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JPH04348900A - Patch plate for drilling resin plate laminated with metal foil and method of drilling hole in resin plate laminated with metal foil - Google Patents

Patch plate for drilling resin plate laminated with metal foil and method of drilling hole in resin plate laminated with metal foil

Info

Publication number
JPH04348900A
JPH04348900A JP17359991A JP17359991A JPH04348900A JP H04348900 A JPH04348900 A JP H04348900A JP 17359991 A JP17359991 A JP 17359991A JP 17359991 A JP17359991 A JP 17359991A JP H04348900 A JPH04348900 A JP H04348900A
Authority
JP
Japan
Prior art keywords
metal foil
resin
resin plate
plate
drill
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17359991A
Other languages
Japanese (ja)
Inventor
Tomoo Hiranishi
智雄 平西
Yoshihiko Sagara
相良 嘉彦
Etsuji Kubo
久保 悦司
Kazumasa Makihata
巻幡 和正
Shinji Yamamoto
真司 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP17359991A priority Critical patent/JPH04348900A/en
Publication of JPH04348900A publication Critical patent/JPH04348900A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching

Landscapes

  • Drilling And Boring (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

PURPOSE:To reduce buckling of a metal foil laminated over a resin plate when a hole is drilled in the resin plate. CONSTITUTION:A thermoplastic resin plate 2 containing an inorganic filler is used as a patch plate for drilling hole in a stack of metal foil covered resin plates (copper foil covered epoxy resin laminated plates). Further, the drilling is made so as to the tip end of a drill 4 enters into the thermoplastic resin plate 1. The thermoplastic resin plate is polypropylene (resin/filler (weight part) = 100/20 to 400), high density polyethylene (100/10 to 400), ABS resin (100/10 to 250), polyethylene terephthalate (100/10 to 250) or the like.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は、金属箔張り樹脂板、例
えば、金属箔張り熱硬化性樹脂積層板にドリル孔あけを
するときに用いる当て板、ならびに金属箔張り樹脂板に
ドリル孔あけをする方法に関する。
[Industrial Application Field] The present invention relates to a patch plate used for drilling holes in a metal foil-covered resin plate, such as a metal foil-covered thermosetting resin laminate, and a backing plate used for drilling holes in a metal foil-covered resin plate. Concerning how to do.

【0002】0002

【従来の技術】熱硬化性樹脂積層板からなる絶縁層を介
してその両面に形成したプリント回路を、絶縁層のスル
ホールで導通させたプリント回路板を製造する場合、そ
の材料である両面金属箔張り積層板に予めドリル加工に
より貫通孔を形成する工程がある。このドリル孔あけで
は、金属箔張り積層板を何枚か重ね、ドリルの進入側と
は反対側の外側面(通常下面)に1.5mm厚程度のフ
ェノール樹脂積層板を当て板として用いている。また、
ドリルの進入側の外側面(通常上面)には、0.5mm
厚程度のアルミニウム板を当てるのが一般的であり、ア
ルミニウム板の上から、その周辺を押えて孔あけを行な
っている。そして、全ての金属箔張り積層板に良好に孔
があけられるよう、ドリルの先端を当て板であるフェノ
ール樹脂積層板まで進入させ、下死点で進入を一旦止め
た後に、ドリルを後退させている。
[Prior Art] When manufacturing a printed circuit board in which printed circuits formed on both sides of an insulating layer made of a thermosetting resin laminate are electrically connected through holes in the insulating layer, double-sided metal foil is used as the material. There is a step of previously forming through holes in the stretched laminate by drilling. In this drilling process, several metal foil-covered laminates are stacked one on top of the other, and a phenolic resin laminate with a thickness of about 1.5 mm is used as a backing plate on the outside surface (usually the bottom surface) on the opposite side from the drill entry side. . Also,
0.5 mm on the outside surface (usually the top surface) on the entry side of the drill.
Generally, a thick aluminum plate is applied, and the hole is drilled by pressing down on the aluminum plate and its periphery. Then, in order to make good holes in all the metal foil-covered laminates, the tip of the drill was advanced to the phenolic resin laminate that served as the backing plate, and after stopping the advance once at the bottom dead center, the drill was moved back. There is.

