JP7748260B2 - Laser Processing Equipment - Google Patents

Description

The technology disclosed herein relates to a laser processing device.

Patent Document 1 discloses an example of a laser processing device. Specifically, the laser processing device according to Patent Document 1 includes a laser beam deflection unit (laser beam scanning unit) that deflects laser beams, a housing that houses the laser beam deflection unit, and an exit window formed on the underside of the housing that transmits the laser beam deflected by the laser beam deflection unit.

JP 2019-104047 A

In order to block the laser light, it is possible to cover the periphery of the laser light path.

However, in the case of a laser processing device with an emission window formed on the underside of the housing, as in the case of the laser processing device disclosed in Patent Document 1, attaching a light-blocking member or the like to the underside of the housing would result in the space required for installing the device expanding vertically. This is inconvenient when it comes to achieving a compact installation space for the housing of the laser processing device.

The technology disclosed here was developed in light of these issues, and its purpose is to achieve a compact installation space while blocking laser light.

A first aspect of the present disclosure relates to a laser processing device that processes a workpiece by irradiating an irradiation area with laser light. This laser processing device includes a laser beam deflection unit that deflects the laser beam according to predetermined processing settings, and a housing that houses the laser beam deflection unit.

According to a first aspect of the present disclosure, the housing is formed with a first housing portion having an optical element through which the laser light deflected by the laser light deflector toward the irradiation area passes, and a second housing portion having at least a portion of the periphery of the optical element protruding toward the irradiation area beyond the optical element.

According to the first aspect, the housing is formed with a first housing section in which the optical element is provided, and a second housing section that protrudes and surrounds the periphery of the optical element. The second housing section can block laser light that has passed through the optical element. Furthermore, by utilizing part of the housing to block laser light, the installation space for the housing can be made more compact compared to a configuration in which a light-blocking element is attached to the underside of the housing.

Furthermore, according to a second aspect of the present disclosure, the first housing may house a laser light output unit that generates laser light to be deflected by the laser light deflection unit, and the second housing may house a heat sink thermally coupled to the laser light output unit.

According to the second aspect, the optical system can be centrally arranged in the first housing, eliminating the need for a component that deflects the laser light in the direction from the optical component toward the irradiation area. This contributes to a more compact housing.

Furthermore, according to a third aspect of the present disclosure, the housing may have an exit surface on which an exit window having the optical member is formed, and the illumination area may be covered by the exit surface.

Furthermore, according to a fourth aspect of the present disclosure, a mark may be provided on the outer surface of the housing, the mark being positioned corresponding to the position of the illumination area.

According to the fourth aspect, by providing marks on the outer surface of the housing, it becomes easier to position the housing. This makes it easier to install the housing than before.

Furthermore, according to a fifth aspect of the present disclosure, the housing may have an open surface that is at least partially open so as to communicate with the optical element.

Furthermore, according to a sixth aspect of the present disclosure, the open surface may be provided with a cover member that can open the open surface.

Furthermore, according to a seventh aspect of the present disclosure, the workpiece may be formed of a sheet-like film transported along a predetermined movement path, and an area of the movement path onto which the laser light is irradiated corresponding to the irradiation area may be positioned so as to be farther away from the optical element in the protruding direction of the second housing section than the end of the second housing section in the protruding direction.

According to the seventh aspect, for example, if the protruding direction is aligned with the downward direction, the area of the workpiece movement path onto which the laser light is irradiated will be located below the lower end of the second storage unit (farther away from the optical member in the downward direction than the lower end). By arranging it in this way, it is possible to prevent the workpiece from entering the second storage unit, and ultimately to prevent interference between the second storage unit and the workpiece.

Furthermore, according to an eighth aspect of the present disclosure, the workpiece may be formed of a sheet-like film that is wrapped around a conveying roller and conveyed in the longitudinal direction by the rotation of the conveying roller, and the center line passing through the center of the optical element may be offset upstream or downstream in the conveying direction of the workpiece with respect to the apex of the conveying roller on the optical element side.

According to the eighth aspect, the top of the transport roller is positioned offset in the transport direction relative to the center of the optical element. This positioning allows the workpiece before and after being wound around the transport roller to face the optical element. This makes it easier to set a long linear path before and after the transport roller within the workpiece transport path. Furthermore, by separating the top of the transport roller from the optical element, a longer distance can be secured between the transport roller and the optical element, which also contributes to improved maintainability.

