JPH0478704B2 - - Google Patents
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- Publication number
- JPH0478704B2 JPH0478704B2 JP63297416A JP29741688A JPH0478704B2 JP H0478704 B2 JPH0478704 B2 JP H0478704B2 JP 63297416 A JP63297416 A JP 63297416A JP 29741688 A JP29741688 A JP 29741688A JP H0478704 B2 JPH0478704 B2 JP H0478704B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- based alloy
- strength
- resistance
- electrical conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
(イ) 技術分野
本発明は、自動車の電装品等に用いられるワイ
ヤーハーネスのターミナルに代表される電気・電
子材料用として好適な高強度・高導電性銅基合金
に関するものである。
(ロ) 従来技術
今日、自動車産業は周知の通り日本の基幹産業
として大きな役割を果すに至つており、その生産
台数の増加は著しく、また近時ではカーエレクト
ロニクスの発達により、これに使用される伸銅品
材料がますます増加している。
従つて、自動車の電装品の一翼を担うワイヤー
ハーネスもこれにもれず、１台当り約１Kmの長
さ、重量で約20Kgが使用されるまでになつた。
しかしながら、近時の自動車に対する要求は軽
量化、高信頼性および低コスト化とますます厳し
いものになり、従つてワイヤーハーネスも軽量
化、高信頼性および低コスト化が要求されるよう
になつて来ている。
ここで、ワイヤーハーネスは電線とターミナル
が一体となつたものであり、軽量化と配線の高密
度化のためには、ターミナル材料の材料特性およ
び信頼性の向上が必要かつ不可欠である。
上記のような背景の下に、具体的にターミナル
材料は薄肉化され、また複雑な形状にプレス成形
されることから、強度、弾性、導電性およびプレ
ス成形性が良好なことが必要である。
更に、耐食性、耐応力腐食割れ性が良いことは
勿論のことで、エンジンルーム周辺や排ガス系統
周辺では熱的な負荷も加わることから、耐応力緩
和特性にも優れていなければならない。
しかしながら、従来において上記のような諸特
性を同時に兼備し、かつ安価な材料は得られなか
つた。
(ハ) 発明の開示
本発明は、カーエレクトロニクスの発達に伴な
つて、ワイヤーハーネスのターミナル材料に要求
れる上記のような諸特性を兼備した銅基合金、さ
らに詳しくは強度、弾性および電気伝導性に優
れ、かつプレス成形性、耐応力緩和特性等に優れ
たワイヤーハーネスのターミナル用材料として好
適な銅基合金を開発すべく鋭意研究の結果、開発
されたものであつて、次記の銅基合金を提供する
ものである。
即ち、第１の発明は、Ni：0.05〜5.0wt％，
Be：0.005〜1.4wt％，Mg：0.01〜5.0wt％を含
み、残部がCuおよび不可避不純物からなり、マ
トリツクス中にNi−Be，Ni−Mg及びNi−Be−
Mgの金属間化合物が均一微細に析出したことを
特徴とする高強度高導電性銅基合金である。
また、第２の発明は、Ni：0.05〜5.0wt％，
Be：0.005〜1.4wt％，Mg：0.01〜5.0wt％を含
み、更にZr，Ca，Ti，Mn，Al，Ｐ，Sn，Ｂ，
Fe，Ｙ，Co，La，Ceからなる群より選ばれた１
種又は２種以上を合計で0.005〜3.0wt％含み、残
部がCuおよび不可避不純物からなり、マトリツ
クス中にNi−Be，Ni−Mg及びNi−Be−Mgの
金属間化合物が均一微細に析出したことを特徴と
する高強度高導電性銅基合金である。
本発明に係る銅基合金は、Ni，Be，Mg等の
適量の添加により、マトリツクス中にNi−Be，
Ni−Mg及びNi−Be−Mg等の金属間化合物が均
一微細に析出するので、ワイヤーハーネスのター
ミナル用材料に好適な上記諸特性を発現した析出
硬化型銅基合金を提供することに基本的な特徴が
ある。
次に、本発明に係る銅基合金の成分組成範囲を
上記の通りに限定した理由について説明する。
(1) Ni
Niは、Beと化合物を形成し、強度、弾性、耐
熱性および耐応力緩和特性等の向上に寄与する元
素である。
また、鋳造組織および熱間加工組織を微細化
し、かつ溶体化処理時の結晶粒の粗大化を防止す
る効果がある。
このような効果を発揮させるためには、Ni含
有量が0.05wt％未満では所望の効果が得られず、
一方5.0wt％を越えて含有させると電気伝導性の
低下が顕著となり、また経済的にも不利となるこ
とから、その含有量は0.05wt％〜5.0wt％の範囲
とする。
(2) Be
Beは、その含有量が0.005wt％未満ではNiとの
共存下でも強度、弾性、耐熱性および耐熱応力緩
和特性等について所望の効果が得られず、一方
Be含有量が1.4wt％を越えると電気伝導性が低下
すると共に、プレス成形性が著しく低下し、また
経済的にも不利となることから、その含有量は
0.005〜1.4wt％の範囲とする。
(3) Mg
Mgは、本発明合金において、電気伝導性を大
きく損なうことなしに強度及び弾性、特にバネ限
界値を向上させる。また、本発明の係る銅基合金
の半田メツキの耐候性の向上にも効果がある。
このような効果を発揮させるためには、0.01wt
％以上の含有量が必要であるが、一方5.0wt％を
越えて含有すると、電気伝導性及び加工性の低下
が顕著となる。従つて、Mgの含有量は0.01〜
5.0wt％の範囲とする。
(5) 副成分
更に、副成分としてZr，Ca，Ti，Mn，Al，
Ｐ，Sn，Ｂ，Fe，Ｙ，Co，La，Ceからなる群
より選ばれた１種又は２種以上をNi，Be，Mg
を含有する第１発明の銅基合金に含有させること
により、第１発明の合金の加工性及び電気伝導性
を大きく損なうことなしに、第１発明の銅基合金
の強度、弾性、耐熱性及び耐応力緩和特性等の諸
特性をより一層向上させることができる。
このような効果を充分に発揮させるためには、
上記副成分から選ばれた１種又は２種以上を合計
で0.005wt％以上を含有させる必要があり、一方
3.0wt％を越えて含有すると、加工性及び電気伝
導性の低下が顕著となり、鋳造時の湯流れ性の低
下や、熱処理時に強固な酸化被膜を生成するな
ど、製造上の問題も生じ、経済的にも不利とな