【0003】ここで、フェノール樹脂積層板を当て板に
用いているのは、次のように考えてのことである。すな
わち、ドリル孔あけ加工をすると、孔周辺で金属箔にか
えりが出るので、このかえりを抑制するために、当て板
には、金属箔張り積層板をしっかりと支持し、かえりが
出ないようにする硬さと平面度が必要であること。しか
し、ドリルの先端が、当て板に進入するので、ドリルを
著しく摩耗させるほど硬くてはいけないことを考慮した
結果である。
[0003] Here, the reason why a phenol resin laminate is used as a backing plate is based on the following considerations. In other words, when drilling a hole, burrs appear on the metal foil around the hole, so in order to suppress this burr, the metal foil-covered laminate is firmly supported on the backing plate to prevent burrs from appearing. hardness and flatness are required. However, since the tip of the drill enters the caul plate, it is a result of consideration that the drill must not be so hard as to cause significant wear.

【0004】また、押さえ板に用いているアルミニウム
板は、フェノール樹脂積層板と同じように、孔周辺の金
属箔のかえりを抑えると共に、ドリルに発生する摩擦熱
を熱伝導により逃がしてドリルの温度を下げる働きもし
ている。
[0004] Also, like the phenolic resin laminate, the aluminum plate used for the holding plate suppresses the burrs of the metal foil around the hole, and also reduces the temperature of the drill by dissipating the frictional heat generated in the drill through thermal conduction. It also works to lower the

【0005】[0005]

【発明が解決しようとする課題】上記従来の技術では、
ドリル進入側からみて、特に1枚目の金属箔張り積層板
の上面の仕上がりが、ドリルのヒット回数を重ねるに従
って目立って悪くなる。あけた孔周辺の金属箔のかえり
が大きくなり、これがスルホールメッキをしたときの導
通信頼性を低くする原因になっているのである。本発明
が解決しようとする課題は、金属箔張り積層板をはじめ
とする金属箔張り樹脂板のドリル孔あけに際して、金属
箔のかえりを小さくすることであり、そのための当て板
を提供し、またドリル孔あけ法を提供することである。
[Problem to be solved by the invention] In the above conventional technology,
Viewed from the drill entry side, the finish on the top surface of the first metal foil-covered laminate becomes noticeably worse as the number of drill hits increases. The burrs of the metal foil around the drilled holes become large, and this causes a decrease in the continuity reliability when through-hole plating is performed. The problem to be solved by the present invention is to reduce the burr of metal foil when drilling holes in metal foil-clad resin plates such as metal foil-clad laminates, and to provide a backing plate for this purpose. An object of the present invention is to provide a drilling method.

【0006】[0006]

【課題を解決するための手段】本発明に係る当て板は、
金属箔張り樹脂板のドリル孔あけに際して、これに当接
するものであって、無機充填材を含有する熱可塑性樹脂
板からなるものである。また、本発明に係るドリル孔あ
け法は、ドリルの進入側とは反対側の外側面に熱可塑性
樹脂板を設置して金属箔張り樹脂板に当接し、金属箔張
り樹脂板に孔をあけたドリルの先端を熱可塑性樹脂板ま
で進入させた後に、ドリルを後退させるものである。ド
リルの進入側の外側面に熱可塑性樹脂板を設置して金属
箔張り樹脂板に当接し、熱可塑性樹脂板を貫通して金属
箔張り樹脂板に孔をあけるようにしてもよい。
[Means for Solving the Problems] The caul plate according to the present invention includes:
It is made of a thermoplastic resin plate containing an inorganic filler and comes into contact with the metal foil-covered resin plate when drilling holes therein. Further, in the drilling method according to the present invention, a thermoplastic resin plate is installed on the outer surface of the drill on the side opposite to the entrance side, and the thermoplastic resin plate is brought into contact with the metal foil-covered resin plate, and a hole is drilled in the metal foil-covered resin plate. After the tip of the drill reaches the thermoplastic resin plate, the drill is moved back. A thermoplastic resin plate may be installed on the outer surface of the entry side of the drill so as to come into contact with the metal foil-covered resin plate, and a hole may be made in the metal foil-covered resin plate by penetrating the thermoplastic resin plate.

【0007】[0007]

【作用】従来、金属箔張り樹脂板を押えながらドリル孔
あけを行なっているといっても、それは周辺部分を押え
ているのであって、孔あけを行なう部分が十分に押えら
れているとは限らない。金属箔張り樹脂板とアルミニウ
ム板との間には、小さな隙間が残っている。ドリル孔あ
けで発生した切り屑は、ドリルの螺旋溝に沿って排出さ
れさるが、このとき切り屑が前記隙間に侵入しさらに隙
間を広げることから金属箔のかえりが大きくなるものと
推測される。
[Function] Conventionally, drilling is performed while holding down a metal foil-covered resin plate, but this only holds down the surrounding area, and does not mean that the area to be drilled is sufficiently held down. Not exclusively. A small gap remains between the metal foil-covered resin plate and the aluminum plate. The chips generated during drilling are discharged along the spiral groove of the drill, and it is assumed that at this time, the chips enter the gap and further widen the gap, making the burr of the metal foil larger. .

