JPH0420178B2 - - Google Patents
Info
- Publication number
- JPH0420178B2 JPH0420178B2 JP21347283A JP21347283A JPH0420178B2 JP H0420178 B2 JPH0420178 B2 JP H0420178B2 JP 21347283 A JP21347283 A JP 21347283A JP 21347283 A JP21347283 A JP 21347283A JP H0420178 B2 JPH0420178 B2 JP H0420178B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- mask
- cellulose
- photosensitive resin
- mask pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 42
- 229920002678 cellulose Polymers 0.000 claims description 22
- 238000012546 transfer Methods 0.000 claims description 21
- 239000001913 cellulose Substances 0.000 claims description 18
- -1 ester compound Chemical class 0.000 claims description 18
- 239000011342 resin composition Substances 0.000 claims description 17
- 239000007787 solid Substances 0.000 claims description 6
- 229920013820 alkyl cellulose Polymers 0.000 claims description 2
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 claims description 2
- 238000003672 processing method Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 43
- 235000010980 cellulose Nutrition 0.000 description 15
- 238000000034 method Methods 0.000 description 15
- 239000002585 base Substances 0.000 description 14
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 239000000758 substrate Substances 0.000 description 14
- 238000005488 sandblasting Methods 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 8
- 230000001681 protective effect Effects 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 238000005406 washing Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 239000004743 Polypropylene Substances 0.000 description 6
- 238000013461 design Methods 0.000 description 6
- 229920006267 polyester film Polymers 0.000 description 6
- 229920001155 polypropylene Polymers 0.000 description 6
- 229920002635 polyurethane Polymers 0.000 description 6
- 239000004814 polyurethane Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- 229920000623 Cellulose acetate phthalate Polymers 0.000 description 4
- 239000001856 Ethyl cellulose Substances 0.000 description 4
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 229940081734 cellulose acetate phthalate Drugs 0.000 description 4
- 229920001249 ethyl cellulose Polymers 0.000 description 4
- 235000019325 ethyl cellulose Nutrition 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 4
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229910001868 water Inorganic materials 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 229920003086 cellulose ether Polymers 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 150000002763 monocarboxylic acids Chemical class 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- RBGUKBSLNOTVCD-UHFFFAOYSA-N 1-methylanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C RBGUKBSLNOTVCD-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- LNAZSHAWQACDHT-XIYTZBAFSA-N (2r,3r,4s,5r,6s)-4,5-dimethoxy-2-(methoxymethyl)-3-[(2s,3r,4s,5r,6r)-3,4,5-trimethoxy-6-(methoxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6r)-4,5,6-trimethoxy-2-(methoxymethyl)oxan-3-yl]oxyoxane Chemical compound CO[C@@H]1[C@@H](OC)[C@H](OC)[C@@H](COC)O[C@H]1O[C@H]1[C@H](OC)[C@@H](OC)[C@H](O[C@H]2[C@@H]([C@@H](OC)[C@H](OC)O[C@@H]2COC)OC)O[C@@H]1COC LNAZSHAWQACDHT-XIYTZBAFSA-N 0.000 description 1
- PVPBBTJXIKFICP-UHFFFAOYSA-N (7-aminophenothiazin-3-ylidene)azanium;chloride Chemical compound [Cl-].C1=CC(=[NH2+])C=C2SC3=CC(N)=CC=C3N=C21 PVPBBTJXIKFICP-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 1
- HSKPJQYAHCKJQC-UHFFFAOYSA-N 1-ethylanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2CC HSKPJQYAHCKJQC-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- CKKQLOUBFINSIB-UHFFFAOYSA-N 2-hydroxy-1,2,2-triphenylethanone Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(O)C(=O)C1=CC=CC=C1 CKKQLOUBFINSIB-UHFFFAOYSA-N 0.000 description 1
- RZCDMINQJLGWEP-UHFFFAOYSA-N 2-hydroxy-1,2-diphenylpent-4-en-1-one Chemical compound C=1C=CC=CC=1C(CC=C)(O)C(=O)C1=CC=CC=C1 RZCDMINQJLGWEP-UHFFFAOYSA-N 0.000 description 1
- DIVXVZXROTWKIH-UHFFFAOYSA-N 2-hydroxy-1,2-diphenylpropan-1-one Chemical compound C=1C=CC=CC=1C(O)(C)C(=O)C1=CC=CC=C1 DIVXVZXROTWKIH-UHFFFAOYSA-N 0.000 description 1
