JPH0470284A - Solid state image pickup device - Google Patents

Abstract

PURPOSE:To shift a solid state image pickup element exactly by a half picture element pitch portion, and to obtain the video signal of high resolution by regulating the movement of the solid state image pickup element to move according to the displacement of a piezoelectric element so as to be the half picture element pitch portion by a regulating means. CONSTITUTION:Preliminary exposure is executed in a CCD 28 for exposure time (t) determined by photometry, and a gradation level is determined from the result of the exposure, and the exposure of a first time is started. After the exposure of the first time is finished, the OFD of the CCD 28 is opened, and the accumulation of charge to a photosensitive part is inhibited. Subsequently, the displacement of the CCD 28 is started, and further, the closing of a shutter 26 is started. At that time, a closing amount due to the closing operation of the shutter 26 is monitored, and when the shutter is closed to a position where the exposure quantity by the shutter 26 becomes the same exposure quantity as the first time, the OFD of the CCD 28 is closed, and the exposure of a second time is started.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a solid-state I-image device suitable for television cameras, still cameras, and the like.

[Conventional technology]

CC conventionally used in television cameras, still cameras, etc.
In the DIIm element, various methods have been proposed to improve the substantial resolution without increasing the physical size by relatively displacing the CCOM image element and the subject image vertically or horizontally.

For example, Japanese Unexamined Patent Publication No. 58-197970 proposes a device in which an imaging device is displaced vertically or horizontally using a piezoelectric element such as PZT or an electromagnetic transducer such as a linear motor.

Furthermore, in Japanese Patent Application Laid-open No. 59-22485, a support plate on which a solid-state II image element is fixed is sandwiched between two leaf springs protruding from a base, and the support plate is moved in parallel by a piezoelectric element. A device in which the solid-state image sensor is displaced is shown.

In addition, Japanese Patent Application Laid-Open No. 64-60072 discloses that a bimorph piezoelectric element is used to move a parallel plate in parallel to obtain a C of an object image.
A method for displacing the imaging position on the OD element is shown. In this method, the driving of the parallel plate is controlled based on the amount of displacement of the imaging position obtained by receiving light emitted from a light emitting source by one of two light receiving parts, and the imaging position is accurately determined. 1/2 pixel pitch.

[Problem to be solved by the invention]

By the way, when displacing the CCDl1l image element, it is necessary to displace the CCDl1l image element accurately by a pitch of 172 pixels with respect to the subject image.
8-22485 discloses a driving source for displacement, but does not disclose a specific displacement method. Furthermore, in the device disclosed in Japanese Patent Laid-Open No. 58-194970, the amount of displacement of the COD is determined by the amount of displacement of the piezoelectric element. However, it is difficult to accurately control the amount of displacement of a piezoelectric element using only applied voltage.

Furthermore, the method disclosed in Japanese Patent Application Laid-Open No. 64-60072 has the disadvantage that the II mD system for translating the parallel plate by a predetermined amount is complicated.

The present invention has been made in view of the above problems, and is based on the C0DI
An object of the present invention is to provide a solid-state Wi image device that accurately displaces a II element by a 1/2 pixel pitch.

[Means for Solving the Problems] In order to solve the above problems, the present invention provides a piezoelectric member that is displaced according to an applied voltage, and a two-dimensionally distributed charger that is moved according to the displacement of the piezoelectric member. This solid-state imaging device includes a solid-state imaging means composed of converted pixels, and a regulating member that regulates the amount of movement of the solid-state means to 1/2 pixel pitch in the pixel array.

[Effect]

In the solid-state ll1lI device configured as described above, the piezoelectric member is displaced according to the applied voltage, and the solid-state imaging means is moved accordingly. The amount of movement of the solid silver edge means is regulated by the regulating means to 1/2 pixel pitch in the pixel array, and thereby the solid image carrier moves by 1/2 pixel pitch.

[Embodiment] FIG. 6 is a front view showing an embodiment of a digital still camera equipped with a solid-state IL image device according to the present invention. 7 and 8 are a plan view and a side view, respectively, of the digital still camera. In Figure 6, 1 is the camera body, 2 is the release button, 3 is the light receiving window for auto white balance (AWB window), 4 is the see-through viewfinder, 5 is the flash emission window, 6 is the photographing lens, and 7 is the lamp. It is a floodlight window. Further, 8 is a light receiving window for photometry, and 9 is a photographing mode changeover switch. The photographing mode changeover switch 9 also serves as a power switch, and when set to rOFFJ, power supply is stopped.

In addition, the l#I Akira mode is switchable between a normal photography mode for photographing natural images such as people and landscapes, and a text photography mode for close-up photography of characters, figures, etc.
Normal shooting mode is selected in ORM, j position,
At the rCHARACT and J positions, the character photographing mode is selected. Reference numeral 10 denotes a changeover switch for changing the photographing magnification, and the switch 10 allows the photographing magnification to be selectively switched between standard photography and macro photography. "N
ORM, standard Q in J position! Shooting is selected and rc
Macro photography is selected for LO8E UPJ Bojisimin. Further, reference numeral 11 is an operation button for switching the light emission mode of the flash, and by pressing the light emission mode switching button 11, two types of light emission modes, forced light emission and light emission prohibition, can be selected.

Further, 12 is an eject switch for an IC card which is a recording medium for image data, and the switch 12 is
When sliding toward the cTJ side, the insertion port 15 (8th
(see figure) is ejected.

Further, in FIG. 7, numeral 13 is a display section comprising, for example, an LCD, an LED, etc., for displaying data such as the number of shots, the above-mentioned shooting mode, exposure control value, and shooting date, and numeral 14 is an operation button for setting the date. Also, in FIG. 8, 15 is I
The C card insertion slot 16 is a lid of a battery mounting section.

Next, FIG. 4 is a system configuration diagram of the digital still camera.