Furthermore, according to a ninth aspect of the present disclosure, the center line passing through the center of the optical element may be offset to either the upstream or downstream side in the conveying direction, whichever side has the smaller inclination of the workpiece relative to a plane perpendicular to the center line.

For example, if the center line is aligned vertically, the plane perpendicular to the center line will coincide with the horizontal plane. According to the eighth aspect, the center line is offset to one side that is approximately coincident with the horizontal plane. This allows the side with the gentler slope to be the target of laser light irradiation, improving print quality.

A tenth aspect of the present disclosure relates to a laser processing device that processes a workpiece by irradiating an irradiation area with laser light. This laser processing device includes a laser beam deflection unit that deflects the laser beam by driving a first mirror according to predetermined processing settings, and a housing that houses the laser beam deflection unit and has a plate-like member that separates a space that includes a portion of the optical path of the laser beam connecting the first mirror and the irradiation area that is closer to the irradiation area from a space that houses a member.

According to the tenth aspect, the housing is divided into a space including the optical path closer to the irradiation area and a space for accommodating components. The former space can block the laser light immediately before it reaches the irradiation area. Furthermore, by utilizing a portion of the housing space to block the laser light, the installation space for the housing can be made more compact compared to a configuration in which a light-blocking member is attached to the underside of the housing.

As described above, the present disclosure makes it possible to block laser light while achieving compact installation space.

FIG. 1 is a diagram illustrating an example of the overall configuration of a laser processing system. FIG. 2 is a block diagram illustrating a schematic configuration of the laser processing device. FIG. 3A is a perspective view illustrating an example of the appearance of the marker head. FIG. 3B is a perspective view illustrating an example of the appearance of the marker head. FIG. 4 is a side view of the marker head. FIG. 5 is a perspective view illustrating a state in which the cover member is removed from the marker head. FIG. 6 is a rear view of the marker head. FIG. 7 is a diagram illustrating an example of a connection structure of an electric cable in a marker head. FIG. 8 is a perspective view illustrating an example of a housing structure for the marker head. FIG. 9 is a perspective view illustrating an example of a housing structure for the marker head. FIG. 10 is a cross-sectional view schematically illustrating the internal structure of the marker head. FIG. 11 is a longitudinal sectional view schematically illustrating the internal structure of the marker head. FIG. 12 is a side view schematically illustrating the main parts inside the substrate accommodating section. FIG. 13 is a side view schematically illustrating the main parts inside the crystal housing portion. FIG. 14 is a perspective view illustrating a schematic example of the main parts inside the mirror housing portion. FIG. 15 is a perspective view for explaining deflection of the laser beam by the laser beam scanning unit. FIG. 16 is a perspective view for explaining deflection of the laser beam by the laser beam scanning unit. FIG. 17A is a schematic diagram for explaining the replacement of the printing device and the marker head. FIG. 17B is a perspective view for explaining attachment of the marker head to the support member. FIG. 18 is a diagram for explaining various dimensions of the marker head and the support member. FIG. 19 is a flowchart illustrating a basic control process of the laser processing apparatus. FIG. 20 is a block diagram for explaining the circuit structure of the power supply unit. FIG. 21 is a flowchart showing a specific example of a control process for the power supply unit. FIG. 22 is a perspective view showing a modified example of the mounting surface and the attachment. FIG. 23 is a schematic diagram showing a further modification of the mounting surface.

Embodiments of the present disclosure will be described below with reference to the drawings. Please note that the following description is for illustrative purposes only.

In other words, although this specification describes a laser marker as an example of a laser processing device, the technology disclosed herein can be applied to laser-applied equipment in general, regardless of whether it is called a laser processing device or a laser marker.

In addition, while this specification describes printing as a typical example of processing, it is not limited to printing and can be used in any processing using laser light, such as image marking.

<Overall structure>
Fig. 1 is a diagram illustrating an example of the overall configuration of a laser processing system S, and Fig. 2 is a diagram illustrating a schematic configuration of a laser processing device L in the laser processing system S. Also, Fig. 17A is a schematic diagram for explaining the replacement of a printing device 1001 with a marker head 1, and Fig. 17B is a perspective view for explaining the attachment of the marker head 1 to a support member 501.