る。
従つて、上記副成分の含有量の範囲は、１種或
は２種以上を合計で0.005〜3.0wt％とする。
次に、本発明を実施例により詳細に説明する。
(ニ) 実施例
第１表に化学成分値（重量％）を示す銅基合金
No.１〜No.６を高周波誘導溶解炉を用いて溶製し、
20×50×220（mm）の鋳塊に鋳造した。
ただし、溶解鋳造時の雰囲気はArガスシール
とし、鋳造後直ちに水冷した。各鋳塊を面削後、
冷間圧延と焼鈍を繰返し、厚さ0.6mmまで冷間圧
延した。
その後、815℃の温度で10分間熱処理後、水急
冷を行ない、さらに酸洗を施した。
上記のようにして得られた熱処理材を厚さ0.3
mmまで冷間圧延し、500℃の温度で30分間の熱処
理を施し、試験材とした。
得られた試験材を用いて、各所定の試験片を作
成し、引張強さ、バネ限界値、導電率およびハン
ダ耐候性を測定した。その結果を第１表に示す。
測定法としては、引張強さ、バネ限界値、導電
率の測定はJIS−Ｚ−2241，JIS−Ｈ−3130，JIS
−Ｈ−0505に従つて行なつた。
また、ハンダ耐候性は試験片に溶融ハンダメツ
キ（Sn−40wt％Pb，デイツプ、260℃×5sec，
弱活性ロジンフラツクス使用）を行ない、150℃
の温度で300時間大気中に保持後、試験片を90°W
曲げし、曲げ部の観察を行なつた。観察の結果、
メツキが密着しているものは○印、剥離している
ものは×印として、第１表に示した。
第１表に示した結果から、本発明に係るNo.１〜
３の銅基合金は、引張強さ、バネ限界値、導電率
のバランスに優れ、かつハンダ耐候性も良好であ
る。従つて、ワイヤーハーネスのターミナル等の
電気電子用材料として好適な非常に優れた特性を
有する銅基合金である。
これに対して、Mgを含まない比較合金No.６は
バネ限界値が低く、またBeを含まない比較合金
No.４およびNiを含まない比較合金No.５では引張
強さ、バネ限界値が低く、導電率の向上も認めら
れない。
(a) Technical Field The present invention relates to a high-strength, high-conductivity copper-based alloy suitable for use in electrical and electronic materials, typified by wire harness terminals used in automobile electrical components and the like. (b) Prior art Today, as is well known, the automobile industry has come to play a major role as Japan's core industry, and the number of cars produced has increased significantly, and with the recent development of car electronics, the number of cars used in this industry has increased significantly. Copper products materials are becoming more and more popular. Therefore, wire harnesses, which play a role in the electrical components of automobiles, are no exception, and each car now uses wire harnesses that are approximately 1 km long and weigh approximately 20 kg. However, the demands placed on modern automobiles have become increasingly strict, such as weight reduction, high reliability, and low cost.Therefore, wire harnesses are also required to be lightweight, high reliability, and low cost. It is coming. Here, a wire harness is a combination of electric wires and terminals, and in order to reduce weight and increase wiring density, it is necessary and essential to improve the material properties and reliability of the terminal material. Under the above-mentioned background, terminal materials are specifically made thinner and press-molded into complicated shapes, so they need to have good strength, elasticity, conductivity, and press-formability. Furthermore, in addition to having good corrosion resistance and stress corrosion cracking resistance, it must also have excellent stress relaxation resistance since thermal loads are applied around the engine room and exhaust gas system. However, in the past, it has not been possible to obtain a material that has all of the above properties at the same time and is inexpensive. (C) Disclosure of the Invention With the development of car electronics, the present invention provides a copper-based alloy that has