In the figure, 17 is a central control unit (hereinafter referred to as CPLI) that centrally controls the operation of the entire camera, and 18 is a power supply circuit that supplies power to each circuit to be described later. Also, 19
is a distance measuring circuit that calculates the maximum day focus from the current position of the lens to the in-focus position of the main subject. This distance measuring circuit 19 also calculates the absolute distance to the main subject, and the CPU
17 is the main subject distance and the guide number G of the built-in flash.

The so-called flashmatic appropriate exposure is calculated from NOo. Further, 20 is a photometry circuit that measures the subject brightness, 21 is a flash circuit that controls flash emission and charging of a flash emission capacitor, 22 is a display circuit that displays various data on the display section 13, and 2
3 is an auto white balance (AWB) circuit that measures the color temperature of the subject, and 24 is a lamp projection circuit that illuminates the subject when photographing characters. Further, reference numeral 25 denotes a mirror that guides the transmitted light of the photographing lens 6 to the image pickup device during exposure, and shields the image pickup device from light except during exposure, and guides the transmitted light to the photometry circuit 20. Further, 26 is a mechanical shutter for controlling exposure, and the shutter 26 is closed by detecting a hole 65 provided in one shutter curtain 26a with a 7-interval shutter 67, as shown in FIG. 12, for example. The amount can be monitored. That is, when the shutter curtain 26a rotates clockwise from the fully open state and the aperture 66 is closed as shown by the imaginary line, a pulse that detects the hole 65 is output from the photo interrupter 67, and the number of pulses is counted. The amount of rotation of the shutter 126a is detected. shutter 12
Since the amount of rotation of 6a corresponds to the amount of closing of the aperture 66 by the shutter curtains 26a and 26b, the amount of closing of the corresponding aperture 66 can be detected from the amount of rotation.

Returning to FIG. 4, 27 is a motor drive circuit that controls the drive of the motor M. The motor M is a driving source for moving the mirror 25, controlling the exposure of the shutter 26, focusing the photographing lens 6, or changing the magnification. Also, 28
is a solid-state Ii image element (hereinafter referred to as COD), and 29 is the C
A displacement member 30 that moves the 0D 28 by a 1/2 pixel pitch in a direction perpendicular to the optical axis is a COD driver that controls the driving of the CCD 28. In addition, the CC02
8 and the displacement member 29 are unitized as will be described later, and constitute the solid-state image conveying device according to the present invention. Further, 31 is a signal processing circuit that processes the video signal carried by the C0D 28 by a method described later, and 32 is an IC card that stores the signal-processed digital image information.

Here, the displacement mechanism of the solid-state I image device according to the present invention will be explained using FIGS. 1, 2, and 3.

1 and 2 are a front view and a side view, respectively, of the displacement member 29 to which the C0D 28 is attached.

Further, FIG. 3 is a sectional view taken along the line T1 in FIG. 1.

In FIG. 1, the displacement member 29 has a protrusion 29 at the center of the left side.
It is composed of a substrate 291 on which the projection 1a is formed and a displacement driving section 294 fixed to the projection 291a. Also,
The support member 281 of C0D28 is in the horizontal direction (arrow H in the figure).
direction) so as to be slidably attached to the substrate 291. That is, V-shaped bearing portions 281a, 281b and 2 are provided at both ends of the upper side and at the center of the lower side of the support member 281.
81C, and a nut portion 282a for screwing the flexible pressure contact pieces 283a, 283b, and 283C, respectively.
282b and 282C are formed, and the substrate 291
Shafts 292 and 292' are provided on the upper and lower sides, respectively. The support member 281 supports the bearing portion 28
1a and 281b and the pressure contact pieces 283a and 283b sandwich the shaft 292, and the bearing portion 28
1C and the pressure contact piece 283C, the axial direction of the shaft 292.292' is
That is, it is attached so as to be slidable in the direction of arrow H.

Further, as shown in FIG. 3, the displacement driving section 294
For example, the piezoelectric element 298 and the sliding member 297 are enclosed in a cylindrical container formed by fitting an outer frame 295 and an inner frame 296 having a hole 296b formed in the bottom surface. That is, the sliding member 297 has a cylindrical portion 297a.
It has a structure in which a cylindrical convex pillar 297b is formed on the outside of the bottom surface of the cylinder, and the cylindrical part 297a has an outer diameter equal to the inner diameter of the inner frame 296 and the outer diameter of the groove. It is between the hole 296b and the road. Further, the cylindrical portion 29
The open end of the inner frame 296 is folded back to form the open end 2 of the inner frame 296.
A contact portion 297C to 96a is formed. and,
The piezoelectric element 298 is inserted into the cylindrical portion 297a of the sliding member 297, and the sliding member 297 is further inserted into the inner frame 296 with the six pieces 297b passing through the hole 296b via the spring 299. As a result, the sliding member 297 is always urged toward the outer frame 295 by the spring 299, and the piezoelectric element 298 is connected to the sliding member 297 and the outer frame 295.
95. Note that in the initial state, no voltage is applied to the piezoelectric element 298 between the open end 296a of the inner frame 296 and the contact portion 297C! In I), a gap d of 17'2 pixel pitch of C0D28, for example, 5 μm is provided. Piezoelectric element 2
When a voltage is applied to the piezoelectric element 298 and the sliding member 297 is moved to the right by the displacement of the piezoelectric element 298, the abutting portion 297C touches the opening end 29 at the point where the sliding member 297 moves by 1/2 pixel pitch.
6a and its movement is stopped, so the sliding member 2
97 moves exactly by 1/2 pixel pitch.

The displacement driving section 294 is fixed to the side surface of the protrusion 291a by screwing the bottom surface of the outer frame 295. On the other hand, the support member 281 is urged toward the displacement drive section 294 by a spring 293, and its side surface comes into contact with the tips of the six pieces 297b of the displacement drive section 294, thereby inhibiting the movement of the support member 281. has been done. And the pressure N
When a voltage is applied to the element 298, the sliding member 297 moves to the right by exactly 1/2 pixel pitch due to the elongation displacement of the piezoelectric element 298 as described above, and thereby the supporting member 281 also moves accurately. Move to the right by 1/2 pixel pitch. This allows the C0D 28 to be accurately displaced by 1/2 pixel pitch. Furthermore, when the voltage application is stopped, the piezoelectric element 298 is reduced and displaced to its original state, and the sliding member 297 is moved to the left by exactly 1/2i1 prime pitch.
1 also moves to the left by exactly 1/2 pixel pitch and returns to the initial state.