The laser processing system S illustrated in Figure 1 includes a laser processing device L and an external device 400 connected to it. Of these, the laser processing device L illustrated in Figures 1 and 2 is configured to irradiate a predetermined irradiation area R1 with laser light, thereby performing processing on a workpiece W according to a predetermined processing pattern Pp.

The irradiation area R1 here refers to an area set on the surface of the workpiece W, and can take various forms depending on the relative positional relationship between the laser processing device L and the workpiece W, the specifications of the laser processing device L, the movement path of the workpiece W, etc. The irradiation area R1 in this embodiment is configured as a rectangular area as shown in Figure 1.

In particular, the laser processing device L according to this embodiment can emit laser light having a wavelength of around 350 nm as laser light for processing the workpiece W. This wavelength corresponds to the ultraviolet wavelength range. Therefore, in the following description, the laser light for processing the workpiece W will sometimes be referred to as "UV laser light" to distinguish it from other laser light, such as near-infrared light. Note that laser light other than ultraviolet light, such as infrared light, may also be used to process the workpiece W.

The following describes a case where the workpiece W to be processed is made of a sheet-like film, and the film contains a UV reactive layer that chemically reacts with UV laser light.

However, the workpiece W that can be processed by the laser processing device L according to the present disclosure is not limited to films containing a UV-reactive layer. Films that chemically react with laser light having wavelengths other than ultraviolet light may also be used, and workpieces W made of various materials, such as paper and synthetic resin, may also be processed.

In addition, the laser processing device L according to this embodiment is configured to perform so-called two-dimensional printing by scanning the laser light in two dimensions, but as will be described later, this laser processing device L is configured to have a deep focal depth, so it can also perform so-called three-dimensional printing. Therefore, this laser processing device L can even process a workpiece W being transported along a three-dimensional movement path, as shown in Figure 18, which will be described later.

As shown in Figures 1 and 2, the laser processing device L according to this embodiment includes a marker head 1, a marker controller 100, an electrical cable 200, and an operation terminal 300.

Of these, the marker controller 100 accepts settings related to the processing pattern, can supply power to the outside, and is configured as a controller for controlling the marker head 1.

On the other hand, the marker head 1 can emit laser light toward the irradiation area R1 by being controlled by the marker controller 100.

In this embodiment, the marker head 1 and the marker controller 100 are separate entities and connected by an electrical cable 200. This electrical cable 200 includes at least electrical wiring that transmits power from the inside of the marker controller 100 (specifically, the power supply unit 104, described below) to the outside. Specifically, the electrical cable 200 in this embodiment is configured by bundling together electrical wiring for transmitting power and signal wiring for sending and receiving analog signals, digital signals, etc.

The marker head 1 according to this embodiment is installed on processing equipment 500, which processes a workpiece W made of a sheet-like film. As shown in Figures 17A and 17B, this processing equipment 500 includes a support member 501 that supports the marker head 1 and a transport roller 502 around which the workpiece W is wrapped.

17B and 18, the processing equipment 500 further includes two rail members 503l and 503r that slidably support the marker head 1 via the support member 501, two fixed members 505 and 506 to which the ends of the two rail members 503l and 503r are attached, and a first driven roller 504l and a second driven roller 504r that are driven when the workpiece W is transported by the drive of the transport roller 502. In this case, it is preferable that the workpiece W is wrapped around the transport roller 502 so that the contact length between the transport roller 502 and the workpiece W is longer than the contact length between the first driven roller 504l and the workpiece W and also longer than the contact length between the second driven roller 504r and the workpiece W. This makes it less likely that the workpiece W will slip on the transport roller 502 when the transport roller 502 transports the workpiece W. Note that the "contact length" referred to here refers to the length as seen in a cross section perpendicular to the rotation axis of each of the conveying roller 502, first driven roller 504l, and second driven roller 504r.

In this way, the workpiece W in this embodiment can be a workpiece that is transported while wrapped around the transport roller 502, and the transport roller 502 used in this case may be positioned so that it overlaps with the irradiation area R1 in the vertical direction (Z direction, described below), as shown, for example, in Figure 1, the lower diagram of Figure 17A, and Figure 18.

