JPH0439761B2 - - Google Patents
Info
- Publication number
- JPH0439761B2 JPH0439761B2 JP59075848A JP7584884A JPH0439761B2 JP H0439761 B2 JPH0439761 B2 JP H0439761B2 JP 59075848 A JP59075848 A JP 59075848A JP 7584884 A JP7584884 A JP 7584884A JP H0439761 B2 JPH0439761 B2 JP H0439761B2
- Authority
- JP
- Japan
- Prior art keywords
- oxide
- weight
- mol
- zno
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 95
- 239000011787 zinc oxide Substances 0.000 claims description 46
- 239000013078 crystal Substances 0.000 claims description 31
- 239000010949 copper Substances 0.000 claims description 25
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 claims description 21
- 239000011521 glass Substances 0.000 claims description 19
- 239000005388 borosilicate glass Substances 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 238000010304 firing Methods 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 claims description 11
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 claims description 10
- 239000011701 zinc Substances 0.000 claims description 10
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 229910000416 bismuth oxide Inorganic materials 0.000 claims description 6
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 claims description 6
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 5
- 239000011651 chromium Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 5
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 3
- 239000005751 Copper oxide Substances 0.000 claims description 3
- 229910000410 antimony oxide Inorganic materials 0.000 claims description 3
- 229910000431 copper oxide Inorganic materials 0.000 claims description 3
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 3
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 2
- 229910052810 boron oxide Inorganic materials 0.000 claims description 2
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 2
- 229910000428 cobalt oxide Inorganic materials 0.000 claims description 2
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 claims description 2
- 239000012071 phase Substances 0.000 description 21
- 238000009792 diffusion process Methods 0.000 description 14
- 230000007423 decrease Effects 0.000 description 10
- BNGXYYYYKUGPPF-UHFFFAOYSA-M (3-methylphenyl)methyl-triphenylphosphanium;chloride Chemical compound [Cl-].CC1=CC=CC(C[P+](C=2C=CC=CC=2)(C=2C=CC=CC=2)C=2C=CC=CC=2)=C1 BNGXYYYYKUGPPF-UHFFFAOYSA-M 0.000 description 9
- 238000010586 diagram Methods 0.000 description 9
- 239000000047 product Substances 0.000 description 7
- 229910052596 spinel Inorganic materials 0.000 description 7
- 239000011029 spinel Substances 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 6
- 230000005611 electricity Effects 0.000 description 5
- 229910052804 chromium Inorganic materials 0.000 description 3
