JPH04165601A - Electronic device - Google Patents

Abstract

PURPOSE:To reduce in size an electronic device by using a resistance wire having a predetermined resistance value as a bonding wire. CONSTITUTION:An optical element 3 placed on a board 1, and a resistance wire 7 are provided. The lower surface of the element 3 is secured onto printed wiring 2 formed on the board 1, and one end of the element 3 is electrically connected to the wiring 2. On the other hand, the other end of the element 3 is connected to a lead pin 5 through the wire 7. In this case, if a suitable resistance value to be inserted between the element 3 and the pin 5 is 5OMEGA, the resistance wire having, for example, 10OMEGA.cm of a resistance value and 5mm of a length may be used as a bonding wire. If the length of the wiring is desirably shortened, the resistance wire having 20OMEGA.cm of a resistance value and 2.5mm of a length may be used. Thus, reductions in size and cost can be realized.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to electronic devices. More specifically, the present invention relates to a novel configuration of an electronic device that uses a small diameter wire as a wiring member and includes elements or integrated circuits connected by the wire.

Conventional technology In the field of so-called electronics, advances in device manufacturing technology and circuit integration technology have been remarkable, and recently, devices and integrated circuits with all kinds of functions are being supplied in miniaturized configurations through extreme rationalization. There is.

However, it is difficult to integrate some elements that are difficult to integrate, and parts of the circuit that require changes in characteristics and wiring depending on the application.
Elements that generate heat during operation are generally separated from other elements. Therefore, in the electronic device actually used, the integrated circuit is regarded as one element, and a plurality of elements and integrated circuits are interconnected by various wiring members.

FIG. 2 is an enlarged view of a part of an electronic device used in an optical transceiver module as a typical example of the electronic device as described above.

As shown in the figure, this electronic device is constructed by mounting an optical element 3 and a resistive element 4 on a ceramic substrate 1. Further, the electronic circuit constituted by the optical element 3 and the resistive element 4 can be configured by wiring members described below.
It is connected to the outside or another board via lead pins 5.

That is, printed wirings 2a to 2 are printed in a predetermined pattern on the substrate l.
C is formed, and the optical element 3 is mounted on the printed wiring 2a, and its lower surface is electrically connected.

Further, the other terminal of the optical element is connected to the printed wiring 2b via a bonding wire 6b.

On the other hand, the resistance element 4 is connected at one end to the printed wiring 2b and at the other end to the printed wiring 2C. Therefore, one end of the resistance element 4 is connected to the optical element 3 via the printed wiring 2b and the bonding wire 6b. Further, the printed wiring 2C is connected to the lead pin 5 via a bonding wire 6a.

When these wirings are put together, the optical element 3 includes a bonding wire 6b, a printed wiring 2b, a resistive element 4, and a printed wiring 6b.
It is connected to the lead pin 5 via the bonding wire 6a and the bonding wire 6a in this order. The lead pins 5 are terminals for connecting this electronic device to other circuits not shown.

In the electronic device configured as described above, the optical element 3 is, for example, a light receiving element, and the resistive element 4 is a resistor printed on a ceramic substrate, and has a resistance value of about 0.6 to 1.3 Ω. have. Such a configuration is often found in electronic devices such as optical transceiver modules in order to protect the optical element 3 from sudden voltage fluctuations. The printed wirings 2a, 2b, and 2c are used not only as wirings themselves, but also as a base for fixing the optical element 3 and the resistive element 4 on the substrate 1. Moreover, each bonding wire 6a, 6b usually has a diameter of 10~.

An ultrafine Au wire or the like of about 30 μm is used.

Problems to be Solved by the Invention As can be seen in the electronic device shown in Figure 2, in conventional electronic devices, in order to mount one element, a space of -L is required than the area occupied by that element. It is. That is, the second
In the example shown in the figure, printed wirings 2b and 2C are provided in order to insert the resistance element 4, but these printed wirings 2b,
A part of 2C is used as a base for fixing the resistive element 4, and the remaining area is used as a pad for connecting bonding wires 6b and 6C.

On the other hand, in all electronic devices, miniaturization as well as high performance is a universal technical issue, and in particular, it is preferable to occupy a large space as mentioned above in order to mount simple elements such as resistive elements. do not have.

Further, in the configuration shown in FIG. 2, since the signal propagation path must be long, there is a problem that noise radiation cannot be ignored, especially in applications that handle precise signals. Furthermore, since there are many connection points between the wiring members, losses at the connection points cannot be ignored.

SUMMARY OF THE INVENTION Therefore, the present invention aims to solve the problems of the prior art described above and to provide a more rational configuration of an electronic device suitable for miniaturization.