the above-mentioned properties required for a terminal material for a wire harness, and more specifically, a copper-based alloy that has strength, elasticity, and electrical conductivity. This alloy was developed as a result of intensive research to develop a copper-based alloy suitable as a terminal material for wire harnesses, which has excellent press formability, stress relaxation resistance, etc. It provides alloys. That is, the first invention includes Ni: 0.05 to 5.0wt%,
Contains Be: 0.005 to 1.4 wt%, Mg: 0.01 to 5.0 wt%, the remainder consists of Cu and inevitable impurities, and the matrix contains Ni-Be, Ni-Mg and Ni-Be-
This is a high-strength, high-conductivity copper-based alloy characterized by uniform, finely precipitated Mg intermetallic compounds. Further, the second invention has Ni: 0.05 to 5.0wt%,
Contains Be: 0.005-1.4wt%, Mg: 0.01-5.0wt%, and further contains Zr, Ca, Ti, Mn, Al, P, Sn, B,
1 selected from the group consisting of Fe, Y, Co, La, Ce
Contains a total of 0.005 to 3.0 wt% of one or more species, with the remainder consisting of Cu and unavoidable impurities, and intermetallic compounds of Ni-Be, Ni-Mg, and Ni-Be-Mg are uniformly and finely precipitated in the matrix. It is a high-strength, high-conductivity copper-based alloy. The copper-based alloy according to the present invention has Ni-Be, Mg, etc. added in the matrix by adding appropriate amounts of Ni, Be, Mg, etc.
Since intermetallic compounds such as Ni-Mg and Ni-Be-Mg precipitate uniformly and finely, the fundamental objective is to provide a precipitation-hardening copper-based alloy that exhibits the above-mentioned properties suitable for wire harness terminal materials. There are some characteristics. Next, the reason why the composition range of the copper-based alloy according to the present invention is limited as described above will be explained. (1) Ni Ni is an element that forms a compound with Be and contributes to improvements in strength, elasticity, heat resistance, stress relaxation resistance, etc. Further, it has the effect of refining the casting structure and hot working structure and preventing coarsening of crystal grains during solution treatment. In order to exhibit such an effect, if the Ni content is less than 0.05wt%, the desired effect cannot be obtained;
On the other hand, if the content exceeds 5.0 wt%, the electrical conductivity will drop significantly and it will also be economically disadvantageous, so the content should be in the range of 0.05 wt% to 5.0 wt%. (2) Be If the content of Be is less than 0.005wt%, the desired effects on strength, elasticity, heat resistance, thermal stress relaxation properties, etc. cannot be obtained even in the coexistence with Ni;
If the Be content exceeds 1.4wt%, the electrical conductivity will decrease, the press formability will decrease significantly, and it will also be economically disadvantageous.
It should be in the range of 0.005 to 1.4wt%. (3) Mg Mg improves the strength and elasticity, especially the spring limit value, in the alloy of the present invention without significantly impairing the electrical conductivity. It is also effective in improving the weather resistance of solder plating of copper-based alloys according to the present invention. In order to achieve this effect, 0.01wt
% or more, but if the content exceeds 5.0 wt%, the electrical conductivity and processability will be significantly reduced. Therefore, the Mg content is 0.01~
The range is 5.0wt%. (5) Subcomponents In addition, subcomponents include Zr, Ca, Ti, Mn, Al,
One or more selected from the group consisting of P, Sn, B, Fe, Y, Co, La, Ce and Ni, Be, Mg
By incorporating it into the copper-based alloy of the first invention, the strength, elasticity, heat resistance and Various properties such as stress relaxation resistance can be further improved. In order to fully demonstrate this effect,
It is necessary to contain one or more selected from the above subcomponents in a total amount of 0.005wt% or more;
If the content exceeds 3.0wt%, there will be a noticeable decrease in workability and electrical conductivity, and manufacturing problems such as a decrease in flowability during casting and the formation of a strong oxide film during heat treatment will occur, resulting in economical problems. It is also disadvantageous. Therefore, the range of content of the above-mentioned subcomponents is 0.005 to 3.0 wt% in total of one or more kinds. Next, the present invention will be explained in detail using examples. (d) Example Copper-based alloy whose chemical composition values (wt%) are shown in Table 1
No. 1 to No. 6 are melted using a high frequency induction melting furnace,
It was cast into an ingot of 20 x 50 x 220 (mm). However, the atmosphere during melting and casting was set to an Ar gas seal, and water cooling was performed immediately after casting. After facing each ingot,
Cold rolling and annealing were repeated until the thickness was 0.6 mm. Thereafter, after heat treatment at a temperature of 815°C for 10 minutes, quenching with water was performed, and further acid washing was performed. The heat-treated material obtained as above was heated to a thickness of 0.3
It was cold-rolled to a thickness of 1.5 mm and heat-treated at 500°C for 30 minutes to obtain a test material. Each predetermined test piece was created using the obtained test material, and the tensile strength, spring limit value, electrical conductivity, and solder weather resistance were measured. The results are shown in Table 1. Measurement methods for tensile strength, spring limit value, and electrical conductivity are JIS-Z-2241, JIS-H-3130, and JIS
-H-0505. In addition, the solder weather resistance was determined by applying molten solder plating to the test piece (Sn-40wt%Pb, dip, 260℃ x 5sec,
(using weakly activated rosin flux) and heated to 150°C.
After being held in the atmosphere for 300 hours at a temperature of 90°W
It was bent and the bent part was observed. As a result of observation,
In Table 1, cases where the plating was adhered are marked with an ○ mark, and cases where the plating was peeled off are marked with an x mark. From the results shown in Table 1, No. 1 to 1 according to the present invention
The copper-based alloy No. 3 has an excellent balance of tensile strength, spring limit value, and electrical conductivity, and also has good solder weather resistance. Therefore, it is a copper-based alloy with very excellent properties suitable for electrical and electronic materials such as wire harness terminals. On the other hand, comparative alloy No. 6, which does not contain Mg, has a low spring limit value, and comparative alloy No. 6, which does not contain Be, has a low spring limit value.
In No. 4 and Comparative Alloy No. 5 which does not contain Ni, the tensile strength and spring limit value are low, and no improvement in electrical conductivity is observed.
【表】
実施例 ２
実施例１の第１表中に示す本発明合金No.１と市
販のリン青銅２種（C5191−Ｈ）について、硬
度、引張強さ、ばね限界値、導電率、耐応力緩和
特性及び耐熱性を試験測定した。その結果を第２
表に示す。
引張強さ、バネ限界値及び導電率の測定試験は
実施例１と同様の測定法であり、硬度の測定は
JIS−Ｚ−2244に従つて行なつた。
また、応力緩和試験は試験片の中央部の応力が
40Kgｆ／mm2になるようにＵ字曲げを行ない、150
℃の温度で200時間保持後の曲げぐせを応力緩和
率として、次式により算出した。
応力緩和率（％）＝［（L1−L2）／（L1−L0）］×
100
L0：治具の長さ（mm）
L1：開始時の試料長さ（mm）
L2：処理後の試料端間の水平距離（mm）
更に耐熱性試験は、試料の硬度が初期硬度の80
％になるときの温度（30分間保持）とした。[Table] Example 2 The hardness, tensile strength, spring limit value, electrical conductivity, and durability of the present invention alloy No. 1 shown in Table 1 of Example 1 and the two types of commercially available phosphor bronze (C5191-H) were The stress relaxation properties and heat resistance were tested and measured. The result is the second
Shown in the table. The measurement tests for tensile strength, spring limit value, and electrical conductivity were the same as in Example 1, and the hardness was measured using the same method as in Example 1.
It was conducted in accordance with JIS-Z-2244. In addition, in stress relaxation tests, the stress in the center of the specimen is
Perform U-shaped bending to make it 40Kgf/ mm2 , 150
The stress relaxation rate was calculated using the following formula, using the bending pattern after being held at a temperature of 200 hours at a temperature of .degree. Stress relaxation rate (%) = [(L 1 − L 2 )/(L 1 − L 0 )]×
100 L 0 : Length of jig (mm) L 1 : Length of sample at start (mm) L 2 : Horizontal distance between sample edges after treatment (mm) Furthermore, in heat resistance tests, the hardness of the sample is hardness 80
% (held for 30 minutes).
【表】
第２表に示す結果から、本発明の銅基合金は、
従来の代表的なワイヤーハーネスのターミナル等
の電気電子用材料であるリン青銅に比較して、導
電率、耐応力緩和特性ならべに耐熱性が格段に向
上していることが分る。従つて、本発明銅基合金
は高度な耐環境性を有し、信頼性に極めて優れて
いることが明らかである。
(ホ) 発明の効果
以上の実施例から明らかなように、本発明に係
る銅基合金は、高強度、高弾性、高電気伝導性を
有し、かつ耐応力緩和特性および耐熱性に優れて
おり、更に充分なハンダ耐候性を有しているの
で、ワイヤーハーネスのターミナル等の電気電子
用材料として最適なものである。
しかも、本発明合金は、近年の自動車用電装品
の小型軽量化と配線の高密度化に充分対応できる
ターミナル用として好適な画期的な銅基合金であ
る。[Table] From the results shown in Table 2, the copper-based alloy of the present invention:
Compared to phosphor bronze, which is a typical conventional electrical and electronic material such as wire harness terminals, it can be seen that the conductivity, stress relaxation resistance, and heat resistance are significantly improved. Therefore, it is clear that the copper-based alloy of the present invention has a high degree of environmental resistance and is extremely reliable. (e) Effects of the invention As is clear from the above examples, the copper-based alloy according to the present invention has high strength, high elasticity, and high electrical conductivity, and has excellent stress relaxation resistance and heat resistance. Furthermore, it has sufficient solder weather resistance, making it ideal for electrical and electronic materials such as wire harness terminals. Furthermore, the alloy of the present invention is an epoch-making copper-based alloy suitable for terminals, which can fully respond to the recent trends in the miniaturization and weight reduction of automotive electrical components and the increase in wiring density.
Claims (1)
マトリツクス中にNi−Be，Ni−Mg，及びNi−
Be−Mgの金属間化合物が均一微細に析出したこ
とを特徴とする高強度高導電性銅基合金。 ２ Ni：0.05〜5.0wt％， Be：0.005〜1.4wt％， Mg：0.01〜5.0wt％， を含み、更にZr，Ca，Ti，Mn，Al，Ｐ，Sn，
Ｂ，Fe，Ｙ，Co，La，Ceからなる群より選ばれ
た１種又は２種以上を合計で0.005〜3.0wt％含
み、残部がCuおよび不可避不純物からなり、マ
トリツクス中にNi−Be，Ni−Mg及びNi−Be−
Mgの金属間化合物が均一微細に析出したことを
特徴とする高強度高導電性銅基合金。[Claims] 1 Ni: 0.05 to 5.0 wt%, Be: 0.005 to 1.4 wt%, Mg: 0.01 to 5.0 wt%, with the remainder consisting of Cu and inevitable impurities,
Ni−Be, Ni−Mg, and Ni−
A high-strength, high-conductivity copper-based alloy characterized by uniform and finely precipitated Be-Mg intermetallic compounds. 2 Contains Ni: 0.05-5.0wt%, Be: 0.005-1.4wt%, Mg: 0.01-5.0wt%, and further contains Zr, Ca, Ti, Mn, Al, P, Sn,
Contains a total of 0.005 to 3.0 wt% of one or more selected from the group consisting of B, Fe, Y, Co, La, and Ce, with the remainder consisting of Cu and unavoidable impurities, and the matrix contains Ni-Be, Ni−Mg and Ni−Be−
A high-strength, high-conductivity copper-based alloy characterized by uniform and finely precipitated Mg intermetallic compounds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29741688A JPH02145737A (en) | 1988-11-24 | 1988-11-24 | High strength and high conductivity copper-base alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29741688A JPH02145737A (en) | 1988-11-24 | 1988-11-24 | High strength and high conductivity copper-base alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02145737A JPH02145737A (en) | 1990-06-05 |