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 239000011812 mixed powder Substances 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- GHPGOEFPKIHBNM-UHFFFAOYSA-N antimony(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Sb+3].[Sb+3] GHPGOEFPKIHBNM-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- KAGOZRSGIYZEKW-UHFFFAOYSA-N cobalt(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Co+3].[Co+3] KAGOZRSGIYZEKW-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000000724 energy-dispersive X-ray spectrum Methods 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- UPWOEMHINGJHOB-UHFFFAOYSA-N oxo(oxocobaltiooxy)cobalt Chemical compound O=[Co]O[Co]=O UPWOEMHINGJHOB-UHFFFAOYSA-N 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- ZFZQOKHLXAVJIF-UHFFFAOYSA-N zinc;boric acid;dihydroxy(dioxido)silane Chemical compound [Zn+2].OB(O)O.O[Si](O)([O-])[O-] ZFZQOKHLXAVJIF-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 101100513612 Microdochium nivale MnCO gene Proteins 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910007472 ZnO—B2O3—SiO2 Inorganic materials 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Inorganic materials O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- GUTLYIVDDKVIGB-YPZZEJLDSA-N cobalt-57 Chemical compound [57Co] GUTLYIVDDKVIGB-YPZZEJLDSA-N 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000002772 conduction electron Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000005036 potential barrier Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- YEAUATLBSVJFOY-UHFFFAOYSA-N tetraantimony hexaoxide Chemical compound O1[Sb](O2)O[Sb]3O[Sb]1O[Sb]2O3 YEAUATLBSVJFOY-UHFFFAOYSA-N 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Landscapes
- Compositions Of Oxide Ceramics (AREA)
- Thermistors And Varistors (AREA)
Description
〔発明の利用分野〕
本発明はアレスタやサージアブソーバなどに使
用できる酸化亜鉛を主成分とする焼結体から成る
電圧非直線抵抗体とその製造法に関する。
〔発明の背景〕
酸化亜鉛系の電圧非直線抵抗体は一般に良く知
られているセラミツクス焼結技術で製造される。
その概要は酸化亜鉛(ZnO)粉末を主成分とし
て、それに酸化ビスマス(Bi2O3)、酸化アンチ
モン(Sb2O3)、酸化コバルト(Co2O3)、酸化マ
ンガン(MnO2)、酸化クロム(Cr2O3)、酸化ケ
イ素(SiO2)、酸化ホウ素(B2O3)、酸化アルミ
ニウム(Al2O3)などを加え十分に混合し、これ
に水及びポリビニルアルコールなど適当なバイン
ダを加えて造粒して成形する。この成形体は沿面
防止の目的で、抵抗体の側面にSiO2−Sb2O3−
Bi2O33元系成分を塗布し、電気炉を用いて温度
1000〜1300℃で焼成する。最後に本焼成体の上下
両端面を所定の厚さに研摩、調整し、溶射又は焼
付け法によつて電極を形成して電圧非直線抵抗体
としている。
最近、Bi2O3−B2O3−Ag2O系ガラスあるいは
ZnO−B2O3−SiO2系ガラスを微量添加した非直
線抵抗体は課電寿命が著しく改善されるため上記
ガラスなしの電圧非直線抵抗体と共に実用されて
いる。
酸化亜鉛系の電圧非直線抵抗体は従来知られて
いるSiC等を比べて電圧−電流特性が非常に優れ
ている。しかし、実用面において
(1) 低電流領域特性の改善、特に漏れ電流の減少
(2) 広い電流領域における非直線性の改善
(3) 方形波並びにインパルス電流による方形波耐
量の向上
(4) ACあるいはDC課電寿命特性の向上
等が望まれている。
第1図には従来知られている酸化亜鉛系電圧非
直線抵抗体の内部構造を図解する。すなわち第1
図は、従来の酸化亜鉛系電圧非直線抵抗体の内部
微細構造の概要図であり、符号1はZnO結晶粒、
2はスピネル相結晶粒、3はBi2O3粒界相を意味
する。
ZnO結晶粒はそれぞれが直径10μm程度であり、
焼結体全体積の大部分を占める。一方、スピネル
相結晶粒は直径1〜2μmでZnO結晶粒に比べて小
さく、ZnO結晶粒の間、特に3重点(3個の結晶
粒が互いに接している箇所)などに分散してい
る。組成はZn7Sb2O12でありCo、Mn、Cr、Niな
どが固溶している。Bi2O3相はそれに接するZnO
結晶粒の粒界近傍にポテンシヤルのバリアを形成
するために有効である。Bi2O3相は粒子の3重点
などに凝縮しやすいが、境界層が観察されない境
界においても厚さ20〜200ÅにわたりBi原子濃度
の高い層が存在することが確められている。
第2図は、上記第1図の組成分中にZnO−
B2O3−SiO2系ガラスを1重量%添加した、同じ
く従来の酸化亜鉛系抵抗体の内部微細構造の概要
図であり、符号1′〜3′は、第1図の1〜3と同
義で、4はガラス相を意味する。ZnO結晶粒1′、
スピネル相結晶粒2′、Bi2O3相3′は第1図と同
様な配置であるが、Bi2O3相3′の内部、あるい
は境界層にガラス相4の析出物が点在しているの
が判る。
しかし、これら従来のものは、いずれも前記し
た実用上の要望を十分満しているとはいえない。
〔発明の目的〕
本発明の目的は、ZnO粒内抵抗を低減して平坦
率を向上させ、且つ課電寿命を向上させると同時
に上記ZnO粒内抵抗の減少によつて増大する漏れ
電流を低減させ、低電流特性を改善した電圧非直
線抵抗体及びその製造法を提供することにある。
〔発明の概要〕
本発明を概説すれば、本発明の第1の発明は電
圧非直線抵抗体に関する発明であつて、酸化亜鉛
(ZnO)を主成分とする焼結体の側面に高抵抗層
が形成され、且つ焼結体の上下両端面に電極が形
成された電圧非直線抵抗体において、該焼結体
が、ZnO系結晶粒内には0.0003〜0.03重量%のア
ルミニウムが拡散し、更に該ZnO系結晶粒の表面
近傍には銅が拡散したものであることを特徴とす
る。
また、本発明の第2の発明は電圧非直線抵抗体
の製造法に関する発明であつて、酸化亜鉛を主成
分とし、添加成分として酸化ビスマスをBi2O3に
換算して0.2〜2モル%、酸化ケイ素をSiO2に換
算して1〜4モル%、酸化コバルトCo2O3に換算
して0.8〜3モル%、酸化アンチモンをSb2O3に換
算して0.1〜3モル%、酸化マンガンをMnO2に換
算して0.1〜3モル%、酸化クロムをCr2O3に換算
して0.1〜2モル%、アルミニウムをAl2O3に換算
して0.0005〜0.05モル%含有する組成物に、銅を
Cu2Oに換算して0.001〜20重量%、亜鉛をZnOに
