JPH0416940B2 - - Google Patents
Info
- Publication number
- JPH0416940B2 JPH0416940B2 JP59108214A JP10821484A JPH0416940B2 JP H0416940 B2 JPH0416940 B2 JP H0416940B2 JP 59108214 A JP59108214 A JP 59108214A JP 10821484 A JP10821484 A JP 10821484A JP H0416940 B2 JPH0416940 B2 JP H0416940B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin material
- pressurizing
- pot
- plunger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W74/016—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/462—Injection of preformed charges of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、トランスフアーモールド成形方法
と、これに用いられる成形用金型装置の改良に関
するものであり、主として、半導体素子の樹脂モ
ールド成形技術産業の分野において利用されるも
のである。Detailed Description of the Invention (Field of Industrial Application) This invention relates to a transfer molding method and an improvement of a molding device used therefor, and mainly relates to a resin molding technology for semiconductor elements. It is used in the industrial field.
（従来技術とその問題点）
半導体素子を樹脂モールド成形する場合は、通
常、ポツト内に供給した樹脂材料（樹脂パウダ
ー、或は、これを所要形状に固化させた樹脂タブ
レツト等）を加熱すると共に、これをプランジヤ
ーにて加圧することにより溶融化し、且つ、その
溶融樹脂をランナ及びゲート等から成る移送経路
を通して、直ちに、樹脂モールド成形用キヤビテ
イ内に加圧・注入するようにしている。(Prior art and its problems) When molding a semiconductor element with resin, the resin material (resin powder, resin tablet, etc. that has been solidified into the desired shape) supplied into the pot is usually heated and This is melted by pressurizing it with a plunger, and the molten resin is immediately pressurized and injected into the resin molding cavity through a transfer path consisting of a runner, a gate, etc.
ところで、上記樹脂材料、特に、樹脂タブレツ
ト自体には空気・水分を含んでいること、ポツト
内部にも空気が存在していることから、溶融化さ
れた樹脂中に該空気等が混入した状態でキヤビテ
イ内に加圧注入されることとなる。 By the way, the above resin material, especially the resin tablet itself, contains air and moisture, and air is also present inside the pot, so if the air etc. is mixed into the molten resin, It will be injected into the cavity under pressure.
従つて、このような従来の樹脂モールド成形時
においては、成形樹脂体の内部或は外表面にボイ
ド（気泡）を形成し易く、例えば、発光ダイオー
ドの樹脂モールド成形品である場合は、そのレン
ズ部内或はレンズ表面に欠損部が生じて使用不能
となる等の重大な問題があり、また、その他の半
導体素子の樹脂モールド成形品においてはその耐
久性或は信頼性を著しく低下させることになると
いつた欠点を有している。 Therefore, during such conventional resin molding, voids (bubbles) are likely to be formed inside or on the outer surface of the molded resin body. For example, in the case of a resin molded product of a light emitting diode, the lens There may be serious problems such as defects occurring inside the parts or on the lens surface, making it unusable, and it may also significantly reduce the durability or reliability of resin molded products of other semiconductor elements. It has some drawbacks.
（本発明の目的）
本発明は、ポツト内の樹脂材料をプランジヤー
によつて加圧溶融化する際に、該樹脂材料及びポ
ツト内の空気・水分を効率良く外部に排出させる
ことにより、溶融樹脂中に上記空気等が混入する
のを防止して、上述したような従来の問題を確実
に解消することを目的とするものである。(Objective of the present invention) The present invention provides a method for melting the molten resin by efficiently discharging the resin material and air/moisture in the pot to the outside when the resin material in the pot is melted under pressure with a plunger. The purpose of this is to prevent the above-mentioned air etc. from being mixed in, thereby reliably solving the conventional problems as described above.
