JPH04116200A - Apparatus for supplying metal ion in electroplating - Google Patents
Apparatus for supplying metal ion in electroplatingInfo
- Publication number
- JPH04116200A JPH04116200A JP23320990A JP23320990A JPH04116200A JP H04116200 A JPH04116200 A JP H04116200A JP 23320990 A JP23320990 A JP 23320990A JP 23320990 A JP23320990 A JP 23320990A JP H04116200 A JPH04116200 A JP H04116200A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plating solution
- tank body
- metal ion
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910021645 metal ion Inorganic materials 0.000 title claims abstract description 44
- 238000009713 electroplating Methods 0.000 title claims description 16
- 238000007747 plating Methods 0.000 claims abstract description 79
- 239000002184 metal Substances 0.000 claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 27
- 239000000843 powder Substances 0.000 claims abstract description 26
- 239000010802 sludge Substances 0.000 claims abstract description 20
- 238000003756 stirring Methods 0.000 claims abstract description 10
- 238000007865 diluting Methods 0.000 claims description 4
- 238000000605 extraction Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 239000007788 liquid Substances 0.000 abstract description 10
- 238000004880 explosion Methods 0.000 abstract description 5
- 229910052742 iron Inorganic materials 0.000 abstract description 3
- 229910052745 lead Inorganic materials 0.000 abstract description 3
- 229920006362 Teflon® Polymers 0.000 abstract description 2
- 230000006866 deterioration Effects 0.000 abstract 2
- 238000007599 discharging Methods 0.000 abstract 1
- 239000011701 zinc Substances 0.000 description 23
- 239000007789 gas Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000004090 dissolution Methods 0.000 description 4
- 229910001111 Fine metal Inorganic materials 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、不溶性陽極を使用する電気めっきにおける金
属イオンの供給装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an apparatus for supplying metal ions in electroplating using an insoluble anode.
〈従来の技術〉
近年、鋼材、鋼板等の電気めっきにおいては、めっき液
中のめっき金属イオン熔解量の安定化や消費電力低減化
等のため、めっき液中にめっき金属イオンを溶出しない
不溶性陽極を使用する電気めっきが指向されている。金
属めっきとしては種々のものが使われているが、代表例
としてＺｎについて述べる。<Conventional technology> In recent years, in electroplating of steel materials, steel plates, etc., insoluble anodes that do not elute plating metal ions into the plating solution have been used to stabilize the amount of plating metal ions dissolved in the plating solution and to reduce power consumption. Electroplating using Although various metal platings are used, Zn will be described as a typical example.
不溶性陽極によるＺｎめっきでは、一般に硫酸塩浴が用
いられ、その陰、陽極の反応はそれぞれ、陰極 Ｚｎ”
＋２ ｅ −＋Ｚｎ −−−−−−（１）陽
極 ＳＯ４”−＋ｌ＋２０
− ＨｚＳＯａ ＋ １／２０ｚ↑＋２ｅ −−−−−
（２）である。すなわち、めっき液中において、（１）
式にヨルＺｎ”の減少と、（２）式によるｐＨの低下が
起こるため、金属イオンの供給を連続的に、また定期的
に行う必要がある。In Zn plating with an insoluble anode, a sulfate bath is generally used, and the reactions at the cathode and anode are respectively
+2 e −+Zn −−−−−−(1) Anode SO4”−+l+20 − HzSOa + 1/20z↑+2e −−−−−
(2). That is, in the plating solution, (1)
Since a decrease in Zn'' in the formula and a decrease in pH according to formula (2) occur, it is necessary to continuously and periodically supply metal ions.
Ｚｎめっきの場合、金属イオンの供給源としてＺｎ金属
またはその酸化物、水酸化物、炭酸塩などがあり、その
供給方法としてコスト面、作業性などから、Ｚｎ金属を
Ｚｎ”イオンの減少しためっき液に浸漬し、熔解する方
法が採られている。In the case of Zn plating, the supply source of metal ions is Zn metal or its oxides, hydroxides, carbonates, etc., and from the viewpoint of cost and workability, Zn metal is plated with reduced Zn'' ions. The method used is to immerse it in a liquid and melt it.