- FEWFXBUNENSNBQ-UHFFFAOYSA-N 2-hydroxyacrylic acid Chemical class OC(=C)C(O)=O FEWFXBUNENSNBQ-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- QSJXEFYPDANLFS-UHFFFAOYSA-N Diacetyl Chemical group CC(=O)C(C)=O QSJXEFYPDANLFS-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- AEMRFAOFKBGASW-UHFFFAOYSA-M Glycolate Chemical compound OCC([O-])=O AEMRFAOFKBGASW-UHFFFAOYSA-M 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- 241000282320 Panthera leo Species 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 108010076830 Thionins Proteins 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 229920003064 carboxyethyl cellulose Polymers 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 229920006217 cellulose acetate butyrate Polymers 0.000 description 1
- 229920006265 cellulose acetate-butyrate film Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- JXCHMDATRWUOAP-UHFFFAOYSA-N diisocyanatomethylbenzene Chemical compound O=C=NC(N=C=O)C1=CC=CC=C1 JXCHMDATRWUOAP-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- YQGOJNYOYNNSMM-UHFFFAOYSA-N eosin Chemical compound [Na+].OC(=O)C1=CC=CC=C1C1=C2C=C(Br)C(=O)C(Br)=C2OC2=C(Br)C(O)=C(Br)C=C21 YQGOJNYOYNNSMM-UHFFFAOYSA-N 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 239000001761 ethyl methyl cellulose Substances 0.000 description 1
- 235000010944 ethyl methyl cellulose Nutrition 0.000 description 1
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 1
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
- DASJFYAPNPUBGG-UHFFFAOYSA-N naphthalene-1-sulfonyl chloride Chemical compound C1=CC=C2C(S(=O)(=O)Cl)=CC=CC2=C1 DASJFYAPNPUBGG-UHFFFAOYSA-N 0.000 description 1
- LIGACIXOYTUXAW-UHFFFAOYSA-N phenacyl bromide Chemical compound BrCC(=O)C1=CC=CC=C1 LIGACIXOYTUXAW-UHFFFAOYSA-N 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 150000004291 polyenes Chemical class 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 150000003628 tricarboxylic acids Chemical class 0.000 description 1
- BSVBQGMMJUBVOD-UHFFFAOYSA-N trisodium borate Chemical compound [Na+].[Na+].[Na+].[O-]B([O-])[O-] BSVBQGMMJUBVOD-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/12—Production of screen printing forms or similar printing forms, e.g. stencils
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Decoration By Transfer Pictures (AREA)
Description
本発明は固体表面加工用マスク転写材、さらに
詳しくいえば、被加工基材への転写が可能な、繊
細な図柄をもつサンドブラスト用マスクパターン
層を有した固体表面加工用マスク転写材に関する
ものである。
ガラス、石材、陶磁器、木材、合成樹脂、金
属、皮革などの表面にサンドブラストにより彫刻
などを施す際に、通常非彫刻面を保護するために
マスクが用いられる。
従来、このサンドブラスト用マスクを用いる場
合、手加工によりゴムや紙などからパターンを有
するマスクを得、これを被加工基材に接着剤を用
いて貼着していたが、この方法では手間がかかる
上に繊細な図柄を有するマスクを得ることができ
なかつた。
したがつて、このような欠点を改善するため
に、最近感光性樹脂を用いたサンドブラスト用マ
スクを使用する方法が各種提案されている。例え
ば被加工基材上に直接感光性樹脂層を設け、画像
露光、現像を行つてパターンを有するマスクを作
成する方法(特公昭46−35681号公報)が提案さ
れている。しかしながら、この方法においては、
曲面加工が困難である上に、被加工基材が大きい
場合には、多大の労力を必要とするなどの欠点が
ある。
また、支持体フイルム上に感光性樹脂によるマ
スクパターン層を形成させて成るマスク転写材を
被加工基材に貼り付けて転写する方法(特開昭53
−99258号公報)が提案されている。しかしなが
ら、この方法においては、前記の方法における欠
点がある程度改善されるものの、該支持体フイル
ム上に接着剤層が設けられていないために、マス
クパターン層の作成における現像工程などで点や
線などの細かい硬化樹脂層が該支持体フイルムか
ら脱落してしまうという問題があり、その上被加
工基材に該転写材を貼着したのち、その支持体フ
イルムを剥離する際に、該支持体フイルムと硬化
物との粘着力のために、細かい図柄のマスクパタ
ーン層が被加工基材から脱離し、繊細な図柄の加
工には使用することができないという問題があ
る。
さらに、支持体フイルム上に感光性樹脂で形成
されたマスクパターン層を有するマスク転写材に
おいて、該支持体フイルムとマスクパターン層と
の間に、該フイルムとは剥離可能で、押圧により
被加工基材と密着し、かつサンドブラストにより
破壊される性質を有するメタクリル酸エステルの
ような中間被膜を設ける方法(実開昭55−89555
号公報)が提案されている。しかしながら、この
提案においては、該転写材を被加工基材に貼着し
たのち、支持体フイルムを剥離する際のマスクパ
ターン層の脱離は改善されるものの、該中間被膜
層と支持体フイルムとの剥離を容易にすると感光
性樹脂硬化物との接着力が弱くなつて、マスクパ
ターン層を形成するための現像工程において、該
マスクパターン層の脱落が起こり、また逆に感光
性樹脂硬化物との接着力を十分にすると、支持体
フイルムとの剥離抵抗が増して、該支持体フイル
ムの剥離特にマスクパターン層が脱離するように
なるため、該中間被膜層における前記接着力のバ
ランスをとることが困難であるという問題があ
る。
本発明者らは、このような問題を解決し、繊細
な図柄をもつマスクパターン層を有し、かつ該マ
スクパターン層を全く損わずに被加工基材へ転写
しうる固体表面加工用マスク転写材を提供すべく
鋭意研究を重ねた結果、支持基材とマスクパター
ン層との間に、水不溶性セルロース誘導体から成
る保持層を介在させることにより、その目的を達
成しうることを見出し、この知見に基づいて本発
明を完成するに至つた。
すなわち、本発明は、支持基材表面に水不溶性
セルロース誘導体から成る保持層を設け、さらに
その上に感光性樹脂組成物を硬化させて形成させ
たマスクパターン層を設けて成る固体表面加工用
マスク転写材を提供するものである。
本発明のマスク転写材において用いる支持基材
としては、例えばポリプロピレン、ポリエステ
ル、ポリ塩化ビニル、ポリカーボネート、ポリス
チレン、ポリエチレンなどの合成樹脂フイルム、
スチールやアルミニウムのような金属シートなど
が挙げられる。これらの支持基材の厚みは50μ〜
1mmの範囲が好適である。この厚みが50μより薄
いと支持基材に、いわゆるコシがなくなつて支持
基材としての働きができにくくなり、また1mmよ