換算して40〜70重量%含む銅ホウケイ酸亜鉛ガラ
スを、0.1〜2重量%配合した原料粉を、混合、
造粒、成形し、側面に高抵抗層を取付けて焼成
し、ZnO系結晶粒内には0.0003〜0.03重量%のア
ルミニウムが拡散し、更に該ZnO系結晶粒の表面
近傍には銅が拡散した焼結体を得、その焼結体の
上下両端面に電極を形成させることを特徴とす
る。
第3図は、本発明の電圧非直線抵抗体の内部微
細構造の概要図であり、符号1″〜3″及び4′は
第2図と同義であり、5は銅拡散層を意味する。
ZnO結晶粒1″、スピネル相結晶粒2″、Bi2O3
相3″及びガラス相4′は第2図と同様な構造であ
るが、ZnO結晶粒1″並びにスピネル相結晶粒
2″表面にCu拡散層5が形成されている。
Cu拡散層は上記した本発明の製造法によつて
形成される。特に、温度1150〜1300℃間で1〜5
時間の焼成中にZnO結晶粒が形成され、粒成長が
起ると同時にガラス粉末は酸化ビスマス液相に捕
えられる。同時にCu原子は、ZnO結晶粒やスピ
ネル相結晶粒表面へ拡散され、最後に拡散層が形
成される。拡散層の厚さは酸化銅量並びに焼成条
件によつて調節するが、0.01〜1μmで、且つ結晶
粒半径の1/10〜1/10000程度が望ましい。この拡
散層の抵抗率は、測定によれば10〜100Ω・cmで
ZnO結晶粒内抵抗1〜2Ω・cmの約10〜100倍高
い。この拡散層がBi2O3境界層のそばに形成され
ればシヨツトキー障壁が変形し、障壁電圧が増大
して、漏れ電流が減少すると同時に平坦率が向上
する。
第4図は、本発明及び従来の電圧非直線抵抗体
の電流A(横軸)と電圧(V/mm)との関係を示
すグラフである。第4図において、7は本発明の
抵抗体の特性曲線、8は従来の銅ホウケイ酸亜鉛
ガラス及びAlを共に含まない抵抗体(従来品A)
の特性曲線、そして9は従来の硝酸アルミニウム
0.02重量%及びホウケイ酸亜鉛ガラス1重量%を
共に含む抵抗体(従来品B)の特性曲線である。
曲線8に比べて曲線9においてはAl添加によつ
て低電流域での漏れ電流は増加するが、平坦率は
向上する。他方、本発明の曲線7においては、硝
酸アルミニウムが0.02重量%添加されているにも
かかわらず、Cu拡散層が存在するために、バリ
アが増大し、低電流域での漏れ電流が低減すると
同時に平坦率も向上する。
第5図は、本発明及び従来の抵抗体のAC課電
寿命試験における、課電時間〔(課電時間)1/2〕
(横軸)と漏れ電流増加率(漏れ電流/初期電流)
(横軸)との関係を示すグラフであり、曲線7′〜
9′は、第4図の曲線7〜9に対応する。課電試
験は、課電率85%、温度130℃で行つたものであ
る。
第5図から明らかなように曲線8′に比べて曲
線7′では課電特性が著しく向上し、更に曲線
9′よりも優れている。
焼成中にCu原子はガラス相よりZnO結晶粒へ
移動する。ZnOはn型半導体酸化物に属して、伝
導電子が電気伝導の担い手であるが、Cu拡散層
中のCuイオンに捕えられて抵抗率を高める。
本発明の焼結体の一部を切り出し薄片を電子顕
微鏡観察した結果ではBi2O3境界層は粒子の3重
点などに凝縮しやすいが、厚さ20〜200Å程度の
非常に薄い境界層が広範囲に存在する。この様な
部分にCu拡散層が形成されてバリアが顕著に増
加し電圧非直線性を向上させる。
銅ホウケイ酸亜鉛ガラスの酸化亜鉛、酸化ホウ
素、酸化ケイ素量は、透明なガラスを合成するた
め、且つ常時課電々圧に対する漏れ電流増加率を
非常に小さく、同時に非直線係数αの大きなZnO
系電圧非直線抵抗体を得るために前記した0.1〜
2重量%範囲が適当である。また、本ガラスの酸
化銅量は、ZnO結晶粒表面より深さ数百分の1〜
数μmの高抵抗層にするため、前記した0.001〜20
重量%の範囲が適当である。
他方、酸化アルミニウム又は硝酸アルミニウム
量は、酸化アルミニウムに換算して0.0005〜0.05
モル%が適当である。0.05モル%より以上では、
漏れ電流が増大し、且つ非直線係数αが減少し、
他方、0.0005モル%未満では漏れ電流は減少する
が、非直線係数αが広い電流範囲にわたつて減少
し、好ましくない。
焼成温度は1150゜〜1300℃範囲が望ましい。
1150℃未満では気泡が発生し、1300℃超では酸化
ビスマスや酸化アンチモンが蒸発するため多孔質
となつて密度が減少し望ましくない。この温度範
囲において健全な焼結体が得られ、特に適度な厚
さのCu拡散層が得られる。
ガラス相は課電時における結晶粒内のZnイオ
ン、特に格子間Znイオンの境界層への拡散を制
御し、課電劣化を防止する効果がある。
〔発明の実施例〕
以下、本発明を実施例により更に具体的に説明
するが、本発明はこれら実施例に限定されない。
なお、第6図は、本発明の1実施例の抵抗体、
また第7図は従来品Aの抵抗体を、それぞれ切
断・研摩して得た薄片について、透過電子顕微境
観察した微細構造の概要図と、ZnO結晶粒内イ及
びBi2O3境界層近傍ロのエネルギー分散型X線ス
ペクトルをX線エネルギー(KeV)(横軸)とX
線強度の関係で示したスペクトル図である。
更に、第8図は、本発明の1実施例の抵抗体の
焼成温度(℃)(横軸)とバリスタ電圧(V1nA)、
非直線係数(10〓Aα1nA)及び平坦率(V10KA/
V1nA)(各縦軸)との関係を示すグラフである。
実施例 1
主成分として酸化亜鉛7630gに対して、添加物
として酸化ビスマス(Bi2O3)325g、酸化コバ
ルト(Co2O3)166g、酸化マンガン(MnO)57
g、酸化アンチモン(Sb2O3)292g、酸化クロ
ム(Cr2O3)76g、酸化ケイ素(SiO2)90g、硝
酸アルミニウム〔Al(NO3)2・9H2O〕1.5gを正
確に秤量し、更にZnO65重量%、B2O320重量%、
SiO210重量%、Cu2O5重量%よりなる銅ホウケイ
酸亜鉛ガラス86gを秤量してボールミルで12時間
湿式混合した。混合粉は乾燥した後造粒し、20mm
φ×10mmtに成形した。成形体にはSiO2−Sb2O3
−Bi2O3系高抵抗層を塗布した後、これを1200℃
で2時間焼成した。本焼結体は上下両面をラツプ
マスタで約0.5mmずつ研摩・洗浄し、Al溶射電極
を形成した。本発明品と従来品A(硝酸アルミニ
ウム並びに銅ホウケイ酸亜鉛ガラスを共に含ま
ず)並びに従来品B(硝酸アルミニウム0.02重量
%、ホウケイ酸亜鉛ガラス1重量%含有)の諸電
気特性の比較した結果を第1表に示す。V1nAは
1mA通電時のバリスタ電圧、10〓Aα1nAは非直線係
数、V10KA/V1nAは制限電圧比、課電劣化は温度
130℃、課電率95%で4時間通電後のV1nA85%に
対応する漏れ電流を課電前の漏れ電流で除した値
を示す。
[Field of Application of the Invention] The present invention relates to a voltage nonlinear resistor made of a sintered body containing zinc oxide as a main component, which can be used for arresters, surge absorbers, etc., and a method for manufacturing the same. BACKGROUND OF THE INVENTION Zinc oxide-based voltage nonlinear resistors are manufactured using generally well-known ceramic sintering techniques.
