JPH04102411U - Semiconductor pellet recognition device - Google Patents

Abstract

(57) [Summary] [Purpose] To prevent a semiconductor pellet recognition device from erroneously determining a memory area that is an internal pattern of a pellet as a characteristic defective mark. [Structure] By specifically irradiating the memory area 19 that appears black on the semiconductor pellet 9 with the illumination units 7 and 8 so that it becomes white in the binarized image, the memory area 19 is made to have poor characteristics. Prevent misjudgment as a mark.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

The present invention relates to a mounting device for semiconductor pellets, especially for positioning the pellets. The present invention relates to a recognition device.

0002

[Conventional technology]

The recognition method in the conventional semiconductor pellet mount device is as shown in Figure 4. An imaging camera 1 that recognizes the conductor pellet 9 and a variable magnification lens located below it 3a, and is fixed to the imaging camera 1 in the vertical direction. It is fixed so that the optical axis is aligned with the lens barrel 2 of the camera. In this recognition device, The light from the bright unit 8 is reflected by the half mirror 4 inside the lens barrel 2, and the semiconductor pellet 9, the reflected light is transmitted to the image processing control unit 21 by the imaging camera 1. The amount of positional deviation of the semiconductor pellet 9 is calculated based on the XY table. A signal is transmitted to bull 12, and the position of the semiconductor pellet is corrected. Also, semiconductor pellets When the size of the pellet 9 is small, adjust the variable magnification lens 3a to remove the semiconductor pellet. Adjust the variable magnification lens 3a when projecting a large image or when the size is large. This is useful for improving positional accuracy by having the image display monitor 20 enter the image display monitor 20.

0003

[Problem that the idea aims to solve]

In the conventional recognition device, the internal pattern of the semiconductor pellet 9 as shown in FIG. Since the reflected light from the memory area 19 appears black, the characteristic defect mark remains even after image processing. The problem is that the product is judged as 18 and a good product is mistakenly recognized as a defective product. was there. The memory area portion 19 on this pellet differs depending on the pellet type. Therefore, it was difficult to make adjustments using the irradiation unit 8 to produce a white image.

0004 The purpose of the present invention is to provide a semiconductor pellet recognition device that solves the above problems. It's there.

[0005]

[Means to solve the problem]

In order to achieve the above object, in the semiconductor pellet recognition device according to the present invention, , a semiconductor pellet that recognizes a semiconductor pellet mounted on a lead frame In the recognition device of an imaging camera that inputs an image of the semiconductor pellet; A lighting unit that powerfully illuminates a specific location on a semiconductor pellet through a slit plate. and, and a pair of variable magnification lenses respectively provided on the imaging camera and the illumination unit, This process processes the image of a specific position of the semiconductor pellet to make it white in the binarized image. .

[0006] Further, the device has a mechanism for synchronously driving and controlling the pair of variable magnification lenses. Ru.

[0007]

[Effect]

The center of the semiconductor pellet 9 is irradiated particularly brightly, and the black part on the semiconductor pellet 9 is illuminated. The memory area 19 that is This prevents the area 19 from being erroneously determined as a characteristic defective mark.

[0008]

【Example】

Next, the present invention will be explained with reference to the drawings.

[0009] (Embodiment 1) FIG. 1 is a configuration diagram showing Embodiment 1 of the present invention. In the figure, half An imaging camera 1 is arranged perpendicularly to the conductor pellet 9, and an optical axis of the camera 1 is There is an epi-illumination unit 7 fixed in parallel, and the magnification is variable under each unit. Lenses 3a and 3b are each fixed. Also, magnification is possible with epi-illumination unit 7. A slit plate 6 having a square or round hole is fixed between the variable lenses 3b. A half mirror 4 is fixed at a position where the optical axes on the imaging camera 1 and the illumination unit 8 intersect. A half mirror 5 is placed at the intersection of the optical axes of the epi-illumination unit 7 and the illumination unit 8. is fixed. Also, on the XY table 12, there is a The semiconductor pellet 9 is mounted on an adhesive sheet 10. It is peeled off by the push-up unit 11.

0010 In this recognition device, the light from the illumination unit 8 is transmitted to the half mirror 4 in the lens barrel 2a. , and irradiates the semiconductor pellet 9. Also, the light from the epi-illumination unit 7 is , narrowed into a square or round shape by the slit plate 6, and condensed by the variable magnification lens 3b. is reflected by the half mirrors 5 and 4, and a spot-like illumination is produced on the semiconductor pellet 9. Apply. FIG. 3 is a diagram after image processing, in which the slits formed into square shapes by the slit plate 6 are shown. The pot light brightly illuminates the semiconductor pellet 9. 16 is the irradiation range of the slit plate shows. The image from the imaging camera 1 is input to the control unit 21, and the control unit 21 The XY table 12 is driven and controlled based on the image signal. On the other hand, from the control section 21 A signal is input to the monitor 20, and the image displayed on the monitor 20 is a semiconductor pellet. The memory area 19 above 9 is erased and appears white. Also, the defective mark 18 disappears. Therefore, it is difficult for errors to occur in the determination of good and defective products.

[0011] (Embodiment 2) FIG. 2 is a configuration diagram showing Embodiment 2 of the present invention. In this example, Variable magnification lenses 3a, 3 fixed below the imaging camera 1 and epi-illumination unit 7 b has a structure in which it is interlocked with a gear or pulley and a timing belt 15. , has a driving pulse motor 14 on the outside, and the lens is synchronously driven by the pulse motor 14. The magnification of the lenses 3a and 3b changes. According to this method, the size of the semiconductor pellet 9 changes, by changing the magnification variable lens 3a, the semiconductor pellet 9 can be This has the advantage that the spot irradiation area 16 also changes automatically.

0012

[Effect of the idea]

As explained above, the present invention has a slit in the lens barrel fixed parallel to the imaging camera 1. The spot plate illuminates the center of the semiconductor chip to be positioned particularly brightly, The memory area on the body pellet that appears black is processed as white in the binarized image. Therefore, depending on the shape of the pattern of the semiconductor pellet, it is possible to distinguish between good products and defective products without adjusting the lighting. Misrecognition of non-defective products can be reduced. In addition, the variable magnification ratio of the lighting unit The magnification can be changed by rotating the lens and the variable magnification lens of the imaging camera in synchronization. Even if the chip size is changed, the spot diameter will change according to the chip size. It changes automatically and has the effect of improving the recognition rate.

[Brief explanation of drawings]

FIG. 1 is a configuration diagram showing a first embodiment of the present invention.

FIG. 2 is a configuration diagram showing a second embodiment of the present invention.

FIG. 3 is a diagram showing an image in an embodiment of the present invention.

FIG. 4 is a configuration diagram showing a conventional example.

FIG. 5 is a diagram showing an image of a conventional example.

[Explanation of symbols]

1 Imaging camera 2a, 2b lens barrel 3a, 3b variable magnification lens 4,5 Half mirror 6 Slit plate with square or round holes 7,8 Lighting unit (lamp) 9 Semiconductor pellets 10 Adhesive sheet 11 Push-up unit 12 XY table 14 Drive pulse motor 15 Gears or pulleys and timing belts 16 Illumination range of slit plate 6 18 Bad pellet mark 19 Memory area of semiconductor pellet 20 Image display monitor 21 Image processing control unit

Claims (2)

[Scope of utility model registration request] Claim 1: A semiconductor pellet recognition device that recognizes a semiconductor pellet mounted on a lead frame, which includes an imaging camera that inputs an image of the semiconductor pellet, and a specific position of the semiconductor pellet that is powerfully irradiated through a slit plate. A semiconductor pellet comprising an illumination unit and a pair of variable magnification lenses respectively provided on an imaging camera and an illumination unit, and processing an image at a specific position of the semiconductor pellet as white in a binarized image. recognition device. 2. The semiconductor pellet recognition device according to claim 1, further comprising a mechanism for synchronously driving and controlling the pair of variable magnification lenses.