Returning to FIG. 4, the switches will be explained.

Switch SM is a main switch for starting the camera. The main switch SM is turned on when the photographing mode changeover switch 9 is slid to the rNORM, J or rCHARACT, J position. When the main switch SM is turned on, power is supplied from the power supply circuit 18 to each of the circuits. The switch S1 is a switch that is turned on when the release button 2 is pressed halfway, and starts preparations for photographing such as photometry and distance measurement. Switch S2 is turned on by fully pressing release button 2,
This is a switch that starts exposure.

The switch Sp is a switch that detects that the normal shooting mode is selected, and the shooting mode changeover switch 9 is set to r.
When set to NORM, J position, it becomes on state. The switch Sc is a switch that detects that the text shooting mode is selected, and is a switch that detects that the text shooting mode is selected.
When rCHARACT is set to J position, it becomes on state. The switch SNO is a switch that detects that the standard shooting mode is selected, and when the magnification changeover switch 10 is set to the rNORM or J position,
Turns on. The switch SUP is a switch that detects that the macro photography mode has been selected, and is turned on when the magnification changeover switch 10 is set to the rcLO8E UPJ position. The switch SFL is a switch corresponding to the light emission mode switching button 11, and is turned on when the forced light emission mode is selected by the button 11, and turned off when the light emission prohibition mode is selected. The switch Src is a switch that detects the installed state of the IC card 32, and turns on when the IC card 32 is installed.

Note that the signals inputted to the CPU 17 by the switches described above become low signals in the on state, and become high signals in the off state.

FIG. 5 is a circuit diagram of the signal processing circuit 31. As shown in FIG.

The signal processing circuit 31 shown in the figure includes a processing block 33 that processes a video signal shot in the normal shooting mode, and an I11 that processes a video signal shot in the text shooting mode.
It is composed of a physical block 34. The switch 35 corresponds to the fly mode changeover switch 9, and the common terminals aj and a2 are connected to G (green) of C0D28, respectively.
It is connected to the signal output terminal and the R (red)/B (blue) signal output terminal. In addition, when the normal shooting mode is selected, the common terminals al and a2 are connected to the terminals bl and b2, respectively.
When the character photographing mode is selected, the terminals are connected to terminals C+ and C2, respectively.

In the processing block 33, the G analog video signal output from the C0D 28 is converted to an A/D converter 36.
a, the signal is converted into, for example, an 8-bit digital video signal, and is temporarily stored in the memory 37a. Further, the G digital video signal is subjected to white balance (WB) correction by a WB correction circuit 38a, and then subjected to white balance (WB) correction by a γ correction circuit 39a.
Step II (γ) correction is performed. On the other hand, the R/B analog video signal is converted into a digital video signal by the A/D converter 36b and then temporarily stored in the memory 37b. After white balance (WB) correction is performed by the γ correction circuit 39b and gradation (γ) correction is performed by the γ correction circuit 39b, the signal is separated into an R signal and a B signal by the separation circuit 40. The signal-processed RlG and B signals are input to a ma signal generation circuit 41 and a matrix circuit 42, the luminance signal generation circuit 41 generates a luminance signal (Y), and the matrix circuit 42 generates a color difference signal (Y). RY, B-Y) are generated. The luminance signal (Y) has its black level adjusted in a pedestal circuit 43, and is further adjusted to NT in a synchronization signal addition circuit 44.
After the SC synchronization signal is added, the compression circuit 45a performs compression processing using, for example, the ADCT method, and the image is recorded in the image memory in the IC card 32. On the other hand, (RY
) and (B-Y) color difference signals are compressed by compression circuits 45b and 45.
c, each image is subjected to compression processing similar to that described above and recorded in the image memory within the IC card 32. Note that the above 〇〇T compression method is ADCT (Adapt i veD
iscrete Co51ne Transf o
The image data is converted into frequency domain data from low frequency to high frequency using an orthogonal transformation called rm) transformation,
For example, high frequency component data is compressed by reducing the number of sampling bits.

In the processing block 34, the G analog video signal output from the C0D 28 is converted to the A,/'D converter 4.
7a, it is converted into, for example, a 3-bit (8th floor 31) digital video signal, and is temporarily stored in the memory 48a or memory 48b. As will be described later, the digital still camera to which the present invention is applied is configured to perform two exposures in one photographing operation. In text shooting mode,
The G digital image signal from the first exposure is stored in the memory 48a, and the G digital image signal from the second exposure is stored in the memory 48b.

Further, the R/B analog video signal output from the C0D 28 is separated into an R signal and 8 signals by an R/B separation circuit 46, and then converted into digital video signals by A/D converters 47a and 47c, respectively. It is converted and temporarily stored in memory 48C or memory 48d. The R and B digital video signals from the first exposure are stored in the memory 48G.
The R and B digital video signals from the second exposure are stored in the memory 48d. Note that the number of bits (lli scale) of the digital value converted by the A/D converters 47a to 47c changes depending on the brightness of the subject, and as described later, CPt
It is calculated and set by J17. Each of the RGB digital video signals is inputted to the slice circuit 49 after adding the first and second exposure data.

Then, the slice circuit 49 slices each bit, and the run-length encoding circuit 50 encodes the signal, and then transfers it to the IC card 32 and stores it in the built-in image memory.

9 to 11 are schematic diagrams showing the internal structure of the digital still camera. Figure 9 is a schematic front view, Figure 10
The figure is a schematic plan view, and FIG. 11 is a schematic side view.

