JPH04188848A - Semiconductor transport equipment - Google Patents

Abstract

PURPOSE:To prevent the generation of chip in the corners of the surfaces of semiconductor device by a method wherein the devices are transferred in a state that an adhesive tape is made to warp upward. CONSTITUTION:Semiconductor devices 1 after diced, frame rings 3 are respectively held by suction pads 7, and in a state that a suction jig 8 holding the whole semiconductor wafer, separately from the pads 7, is brought into contact with an adhesive tape 2, a space defined by the tape 2 and the jig 8, is evacuated to a vacuum sate through a tube 9 so that the pressure in the space becomes from the atmospheric pressure to a negative pressure. In a state that the tape 2 is made to warp upward, the pads 7 and the jig 8 are simultaneously moved and the devices 1 are held and transferred so that the intervals between the device surfaces are made larger than the intervals between the device rears bonded firmly on the tape 2. Thereby, as the adjacent devices 1 are transferred without bringing the corners of their surfaces into contact with each other, chip in the corners of the element surfaces can be prevented from being generated and the yield of the devices 1 can be made high.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a transport device for transporting semiconductor elements divided into individual elements.

[Conventional technology]

FIGS. 3 to 5 are cross-sectional views showing the conventional die single conveyance method. In the figures, (1) is a semiconductor element, (2)
is an adhesive tape for fixing the semiconductor element (1), (2a) is an adhesive layer of the adhesive tape (2), and (2b) is an adhesive tape (
(2) is a tape base material; (3) is a frame ring that holds the adhesive tape (2); (4) is a wafer chuck table in a dicing device for making grooves in semiconductor wafers;
(5) is a rotary blade (hereinafter referred to as a blade) that cuts a groove in the semiconductor wafer, (6) is a groove formed by the blade, and (7) is a suction pad used to convey the frame ring.

Next, the operation will be explained. As shown in FIG. 3, the semiconductor wafer fixed to the adhesive tape (2) is placed on a wafer chuck table (4) and vacuum-adsorbed. The blade (5) completely cuts the semiconductor element (1) with a cut that reaches the adhesive layer (2a) of the adhesive tape (2).

FIG. 4 shows an enlarged cross-sectional view of the semiconductor element portion that has been fully cut. Next, as shown in FIG. 5(a), the dicing-completed semiconductor element (1) has a frame ring (3) vacuum-adsorbed by a suction pad (7) and is conveyed to the next process.

[Problem to be solved by the invention]

Conventional transportation is carried out as described above, so the divided semiconductor elements must be held only by the tension of the adhesive tape, and the weight of the semiconductor elements causes the adhesive tape to flex, causing the corners of the surfaces of adjacent elements to touch each other. However, there were problems with the generation of Si particles and damage to the chip pattern.

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a semiconductor transfer device that can prevent corner chipping on the surface of an element.

[Means to solve the problem]

A semiconductor transport device according to the present invention includes a support member that supports a plurality of semiconductor elements fixed to an adhesive tape at a predetermined interval larger than the interval between adjacent surfaces of the semiconductor elements or the interval between the back sides fixed with the adhesive tape. It is something that

[Effect]

In the semiconductor transport device according to the present invention, the semiconductor elements are transported while being maintained such that the distance between the semiconductor elements is larger than the distance between the back surfaces fixed with adhesive tape, which is the distance between the front surfaces.

〔Example〕

J. Ninoshita, an embodiment of the present invention will be described with reference to the drawings.

In Figure 1, (1) is a semiconductor r, (2) is an adhesive tape that fixes the semiconductor element (1), and (3) is an adhesive tape (
2) is the frame ring that holds it, (6) is the kerf formed by the play 1, (A) is the frame ring (3)
(8) is a suction jig used to transport semiconductor wafers, (9) is a suction jig used to carry semiconductor wafers, and (9) is a vacuum or open space consisting of adhesive tape (2) and suction jig (8). It is a tube for one purpose. The support member α0) is formed in steps (7) to (9) above.

Next, the operation will be explained. As in the prior art, as shown in FIG. 3, the semiconductor wafer fixed to the adhesive tape (2) is placed on the wafer chuck table (4) and vacuum-adsorbed. The blade (5) makes a cut that reaches the adhesive layer (2a) of the adhesive tape (2) to completely cut the semiconductor element (1).

FIG. 4 shows an enlarged cross-sectional view of the semiconductor element portion that has been fully cut.

Next, after dicing, the completed semiconductor device (11 is as shown in Figure 1), the frame ring (3) is
), and separate from the suction pad (7), a suction jig (8) containing the entire semiconductor wafer is brought into close contact with the adhesive tape (2).
) The space consisting of the suction jig (8) is evacuated through the tube (9) to a pressure lower than atmospheric pressure.

Then, with the adhesive tape (2) bent upward, the suction pad (A) and the suction jig (8) are simultaneously moved (not shown) to transport the semiconductor element to the next process.

In addition, in the above example, the method of warping the adhesive tape upward by creating a negative pressure between the suction jig and the adhesive tape was shown, but as shown in Fig. 2, the upwardly convex curved plate was placed on the support member side. Even if the back side of the adhesive tape (2) is placed on the curved surface, the same effect as in the above embodiment can be obtained.

〔Effect of the invention〕

As described above, according to the present invention, since the semiconductor elements are transported with the adhesive tape bent upward, the corners of the surfaces of adjacent elements do not come into contact with each other, preventing corner chipping and increasing the yield. be.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a semiconductor transfer device according to an embodiment of the present invention, FIG. 2 is a sectional view showing a transfer device according to another embodiment of the invention, and FIG. 3 is a sectional view of a dicing method. 4 is an enlarged view of the cut portion of FIG. 3, FIG. 5(a) is a sectional view of a conventional conveying device, and FIG. 5(b) is an enlarged view of the conventional conveying device. In the figure, (1) is a semiconductor element, (2
) is an adhesive tape, (2a) is an adhesive layer, (2b) is a tape base material (3) is a frame ring, (4) is a wafer chuck table, (5) is a blade, (6) is a kerf, (7 )
is a suction pad, (8) is a suction jig, (9) is a pipe, and aα is a support member. In addition, in the figures, the same reference numerals indicate the same or equivalent parts. Agent Masuo Oiwa! @2 diagram Q 1 Semiconductor element 2 / Adhesive tape 3 Rim link 6, 1 sword Beak 7: OFL guard bat δ Grant guard guard 9 ° Arrival LO, support member

Claims (1)

[Claims] In an apparatus in which a semiconductor wafer fixed to an adhesive tape is transported as a plurality of semiconductor elements in a direction substantially perpendicular to the length direction of the adhesive tape, the distance between adjacent elements on the surface side is fixed by the adhesive tape. A semiconductor transfer device characterized by supporting the semiconductor in a state where the distance is wider than the distance on the back side.