The main component is zinc oxide (ZnO) powder, and it also contains bismuth oxide (Bi 2 O 3 ), antimony oxide (Sb 2 O 3 ), cobalt oxide (Co 2 O 3 ), manganese oxide (MnO 2 ), and oxide. Chromium (Cr 2 O 3 ), silicon oxide (SiO 2 ), boron oxide (B 2 O 3 ), aluminum oxide (Al 2 O 3 ), etc. are added and mixed thoroughly, followed by water and a suitable binder such as polyvinyl alcohol. is added, granulated and molded. This molded body has SiO 2 −Sb 2 O 3 − on the side surface of the resistor for the purpose of preventing creepage.
Bi 2 O 3 ternary component is applied and the temperature is increased using an electric furnace.
Fire at 1000-1300℃. Finally, both the upper and lower end surfaces of the fired body are polished and adjusted to a predetermined thickness, and electrodes are formed by thermal spraying or baking to form a voltage nonlinear resistor. Recently, Bi 2 O 3 −B 2 O 3 −Ag 2 O glass or
Non-linear resistors to which a small amount of ZnO-B 2 O 3 -SiO 2 glass is added have significantly improved lifespan when applied with electricity, and are therefore put into practical use along with the above-mentioned voltage non-linear resistors without glass. Zinc oxide-based voltage nonlinear resistors have extremely superior voltage-current characteristics compared to conventionally known SiC and other materials. However, in practical terms, (1) improvement of low current region characteristics, especially reduction of leakage current (2) improvement of nonlinearity in wide current region (3) improvement of square wave withstand capability by square wave and impulse current (4) AC Alternatively, it is desired to improve DC charging life characteristics. FIG. 1 illustrates the internal structure of a conventionally known zinc oxide-based voltage nonlinear resistor. That is, the first
The figure is a schematic diagram of the internal microstructure of a conventional zinc oxide-based voltage nonlinear resistor, where 1 is a ZnO crystal grain;
2 means a spinel phase crystal grain, and 3 means a Bi 2 O 3 grain boundary phase. Each ZnO crystal grain has a diameter of about 10 μm,
It occupies most of the total volume of the sintered body. On the other hand, spinel phase crystal grains have a diameter of 1 to 2 μm, which is smaller than ZnO crystal grains, and are dispersed between ZnO crystal grains, particularly at triple points (where three crystal grains are in contact with each other). The composition is Zn 7 Sb 2 O 12 , and Co, Mn, Cr, Ni, etc. are dissolved in solid solution. Bi 2 O 3 phase is ZnO in contact with it
This is effective for forming a potential barrier near the grain boundaries of crystal grains. Although the Bi 2 O 3 phase tends to condense at the triple points of particles, it has been confirmed that a layer with a high Bi atom concentration exists over a thickness of 20 to 200 Å even at boundaries where no boundary layer is observed. Figure 2 shows ZnO− in the composition shown in Figure 1 above.
This is a schematic diagram of the internal microstructure of a conventional zinc oxide-based resistor to which 1% by weight of B 2 O 3 -SiO 2 -based glass is added. Synonymously, 4 means a glass phase. ZnO grain 1′,
The spinel phase crystal grains 2' and the Bi 2 O 3 phase 3' are arranged in the same way as in Figure 1, but precipitates of the glass phase 4 are scattered inside the Bi 2 O 3 phase 3' or in the boundary layer. I can see that it is. However, none of these conventional devices can be said to fully satisfy the above-mentioned practical needs. [Objective of the Invention] The object of the present invention is to reduce the intragranular resistance of ZnO, improve the flatness rate, and improve the charging life, while at the same time reducing the leakage current that increases due to the reduction in the intragranular resistance of ZnO. An object of the present invention is to provide a voltage nonlinear resistor with improved low current characteristics and a method for manufacturing the same. [Summary of the Invention] To summarize the present invention, the first invention of the present invention relates to a voltage nonlinear resistor, which includes a high resistance layer on the side surface of a sintered body mainly composed of zinc oxide (ZnO). In a voltage nonlinear resistor in which electrodes are formed on both the upper and lower end surfaces of the sintered body, the sintered body has 0.0003 to 0.03% by weight of aluminum diffused into the ZnO-based crystal grains, and It is characterized in that copper is diffused near the surface of the ZnO-based crystal grains. Further, the second invention of the present invention relates to a method for manufacturing a voltage nonlinear resistor, which contains zinc oxide as a main component and bismuth oxide as an additive component in an amount of 0.2 to 2 mol % in terms of Bi 2 O 3 . , silicon oxide 1 to 4 mol% in terms of SiO2, cobalt oxide 0.8 to 3 mol% in terms of Co2O3 , antimony oxide 0.1 to 3 mol% in terms of Sb2O3 , oxidation A composition containing 0.1 to 3 mol% of manganese in terms of MnO2 , 0.1 to 2 mol% of chromium oxide in terms of Cr2O3 , and 0.0005 to 0.05 mol% of aluminum in terms of Al2O3 . copper to
Mix raw material powder containing 0.1 to 2% by weight of copper-zinc borosilicate glass containing 0.001 to 20% by weight in terms of Cu 2 O and 40 to 70% by weight in terms of zinc as ZnO.