In the internal structure of the digital still camera, a shutter 26 is disposed at an appropriate position in the optical system constituting the photographic lens 6, and a close-up lens 51 for changing the focal length is disposed (see FIG. 11). Further, a drive mechanism 52 for the mirror 25, the shutter 26, and the close-up lens 51, including the aforementioned motor drive circuit 27, is provided adjacent to the ML shadow lens 6. In addition, a control circuit in which a CPtJ17 and various control circuits are installed behind the drive mechanism 52 is also provided.
A circuit board 53 is disposed, and a displacement member 29 is further provided at the rear thereof.
and displacement tlIIIm of the above-mentioned COD driver 30 and the displacement member 29] II image circuit board 5 in which circuits etc. are incorporated.
An am circuit 55 which is formed into a unit by combining 4 is provided. Note that this II image circuit 55 is disposed at a predetermined position where the II image plane of the C0D 28 is the imaging position of the photographing lens 6. Then, the IC card 32 mounting section 5
A recording circuit board 57 in which the signal processing circuit 31 and the like are incorporated is disposed along the back side of the camera body 1, sandwiching the recording circuit board 6.

Further, a lamp 58 is disposed at a suitable position inside the floodlight window 7,
A photometric lens system 59 and a light receiving element 60 are arranged at predetermined positions inside the photometric window 8 . In addition, a xenon v! integrated with a reflective umbrella 61 is placed at a suitable location inside the flash window 5.
62 is arranged, and the main capacitor 6 is located at a suitable place below it.
3 and a flash circuit board 64 are provided. A power battery B is housed at the bottom of the main body 1.

Next, the photographing operation of the digital still camera will be explained.

First, the main routine will be explained using the flowchart shown in FIG.

When power battery B is inserted, a power-on reset is activated, and the CPU 17 clears the RAM and clears each circuit block.
Initial settings of flags and the like are performed (#1), and the following main routine starts.

First, it is determined whether the main switch SM is on or not (#2). If the main switch SM is off, the process moves to #19, and if the main capacitor 63 is being charged, the voltage is boosted. Stop and return to #2. If the main switch SM is in the on state, the process moves to #3, and the main switch SM changes from the off state to the on state (the power has just been turned on), or the on state is maintained. A determination is made. If the main switch SM changes from the off state to the on state, the boost flag F1 is set to 1 to instruct the boosting (#4
), if the ON state is maintained, the process in #4 is not performed, and it is then determined from the state of the switch Stc whether or not the IC card 32 is inserted (#5
). If the IC card 32 is installed (switch SI
Is the switch Sxc changed from off to on (IC card 32 is now installed)?
It is determined whether the on state is maintained (the IC card 32 is already inserted) (#6), and if the state changes from the off state to the on state, the boost flag F1 is
is set to 1 (#7) and the on state is maintained, no special processing is performed and the subsequently installed I
It is determined whether there is memory capacity remaining in the C card 32 (#8). If the memory capacity of the IC card 32 remains, it is possible to take a picture and the process moves to #9.
It is determined whether the switch S1 is on or not, and if there is no memory capacity remaining, it is determined that photographing is not possible and the process moves to #11, the step-up flag F1 is set to O, and the process moves to #12. If the switch $1 is in the on state in #9, the CPU 17 further determines whether the switch S1 wants to change from the off state to the on state (the release button 2 is now fully pressed) or whether the on state is maintained. It is determined whether the release button 2 is held in the half-pressed state (, :10), and if the switch S1 has changed from the off state to the on state, the "Sl" routine (#
If the ON state is maintained, the process moves to #12.

In #12, the state B of the switch SNO ('IA shadow magnification setting state) is determined, and if the switch SNO is on state Im (standard photography), the photographing lens 6 is set to the standard state and the switch SNO is turned off. Status! (Macro photography)
The photographing lens 6 is set to a macro photographing state and the process moves to #15. Note that the photographing lens 6 can be switched to the macro photographing state by inserting the magnification switching close-up lens 51 onto the optical path. In #15, the state of the boost flag F1 is determined, and if O is set,
The process moves to #19, the boosting operation is stopped, and the process returns to #2. If the boost flag F1 is set to 1, the CPU1
7 determines whether charging of the main capacitor 63 is completed (#16), and if charging is completed,
Since promotion is not necessary, the process moves to the above-mentioned #19, the boost is stopped, and the process returns to #2. Further, if charging is not completed, boosting is started and time measurement by a boosting timer is started (#17). Subsequently, it is determined whether a predetermined boosting time has elapsed (#18), and if the predetermined time has not elapsed, the process returns to #2 and the operations from #2 to #16 are repeated. On the other hand, if charging is not completed within the predetermined boosting time and the time is over (YES in #18), it is determined that the capacity of the power source battery B has decreased, and the photographing operation is prohibited.

Next, using the flowchart in FIG.
Explain the routine.

When the "$1" routine is entered, if the boost operation is in progress, the boost operation is temporarily stopped (:21), and the shooting mode set by the shooting mode changeover switch 9 is determined (#
22). Text shooting mode is set (switch Sc is ON)
If so, move to #51 (Figure 15), and proceed to #51~
Character photographing processing is performed in #66, and if the normal photographing mode is set (switch Sc is 0FF), the process moves to #23, and normal both photographing processes are performed in #23 to #50.

In the normal shooting mode, the distance measuring circuit 19 measures the subject distance, and the shooting lens 6 is adjusted to the focused state (#2
3) Next, the photometry circuit 20 measures the subject brightness, and the CPLJ 17 determines whether or not to use the flash based on the subject distance and the measured value, and determines the F value when the flash fires, the F value when the flash does not fire, etc. The calculation is performed (#
24).

Furthermore, the color temperature of the subject is measured by the AWB circuit 23,
White balance (WB) adjustment processing is performed (#2
5). Subsequently, the set state of the boost flag F1 is determined (#26), and if the boost flag F1=1, it is further determined whether charging is completed (#27). If charging is not completed, the flash circuit 24 starts charging the main capacitor 63 (#28>.Next, it is determined whether charging is completed within a predetermined time, and the charging operation is not completed. During the process, it is confirmed whether the switch 518M and src are turned off and the switch Sc is turned on (#28 to #3
3 loop). That is, it is confirmed whether the power is turned off, the photographing preparation operation is canceled, the photographing mode is switched from the normal photographing mode to the character photographing mode, and the IC card is ejected.