As shown in Figure 17A, the support member 501 can attach the laser processing device L, particularly the housing 10 of the marker head 1, to a predetermined mounting position. Figures 1, 17A, and 17B show examples of a support member 501 configured to suspend the housing 10 from above, but as described below, the housing 10 may also be supported from other directions, such as the side.

On the other hand, the transport roller 502 is cylindrical with a central axis extending in the short direction of the workpiece W (the front-to-back direction described below). In this case, the workpiece W is transported in the long direction (the left-to-right direction described below) along a predetermined movement path by the rotation of the transport roller 502.

Here, as shown in the upper and lower diagrams of Figure 17A, the processing equipment 500 according to this embodiment is shared between the marker head 1 according to this embodiment and a printing device 1001 that prints using a method other than laser light.

In other words, the marker head 1 according to this embodiment is configured to be attached in place of the printing device 1001 to the support member 501 of the processing equipment 500 configured to mount the printing device 1001.

An example of a printing device 1001 that can replace the marker head 1 is a thermal transfer overprinter (TTO), but it can also be replaced with other printing devices 1001.

The printing device 1001 that can replace the marker head 1 may be, for example, one that includes a roughly rectangular parallelepiped housing 1010 that has a printing surface 1010d that exposes the printing section 1006 that contacts the printing area on the workpiece W, and a connection surface 1010u that is different from the printing surface 1010d and can be connected to the support member 501.

In this case, as shown in the upper and lower diagrams of Figure 17A, the marker head 1 is supported by a support member 501 that can be connected to the connection surface 1010u, similar to the printing device 1001. The marker head 1 thus supported processes the workpiece W by irradiating laser light toward an irradiation area R1 that is set corresponding to the printing area (the area that comes into contact with the printing unit 1006 in the printing device 1001).

On the other hand, the operation terminal 300 has, for example, a central processing unit (CPU) and memory, and is connected to the marker controller 100 via wire or wirelessly so as to be able to send and receive electrical signals.

The operation terminal 300 functions as a terminal for setting various processing conditions (also called printing conditions), such as print settings, and for displaying information related to the processing of the workpiece W to the user. This operation terminal 300 is equipped with a display unit 301 for displaying information to the user, an operation unit 302 for accepting operation inputs from the user, and a storage device 303 for storing various information.

For example, the display unit 301 can be configured with a liquid crystal display or an organic EL panel. The operation unit 302 can be configured with a keyboard and a pointing device. Pointing devices include a mouse, joystick, etc. Instead of such a pointing device, the operation unit 302 may be configured with, for example, a touch panel console directly connected to the marker controller 100.

The operation terminal 300 configured as described above can set processing conditions for laser processing based on operation input by the user. These processing conditions include one or more of the content of the character string and graphic to be printed on the workpiece W (processing pattern Pp), the target output of the laser light (laser power), and the scanning speed of the laser light on the workpiece W (scan speed).

The processing conditions set by the operation terminal 300 are output to the marker controller 100 and stored in the memory unit 102 of the marker controller 100. If necessary, the memory device 303 of the operation terminal 300 may store the processing conditions.

The operation terminal 300 can also be integrated into the marker controller 100, for example.

The external device 400 is connected to the marker controller 100 as needed. In the example shown in Figures 1 and 2, the external device 400 includes a conveying speed sensor 401 and a programmable logic controller (PLC) 402.

The conveying speed sensor 401 is configured, for example, by a rotary encoder, and is capable of detecting the conveying speed of the workpiece W. The conveying speed sensor 401 outputs a signal (detection signal) indicating the detection result to the marker controller 100. The marker controller 100 controls the two-dimensional scanning of the laser light, etc., based on the detection signal input from the conveying speed sensor 401.

The PLC 402 is configured, for example, by a microprocessor, and can input control signals to the marker controller 100. The PLC 402 is used to control the laser processing system S according to a predetermined sequence.

In addition to the above-mentioned equipment and devices, the laser processing device L can be connected wirelessly or via wire to devices for operation and control, computers for performing various other processes, storage devices, peripheral devices, etc.

Below, we will first provide a detailed explanation of the hardware configuration of the marker head 1 and the marker controller 100, and then provide an overview of how the marker controller 100 controls the marker head 1.