【0008】しかしながら、上記の本発明に係る場合は
、従来のフェノール樹脂板を当て板に用いない分、切り
屑の発生量が少なくなる。そして、当て板である熱可塑
性樹脂板にドリルの先端が侵入したとき、あるいはドリ
ルが熱可塑性樹脂板を貫通したときに、摩擦熱で周辺の
熱可塑性樹脂が溶融し、これがドリルの螺旋溝に付着す
る。この付着した溶融樹脂は、孔あけのときに発生した
切り屑を捕捉して溶融樹脂中に巻き込み、溶融状態から
固形の大粒になり(ちょうど、消しゴムを使用したとき
にできる消しゴム屑のような形状となる)、ドリルの螺
旋溝から排出される。このように大粒になった切り屑は
、前記隙間に入りにくくなるので隙間が広がらず、金属
箔のかえりを抑制することができるのである。
However, in the case of the present invention described above, the amount of chips generated is reduced because the conventional phenolic resin plate is not used as the backing plate. When the tip of the drill enters the thermoplastic resin plate that serves as the backing plate, or when the drill penetrates the thermoplastic resin plate, the surrounding thermoplastic resin melts due to frictional heat, and this melts into the spiral groove of the drill. adhere to. This adhered molten resin captures the chips generated during drilling and rolls them into the molten resin, turning the molten state into large solid particles (similar to the shape of eraser scraps formed when using an eraser). ) is discharged from the spiral groove of the drill. Since these large chips are difficult to enter into the gap, the gap does not widen, and burrs of the metal foil can be suppressed.

【0009】また、従来のフェノール樹脂積層板を当て
板に使用した場合には、それが硬いために、ドリル先端
が下死点まで到達して進入を停止してから後退するまで
の間、同じところで回転しているときに発熱が最も著し
くなり、ドリルの摩耗を促進している。ドリルの摩耗は
、金属箔のかえりを大きくする原因の一つであるが、本
発明に係る場合は、ドリルの先端が熱可塑性樹脂板に侵
入しても発熱は小さく、これによってドリルの摩耗が促
進されることはない。さらに、硬い切り屑がドリルに付
着したままで孔あけを続けると、ドリルの摩耗を促進す
ることになるが、本発明に係る場合は、切り屑が、溶融
した熱可塑性樹脂に捕捉されて良好に取り除かれ、この
点でも、ドリルの摩耗を抑制することができる。
In addition, when a conventional phenolic resin laminate is used as a backing plate, because it is hard, the drill tip reaches the bottom dead center and stops advancing until it retreats. By the way, the heat generation is most significant when the drill is rotating, which accelerates the wear of the drill. Wear of the drill is one of the causes of large burrs of the metal foil, but in the case of the present invention, even if the tip of the drill penetrates the thermoplastic resin plate, the heat generated is small, thereby reducing the wear of the drill. It will not be promoted. Furthermore, if drilling is continued with hard chips attached to the drill, the wear of the drill will be accelerated, but in the case of the present invention, the chips are captured by the molten thermoplastic resin and are not damaged. In this respect, the wear of the drill can also be suppressed.

【0010】上記当て板として用いる熱可塑性樹脂板は
、無機充填材を適当量含有させておくことが重要である
。無機充填材を含有量しないと、ドリルに付着した溶融
樹脂が切り屑を捕捉して溶融樹脂中に巻き込んだ後にも
溶融状態から固形状態に変化せず、ドリルの螺旋溝に付
着したままで排出されにくくなったり、孔壁面にこすり
つけられたりする。無機充填材は、樹脂の溶融粘度を上
げると共に溶融する樹脂の絶対量を減らす作用をしてい
る。また、無機充填材を含有することで、熱可塑性樹脂
板の表面が硬くなり、孔あけをする金属箔張り樹脂板を
しっかり押さえることができるし、熱可塑性樹脂板の熱
伝導率を高めるのでドリルの熱を吸収し、ドリルの温度
上昇を防止する作用がある。
It is important that the thermoplastic resin plate used as the patch plate contains an appropriate amount of inorganic filler. If the inorganic filler is not included, the molten resin attached to the drill will capture the chips and even after they are rolled up into the molten resin, they will not change from a molten state to a solid state and will remain attached to the spiral groove of the drill and be discharged. It may become difficult to clean or rub against the hole wall. The inorganic filler has the function of increasing the melt viscosity of the resin and reducing the absolute amount of the resin to be melted. In addition, by containing an inorganic filler, the surface of the thermoplastic resin plate becomes hard, allowing it to firmly hold down the metal foil-covered resin plate that is being drilled, and increases the thermal conductivity of the thermoplastic resin plate, making it easier to drill. It has the effect of absorbing heat and preventing the temperature of the drill from rising.

