JPH0433389A - Ceramic composite copper clad board and manufacture thereof - Google Patents
Ceramic composite copper clad board and manufacture thereofInfo
- Publication number
- JPH0433389A JPH0433389A JP14023490A JP14023490A JPH0433389A JP H0433389 A JPH0433389 A JP H0433389A JP 14023490 A JP14023490 A JP 14023490A JP 14023490 A JP14023490 A JP 14023490A JP H0433389 A JPH0433389 A JP H0433389A
- Authority
- JP
- Japan
- Prior art keywords
- cordierite
- woven fabric
- ceramic composite
- layer
- composite copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 45
- 239000002131 composite material Substances 0.000 title claims abstract description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 229910052802 copper Inorganic materials 0.000 title abstract description 4
- 239000010949 copper Substances 0.000 title abstract description 4
- 229910052878 cordierite Inorganic materials 0.000 claims abstract description 43
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 claims abstract description 43
- 239000002759 woven fabric Substances 0.000 claims abstract description 22
- 239000011889 copper foil Substances 0.000 claims abstract description 17
- 239000003822 epoxy resin Substances 0.000 claims abstract description 8
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 8
- 239000003365 glass fiber Substances 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000004744 fabric Substances 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000009719 polyimide resin Substances 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 claims description 2
- 238000005553 drilling Methods 0.000 abstract description 5
- 238000000465 moulding Methods 0.000 abstract description 3
- 238000010285 flame spraying Methods 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 16
- 239000000758 substrate Substances 0.000 description 8
- 239000011148 porous material Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 5
- 239000011151 fibre-reinforced plastic Substances 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 238000007751 thermal spraying Methods 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910021532 Calcite Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 230000037396 body weight Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007750 plasma spraying Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、プリント配線板に用いる銅張積層板及びその
製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a copper-clad laminate used for printed wiring boards and a method for manufacturing the same.
（従来の技術）
従来、プリント配線板には、紙基材フェノール樹脂積層
板、ガラス布基材エポキシ樹脂積層板、ガラス布基材ポ
リイミド樹脂積層板などが主に用いられてきた。しかし
、最近電子機器の高出力化、小型化の進歩に伴い、プリ
ント基板材料にも寸法安定性を向上させるために熱膨張
係数の低減、耐熱性、耐トラツキング性等の向上が強（
望すれている。(Prior Art) Conventionally, paper-based phenol resin laminates, glass cloth-based epoxy resin laminates, glass cloth-based polyimide resin laminates, and the like have been mainly used for printed wiring boards. However, as electronic devices have recently become more powerful and more compact, printed circuit board materials are increasingly required to have lower thermal expansion coefficients, heat resistance, tracking resistance, etc. in order to improve dimensional stability.
desired.
このような要求に対して従来のガラス布基材エポキシ樹
脂積層板などのプラスチック基板は、熱膨張係数、耐ト
ラツキング性、耐熱性などの点で劣るために高密度実装
化に対応するためには改良が必要である。これに対して
アルミナをはじめとするセラミック基板は、これらの要
求を満たすが、加工性が悪い、基板の大型化ができない
などの欠点を有する。In response to these demands, conventional plastic substrates such as glass cloth-based epoxy resin laminates are inferior in terms of thermal expansion coefficient, tracking resistance, heat resistance, etc., so they are not suitable for high-density packaging. Improvement is needed. On the other hand, ceramic substrates such as alumina meet these requirements, but have drawbacks such as poor workability and the inability to increase the size of the substrate.
このような状況から、本発明者らは、従来のプラスチッ
ク基板とセラミック基板を複合化することを考え、セラ
ミックコート積層板を提案した（特開昭６２−１５２７
４２）。これは、銅箔と繊維強化プラスチツク層との闇
にアルミナなどのセラミック層を設けたものである。従
来のプラスチック基板に比べて熱膨張係数が低いために
寸法安定性が良い、熱間での銅箔引きはがし強さ、表面
硬度などの耐熱性にすぐれる、あるいは耐トラツキング
性、耐アーク性にすぐれるなどの特長があり、セラミッ
ク基板では不可能であるが、ドリル加工も可能である。Under these circumstances, the present inventors proposed a ceramic coated laminate with the idea of combining a conventional plastic substrate and a ceramic substrate (Japanese Unexamined Patent Application Publication No. 1527-1989).
