JPH05116836A - Embossed tape component tape removing device and method - Google Patents

Abstract

(57) [Summary] [Purpose] The cover tape is larger than the cavity tape .
Even taping parts that are adhered with sufficient adhesive strength,
Stable cover tape without tearing the cover tape
To obtain a tape removing device. [Structure] Cover tape thermocompression bonded to cavity tape 1
Thermocompression-bonded parts (adhesive parts 2a) on both ends of the loop 2 and the cavity
Attach the cover tape 2 to the pocket 4 of the tape 1.
A cutter that cuts in parallel to the traveling direction of the cover tape 2.
The ter 5 is provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape removing device for taping parts.

[0002]

2. Description of the Related Art As a recent trend, the shipping form of semiconductor elements is shifting to shipping by emboss taping. FIG. 5 shows a conventional method of peeling a cover tape. The embossed taping consists of a cavity tape and a cover tape. In FIG. 5, 1 is a cavity tape, 2 is a cover tape, 3 is a sprocket hole,
Reference numeral 4 is a pocket portion of the cavity tape 1. When the cover tape 2 of the embossed taping component having such a structure is removed, the cover tape 2 is pulled in the direction opposite to the direction in which the embossed taping proceeds, and the adhesive portions at both ends are peeled off. Due to the balance between the adhesive strength and the ease of peeling, it is necessary to control the peel strength to be constant during thermocompression bonding of the cover tape, but it is very difficult with the current technology. Next, the operation will be described. The thermocompression bonding part is peeled off while pulling the cover tape 2 in the direction opposite to the traveling direction of the cavity tape 1.

[0003]

In the conventional method, there are problems that the adhesive strength becomes unstable and the peel strength varies, and if the peel strength is too strong, the cover tape 2 tears. It was The present invention has been made to solve the above problems, and an object of the present invention is to obtain a tape removing device for a taping component that enables stable tape removal and enhances the adhesive strength of the tape. ..

[0004]

SUMMARY OF THE INVENTION A tape removing device according to the present invention controls a cutter provided such that its cutting edge bites in a position between a pocket portion and a cutting amount of the cutting edge of this cutter. It is provided with a biting depth adjusting means.

[0005]

In the cutter according to the present invention, the tape can be removed without peeling off the adhesive portion, so that stable peeling can be performed and there is no need to control the peel strength of the adhesive portion, so that the adhesive strength can be sufficiently increased. ..

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows the appearance of a tape removing device 6 according to an embodiment of the present invention. Below the device 6, there are provided a plurality of pockets 4 arranged in a line to accommodate semiconductor elements (not shown). A cavity tape 1 having a plurality of sprocket holes 3 on both sides of the pocket portion 4 is driven by a rotating sprocket (not shown) to advance in the arrow direction.

The cover tape 2 has a sprocket hole 3 described above.
Is bonded to the cavity tape 1 at a portion between the pocket portion 4 and the pocket portion 4, and an adhesive portion 2a is formed on the right side of the drawing to cover the pocket portion 4.

A drive sprocket (not shown) for driving the cavity tape drives the cavity tape, and a tape peeling device (not shown) for peeling the cover tape pulls the tape cover 2 upward.

2, FIG. 3 and FIG. 4 show the blade portion of the internal structure of the tape removing device 6 of the present invention, and the pair of cutters 5
Is located between the adhesive portion 2a and the pocket portion 4, and the cutting edge 5a of the cutter 5 is the cover tape 2
So as to bite into the cover tape 2, the blade tip 5a is fitted into the cover tape 2 by adjusting the biting depth of the blade tip (not shown), and the height at which the cover tape 2 is cut is adjusted as the cavity tape 1 advances. ing.

Next, the operation will be described. In FIG. 2, the cover tape 2 is pulled upward, the cutting edge 5a of the cutter 5 bites into the portion between the adhesive portion 2a and the pocket portion 4, and the cover tape 2 is cut as the cavity tape 2 advances. To be done. The cover tape 2 has an adhesive portion 2a
The portion is left in the cavity tape 1 and is carried away by the cavity tape 1.

