JPH04164562A - Method and device for setting area in polishing work - Google Patents

Abstract

PURPOSE:To set a polishing area optionally with an easy operation, by delivering the moving command of a polishing tool with the input positional data obtained by a direct input means being converted, and controlling the polishing tool so as to perform a polishing motion for the work surface based thereon. CONSTITUTION:A work 4 surface is recognized at its picture image by a work image pickup means 8, the recognized picture image in processed at its picture image by a picture image processing means 9, the picture image of the work surface is presented by a picture image display means 11 based on the output signal from the picture image processing means 9, and a polishing area is set by a direct input means 12 on the picture image of the work surface appeared on the display scope of the picture image display means 11. A polishing tool is subjected to a polishing motion for the work 4 surface, based on the moving command of the polishing tool which delivers the input positional data thus obtained with its conversion by a control means 10.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a region setting method and apparatus for polishing, and more specifically, to polishing the surface of a workpiece when manufacturing a workpiece such as a pocket-shaped mold. The present invention relates to a method and apparatus for setting a polishing area in a polishing process by which the polishing area can be set in advance by a simple means.

[Prior Art] For example, the production of molds, etc. first involves shape processing using a machine tool equipped with a copy control device, such as a copy milling machine or a vertical machining center, and mirror polishing using an oil grindstone, stick grindstone, diamond paste, etc. It is broadly divided into Since highly automated machine tools are used for the above-mentioned shape processing, extremely highly efficient automatic processing is possible.

However, in the subsequent polishing process,
The reality is that it relies on manual finishing by workers,
There has been a strong desire to automate this polishing process to improve work efficiency and product dimensional accuracy.

In order to meet this demand, the present applicant has previously proposed a self-copying polishing device (Japanese Patent Application Laid-Open No. 60-263662) to realize automation of polishing.

[Problems to be Solved by the Invention] By the way, in the automatic polishing process using the above-mentioned self-copying polishing device, it is necessary to set the polishing area on the workpiece surface in advance before polishing the workpiece surface with the polishing tool. . As a method for setting the polishing area, there are a method of inputting the boundary points of the polishing area as numerical data, a method of actually moving the grindstone of the polishing tool by simple means such as teaching, and teaching the trajectory.

However, with these polishing area setting methods, the polishing area setting operations such as teaching are complicated, and some precision molds in particular have extremely complicated shapes, so the polishing area setting operations described above are extremely complicated. This method is complicated and takes a lot of time, and it is difficult to confirm the setting of the polishing area. Moreover, it also requires work such as calculating coordinate values and test machining, resulting in a problem that work efficiency is significantly reduced.

Therefore, the present invention has been proposed in view of the above-mentioned problems, and an object of the present invention is to provide a method and apparatus for setting a polishing area in polishing, which can simplify the operation of setting a polishing area before polishing the surface of a workpiece. It is about providing.

[Means for Solving the Problems] As a technical means for achieving the above object, the method of the present invention provides a method for polishing the work surface by polishing the work surface with a polishing tool attached to the main shaft of a machine tool. The image is recognized by the imaging means, the recognized image is image-processed by the image processing means, and an image of the workpiece surface is displayed by the image display means based on the output signal from the image processing means, and the display screen of the image display means is A polishing area is set using a direct input means on the image of the workpiece surface that appears, and the input position data obtained by this is converted by the control means and based on a polishing tool movement command, the polishing tool is moved to the workpiece surface. This is because the polishing operation is performed on the surface.

In addition, in the method of the present invention, when correcting and polishing the workpiece surface using a polishing tool attached to the main shaft of the machine tool, the image of the workpiece surface appearing on the display screen of the image display means is corrected by direct input means. The set point of the polishing area is continuously moved, and the input position data obtained thereby is converted by the control means and the polishing tool is moved to follow the movement of the set point based on a polishing tool movement command sent out. However, it is desirable to perform a local correction polishing operation on the work surface.

Furthermore, the apparatus of the present invention includes a workpiece imaging means for image-recognizing the surface of the workpiece to be polished by a polishing tool mounted on the main shaft of the machine tool, and an image processing means for image-processing the recognized image obtained by the workpiece imaging means. an image display means for displaying an image of the workpiece surface based on an output signal from the image processing means; and a direct input means for setting a polishing area in the image of the workpiece surface appearing on the display screen of the image display means. and a control means that converts the input position data obtained by the direct input means, sends a movement command for the polishing tool, and causes the polishing tool to perform a polishing operation on the surface of the workpiece based on this command. be.

[Operation] In the method and apparatus of the present invention, the workpiece surface is imaged by the workpiece imaging means, the image is processed by the image processing means, and the image of the workpiece surface obtained thereby is displayed on the screen by the image display means. Since the polishing area is set on the image of the workpiece surface by direct input means, the operation for setting the polishing area can be simplified.