この時の反応は
Ｚｎ＋Ｉｌ□Ｓｏ、 →Ｚｎ５Ｏ，＋１Ｉ２７
−１３）であり、金属イオン（Ｚｎ ２’ ）の増加と
ｐｌ＋の上昇が起こる。すなわち、この（３）式の反応
により、前述したＺｎ”イオンの減少とｐｌ＋の低下を
同時に補うことができ好都合である。The reaction at this time is Zn+Il□So, →Zn5O, +1I27
-13), and an increase in metal ions (Zn 2' ) and a rise in pl+ occur. That is, the reaction of formula (3) can advantageously compensate for the aforementioned decrease in Zn'' ions and decrease in pl+ at the same time.
めっき液の金属イオンを供給する方法として従来、充填
層方式がある。Conventionally, there is a packed bed method as a method for supplying metal ions in a plating solution.
充填層方式は、例えば特開昭５８−１５１４８９号公報
等に開示されており、第３図に示すように、電解槽を出
た浴液は充填槽２６の下部の配管２７より送り込まれ、
多孔質板２８、充填亜鉛粒子２９を通過し充填槽上部の
排出間隙３０より排出され、再び電解槽へ送り込まれる
。なお、充填槽頂部の配管３１からは、発生した水素ガ
ス３２が排出される。The packed bed method is disclosed, for example, in Japanese Patent Application Laid-Open No. 151489/1989, and as shown in FIG.
It passes through the porous plate 28 and the filled zinc particles 29, is discharged from the discharge gap 30 at the top of the filling tank, and is fed into the electrolytic cell again. Note that the generated hydrogen gas 32 is discharged from the pipe 31 at the top of the filling tank.
〈発明が解決しようとする課題〉
しかし、前記の特開昭５８ｉ５１４８９号公報等に開示
されている充填層方式では、めっき液をめっき液槽へ導
出する際、フィルターの装着がないため微細な金属粉が
導出されたり、ひいてはめっき浴槽内に流入しロールに
付着した場合、めっき製品に押しキズなどが発生し、め
っき製品特性値を著しく害する恐れがある。また、スラ
ッジの除去ができない等の欠点を有している。<Problems to be Solved by the Invention> However, in the packed bed method disclosed in the above-mentioned Japanese Patent Laid-Open Publication No. 58i51489, fine metal particles are If the powder is drawn out or even flows into the plating bath and adheres to the roll, it may cause press scratches on the plated product and significantly impair the properties of the plated product. It also has drawbacks such as the inability to remove sludge.
本発明は、このような従来技術の欠点を解消した電気め
っきにおける金属イオンの供給装置を提供することを目
的とする。An object of the present invention is to provide a metal ion supply device for electroplating that eliminates the drawbacks of the prior art.
〈課題を解決するための手段〉
本発明は、不溶性陽極を用いる電気めっきにおいて、所
定の電気めっきを行うめっき浴槽からの前記金属イオン
濃度が低下した循環めっき液に、フレークＺｎを熔解さ
せて前記金属イオン濃度の上昇しためっき液を前記また
は他のめっき浴槽に供給するための電気めっきにおける
金属イオン供給装置であって、槽本体の上部にめっき液
供給口、金属粉供給口、Ｈ２ガス排出口、およびＨ２ガ
スを希釈するためのＮｔガス供給口を有し、槽本体高さ
方向中央部にめっき液排出口を有し、かつ前記めっき液
排出口に排出されるめっき液を濾過するフィルターが、
金属粉を充填保持する充填槽部および槽本体のフリーボ
ード部の内周面に設置されており、槽本体底部に蓄積し
たスラッジを定期的に抜き出すスラッジ抜き出し口を具
備するスラッジ沈降槽部をさらに有し、槽本体中央部に
金属粉を撹拌する攪拌機を有し、かつ前記攪拌機の攪拌
時にめっき液に乱流を与える邪魔板を有することを特徴
とする電気めっきにおける金属イオンの供給装置である
。<Means for Solving the Problems> In electroplating using an insoluble anode, the present invention provides for melting Zn flakes into a circulating plating solution in which the metal ion concentration has been reduced from a plating bath in which a predetermined electroplating is performed. A metal ion supply device for electroplating for supplying a plating solution with increased metal ion concentration to the above or other plating bath, which has a plating solution supply port, a metal powder supply port, and an H2 gas discharge port in the upper part of the tank body. , and a filter having an Nt gas supply port for diluting the H2 gas, having a plating solution outlet at the center in the height direction of the tank body, and filtering the plating solution discharged to the plating solution outlet. ,
Furthermore, the sludge settling tank part is equipped with a filling tank part for filling and holding metal powder and a sludge extraction port which is installed on the inner peripheral surface of the freeboard part of the tank body and periodically extracts the sludge accumulated at the bottom of the tank body. A device for supplying metal ions in electroplating, comprising: a stirrer for stirring metal powder in the center of a tank body; and a baffle plate for creating turbulence in a plating solution when the stirrer stirs. .