<Marker Controller 100>
As shown in Figure 2, the marker controller 100 includes an acceptance unit 101 that accepts settings (processing settings) regarding processing conditions including processing patterns, a memory unit 102 that stores the processing conditions, a control unit 103 that controls the marker head 1 based on the processing conditions, and a power supply unit 104 that serves as a power source unit that supplies power to the marker head 1.

(Reception unit 101)
The receiving unit 101 is configured to receive processing conditions input via the operation terminal 300 and to output the received processing conditions to the storage unit 102 and/or the control unit 103 .

Specifically, the reception unit 101 according to this embodiment is electrically connected to the operation terminal 300, and can display a setting screen (not shown) for setting each processing condition on the aforementioned display unit 301 of the operation terminal 300. The reception unit 101 can reflect the content input through the setting screen in each processing condition, and output the reflected processing conditions to the memory unit 102 and/or control unit 103.

(Storage unit 102)
The memory unit 102 is configured to temporarily or continuously store the processing conditions received by the receiving unit 101, and to output the stored processing conditions to the control unit 103, display unit 301, etc., as necessary.

Specifically, the storage unit 102 according to this embodiment is configured using non-volatile memory such as a hard disk drive (HDD) or a solid state drive (SSD), and can temporarily or continuously store data indicating processing conditions.

(Control unit 103)
The control unit 103 is configured to perform processing on the workpiece W in accordance with the processing conditions by controlling the power supply unit 104, the laser light output unit 4, the laser light scanning unit 5, etc. based on the processing conditions.

Specifically, the control unit 103 according to this embodiment is composed of a processor, volatile memory, an input/output bus, etc. This control unit 103 generates control signals based on the processing conditions read from the storage unit 102 or input directly from the reception unit 101, and controls the processing of the workpiece W by outputting the generated control signals to each part of the laser processing device L.

For example, when starting to process the workpiece W, the control unit 103 reads the target output, which is one of the processing conditions, from the memory unit 102 and inputs a control signal generated in relation to that target output to the power supply unit 104, etc., thereby controlling the generation of laser excitation light.

(Power supply unit 104)
The power supply unit 104 supplies a drive current to the excitation light generation unit 2 based on a control signal output from the control unit 103. Although details are omitted, the power supply unit 104 determines a drive current based on a target output input from the control unit 103, and supplies the determined drive current to the excitation light generation unit 2. The power supply unit 104 supplies power to the excitation light generation unit 2, and can be configured by a DC power supply 104a or the like, as exemplified in Fig. 20 described below. Details of the power supply unit 104 will be described later.

In this embodiment, the excitation light generation unit 2, which is composed of an excitation light source such as a laser diode, is configured to be built into the marker head 1, not the marker controller 100. Power supplied from the power supply unit 104 is supplied to the excitation light generation unit 2 via the aforementioned electrical cable 200.

<Marker head 1>
3A and 3B are perspective views illustrating the appearance of the marker head 1. Fig. 4 is a side view of the marker head 1, Fig. 5 is a perspective view illustrating the marker head 1 with the cover member 13 removed, and Fig. 6 is a rear view of the marker head 1.

Furthermore, Figure 7 is a diagram illustrating the connection structure of the electric cable 200 in the marker head 1, and Figures 8 and 9 are perspective views illustrating the housing structure of the marker head 1. Furthermore, Figure 10 is a cross-sectional view that schematically illustrates the internal structure of the marker head 1, and Figure 11 is a longitudinal cross-sectional view that schematically illustrates the internal structure of the marker head 1. The cross-section in Figure 10 roughly coincides with the A-A cross-section in Figure 11.

Furthermore, Figure 11 is a longitudinal cross-sectional view that schematically illustrates the internal structure of the marker head 1, Figure 12 is a side view that schematically illustrates the main parts of the substrate housing section H13, and Figure 13 is a side view that schematically illustrates the main parts of the crystal housing section H12.

In addition, Figure 14 is a perspective view that schematically illustrates the main parts inside the mirror housing section H11, and Figures 15 and 16 are perspective views that explain the deflection of laser light by the laser light scanning section.

(Schematic configuration of marker head 1)
As shown in Figure 2, the marker head 1 has, as its main components, an excitation light generating unit 2, an excitation light guiding unit 3 as a light guiding optical system, a laser light output unit 4, and a laser light scanning unit 5 as a laser light deflection unit.

