JPH04303997A - Electronic cooling system - Google Patents

Abstract

PURPOSE:To provide an electronic cooling system which does not require any separate installing space for its power source section and can be easily wired with a simple structure. CONSTITUTION:The case 1 of this electronic cooling system is divided into a cooling and heat radiating chambers 3 and 4 and an electronic cooler 19 composed of a chamber heat-insulating member 2 which heat-insulates the chambers 3 and 4 from each other, power source section 11 which is provided in the chamber 4 of the case 1 with an opening and converts an alternating current into a direct current, power source heat-insulating member 17 which heat-insulates the section 11 and chamber 3 from each other, electronic cooling device 5 arranged beside the section 11, cooling fins 6 which are joined to the cooling surfaces of the devices 5 and positioned in the chamber 3, and heat radiating fins 7 which are joined to the heat radiating surfaces of the device 5 and positioned in the chamber 4 is provided.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic cooling device that uses an electronic cooling element having a Peltier effect to cool and dehumidify the inside of electrical equipment such as a switchboard and other equipment.

0002

2. Description of the Related Art Conventionally, this type of electronic cooling device has a case 1 which is insulated and divided into a cooling chamber 3 and a heat radiation chamber 4 by a room heat insulating material 2, as shown in FIG. A thermoelectric cooling element 5 is embedded in the element 5, cooling fins 6 are joined to the cooling surface of the element 5, that is, the cooling chamber 3 side, and radiation fins 7 are joined to the heat radiation surface of the element 5, that is, the heat radiation chamber 4 side.

A cooling fan 8 is provided to face the cooling fins 6, and takes in air from an intake port at the top of the cooling chamber 3 and exhausts air from an exhaust port at the bottom. Further, a heat radiation fan 9 is provided to face the heat radiation fins 7, and takes in air from an intake port in the center of the heat radiation chamber 4 and exhausts air from an exhaust port in the upper part. on the other hand,
A drain hose 10 is connected to the case 1 below the cooling fins 6, and the condensed water that has condensed on the cooling fins 6 falls and is discharged from the hose 10.

[0004] Furthermore, in the case 1, the cooling chamber 3 side is inserted from the outside into a through hole in the wall of electrical equipment and other equipment, and the heat dissipation chamber 4
is placed and fixed on the outside of the wall. Direct current is supplied to the element 5 from a power supply section installed outside the case 1 that converts an alternating current power source into direct current.

[0005]

[Problem to be Solved by the Invention] In the case of the above-mentioned conventional device, the power supply unit for converting AC power to DC is separately installed.
The wiring becomes complicated, and when the power supply section is installed in the device, the power supply section also generates heat, so the heat generated by the power supply section must be cooled down excessively, resulting in a problem that the cooling efficiency decreases. On the other hand, when installing the power supply section outside the device, there are problems in that installation space is required, the structure of the device becomes complicated, and wiring is extremely complicated.

The present invention has been made in consideration of the above points, and an object of the present invention is to provide an electronic cooling device that does not require a separate space for a power supply section, has a simple structure, and has easy wiring.

[0007]

[Means for Solving the Problems] In order to solve the above problems, the electronic cooling device of the present invention divides the inside of the case into a cooling chamber and a heat radiation chamber, and includes a room heat insulating material that insulates the space between the two chambers, and a heat sink inside the case. a power supply section that opens into the heat dissipation chamber and converts AC power into DC; a power supply insulation material that insulates the space between the power supply section and the cooling chamber;
The electronic cooler consists of an electronic cooling element disposed on the side of the power supply section, a cooling fin bonded to the cooling surface of the element and located in the cooling chamber, and a radiation fin bonded to the heat radiation surface of the element and located in the heat radiation chamber. It is prepared.

[0008]

[Operation] In the electronic cooling device of the present invention configured as described above, a power supply unit for supplying direct current to the electronic cooling element is provided in the case, and the electronic cooler is disposed on the side of the power supply unit. Because the power supply unit is built-in, it is easy to handle and wire, and the structure is simple.There is no need for installation space for the power supply unit outside the equipment, and the space between the power supply unit and the cooling room is insulated with power insulation material. Therefore, cooling efficiency is not hindered.