Granulation, molding, attaching a high-resistance layer to the side surface and firing resulted in diffusion of 0.0003 to 0.03% by weight of aluminum into the ZnO-based crystal grains, and further diffusion of copper near the surface of the ZnO-based crystal grains. The method is characterized in that a sintered body is obtained and electrodes are formed on both upper and lower end surfaces of the sintered body. FIG. 3 is a schematic diagram of the internal microstructure of the voltage nonlinear resistor of the present invention, where the symbols 1'' to 3'' and 4' have the same meanings as in FIG. 2, and 5 means a copper diffusion layer. ZnO grain 1″, spinel phase grain 2″, Bi 2 O 3
Phase 3'' and glass phase 4' have the same structure as shown in Fig. 2, but Cu diffusion layer 5 is formed on the surfaces of ZnO crystal grain 1'' and spinel phase crystal grain 2''. Formed by the production method of the present invention.In particular, at a temperature of 1150 to 1300°C,
During calcination for hours, ZnO grains are formed and the glass powder is trapped in the bismuth oxide liquid phase while grain growth occurs. At the same time, Cu atoms are diffused to the surfaces of ZnO crystal grains and spinel phase crystal grains, and finally a diffusion layer is formed. The thickness of the diffusion layer is adjusted depending on the amount of copper oxide and firing conditions, but it is preferably 0.01 to 1 μm and about 1/10 to 1/10,000 of the crystal grain radius. The resistivity of this diffusion layer is measured to be between 10 and 100 Ωcm.
It is approximately 10 to 100 times higher than the ZnO crystal grain resistance of 1 to 2 Ω·cm. If this diffusion layer is formed near the Bi 2 O 3 boundary layer, the Schottky barrier is deformed, the barrier voltage increases, the leakage current decreases, and the flatness improves at the same time. FIG. 4 is a graph showing the relationship between current A (horizontal axis) and voltage (V/mm) of the present invention and the conventional voltage nonlinear resistor. In FIG. 4, 7 is the characteristic curve of the resistor of the present invention, and 8 is the conventional resistor containing neither copper borosilicate zinc glass nor Al (conventional product A).
characteristic curve, and 9 is the conventional aluminum nitrate
This is a characteristic curve of a resistor (conventional product B) containing both 0.02% by weight and 1% by weight of zinc borosilicate glass.
Compared to curve 8, in curve 9, the leakage current in the low current range increases due to the addition of Al, but the flatness rate improves. On the other hand, in curve 7 of the present invention, despite the addition of 0.02% by weight of aluminum nitrate, the presence of the Cu diffusion layer increases the barrier and reduces the leakage current in the low current range. The flatness rate also improves. Figure 5 shows the energizing time [(energizing time) 1/2] in the AC energizing life test of the present invention and the conventional resistor.
(horizontal axis) and leakage current increase rate (leakage current/initial current)
(horizontal axis) is a graph showing the relationship between curve 7' and
9' corresponds to curves 7 to 9 in FIG. The power application test was conducted at a power application rate of 85% and a temperature of 130°C. As is clear from FIG. 5, the charging characteristics of curve 7' are significantly improved compared to curve 8', and are even better than curve 9'. During firing, Cu atoms migrate from the glass phase to the ZnO crystal grains. ZnO belongs to an n-type semiconductor oxide, and conduction electrons are responsible for electrical conduction, but they are captured by Cu ions in the Cu diffusion layer and increase resistivity. The results of cutting out a part of the sintered body of the present invention and observing a thin section with an electron microscope show that the Bi 2 O 3 boundary layer tends to condense at the triple points of particles, but the boundary layer is very thin with a thickness of about 20 to 200 Å. Exist over a wide range of areas. A Cu diffusion layer is formed in such a portion, which significantly increases the barrier and improves voltage nonlinearity. The amounts of zinc oxide, boron oxide, and silicon oxide in copper-zinc borosilicate glass are selected in order to synthesize a transparent glass and to minimize the rate of increase in leakage current against constantly applied voltage, while at the same time making ZnO with a large nonlinear coefficient α.
In order to obtain a system voltage non-linear resistor, the above 0.1~
A range of 2% by weight is suitable. In addition, the amount of copper oxide in this glass ranges from 1/100th to 1/100th of the depth from the surface of the ZnO crystal grains.
In order to make a high resistance layer of several μm, the above-mentioned 0.001 to 20
A range of weight percent is suitable. On the other hand, the amount of aluminum oxide or aluminum nitrate is 0.0005 to 0.05 in terms of aluminum oxide.
Mol% is appropriate. At more than 0.05 mol%,
The leakage current increases and the nonlinear coefficient α decreases,
On the other hand, if it is less than 0.0005 mol %, the leakage current decreases, but the nonlinear coefficient α decreases over a wide current range, which is not preferable. The firing temperature is preferably in the range of 1150° to 1300°C.
If the temperature is lower than 1150°C, bubbles will occur, and if it exceeds 1300°C, bismuth oxide and antimony oxide will evaporate, resulting in a porous structure and a decrease in density, which is undesirable. In this temperature range, a healthy sintered body can be obtained, and in particular, a Cu diffusion layer with an appropriate thickness can be obtained. The glass phase has the effect of controlling the diffusion of Zn ions within the crystal grains, especially interstitial Zn ions, into the boundary layer when a voltage is applied, thereby preventing deterioration caused by the voltage application. [Examples of the Invention] Hereinafter, the present invention will be explained in more detail with reference to Examples, but the present invention is not limited to these Examples. In addition, FIG. 6 shows a resistor of one embodiment of the present invention,
Furthermore, Figure 7 shows a schematic diagram of the microstructure observed under a transmission electron microscope of thin sections obtained by cutting and polishing the resistor of conventional product A, and the inside of the ZnO crystal grains and the vicinity of the Bi 2 O 3 boundary layer. The energy dispersive X-ray spectrum of
It is a spectrum diagram shown in relation to line intensity. Furthermore, FIG. 8 shows the firing temperature (°C) (horizontal axis) and varistor voltage (V 1nA ) of the resistor of one embodiment of the present invention.