そして、好ましくは、前記槽本体の幅が、前記槽本体の
高さの約１／２で、前記撹拌機のインペラーの大きさが
、前記槽本体の幅の約１／４で、また、前記攪拌機のイ
ンペラーの位置が、前記槽本体の高さの約１／２である
電気めっきにおける金属イオンの供給装置である。Preferably, the width of the tank body is about 1/2 of the height of the tank body, and the size of the impeller of the agitator is about 1/4 of the width of the tank body, and This is a metal ion supply device for electroplating in which the impeller of the stirrer is located at about 1/2 of the height of the tank body.
〈作 用〉
本発明の金属イオン供給装置には、金属粉を充填保持す
る充填槽部および槽本体のフリーボード部の内周面に、
めっき液排出口に排出されるめっき液を濾過するフィル
ターが設けられているから、金属イオン濃度を上昇させ
ためっき液をめっき槽へ導出する際に、微細な金属粉が
導出されることがないので、めっき浴槽内に流入した金
属ｔ５）がＬ１−ルに付着して、めっき製品に押しキズ
などを発生し、めっき製品特性値を害する恐れが無くな
る。<Function> The metal ion supply device of the present invention includes a filling tank portion for filling and holding metal powder and an inner circumferential surface of a freeboard portion of the tank body.
Since a filter is provided to filter the plating solution discharged from the plating solution outlet, fine metal powder will not be drawn out when the plating solution with increased metal ion concentration is led to the plating tank. Therefore, there is no possibility that the metal t5) that has flowed into the plating bath will adhere to the L1-ru and cause press scratches on the plating product, thereby damaging the plating product characteristic values.
また、槽本体の底部にスラッジ沈降槽を設置したので、
電磁バルブで定期的にスラッジ（主としてＺｎ、 Ｆｅ
、 Ｎｉ、 Ｐｂ含有）を除去し、めっきに有害なＦｅ
、 Ｎｉ、 Ｐｂ等の再溶解が防止でき、めっき製品の
特性値を害する恐れが無くなる。In addition, a sludge settling tank was installed at the bottom of the tank body, so
A solenoid valve periodically removes sludge (mainly Zn, Fe).
, Ni, Pb) and removes Fe, which is harmful to plating.
, Ni, Pb, etc. can be prevented from being redissolved, eliminating the risk of damaging the characteristic values of the plated product.
Ｚｎめっきにおいては、従来法ではＺｎ （Ｏ）ｌ）
２やスラッジの発生のため、金属イオンが増加しためっ
き液にこれらが混入し、ひいてはめっき浴槽内に運ばれ
る危険性を有し、めっき品質特性値を悪化させていたが
、本発明では、フレークＺｎはほぼ完全に溶解され、溶
解装置下部よりスラッジを定期的に除去するので、その
危険性が極めて小さい。In Zn plating, the conventional method is Zn (O)l)
Due to the generation of flakes and sludge, there is a risk that these metal ions will be mixed into the plating solution and transported into the plating bath, deteriorating the plating quality characteristic values.However, in the present invention, flakes Since the Zn is almost completely dissolved and the sludge is periodically removed from the bottom of the melting device, the risk of this is extremely small.
さらに、槽本体の上部からＮ２ガスを供給し、金属粉（
例えばフレークＺｎ）の熔解時に発生するＯＸガスを希
釈するため、水素爆発などの危険が無（なる。Furthermore, N2 gas is supplied from the top of the tank body, and metal powder (
For example, since the OX gas generated when melting Zn flakes is diluted, there is no risk of hydrogen explosion.
