JPH0471297A - Multilayer board provided with built-in component - Google Patents

Abstract

PURPOSE:To obtain a multilayer board having the forms of various circuits by a method wherein an anisotropic conductive film is installed between first and second substrates along with an arbitrary circuit component and the electrical connection of the electrodes of the circuit component with wiring conductors, which are respectively formed on the first and second electrodes, is selectively performed through the anisotropic conductive film. CONSTITUTION:A multilayer board is constituted between first and second substrates 2A and 2B and an anisotropic conductive film 10 containing a conductive filler 14 is inserted between electrodes 61, 62, 63...6n of a base chip 6 and wiring electrodes 21, 22, 23...2n. Then, wiring conductors 20a and 20b are respectively formed on the substrates 2A and 2B and an anisotropic conductive bonding agent 12 is inserted between the conductors 20a and 20b to form a multilayer structure. In this case, the conductors 20a and 20b are in a state that they are insulated from each other via the film 10. There, when a pressure F is applied between the substrates 2A and 2B to compress the bonding agent 12, heat is applied and the compressed state of the agent 12 is fixed, connecting pieces are constituted of the filler 14 contained in this agent 12 and conductor circuits are formed between the substrates 2A and 2B. Thereby, the connection between the built-in component and the wiring conductors 20a and 20b can selectively be made possible.

Description

[Detailed description of the invention] [Industrial application field]

The present invention relates to a component-embedded multilayer board that incorporates various electronic components such as IC1 resistors and capacitors.

[Conventional technology]

Conventionally, sheet lamination method,
There are multilayer printing methods, thick film multilayer methods, etc. The sheet lamination method prints conductors on green sheets made of ceramic and stacks them to create a multilayer structure.The multilayer printing method prints a conductor on a green sheet, prints an insulating layer on top of it, and prints the printed wiring again. The glabella is connected through a through hole, and these steps are repeated to create multiple layers. In addition, the thick film multilayer method prints and wires a thick film conductor on an alumina substrate, prints crystallized glass on top of it, prints and wires the conductor on top of that, and connects the eyebrows with a through hole. This is a method of creating multiple layers by repeating the process.

[Problem to be solved by the invention]

By the way, these multilayering techniques print conductors or insulators on green sheets or alumina substrates, and repeat this process to form multiple layers, and use printed conductors. Multilayering using such printing technology is
The manufacturing process is complicated, and printing equipment for multilayering is required, which has the drawback of requiring large-scale equipment. In addition, when a multilayer board is constructed using such multilayer technology, it is necessary to change a part of the conductor circuit formed on the multilayer board, or to select specific elements and wiring conductors mounted on the multilayer board. is impossible. That is, in a circuit device that meets specific needs, it is necessary to perform a new circuit design even if the constants are only slightly changed. SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a component-embedded multilayer board that can extremely easily realize multilayering and also allows selection of connections between built-in components and wiring conductors. [Means for Solving 1 Problem] That is, the component-embedded multilayer substrate of the present invention utilizes the selective conductive property of an anisotropic conductive film containing a conductive filler, first and second substrates (2A, 2B), and circuit components (pair chip 6, chip component 71) installed on either or both of these substrates.
．． 72) and the electrodes (61, 62=・6n, 711.712) of the circuit component installed on the first or second substrate.
．． 721, 722) and the wiring conductor (4, 21,
22...2n), which is sandwiched between the first substrate and the second substrate to bond the respective substrates, and is connected to the electrode of the circuit component using a conductive filler (14) contained therein. It is provided with an anisotropic conductive film (10) selectively connecting between the wiring conductors or between the wiring conductors.

[For production]

When an anisotropic conductive film containing a conductive filler is pressurized, electrical conduction is selectively established between the conductive fillers at the pressurized portions, thereby forming a local conductor circuit. Therefore, in this invention, since an anisotropic conductive film is provided which is sandwiched between the first and second substrates disposed facing each other and connects each substrate, the anisotropic conductive film contains The electrodes of the circuit component and the wiring conductor can be selectively connected using the conductive filler.