In addition, when performing correction polishing on the workpiece surface, based on the image of the workpiece surface on the above screen, the set point of the correction polishing area is continuously moved by direct input means on the screen, and the set point is By moving the polishing tool to follow, local polishing can be achieved.

[Example] An example of the area setting method and apparatus for polishing according to the present invention will be described with reference to FIGS. 1 to 5. Fig. 1 shows the external appearance of the polishing area setting device in the self-copying polishing device, and Fig. 2 shows the schematic configuration of the polishing area setting device. (not shown) in the X and Y axis directions (arrow direction in the figure)
The table (3) is movably attached to the apparatus main body (2) and is a spindle head that is movably attached in the Z-axis direction, and is positioned with high precision in the Z-axis direction. (4) is a workpiece to be polished which is removably positioned on the table (1), and includes, for example, a pocket-shaped mold as shown in FIG. here,
Hereinafter, the workpiece will be referred to as a mold. This mold (4) has a concave pocket part (5) formed on its upper surface, and the pocket part (5) has a pocket bottom part (6) and a pocket side part (
7). (8) is a CCD camera which is a workpiece imaging means fixed to the spindle head (3) facing downward;
The pocket portion (5) of the mold (4) on the table (1) is imaged from above and image recognized. Note that this workpiece imaging means may be other than the CCD camera (8).

At this time, the CCD camera (8) automatically enlarges and reduces the field of view on the table (1). In addition to the CCD camera (8), the spindle head (3) is attached with a grinding spindle (not shown) on which a grinding tool such as a grindstone is removably attached. (9) is an image processing device that is an image processing means electrically connected to the CCD camera (8);
The image signal from the D camera (8) is binarized and the binarized signal is stored and held as pixels in the frame memory. (
10) is a personal computer (hereinafter referred to as a personal computer) which is a control means attached to the device body (2),
It is electrically connected to the image processing device (9). This personal computer (IO) has the function of mechanically controlling the automatic polishing process in the self-copying polishing device, such as the positioning function of the table (1) and spindle head (3), as well as the function of calculating and processing image data captured by the CCD camera (8). Automatically controls area setting in a polishing area setting device such as the following. The relative relationship between the image captured by the CCD camera (8) and the amount of movement of the table (1), spindle head (3), etc. is determined in advance, and the actual dimensions of the image are automatically calculated from this relationship. It has built-in functionality. (11) is the above computer (10)
A display, which is an image display means provided as a part of the mold, displays an image of the surface of the mold (4) based on an output signal from the image processing device (9). (12) is a computer (
10), the polishing area of the mold (4) is directly displayed on the image of the surface of the mold (4) displayed on the display screen of the display (11). Enter and set. This direct input device W (12)
For example, a transparent touch panel or the like, which is a contact point detection device for digitizing the position of the pressed point by pressing the display screen of the display (11), is attached to the display screen of the display (11), Input is performed on the screen with the touch panel using a finger or a substitute device [pointer stick], or input is performed on the display screen of the display (11) by moving the desk on the desk in addition to input using the touch panel. There are mice that do this.

The operation of the polishing area setting device having the above configuration, that is, the polishing area setting method will be described below.

First, place the table (1) in the XSY position against the device body (2).
The mold (4) placed on the table (1) is positioned directly below the CCD camera (8) on the spindle head (3) by moving it in the axial direction, and the CCD camera (8)
By moving in the Y-axis direction, the field of view on the table (1) is enlarged or reduced so that the CCD camera (8) can properly image the surface of the mold (4) on the table (1). A CCD camera (8) is positioned and arranged.

In this state, the CCD camera (8) detects the table (1).
) on the mold (4) surface, image recognition is performed, and the image signal sent from the CCD camera (8) is sent to the image processing device (9).
). This image processing device (9) binarizes the image signal, stores the binarized signal as pixels in a frame memory, and outputs it to a personal computer (10). The computer (10) processes the image data captured by the CCD camera (8) based on the output signal from the image processing device (9), and displays the surface of the mold (4) on the table (1) on the display (11). Display.

The mold (
4) Setting the polishing area on the surface. Specifically, on the display screen, an image of the surface of the mold (4), that is, an outline of the outer periphery of the mold (4) and an outline of the concave pocket portion (5), is displayed as shown in FIG. 4(a). be done. Note that the shaded area in the figure indicates the mating surface of the upper surface of the mold (4). Now, let us consider polishing the pocket bottom portion (6) of the pocket portion (5) surrounded by the hatched area. At this time, the bottom of the pocket (
6), it is necessary to set the polishing area as shown by the chain line in FIG. 4(b).