During the charging operation, any one of the switches SI, SM, and Src changes to the off state, and the switch Sc
When it changes to the on state (NO1 #32 is YES in any of steps #30, #31, and #33), the process returns to #2 and the above-described photographing operation is performed again from the beginning. On the other hand, if charging is completed within a predetermined time without any change in switches S+, SM, SC, and Slc during the charging operation (YES in #29), charging of the main capacitor 63 is stopped (#35). , the process returns to #23, and the above-described processes such as distance measurement and photometry are performed again. Furthermore, if charging is not completed within a predetermined time (YES in #34), it is determined that the capacity of power supply battery B has decreased, and the photographing operation is prohibited (#36).

If the boost flag F1 is set to 0 in #26, or if charging is completed in #27, then it is determined whether the release switch S2 is turned on (#37). If the release switch S2 is in the off state (No in #37), the process moves to #47 and waits until the release switch S2 is in the on state.
~ Switches S1, SM, SC and SI described above in #50
The presence or absence of a change in C is confirmed. Switch S during the standby
1. S! l! , Sc, and Stc (No in any step of #47, #48, or 50, YES in #49), the process returns to #2 and the above-mentioned shooting operation starts again from the beginning. I do. On the other hand, when the release switch $2 is turned on without any changes in switches S1, SM, Sc, and Src during the standby period (YES in #37), the mirror 25 starts to be moved out of the optical path. At the same time, the shutter 26 starts opening (#3
8.939), further initialization of C0D28 is performed (#
40). Then, the mirror 29 is completely retracted out of the optical path,
After the shutter 26 opens to the predetermined film calculated in #25 (YES in #41 and #42), exposure in the normal photographing mode to be described later is performed (#43). In addition,
The predetermined F value is a flashmatic F value calculated from the subject distance and subject brightness when the flash is emitted, and is an F value calculated from the subject brightness when the flash is not emitted.

Exposure in the normal photographing mode will now be explained according to the flowchart of "Exposure 1" in FIG. 16.

First, the total exposure time t corresponding to the F value calculated in #25
(seconds) and the displacement time ic (seconds) of C0D28 are compared (#71), and rI at full exposure! jt is 1 at the displacement time tC of C0D28. If it is above (tztc), then #7, which will be described later.
Exposure processing is performed according to the flow from 2 to #86, and if the total exposure time t is less than the displacement time tc of C0D28 (t<
jc), exposure processing is performed according to the flow in #87 to #104, which will be described later. Exposure processing will be explained separately for each case below.

(1) In the case of tztc First, the time difference t1 (=t-jc) between the total exposure time t (seconds) and the displacement time tc (seconds) is calculated (#72), and then half the time t2 of this time difference t1 ( seconds) is calculated (#73). Subsequently, at the same time as the charge accumulation of C0D28 is started, measurement of the time t2 is started (#74
．． 175). Then, when the time 11t2 is counted down to O (YES in #76), the boost flag F1
The set state of is determined (#77), and if the boost flag F1 is set to 1 (flash emission), a flash is emitted (#78). Note that the amount of light emitted by the flash at this time is half the amount of guide numbers G and No. Subsequently, measurement of the displacement time tc is started at the same time as the displacement of C0D28 is started (#79.#80)
. If the boost flag F1 is set to O (flash not emitted) in #77, the process moves to #79 without emitting the built-in flash, and measurement of the displacement and displacement time tc of C0D28 is started. Then, when the displacement time tc has elapsed and the displacement of C0D28 is completed (YES in #81>
, the set state of the boost flag F1 is determined again (#8
2) If the boost flag F1 is set to 1, measurement of time t2 is started at the same time as the flash is emitted (#83, #84).

Note that the amount of flash light emission at this time is also half the amount of guide numbers G and No, similar to the first time light emission amount.

On the other hand, if the boost flag F1 is set to O in #82, the process moves to #85 without emitting a flash, and measurement of time t2 is started.

Then, when the time t2 is counted down to 0 (YES in #85), charge accumulation in the photosensitive part of the C0D28 is stopped, and the accumulated charge is further transferred to the transfer part of the CCD28 (#86) to prevent exposure. The process ends and returns to #45 (#105).

FIG. 17 is a time chart showing the exposure process in case (1) above. In the figure, when switch S1 is turned on at point A and release switch S2 is turned on at point B, distance measurement and photometry processing are performed between points A and B, and focus adjustment and exposure time t are performed. An operation is performed. Further, retraction of the mirror 25 and opening of the shutter 26 are started from point B, and charge accumulation in the C0D 28 is started from point 0, where these operations are completed. Then, charges are accumulated in C0D28 for the exposure time t from point 0 to point E. on the other hand,
Displacement of C0D28 starts from point D, which is tz (-(t-tc)/2) seconds after point 0, and the displacement of 172 pixel pitches is completed at point E, which is tc seconds later. Further, when emitting a flash, 1/2 of the total amount of light emitted by the flash is emitted at the above-mentioned point and the above-mentioned point E, that is, immediately before the displacement of the C0D 28 starts and after the displacement of the C0D 28.

Furthermore, since the aperture of the shutter 26 is set to an appropriate aperture value based on Flashmatic calculation, the total amount of light emitted by the flash is divided into two, and the total amount of light is emitted within the total exposure time. The exposure amount for the main subject will be appropriate even if the camera is set to

<2) When ic>j First, the time difference i1' (=j(i)) between the displacement time ic (seconds) and the total exposure time t (seconds) is calculated (#87),
Furthermore, a time t3 (=t/2), which is half of the previous two total exposure times t, is calculated (388). Next, the first charge accumulation is started in the photosensitive part of the C0D28 (#89), and the set state of the boost flag F1 is determined (#90). If the boost flag F1 is set to 1, the flash is activated. is emitted (#91). Note that the amount of light emitted by the flash at this time is half the amount of guide numbers G and No. Subsequently, measurement of the first exposure time t3 is started at the same time as the displacement of C0D28 is started (#92.#93).
If booster 75g F1 is set to 1 in #90, the process moves to #92 without firing the flash, and C0
Measurement of the displacement of D28 and exposure time t3 is started. Then, when the exposure time t3 is counted down to O (YES in #94), charge accumulation in the photosensitive part of the C0D28 is stopped, and the first accumulated charge is transferred to the transfer part of the C0D28 ($95> Next, the overflow drain (hereinafter referred to as OFD) of C0D28 is opened, and unnecessary charges generated in the photosensitive area are discharged to OFD (#9
6), measurement of the time difference tt' is started (#97).