り厚くなると取り扱い作業性が悪くなつて好まし
くない。
本発明のマスク転写材において、支持基材と、
感光性樹脂組成物を硬化させて成るマスクパター
ン層との間に介在させる支持層は水不溶性セルロ
ース誘導体から成り、それ自体は粘着性を有して
いないが、該マスクパターン層とは十分に強い接
着力を有し、しかも支持基材とは容易に剥離可能
であり、その上サンドブラストにより破壊される
性質を有している。
この水不溶性セルロース誘導体から成る保持層
は、支持基材上にマスクパターン層を形成させる
際の未露光感光性樹脂組成物を洗い出す工程にお
いて用いる水、アルカリ水溶液、界面活性剤水溶
液などの水系洗い出し液に不溶であつて、該工程
において、細かい点や線の樹脂硬化物が支持基材
から脱離するのを防ぐ役目を有し、その上該転写
材を被加工基材に貼着したのち、支持基材を剥離
する際に、マスクパターン層が該被加工基材から
脱離するのを防ぐ役目を有している。この保持層
と支持基材との剥離抵抗地は、該支持基材を剥離
する際に作業性の点から10g/cm以下であること
が望ましい。
前期保持層に用いられる水不溶性セルロース誘
導体の中でも、特にエチルセルロースやメチルセ
ルロースなどのアルキルセルロース類、セルロー
スアセテートブチレートなどのセルロースとモノ
カルボン酸とのエステル化合物が水系洗い出し液
に対する不溶性に優れている点で好ましい。
この保持層は、好ましくは0.5〜20μの厚さで用
いられる。この厚さが0.5μ未満では保持層として
の機能が劣り、また20μを超えると、このような
保持層を設けた支持基材の製造が困難となつて経
済的でない。
本発明のマスク転写材におけるマスクパターン
層を形成するために用いる感光性樹脂組成物は、
その硬化物が十分なサンドブラスト耐性と、例え
ば被加工基材との剥離抵抗値が20℃の温度で300
g/cm以上であるような表面粘着性とを有し、し
かも水、アルカリ水溶液、界面活性剤水溶液など
の水系洗い出し液で未露光部の洗い出しができる
ことが必要である。このような感光性樹脂組成物
の好適な例としては、
(イ)一般式
B(XA)oXB ……()
〔式中のXはウレタン残基、Aはポリエーテル、
ポリエステル、ポリエーテルポリエステルブロツ
クコポリマー、ポリジエン、ポリエン及びこれら
の混合物、Bは一般式
The present invention relates to a mask transfer material for solid surface processing, and more specifically, to a mask transfer material for solid surface processing that has a sandblasting mask pattern layer with a delicate design that can be transferred to a substrate to be processed. be. When sandblasting is used to engrave the surface of glass, stone, ceramics, wood, synthetic resin, metal, leather, etc., a mask is usually used to protect the non-engraved surface. Conventionally, when using this sandblasting mask, a mask with a pattern was obtained from rubber or paper by hand, and it was attached to the substrate to be processed using adhesive, but this method was time-consuming. It was not possible to obtain a mask with delicate designs on the top. Therefore, in order to improve these drawbacks, various methods have recently been proposed using sandblasting masks made of photosensitive resin. For example, a method has been proposed (Japanese Patent Publication No. 46-35681) in which a photosensitive resin layer is directly provided on a substrate to be processed, imagewise exposed and developed to create a mask having a pattern. However, in this method,
In addition to being difficult to process curved surfaces, it also requires a great deal of labor when the substrate to be processed is large. Furthermore, a method of transferring a mask pattern layer formed of a photosensitive resin onto a support film by attaching it to a substrate to be processed (Japanese Unexamined Patent Publication No. 53
-99258) has been proposed. However, in this method, although the drawbacks of the above-mentioned methods are improved to some extent, since no adhesive layer is provided on the support film, dots and lines may be formed during the development process in creating the mask pattern layer. There is a problem in that the fine cured resin layer falls off from the support film, and furthermore, when the support film is peeled off after the transfer material has been attached to the substrate to be processed, the support film may fall off. Due to the adhesive force between the mask pattern layer and the cured product, there is a problem that the mask pattern layer with a fine design detaches from the substrate to be processed, making it impossible to use it for processing delicate designs. Furthermore, in a mask transfer material having a mask pattern layer formed of a photosensitive resin on a support film, there is a space between the support film and the mask pattern layer that is removable from the film and that allows the substrate to be processed to be A method of providing an intermediate film such as methacrylic acid ester that adheres closely to the material and can be destroyed by sandblasting (Utility Model Publication No. 55-89555)