Therefore, as shown in Figure 4(C), the display (11
) The polishing area is directly input and set using the input device (12) on the display screen. Specifically, for example, by pressing a boundary point of the polishing area with a pointer stick on the touch panel of the display screen, the pressed point position is detected and digitized, and the digitized input position data is transferred to a personal computer (10
).

In this personal computer (10), coordinate values are automatically processed based on input position data and stored and held as polishing area position data. In addition, the CCD camera (8) is attached to the spindle head (3
), the field of view and resolution of the display screen (11) will change due to movement in the Y-axis direction, but since these relative relationships have been entered into the computer (10) in advance, any Z-axis The input position will be recognized as a coordinate value. Thereafter, the personal computer (10) mechanically controls the automatic polishing process in the self-copying polishing device based on this polishing area position data. That is, the table (1) is moved in the X and Y-axis directions and the spindle head (3) is moved in the Y-axis direction according to a movement command consisting of polishing area position data output from the personal computer (10). 3) A polishing tool such as a grindstone mounted on the main shaft is moved to automatically polish the pocket bottom portion (6) of the mold (4) on the table (1).

Next, a method for setting a polishing area when performing a correction polishing process using a self-copying polishing device will be described.

First, as shown in FIG.
) The corrected polishing area is directly input and set using the input device (12) based on the image of the surface of the mold (4) displayed on the display screen. Specifically, for example, by moving the set point of the corrective polishing area continuously, for example, in a zigzag pattern with a pointing stick on the touch panel of the display screen, the set point position is detected and digitized, The digitized input position data is imported into a personal computer (10). In this personal computer (10), as described above, coordinate values are automatically processed based on input position data and stored and held as corrected polishing area position data, and based on a movement command consisting of this corrected polishing area position data, (10) mechanically controls the automatic polishing process in the self-copying polishing device, and the table (
1) Automatically correct and polish the pocket bottom part (6) of the upper mold (4).

[Effects of the Invention] According to the area setting method and apparatus for polishing according to the present invention, the boundary points of the polishing area can be input as numerical data, or the polishing tool can be actually moved as in teaching and its trajectory can be determined. The polishing area can be set arbitrarily with very simple operations without the need for complicated operations such as teaching methods for setting the polishing area. It becomes possible to check that the polishing areas overlap, which reduces the burden on the operator and significantly improves operability. This has great practical value as it reduces the burden on the operator and greatly improves operability even when locally correcting and polishing the surface of the workpiece.

[Brief explanation of the drawing]

1 to 5 are for explaining an embodiment of the area setting method and apparatus for polishing according to the present invention, and FIG. 1 is a front view showing the external appearance of the polishing area setting device in the self-copying polishing device. , FIG. 2 is a schematic configuration diagram of the polishing area setting device, FIG. 3 is a perspective view showing a mold as a specific example of the workpiece,
FIGS. 4(a) to (C) are front views of display screens showing the input procedure for setting the polishing area, and FIG. It is an explanatory view showing a polishing tool and a mold in a corrective polishing state. (4)...Workpiece, (6)...Workpiece surface, (8)...Workpiece imaging means, (9)...Image processing means, (10)...Controlling means, (11)... ...Image display means, (12)...Direct input means.

Claims (3)

[Claims] (1) When polishing a workpiece surface with a polishing tool attached to the main shaft of a machine tool, the workpiece surface is image-recognized by a workpiece imaging means,
The recognized image is image-processed by the image processing means, and an image of the work surface is displayed by the image display means based on the output signal from the image processing means, and the image of the work surface appearing on the display screen of the image display means is A polishing area is set in the image by direct input means, and the input position data obtained thereby is converted by a control means and sent out. Based on a polishing tool movement command, the polishing tool is operated to perform polishing on the work surface. A region setting method in polishing processing, characterized in that: (2) When correcting and polishing the surface of a workpiece using a polishing tool attached to the main shaft of a machine tool, the setting point of the correction polishing area is determined by direct input means to the image of the workpiece surface that appears on the display screen of the image display means. is moved continuously, and the input position data obtained thereby is converted by the control means and sent out.Based on the polishing tool movement command, the polishing tool is moved to follow the movement of the set point above, and the polishing tool is moved against the workpiece surface. 2. The area setting method for polishing according to claim 1, wherein the polishing operation is performed locally using the polishing process. (3) a workpiece imaging means for image recognition of the surface of the workpiece to be polished by a polishing tool attached to the main shaft of the machine tool; an image processing means for imaging the recognized image obtained by the workpiece imaging means; and this image processing an image display means for displaying an image of the workpiece surface based on an output signal from the means; a direct input means for setting a polishing area on the image of the workpiece surface appearing on the display screen of the image display means; and the direct input means. A polishing device comprising: a control means that converts the input position data obtained by the means, sends a movement command for the polishing tool, and, based on the command, causes the polishing tool to perform a polishing operation on the surface of the workpiece. Area setting device in machining.