42). This has a ceramic layer such as alumina placed between the copper foil and the fiber-reinforced plastic layer. It has a lower coefficient of thermal expansion than conventional plastic substrates, so it has good dimensional stability, and it has excellent heat resistance such as hot copper foil peeling strength and surface hardness, as well as tracking and arc resistance. It has excellent features such as excellent performance, and it can also be drilled, which is not possible with ceramic substrates.
（発明が解決しようとする課題）
しかし、このような特長を有するセラミツクコ−条種層
板の大きな欠点は、このドリル加工性が従来のプラスチ
ック基板に比べて劣る点であった。すなわち、φ１．Ｏ
ｍｌ程度ならば超硬ドリルで、ドリルの摩耗は大きいも
のの加工可能であるが、φ０．３−程度の小径になると
ドリルが折損しやすい。例えばセラミック層をアルミナ
として厚さ１００μｍにすると約２００穴程度でドリル
が折損する。したがって小径穴を有するプリント配線板
に適用するには問題があり、寸法安定性、耐トラツキン
グ性、耐熱性などの特徴を有するものの、用途が限定さ
れてし４５゜本発明はこの欠点を改良し、ドリル加工性
が改良されしかも寸法安定性、耐トラツキング性、耐熱
性などの特長を有するセラミック複合銅張積層板を提供
”ｒるものである。(Problems to be Solved by the Invention) However, a major drawback of the ceramic curvature laminated board having such features is that its drilling workability is inferior to that of conventional plastic substrates. That is, φ1. O
If the diameter is about 0.3 ml, it can be processed with a carbide drill, although the wear of the drill is large, but if the diameter is as small as 0.3 mm, the drill is likely to break. For example, if the ceramic layer is made of alumina and has a thickness of 100 μm, the drill will break after about 200 holes. Therefore, there is a problem in applying it to a printed wiring board having small diameter holes, and although it has characteristics such as dimensional stability, tracking resistance, and heat resistance, the application is limited.45 The present invention improves this drawback. The present invention provides a ceramic composite copper-clad laminate having improved drillability and features such as dimensional stability, tracking resistance, and heat resistance.
（課題を解決するための手段）
すなわち、本発明はＪｌ箔と織布プリプレグ層との間に
コージェライトを主体とする溶射層を設けて熱圧成形し
、銅箔と繊維強化プラスチツク層との間にコージェライ
トを主体とする溶射層を有する構造のセラミック複合Ｉ
！４張積層板を特徴とする。また、その製造法は、銅箔
の片面にコージェライトを生体とＣるセラミックを溶射
してコージェライトを主体とする溶射層を形成し、該コ
ージェライトを主体とする溶射−と接するように織布プ
リプレグを極層、載置して熱圧成形するものである。(Means for Solving the Problems) That is, the present invention provides a thermal spray layer mainly composed of cordierite between the JL foil and the woven fabric prepreg layer, and then hot-pressing the copper foil and the fiber-reinforced plastic layer. Ceramic composite I with a structure with a sprayed layer mainly composed of cordierite
! Features 4-panel laminate. In addition, the manufacturing method involves thermally spraying a ceramic material containing cordierite as a living body on one side of a copper foil to form a thermally sprayed layer mainly composed of cordierite, and then fabricating a layer in contact with the thermally sprayed layer mainly composed of cordierite. A layer of fabric prepreg is placed and hot-press molded.
鋼箔と繊處強化プラスチック層との間に設けるセラミッ
クをコージェライトとしたのは、コージェライトがアル
ミナに比べて軟質でしかも熱膨張係数が低いためである
。コージェライトは、その組成は、２Ｍｇ０１１２ムを
言０８・５ｓｉ（ｈ ’Ｃ＋（１）熱膨張係数は０．
５〜２．ＯＸ ｌ Ｏ’ ／℃である。すなわち、熱膨
張係数の低いコージェライト層を設けることによって熱
膨張係数の高い繊維強化プラスチツク層の熱膨張を抑え
ることができ、結果的に積層板の熱膨張係数が低くなり
、寸法安定性が向上するのである。また、セラミック層
としてアルミナを用いた場合は、アルミナが硬質で加工
性が悪いために、ドリル加工時にドリルの摩耗が著しく
、したがってドリルが折損しやすい。特にドリルが小径
になるとこの現象は顕著である。ところが、セラミック
層としてアルミナに代えてコージェライトを用いると、
コージェライトはアルミナに比べて軟質のため、ドリル
加工時のドリル摩耗は少なくなり、ドリルは折損しにく
くなる。ちなみにアルミナのビッカーズ硬さは約２．５
００であるのに対して、コージェライトでは約７００〜
８００である。The reason why cordierite was used as the ceramic provided between the steel foil and the fiber-reinforced plastic layer is that cordierite is softer and has a lower coefficient of thermal expansion than alumina. Cordierite has a composition of 2Mg0112m and a coefficient of thermal expansion of 08.5si (h'C+(1)).
5-2. OX l O'/°C. In other words, by providing a cordierite layer with a low coefficient of thermal expansion, the thermal expansion of the fiber-reinforced plastic layer with a high coefficient of thermal expansion can be suppressed, resulting in a lower coefficient of thermal expansion of the laminate and improved dimensional stability. That's what I do. Furthermore, when alumina is used as the ceramic layer, since alumina is hard and has poor workability, the drill wears significantly during drilling, and the drill is therefore likely to break. This phenomenon is particularly noticeable when the diameter of the drill becomes small. However, when cordierite is used instead of alumina as the ceramic layer,
Since cordierite is softer than alumina, there is less wear on the drill during drilling, making the drill less likely to break. By the way, the Vickers hardness of alumina is approximately 2.5.
00, whereas cordierite has about 700~
It is 800.
また、その製造法としてコージェライトを銅箔に溶射し
てコージェライト溶射層を形成し、これを織布プリプレ
グとともに熱圧成形して一体化する方法を採用したのは
、次のような利点からである。In addition, as a manufacturing method, we adopted a method in which cordierite is thermally sprayed onto copper foil to form a cordierite thermal sprayed layer, which is then heat-press molded and integrated with woven fabric prepreg due to the following advantages. It is.
溶射とは、プテズ７溶射法、ガス溶射法などの一般のセ
ラミック溶射に用いられる溶射法が適用できるが、セラ
ミックの粉末を熱で溶融させ、高速で被溶射体に衝突さ
せて、固着させるものである。したがって得られる溶射
層は、溶射材料であるセラミック粉本のへん平な粒子が
たい積した構造で５〜２０体積パーセントの気孔を有す
る。一般に、この気孔の存在は、電気絶縁用途には大き
な欠点になる。すなわち、気孔が吸湿しやすく、吸湿時
の絶縁特性が低下するのである。ところが、本発明の製
造法においては、この気孔の存在が、逆に大きな利点に
なる。というのは、銅箔にコージェライトを溶射してコ
ージェライト溶射層を成形し、これに織布プリプレグを
載置して熱圧成形すると、織布プリプレグの樹脂が熱圧
成形時に軟化、溶融し、コージェライト溶射層の気孔に
含浸する。その結果、コージェライト溶射層の気孔は封
孔され、吸湿時の絶縁特性の低下の問題は解決される。Thermal spraying can be applied to the thermal spraying methods used for general ceramic thermal spraying, such as the Putez 7 thermal spraying method and the gas thermal spraying method, but it is a method in which ceramic powder is melted with heat and is made to collide with the object to be thermally sprayed at high speed to make it stick. It is. Therefore, the resulting sprayed layer has a structure in which flat particles of ceramic powder, which is the sprayed material, are piled up and has pores of 5 to 20 volume percent. Generally, the presence of pores is a major drawback for electrical insulation applications. In other words, the pores tend to absorb moisture, and the insulation properties deteriorate when moisture is absorbed. However, in the production method of the present invention, the presence of these pores is, on the contrary, a great advantage. This is because if you thermally spray cordierite onto copper foil to form a cordierite sprayed layer, then place woven fabric prepreg on it and heat-press mold it, the resin in the woven fabric prepreg will soften and melt during hot-press molding. , impregnating into the pores of the cordierite sprayed layer. As a result, the pores in the cordierite sprayed layer are sealed, and the problem of deterioration of insulation properties when moisture is absorbed is solved.
さらに、セラミックと樹脂の接着性は互いに−ｍ材料で
あり、しかも熱膨張係数が異なるために良好ではないが
、熱圧成形時に樹脂がコージェライト溶射層の気孔に含
浸するために強固な接着力が得られる。また、銅箔とコ
ージェライト溶射層との接着力も溶射したままでは、プ
リント配線板として用いるには満足なものではないが、
樹脂がコージェライト溶射層を通して鋼箔面にまで達す
ることによって強固な接着力が得られる。Furthermore, the adhesion between ceramic and resin is not good because they are both -m materials and have different thermal expansion coefficients, but the resin impregnates the pores of the cordierite spray layer during hot press molding, so the adhesive strength is strong. is obtained. In addition, the adhesive strength between the copper foil and the cordierite sprayed layer is not satisfactory for use as a printed wiring board if it is sprayed as is.
Strong adhesion is achieved by the resin reaching the steel foil surface through the cordierite spray layer.
本発明に用いる織布プリプレグの織布としては、一般の
積層板に用いられているガラス繊維織布がその特性、価
格の点から好適であるが、その他にアラミド繊維、クォ
ーツ繊碓などの織布を用いることができる。また、樹脂
も一般の積層板に用いられているエポキシ樹脂、または
ポリイミド樹脂が好適であるが、その他にフェノール樹
脂、メラミン樹脂、不飽和ポリエステル樹脂、ふっ素樹
脂などを用いることができる。As the woven fabric for the woven fabric prepreg used in the present invention, glass fiber woven fabric used for general laminates is suitable from the viewpoint of its characteristics and price, but other woven fabrics such as aramid fiber and quartz fiber are also suitable. Cloth can be used. Further, as for the resin, epoxy resins or polyimide resins which are used in general laminates are suitable, but phenol resins, melamine resins, unsaturated polyester resins, fluororesins, etc. can also be used.
なお、本発明に用いるコージェライトを主体とするセラ
ミックは、コージェライトを主成分とするものであれば
、他のアルミナ、ジルコニア、チタニア、カルシ了、ス
ピネル、ムライト、ジルコンなどのセラミックを混合し
たものでも良いが、そのコージェライトの含有率は６０
体槓パーセント以上が好適である。コージェライトの量
が６０体積パーセント未満では、ドリル加工性の同上効
果が少な（、またたとえドリル加工性が向上しても、寸
法安定性が低下してしまうためである。ドリル加工性と
寸法安定性を両立スるためにはコージェライトが６００
体指バーセント上であることが必要なのである。The cordierite-based ceramic used in the present invention may be a mixture of other ceramics such as alumina, zirconia, titania, calcite, spinel, mullite, and zircon, as long as it has cordierite as its main component. That's fine, but the cordierite content is 60
A body weight percentage or higher is preferable. If the amount of cordierite is less than 60 volume percent, the above effect on drillability will be small (also, even if drillability improves, dimensional stability will decrease.Drillability and dimensional stability) Cordierite is 600 yen to balance gender.
It is necessary to be above the body and finger percentage.
（作用）
本発明のセラミック複合銅張積層板は、銅箔と繊維強化
プラスチツク層との間にコージェライトを主体とする溶
射層を有′するものである。(Function) The ceramic composite copper-clad laminate of the present invention has a thermally sprayed layer mainly composed of cordierite between the copper foil and the fiber-reinforced plastic layer.
熱膨張係数が低い（０，５〜２． ＯＸ １０−’ ／
’Ｃ）コージェライト層が存在するために積層板の熱膨
張係数はコージェライト層のない従来の銅張積層板に比
べて格段に低くなり、基板の寸法安定性を大きく向上す
ることができる。また、アルミナ溶射層に比べるとコー
ジェライト溶射層は、軟かいためにドリル加工時のドリ
ル摩耗もアルミナを用いた場合よりも少なく、そのため
にドリルも折損しにくくなる。特に小径ドリルでは顕著
な効果がある。Low coefficient of thermal expansion (0.5~2.OX 10-'/
'C) Due to the presence of the cordierite layer, the thermal expansion coefficient of the laminate is much lower than that of a conventional copper-clad laminate without a cordierite layer, and the dimensional stability of the board can be greatly improved. Furthermore, since the cordierite sprayed layer is softer than the alumina sprayed layer, drill wear during drilling is less than when alumina is used, and therefore the drill is less likely to break. This is particularly effective for small diameter drills.
さらに、鋼箔のすぐ下にセラミックであるコージェライ
ト溶射層が存在するために積層板の耐トラツキング性、
耐アーク性、加熱時の銅箔引きはがし強さなどもすぐれ
たものである。Furthermore, due to the presence of a ceramic cordierite sprayed layer just below the steel foil, the tracking resistance of the laminate is improved.
It also has excellent arc resistance and copper foil peeling strength when heated.
（実施例）
本発明の実施例を第１図、第２図に基づき以下説明°ｒ
る。(Example) An example of the present invention will be explained below based on FIGS. 1 and 2.
Ru.