【0011】尚、無機充填材の含有量があまりにも多く
なりすぎると溶融樹脂量が減り、ドリル孔あけで発生し
た切り屑を捕捉しにくくなって切り屑が金属箔張り樹脂
板とアルミニウム板との隙間に侵入し易くなり、次第に
金属箔のかえりが大きくなってくる。また、ドリルの先
端が熱可塑性樹脂板に侵入した時の発熱が大きくなりド
リルの摩耗を促進するので望ましくない。用いる熱可塑
性樹脂の種類により適宜調整する。
[0011] If the content of the inorganic filler is too high, the amount of molten resin will decrease and it will become difficult to capture the chips generated during drilling, causing the chips to separate between the metal foil-covered resin plate and the aluminum plate. It becomes easier to get into the gaps between metal foils, and the burrs of the metal foil gradually become larger. Further, when the tip of the drill penetrates into the thermoplastic resin plate, heat generation increases, which is undesirable because wear of the drill is accelerated. Adjust as appropriate depending on the type of thermoplastic resin used.

【0012】0012

【実施例】次に、本発明に係る実施例を説明する。使用
する熱可塑性樹脂としては、孔あけ時のドリル刃の温度
(推定400℃)において熱分解をしたり、溶融粘度が
低く過ぎて水飴状にべとべと刃に付着するようなものを
除けば、特に限定するものではない。ポリプロピレン、
高密度ポリエチレン、ABS樹脂、ポリエステルのほか
、低密度ポリエチレン、ポリスチレン、ポリブテン、メ
チルメタクリレート、ポリカーボネート、熱可塑性エラ
ストマ等の熱可塑性樹脂で特に支障はない。しかし、ド
リル径が小さくなったときは、摩擦熱が多く発生し、ド
リル刃が特に高温になりやすいので、樹脂の溶融粘度は
高い方が望ましい。一方、熱可塑性樹脂板を成形すると
きには、溶融粘度が低い方が成形性や無機充填材の分散
性がよいので、これらのことを勘案して適宜選定するこ
とになる。
[Example] Next, an example according to the present invention will be described. The thermoplastic resins to be used should not be used, except for those that thermally decompose at the temperature of the drill bit during drilling (estimated at 400°C) or those whose melt viscosity is too low and stick to the drill bit like syrup. It is not limited. polypropylene,
In addition to high-density polyethylene, ABS resin, and polyester, there are no particular problems with thermoplastic resins such as low-density polyethylene, polystyrene, polybutene, methyl methacrylate, polycarbonate, and thermoplastic elastomer. However, when the diameter of the drill becomes small, a large amount of frictional heat is generated and the drill blade tends to become particularly hot, so it is desirable that the melt viscosity of the resin be high. On the other hand, when molding a thermoplastic resin plate, the lower the melt viscosity, the better the moldability and the dispersibility of the inorganic filler, so these should be taken into consideration when making an appropriate selection.

【0013】使用する無機充填材としては、炭酸カルシ
ウム、炭酸マグネシウム、タルク、マイカ、シリカ、ア
ルミナ、水酸化アルミニウム、水酸化マグネシウム、硫
酸バリウム、ワラストナイト、ラジオライト等一般の充
填材でよい。ドリルの摩耗を抑える点からはタルク、硫
酸バリウム、水酸化アルミニウム等モース硬度の低い無
機充填材がより好ましい。また、水酸化アルミニウムや
水酸化マグネシウム等結晶水を有する充填材においては
ドリルによる発熱で結晶水が遊離し、吸熱反応を起こす
ことによりドリルの温度上昇を防止する効果がある。無
機充填材の平均粒径は好ましくは1〜10μで、平均粒
径50μ以上ではドリル刃のかけ(ピッチング)を起こ
し易くなる。
The inorganic filler used may be general fillers such as calcium carbonate, magnesium carbonate, talc, mica, silica, alumina, aluminum hydroxide, magnesium hydroxide, barium sulfate, wollastonite, and radiolite. From the viewpoint of suppressing drill wear, inorganic fillers with low Mohs hardness, such as talc, barium sulfate, and aluminum hydroxide, are more preferable. In addition, in fillers containing water of crystallization, such as aluminum hydroxide and magnesium hydroxide, the water of crystallization is liberated by the heat generated by the drill, causing an endothermic reaction, which has the effect of preventing the temperature of the drill from rising. The average particle size of the inorganic filler is preferably 1 to 10 microns, and if the average particle size is 50 microns or more, the drill bit tends to chip (pitting).