No. 2) has been proposed. However, in this proposal, although the detachment of the mask pattern layer is improved when the support film is peeled off after the transfer material is attached to the substrate to be processed, the intermediate coating layer and the support film are separated. If it is easily peeled off, the adhesive force with the photosensitive resin cured product becomes weaker, causing the mask pattern layer to fall off in the development process for forming the mask pattern layer, and conversely, the adhesive strength between the photosensitive resin cured product and the photosensitive resin cured product becomes weaker. If the adhesive force is sufficient, the peeling resistance from the support film will increase, and the peeling of the support film, especially the mask pattern layer, will occur. Therefore, balance the adhesive force in the intermediate coating layer. The problem is that it is difficult to The present inventors have solved these problems and created a mask for solid surface processing that has a mask pattern layer with a delicate design and that can be transferred to a processed substrate without damaging the mask pattern layer at all. As a result of extensive research in order to provide a transfer material, we discovered that this objective could be achieved by interposing a retaining layer made of a water-insoluble cellulose derivative between the supporting base material and the mask pattern layer. Based on this knowledge, we have completed the present invention. That is, the present invention provides a mask for solid surface processing, which comprises a holding layer made of a water-insoluble cellulose derivative on the surface of a supporting base material, and a mask pattern layer formed by curing a photosensitive resin composition thereon. It provides a transfer material. Examples of the supporting base material used in the mask transfer material of the present invention include synthetic resin films such as polypropylene, polyester, polyvinyl chloride, polycarbonate, polystyrene, and polyethylene;
Examples include metal sheets such as steel and aluminum. The thickness of these supporting base materials is 50μ ~
A range of 1 mm is preferred. If the thickness is less than 50 μm, the supporting base material loses its so-called stiffness, making it difficult to function as a supporting base material, and if it is thicker than 1 mm, handling efficiency becomes undesirable. In the mask transfer material of the present invention, a supporting base material;
The support layer interposed between the mask pattern layer formed by curing the photosensitive resin composition is made of a water-insoluble cellulose derivative, and does not have adhesive properties itself, but is sufficiently strong with respect to the mask pattern layer. It has adhesive strength, can be easily peeled from the supporting base material, and has the property of being destroyed by sandblasting. This holding layer made of a water-insoluble cellulose derivative is a water-based washing solution such as water, an aqueous alkali solution, or an aqueous surfactant solution used in the step of washing out an unexposed photosensitive resin composition when forming a mask pattern layer on a supporting substrate. It is insoluble in the material and has the role of preventing the fine dots and lines of the cured resin material from detaching from the supporting base material in the process, and furthermore, after the transfer material is affixed to the processed base material, It has the role of preventing the mask pattern layer from detaching from the substrate to be processed when the supporting substrate is peeled off. The peel resistance between the holding layer and the supporting base material is desirably 10 g/cm or less from the viewpoint of workability when the supporting base material is peeled off. Among the water-insoluble cellulose derivatives used in the former retention layer, alkyl celluloses such as ethyl cellulose and methyl cellulose, and ester compounds of cellulose and monocarboxylic acids such as cellulose acetate butyrate are particularly effective in their insolubility in aqueous washouts. preferable. This retaining layer is preferably used in a thickness of 0.5 to 20 microns. If the thickness is less than 0.5μ, the function as a retaining layer will be poor, and if it exceeds 20μ, it will be difficult and uneconomical to manufacture a supporting base material provided with such a retainer layer. The photosensitive resin composition used to form the mask pattern layer in the mask transfer material of the present invention is
