JPH042450A - Mixed lot management method and device - Google Patents

Abstract

PURPOSE:To manufacture products in different forms by necessary quantities without reducing the manufacturing efficiency, by grasping in advance the data concerning the structure of the form of the body to be processed and the processing content and correcting the data after performing the treatment of the form proper corresponding to each bodies to be processed of a hybrid lot. CONSTITUTION:A control part 1 decides as to whether or not an individual sheet processing process by reading the process order of the hybrid lot required for manufacture, reading the structural data of a wafer from a lot control file 4 in case of the leaf and sheet processing by a mask mating device 6, setting to the mask mating device 6 with a parameter being read from a manufacture conditions file 5 and performing photoengraving processes in order. On the other hand, one form composing the lot is read in case of a batch processing by a dispersion equipment 7, a parameter is set on the dispersion equipment 7 with its reading from the manufacturing conditions file 5 and the dispersion process for the wafer of the cassette inside is performed in a lump. On completion of the processing of one process, the inspection of the wafer is performed and the structural data of the hybrid lot are maintained or changed according to the inspection result.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a mixed lot management method for carrying out manufacturing processing in a mixed lot consisting of materials for a plurality of different types of products or semi-finished products, and a mixed lot management method thereof. Regarding equipment.

[Conventional technology]

For example, in a wafer process for manufacturing semiconductor devices, wafers are manufactured in units of lots, each containing a plurality of wafers stored in a cassette or the like. This lot is made up of wafers of the same type.

[Problem to be solved by the invention]

Incidentally, in recent years, there has been a trend in the production of semiconductor devices in small quantities and in a wide variety of products. For this reason, the number of wafers of the same type constituting a 10.7 lot may be less than the predetermined number, that is, the number that can be stored in one cassette, and such a lot has very poor manufacturing efficiency. Therefore, normally, manufacturing is performed by adding wafers of the same type that are in short supply, and the surplus is stored as inventory.

However, due to the above-mentioned small-volume, high-mix, orders for inventory are rarely received, and inventory is often unnecessary.
In the case of final disposal, the inventory maintenance costs up to that point are completely wasted.

The present invention has been made in view of the above circumstances, and is a hybrid lot that can manufacture products of different types in required quantities without reducing the manufacturing efficiency of manufacturing equipment that performs manufacturing processing on a lot-by-lot basis. The purpose is to provide management methods and equipment.

[Means to solve the problem]

The mixed lot management method according to the present invention grasps data regarding the composition of the product types and processing contents for a mixed lot made up of objects of different types, and based on this data, The processing apparatus is caused to perform processing corresponding to each workpiece of the mixed lot, and after the processing, the data is corrected.

Further, the mixed lot management device according to the present invention includes an input means for inputting data regarding the composition of types of objects to be processed and processing contents in the mixed lot, and a storage means for storing this input data. The apparatus includes processing means for causing a processing apparatus to perform processing corresponding to each workpiece of the lot based on stored data, and means for correcting the data after the processing.

[Effect]

In the mixed lot management method according to the present invention, data regarding the composition of the types of objects to be processed in the mixed lot and the processing contents are grasped in advance, and the processing device uses each object to be processed in the mixed lot based on this data. Type-specific processing corresponding to the data is performed, and after this processing, the data is corrected.

Further, in the mixed lot management device according to the present invention, when data regarding the configuration of the types of objects to be processed and the processing contents in the mixed lot are inputted by the input means, this data is stored in the storage means. Then, the processing device is controlled by the processing means based on this stored data, and type-specific processing corresponding to each workpiece of the mixed lot is performed, and after this processing, the data is corrected.

[Embodiments of the invention]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below based on drawings showing embodiments thereof. FIG. 1 is a block diagram showing the configuration of a mixed lot management apparatus according to the present invention, and shows an example of application to a wafer process in the manufacturing process of semiconductor devices. 1 in the diagram
is a control unit that performs manufacturing management of mixed lots of different types according to the present invention. The control section 1 is supplied with input data from the lot information input section 2 and manufacturing condition input section 3, which are the input means. The data input in the lot information input section 2 includes the lot number, process order,
This relates to the breakdown of the types of wafers constituting a mixed lot, and an explanatory diagram thereof is shown in FIG. In the figure, 10 is a cassette that stores each wafer 11. In this embodiment, cassette O can store 25 wafers, and for example, from the top, 5 wafers of type A, 5 wafers of type B, and 15 wafers of type C are stored to form one mixed lot. It is composed. From this, data is manually entered for each cassette, that is, for each mixed lot, such as which type of wafer is stored in which stage of this cassette and in what process order this cassette is to be processed.

In addition, the data inputted in the manufacturing condition input section 3 is the manufacturing condition in each manufacturing apparatus corresponding to each type of wafer, and this manufacturing condition is instructed to be set in the manufacturing apparatus described later.
Processing is performed on the wafer.

The control section 1 includes a lower management file 4 and a manufacturing condition file 5, which are storage means for storing input data from the lot information input section 2 and manufacturing condition input section 3, respectively.

Further, the control section 1 is configured to control various manufacturing devices in the wafer process, such as a mask alignment device 6 and a diffusion device 7.

Now, in the wafer process, there are two conditions under which wafers of different types can be configured into the same lot. first,
Wafers are transported between each manufacturing device in cassettes, so the process flow is the same, and the manufacturing conditions are the same in the process of batch processing wafers in cassettes. It is to satisfy the following. The manufacturing procedure for a hybrid lot configured as described above will be explained based on the flowchart shown in FIG. 3.