（本発明の方法及び構成）
本発明方法は、樹脂材料の供給用ポツト及び加
圧用プランジヤーを備えた樹脂材料の加圧部に樹
脂材料を供給する工程と、上記加圧部の近傍位置
側となる溶融樹脂の移送経路を遮断した状態で樹
脂材料を加熱・加圧して溶融化させながら該溶融
樹脂中の空気・水分を上記ポツトとプランジヤー
との間〓から外部に排出する工程と、上記移送経
路を連通させることにより上記加圧部の空気・水
分を含まない溶融樹脂を樹脂モールド成形用のキ
ヤビテイ内に加圧注入する工程とから成るトラン
フアーモールド成形方法に係るものである。(Method and structure of the present invention) The method of the present invention includes a step of supplying a resin material to a pressurizing section of the resin material that is equipped with a resin material supply pot and a pressurizing plunger, and a step of supplying a resin material to a pressure section of the resin material that is equipped with a resin material supply pot and a pressurizing plunger, and A step of discharging air and moisture in the molten resin to the outside from between the pot and the plunger while melting the resin material by heating and pressurizing the resin material with the transfer path of the molten resin blocked, and The present invention relates to a transfer molding method comprising the step of injecting the molten resin containing no air or moisture from the pressurizing section under pressure into a cavity for resin molding by communicating a path.
また、本発明装置は、樹脂材料の供給用ポツト
及び加圧用プランジヤーを備えた樹脂材料の加圧
部と、樹脂モールド成形用のキヤビテイ部と、上
記加圧部とキヤビテイ部との間を連通させる溶融
樹脂の移送経路とを備えたトランスフアーモール
ド成形用金型において、上記加圧部の近傍位置側
に、上記移送経路を連通・遮断される開閉機構を
配設すると共に、上記ポツトとプランジヤーとの
間に、空気・水分の排出用間〓を設けたことを特
徴とするトランスフアーモールド成形用金型装置
に係るものである。 Furthermore, the apparatus of the present invention provides communication between a resin material pressurizing section equipped with a resin material supply pot and a pressurizing plunger, a cavity section for resin molding, and the pressurizing section and the cavity section. In a transfer mold molding die equipped with a transfer path for molten resin, an opening/closing mechanism is disposed near the pressurizing part to connect and block the transfer path, and the pot and the plunger are connected to each other. This relates to a mold apparatus for transfer molding, characterized in that a space for discharging air and moisture is provided in between.
（実施例） 以下、本発明を実施例図に基づいて説明する。(Example) Hereinafter, the present invention will be explained based on embodiment figures.
第１図は本発明方法に用いられるトランスフア
ーモールド成形用金型装置を示している。該金型
装置は、固定上型１と該上型に対設した可動下型
２とから構成されると共に、樹脂材料の供給用ポ
ツト３及び加圧用プランジヤー４を備えた樹脂材
料の加圧部Ａと、樹脂モールド成形用のキヤビテ
イ部Ｂと、上記加圧部Ａとキヤビテイ部Ｂとの間
を連通させる溶融樹脂の移送経路Ｃと、上記加圧
部Ａの近傍位置側に上記移送経路を連通・遮断さ
せる開閉機構Ｄとが夫々配設されている。 FIG. 1 shows a mold apparatus for transfer molding used in the method of the present invention. The mold apparatus is composed of a fixed upper mold 1 and a movable lower mold 2 disposed opposite to the upper mold, and also includes a resin material pressurizing section equipped with a resin material supply pot 3 and a pressurizing plunger 4. A, a cavity part B for resin molding, a transfer route C for molten resin that communicates between the pressure part A and the cavity part B, and a transfer route C in the vicinity of the pressure part A. An opening/closing mechanism D for communication/blocking is provided, respectively.
