JPH04111332A - Ic testing jig - Google Patents
Ic testing jigInfo
- Publication number
- JPH04111332A JPH04111332A JP22928790A JP22928790A JPH04111332A JP H04111332 A JPH04111332 A JP H04111332A JP 22928790 A JP22928790 A JP 22928790A JP 22928790 A JP22928790 A JP 22928790A JP H04111332 A JPH04111332 A JP H04111332A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- pins
- substrate
- jig
- scratches
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 238000004140 cleaning Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Connecting Device With Holders (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はIC試験用治具に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to an IC testing jig.
従来のIC試験用治具は、被試験ICの外部リードとの
電気的接続をICソケットを利用したり、リーフスプリ
ングやポゴピン等の接触子を有する治具の接触子を外部
リードに接続させて電気的に接続していた。Conventional IC test jigs make electrical connections with the external leads of the IC under test by using an IC socket, or by connecting the contacts of a jig with contacts such as leaf springs or pogo pins to the external leads. It was electrically connected.
上述した従来のIC試験用治具は、外部リードとの接触
がポゴピンやリーフスプリング等のように接触子が外部
リードの一部に固定して接触されるものについては、繰
返しの使用で接触面に半田屑等の異物が付着して接触不
良を生じたり、ICソケット等の接触片に外部リードを
擦付けながら接触させるものについては、外部リードに
擦り傷を生じたり半田屑を発生させて外部リードに付着
させる等の外観不良を生じさせる等の欠点があった。The above-mentioned conventional IC testing jigs have a tendency to damage the contact surface due to repeated use when the contact element is fixed to a part of the external lead, such as a pogo pin or a leaf spring. Foreign matter such as solder chips may adhere to the external lead, resulting in poor contact.If the external lead is brought into contact with a contact piece such as an IC socket while rubbing, it may cause scratches on the external lead or generate solder chips. There were drawbacks such as causing poor appearance due to adhesion to the surface of the surface.
本発明のIC試験用治具は、対向する両側部に設けたレ
ールを有する絶縁基板と、前記絶縁基板を貫通して設け
た接触子と、前記レールに嵌込んで絶縁基板上をスライ
ドし且つ隣合う前記接触子間を互に隔離する隔離板を有
する位置決め基板とを有する。The IC test jig of the present invention includes an insulating substrate having rails provided on opposing sides, a contact provided penetrating the insulating substrate, and a contactor that fits into the rail and slides on the insulating substrate. and a positioning board having a separating plate that isolates the adjacent contacts from each other.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第1図は本発明の一実施例を示す一部切欠平面図、第2
図は第1図の模式的断面図である。FIG. 1 is a partially cutaway plan view showing one embodiment of the present invention, and FIG.
The figure is a schematic cross-sectional view of FIG. 1.
第1図及び第2図に示すように、対向する両側部にレー
ル1を設けた絶縁基板2と、絶縁基板2を貫通して設け
たコンタクトビン3と、レール1に嵌込んで絶縁基板2
の上をスライドし、且つ隣合うコンタクトビン3の間を
互に隔離する隔離板4を設けた絶縁性位置決め基板5と
を有して構成され、被試験IC6の外部リード7を隔離
板4で仕切られたコンタクトビン3の上にのせて装着し
、外部リード7とコンタクトビン3とを接触させ電気的
に接続する。As shown in FIGS. 1 and 2, there is an insulating substrate 2 with rails 1 provided on opposing sides, a contact pin 3 provided through the insulating substrate 2, and an insulating substrate 2 fitted into the rail 1.
An insulating positioning board 5 is provided with a separator plate 4 that slides over the contact bins 3 and isolates adjacent contact bins 3 from each other. It is mounted on the partitioned contact bin 3, and the external lead 7 and the contact bin 3 are brought into contact and electrically connected.
ここで、位置決め基板5をスライドさせることにより外
部リード7はコンタクトビン3の先端上をスライドし、
コンタクトビン3の先端のセルフクリーニングが行なわ
れコンタクト不良を防止できると共に擦り傷の発生も最
小限に抑えられる。Here, by sliding the positioning board 5, the external lead 7 slides over the tip of the contact bin 3,
Self-cleaning of the tip of the contact bottle 3 is performed to prevent contact failure and to minimize the occurrence of scratches.
以上説明したように本発明は、接触子の先端に載せた外
部リードをスライドさせることにより接触子の先端をセ
ルフクリーニングすると共に接触子と外部リードとの接
触不良を防止し、擦り傷の発生も最小限に抑えられると
いう効果を有する。As explained above, the present invention self-cleans the tip of the contact by sliding the external lead placed on the tip of the contact, prevents poor contact between the contact and the external lead, and minimizes the occurrence of scratches. This has the effect of minimizing the
第1図は本発明の一実施例を示す一部切欠平面図、第2
図は第1図の模式的断面図である。
1・・・レール、2・・・絶縁基板、3・・・コンタク
トビン、4・・・隔離板、5・・・位置決め基板、6・
・・IC17・・・外部リード。FIG. 1 is a partially cutaway plan view showing one embodiment of the present invention, and FIG.
The figure is a schematic cross-sectional view of FIG. 1. DESCRIPTION OF SYMBOLS 1...Rail, 2...Insulating board, 3...Contact bin, 4...Separating plate, 5...Positioning board, 6...
...IC17...External lead.
Claims (1)
記絶縁基板を貫通して設けた接触子と、前記レールに嵌
込んで絶縁基板上をスライドし且つ隣合う前記接触子間
を互に隔離する隔離板を有する位置決め基板とを有する
ことを特徴とするIC試験用治具。an insulated substrate having rails provided on opposite sides; a contact provided through the insulated substrate; and a contact that fits into the rail and slides on the insulated substrate and isolates adjacent contacts from each other. 1. A jig for IC testing, comprising: a positioning board having a separator plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22928790A JPH04111332A (en) | 1990-08-30 | 1990-08-30 | Ic testing jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22928790A JPH04111332A (en) | 1990-08-30 | 1990-08-30 | Ic testing jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04111332A true JPH04111332A (en) | 1992-04-13 |
Family
ID=16889757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22928790A Pending JPH04111332A (en) | 1990-08-30 | 1990-08-30 | Ic testing jig |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04111332A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4892624A (en) * | 1987-09-05 | 1990-01-09 | Basf Aktiengesellschaft | Workup of distillation residues from the purification of caprolactam |
-
1990
- 1990-08-30 JP JP22928790A patent/JPH04111332A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4892624A (en) * | 1987-09-05 | 1990-01-09 | Basf Aktiengesellschaft | Workup of distillation residues from the purification of caprolactam |
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