The cured product has sufficient sandblasting resistance and has a peel resistance value of 300°C at a temperature of 20°C.
It is necessary to have a surface tackiness of at least g/cm, and to be able to wash out unexposed areas with an aqueous washing solution such as water, an aqueous alkali solution, or an aqueous surfactant solution. Suitable examples of such photosensitive resin compositions include (a) General formula B(XA) o XB ... () [In the formula, X is a urethane residue, A is a polyether,
Polyester, polyether polyester block copolymer, polydiene, polyene and mixtures thereof, B is the general formula
【式】(た
だし、Zは水素原子又はメチル基、Yは−(CH2−)
m1o−、−(CH2CH2O−)m2又は−(CH2CH2O−)
m3、m1は1〜6、m2及びm3はそれぞれ1〜15
である)で示される化合物、nは1〜10である〕
で表わされる不飽和ポリウレタン、(ロ)エチレン性
不溶和化合物及び(ハ)光重合開始剤を主成分として
含有して成る感光性樹脂組成物を挙げることがで
きるが、これらに限定されるものではない。
前記の感光性樹脂組成物に用いるエチレン性不
飽和化合物としては、例えばアクリル酸、メタク
リ酸又はこれらのエステル類、例えばアルキル、
シクロアルキル、テトラヒドロフルフリル、アリ
ル、グリシジル、ヒドロキシアルキルアクリレー
トやそれらのメタクリレート、アルキレングリコ
ール、ポリアルキレングリコールのモノ、ジアク
リレートやそれらのメタクリレート、ペンタエリ
スリトールテトラアクリレートやそのメタクリレ
ートなど;アクリルアミド、メタクリルアミド又
はこれらの誘導体、例えばN−メチロールアクリ
ルアミドやそのメタクリルアミド、N,N´−アル
キレンビスアクリルアミドやそのメタクリルアミ
ド、ジアセトンアクリルアミドやそのメタクリル
アミドなど;付加重合可能な不飽和単量体、例え
ばスチレン、ビニルトルエン、ジビニルベンゼ
ン、ジアリルフタレート、トリアリルシアヌレー
ト、ビニルアセテート、アクリロニトリルなど;
不飽和ポリエステル;アルキツド樹脂;ヒドロキ
シアクリレートやそのメタクリレートなどの活性
水素を有する付加重合可能な単量体で改質された
ポリウレタンのような不飽和ポリウレタンなどが
挙げられる。
また、前記感光性樹脂組成物に用いられる光重
合開始剤としては、例えばベンゾイン、ベンゾイ
ンアルキルエステル、α−メチルベンゾインやそ
のアルキルエーテル、α−フエニルベンゾイン、
α−アリルベンゾイン、アンスラキノン、クロロ
アンスラキノン、メチルアンスラキノン、エチル
アンスラキノン、ベンジル、ジアセチル、アセト
フエノン、ω−ブロモアセトフエノン、2,2−
ジメトキシフエニルアセトフエノン、α−ナフタ
レンスルホニルクロリド、ジフエニルジスルフイ
ド、エオシンやチオニンのような染料などが挙げ
られる。
次に、本発明のマスク転写材を製造する方法に
ついてその1例を示すと、まず保護フイルムの表
面に該フイルムと剥離しやすく、かつ未露光感光
性樹脂組成物の洗い出し液に可溶な被膜を形成
し、この保護フイルムを該被膜が露出するような
状態で透明画像担体上に設ける。該保護フイルム
としては、例えばポリプロピレン、ポリエステ
ル、ポリエチレン、ポリスチレン、ポリ塩化ビニ
ル、ポリアミド、酢酸セルロース、ポリカーボネ
ートなどの透明な合成樹脂フイルムが挙げられ、
その厚みは通常5〜50μのものが用いられる。こ
れより厚いと、該フイルム内での光の散乱により
画像の再現性が低下し、これより薄いと取り扱い
性が悪くなる。好ましくは9〜25μの厚さであ
る。また、該フイルムの酸素透過性が小さいと、
形成されるサンドブラスト用マスクパターン層の
表面粘着性を減少させる傾向を示すので、酸素透
過量が30×10-6g/24hr/m2/mm厚/cmHg(21
℃)以上であるものが好ましい。この点からポリ
プロピレンフイルム、セルロースエステル系フイ
ルム、ポリカーボネートフイルム、ポリエチレン
フイルム、ポリスチレンフイルムなどが適してい
る。さらに取扱い性を考慮するとポリプロピレン
フイルムが最も適している。
この保護フイルムの表面に設ける被膜は、該フ
イルムと剥離が容易であつて、未露光感光性樹脂
組成物の洗い出し液に可溶であることが必要であ
る。また該フイルムとの剥離抵抗値は10g/cm以
下であることが好ましい。したがつて、この被膜
には、例えばヒドロキシル基含有セルロースエー
テル又はエステル、カルボキシル基含有セルロー
スエーテル又はエステルなどのセルロース誘導
体、部分ケン化ポリ酢酸ビニルなどが使用可能で
ある。ヒドロキシル基含有セルロース誘導体とし
ては、例えばヒドロキシエチルセルロース、ヒド
ロキシプロピルセルロース、セルロースヒドロキ
シ酢酸エステルなどが、カルボキシル基含有セル
ロースエーテルとしては、例えばカルボキシメチ
ルセルロース、カルボキシエチルセルロースなど
が挙げられる。また、カルボキシル基含有セルロ
ースエステルとしては、セルロースと、ジ又はト
リカルボン酸などのポリカルボン酸、例えばコハ
ク酸、アジピン酸、セバシン酸、フタル酸、イソ
フタル酸、テレフタル酸、トリメリツト酸などと
の、あるいはこれらの一部を酢酸、プロピオン
酸、酪酸、安息香酸などのモノカルボン酸で置き
換えたものとのエステル化反応物が挙げられる。
また、これらのカルボン酸は塩の状態になつてい
てもよい。
前記以外のものでも、洗い出し液に可溶で被膜
性を有するものであれば使用可能である。
また、これらの被膜材の酸素透過性が小さいと
露光過程で表面の硬化がよく進み、形成されるサ
ンドブラスト用マスクパターン層の粘着性が低下
するので好ましくなく、この点から酸素透過性の
高いセルロース誘導体が好ましい。このセルロー
ス誘導体の中でも、吸湿性が小さく、弱アルカリ
水溶液や界面活性剤水溶液に可溶なカルボキシル
基含有セルロース誘導体が好ましく、さらに好ま
しくはセルロースとポリカルボン酸及びモノカル
ボン酸とのエステルであり、特に入手の容易さか
らセルロースアセテートフタレートが最適であ
る。
この被膜の厚さは、通常0.1〜10μの範囲であ
る。これより厚いと画像の再現性が低下し、これ
より薄いと製造上厚みコントロールが難しく、ま
たピンホールなどが発生しやすくなる。好ましい
被膜の厚さは0.2〜5μの範囲である。
次に、前記の保護フイルムの被膜の上に、感光
性樹脂組成物層を設け、さらにその上に、保持層
を設けた支持基材を、該保持層が感光性樹脂組成
物層に接するようにラミネートする。次いで透明
画像担体を通して活性光線で画像露光を行つたの
ち、透明画像担体を外し、さらに保護フイルムを
剥離して、未露光部を洗い出し、乾燥することに
より、本発明の転写材が得られる。
この際、保護フイルムの被膜上に設ける感光性
樹脂組成物層の厚さは、通常0.05〜3mmの範囲で
ある。これより薄いと十分なサンドブラスト耐性
が得られず、またこりより厚いと解像力が悪くな
つて好ましくない。
また、画像露光に用いる活性光線の光源として
は、例えばアーク灯、水銀灯、キセノン灯、けい
光灯、紫外線発生装置、太陽光などが挙げられ
る。活性光線の波長としては200〜800mμ、好ま
しくは300〜500mμの範囲である。
さらに、未露光部の洗い出し液としては、例え
ば水、又は水酸化ナトリウム、炭酸ナトリウム、
酸化炭酸ナトリウム、ホウ酸ナトリウム、リン酸
ナトリウム、ケイ酸ナトリウム、トリエタノール
アミンなどのアルカリ水溶液、あるいはセツケ
ン、アルキルベンゼンスルホネート、アルキルス
ルホネート、アルキルアミンクロリド、ポリオキ
シアルキレングリコール、ポリオキシアルキレン
グリコールアルキルエーテル、ポリオキシアルキ
レングリコールアルキルエステル、ソルビタン脂
肪酸エステル、ポリオキシアルキレングリコール
ソルビタン脂肪酸エステルなどの界面活性剤水溶
液が挙げられる。また、乾燥は温風又は熱風の吹
きつけや、室温での放置などによつて行われる。
本発明の固体表面加工用マスク転写材は繊細な
図柄をもつマスクパターン層を有しており、該転
写材を被加工基材へ貼り付けて支持基材を剥離す
る際に、マスクパターン層の脱離が生じることが
なく、該マスクパターン層を全く損わずに被加工
基材へ転写することができる。
次に実施例によつて本発明をさらに詳細に説明
するが、本発明はこれらの例によつて何ら限定さ
れものではない。
実施例 1
セルロースアセテートフタレートをメチルエチ
ルケトン/酢酸セロソルブ混合溶媒(重量比6/
1)に溶解させ、これを厚さ22μのポリプロピレ