また、上記ポツト３とプランジヤー４の先端加
圧部４1との間には空気・水分の排出用の間〓５
が構成されている。また、上記キヤビテイ部Ｂ
は、両型１，２のパーテイングライン（Ｐ・Ｌ）
面に対設されると共に、下型２側のキヤビテイ部
には半導体素子を取り付けたリードフレームＥ
（第２図）をセツトするための係合凹所６が設け
られている。また、上記移送経路Ｃは、第１図に
示すように、ポツト３内に供給した樹脂材料（タ
ブレツト）Ｆを受けるカル部７と、上記キヤビテ
イ部Ｂとの連通口であるゲート８と、上記カル部
７とゲート８との間を連通するランナ９とから構
成されている。また、上記開閉機構Ｄは、上記ラ
ンナ９を連通・遮断させるものであつて、該ラン
ナの遮閉部材１０と該遮閉部材の適宜な進退機構
１１とから構成されるものであるが、該進退機構
１１は、図例のように上型１側に設けてもよく、
或は、下型２側に配設しても差支えない。 Further, between the pot 3 and the tip pressurizing part 41 of the plunger 4, there is a gap 5 for discharging air and moisture.
is configured. In addition, the above cavity part B
is the parting line of both molds 1 and 2 (P/L)
A lead frame E is provided opposite to the surface and has a semiconductor element attached to the cavity part on the lower mold 2 side.
An engagement recess 6 is provided for setting (FIG. 2). Further, as shown in FIG. 1, the transfer path C includes a cull section 7 that receives the resin material (tablet) F supplied into the pot 3, a gate 8 that is a communication port between the cavity section B, and the It is composed of a runner 9 that communicates between the cull section 7 and the gate 8. Further, the opening/closing mechanism D connects and disconnects the runner 9 and is composed of a closing member 10 for the runner and an appropriate advancing/retracting mechanism 11 for the closing member. The advancing/retracting mechanism 11 may be provided on the upper mold 1 side as shown in the figure,
Alternatively, it may be arranged on the lower mold 2 side.
なお、図中符号１２，１３，１４，１５で示す
ものは、上型１及び下型２に設けられた成形樹脂
体の押出用エジエクターピンである。 Note that reference numerals 12, 13, 14, and 15 in the figure are ejector pins provided in the upper die 1 and the lower die 2 for extruding a molded resin body.
次に本発明の作用を説明する。 Next, the operation of the present invention will be explained.
まず、前記凹所６内にリードフレームＥをセツ
トして両型１，２の型締めを行なうと共に、進退
機構１１により遮閉部材１０をランナ９側に進行
させて該ランナの連通状態を遮断する。次に、ポ
ツト３内に樹脂材料Ｆを供給してこれを所要温度
まで加熱すると共に、プランジヤーの先端加圧部
４1により加圧して溶融化するのであるが、この
とき、上記樹脂材料Ｆは、金型の加熱部からの熱
を最も多く受けるカル部７側から順次溶融化され
ていくこと、及び、その溶融化された樹脂は遮閉
部材１０に遮られてキヤビテイ部Ｂ側に圧送され
ず、従つて、該ポツト３内における樹脂材料Ｆの
加圧力を従来装置のものよりも高めることができ
ることから、樹脂材料Ｆの溶融化の際に、ポツト
３内或は樹脂材料Ｆ自体に含まれる空気・水分
は、ポツト３とプランジヤーの先端加圧部４1と
の間〓５を通して外部に排出されることになる。
即ち、加熱且つ加圧力を受けた樹脂材料Ｆは、第
２図に示すように、プランジヤー先端加圧部４1
とポツト３、及び、カル部７と遮られたランナ９
１部とから構成される空間内で、空気・水分を含
まない溶融樹脂F1となる。次に、進退機構１１
により遮閉部材１０を、第３図に退行させてラン
ナ９を連通させると共に、プランジヤー先端部４
１により溶融樹脂F1を更に加圧すると、該樹脂は
ランナ９及びゲート８を通してキヤビテイ部８側
に圧送されることになる。なお、このとき、上記
遮閉部材１０よりもキヤビテイ部Ｂ側となるラン
ナ９及び該キヤビテイ部内に存在する空気は、溶
融樹脂F1のキヤビテイ部Ｂ側への圧送及び該キ
ヤビテイ部内への加圧注入に際して、両型１，２
のパーテイングライン間（又は、該部に設けた専
用のエアベント）を通して外部に排出されるもの
であるから、結局、リードフレームＥ上の半導体
素子を樹脂モールドする成形樹脂体F2はその内
部及び外表面のいずれにもボイドを形成すること
がないのである。 First, the lead frame E is set in the recess 6 and the molds 1 and 2 are clamped together, and the advancing/retracting mechanism 11 advances the blocking member 10 toward the runner 9 to cut off the communication state of the runner. do. Next, the resin material F is supplied into the pot 3 and heated to a required temperature, and is pressurized by the pressure section 41 at the tip of the plunger to melt it. , the resin is melted sequentially from the cull part 7 side which receives the most heat from the heating part of the mold, and the melted resin is blocked by the shielding member 10 and pumped to the cavity part B side. Therefore, since the pressurizing force of the resin material F in the pot 3 can be higher than that of the conventional device, when the resin material F is melted, the pressure contained in the pot 3 or in the resin material F itself can be reduced. The air/moisture contained therein will be discharged to the outside through the gap 5 between the pot 3 and the pressure section 41 at the tip of the plunger.