【0014】実施例1 表1に示す配合のポリプロピレン組成物を押出し成形し
、1.5mm厚の熱可塑性樹脂板1とした。
Example 1 A polypropylene composition having the composition shown in Table 1 was extruded to form a thermoplastic resin plate 1 having a thickness of 1.5 mm.

【0015】[0015]

【表1】[Table 1]

【0016】上記の熱可塑性樹脂板1を当て板に用いて
、図1に示すような構成で金属箔張り樹脂板2に、0.
9mm径、1.2mm径のドリル孔あけをそれぞれ行な
った。孔あけを行なう金属箔張り樹脂板2は、基材とし
てガラス織布とガラス不織布を組合せたコンポジット両
面銅張りエポキシ樹脂積層板(新神戸電機製グリーンエ
ポE668、1.6mm厚)であり、これを4枚重ねて
、下面には上記熱可塑性樹脂板1を、上面には0.5m
m厚のアルミニウム板3を設置した。そして、孔あけ作
業は、金属箔張り樹脂板2に孔をあけたドリル4の先端
が熱可塑性樹脂板1の厚さ方向中ほどまで進入した後、
ドリル4を後退させることとした。
Using the above-mentioned thermoplastic resin plate 1 as a backing plate, a metal foil-covered resin plate 2 with a structure as shown in FIG.
Drill holes with a diameter of 9 mm and a diameter of 1.2 mm were respectively made. The metal foil-clad resin board 2 on which holes are to be drilled is a composite double-sided copper-clad epoxy resin laminate (Shin-Kobe Denki Green Epo E668, 1.6 mm thick) that combines glass woven fabric and glass non-woven fabric as a base material. Stack 4 sheets, with the above thermoplastic resin plate 1 on the bottom surface and 0.5 m on the top surface.
An aluminum plate 3 having a thickness of m was installed. The drilling operation is carried out after the tip of the drill 4 that drilled the hole in the metal foil-covered resin plate 2 has entered the middle of the thermoplastic resin plate 1 in the thickness direction.
It was decided to move Drill 4 back.

【0017】孔径が、0.9mmと1.2mmの場合に
ついて、孔あけのヒット回数増加に伴う銅箔のかえり量
の変化を図2から図3に示した。銅箔のかえり量は、上
から1枚目の金属箔張り樹脂板2の上面、上から4枚目
の金属箔張り樹脂板2の下面について測定した。また、
図中、従来例は、熱可塑性樹脂板2に代えて、1.6m
m厚のフェノール樹脂積層板を当て板に用いた場合であ
る。 各図から、実施例の当て板を用いたものでは、4枚目の
下面で従来例より多少銅箔のかえりが大きくなることが
あるものの、1枚目の上面を含めた銅箔かえり量の最大
値は、従来例より小さく抑えられることが分かる。
FIGS. 2 and 3 show changes in the amount of burr of the copper foil as the number of drilling hits increases when the hole diameter is 0.9 mm and 1.2 mm. The amount of burr of the copper foil was measured on the top surface of the first metal foil-covered resin board 2 from the top and the bottom surface of the fourth metal foil-covered resin board 2 from the top. Also,
In the figure, in the conventional example, instead of the thermoplastic resin plate 2, a 1.6 m
This is a case where a phenolic resin laminate with a thickness of m is used as a backing plate. From each figure, it can be seen that in the case of using the patch plate of the example, although the copper foil burr may be slightly larger on the lower surface of the fourth sheet than the conventional example, the amount of copper foil burr including the top surface of the first sheet is small. It can be seen that the maximum value can be kept smaller than in the conventional example.