Nonlinear coefficient ( 10 〓 A α 1nA ) and flatness rate (V 10KA /
V 1nA ) (each vertical axis). Example 1 To 7630 g of zinc oxide as the main component, 325 g of bismuth oxide (Bi 2 O 3 ), 166 g of cobalt oxide (Co 2 O 3 ), and 57 g of manganese oxide (MnO) were added as additives.
Accurately weigh 292 g of antimony oxide (Sb 2 O 3 ), 76 g of chromium oxide (Cr 2 O 3 ), 90 g of silicon oxide (SiO 2 ), and 1.5 g of aluminum nitrate [Al(NO 3 ) 2・9H 2 O]. In addition, 65% by weight of ZnO, 20% by weight of B 2 O 3 ,
86 g of copper-zinc borosilicate glass consisting of 10% by weight of SiO 2 and 5% by weight of Cu 2 O was weighed and wet mixed in a ball mill for 12 hours. After drying, the mixed powder is granulated into 20mm particles.
It was molded to φ×10mmt. SiO 2 −Sb 2 O 3 in the molded body
−After applying the Bi 2 O 3 based high resistance layer, heat it to 1200℃.
It was baked for 2 hours. The upper and lower surfaces of this sintered body were polished and cleaned approximately 0.5 mm each using a Lapmaster to form Al sprayed electrodes. The results of comparing the electrical properties of the product of the present invention, conventional product A (does not contain aluminum nitrate or copper-zinc borosilicate glass), and conventional product B (contains 0.02% by weight of aluminum nitrate and 1% by weight of zinc borosilicate glass). Shown in Table 1. V 1nA is
The varistor voltage when 1mA is applied, 10 〓 A α 1nA is the nonlinear coefficient, V 10KA /V 1nA is the limiting voltage ratio, and the deterioration caused by charging is due to temperature.
It shows the value obtained by dividing the leakage current corresponding to 85% V 1nA after 4 hours of electricity at 130°C and 95% electricity application rate by the leakage current before electricity application.
【表】
第1表よりみて、本発明品の電気特性は従来値
と比べて諸特性共に向上していることがわかる。
また、第6図と第7図の対比から明らかなよう
に、ZnO結晶粒の成分は主成分であるZnのほか、
若干量のSi、Coが認められる。他方、Bi2O3境界
層近傍はBi、Znの主成分のほか、若干量のSi、
Co等を固溶するが、特に本発明の焼結体におい
てはCuが検出される。
実施例 2
実施例1と同じ各種原料粉を混合・造粒・成形
した後高抵抗層を塗布し、温度1000〜1350℃間の
諸種温度で焼成し、電極を塗布した焼結体の電圧
−電流特性を測定した。第8図には焼成温度とバ
リスタ電圧V1nA、非直線係数10〓Aα1nA、平坦率
V10KA/V1nAとの関係をグラフで示す。V1nAは焼
成温度に伴つて漸次減少する。この主因は結晶粒
成長が起つてバリア数が減少するためである。10〓
Aα1nAは焼成温度に伴つて漸次増加するが、1250
℃で最大値を示し、1300℃超では減少する。制限
電圧比V10KA/V1nAは焼成温度の上昇に伴つて増
大する。焼成温度が低過ぎると、10〓Aα1nAが低下
し、同時に焼結体内部、特に境界層付近に気泡が
発生し好ましくない。他方、焼成温度が高過ぎて
も10〓Aα1nAが顕著に減少し、且つV10KA/V1nAが
増大し、同時に成分の蒸発を起して好ましくな
い。
実施例 3
酸化亜鉛を主成分とした混合粉が8Kgとなる様
にSiO21.5モル%、Bi2O30.7モル%、Co2O31モル
%、MnCO30.5モル%、Cr2O30.5モル%、Sb2O31
モル%、Al(NO3)3・9H2Oの0.005モル%に対し
て65重量%ZnO−10重量%SiO2−20重量%B2O3
−5重量%Cu2O系ガラスを0〜3重量%の範囲
にわたつて添加し、実施例1と同様にして直径50
mm、厚さ23mmの電圧非直線抵抗体を製作した。各
銅ホウケイ酸亜鉛ガラス量の焼結体の特性値を第
2表に示す。課電時間は温度100℃においてAC課
電率95%で通電した時に熱暴走を起すまでの時間
を示す。[Table] From Table 1, it can be seen that the electrical properties of the product of the present invention are improved in all characteristics compared to conventional values. Furthermore, as is clear from the comparison between Figures 6 and 7, the components of ZnO crystal grains include Zn, which is the main component, and
Some amounts of Si and Co are recognized. On the other hand, near the Bi 2 O 3 boundary layer, in addition to the main components Bi and Zn, a small amount of Si and
Although Co and the like are dissolved in solid solution, Cu is particularly detected in the sintered body of the present invention. Example 2 The same raw material powders as in Example 1 were mixed, granulated, and molded, then a high resistance layer was applied, and the sintered bodies were fired at various temperatures between 1000 and 1350°C, and electrodes were applied. The current characteristics were measured. Figure 8 shows firing temperature, varistor voltage V 1nA , nonlinear coefficient 10 〓 A α 1nA , and flatness rate.