That is, the resin material F that has been heated and subjected to pressure is transferred to the plunger tip pressurizing section 4 1 as shown in FIG.
and the pot 3 and the cull part 7 and the blocked runner 9
The molten resin F 1 does not contain air or moisture in the space consisting of 1 part and 1 part. Next, the advancing/retracting mechanism 11
The shielding member 10 is retracted to the position shown in FIG. 3 to communicate with the runner 9, and the plunger tip 4
When the molten resin F 1 is further pressurized by 1 , the resin is forced to be fed to the cavity portion 8 side through the runner 9 and gate 8. At this time, the runner 9 which is closer to the cavity B than the shielding member 10 and the air present in the cavity are used to force feed the molten resin F 1 to the cavity B side and pressurize the inside of the cavity. During injection, both molds 1 and 2
As a result, the molded resin body F 2 for resin-molding the semiconductor element on the lead frame E has internal and No voids are formed on any of the outer surfaces.
（本発明の作用・効果）
本発明方法によれば、樹脂材料の加熱・加圧に
よる溶融化の過程において、ポツト内及び樹脂材
料自体に含まれる空気・水分をポツトとプランジ
ヤーとの間〓から効率良く外部に排出するため、
溶融樹脂中に空気・水分が混入することなく、従
つて、この溶融樹脂をキヤビテイ部内に加圧注入
することにより、その成形樹脂体内部或は外表面
にボイドが形成されるのを確実に防止することが
できて、この種樹脂モールド成形品に要求される
高品質性及び高信頼性の向上を図ることができる
といつた優れた効果を奏するものである。特に、
従来方法においては、樹脂モールド成形サイクル
の短縮化を図るといつた観点から、ポツト内の樹
脂材料の溶融化とそのキヤビテイ部内への加圧注
入作用を可及的に迅速に行なうようにしているこ
とから、溶融樹脂中に上記した空気等が混入する
のを避けられないといつた現状にある。更に、こ
のような弊害を除去する目的で樹脂材料の溶融化
とキヤビテイ部への圧送時間を遅くすることは、
作業能率が著しく低下するのみならず、使用され
る樹脂材料が熱硬化樹脂であることとも相俟つ
て、キヤビテイ部内への樹脂充填不足等の重大な
問題を生ずるものであるが、本発明方法によれ
ば、上述したような従来の問題点を確実に解消で
きる優れた効果を奏するものである。(Operations and effects of the present invention) According to the method of the present invention, during the process of melting the resin material by heating and pressurizing, air and moisture contained in the pot and the resin material itself are removed from between the pot and the plunger. In order to efficiently discharge to the outside,
By injecting the molten resin into the cavity under pressure, the formation of voids inside or on the outer surface of the molded resin body is reliably prevented, without air or moisture being mixed into the molten resin. This provides excellent effects such as being able to improve the high quality and high reliability required for this type of resin molded product. especially,
In the conventional method, from the viewpoint of shortening the resin molding cycle, the resin material in the pot is melted and the resin material is injected under pressure into the cavity as quickly as possible. Therefore, the current situation is that it is unavoidable that the above-mentioned air and the like are mixed into the molten resin. Furthermore, in order to eliminate such adverse effects, it is possible to slow down the time for melting the resin material and pumping it into the cavity.