First, in step 1, lot information is registered in advance for each mixed lot made up of wafers of different types.

In other words, data such as the lot number, process order, breakdown of product types, order of storing wafers in cassettes, and manufacturing conditions corresponding to the product types are input into the lot information input section 2 and manufacturing condition input section 3, and The information is stored in the management file 4 and manufacturing condition file 5, respectively.

Next, the control unit 1 responds to the mixed lot for which there is a manufacturing request.
Read the process order from the lot information data corresponding to the lot number (step 2), and determine whether the first process to be performed on this mixed lot is a single wafer processing process (step 2).
Step 3). In other words, in the wafer process, there are
The wafer 1 is
There are two processing methods: a step in which wafers are processed one by one (this is referred to as single wafer processing), and a step in which wafers in a cassette are processed all at once, such as diffusion processing using a diffusion device 7. Therefore, if it is single wafer processing, the process proceeds to steps 4 to 6, and if it is batch processing, the process proceeds to steps 7 to 9.

For example, in the case of single wafer processing using the mask matching device 6, configuration data of wafers in a mixed lot is read out from the lot management file 4 in step 4. Next, the manufacturing conditions stored corresponding to each type of wafer read out, that is, each parameter to be set in the mask alignment device 6, are read out from the manufacturing condition file 5 (step 5). Using these data, the mask matching device 6 is instructed to set the corresponding parameters for each wafer in the cassette, and the photolithography process is sequentially performed (step 6).

On the other hand, if batch processing is performed by the diffusion device 7, step 7
Read out one product type that makes up the lot.

In this case, since the mixed lot is configured under the above-mentioned conditions, the manufacturing conditions are the same no matter which type of wafer making up the mixed lot is read out, and the manufacturing conditions stored corresponding to the readout type are the same. That is, parameters to be set for the diffusion device 7 are read from the manufacturing condition file 5 (step 8).

The parameters are then instructed to be set to the diffusion device 7, and the diffusion process for the wafers in the cassette is performed all at once (step 9).

When any of the above processes is completed, the wafers constituting the mixed lot are inspected (step 7 step 10). If a wafer is broken, it is detected as a defective wafer (step 11), and the contents of the configuration data of the mixed lot wafer stored in the lot management file 4 are changed and corrected (step 12). For example, in the mixed lot shown in Figure 2, if the second wafer from the top of type A is defective, data should be created to exclude it from processing as a missing part, or the second wafer By sequentially transferring the third and subsequent wafers to the section and re-creating the configuration data to correspond to this, in subsequent single-wafer processing, manufacturing conditions that do not correspond to the own type are set for each normal wafer. This prevents the user from being exposed. Note that this inspection and change/correction of lot information may be configured to be performed automatically using appropriate means, or may be configured to be inspected by an operator and then changed by the lot information human resource department 2. good.

When the processing of one process is completed in this way, the wafer is inspected, and the composition data of the mixed lot is maintained or changed according to the inspection result, and then the process returns to step 3.
The above-described process is repeated until the final step according to the process order.

As a result, wafer processing is performed on a lot-by-lot basis for each wafer of a different type that makes up the mixed lot.

Although this embodiment describes a configuration applied to a wafer process for semiconductor devices, it is of course not limited to this, and can be applied to any method in which different types of products with the same configuration are manufactured in lots. Applicable.

〔Effect of the invention〕

As described above, in the mixed lot management method and apparatus according to the present invention, objects to be processed of different types are configured into the same lot, and processing is automatically performed in units of lots corresponding to the types of objects to be processed. Therefore, when applied to the wafer process of semiconductor devices, for example, it is possible to manufacture only the required amount without reducing manufacturing efficiency, so there is no need for unnecessary inventory or wasteful inventory maintenance costs as in the past.

As a result, even in the case of small-scale production of a wide variety of products, there is no need to prepare and replace cassettes for each type of product as in the past. The present invention has excellent effects such as shortening the delivery time from order receipt to delivery and contributing to cost reduction.

[Brief Description of the Drawings] Fig. 1 is a block diagram showing the configuration of the mixed lot management device according to the present invention, Fig. 2 is an explanatory diagram of the mixed lot, and Fig. 3 is a flowchart showing the manufacturing procedure of the mixed lot. . 1... Control section 2... Lot information input section 3...
Manufacturing condition input section 4... Lot management file 5...
・Manufacturing condition file 6...Mask matching device 7...
- Diffusion device 11... wafer In the drawings, the same reference numerals indicate the same or corresponding parts.

Claims (2)

[Claims] (1) A mixed lot management method for forming a mixed lot by collecting materials for different types of products and objects to be processed such as semi-finished products, and inputting the mixed lot into a processing device for processing. , grasping data regarding the composition of the types of objects to be processed and processing contents in the mixed lot, and having the processing device perform processing corresponding to each object to be processed in the lot based on this data; A mixed lot management method characterized by modifying data. (2) A mixed lot management device for collecting a plurality of objects to be processed, such as materials for different types of products and semi-finished products, to form a mixed lot, and inputting the mixed lot into a processing device for processing. , an input means for inputting data regarding the composition of types of objects to be processed and processing contents in the mixed lot; a storage means for storing data inputted by the input means; and a storage means for storing data inputted by the input means; A mixed lot management device comprising: processing means for causing the processing device to perform processing corresponding to each workpiece of the mixed lot based on the processing information; and means for correcting the data after processing by the processing means. .