【0018】実施例2 次に、表2に示した各種熱可塑性樹脂(No.1〜4)
について、含有させる無機充填材(タルク)の量を変え
て、押出し成形により1.5mm厚の熱可塑性樹脂板を
成形した。孔径が、0.7mmの場合について、実施例
1と同様に孔あけを行なった。熱可塑性樹脂板に含有さ
せる無機充填材の量(樹脂100重量部に対する重量部
)と、上から1枚目のコンポジット両面銅張りエポキシ
樹脂積層板の上面および上から4枚目のコンポジット両
面銅張りエポキシ樹脂積層板の下面の銅箔のかえり量(
8000ヒット後)との関係を図4および表3に示した
。 また、表3中に示したドリル刃摩耗度は、ドリルの切れ
刃部面積を孔あけ前後で測定し、次式で計算して求めた
Example 2 Next, various thermoplastic resins (No. 1 to 4) shown in Table 2 were used.
Thermoplastic resin plates with a thickness of 1.5 mm were formed by extrusion molding with varying amounts of the inorganic filler (talc) contained. Drilling was performed in the same manner as in Example 1 for a case where the hole diameter was 0.7 mm. The amount of inorganic filler contained in the thermoplastic resin board (parts by weight relative to 100 parts by weight of resin), the top surface of the first composite double-sided copper-clad epoxy resin laminate from the top, and the fourth composite double-sided copper-clad laminate from the top. Amount of burr of copper foil on the bottom surface of the epoxy resin laminate (
(after 8000 hits) are shown in FIG. 4 and Table 3. Further, the degree of wear of the drill blade shown in Table 3 was determined by measuring the area of the cutting edge of the drill before and after drilling, and calculating it using the following formula.

【0019】[0019]

【数1】[Math 1]

【0020】[0020]

【表2】[Table 2]

【0021】[0021]

【表3】[Table 3]

【0022】図4から、本発明に係る実施例によれば、
いずれの場合も、銅箔のかえり量の最大値を従来より小
さく抑えられることが分かる。また、図4および表3か
ら、銅箔のかえりをより小さくするための、樹脂100
重量部に対する好ましい無機充填材の配合量は、ポリプ
ロピレンでは、20〜400重量部、高密度ポリエチレ
ンでは、10〜400重量部、ABS樹脂では、10〜
250重量部、ポリエチレンテレフタレートでは、10
〜250重量部であり、特に、ポリエチレンテレフタレ
ートでは、全体として銅箔のかえりが小さいことも分か
る。
From FIG. 4, according to the embodiment of the present invention,
It can be seen that in both cases, the maximum value of the amount of burr of the copper foil can be suppressed to be smaller than that of the conventional method. Also, from FIG. 4 and Table 3, resin 100
The preferred amount of the inorganic filler to parts by weight is 20 to 400 parts by weight for polypropylene, 10 to 400 parts by weight for high density polyethylene, and 10 to 400 parts by weight for ABS resin.
250 parts by weight, for polyethylene terephthalate, 10
-250 parts by weight, and it can be seen that the burrs of the copper foil are small as a whole, especially in polyethylene terephthalate.

【0023】実施例3 表2に示した各種熱可塑性樹脂100重量部に、表4に
示す割合でタルクを配合し、押出し成形により0.8m
m厚の熱可塑性樹脂板を成形した。この熱可塑性樹脂板
を実施例1におけるアルミニウム板に代えて使用し、コ
ンポジット両面銅張りエポキシ樹脂積層板の重ね枚数を
3枚として、0.4mm径のドリル孔あけを行なった。 孔あけ時の孔位置ずれの程度を、アルミニウム板を使用
した場合と比較して、表4に併せて示す。尚、銅箔のか
えり量は、実施例1の場合と同様に小さいものであった
Example 3 Talc was blended with 100 parts by weight of various thermoplastic resins shown in Table 2 in the proportions shown in Table 4, and 0.8 m thick was formed by extrusion molding.
A thermoplastic resin plate with a thickness of m was molded. This thermoplastic resin plate was used in place of the aluminum plate in Example 1, and the number of stacked composite double-sided copper-clad epoxy resin laminates was set to 3. Drill holes with a diameter of 0.4 mm were drilled. The degree of hole position shift during drilling is also shown in Table 4 in comparison with the case where an aluminum plate is used. Note that the amount of burr of the copper foil was small as in Example 1.

【0024】[0024]

【表4】[Table 4]

【0025】尚、本発明に係る孔あけ方法は、金属箔張
り樹脂板1枚にドリル孔あけする場合にも有効である。 また、孔あけをする対象は、金属箔張り樹脂板であれば
、上記の金属箔張り積層板に限るものではない。
The drilling method according to the present invention is also effective when drilling holes in a single metal foil-covered resin plate. Further, the object to be drilled is not limited to the metal foil-clad laminate described above, as long as it is a metal foil-clad resin plate.