ンフイルム上にバーコーターを用いてコーテイン
グすることにより、2μ厚さのセルロースアセテ
ートフタレート膜を有するポリプロピレンフイル
ムを得た。これをフイルムAとする。
また、エチルセルロースをメチルエチルケトン
に溶解させ、これを厚さ75μのポリエステルフイ
ルムにバーコーターを用いてコーテイングし、
8μ厚のエチルセルロース層を有するポリエステ
ルフイルムを得た。これをフイルムBとする。
さらに、ポリプロピレングリコールアジペート
ジオール(数平均分子量2500)39重量部、ポリプ
ロピレングリーコール(両末端にエチレンオキシ
ド合計10重量%付加させたもので、数平均分子量
2500)39重量部及びトルイレンジイソシアネート
6重量部を反応させて、両末端にイソシアネート
基を有するポリウレタンを得た。これに、15重量
部の2−ヒドロキシプロピルメタクリレートを反
応させて、両末端にメタクリレート基を有する不
飽和ポリウレタンを得た。この不飽和ポリウレタ
ンに、ポリプロピレングリコールモノメタクリレ
ート(数平均分子量550)20重量部、ジエチレン
グリコールジメタクリレート3重量部、2,2−
ジメトキシフエニルアセトフエエノン1.5重量部、
2,6−ジ−t−ブチル−p−クレゾール0.1重
量部を添加混合して液状感光性樹脂組成物を得
た。
次に、厚さ10mmのガラス板上にポジフイルムを
置き、その上を前記フイルムAでセルロースアセ
テートフタレート膜がむき出しになるようにして
覆つた。さらに厚さ0.3mmのテフロン製スペーサ
ーを置き、前記のようにして調整した液状感光性
樹脂組成物を注いだ。次いで前記フイルムBをエ
チルセルロース膜が感光性樹脂組成物層と接する
ようにしてラミネートし、その上に10mm厚のガラ
ス板を置いて四端をクリツプで固定することによ
り厚みを制御した。
このようにして得た構成体を2KWの高圧水銀
灯から50cmの位置に置き、ポジフイルムを通して
80秒間露光した。次いでガラス板を外し、ポジフ
イルムに接していたフイルムAを剥離した。この
際の剥離抵抗はほとんどなく、小さな硬化樹脂部
分も脱離することはなかつた。次に2重量%の界
面活性剤(ライオン(株)製、ライポンF)水溶液を
0.8Kg/cm2の圧力で150秒間吹きつけるこにより、
未露光感光性樹脂組成物を洗い出した。このとき
も硬化樹脂が脱離することはなかつた。次いで60
℃で10分間乾燥することにより、サンドブラスト
用マスク転写材を得た。
次に、この転写材を厚さ7mmのガラス板に貼着
し、フイルムBのポリエステルフイルムを剥ぎ取
つた。このとき剥離抵抗はほとんどなかつた。次
いでサイホン式サンドブラスターを用い、研磨材
としてランダム#180を3.5Kg/cm2の空気圧で全面
に30秒間吹きつけて彫刻を行つたところ、マスク
がガラスより剥離することがなく、目的とするパ
ターンを彫刻することができた。
実施例 2
実施例1におけるフイルムBとして、4μ厚さ
のセルロースアセテートブチレート被膜を120μ
厚のポリエステルフイルム上に設けたものを用い
る以外は、実施例1と全く同様にして、サンドブ
ラスト用マスク転写材を作成した。次いで、実施
例1と同様にして、前記転写材のガラス板への貼
り付け及びサンドブラスト加工を行つたところ、
目的とするパターンを彫刻することができた。
比較例
実施例1におけるフイルムBの代りに、10μ厚
のポリメタクリル酸メチルエステル被膜を75μ厚
のポリエステルフイルム上に設けたもの、及びこ
の保持層を設けない75μ厚のポリエステルフイル
ムを用いて、実施例1と同様にして、サンドブラ
スト用マスク転写材を作成しようとしたが、いず
れの場合も未硬化樹脂の現像工程で、トビ柄にな
つている小さい点や線の樹脂硬化物がフイルムか
ら脱離して目的とするパターンを得ることができ
なかつた。[Formula] (Z is a hydrogen atom or a methyl group, Y is -(CH 2 -)
m 1 o−, −(CH 2 CH 2 O−) m 2 or −(CH 2 CH 2 O−)
m 3 and m 1 are 1 to 6, m 2 and m 3 are each 1 to 15
A photosensitive resin containing as main components an unsaturated polyurethane represented by (b) an ethylenically insoluble compound and (c) a photopolymerization initiator, where n is 1 to 10. Examples include, but are not limited to, compositions. Examples of the ethylenically unsaturated compound used in the photosensitive resin composition include acrylic acid, methacrylic acid, or esters thereof, such as alkyl,
Cycloalkyl, tetrahydrofurfuryl, allyl, glycidyl, hydroxyalkyl acrylates and their methacrylates, alkylene glycol, polyalkylene glycol mono- and diacrylates and their methacrylates, pentaerythritol tetraacrylate and their methacrylates, etc.; acrylamide, methacrylamide, or these derivatives such as N-methylolacrylamide and its methacrylamide, N,N'-alkylenebisacrylamide and its methacrylamide, diacetone acrylamide and its methacrylamide; addition-polymerizable unsaturated monomers such as styrene, vinyltoluene , divinylbenzene, diallyl phthalate, triallyl cyanurate, vinyl acetate, acrylonitrile, etc.;
Unsaturated polyesters; alkyd resins; unsaturated polyurethanes such as polyurethanes modified with addition-polymerizable monomers having active hydrogen, such as hydroxyacrylates and their methacrylates. In addition, examples of the photopolymerization initiator used in the photosensitive resin composition include benzoin, benzoin alkyl ester, α-methylbenzoin and its alkyl ether, α-phenylbenzoin,
α-allylbenzoin, anthraquinone, chloroanthraquinone, methylanthraquinone, ethylanthraquinone, benzyl, diacetyl, acetophenone, ω-bromoacetophenone, 2,2-
Examples include dimethoxyphenylacetophenone, α-naphthalenesulfonyl chloride, diphenyl disulfide, and dyes such as eosin and thionin. Next, an example of the method for manufacturing the mask transfer material of the present invention will be described. First, a coating is formed on the surface of the protective film that is easily peeled from the film and is soluble in the washing solution of the unexposed photosensitive resin composition. A protective film is formed on a transparent image carrier in such a manner that the protective film is exposed. Examples of the protective film include transparent synthetic resin films such as polypropylene, polyester, polyethylene, polystyrene, polyvinyl chloride, polyamide, cellulose acetate, and polycarbonate.