This not only significantly reduces work efficiency, but also causes serious problems such as insufficient resin filling into the cavity due to the fact that the resin material used is a thermosetting resin. According to the present invention, the above-mentioned conventional problems can be reliably solved and an excellent effect can be achieved.
また、本発明装置によれば、樹脂材料の加圧部
の近傍位置側となる溶融樹脂の移送経路を連通・
遮断させることができるので、樹脂材料の加熱・
加圧による溶融化の際に、ポツト内及び樹脂材料
自体に含まれる空気・水分をポツトとプランジヤ
ーの間〓から効率良く外部に排出させ得て、その
溶融樹脂中に上記した空気等の混入を確実に防止
するといつた優れた効果を奏するものである。特
に、従来装置においては、樹脂材料の溶融化と同
時的にその圧送及びキヤビテイ部内への加圧注入
作用が行なわれることから溶融樹脂中に空気・水
分等が残溜し易い欠点があるが、本発明装置にお
いては、樹脂材料の溶融化の過程において、溶融
樹脂中から空気等を除去し、その後に、これをキ
ヤビテイ部内に加圧注入することになるから、成
形樹脂体の内部或は外表面にボイドが形成される
のを確実に防止することができるため、半導体素
子の樹脂モールド成形用金型装置として最適であ
る等の優れた効果を奏するものである。 Further, according to the device of the present invention, the molten resin transfer path near the pressurizing part of the resin material is communicated.
Since it can be shut off, heating and
During melting under pressure, the air and moisture contained in the pot and the resin material itself can be efficiently discharged to the outside from between the pot and the plunger, thereby preventing the above-mentioned air from entering the molten resin. It has excellent effects such as reliable prevention. In particular, conventional equipment has the drawback that air, moisture, etc. tend to remain in the molten resin because the resin material is simultaneously melted and simultaneously pumped and injected into the cavity under pressure. In the apparatus of the present invention, air etc. are removed from the molten resin during the process of melting the resin material, and then this is injected under pressure into the cavity, so that no air is removed inside or outside the molded resin body. Since it is possible to reliably prevent the formation of voids on the surface, it has excellent effects such as being optimal as a mold device for resin molding semiconductor elements.
図は本発明の実施例を示すものであり、第１図
はその金型装置の要部を示す縦断面図、第２図及
び第３図は本発明方法の作用説明図である。
Ａ……加圧部、Ｂ……キヤビテイ部、Ｃ……移
送経路、Ｄ……開閉機構、Ｆ……樹脂材料、３…
…ポツト、４……プランジヤー、５……間隙。
The drawings show an embodiment of the present invention, and FIG. 1 is a longitudinal sectional view showing the main parts of the mold apparatus, and FIGS. 2 and 3 are explanatory diagrams of the operation of the method of the present invention. A...Pressure part, B...Cavity part, C...Transfer route, D...Opening/closing mechanism, F...Resin material, 3...
...Pot, 4...Plunger, 5...Gap.