厚さ１８μｍの電解鋼箔１ （Ｔ８ＴＯ−１８μｍ、古
河サーキットフォイル製）の粗化面に米国プラズマダイ
ン社製のプラズマ溶射機、プラズマダインシステム３６
００−８０Ｒ型を用いてコージェライト（ＰＯ−Ｍ入Ｓ
／ Ｆ 、日本研磨材製）を溶射し、厚さ１００μｍ
のコージェライト層２を形成した。次いで第１１に示す
積層構成でガラス繊維織布エポキシ樹Ｊ１ぼプリプレグ
３とともに熱圧成形し、第２図に示す構造ノ板厚０．４
ａｏのセラミック複合銅張積層板を得た。Plasma spraying machine, Plasma Dyne System 36 manufactured by Plasma Dyne Co., Ltd.
Using the 00-80R type, cordierite (PO-M containing S
/F, manufactured by Nippon Abrasive Materials), with a thickness of 100 μm.
A cordierite layer 2 was formed. Next, the glass fiber woven epoxy resin J1 was hot-press molded with the prepreg 3 in the laminated structure shown in FIG.
A ceramic composite copper-clad laminate of ao was obtained.
得られたセラミック複合銅張積層板の面方向の熱膨張係
数は８．４ Ｘ １０−”Ｃ−であり、このセラミック
複合銅張積層板を内層板に用いた４層板の４１１板プレ
ス後の寸法変化率は０．００３％で、めった。なお、コ
ージェライト溶射１の代わりにアルミナ溶射層を有する
セラミック複合銅張積層板の面方向の熱膨張係数は８．
３Ｘ１０４℃−１４層板プレス後の寸法変化率は０．０
０３％とほぼ同等であった。また、セラミック溶射層の
ない従来の銅張積層板では、面方向の熱膨張係数は１３
．７Ｘ１０−”Ｃ−’ ４層板プレス後の寸法変化率
は０．０２５９ｂであった。The coefficient of thermal expansion in the plane direction of the obtained ceramic composite copper clad laminate was 8.4 x 10-''C-, and after pressing 411 sheets of a 4-layer board using this ceramic composite copper clad laminate as an inner layer. The dimensional change rate was 0.003%, which was rare.The coefficient of thermal expansion in the in-plane direction of the ceramic composite copper-clad laminate having an alumina sprayed layer instead of the cordierite sprayed layer 1 was 8.
Dimensional change rate after pressing 3X104℃-14 layers is 0.0
It was almost the same as 0.03%. In addition, in a conventional copper-clad laminate without a ceramic sprayed layer, the coefficient of thermal expansion in the plane direction is 13.
．． The dimensional change rate after pressing the 7X10-"C-" 4-layer board was 0.0259b.
次にコージェライト溶射層をもつセラミック複合銅張積
層板で直径０．３５ｆｔｍｌ＋の超硬ドリルによる穴あ
けを行ったところ、加工大数ｉｏ、ｏ。Next, when we drilled holes in a ceramic composite copper-clad laminate with a cordierite sprayed layer using a carbide drill with a diameter of 0.35 ftml+, the number of holes drilled was io and o.
Ｏ穴でもドリルは折損しなか、た。一方、アルミナ溶射
層をもつセラミック複合銅張積層板では２０６穴でドリ
ルが折損した。また、積層板のドリル突きぬけ側の銅箔
のかえりは、セラミックとしてアルミナを用いたもので
は大きく、銅箔のかえり部分を研磨により除去しなけれ
ば、スルーホールめっき処理が困難であったが、セラミ
ックとしてコージェライトを用いたものでは、銅箔のか
えりはセラミックのない従来の銅張積層板とほぼ同等で
少なく、問題のないものであった。The drill did not break even with the O hole. On the other hand, the drill broke at 206 holes in a ceramic composite copper-clad laminate with an alumina sprayed layer. In addition, the burrs of copper foil on the side of the laminate where the drill penetrates are large when alumina is used as the ceramic, and through-hole plating is difficult unless the burrs of the copper foil are removed by polishing. In the case where cordierite was used as the material, the burrs of the copper foil were almost the same as those of conventional copper-clad laminates without ceramics, and there were no problems.
（発明の効果）
以上、本発明の方法により得られるセラミック複合銅張
積層板は、熱膨張が低く、耐トラツキング性、熱間での
銅箔引きはがし強さなどが従来の銅張積層板に比べてす
ぐれており、しかもセラミックにアルミナ溶射層を用い
たセラミック複合銅張積層板の最大の欠点であるドリル
加工性を大幅に改善することができるものである。(Effects of the Invention) As described above, the ceramic composite copper-clad laminate obtained by the method of the present invention has lower thermal expansion, tracking resistance, hot copper foil peeling strength, etc. than conventional copper-clad laminates. It is superior compared to other materials, and can also significantly improve drill workability, which is the biggest drawback of ceramic composite copper-clad laminates that use an alumina sprayed layer on ceramic.
第１図は本発明の実施例の積層構成を示す断面模式図、
第２図は、得られたセラミック連合銅張積層板の構造を
示す断面模式図である。
符号の説明
１・・・電解鋼箔
２・・コージェライト溶射層
３・・・ガラス繊維織布エポキシ４！詣プリプレグ４・
・・ガラス布基材エポキシ樹脂FIG. 1 is a schematic cross-sectional view showing the laminated structure of an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view showing the structure of the obtained ceramic-coated copper-clad laminate. Explanation of symbols 1...Electrolytic steel foil 2...Cordierite sprayed layer 3...Glass fiber woven epoxy 4! Pilgrimage prepreg 4.
・・Glass cloth base material epoxy resin
Claims (8)
主体とする溶射層を設け、これを熱圧成形してなること
を特徴とするセラミック複合銅張積層板。1. A ceramic composite copper-clad laminate, characterized in that a thermally sprayed layer mainly composed of cordierite is provided between a copper foil and a woven fabric prepreg layer, and this is formed by thermo-pressing.
項１記載のセラミック複合銅張積層板。2. The ceramic composite copper-clad laminate according to claim 1, wherein the woven fabric of the woven fabric prepreg is a glass fiber woven fabric.
１記載のセラミック複合銅張積層板。3. The ceramic composite copper-clad laminate according to claim 1, wherein the resin of the woven fabric prepreg is an epoxy resin.
項１項記載のセラミック複合銅張積層板。4. The ceramic composite copper-clad laminate according to claim 1, wherein the resin of the woven fabric prepreg is a polyimide resin.
クを溶射して溶射層を形成し、該コージェライト溶射層
に接するように織布プリプレグを載置してこれらを熱圧
成形することを特徴とするセラミック複合銅張積層板の
製造方法。5. It is characterized by forming a sprayed layer by thermally spraying a ceramic mainly composed of cordierite on one side of a copper foil, placing a woven fabric prepreg in contact with the cordierite spraying layer, and then hot-pressing the fabric prepreg. A method for manufacturing ceramic composite copper-clad laminates.
項５記載のセラミック複合銅張積層板の製造方法。6. The method for manufacturing a ceramic composite copper-clad laminate according to claim 5, wherein the woven fabric of the woven fabric prepreg is a glass fiber woven fabric.
５記載のセラミック複合銅張積層板の製造方法。7. The method for manufacturing a ceramic composite copper-clad laminate according to claim 5, wherein the resin of the woven fabric prepreg is an epoxy resin.
項５記載のセラミック複合銅張積層板の製造方法。8. The method for manufacturing a ceramic composite copper-clad laminate according to claim 5, wherein the resin of the woven fabric prepreg is a polyimide resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14023490A JPH0719941B2 (en) | 1990-05-30 | 1990-05-30 | Ceramic composite copper clad laminate and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14023490A JPH0719941B2 (en) | 1990-05-30 | 1990-05-30 | Ceramic composite copper clad laminate and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0433389A true JPH0433389A (en) | 1992-02-04 |
| JPH0719941B2 JPH0719941B2 (en) | 1995-03-06 |
Family
ID=15264030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14023490A Expired - Lifetime JPH0719941B2 (en) | 1990-05-30 | 1990-05-30 | Ceramic composite copper clad laminate and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0719941B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013191903A (en) * | 2010-03-31 | 2013-09-26 | Kyocera Corp | Interposer and electronic apparatus using the same |
| CN109890127A (en) * | 2019-03-09 | 2019-06-14 | 信丰福昌发电子有限公司 | A kind of high impedance ceramic base and epoxy resin-matrix composite multi-layer wiring board |
-
1990
- 1990-05-30 JP JP14023490A patent/JPH0719941B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013191903A (en) * | 2010-03-31 | 2013-09-26 | Kyocera Corp | Interposer and electronic apparatus using the same |
| CN109890127A (en) * | 2019-03-09 | 2019-06-14 | 信丰福昌发电子有限公司 | A kind of high impedance ceramic base and epoxy resin-matrix composite multi-layer wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0719941B2 (en) | 1995-03-06 |
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