また、本発明の金属イオン供給装置は、攪拌機により、
充填保持された金属粉を攪拌し、かつ邪魔板でめっき液
に乱流を与えることにより、金属粉の溶解促進を行うこ
とができる。Further, the metal ion supply device of the present invention uses a stirrer to
The dissolution of the metal powder can be promoted by stirring the filled and held metal powder and providing turbulent flow to the plating solution using a baffle plate.
また、本発明者らの検討によれば、本発明の金属イオン
供給装置の好ましい寸法は、槽本体の幅（Ｄ）が、槽本
体の高さ（Ｈ）の約１／２ （Ｄ輪１／２Ｈ）で、攪拌
機のインペラーの大きさ（ｄ）が、槽本体の幅（Ｄ）の
約１／４ （ｄ鴫１／４Ｄ）で、また、攪拌機のインペ
ラーの位置（ｈ）が、槽本体の高さ（Ｈ）の約１／２（
ｈＬｉ１／２Ｈ）である（第２図参照）。Further, according to the studies of the present inventors, the preferred dimensions of the metal ion supply device of the present invention are that the width (D) of the tank body is about 1/2 of the height (H) of the tank body (D wheel 1 /2H), the size (d) of the impeller of the stirrer is approximately 1/4 of the width (D) of the tank body, and the position (h) of the impeller of the stirrer is approximately 1/4 of the width (D) of the tank body. Approximately 1/2 of the height (H) of the main body (
hLi1/2H) (see Figure 2).
〈実施例〉 本発明の一実施例を図面に基づいて説明する。<Example> An embodiment of the present invention will be described based on the drawings.
第１図は、本発明の金属イオン供給装置をめっき設備に
設置した例を示す全体構成図、第２図は本発明の金属イ
オン供給装置の一実施例の詳細図である。FIG. 1 is an overall configuration diagram showing an example in which the metal ion supply device of the present invention is installed in plating equipment, and FIG. 2 is a detailed diagram of one embodiment of the metal ion supply device of the present invention.
第１図において、１はめっき浴槽、２は本発明の金属イ
オン供給装置、３はサーキュレーションタンク、４は金
属粉ホンパーである。In FIG. 1, 1 is a plating bath, 2 is a metal ion supply device of the present invention, 3 is a circulation tank, and 4 is a metal powder pumper.
サーキュレーションタンク３は、金属イオン濃度の低下
しためっき液が通過する液槽３ａと、金属イオン濃度の
上昇しためっき液が通過する液槽３ｂを有し、液槽３ａ
はパイプ５．６によりそれぞれめっき浴槽１と金属イオ
ン供給装置２に連通し、液槽３ｂはパイプ７．８により
それぞれめっき浴槽１と金属イオン供給袋Ｗ２に連通し
ている。The circulation tank 3 has a liquid tank 3a through which a plating solution with a reduced metal ion concentration passes, and a liquid tank 3b through which a plating solution with an increased metal ion concentration passes.
are connected to the plating bath 1 and the metal ion supply device 2 through pipes 5.6, respectively, and the liquid tank 3b is connected to the plating bath 1 and the metal ion supply bag W2 through pipes 7.8, respectively.
９はポンプである。9 is a pump.
そして、めっき浴槽１にて金属イオン濃度の低下しため
っき液は、パイプ５→液槽３ａからポンプ９を介して、
バイブロ→金属イオン供給装置２の上部に設けためっき
液供給口１１（第２図参照）へ送り込まれる。金属イオ
ン供給装置２内において、フレークＺｎ１Ｏの溶解によ
って前記めっき液の金属イオン濃度が上昇する。この金
属イオン濃度の上昇しためっき液は、めっき液排出口１
２（第２図参照）→バイブ７−争液槽３ｂ→パイプ８を
経て再びめっき浴槽１あるいは他のめっき浴槽に供給さ
れる。Then, the plating solution whose metal ion concentration has decreased in the plating bath 1 is transferred from the pipe 5 to the liquid tank 3a via the pump 9.
The vibro is fed into the plating solution supply port 11 (see FIG. 2) provided at the top of the metal ion supply device 2. In the metal ion supply device 2, the metal ion concentration of the plating solution increases due to the dissolution of the flakes Zn1O. This plating solution with increased metal ion concentration is removed from the plating solution outlet 1.
2 (see Fig. 2) -> vibrator 7 - liquid fighting tank 3b -> pipe 8 and is again supplied to the plating bath 1 or another plating bath.