| JPH0478704B2 true JPH0478704B2 (en) | 1992-12-11 |
Family
ID=17846225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29741688A Granted JPH02145737A (en) | 1988-11-24 | 1988-11-24 | High strength and high conductivity copper-base alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02145737A (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06172895A (en) * | 1992-12-03 | 1994-06-21 | Yamaha Metanikusu Kk | Copper alloy for lead frame |
| JP2950715B2 (en) * | 1993-09-30 | 1999-09-20 | 株式会社神戸製鋼所 | Copper alloy for electric and electronic parts |
| US7163753B2 (en) * | 2002-04-15 | 2007-01-16 | Sumitomo Wiring Systems, Ltd. | Arc-resistant terminal, arc-resistant terminal couple and connector or the like for automobile |
| DE10335947A1 (en) * | 2003-08-04 | 2005-03-17 | Vacuumschmelze Gmbh & Co. Kg | Copper brazing alloy and brazing method |
| KR101369693B1 (en) * | 2010-05-14 | 2014-03-04 | 미쓰비시 마테리알 가부시키가이샤 | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
| JP5903832B2 (en) | 2011-10-28 | 2016-04-13 | 三菱マテリアル株式会社 | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and electronic equipment parts |
| JP5903838B2 (en) | 2011-11-07 | 2016-04-13 | 三菱マテリアル株式会社 | Copper alloy for electronic equipment, copper material for electronic equipment, copper alloy manufacturing method for electronic equipment, copper alloy plastic working material for electronic equipment, and electronic equipment parts |
| JP5903842B2 (en) | 2011-11-14 | 2016-04-13 | 三菱マテリアル株式会社 | Copper alloy, copper alloy plastic working material, and method for producing copper alloy plastic working material |
| CN102810341A (en) * | 2012-07-31 | 2012-12-05 | 江苏银盛电缆科技有限公司 | Copper-clad aluminum magnesium alloy for cable |
| CN103773989B (en) * | 2014-03-04 | 2015-11-04 | 南京信息工程大学 | Conductive copper material modified by ferromagnetic element gadolinium and preparation method thereof |
| JP6056877B2 (en) * | 2015-01-07 | 2017-01-11 | 三菱マテリアル株式会社 | Superconducting wire and superconducting coil |
| JP6056876B2 (en) * | 2015-01-07 | 2017-01-11 | 三菱マテリアル株式会社 | Superconducting stabilizer |
| JP6299802B2 (en) | 2016-04-06 | 2018-03-28 | 三菱マテリアル株式会社 | Superconducting stabilizer, superconducting wire and superconducting coil |
| JP6299803B2 (en) | 2016-04-06 | 2018-03-28 | 三菱マテリアル株式会社 | Superconducting wire and superconducting coil |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59193233A (en) * | 1983-04-15 | 1984-11-01 | Toshiba Corp | Copper alloy |
| JPS6362834A (en) * | 1986-09-04 | 1988-03-19 | Nippon Mining Co Ltd | Copper alloy for DC wiring materials |
| JPS63109132A (en) * | 1986-10-28 | 1988-05-13 | Furukawa Electric Co Ltd:The | High-strength conductive copper alloy and its production |
| JPS63125648A (en) * | 1986-11-13 | 1988-05-28 | Ngk Insulators Ltd | Production of beryllium copper alloy |
| JPS63130739A (en) * | 1986-11-20 | 1988-06-02 | Nippon Mining Co Ltd | High-strength, high-conductivity copper alloy for semiconductor equipment lead materials or conductive spring materials |
| JPH01168831A (en) * | 1987-12-25 | 1989-07-04 | Nippon Mining Co Ltd | Electric conductive material |
-
1988
- 1988-11-24 JP JP29741688A patent/JPH02145737A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02145737A (en) | 1990-06-05 |
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