The relationship between V 10KA /V 1nA is shown graphically. V 1nA gradually decreases with firing temperature. The main reason for this is that crystal grain growth occurs and the barrier number decreases. 10〓
A α 1nA gradually increases with the firing temperature, but 1250
It shows maximum value at ℃ and decreases above 1300℃. The limiting voltage ratio V 10KA /V 1nA increases as the firing temperature increases. If the firing temperature is too low, 10 〓 A α 1nA decreases, and at the same time bubbles are generated inside the sintered body, especially near the boundary layer, which is not preferable. On the other hand, if the firing temperature is too high, 10 〓 A α 1nA will decrease significantly, V 10KA /V 1nA will increase, and at the same time, components will evaporate, which is not preferable. Example 3 SiO 2 1.5 mol%, Bi 2 O 3 0.7 mol%, Co 2 O 3 1 mol%, MnCO 3 0.5 mol%, Cr 2 O 3 so that the mixed powder containing zinc oxide as the main component weighs 8 kg. 0.5 mol%, Sb2O31
Mol% , 65 wt% ZnO - 10 wt% SiO 2 - 20 wt% B 2 O 3 for 0.005 mol% of Al( NO3 ) 3.9H2O
-5 wt% Cu 2 O glass was added in a range of 0 to 3 wt%, and the diameter was 50 mm in the same manner as in Example 1.
A voltage nonlinear resistor with a thickness of 23 mm and a thickness of 23 mm was fabricated. Table 2 shows the characteristic values of the sintered bodies for each amount of copper-zinc borosilicate glass. The power application time indicates the time until thermal runaway occurs when electricity is applied at a temperature of 100°C and an AC power application rate of 95%.
【表】【table】
【表】
上記第2表から明らかなように、銅ホウケイ酸
亜鉛ガラス量が1重量%前後において優れた特性
を示す。V1nAは最大、10〓Aα1nA=50の最大、
V10KA/V1nAは1.76の最小、また課電試験による
熱暴走時間は3000時間以上の最大を示す。
銅ホウケイ酸亜鉛ガラスの添加量は、0.1〜2
重量%が望ましいことがわかる。
実施例 4
銅ホウケイ酸亜鉛ガラスの成分量を第3表に示
す様にA〜Dの4通りに変え、更に本ガラス量を
0.05〜3重量%範囲で種々変え、硝酸アルミニウ
ム量も0.005〜0.05重量%範囲で種々変えた電圧
非直線抵抗体の特性値を実施例3と同様にして測
定した。[Table] As is clear from Table 2 above, excellent properties are exhibited when the amount of copper zinc borosilicate glass is around 1% by weight. V 1nA is maximum, 10 〓 A α 1nA = 50 maximum,
The minimum value of V 10KA /V 1nA is 1.76, and the maximum thermal runaway time determined by the voltage application test is over 3000 hours. The amount of copper borosilicate zinc glass added is 0.1 to 2
It can be seen that weight % is desirable. Example 4 The component amount of the copper-zinc borosilicate glass was changed in four ways from A to D as shown in Table 3, and the amount of the glass was further changed.
The characteristic values of the voltage non-linear resistors were measured in the same manner as in Example 3, with the amount of aluminum nitrate varied in the range of 0.05 to 3% by weight and the amount of aluminum nitrate varied in the range of 0.005 to 0.05% by weight.
【表】
なお、特性値の比較のため銅ホウケイ酸亜鉛ガ
ラスなしの場合並びに銅ホウケイ酸亜鉛ガラス、
硝酸アルミニウム共になしの場合についても示し
た。これらの結果を第4表に示す。[Table] For comparison of characteristic values, the case without copper-zinc borosilicate glass, the case with copper-zinc borosilicate glass,
The case without aluminum nitrate is also shown. These results are shown in Table 4.
【表】【table】
以上詳細に説明したように、本発明によれば、
銅ホウケイ酸亜鉛ガラスを酸化亜鉛系混合粉に少
量添加、混合、焼結することによつて、Bi2O3境
界層近傍にガラスを分散させると同時に銅を拡散
させ、バリアを増大させると共に広い電流領域に
わたつて非直線特性を向上させるという顕著な効
果を奏することができる。
As explained in detail above, according to the present invention,
By adding a small amount of copper-zinc borosilicate glass to the zinc oxide mixed powder, mixing it, and sintering it, the glass is dispersed near the Bi 2 O 3 boundary layer and at the same time the copper is diffused, increasing the barrier and widening the area. It is possible to achieve a remarkable effect of improving nonlinear characteristics over the current range.
第1図及び第2図は従来の酸化亜鉛系非直線抵
抗体の内部微細構造の概要図、第3図は本発明の
電圧非直線抵抗体の内部微細構造の概要図、第4
図は本発明7及び従来8及び9の電圧非直線抵抗
体の電流と電圧との関係を示すグラフ、第5図は
本発明及び従来の同抵抗体のAC課電寿命試験に
おける課電時間と漏れ電流増加率との関係を示す
グラフ、第6図は本発明の1実施例の抵抗体また
第7図は従来の抵抗体の1例の、それぞれ透過電
子顕微鏡観察した微細構造の概要図及びZnO結晶
粒内イとBi2O3境界層近傍ロのエネルギー分散型
X線スペクトル図、第8図は本発明の抵抗体の1
実施例の焼成温度とバリスタ電圧、非直線係数及
び平坦率との関係を示すグラフである。
1:ZnO結晶粒、2:スピネル相結晶粒、3:
Bi2O3粒界相、4:ガラス相、5:銅拡散相。
1 and 2 are schematic diagrams of the internal microstructure of a conventional zinc oxide-based nonlinear resistor, FIG. 3 is a schematic diagram of the internal microstructure of the voltage nonlinear resistor of the present invention, and FIG.