次に第２図において、本実施例では、金属イオン供給装
置２の槽本体１３は円筒状容器からなっており、槽本体
１３の上部にめっき液供給口１１、金属粉供給口１４、
Ｈ２ガス排出口１５、およびＮ２ガス供給口１６を有す
る。Ｎ２ガス供給口１６から供給されるＮ。Next, in FIG. 2, in this embodiment, the tank body 13 of the metal ion supply device 2 is made of a cylindrical container, and the upper part of the tank body 13 has a plating solution supply port 11, a metal powder supply port 14,
It has an H2 gas exhaust port 15 and a N2 gas supply port 16. N is supplied from the N2 gas supply port 16.
ガスは、フレークＺｎ１Ｏの溶解時に発生するＨ２ガス
を希釈し爆発防止と金属粉（フレークＺｎ）の酸化を防
止する働きをする。The gas serves to prevent explosions and oxidation of the metal powder (flake Zn) by diluting the H2 gas generated when the flakes Zn1O are melted.
１２は、溶解装置のほぼ中央部の横に設けた、金属イオ
ン濃度を上昇させためっき液の排出口である。Reference numeral 12 denotes a discharge port for a plating solution that increases the concentration of metal ions, which is provided next to approximately the center of the dissolving device.
１７は、めっき液排出口１２から排出されるめっき液を
濾過する５〜１０屡のテフロン製のフィルターであり、
円筒状容器の内周面に、はぼ容器の高さ方向全域にわた
り設けである。フィルター１７により、めっき液中に含
まれる微少な金属粉がめつき液排出口から排出されるこ
とはない。17 is a 5 to 10 filter made of Teflon that filters the plating solution discharged from the plating solution outlet 12;
It is provided on the inner peripheral surface of the cylindrical container over the entire height direction of the container. The filter 17 prevents fine metal powder contained in the plating solution from being discharged from the plating solution outlet.
１８は、スランン沈降槽部１９に蓄積しためっき品質を
害する恐れのあるＦｅ、 Ｎｉ、 ｒ’ｂを含むスラッ
ジを系外に抜き出すスラッジ抜き出し口である。スラッ
ジは電磁バルブ２０により定期的に排出される。Reference numeral 18 denotes a sludge extraction port for extracting sludge containing Fe, Ni, and r'b that has accumulated in the slan settling tank 19 and that may impair the plating quality to the outside of the system. Sludge is periodically discharged by a solenoid valve 20.
２１はフレークＺｎ１Ｏを攪拌する撹拌機で、先端には
攪拌翼２２（例えば旋回外径２５０価φ、翼数４〜６枚
、攪拌出力３ ｋＷ／ボ）が装着されている。Reference numeral 21 denotes a stirrer for stirring the Zn1O flakes, and a stirring blade 22 (eg, outer diameter of rotation 250 valence φ, number of blades 4 to 6, stirring output 3 kW/bo) is attached to the tip.
２３は、円筒状容器の高さ方向のほぼ全域にわたり設置
された邪魔板であり、９０°間隔に４枚設けられている
。邪魔板２３は、攪拌機２１による撹拌時に、めっき液
に乱流を与え、フレークＺｎ１Ｏの溶解促進をなすもの
である。Reference numeral 23 denotes baffle plates installed over almost the entire height of the cylindrical container, and four baffle plates are provided at 90° intervals. The baffle plate 23 provides turbulence to the plating solution during stirring by the stirrer 21 and promotes dissolution of the Zn1O flakes.
金属粉ホンパー４内のフレークＺｎ１Ｏは、電磁バルブ
２４により、定期的（電気めっきで消費されたＺｎの算
出とフレークＺｎの溶解量の算出より）に切り出される
。フレークＺｎ１Ｏは嵩比重的１．０のものが望ましい
。The flakes Zn1O in the metal powder pumper 4 are periodically cut out by the electromagnetic valve 24 (based on calculation of Zn consumed by electroplating and calculation of the amount of dissolved Zn flakes). The Zn1O flakes preferably have a bulk specific gravity of 1.0.
なお、２５はめっき液のオーバーフロー排出口である。Note that 25 is an overflow outlet for the plating solution.