Since the adhesive portion 2a is left without being peeled off in this manner, it is not necessary to set the adhesive strength to a severe value, and to satisfy the contradictory requirements of the strength of the adhesive force and the ease of peeling. No very difficult technology is required.
Therefore, since a sufficiently large adhesive strength can be given, the risk of dropping the device can be prevented in advance.

[0012]

As described above, according to the present invention, it is possible to bond with a sufficient strength so that the bonded portion is not peeled off, and it is not necessary to set the bonding strength to a severe value. And the very difficult technique of meeting the conflicting requirements of ease of removal and peeling. Therefore, a sufficiently large adhesive strength can be given, and there is an effect that the risk of dropping the device can be prevented beforehand.

[Brief description of drawings]

FIG. 1 shows an embodiment of a tape removing device of the present invention,
It is a perspective view showing the case where the whole device is covered with a box cover.

FIG. 2 is an explanatory diagram for explaining the operation of the tape removing device according to the embodiment of the present invention, showing only the blade portion.

FIG. 3 is a front view showing a holding state of the cutter of the tape removing device according to the embodiment of the present invention.

FIG. 4 is a side view showing a holding state of the cutter of the tape removing device according to the embodiment of the present invention.

FIG. 5 is a perspective view showing a conventional embossed taping separation method.

[Explanation of symbols]

1 Cavity tape 2 Cover tape 2a Adhesive part 3 Sprocket hole 4 Pocket part 5 Cutter 5a Blade tip 6 Box-like cover that covers the outside of the tape removing device with a built-in cutter

[Procedure amendment]

[Submission date] February 27, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0006

[Correction method] Change

[Correction content]

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. Figure 1 is a view to view the appearance of the tape removal device 6 of an embodiment of the present invention, reference numeral 1 is a cavity tape
2 is cover tape, 3 is sprocket hole, 4 is
The pocket 5 of the cavity tape 1 is a cutter 5a
Is the cutting edge. Below the this device 6 has a plurality of pockets 4 provided in a row in order to accommodate the semiconductor element (not shown), a cavity tape having a plurality of sprocket holes 3 on both sides of the pocket portion 4 1 is driven by a rotating sprocket (not shown) and is moving in the direction of the arrow.

[Procedure Amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0008

[Correction method] Change

[Correction content]

[0008] drive sprocket (not shown) for driving the cavities tape 1 drives the cavity tape 1, the tape peeling device (not shown) for peeling the cover tape 2 is driven the tape cover 2 upward ..

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0009

[Correction method] Change

[Correction content]

[0009] FIGS. 2, 3, 4 is a view to view the blade portion of the internal structure of the tape removal device 6 of the present invention, FIG smell
The pair of cutters 5 is located between the adhesive portion 2a and the pocket portion 4, and the cutting edge 5a of the cutter 5 is provided.
Is equipped with not-shown cutting edge depth adjusting means for cutting the cover tape 2 so that the cover tape 2 is cut into the cover tape 2, and the cover tape 2 is cut as the cavity tape 1 advances. The height is adjusted.

[Procedure Amendment 5]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 1

[Correction method] Change

[Correction content]

[Figure 1] ─────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] November 10, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Full text

[Correction method] Change

[Correction content]

[Document name] Statement

[ Title of Invention] Tape removal of embossed taping parts
Device and removal method

[Claims]

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION This invention relates to an embossed taping section.
The present invention relates to a tape removing device and a tape removing method for a product.

[0002]

2. Description of the Related Art As a recent trend, the shipping form of semiconductor elements is shifting to shipping by emboss taping. This
Embossed taping means that semiconductor elements are
Cavity table with multiple pockets
The semiconductor in the pocket while moving the
A pocket part that accommodates elements, etc. and semiconductor elements, etc.
In order from the beginning, the cap is covered so as to cover the peripheral part of the pocket part.
Attach the cover tape to the surface of the bitty tape
It is something to do. Figure 5 is a conventional embossing Te Pin
Peeling off the taping component cover tape at the shipping destination
The process of taking out the semiconductor element from the taping parts.
It is the figure shown, In the figure, 1 is a cavity tape,
2 is a cover tape, 3 is a sprocket hole, 4 is a cover
Formed at regular intervals in the center of the bitty tape
It is a pocket portion that accommodates semiconductor elements and the like. Conventionally,
Tape that accommodates semiconductor elements by boss taping
At the shipping destination where the
When taking out semiconductor elements, etc., as shown in FIG.
Not in the sprocket hole 3 of the cavity tape 1
Cavity tape 1 with engaging drive sprockets
Move the cover tape 2 in the specified direction while
Pull the tape tape 1 in the opposite direction to the
I was peeling off my dress.