【0026】[0026]

【発明の効果】従来、金属箔のかえりを小さくするため
には、金属箔張り樹脂板をしっかりと支持できる硬い当
て板を用いる必要があるとの観点から、フェノール樹脂
積層板を当て板としていたのであるが、意外にも、これ
より軟らかい熱可塑性樹脂板を当て板とすることにより
、金属箔のかえりを全体として小さく抑えることが可能
となった。そして、熱可塑性樹脂板に含有させる無機充
填材の量を極端に多くしない限りはドリル刃の摩耗度が
減り、ドリル寿命が長くなる効果をもたらした。
[Effect of the invention] Conventionally, in order to reduce the burrs of metal foil, it was necessary to use a hard backing plate that could firmly support the metal foil-covered resin board, so phenolic resin laminates were used as backing boards. However, surprisingly, by using a softer thermoplastic resin plate as the backing plate, it became possible to suppress the burrs of the metal foil as a whole. As long as the amount of inorganic filler contained in the thermoplastic resin plate was not excessively increased, the degree of wear on the drill blade was reduced and the life of the drill was extended.

【0027】また、本発明に係る方法では、ドリル刃の
摩擦熱による温度上昇が小さいことから、放熱のための
アルミニウム板に代えて熱可塑性樹脂板を押さえ板に使
用でき、孔あけの位置ずれも小さくなる。
In addition, in the method according to the present invention, since the temperature rise due to frictional heat of the drill blade is small, a thermoplastic resin plate can be used as a holding plate instead of an aluminum plate for heat dissipation, and positional deviation during drilling can be avoided. will also become smaller.

【0028】さらに、当て板は、ドリルの先端の進入で
凹部や貫通孔ができるので、それ以上は使用することが
できないものであるが、本発明に係るものは、熱可塑性
樹脂よりなるので溶融して再成形、再使用が可能であり
、資源の有効利用を図ることができる。
[0028]Furthermore, the caul plate cannot be used any more because it creates a recess or a through hole when the tip of the drill enters, but the one according to the present invention is made of thermoplastic resin and cannot be melted. It can be remolded and reused, allowing for effective use of resources.

【図面の簡単な説明】[Brief explanation of drawings]

【図1】本発明に係る孔あけ法の実施例を説明する図。FIG. 1 is a diagram illustrating an embodiment of the drilling method according to the present invention.

【図2】ドリル孔あけのヒット回数増加に伴う銅箔のか
えり量の変化を示す曲線図(孔径0.9mm)。
FIG. 2 is a curve diagram showing changes in the amount of burr of copper foil as the number of hits increases during drilling (hole diameter 0.9 mm).

【図3】ドリル孔あけのヒット回数増加に伴う銅箔のか
えり量の変化を示す曲線図(孔径1.2mm)。
FIG. 3 is a curve diagram showing changes in the amount of burr of copper foil as the number of hits increases during drilling (hole diameter 1.2 mm).

【図4】熱可塑性樹脂板に含有させる無機充填材の量と
、金属箔張り樹脂板の銅箔のかえり量との関係を示す曲
線図。
FIG. 4 is a curve diagram showing the relationship between the amount of inorganic filler contained in a thermoplastic resin plate and the amount of burr of copper foil of a metal foil-clad resin plate.

【符号の説明】[Explanation of symbols]

1は熱可塑性樹脂板 2は金属箔張り樹脂板 4はドリル 1 is a thermoplastic resin plate 2 is a metal foil-covered resin board 4 is a drill

Claims (7)