The figure is a graph showing the relationship between current and voltage of the voltage non-linear resistors of the present invention 7 and conventional 8 and 9, and Fig. 5 is a graph showing the energizing time and voltage in the AC energizing life test of the present invention and the conventional resistors. A graph showing the relationship with the leakage current increase rate, FIG. 6 is a schematic diagram of the fine structure of a resistor according to an embodiment of the present invention, and FIG. 7 is an example of a conventional resistor, observed using a transmission electron microscope. Energy-dispersive X-ray spectra of A within the ZnO crystal grains and B near the Bi 2 O 3 boundary layer, Figure 8 is a diagram of resistor 1 of the present invention.
It is a graph showing the relationship between firing temperature, varistor voltage, nonlinear coefficient, and flatness ratio in Examples. 1: ZnO crystal grains, 2: Spinel phase crystal grains, 3:
Bi 2 O 3 grain boundary phase, 4: glass phase, 5: copper diffusion phase.
Claims (1)
面に高抵抗層が形成され、且つ焼結体の上下両端
面に電極が形成された電圧非直線抵抗体におい
て、該焼結体が、ZnO系結晶粒内には0.0003〜
0.03重量%のアルミニウムが拡散し、更に該ZnO
系結晶粒の表面近傍には銅が拡散したものである
ことを特徴とする電圧非直線抵抗体。 2 酸化亜鉛を主成分とし、添加成分として酸化
ビスマスをBi2O3に換算して0.2〜2モル%、酸化
ケイ素をSiO2に換算して1〜4モル%、酸化コ
バルトをCo2O3に換算して0.8〜3モル%、酸化
アンチモンをSb2O3に換算して0.1〜3モル%、酸
化マンガンをMnO2に換算して0.1〜3モル%、酸
化クロムをCr2O3に換算して0.1〜2モル%、アル
ミニウムをAl2O3に換算して0.0005〜0.05モル%
含有する組成物に、銅をCu2Oに換算して0.001〜
20重量%、亜鉛をZnOに換算して40〜70重量%含
む銅ホウケイ酸亜鉛ガラスを、0.1〜2重量%配
合した原料粉を、混合、造粒、成形し、側面に高
抵抗層を取付けて焼成し、ZnO系結晶粒内には
0.0003〜0.03重量%のアルミニウムが拡散し、更
に該ZnO系結晶粒の表面近傍には銅が拡散した焼
結体を得、その焼結体の上下両端面に電極を形成
させることを特徴とする電圧非直線抵抗体の製造
法。 3 該銅ホウケイ酸亜鉛ガラスが、酸化銅を
0.001〜20重量%、酸化ホウ素を10〜30重量%、
酸化ケイ素を5〜20重量%、及び酸化亜鉛を40〜
70重量%含有するものである特許請求の範囲第2
項記載の電圧非直線抵抗体の製造法。 4 該焼成を、1150〜1300℃の温度範囲で行う特
許請求の範囲第2項記載の電圧非直線抵抗体の製
造法。[Claims] 1. A voltage nonlinear resistor in which a high resistance layer is formed on the side surface of a sintered body mainly composed of zinc oxide (ZnO), and electrodes are formed on both upper and lower end surfaces of the sintered body. , the sintered body contains 0.0003~
0.03% by weight of aluminum diffuses and further the ZnO
A voltage nonlinear resistor characterized by copper diffused near the surface of system crystal grains. 2 Zinc oxide is the main component, and as additional components, bismuth oxide is 0.2 to 2 mol% in terms of Bi 2 O 3 , silicon oxide is 1 to 4 mol % in terms of SiO 2 , and cobalt oxide is Co 2 O 3 0.8 to 3 mol% converted to Sb 2 O 3, antimony oxide 0.1 to 3 mol% converted to Sb 2 O 3 , manganese oxide 0.1 to 3 mol % converted to MnO 2 , chromium oxide to Cr 2 O 3 0.1 to 2 mol% in terms of aluminum, 0.0005 to 0.05 mol% in terms of aluminum as Al 2 O 3
The composition containing copper is 0.001 to Cu 2 O.
Raw material powder containing 0.1 to 2% by weight of copper borosilicate zinc glass containing 20% by weight and 40 to 70% by weight of zinc converted to ZnO is mixed, granulated, and formed, and a high-resistance layer is attached to the side surface. The inside of the ZnO crystal grains is
A sintered body in which 0.0003 to 0.03% by weight of aluminum is diffused and further copper is diffused near the surface of the ZnO-based crystal grains is obtained, and electrodes are formed on both upper and lower end surfaces of the sintered body. Manufacturing method of voltage nonlinear resistor. 3. The copper-zinc borosilicate glass contains copper oxide.
0.001-20% by weight, boron oxide 10-30% by weight,
5 to 20% by weight of silicon oxide and 40 to 40% of zinc oxide
Claim 2 which contains 70% by weight
2. Method for manufacturing a voltage nonlinear resistor described in Section 1. 4. The method for manufacturing a voltage nonlinear resistor according to claim 2, wherein the firing is performed in a temperature range of 1150 to 1300°C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59075848A JPS60219704A (en) | 1984-04-17 | 1984-04-17 | Voltage nonlinear resistor and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59075848A JPS60219704A (en) | 1984-04-17 | 1984-04-17 | Voltage nonlinear resistor and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60219704A JPS60219704A (en) | 1985-11-02 |
| JPH0439761B2 true JPH0439761B2 (en) | 1992-06-30 |
Family
ID=13588040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59075848A Granted JPS60219704A (en) | 1984-04-17 | 1984-04-17 | Voltage nonlinear resistor and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60219704A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3397125B2 (en) * | 1998-03-12 | 2003-04-14 | 株式会社村田製作所 | Electronic components |
| DE102004044648A1 (en) | 2004-09-15 | 2006-03-30 | Epcos Ag | varistor |
-
1984
- 1984-04-17 JP JP59075848A patent/JPS60219704A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60219704A (en) | 1985-11-02 |
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