When the time difference t+' is counted down to 0 (
#98: YES), the OFD is closed and C0D28
The second charge accumulation on the photosensitive area starts (#99)
. Subsequently, the set state of the promotion flag F1 is determined (#
100), if the boost flag F1 is set to 1,
At the same time as the flash fires, measurement of the exposure time t3 starts (#101, #102>.The amount of light emitted by the flash at this time also depends on the guide number G, No., as well as the amount of light emitted at the first time. On the other hand, if the boost flag F1 is set to 0 in #100, the process moves to #102 without firing the flash, and the exposure time t
3 measurement is started. Then, the exposure time t3 is 0
When the countdown is completed (YES in #103), C
Accumulation of charges in the photosensitive section of 0D28 is stopped, and the accumulated charges are further transferred to the transfer section of C0D28 (#104), and the exposure is completed and the process returns to #44 (#105). At this time, the charge in the transfer section is a mixture of the first accumulated charge and the second accumulated charge, and the total exposure time t (=2xt3
)'s total accumulation WA1! The amount of cargo.

FIG. 18 is a time chart showing the exposure process in case (2) above. In the figure, the displacement of C0D 28 is started from point 0, where the mirror 25 has been retracted and the shutter 26 has been opened, and the displacement is completed at one point after the displacement time tc has elapsed. C0D28 is laterally displaced by 1/2 pixel pitch after one point. In addition, the photosensitive part of C0D28 is 1
The first charge accumulation is performed, and the first accumulated charge is transferred to the transfer section of the C0D 28 at the point G. Also, from point G to tl
'Time t3 (=t/2) from elapsed point H to point 1
The second charge is accumulated in the photosensitive part of the C0D28 for a while, and the second accumulated charge is transferred to the transfer section of the C0D28 at that point, and the first and second accumulated charges are mixed in the transfer section. . In addition, from point G to point H, the OF of C0D28
D is open, and no charge is accumulated in the photosensitive portion of C0D28. Also, when firing a flash, at the 0 point and H point, which are the first and second exposure start points,
1/2 of the total amount of flash light is emitted.

In this case as well, the total amount of light is emitted within the total exposure time t (-2 Even if this is done, the exposure amount of the main subject will be appropriate as in case (1).

Returning to FIG. 14, when the exposure is completed, closing of the open shutter 26 is started (#45), and at the same time, C0
The accumulated charges (video signal charges) in the transfer section of D28 are transferred to the signal processing circuit 31 (#46). Subsequently, the video signal is subjected to predetermined signal processing in a signal processing circuit 31, converted into a luminance signal (Y) and color difference signals (RY, B-Y), and then stored in an IC card 32. Ru.

Next, the text shooting mode will be explained. When the character photographing mode is set in #20, the lamp 58 is turned on by the light projecting circuit 24, and the lamp light is irradiated onto the character to be photographed (FIG. 15, #51).

The irradiation range of the lamp light corresponds to the shooting range, and this allows the photographer to know the shooting angle of view.

Further, since the lamp light is evenly irradiated onto the entire shaded character, the brightness of the subject can be made uniform.

Subsequently, the distance measuring circuit 19 measures the distance to the subject, and the focus of the photographic lens 6 is adjusted based on the distance to the subject, and the photometric circuit 2o measures the brightness of the subject, and the exposure time t is set based on the measurement result. (#52.#53
). Next, it is determined whether the release switch S2 is turned on (#54), and the release switch S2 is turned on.
If S2 is off (No in #54), move to #62 and wait until it becomes on. During the standby, check whether the above-mentioned switch S1.SM, SC, and Src become off. is performed (#62 to #65), and during the standby, any one of the switches S+, SM, SC, and SIC
When the switch changes to the off state (No in any of steps #62 to #65), the lamp 58 is turned off by the light emitting circuit 27 (#66), and then the process returns to #2. On the other hand, the switch S+, When the release switch S2 is turned on without changing any of SM, SC and S!c (#
54: YES), the mirror 25 starts to move out of the optical path (mirror up) (#55), and then the shutter 26
opening is started (#56). Additionally, the CC[) driver 30 starts initializing the C0D28 (#57
). Next, wait until the mirror 25 is completely retracted out of the optical path and the shutter 26 opens to the predetermined F value calculated in #23 (YES in #58 and #59), and then enter the text shooting mode described later. Exposure is performed (#60), and when the exposure is completed, the lamp 7 is turned off by the light projection circuit 27 (#6
1>, return to #2.

Next, exposure in the character photographing mode will be explained according to the flowchart in FIG. 19.