As will be described in more detail below, the excitation light generation unit 2 generates excitation light for exciting laser light based on power supplied via the electric cable 200. The excitation light guide unit 3 guides the excitation light generated by the excitation light generation unit 2 and inputs it to the laser light output unit 4. The laser light output unit 4 has a solid-state laser crystal 41 that generates laser light based on the excitation light guided by the excitation light guide unit 3.

The laser light scanning unit 5 also includes a first scanner 51 that drives a first mirror 51a so that the laser light generated by the solid-state laser crystal 41 is irradiated toward the desired position in the irradiation area R1, and a first control board 53 that controls this first scanner 51.

More specifically, the laser light scanning unit 5 according to this embodiment is configured using a so-called two-axis (X-axis and Y-axis) galvanometer scanner, and in addition to a first scanner 51 acting as a Y-scanner, it also has a second scanner 52 acting as an X-scanner and a second control board 54 that controls this second scanner 52.

The laser light scanning unit 5 controls the first scanner 51 via the first control board 53 and the second scanner 52 via the second control board 54, thereby driving the first mirror 51a of the first scanner 51 and the second mirror 52a of the second scanner 52.

At this time, the laser beam scanning unit 5, which serves as a laser beam deflection unit, drives the first mirror 51a and the second mirror 52a in accordance with predetermined processing settings (settings related to the processing pattern Pp), thereby deflecting the laser beam generated by the laser beam output unit 4 so that it is irradiated toward the desired position in the irradiation area R1.

The marker head 1 also includes a housing 10 that houses the aforementioned components, namely, the excitation light generation unit 2, the excitation light guide unit 3, the laser light output unit 4, and the laser light scanning unit 5. This housing 10 is formed with an exit window 6 that transmits the laser light deflected by the first mirror 51a of the laser light scanning unit 5 (i.e., the laser light irradiated toward the irradiation area R1 via the laser light scanning unit 5).

Below, we will explain the external configuration of the marker head 1 (specifically, the configuration of the six sides of the housing 10) and the internal structure of the marker head 1 in order.

(Outer surface of the housing 10)
As shown in Fig. 3A, the housing 10 of the marker head 1 is configured as a roughly rectangular parallelepiped with a longer dimension in the front-to-rear direction (the direction from the right and front side to the left and depth side in Fig. 3A) compared to the left-to-right direction (the direction from the left and front side when viewed from the front of the housing 10 to the right and depth side when viewed from the front of the housing 10 in Fig. 3A). Note that "left and right" in this specification refers to left and right as seen by a user facing the housing 10.

Hereinafter, the front-to-back direction of the housing 10 will be referred to as the X direction, the left-to-right direction as the Y direction, and the height direction as the Z direction. In particular, the depth of the paper in Figure 3A in the X direction will be referred to as the +X direction, and the front side of the paper in Figure 3A in the Y direction will be referred to as the -X direction. Similarly, the front side of the paper in Figure 3A in the Y direction will be referred to as the +Y direction, and the depth side of the paper in Figure 3A in the Z direction will be referred to as the -Z direction. Similarly, the top side of the paper in Figure 3A in the Z direction will be referred to as the -Z direction, and the bottom side of the paper in Figure 3A in the +Z direction.

For convenience, the definition given here is based on the external shape of the housing 10, but instead of, or in addition to, this definition, a definition based on the operating direction and positional relationship of each component housed in the housing 10 can also be used.

For example, the first direction, which is the deflection direction of the first mirror 51a, can be defined as the Y direction, and the second direction, which is the deflection direction of the second mirror 52a, can be defined as the X direction. In this embodiment, the deflection direction of the mirror included in the laser light scanning unit 5 and driven refers to the direction in which the irradiation position within the irradiation area R1 is scanned by driving the mirror. In other words, when the first mirror 51a is driven and rotated, the irradiation position within the irradiation area R1 is scanned in the Y direction. Furthermore, when the second mirror 52a is driven and rotated, the irradiation position within the irradiation area R1 is scanned in the X direction. Similarly, the irradiation direction, which is the direction from the marker head 1 toward the irradiation area R1, or more specifically, the direction from the exit window 6 toward the irradiation area R1, can be considered the Z direction. The irradiation direction may also be defined as the direction from the first mirror 51a toward the irradiation area R1. In this embodiment, the "direction from a certain component toward the irradiation area R1" refers to one of the axial directions in which the certain component and the irradiation area R1 face each other. The "direction from a certain component toward the illuminated area R1" does not refer to the direction in which light travels from a certain component toward the illuminated area R1. Therefore, although the illumination position in the illuminated area R1, i.e., the direction in which light travels toward the illuminated area R1, changes depending on the rotation of the first mirror 51a and the second mirror 52a, the illumination direction in this embodiment does not change in accordance with the change in the direction in which the light travels.