〈発明の効果〉
以上説明したように、本発明の装置により、金属イオン
濃度を上昇さセためつき液をめっき浴槽に導入しても、
押しキズの発生がなく、またスラッジを定期的に排出で
きるので、めっき製品特性値を害する危険がない。<Effects of the Invention> As explained above, with the apparatus of the present invention, even if the plating solution with increased metal ion concentration is introduced into the plating bath,
Since there are no press scratches and the sludge can be discharged periodically, there is no risk of damaging the characteristic values of the plated product.
また、本発明の装置には、金属粉（フレークＺｎ）の溶
解時に発生するＨ２ガスを希釈するためのＮ２供給口を
設けているので爆発の危険がない。Further, since the apparatus of the present invention is provided with a N2 supply port for diluting H2 gas generated when metal powder (flake Zn) is melted, there is no risk of explosion.
さらに、攪拌機及び邪魔板によってめっき液に乱流を与
え、金属粉の溶解促進をなす効果を有する。Furthermore, the stirrer and the baffle plate provide turbulent flow to the plating solution, which has the effect of promoting dissolution of the metal powder.
第１図は本発明の金属イオン供給装置をめっき設備に設
置した一実施例を示す全体構成図、第２図は本発明の金
属イオン供給装置の詳細図、第３図は従来の装置の説明
図である。
■・・・めっき浴槽、
２・・・金属イオン供給装置、
３・・・サーキュレーションタンク、
３ａ、３ｂ・・・液 槽、 ４・・・金属粉ホッパー
５．６．７．８・・・パイプ、
９・・・ポンプ、 １０・・・フレークＺ
ｎ、１１・・・めっき液供給口、 １２・・・めっき
液排出口、１３・・・槽本体、 １４・・・
金属粉供給口、１５・・・Ｈｔガス排出口、 １６
・・・Ｎ２ガス供給口、１７・・・フィルター
１８・・・スラッジ抜き出し口、
１９・・・スラッジ沈＋Ｓ槽部、 ２０・・・電磁バル
ブ、２１・・・攪拌機、 ２２・・・撹拌翼
、２３・・・邪魔板、 ２４・・・電磁バル
ブ、２５・・・オーバーフロー排出口、
２６・・・充填槽、 ２７・・・配 管、２
８・・・多孔質板、 ２９・・・充填亜鉛粒子
、３０・・・排出口、 ３１・・・配 管、
３２・・・水素ガス。
第１図FIG. 1 is an overall configuration diagram showing an embodiment of the metal ion supply device of the present invention installed in plating equipment, FIG. 2 is a detailed diagram of the metal ion supply device of the present invention, and FIG. 3 is an explanation of a conventional device. It is a diagram. ■...Plating bathtub, 2...Metal ion supply device, 3...Circulation tank, 3a, 3b...Liquid tank, 4...Metal powder hopper 5.6.7.8... Pipe, 9...Pump, 10...Flake Z
n, 11... Plating solution supply port, 12... Plating solution outlet, 13... Tank body, 14...
Metal powder supply port, 15... Ht gas discharge port, 16
...N2 gas supply port, 17...Filter 18...Sludge extraction port, 19...Sludge settling + S tank section, 20...Solenoid valve, 21...Agitator, 22...Agitator blade , 23... Baffle plate, 24... Solenoid valve, 25... Overflow outlet, 26... Filling tank, 27... Piping, 2
8... Porous plate, 29... Filled zinc particles, 30... Outlet, 31... Piping,
32...Hydrogen gas. Figure 1
Claims (2)
電気めっきを行うめっき浴槽からの前記金属イオン濃度
が低下した循環めっき液に、フレークＺｎを溶解させて
前記金属イオン濃度の上昇しためっき液を前記または他
のめっき浴槽に供給するための電気めっきにおける金属
イオン供給装置であって、槽本体の上部にめっき液供給
口、金属粉供給口、Ｈ＿２ガス排出口、およびＨ＿２ガ
スを希釈するためのＮ＿２ガス供給口を有し、槽本体高
さ方向中央部にめっき液排出口を有し、かつ前記めっき
液排出口に排出されるめっき液を濾過するフィルターが
、金属粉を充填保持する充填槽部および槽本体のフリー
ボード部の内周面に設置されており、槽本体底部に蓄積
したスラッジを定期的に抜き出すスラッジ抜き出し口を
具備するスラッジ沈降槽部をさらに有し、槽本体中央部
に金属粉を撹拌する攪拌機を有し、かつ前記撹拌機の撹
拌時にめっき液に乱流を与える邪魔板を有することを特
徴とする電気めっきにおける金属イオンの供給装置。(1) In electroplating using an insoluble anode, Zn flakes are dissolved in the circulating plating solution in which the metal ion concentration has decreased from a plating bath in which predetermined electroplating is performed, and the plating solution in which the metal ion concentration has increased is added to the plating solution. Or a metal ion supply device in electroplating for supplying to other plating baths, which has a plating solution supply port, metal powder supply port, H_2 gas outlet, and N_2 gas for diluting H_2 gas in the upper part of the tank body. A filling tank section that has a gas supply port, a plating solution discharge port at the center in the height direction of the tank body, and a filter that filters the plating solution discharged to the plating solution discharge port and fills and holds metal powder. It is installed on the inner peripheral surface of the freeboard part of the tank body, and further has a sludge settling tank part equipped with a sludge extraction port for regularly extracting the sludge accumulated at the bottom of the tank body, and has a metal plate in the center of the tank body. 1. A metal ion supply device for electroplating, comprising a stirrer for stirring powder, and a baffle plate for imparting turbulence to a plating solution during stirring by the stirrer.