First, C for the exposure time t determined by photometry in #53.
Pre-order on CD28! jilt is performed, and from the exposure result
The threshold level of the level is determined (#1
11). That is, the gradation levels of the A/D converters 47a to 47c are determined from the luminance signal level at which preliminary exposure has been performed. Subsequently, the shutter 26 is opened and the first exposure is started (#112). Then, when the exposure time t has elapsed, the II charges accumulated in the photosensitive area of the C0D 28 are field shifted to the transfer area (#113), and at the same time, the OFD is opened to prohibit charge accumulation in the photosensitive area, and 1 The second exposure is completed (#114). Next, C0
The displacement of D28 is started (#115), and the shutter 2 is further moved.
6 is started (#116). At this time, as described above, the aperture 6 is closed due to the closing operation of the shutter 26.
5 is monitored (#117), and when the shutter 26 is closed to a position where the exposed layer by the shutter 26 is the same as the first exposure amount (YES in #117), the CCD
28 OFD is closed and the second exposure begins (
a118). Then, the shutter 26 is completely closed, and the 2
When the first exposure is completed (#119), the accumulated charge from the first exposure held in the transfer section of C0D28 (
The first image data) is read out to the signal processing circuit 31 (
#120), then the accumulated charge (second image data) accumulated in the photosensitive section of the CCD 28 due to the second exposure is read out to the signal processing circuit 31 via the transfer section (
#121). In the signal processing circuit 31, the reference voltage and conversion voltage range of the A/D converters 47a to 47C are set according to the gradation level determined in #111. For example, if it is set to 8 gradation levels, the first
The G signal of the image data is converted into a 3-pit digital video signal by the A10 converter 47a, and then stored in the memory 48.
It is temporarily stored in a. Further, R of the first image data
The /B signal is separated into an R signal and a B signal by an R/B separation circuit 46, each converted into a 3-bit digital video signal by A/D converters 47b and 47c, and then stored in a memory 48.
It is temporarily stored in C. Similar A/D conversion processing is performed on the second image data, and the G digital video signal is stored in the memory 48b, and the R and B digital video signals are stored in the memory 48d. Next, the digital video signals related to the first and second image data of R are combined and inputted to the slicing circuit 49, and after the combined data is sliced for each bit, it is run-length encoded in the encoding circuit 50. will be held. Further, similar processing is performed on the digital video signals related to the first and second image data of G and 8. The run-length encoded digital video signal is then stored in the IC card 32 (#122).

FIG. 20 is a time chart showing the exposure processing in the text photographing mode. In the figure, a predetermined exposure time t starts from point 0, when the mirror 25 has been retracted and the shutter 26 has been opened. Then, the gradation level of A/D conversion is determined. Next, after preliminary exposure, C0D from 8 points
The first charge accumulation starts in the photosensitive portion 28 and ends when the exposure time t has elapsed. After the first exposure is completed, the displacement of the CCO 28 is started from point K, and the closing of the shutter 26 is started at point L, where the displacement ends.

Then, at point M, where the aperture 66 is closed by a predetermined amount, the OFD is closed, and the second charge accumulation is started.

The charge accumulation continues until point N, at which the shutter 26 is completely closed.

Next, the exposure operation in the character photographing mode when FIT-COD is used as the image sensor will be explained according to the flowchart of FIG. 21. The flowchart in FIG. 21 replaces the flowcharts #53 to #59 in FIG. 15, so the operation after moving from #52 in the figure to #131 in FIG. 21 will be described.

After photometry is carried out in #52 and the exposure time t is set based on the photometry result, it is determined whether the release switch S2 is in the on state (#131), and if it is in the off state, it is determined in #62.
(see Figure 15), if it is on, C0D
28 initialization is performed (#132),! The mirror 25 is moved out of the optical path (mirror up) and the shutter 26 is
opening is started (#133). And mirror 25
completely retreats out of the optical path and the shutter 26 opens to the predetermined Fl calculated in #23 (YES in #134).
CCD 2 for the exposure time t determined by photometry in #53.
8, a preliminary I exposure is performed (#135), and the gradation level is determined from the exposure result (#136). Next, C0D2
The unnecessary charges accumulated in the photosensitive parts of the odd-numbered lines of 8 are discharged to the transfer part, and the first exposure is started for the odd-numbered lines (#137). Also, after a predetermined time delay, C0D2
Unnecessary charges accumulated in the photosensitive parts of the even-numbered lines of 8 are discharged to the transfer part, and the first exposure is started for the even-numbered lines (#138). Subsequently, after 1Ilt has elapsed during exposure from the start of exposure of the odd-numbered line, the charges accumulated in the photosensitive portion of the odd-numbered line are field-shifted to the transfer portion, and the first exposure of the odd-numbered line is completed (#139). Subsequently, the video signal of the number line transferred to the transfer section is read out to the signal processing circuit 31, and after being A/D converted at a predetermined gradation level as explained in the first embodiment, it is stored in the memory 48a and 48c (#140).

Subsequently, the exposure time t is determined from the start of exposure of the pregametic number line.
l! After that, the charges accumulated in the even lines are field-shifted to the transfer section, and the first exposure of the even lines is completed (#141). The even-numbered line video signals transferred to the transfer unit are also read out to the signal processing circuit 31 in the same way as the odd-numbered line video signals, and after A/D conversion at a predetermined gradation level, are stored in the memories 48a and 48C. be done. Then, when the first exposure is completed, the OFD of C0D28
is opened and charge accumulation in the photosensitive area is prohibited (#142
). Subsequently, displacement of C0D28 is started (#143)
Furthermore, closing of the shutter 26 is started (#144).

At this time, as described above, the amount of closing of the aperture 65 due to the closing operation of the shutter 26 is monitored (#1'45
), when the shutter 26 is closed to a position where the exposure amount by the shutter 26 is the same as the first exposure amount (#145
(YES), the OFD of the CCD 28 is closed and the second exposure is started (:146). The second exposure operation is #
This process is performed in steps 146 to #15o, but this process is similar to the first
#118 to #122 explained in the example (see Figure 19)
Since the same processing is performed, the explanation will be omitted.

FIG. 22 is a time chart showing the exposure operation in the character photographing mode when the FIT-COD is used.

In the figure, preliminary exposure is performed for an exposure time t from the 0 point at which the mirror 25 has been raised and the shutter 26 has been opened, and the level of each gradation is set from the preliminary exposure result. Then, the first exposure is performed for the odd numbered line of the photosensitive area of C0D28 from the 0 point after the preliminary exposure for the exposure time 21, and the first exposure is performed for the even numbered line of the photosensitive area of C0D28 from the point P for the exposure time t. The second exposure is done. Then, at point R, where the first exposure has finished, C0
The OFD of D28 is opened, and the accumulation of electricity in the photosensitive section is prohibited, and the displacement of the C0D28 is started.