[0003]

SUMMARY OF THE INVENTION As described above, the prior art
Embossed taping at shipping destination
A place to take out the semiconductor elements, etc. housed inside from the product
The cover tape 2 from the cavity tape 1
As a result, the cover tape 2 and the cavity tape
The adhesive strength between the tapes 1 is
Cover tape 2 can be easily peeled off, while
Cavity table is used at the time of shipment and before reaching the destination.
Make sure that the cover tape 2 does not come off easily from the
Must meet the conflicting demands of. Accuse
With current technology, this is
It is difficult to obtain such delicate adhesive strength with good reproducibility.
If the adhesive strength is too strong, the cover tape 2 should be
When peeling off, the cover tape 2 tears and the cover tape
It is no longer possible to peel off group 2 continuously,
There was a problem that the efficiency was lowered. Also,
If the adhesive strength is too weak, the adhesive strength will be
As the taping parts reach the shipping destination,
The cover tape 2 is peeled off, and the semiconductor element is stored.
There was a problem that children and others would spill.

The present invention solves the above problems.
This is done for the purpose of collecting the products at the shipping destination.
Cavity tape and cover to hold the contents stably
-The tape was attached with high adhesive strength (taping
The tape), tearing the cover tape
The container so that the contents can be removed.
Continuous and stable removal of cover tape from bitty tape
Tape removal device and tape removal method that can
The porpose is to do.

[0005]

[MEANS FOR SOLVING THE PROBLEMS] A cover according to the present invention
The tape removal device and method removes heat from the cavity tape.
Crimped cover tape and thermo-compression area on both ends and cavity
Cover the cover tape between the pocket and the tape.
-Use a cutter that cuts parallel to the tape's direction of travel.
It is arranged.

[0006]

In the present invention, the cavity tape
Adhesion of both sides of the cover tape without peeling off the adhesive
Cut the parts other than the
Make sure that the cavities are opened so that the pockets for children are opened.
I decided to remove the cover tape from the tape,
Even if the adhesive strength of the above-mentioned adhesive part is strong, the moving cabinet
Without tearing the cover tape from the tape
The bar tape can be continuously and reliably removed.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows a tape removing apparatus according to an embodiment of the present invention.
It is a perspective view for explaining the configuration and operation,
5, the same reference numerals as those in FIG. 5 indicate the same or corresponding parts.
6 is a cavitity to which the cover tape 2 is thermocompression bonded.
Cavity is placed in the upper part of the tape 1.
-Has a pair of cutters 5 with the cutting edge 5a facing the tape 1 side
A tape cutter body, and the tape cutter body
6 is a tape cutter main body 6 (not shown) that supports the tape cutter freely.
The tape cutter body 6 is supported by a supporting body
Is the biting depth of the cutting edge 5a of the cutter 5, which is not shown.
A cutting edge biting depth adjusting means for adjusting the
It In addition, a cutter is provided above the tape cutter body 6.
Tape to pull the cover tape cut by 5
Towing means are provided.

In the figure, the cavity tape 1 is a pocket
The sprocket holes 3 on both sides of the
By engaging the protrusion of the rotating sprocket (not shown)
Move in the direction of the arrow, and the cover tape 2 is
Of the sprocket hole 3 of the tea tape 1 and the pocket 4
It is thermocompression-bonded at the sprocket hole 3 side (adhesive part 2a) between
Until the tape is cut by the tape removing device
Covers the pocket 4 of the cavity tape 1
There is.

On the other hand, FIGS. 2 to 4 show the above tape cutter book.
A perspective view, a front view and a view for explaining the shape and operation of the body 6.
It is a side view and a pair of tape
The blade edge 5a of the cutter 5 projects, and a pair of cutters
The cutting edge 5a of 5 attaches the cover tape 2 to the adhesive portion 2a and
Cavity tape penetrates at a position between the pockets 4
The cover tape 2 is cut in accordance with the progress of 1.

Next, the operation will be described. First,
Put the cover cutter 2 in the above-mentioned state.
Placed above the heat-bonded cavitity tape 1.
It Next, using a cutting edge biting depth adjusting means (not shown).
The blade edge 5a of the cutter 5 in the tape cutter body 6
Adjust the height to a predetermined level and attach the adhesive section 2a and the pocket section 4 together.
The cutting edge 5a of the cutter 5 is made to bite into the space between them. This
After that, the not-shown leading edge of the cover tape 2 is shown.
Not pulled by tape pulling means, not shown in this state
Use the rotating sprocket to remove the cavity tape 1.
If you move it in the fixed direction (the direction of the arrow in Figs. 1 and 2),
The cover tape 2 pockets as the tape 1 progresses.
Inside the cut cover tape 2, cut on both sides of section 4
The central part is taken up by tape pulling means and
The cover tape 2 of the attachment portion 2 a is carried away by the cavity tape 1 while being left on the cavity tape 1.

With the tape removing apparatus of this embodiment as described above,
Is the cover tape thermocompression bonded to the cavity tape 1?
Without peeling from the cavity tape 1 pocket
At the non-bonded positions other than the bonded parts 2a on both sides of 4.
In order to cut the bar tape 2, the semiconductor elements are
The cover tape 2 is housed in the cover portion 4 and the cover tape 2 is a cavity tape.
Taping parts that are thermocompression bonded with high adhesive strength
Even if the cover tape 2 does not tear
With the width required to take out the body element from the pocket 4,
The cover tape 2 can be removed continuously and stably.
Work efficiency can be improved .

[0012]

As described above, according to the present invention, the cover
-The thermo-compression bonding area on both ends of the tape and the embossed tape pocket
The cover tape between the cover section and the cover section.
Since it was cut parallel to the row direction, the above heat
Cavity that moves even when the adhesive strength of the crimp section is strong
The cover without tearing the cover tape from the tape
The tape can be removed continuously and reliably.
For embossed taping, shipping of taping parts
When the cavity tape and cover tape are large enough
Since it can give adhesive strength, at the time of shipment and destination
Before it reaches the
Ruggedness can be prevented, and even if the product is shipped to
Improve the efficiency of the work of removing the semiconductor element from the
There is an effect that can be improved.

[Brief description of drawings]

FIG. 1 shows the structure of a tape removing device according to an embodiment of the present invention.
FIG. 7 is a perspective view for explaining the composition and operation .

FIG. 2 is a diagram showing a tape cassette used in the tape removing device shown in FIG.
It is a perspective view showing only a pair of cutters of the main body .

FIG. 3 is a diagram showing a tape cassette in the tape removing device shown in FIG.
It is a front view showing the structure of the main body .

FIG. 4 is a diagram showing a tape cassette in the tape removing device shown in FIG.
FIG. 3 is a side view showing the structure of the main body of the engine .

FIG. 5 is a view showing a conventional embossed taping component to a cover tape.
It is a perspective view which shows the process of peeling the tape .

[Explanation of Codes] 1 Cavity tape 2 Cover tape 2a Adhesive part 3 Sprocket hole 4 Pocket part 5 Cutter 5a Blade tip 6 Tape cutter body

[Procedure 3]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 1

[Correction method] Change

[Correction content]

[Figure 1]

Claims (1)

[Claims] 1. A cavity tape having a plurality of pockets arranged in a line for accommodating a semiconductor element and having a plurality of sprocket holes on both sides of the pockets, the sprocket holes and the pockets. Of the semiconductor component including a cover tape that is adhered to the cavity tape at a portion between them and covers the pocket portion, a drive sprocket for driving the cavity tape, and a tape peeling device for peeling the cover tape. In the moving device, a cutter is provided between the adhesive portion and the pocket portion, and the cutting edge of the cutter is provided with a cutting depth adjusting means of the cutting edge so as to bite into the cover tape. Characteristic tape removing device for taping parts.