In the following description, we will assume that the definition based on the external shape of the housing 10 is consistent with the definition based on the deflection direction and irradiation direction of the first mirror 51a and the second mirror 52a.

As shown in Figures 3A to 7, the housing 10 has a bottom surface 10d on which the exit window 6 is formed, and a top surface 10u that faces the bottom surface 10d and therefore the exit window 6. For example, the bottom surface 10d faces the +Z direction, while the top surface 10u faces the -Z direction, and both are made of one or more plate-like members that have a thickness in the Z direction. Note that "facing" here refers to conceptual facing when the housing 10 is considered to be a conceptual rectangular parallelepiped.

The housing 10 further has a bottom surface 10d, a top surface 10u, a front surface 10f, a back surface 10b, a left side surface 10l, and a right side surface 10r that surround the excitation light generation unit 2, the excitation light guide unit 3, the laser light output unit 4, and the laser light scanning unit 5.

The front surface 10f, rear surface 10b, left side surface 10l, and right side surface 10r all face in a direction perpendicular to the top surface 10u and bottom surface 10d (i.e., in a direction along the XY plane). For example, the front surface 10f faces in the -X direction, while the rear surface 10b faces in the +X direction, and both are made of one or more plate-like members that have a thickness in the X direction. Similarly, for example, the left side surface 10l faces in the +Y direction, while the right side surface 10r faces in the -Y direction, and both are made of one or more plate-like members that have a thickness in the Y direction.

The six sides of the housing 10 will be described in order below. Note that the term "side" in the context of the bottom side 10d, top side 10u, front side 10f, back side 10b, left side side 10l, and right side side 10r also includes plate-like members having a certain thickness. Furthermore, these six sides are merely classified for convenience and do not need to be separate from one another. For example, at least one of the left side side 10l and the right side side 10r and at least a portion of the bottom side 10d (particularly the non-offset portion 18, described below) may be integrally formed.

-Top surface 10u-
3A, the top surface 10u of the six surfaces constituting the housing 10 extends along the X and Y directions and is formed as a rectangular plate with a longer dimension in the X direction than in the Y direction. The top surface 10u in this embodiment is connected to a support member and serves as a mounting surface to be mounted at the mounting position. In this case, the thickness of the top surface 10u is greater than the thicknesses of the left side surface 10l and the right side surface 10r.

The top surface 10u, which serves as the mounting surface, is provided with an attachment 7 that can be attached to a target mounting position. The attachment 7 is configured as a plate-like member that extends in directions (X and Y directions) substantially parallel to the top surface 10u and has a thickness in a direction (Z direction) perpendicular to the top surface 10u. The attachment 7 is placed on the top surface 10u and, as shown in Figure 10, is fastened to the top surface 10u with fasteners 7b such as bolts. As mentioned above, the thickness of the top surface 10u is greater than the thicknesses of the left side surface 10l, right side surface 10r, etc. Increasing the thickness of the top surface 10u is advantageous in ensuring an insertion clearance for the fasteners 7b.

The top surface of the attachment 7 has fastening holes 7a that correspond to the support member 501 that will be placed in the mounting position. With the support member 501 placed on the attachment 7, the support member 501 can be attached to the attachment 7 by fastening a fastener such as a bolt into the fastening holes 7a. This allows the top surface 10u to be attached to the mounting position via the attachment 7, and simultaneously allows the housing 10 to be suspended from the support member 501.

-Bottom 10d-
4, the bottom surface 10d of the six surfaces is disposed on the opposite side of the top surface 10u across the laser light scanning unit 5. As shown in FIG. 5, the bottom surface 10d is formed in a curved shape that extends along the X direction and has a central portion in the Y direction recessed toward the −Z side.