Closing of the shutter 26 is started at the 8 points where the displacement of the C0D 28 ends, and at the lower point where the aperture 66 is closed by a predetermined amount, the OFD is closed and the second charge accumulation is started. The charge accumulation is then carried out until the point U, at which the shutter 26 is completely closed.

Incidentally, in the above embodiment, an optical low-pass filter is not used even in the normal shooting mode, but a low-pass filter may be used in the normal shooting mode. FIG. 23 is a configuration diagram showing one embodiment thereof. In this figure, the same members as in FIG. 1 are given the same numbers.

70 is a low pass filter (hereinafter referred to as LPF), 71
is a low pass filter (LPF) retracting means for retracting the LPF 70 from the optical path. In the figure, the LPF 70 is retractably provided between the photographing lens 6 and the C0D 28. When the switch Sp is turned on and the normal shooting mode is selected, the CPU 17 activates the LPF retraction means 71.
A control signal is sent to the LPF 70 to place it on the optical path.

As a result, in the normal shooting mode, high frequency components are cut, making it impossible to achieve high resolution. On the other hand, when the switch Sc is turned on and the character photographing mode is selected, the CPU 17 sends a control signal to the LPF retracting means 71 to retract the LPF 70 from the optical path.

As a result, in the character photographing mode, there is no reduction in resolution due to the LPF 70, so high resolution can be achieved.

In the above embodiment, a piezoelectric element was used as a means for displacing the C0D28, but by displacing an optical prism and a horizontal transmission plate on the optical path, the C0D
The same effect as displacing 28 may be obtained.

〔Effect of the invention〕

As explained above, according to the present invention, the amount of movement of the solid-state image sensor that moves in accordance with the displacement of the piezoelectric element is reduced to W! Since the alligator means is used to restrict the displacement to 1/2 pixel pitch, the solid-state imaging device can be accurately displaced by 1/2 pixel pitch. As a result, a high-resolution video signal can be obtained by displacing the solid-state imaging device and performing II imaging at least twice.

Moreover, if the solid-state image sensor and the piezoelectric element that is its displacement source are integrated into a unit, a highly accurate displacement amount can be obtained and it can be easily mounted on a device such as a camera.

[Brief explanation of drawings]

FIG. 1 is a front view showing an embodiment of the solid-state AM device according to the present invention, FIG. 2 is a side view of the solid-state Ili image device, FIG. 3 is a sectional view taken along the line m-■ in FIG. The figure shows a solid 1 according to the present invention.
A system configuration diagram of an embodiment of a digital still camera equipped with a 1m device, FIG. 5 is a circuit configuration diagram of a signal processing circuit,
6 is a front view of the digital still camera, FIG. 7 is a plan view of the digital still camera, FIG. 8 is a side view of the digital still camera, FIG. 9 is a front perspective view of the still camera, and FIG. The figure is a plan perspective view of the still camera, FIG. 11 is a side perspective view of the still camera,
Fig. 12 is a configuration diagram of the main parts of the shutter, Fig. 13 is a main flowchart showing the photographing operation of the digital still camera, Fig. 14 is a flowchart of the "Sl" subroutine,
Fig. 15 is a flowchart showing the shooting operation in text shooting mode, Fig. 16 is a flowchart of the F exposure 1J subroutine in normal shooting mode, and Fig. 17 is an exposure operation when the exposure time is longer than the COD displacement time in normal shooting mode. FIG. 18 is a time chart showing the exposure operation when the exposure time is shorter than the COD displacement time in the normal shooting mode. FIG. 19 is a flowchart of the "Exposure 2J subroutine" in the text shooting mode. FIG. FIG. 21 is a time chart showing the exposure operation in the text shooting mode. FIG. 21 is a flowchart of the second embodiment of the exposure operation in the text shooting mode. FIG. 22 is a time chart showing the second embodiment of the exposure operation in the text shooting mode of a digital still camera. Such a time chart, FIG. 23, is a configuration diagram of main parts of a digital still camera according to the present invention using a low-pass filter. 1...Camera body, 2...Release button, 4...
・Finder, 5...Flash emission window, 6...Photographing lens, 8...Metering window, 9...Power switch and shooting mode selection switch, 1o...Photography magnification selection switch, 11... Flash strength 11J flash/flash inhibit button, 13...display section, 15...IC card slot, 17...CP[J, 18...power circuit, 19...
- Distance measurement circuit, 20... Photometry circuit, 21... Flash circuit, 22... Display circuit, 25... Mirror, 26
...Shutter, 27...Motor drive circuit, 28...
- CCD, 29... Displacement member, 30... COD driver, 31... Signal processing circuit, 32... IC card, 31... Signal processing circuit, 32... IC card, 4
6 ・R/B separation circuit, 47a to 47c...A/D
Converter, 48a to 48d... Memory, 49... Slice circuit, 50... Run length encoding circuit, 58.
... Lamp, 61 ... Reflector, 62 ... Xenon tube, 63 ... Main condenser, 65 ... Hole, 66 ...
... Avatia-167... Photo interrupter,
70...Low pass filter (LPF), 71...Low pass filter retraction means, 281...COD support member, 281 a, 281 b, 281 c-... Bearing portion, 291... Substrate, 292, 292 '···shaft,
293.299 Spring, 294 Displacement drive unit, 295 Outer frame, 296 Inner frame, 297
...m moving member, 297a...cylindrical part, 297b...
Convex portion, 297c... Contact portion, 298... Piezoelectric element,
SM, Sl, 32, Sp, Sc. SNO, Sup, SFL, Sl c-switch. Figure 12 Patent applicant Minolta Camera Co., Ltd. Agent
Person Patent Attorney Etsu Kotani Purpose
Chief Patent Attorney 1) Masayuki Patent Attorney Takao Ito

Claims (1)

[Claims] 1. A solid-state imaging means consisting of a piezoelectric member that is displaced according to an applied voltage, and a two-dimensionally arranged photoelectric conversion pixel that moves according to the displacement of the piezoelectric member, and the amount of movement of the solid-state imaging means in the pixel array. A solid-state imaging device comprising: a regulating member that regulates the pitch by 1/2 pixel pitch.