Its thickness is usually 5 to 50 μm. If the film is thicker than this, the reproducibility of images will be lowered due to light scattering within the film, and if it is thinner than this, handling will be poor. Preferably the thickness is 9 to 25 microns. Furthermore, if the film has low oxygen permeability,
Since it tends to reduce the surface tackiness of the formed sandblasting mask pattern layer, the oxygen permeation rate is 30×10 -6 g/24hr/m 2 /mm thickness/cmHg (21
℃) or higher is preferable. From this point of view, polypropylene film, cellulose ester film, polycarbonate film, polyethylene film, polystyrene film, etc. are suitable. Furthermore, considering ease of handling, polypropylene film is most suitable. The coating provided on the surface of the protective film needs to be easily peelable from the film and soluble in the washing solution of the unexposed photosensitive resin composition. Further, the peel resistance value from the film is preferably 10 g/cm or less. Therefore, for this coating, for example, cellulose derivatives such as hydroxyl group-containing cellulose ethers or esters, carboxyl group-containing cellulose ethers or esters, partially saponified polyvinyl acetate, etc. can be used. Examples of hydroxyl group-containing cellulose derivatives include hydroxyethylcellulose, hydroxypropylcellulose, and cellulose hydroxyacetate, and examples of carboxyl group-containing cellulose ethers include carboxymethylcellulose and carboxyethylcellulose. In addition, the carboxyl group-containing cellulose ester may be a combination of cellulose and polycarboxylic acids such as di- or tricarboxylic acids, such as succinic acid, adipic acid, sebacic acid, phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, or the like. Examples include esterification products in which a portion of the above is replaced with a monocarboxylic acid such as acetic acid, propionic acid, butyric acid, or benzoic acid.
Further, these carboxylic acids may be in the form of salts. Materials other than those mentioned above can also be used as long as they are soluble in the washing liquid and have film properties. In addition, if the oxygen permeability of these coating materials is low, the surface will harden rapidly during the exposure process and the adhesiveness of the formed sandblasting mask pattern layer will decrease, which is undesirable.From this point of view, cellulose with high oxygen permeability is Derivatives are preferred. Among these cellulose derivatives, carboxyl group-containing cellulose derivatives that have low hygroscopicity and are soluble in weak alkali aqueous solutions and surfactant aqueous solutions are preferred, and esters of cellulose and polycarboxylic acids and monocarboxylic acids are more preferred, especially esters of cellulose and polycarboxylic acids and monocarboxylic acids. Cellulose acetate phthalate is most suitable because of its easy availability. The thickness of this coating typically ranges from 0.1 to 10 microns. If it is thicker than this, the image reproducibility will deteriorate, and if it is thinner than this, it will be difficult to control the thickness in manufacturing, and pinholes will be more likely to occur. Preferred coating thicknesses range from 0.2 to 5 microns. Next, a photosensitive resin composition layer is provided on the protective film coating, and a supporting base material with a retaining layer provided thereon is placed so that the retaining layer is in contact with the photosensitive resin composition layer. Laminate on. Next, the transfer material of the present invention is obtained by performing imagewise exposure to actinic light through the transparent image carrier, removing the transparent image carrier, peeling off the protective film, washing out the unexposed areas, and drying. At this time, the thickness of the photosensitive resin composition layer provided on the protective film is usually in the range of 0.05 to 3 mm. If it is thinner than this, sufficient sandblasting resistance cannot be obtained, and if it is thicker than this, the resolution becomes poor, which is not preferable. In addition, examples of the active light source used for image exposure include arc lamps, mercury lamps, xenon lamps, fluorescent lamps, ultraviolet generators, and sunlight. The wavelength of the active light is in the range of 200 to 800 mμ, preferably 300 to 500 mμ. Furthermore, as a washing liquid for the unexposed area, for example, water, sodium hydroxide, sodium carbonate,
Alkaline aqueous solutions such as sodium carbonate oxide, sodium borate, sodium phosphate, sodium silicate, and triethanolamine; Examples include aqueous solutions of surfactants such as oxyalkylene glycol alkyl esters, sorbitan fatty acid esters, and polyoxyalkylene glycol sorbitan fatty acid esters. Further, drying is performed by blowing warm air or hot air, or by leaving it at room temperature. The mask transfer material for solid surface processing of the present invention has a mask pattern layer with a delicate design. No detachment occurs, and the mask pattern layer can be transferred to the substrate to be processed without any damage. EXAMPLES Next, the present invention will be explained in more detail with reference to examples, but the present invention is not limited to these examples in any way. Example 1 Cellulose acetate phthalate was dissolved in methyl ethyl ketone/cellosolve acetate mixed solvent (weight ratio 6/
1) and coated it on a 22μ thick polypropylene film using a bar coater to obtain a polypropylene film having a 2μ thick cellulose acetate phthalate film. This is called film A. In addition, ethyl cellulose was dissolved in methyl ethyl ketone, and this was coated on a 75μ thick polyester film using a bar coater.