で、前記撹拌機のインペラーの大きさが、前記槽本体の
幅の約１／４で、また、前記攪拌機のインペラーの位置
が、前記槽本体の高さの約１／２である請求項１記載の
電気めっきにおける金属イオンの供給装置。(2) The width of the tank body is approximately 1/2 of the height of the tank body
Claim 1, wherein the size of the impeller of the agitator is about 1/4 of the width of the tank body, and the position of the impeller of the agitator is about 1/2 of the height of the tank body. A supply device for metal ions in electroplating as described above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23320990A JPH04116200A (en) | 1990-09-05 | 1990-09-05 | Apparatus for supplying metal ion in electroplating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23320990A JPH04116200A (en) | 1990-09-05 | 1990-09-05 | Apparatus for supplying metal ion in electroplating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04116200A true JPH04116200A (en) | 1992-04-16 |
Family
ID=16951470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23320990A Pending JPH04116200A (en) | 1990-09-05 | 1990-09-05 | Apparatus for supplying metal ion in electroplating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04116200A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030041039A (en) * | 2001-11-19 | 2003-05-23 | 주식회사 포스코 | Apparatus and method for maintaining the concentration of the ferrous ion for the electroplating process |
| JP2007162086A (en) * | 2005-12-15 | 2007-06-28 | Nippon Steel Corp | Sludge separator for electrotin plating solution |
| KR100960378B1 (en) * | 2002-11-15 | 2010-05-28 | 주식회사 포스코 | Film removal device formed on the anode of plating equipment |
| JP2010202941A (en) * | 2009-03-04 | 2010-09-16 | Mitsubishi Materials Corp | Sn ALLOY PLATING APPARATUS AND METHOD OF REPLENISHING Sn COMPONENT FOR THE SAME |
| KR20160140483A (en) * | 2015-05-29 | 2016-12-07 | 램 리써치 코포레이션 | Electrolyte delivery and generation equipment |
-
1990
- 1990-09-05 JP JP23320990A patent/JPH04116200A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030041039A (en) * | 2001-11-19 | 2003-05-23 | 주식회사 포스코 | Apparatus and method for maintaining the concentration of the ferrous ion for the electroplating process |
| KR100960378B1 (en) * | 2002-11-15 | 2010-05-28 | 주식회사 포스코 | Film removal device formed on the anode of plating equipment |
| JP2007162086A (en) * | 2005-12-15 | 2007-06-28 | Nippon Steel Corp | Sludge separator for electrotin plating solution |
| JP2010202941A (en) * | 2009-03-04 | 2010-09-16 | Mitsubishi Materials Corp | Sn ALLOY PLATING APPARATUS AND METHOD OF REPLENISHING Sn COMPONENT FOR THE SAME |
| KR20160140483A (en) * | 2015-05-29 | 2016-12-07 | 램 리써치 코포레이션 | Electrolyte delivery and generation equipment |
| JP2017020102A (en) * | 2015-05-29 | 2017-01-26 | ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ | Electrolyte delivery and generation apparatus |
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