[0009]

Embodiment One embodiment will be described with reference to FIGS. 1 to 5. In those figures, the same symbols as in FIG. 6 indicate the same or equivalent parts. Reference numeral 11 denotes a power supply unit that converts AC power into DC power and supplies it to the electronic cooling element 5, and is disposed in the center of the case 1, spanning the cooling chamber 3 and the heat radiation chamber 4. 12 is a transformer constituting the power supply section 11; 13;
14 is a capacitor, 14 is a rectifier, 15 is a fuse, 16 is a partition wall with a U-shaped cross section that covers the power supply unit 11 in the cooling chamber 3, and 17 is a power insulation material disposed on the outer surface of the partition wall 16, which is connected to the cooling chamber 3. The power supply section 11 is insulated. 18 is the power supply section 1
In order to reduce the thermal influence on the capacitor 13, it is desirable to provide a heat insulating material on the inner surface of the partition wall 16 as well.

Reference numeral 19 designates electronic coolers disposed on both sides of the power supply section 11, which include an electronic cooling element 5, a room heat insulating material 2, cooling fins 6 joined to the cooling surface of the element 5, and a heat dissipating surface of the element 5. It is constructed by integrally incorporating bonded heat radiation fins 7.

20 is a condensed water receiver provided at the lower end of the cooling fin 6, and 21 is a condensed water evaporator provided below the radiation fin 7, which is made of a porous epoxy resin plate or the like. The condensed water, which has water absorption properties and is collected in the water receiver 20, flows into the evaporator 21 through the pipe, and is once absorbed by the evaporator 21. Evaporate.

Reference numeral 22 denotes a filter provided on the entire back surface of the heat radiation chamber 4, and there is a slight gap between it and the heat radiation fan 9, for example, a gap of about 5 to 10 mm. When it is introduced into the room 4, it prevents dust, dirt, oil mist, etc. from entering in a place with a bad external environment, and prevents clogging 23 from occurring in the filter 22 facing the heat dissipation fan 9, as shown in FIG. Also, the gap allows air to be taken in from around the clog 23 as shown by the arrow in the figure.

Then, the AC power is converted into DC by the power supply unit 11 and applied to the electronic cooling element 5, and the cooling fins 6
is cooled, high-temperature and humid air inside the device is taken into the cooling chamber 3 by the cooling fan 8, the heat and moisture are removed by the cooling fins 6, and the condensed water condensed on the cooling fins 6 falls into the water receiver 20. It flows into the evaporator 21 outside the device and evaporates. In this case, since the water is not led out of the device using the drain hose 10 as in the conventional case, there is no need to treat the water from the hose 10. In addition, although the above-mentioned embodiment shows the electronic cooler 19 provided on both sides of the power supply section 11, one electronic cooler 19 may be provided on the side of the power supply section 11.

[0014]

[Effects of the Invention] Since the present invention is constructed as described above, it produces the effects described below. A power supply section 11 that supplies direct current to the electronic cooling element 5 is provided in the center of the case 1, spanning the cooling chamber 3 and the heat radiation chamber 4, and electronic coolers 19 are arranged on both sides of the power supply section 11. For,
Since the power supply section 11 is built-in, it is easy to handle and wire, and the structure can be simplified.There is no need for installation space for the power supply section outside the device, and there is a power supply insulation material between the power supply section 11 and the cooling chamber 3. 17, it is possible to prevent the cooling efficiency from decreasing and the device can be made compact.

[Brief explanation of drawings]

FIG. 1 is a partially cutaway plan view of one embodiment of the electronic cooling device of the present invention.

FIG. 2 is a partially cutaway front view of FIG. 1;

FIG. 3 is a right side view of FIG. 1;

FIG. 4 is a rear view of a portion of FIG. 1;

FIG. 5 is an explanatory diagram of a part of FIG. 1;

FIG. 6 is a right side view of a conventional example.

[Explanation of symbols]

1 case 2 Room insulation material 3 Cooling room 4 Heat radiation chamber 5　Electronic cooling element 6 Cooling fins 7 Heat dissipation fins 11 Power supply section 17 Power insulation material 19 Electronic cooler

Claims (1)

[Claims] [Claim 1] The inside of the case is divided into a cooling chamber and a heat radiation chamber,
A room heat insulating material that insulates the space between the two chambers, a power supply section that is opened to the heat radiation chamber in the case and converts AC power to DC, and a power supply that insulates the space between the power supply section and the cooling chamber. a heat insulating material, an electronic cooling element disposed on the side of the power supply section, a cooling fin bonded to the cooling surface of the element and located in the cooling chamber, and a cooling fin bonded to the heat radiation surface of the element and located in the heat radiation chamber. An electronic cooling device comprising an electronic cooler consisting of radiation fins.