JPH05121498A - Wafer testing device - Google Patents

Abstract

PURPOSE:To alleviate a mechanical working, and to obtain a device for positioning a test head in a rotating direction without manual labor by adding a reference unit to a stationary probe card, and providing special detector, driver and drive controller. CONSTITUTION:When a test head 3 is mounted at a wafer test prober 4, a reference unit 6 is added to a stationary probe card 1 mounted on the head 3. Further, detectors 7, 8 mounted at the prober 4 to detect the unit 6, a driver 10 for rotating the head 3, and a drive controller 9 for controlling the driver 10 according to the output of the detector 8 are provided to align the rotating reference axis of the card 1 with a reference axis on the prober 4. For example, the unit 6 is a pinlike reference probe 6, and the detectors 7, 8 are a laser emitting unit 7 and a light receiver 8.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer test apparatus, and more particularly to positioning in a rotational direction when a test head is attached to a wafer test prober during a wafer test.

[0002]

2. Description of the Related Art FIG. 4 is a sectional view showing a rotational positioning mechanism in a conventional wafer test apparatus. In the figure, 1 is a fixed probe card, 2 is a performance board, 3 is a test head, and 4 is a wafer test prober. is there. Reference numeral 1a is a guide pin attached to the fixed probe card 1, 3a is a guide pin attached to the test head 3, and 2a and 2b are guides formed on the performance board 2 for inserting the guide pins 1a and 3a. It is a hole. Reference numeral 5 is a wafer test probe implanted in the fixed probe card 1.

Next, the operation will be described. Usually, in order to perform a semiconductor wafer test, it is necessary to mount the performance board 2 having the fixed probe card 1 mounted on the test head 3 and further fix the test head 3 to the wafer test prober 4. Conventionally, the guide pins 1a and 3a and the guide holes 2a and 2b are attached to the fixed probe card 1 and the performance board 2, the performance board 2 and the test head 3, and the test head 3 to the wafer test prober 4, respectively. I was wearing it through.

[0004]

Since the positioning mechanism in the rotation direction in the conventional wafer test apparatus is operated within the accuracy of the machining as described above, it is necessary to perform a manual correction operation in actual use. That is, since the rotation reference position of the fixed probe card 1 in which the probe 5 is implanted must be aligned with the reference axis on the wafer test prober 4, manual fine adjustment is troublesome.

The present invention has been made in order to solve the above-mentioned problems, and aims at reducing the mechanical processing, and at the same time, allows the wafer test apparatus to position the test head in the rotational direction without human intervention. Aim to get.

[0006]

In the wafer test apparatus according to the present invention, when a test head is attached to a wafer test prober, a reference body (reference probe) is added to a fixed probe card mounted on the test head, and the wafer is A detection device (projection device, light reception device) attached to a test prober for detecting the reference body, a drive device for rotating the test head, and a drive control device for controlling the drive device by the output of the detection device. With and
The rotation reference axis (reference Y axis) of the fixed probe card and the reference axis on the wafer test prober are aligned with each other.

[0007]

According to the present invention, by detecting the reference body by the detection device, the rotation reference axis of the fixed probe card and the reference axis on the wafer test prober are aligned, and the rotation start position of the test head is determined. It

[0008]

An embodiment of the present invention will be described below with reference to FIGS. In FIG. 1, 1 is a fixed probe card, 2
Is a performance board, 3 is a test head, and this test head 3 is attached to a wafer test prober 4. The fixed probe card 1 is attached to the lower surface of the test head 3 via the performance board 2. 6 is a pin-shaped reference probe as a reference body added to the fixed probe card 1 so as to project downward according to the present invention, 7 is a laser projecting device, and 8 is a light receiving device.
Configure a detection device. Reference numeral 9 is a servo drive control device for driving the test head 3, and 10 is a test head drive device. Reference numeral 5 denotes a wafer test probe provided on the fixed probe card. The wafer 20 is located below the probe 5. 21 is a stage on which a wafer is placed.

2 and 3 are views showing the structure of the fixed probe card 1 used in the present invention. In the figures, 11 is a reference position when the wafer test probe 5 is implanted, 12 is a reference X-axis, Reference numeral 13 is a reference Y axis (rotation reference axis). Reference numeral 14 is a ring for implanting the probe 5 and the reference probe 6. The probe 5 is arranged in four directions forming a right angle with the ring 14, the tip side thereof extends to the center, and the tip is bent to form a tentacle 5a. Therefore, when the tentacles 5a group is viewed in plan,
It will be arranged so as to form a quadrangle as shown in.
Two reference probes 6 are planted in the ring 14, and they are provided so as to be positioned on a straight line parallel to the reference Y axis 13 of the fixed probe card 1.

Next, the operation will be described. The ring 14 in which the wafer test probe 5 and the reference probe 6 are implanted is fitted and attached to the hole 1s of the fixed probe card 1. At this time, based on the reference position 11, the reference probe 6 is mounted so as to be located on the side of the light emitting / receiving devices 7 and 8 and substantially parallel to the reference Y-axis 13. Laser projecting device 7
The light receiving device 8 and the light receiving device 8 are provided on the wafer test prober 4, and are arranged and fixed so as to face each other on a straight line where the reference probe 6 is located.

The test head 3 can be rotated by the servo drive control device 9 and the test head drive device 10, and the intensity of the laser beam emitted from the laser projecting device 7 is measured by the light receiving device 8. At this time, since the ring 14 is attached based on the reference position 11, the rough positions are in alignment. Therefore, the amount of rotation of the test head 3 at the time of this alignment is very small. Therefore, the position where the measured value becomes the minimum is the reference Y on the fixed probe card 1.
The axis 13 and the reference axis on the wafer test prober 4 are coincident with each other, and the output of the minimum measured value is the servo drive device 9.
Then, the rotation of the test head 3 is stopped and the test head 3 is fixed at that position. This position is the rotation start position of the test head 3. The actual wafer test becomes possible through the above operation procedure.

In the above embodiment, two reference probes 6 are added to show the position for attaching the ring 14 to the fixed probe card 1, but the probe 5 to be positioned at the reference position 11 is implanted. If you put a mark on the, you only need one reference probe. In this case, the light emitting and receiving devices 7 and 8 may be arranged on the left and right sides in FIG.

[0013]

According to the present invention, when the test head is mounted on the wafer test prober, a reference body is added to the fixed probe card mounted on the test head, and the test head is mounted on the wafer test prober. A detection device for detecting a body, a drive device for rotating the test head, and a drive control device for controlling the drive device by the output of the detection device are provided, and the rotation reference axis of the fixed probe card and the wafer test. Since it is configured to be aligned with the reference axis on the prober, there is an effect that machining can be reduced, and the rotation start position of the test head can be accurately positioned without manpower during the wafer test.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a rotation direction positioning mechanism according to an embodiment of a wafer test apparatus of the present invention.

FIG. 2 is a sectional view of a fixed probe card showing the same embodiment.

FIG. 3 is a bottom view of FIG. 2 seen from below.

FIG. 4 is a configuration diagram of a rotation-direction positioning mechanism showing a conventional wafer test apparatus.

[Explanation of symbols]

 1 Fixed probe card 3 Test head 4 Wafer test prober 5 Wafer test probe 6 Reference probe (reference body) 7 Laser projecting device (detecting device) 8 Light receiving device (detecting device) 9 Servo drive control device 10 Test head driving device 13 Reference Y axis (rotation reference axis)

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[Procedure amendment]

[Submission date] September 8, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be amended] Claims

[Correction method] Change

[Correction content]

[Claims]

Claims (1)

[Claims] 1. A detector for attaching a reference body to a fixed probe card mounted on the test head when the test head is attached to the wafer test prober, and being attached to the wafer test prober and detecting the reference body. A drive device for rotating the test head, and a drive control device for controlling the drive device according to the output of the detection device, and a rotation reference axis of the fixed probe card and a reference axis on the wafer test prober. A wafer test apparatus characterized in that the position of the wafer tester is adjusted.