A polyester film having an 8μ thick ethylcellulose layer was obtained. This is called film B. Furthermore, 39 parts by weight of polypropylene glycol adipate diol (number average molecular weight 2500), polypropylene glycol (with a total of 10 weight % of ethylene oxide added to both ends, number average molecular weight
2500) and 6 parts by weight of toluylene diisocyanate were reacted to obtain a polyurethane having isocyanate groups at both ends. This was reacted with 15 parts by weight of 2-hydroxypropyl methacrylate to obtain an unsaturated polyurethane having methacrylate groups at both ends. To this unsaturated polyurethane, 20 parts by weight of polypropylene glycol monomethacrylate (number average molecular weight 550), 3 parts by weight of diethylene glycol dimethacrylate, 2,2-
1.5 parts by weight of dimethoxyphenylacetopheenone,
0.1 part by weight of 2,6-di-t-butyl-p-cresol was added and mixed to obtain a liquid photosensitive resin composition. Next, a positive film was placed on a glass plate having a thickness of 10 mm, and the positive film was covered with the film A so that the cellulose acetate phthalate film was exposed. Furthermore, a Teflon spacer with a thickness of 0.3 mm was placed, and the liquid photosensitive resin composition prepared as described above was poured into the spacer. Next, the film B was laminated so that the ethyl cellulose membrane was in contact with the photosensitive resin composition layer, and a 10 mm thick glass plate was placed thereon and the four ends were fixed with clips to control the thickness. The structure obtained in this way was placed 50 cm from a 2KW high-pressure mercury lamp, and a positive film was passed through it.
Exposure was made for 80 seconds. Next, the glass plate was removed, and the film A that was in contact with the positive film was peeled off. At this time, there was almost no peeling resistance, and even a small portion of the cured resin did not come off. Next, a 2% by weight surfactant (Lipon F, manufactured by Lion Corporation) aqueous solution was added.
By spraying for 150 seconds at a pressure of 0.8Kg/ cm2 ,
The unexposed photosensitive resin composition was washed out. At this time, the cured resin did not come off. then 60
A sandblasting mask transfer material was obtained by drying at ℃ for 10 minutes. Next, this transfer material was adhered to a glass plate having a thickness of 7 mm, and the polyester film of film B was peeled off. At this time, there was almost no peeling resistance. Next, using a siphon-type sandblaster, we sprayed random #180 as an abrasive over the entire surface at an air pressure of 3.5 kg/cm 2 for 30 seconds to engrave the mask.The mask did not separate from the glass and the desired pattern was achieved. was able to engrave. Example 2 As film B in Example 1, a 4μ thick cellulose acetate butyrate film was coated with a 120μ thick film.
A sandblasting mask transfer material was prepared in exactly the same manner as in Example 1, except that it was provided on a thick polyester film. Next, in the same manner as in Example 1, the transfer material was attached to a glass plate and sandblasted.
I was able to engrave the desired pattern. Comparative Example In place of the film B in Example 1, a 10μ thick polymethacrylic acid methyl ester coating was provided on a 75μ thick polyester film, and a 75μ thick polyester film without this retaining layer was used. An attempt was made to create a sandblasting mask transfer material in the same manner as in Example 1, but in both cases, during the uncured resin development process, the cured resin material in the form of small dots and lines forming the pattern was detached from the film. However, I was unable to obtain the desired pattern.
Claims (1)
ら成る保持層を設け、さらにその上に感光性樹脂
組成物を硬化させて形成させたマスクパターン層
を設けて成る固体表面加工用マスク転写材。 2 水不溶性セルロース誘導体がアルキルセルロ
ース、又はセルロースとモノカルボン酸とのエス
テル化合物である特許請求の範囲第1項記載の転
写材。[Scope of Claims] 1. A solid surface processing method comprising a holding layer made of a water-insoluble cellulose derivative on the surface of a supporting base material, and a mask pattern layer formed by curing a photosensitive resin composition on top of the holding layer. Mask transfer material. 2. The transfer material according to claim 1, wherein the water-insoluble cellulose derivative is an alkyl cellulose or an ester compound of cellulose and a monocarboxylic acid.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21347283A JPS60104938A (en) | 1982-05-13 | 1983-11-14 | Mask transferring material for working surface of solid |
| US06/601,825 US4587186A (en) | 1982-05-13 | 1984-04-19 | Mask element for selective sandblasting and a method |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57079184A JPS58196971A (en) | 1982-05-13 | 1982-05-13 | How to make a sandblasting mask |
| JP21347283A JPS60104938A (en) | 1982-05-13 | 1983-11-14 | Mask transferring material for working surface of solid |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60104938A JPS60104938A (en) | 1985-06-10 |
| JPH0420178B2 true JPH0420178B2 (en) | 1992-03-31 |
Family
ID=26420235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21347283A Granted JPS60104938A (en) | 1982-05-13 | 1983-11-14 | Mask transferring material for working surface of solid |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60104938A (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0414799Y2 (en) * | 1985-07-10 | 1992-04-02 | ||
| JP2562954B2 (en) * | 1988-09-06 | 1996-12-11 | アイセロ化学 株式会社 | Photosensitive laminated film for engraving mask |
| JPH0811365B2 (en) * | 1989-08-17 | 1996-02-07 | アイセロ化学株式会社 | Photosensitive laminated film for engraving mask |
| ES2149754T3 (en) * | 1990-10-22 | 2000-11-16 | Aicello Chemical Company Ltd | ENGRAVING METHOD WITH IMAGE CARRIER MASK AND PHOTOSENSITIVE STRATIFIED FILM FOR SUCH IMAGE CARRIER MASK. |
| US5629132B1 (en) * | 1991-03-28 | 2000-02-08 | Aicello Chemical | Method for engraving and/or etching with image-carrying mask and photo-sensitive laminate film for use in making the mask |
| US5518857A (en) * | 1991-03-28 | 1996-05-21 | Aicello Chemical Co., Ltd. | Image-carrying mask photo-sensitive laminate film for use in making an image carry mask |
| JP2901129B2 (en) * | 1994-03-14 | 1999-06-07 | アイセロ化学株式会社 | Sandblast resist ink |
| JP4497862B2 (en) * | 2003-07-18 | 2010-07-07 | 旭化成イーマテリアルズ株式会社 | Photosensitive resin laminate for sandblasting |
| DE102019211858A1 (en) * | 2019-08-07 | 2021-02-11 | Audi Ag | Process for masking surfaces to be matted |
-
1983
- 1983-11-14 JP JP21347283A patent/JPS60104938A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60104938A (en) | 1985-06-10 |
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