Claims (1)
ヤーを備えた樹脂材料の加圧部に樹脂材料を供給
する工程と、上記加圧部の近傍位置側となる溶融
樹脂の移送経路を遮断した状態で樹脂材料を加
熱・加圧して溶融化させながら該溶融樹脂中の空
気・水分を上記ポツトとプランジヤーとの間〓か
ら外部に排出する工程と、上記移送経路を連通さ
せることにより上記加圧部の空気・水分を含まな
い溶融樹脂を樹脂モールド成形用のキヤビテイ内
に加圧注入する工程とから成るトランスフアーモ
ールド成形方法。 ２ 樹脂材料の供給用ポツト及び加圧用プランジ
ヤーを備えた樹脂材料の加圧部と、樹脂モールド
成形用のキヤビテイ部と、上記加圧部とキヤビテ
イ部との間を連通させる溶融樹脂の移送経路とを
備えたトランスフアーモールド成形用金型におい
て、上記加圧部の近傍位置側に、上記移送経路を
連通・遮断させる開閉機構を配設すると共に、上
記ポツトとプランジヤーとの間に、空気・水分の
排出用間〓を設けたことを特徴とするトランスフ
アーモールド成形用金型装置。[Scope of Claims] 1. A step of supplying a resin material to a resin material pressurizing section that is equipped with a resin material supply pot and a pressurizing plunger, and a transfer route for molten resin that is located near the pressurizing section. By connecting the transfer path with the process of melting the resin material by heating and pressurizing it while blocking the air and exhausting the air and moisture in the molten resin to the outside from between the pot and the plunger. A transfer molding method comprising the step of injecting the molten resin containing no air or moisture in the pressurizing section into a cavity for resin molding under pressure. 2. A resin material pressurizing section equipped with a resin material supply pot and a pressurizing plunger, a cavity section for resin molding, and a molten resin transfer path that communicates between the pressurizing section and the cavity section. In a transfer mold molding die equipped with a transfer mold, an opening/closing mechanism for communicating and blocking the transfer path is disposed near the pressurizing part, and a mechanism for preventing air/moisture from flowing between the pot and the plunger is provided. A mold device for forming a transfer mold, characterized in that a discharge gap is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59108214A JPS60251635A (en) | 1984-05-28 | 1984-05-28 | Transfer molding method and mold therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59108214A JPS60251635A (en) | 1984-05-28 | 1984-05-28 | Transfer molding method and mold therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60251635A JPS60251635A (en) | 1985-12-12 |
| JPH0416940B2 true JPH0416940B2 (en) | 1992-03-25 |
Family
ID=14478917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59108214A Granted JPS60251635A (en) | 1984-05-28 | 1984-05-28 | Transfer molding method and mold therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60251635A (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4826931A (en) * | 1986-10-09 | 1989-05-02 | Mitsubishi Denki Kabushiki Kaisha | Tablet for resin-molding semiconductor devices |
| JPH0449016A (en) * | 1990-06-18 | 1992-02-18 | Ngk Insulators Ltd | Transfer molding method and device |
| GB2252746B (en) * | 1991-01-17 | 1995-07-12 | Towa Corp | A method of molding resin to seal an electronic part on a lead frame and apparatus therefor |
| US5275546A (en) * | 1991-12-30 | 1994-01-04 | Fierkens Richard H J | Plastic encapsulation apparatus for an integrated circuit lead frame and method therefor |
| JP2524955B2 (en) * | 1993-04-22 | 1996-08-14 | トーワ株式会社 | Method and apparatus for resin sealing molding of electronic parts |
| TW434131B (en) * | 1996-07-25 | 2001-05-16 | Matsushita Electric Works Ltd | Thermoset resin molding apparatus |
| WO2005078807A1 (en) * | 2004-02-17 | 2005-08-25 | Matsushita Electric Industrial Co., Ltd. | Photoelectric conversion plug and photoelectric conversion module using it, and production method for photoelectric conversion plug |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5986229A (en) * | 1982-11-09 | 1984-05-18 | Toshiba Corp | Semiconductor resin-sealing mold |
-
1984
- 1984-05-28 JP JP59108214A patent/JPS60251635A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60251635A (en) | 1985-12-12 |
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