【Example】

Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings. FIG. 1 shows an embodiment of a component-embedded multilayer board (hereinafter referred to as "multilayer board") of the present invention. First and second flexible substrates 2A and 2B such as ceramic green sheets are installed on this multilayer substrate,
Each substrate 2A, 2B is arranged facing each other. Board 2
A wiring conductor 4 is formed by a method such as printing,
A pair chip 6, which is a semiconductor circuit device, is placed thereon as a circuit component to be built in, and an insulating layer 8 is formed in a portion surrounding the pair chip 6 by a method such as printing. The pair chip 6 is an IC with a large number of transistors, resistors, etc. built-in, and as shown in FIG. 2, the pair chip 6 has a plurality of electrodes 61 . 62, 63...6n are formed. Each electrode 61 . of the paired chip 6 is provided on the opposing surface side of the substrate 2B.
A plurality of wiring conductors 21.62, 63...6n correspond to the plurality of wiring conductors 21.
22, 23...2n are installed, and these wiring conductors 2
1,22,23...2n are formed by a method such as conductor printing. An anisotropic conductive film 10 is sandwiched between the opposing surfaces of the substrates 2A and 2B, and the anisotropic conductive film 10 is made of an anisotropic conductive adhesive 12. This anisotropic conductive adhesive 1
2 contains a conductive filler 1 for imparting anisotropic conductivity.
Contains 4. According to the above configuration, the anisotropic conductive film 10 is sandwiched between the substrates 2A and 2B to constitute one multilayer substrate, and each electrode 61, 62, 63...6n of the paired chip 6 and the wiring conductor 21 .22. Conductive filler 1 between 23...2n
An anisotropic conductive film 10 including 4 is sandwiched therebetween. By the way, as shown in FIG. 3(A), the substrates 2A, 2
Wiring conductors 20a and 20b are formed on B, and an anisotropic conductive adhesive 12 is sandwiched between them to form a multilayer structure. In this case, in the anisotropic conductive adhesive 12 sandwiched between the substrates 2A and 2B, the conductive fillers 14 contained therein are in a state separated from each other in a steady state, so that the wiring conductor 20
a and 20b are insulated from each other via the anisotropic conductive film 10. Therefore, as shown in FIG. 3(A), the substrates 2A and 2B are
When the anisotropic conductive adhesive 12 is compressed by applying a pressure F between the two and the compressed state is fixed by applying heat, the conductive filler 14 contained in the anisotropic conductive adhesive 12 becomes as shown in FIG. From the insulated state shown in (A) of FIG. 3, as shown in (B) of FIG.
A conductive circuit will be formed between them. Therefore, in the multilayer substrate shown in FIG. 1 in which the anisotropic conductive film 10 formed with such an anisotropic conductive adhesive 12 is sandwiched, the compressed state is fixed by pressurizing the corresponding parts and applying heat. By doing this, each electrode 61.6 of the paired chip 6
2.63...6n and wiring conductor 21.22.23...
2n, a conductive circuit is formed using the conductive filler 14 of the anisotropic conductive film 10, and electrical connection is made via the conductive circuit. Conductor circuits using such an anisotropic conductor trio are easier to work with than conventional connections by printing or soldering, and have the advantage that the connection points can be set arbitrarily by selecting the pressure points. . Next, FIGS. 4 and 5 show other embodiments of the component-embedded multilayer board of the present invention. In the embodiment described above, a relatively large pair chip 6 was used as the circuit component to be built-in, but in the embodiment shown in FIGS. 4 and 5, a chip such as a chip electrolytic capacitor or a chip resistor is used as the built-in component. Parts 71 and 72 are used. As illustrated in FIG.
．． 206 is formed, and the first chip component 71 is installed between the wiring conductors 201.2020 and its electrodes 711.7.
12 are connected, and a second chip component 72 is installed between the wiring conductors 205 and 206, and its electrodes 721 .
722 is connected. In this embodiment, the chip components 71 and 72 are arranged so as not to overlap each other, and the thickness of the multilayer board is adjusted. An anisotropic conductive film 10 is provided between each substrate 2A and 2B.
is formed by an anisotropic conductive adhesive 12, and the substrate 2A,
A conductor circuit is formed by the conductive filler 14 contained in the anisotropic conductive film 10 by press-welding 2B. That is, in this embodiment, the wiring conductor 201, the wiring conductor 204,
The wiring conductor 202 and the wiring conductor 205, and the wiring conductor 203 and the wiring conductor 206 are electrically connected by the conductive filler 14, respectively, and the chip components 71 and 72 built in between the substrates 2A and 2B are connected to the wiring conductor 203 and the wiring conductor 204. are connected in series. In this way, a plurality of built-in components can be electrically connected using the anisotropic conductive film 10 sandwiched between the substrates 2A and 2B, and a multilayer board with a simple connection structure can be easily formed. It is possible to improve the mounting density of components and components to be mounted on a multilayer board. Although the embodiments have been explained using paired chips and chip components as built-in components, the component-embedded multilayer board of the present invention can also be applied to the case where a multilayer board is constructed by electrically connecting other built-in electronic components. It is possible. Further, in the embodiment, the case where two substrates are used has been described, but the component-embedded multilayer substrate of the present invention can also be used when three or more substrates are stacked.

【Effect of the invention】

As explained above, according to the present invention, the first and second
An anisotropic conductive film is installed together with any circuit components between the two substrates, and electrical connections between the electrodes of the circuit components and the wiring conductors formed on the first or second substrate are made using the anisotropic conductive film. Since this is selectively performed through the conductive layer, it is possible to provide multilayer substrates having various circuit configurations in which arbitrary circuit components are incorporated and necessary electrical connections are made using the anisotropic conductive film.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing an embodiment of the component-embedded multilayer board of the present invention, FIG. 2 is a perspective view showing a pair of chips in the component-embedded multilayer board shown in FIG. 1, and FIG. 3 is the same as shown in FIG. FIG. 4 is a cross-sectional view showing another embodiment of the component-embedded multilayer board of the present invention, and FIG. FIG. 2 is a cross-sectional view showing a method of manufacturing a component-embedded multilayer board. 2A... First substrate 2B... Second substrate 4... Wiring conductor 6... Pair chip (circuit component) 10... Anisotropic conductive film 14... Conductive filler 21.2: l = 2n, 20a, 20b, 20L 20
2.203.204.205.206...Wiring conductor 61.62...6n, 711.712.721.72
2... Electrode 71.72... Chip parts (circuit parts) F

Claims (1)

[Scope of Claims] A first and a second board disposed facing each other, a circuit component installed on one or both of these boards, and a circuit component installed on the first or second board and the circuit component installed on the first or second board. A wiring conductor to be connected to an electrode of a circuit component; and a wiring conductor that is sandwiched between the first substrate and the second substrate to bond the substrates, and a conductive filler contained therein to connect the electrode of the circuit component. and an anisotropic conductive film selectively connecting between the wiring conductor and the wiring conductor.