【特許請求の範囲】[Claims] 【請求項1】金属箔張り樹脂板のドリル孔あけに際して
、これに当接するものであって、無機充填材を含有する
熱可塑性樹脂板よりなることを特徴とする金属箔張り樹
脂板のドリル孔あけ用当て板。
[Claim 1] A drill hole in a metal foil-clad resin plate, which is made of a thermoplastic resin plate containing an inorganic filler and is in contact with the metal foil-clad resin plate when drilling holes therein. Opening plate.
【請求項2】熱可塑性樹脂がポリプロピレンであり、無
機充填材の含有量が、ポリプロピレン100重量部に対
して、20〜400重量部である請求項1に記載の金属
箔張り樹脂板のドリル孔あけ用当て板。
2. The drill hole in the metal foil-clad resin plate according to claim 1, wherein the thermoplastic resin is polypropylene, and the content of the inorganic filler is 20 to 400 parts by weight based on 100 parts by weight of the polypropylene. Opening plate.
【請求項3】熱可塑性樹脂が高密度ポリエチレンであり
、無機充填材の含有量が、高密度ポリエチレン100重
量部に対して、10〜400重量部である請求項1に記
載の金属箔張り樹脂板のドリル孔あけ用当て板。
3. The metal foiling resin according to claim 1, wherein the thermoplastic resin is high-density polyethylene, and the content of the inorganic filler is 10 to 400 parts by weight based on 100 parts by weight of the high-density polyethylene. A backing plate for drilling holes in a board.
【請求項4】熱可塑性樹脂がABS樹脂であり、無機充
填材の含有量が、ABS樹脂100重量部に対して、1
0〜250重量部である請求項1に記載の金属箔張り樹
脂板のドリル孔あけ用当て板。
4. The thermoplastic resin is ABS resin, and the content of the inorganic filler is 1 part by weight per 100 parts by weight of the ABS resin.
The caul plate for drilling a metal foil-clad resin plate according to claim 1, wherein the amount is 0 to 250 parts by weight.
【請求項5】熱可塑性樹脂がポリエチレンテレフタレー
トであり、無機充填材の含有量が、ポリエチレンテレフ
タレート100重量部に対して、10〜250重量部で
ある請求項1に記載の金属箔張り樹脂板のドリル孔あけ
用当て板。
5. The metal foil-clad resin plate according to claim 1, wherein the thermoplastic resin is polyethylene terephthalate, and the content of the inorganic filler is 10 to 250 parts by weight based on 100 parts by weight of polyethylene terephthalate. Backing plate for drilling holes.
【請求項6】金属箔張り樹脂板にドリル孔あけをするに
際して、ドリルの進入側とは反対側の外側面に無機充填
材を含有する熱可塑性樹脂板を設置して金属箔張り樹脂
板に当接し、金属箔張り樹脂板に孔をあけたドリルの先
端が熱可塑性樹脂板に進入した後に、ドリルを後退させ
ることを特徴とする金属箔張り樹脂板のドリル孔あけ法
[Claim 6] When drilling holes in a metal foil-covered resin plate, a thermoplastic resin plate containing an inorganic filler is installed on the outer surface of the metal foil-covered resin plate on the opposite side to the entrance side of the drill. A method for drilling a hole in a metal foil-covered resin board, which comprises: abutting the metal foil-covered resin board, and then retracting the drill after the tip of the drill that drills a hole in the metal foil-covered resin board enters the thermoplastic resin board.
【請求項7】金属箔張り樹脂板にドリル孔あけをするに
際して、ドリルの進入側の外側面に無機充填材を含有す
る熱可塑性樹脂板を設置して金属箔張り樹脂板に当接し
、熱可塑性樹脂板を貫通して金属箔張り樹脂板に孔をあ
けることを特徴とする金属箔張り樹脂板のドリル孔あけ
法。
[Claim 7] When drilling a hole in a metal foil-covered resin plate, a thermoplastic resin plate containing an inorganic filler is placed on the outer surface of the entry side of the drill, and the thermoplastic resin plate is brought into contact with the metal foil-covered resin plate. A method for drilling holes in a metal foil-covered resin board, which is characterized by drilling holes in the metal foil-covered resin board through the plastic resin board.
JP17359991A 1990-07-20 1991-07-15 Patch plate for drilling resin plate laminated with metal foil and method of drilling hole in resin plate laminated with metal foil Pending JPH04348900A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17359991A JPH04348900A (en) 1990-07-20 1991-07-15 Patch plate for drilling resin plate laminated with metal foil and method of drilling hole in resin plate laminated with metal foil

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2-192652 1990-07-20
JP19265290 1990-07-20
JP2-408194 1990-12-27
JP40819490 1990-12-27
JP17359991A JPH04348900A (en) 1990-07-20 1991-07-15 Patch plate for drilling resin plate laminated with metal foil and method of drilling hole in resin plate laminated with metal foil

Publications (1)

Publication Number Publication Date
JPH04348900A true JPH04348900A (en) 1992-12-03

Family

ID=27323805

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17359991A Pending JPH04348900A (en) 1990-07-20 1991-07-15 Patch plate for drilling resin plate laminated with metal foil and method of drilling hole in resin plate laminated with metal foil

Country Status (1)

Country Link
JP (1) JPH04348900A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5094380B2 (en) * 2005-01-31 2012-12-12 Psジャパン株式会社 Auxiliary plate material for drilling and cutting workpieces, and molded products using the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6420908A (en) * 1987-07-13 1989-01-24 Tsutsunaka Plastic Kogyo Auxiliary plat for boring and cutting workpiece
JPH0224012A (en) * 1988-07-12 1990-01-26 Tsutsunaka Plast Ind Co Ltd Support plate for piercing/cutting work

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6420908A (en) * 1987-07-13 1989-01-24 Tsutsunaka Plastic Kogyo Auxiliary plat for boring and cutting workpiece
JPH0224012A (en) * 1988-07-12 1990-01-26 Tsutsunaka Plast Ind Co Ltd Support plate for piercing/cutting work

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5094380B2 (en) * 2005-01-31 2012-12-12 Psジャパン株式会社 Auxiliary plate material for drilling and cutting workpieces, and molded products using the same

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