According to a means for solving the problem, that is, according to the present invention, in an electronic device including an element or an integrated circuit and a wiring member having at least one end connected to the element or integrated circuit, at least a part of the wiring member: An electronic device is provided that is characterized by being a wire having a given resistance value.

Operation The main feature of the electronic device according to the present invention is that a wire rod itself having a given resistance value is used as a bonding wire, without using a separate resistance element.

That is, in conventional electronic devices, the resistance element was an independent element, and in addition to the space occupied by the element itself, a space for connecting it to a bonding wire or the like was required.

In contrast, the electronic device according to the present invention uses a bonding wire that itself functions as a resistor, so it is possible not only to save the space occupied by the resistor element itself, but also to save the space occupied by the resistor element itself. It is also possible to reduce the space required for wiring pads. Therefore, the overall size of the electronic device can be significantly reduced.

Note that as a bonding wire that can be used as a resistor, for example, a thin Ta alloy wire can be used.
A desired resistance value can be obtained by adjusting the length, thickness, etc. of the bonding wire. That is, if the desired resistance value is large, the wire diameter of the bonding wire may be reduced or the length may be increased. Further, by reducing the wire diameter, the wiring length can also be shortened. Furthermore, if it is desired to reduce the resistance value while keeping the wiring length constant, the wire diameter may be increased or a plurality of bonding wires may be connected in parallel.

Hereinafter, the present invention will be described in more detail with reference to the drawings, but the following disclosure is only one embodiment of the present invention, and does not limit the technical scope of the present invention in any way.

Embodiment FIG. 1 is a diagram showing a specific example of the configuration of an electronic device according to the present invention, which has the same functions as the electronic device shown in FIG. Note that the same components as those of the electronic device shown in FIG. 2 are given the same reference numerals.

As shown in the figure, this electronic device includes an optical element 3 mounted on a substrate 1 and a resistance wire 7. The lower surface of the optical element 3 is fixed on printed wiring 2a formed on the substrate 1, and one end of the optical element 3 is fixed on the printed wiring 2a formed on the substrate 1.
It is also electrically connected to. On the other hand, the other end of the optical element 3 is connected to the lead bin 5 via a resistance wire 7.

In the electronic device configured as described above, if the appropriate resistance value to be inserted between the optical element 3 and the lead bin 5 is 50, then for example, a 5 mm long resistance wire with a resistance value of 10 Ω cm is inserted. Just use it.

Furthermore, if it is desired to shorten the wiring length, a resistance wire with a length of 2.5 mm and a resistance value of 20 Ω·cm can be used.

Further, in the electronic device shown in FIG. 1, the resistance wire 7 may be, for example, φ25 μ
It is also possible to use two wires with a length of 2+r+m. Furthermore, using a resistance wire 7 with the same characteristics as this, a resistance wire 6 having a diameter of 25 μm and a resistance value of Ω・cm, and having a length of 2 m.
It can also be constructed using one each of m and 1 wire rods. In this case, even if one wire is disconnected, the electrical characteristics of the circuit are not substantially affected, and higher reliability can be achieved. That is, the resistance value is adjusted by the wire length, and the reliability of the entire electronic device is improved by adjusting the resistance value within the allowable range of the required resistance value by a combination thereof.

The electronic device according to the present invention configured as described above has a first
As shown in the figure, while it has functionality and reliability equal to or greater than the conventional electronic device shown in Figure 2, the overall space occupied by the electronic device is smaller than that of the conventional electronic device shown in Figure 2. is also much smaller.

As described in detail, the electronic device according to the present invention achieves significant miniaturization by using a resistance wire having a given resistance value as a bonding wire.

Furthermore, the unique configuration of the electronic device according to the present invention also simplifies the structure of the electronic device, improving ease of manufacture and reliability at the same time.

Therefore, according to the present invention, further miniaturization and cost reduction of electronic devices can be realized.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a specific example of the configuration of an electronic device according to the present invention, and FIG. 2 is a diagram showing a typical configuration of a conventional electronic device. [Main reference numbers] 1... Board, 2a, 2b, 2c= ・EI] Printed wiring, 3... Optical element, 4... Resistance element, 5... Lead pin, 5a, 5b... Bonding wire, 7... Resistance wire patent applicant Sumitomo Electric Industries, Ltd.

Claims (1)

[Scope of Claims] An electronic device including an element or an integrated circuit, and a wiring member having at least one end connected to the element or integrated circuit, wherein at least a part of the wiring member is a wire having a given resistance value. An electronic device characterized by: