JPH04107857U - semiconductor equipment - Google Patents

Abstract

(57) [Summary] [Structure] Each of the output buffers 1a to 1d is provided with at least one bonding pad 2a to 2d for supplying driving power or for grounding. [Effect] Since the length of wiring for supplying the driving power source or ground potential inside the pellet can be minimized, parasitic effects such as resistance and inductance components can be significantly reduced, and deterioration of electrical characteristics can be reduced.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

This invention relates to semiconductor devices, and in particular to output buffers, which are output circuits for external drive. The present invention relates to a semiconductor device.

0002

[Conventional technology]

A conventional semiconductor device of this type has an island of a lead frame, as shown in FIG. Output buffers 1a to 1 formed inside the semiconductor pellet 6 mounted on the board portion 7 1d is arranged, and the external driving power supply or ground potential is connected to terminal 4 and the Aluminum connected to bonding pad 2 via bonding wire 5 The signal was supplied to the individual output buffers 1a to 1d through metal wiring 8 such as a film.

0003

[Problem that the idea aims to solve]

The conventional semiconductor device described above is Due to the limitations of Parasitic effects such as pulse components may occur, causing deterioration of electrical characteristics such as pulse rise and fall times. This has the problem of being a cause.

0004 The purpose of this invention is to solve the above problems and to reduce the deterioration of electrical characteristics of semiconductors. The goal is to provide equipment.

[0005]

[Means to solve the problem]

The semiconductor device of the present invention has each output buffer, which is an output circuit for external drive. At least one bonding pad for supplying drive power or grounding for each Configured with the necessary features.

[0006]

【Example】

Next, embodiments of the present invention will be described with reference to the drawings.

[0007] FIG. 1 is a partial plan view showing an embodiment of the semiconductor device of the present invention.

[0008] As shown in FIG. 1, the semiconductor device of this example has an island portion of a lead frame. Output buffers 1a to 1d formed inside the semiconductor pellet 6 mounted on the semiconductor pellet 7 are arranged, and bonding pads corresponding to the respective output buffers 1a to 1d are arranged. 2a to 2d. The external driving power supply or ground potential is connected to terminals 4a to 4a. 4d and the corresponding bonding wires 5a to 5d, respectively. are connected to the ground pads 2a to 2d, and the individual It is supplied to output buffers 1a to 1d.

[0009] Therefore, since the length of the wiring 3 can be minimized, it is possible to minimize the length of the wiring 3. Compared to supplying drive power or ground potential through internal wiring, resistance and inductance are required. Parasitic effects such as gas components can be significantly reduced.

0010

[Effect of the idea]

As explained above, the semiconductor device of the present invention has a Equipped with at least one bonding pad for power supply or grounding This minimizes the length of the wiring for supplying the drive power or ground potential inside the pellet. As a result, parasitic effects such as resistance and inductance components can be significantly reduced. This has the effect of reducing deterioration of physical characteristics.

[Brief explanation of the drawing]

FIG. 1 is a partial plan view showing an embodiment of a semiconductor device of the present invention.

FIG. 2 is a partial plan view showing an example of a conventional semiconductor device.

[Explanation of symbols]

1 Output buffer 2 Bonding pad 3,8 Wiring 4 terminal 5 Bonding wire 6 pellets 7 Island part

Claims (1)

[Scope of utility model registration request] 1. A semiconductor device comprising at least one bonding pad for supplying driving power or grounding for each output buffer that is an output circuit for external driving.