Specifically, as shown in Figures 5 and 10, the bottom surface 10d according to this embodiment has an offset portion 16a located in the center in the Y direction and offset toward the -Z side, and non-offset portions 18 located at both ends in the Y direction and protruding toward the +Z side compared to the offset portion 16a. Both the offset portion 16a and the non-offset portion 18 are formed to extend flatly along the X direction.

In detail, the bottom surface 10d according to this embodiment has an offset portion 16a as its upper base and a groove with a trapezoidal cross section that widens toward the +Z side. The exit window 6 is provided in the offset portion 16a, which serves as the upper base. The bottom surface 10d according to this embodiment is configured as an exit surface on which the exit window 6 is formed. Details of the exit window 6 will be described later.

On the other hand, the non-offset portion 18 constitutes the portion of the bottom surface 10d that extends from the hypotenuse of the trapezoid to the +Z end. The non-offset portion 18 in this embodiment is composed of a first plate-shaped member 18l located on the +Y side of the offset portion 16a, and a second plate-shaped member 18r located on the -Y side of the offset portion 16a.

As shown in Figure 10, the first plate-shaped member 18l is formed in a thin plate shape and has an inverted L-shape when viewed from the -X side. Here, "inverted L-shape" refers to a shape obtained by inverting an L-shape with respect to an axis of symmetry extending in the Z direction. The first plate-shaped member 18l is disposed on the opposite side of the second plate-shaped member 18r across the offset portion 16a. The vertical side of the inverted L-shape of the first plate-shaped member 18l forms the oblique side on the +Y side of the trapezoid, and the horizontal side of the inverted L-shape forms the +Z side end of the +Y side.

As shown in Figure 10, the second plate-shaped member 18r is formed in a thin plate shape and is L-shaped when viewed from the -X side. The second plate-shaped member 18r is positioned on the opposite side of the first plate-shaped member 18l, with the offset portion 16a sandwiched between them. The vertical side of the L-shape of the second plate-shaped member 18r forms the oblique side on the -Y side of the trapezoid, and the horizontal side of the L-shape forms the +Z side end of the -Y side.

Also, as shown in FIG. 10, the first plate-shaped member 18l, together with the lower half of the left side surface 10l, covers the exit window 6 from the +Y side. Meanwhile, the second plate-shaped member 18r, together with the lower half of the right side surface 10r, covers the exit window 6 from the -Y side. In this way, the first plate-shaped member 18l and the second plate-shaped member 18r, together with the lower half of the left side surface 10l and the lower half of the right side surface 10r, form a skirt-shaped cover (skirt portion).

-Front 10f-
As shown in Figures 3B and 5, the front surface 10f of the six surfaces extends along the YZ direction and is formed in a plate shape having an indicator 11, two ventilation holes 12, 12, and a notch 10c.

As shown in Figures 3B and 5, the indicator 11 is located near the upper right edge of the front surface 10f and consists of three lamps 11a, 11b, and 11c lined up in the Y direction (shown only in Figure 5). Each of the three lamps 11a, 11b, and 11c is composed of a light-emitting diode (LED) electrically connected to the marker controller 100. Hereinafter, the three lamps 11a, 11b, and 11c will be referred to as the first lamp 11a, the second lamp 11b, and the third lamp 11c, starting from the +Y side.

The first lamp 11a is composed of, for example, a blue LED, and lights up blue in conjunction with a key switch (not shown) provided on the laser processing device L. Note that the "key switch" referred to here is a switch that is switched using a key managed by a safety manager or the like. By inserting the key into the laser processing device L and turning it in a predetermined direction, the device switches between an "OFF" state, which corresponds to a power-off state, a "POWER ON" state, which corresponds to a power-on state and does not permit laser light emission, and a "LASER ON" state, which corresponds to a power-on state and permits laser light emission.

On the other hand, the second lamp 11b is configured to be switchable between green and orange, and the light color changes depending on the state of the key switch and various other conditions. The third lamp 11c is configured to be switchable between green, orange, and red, and the light color changes depending on the state of the key switch and various other conditions.

The first lamp 11a, second lamp 11b, and third lamp 11c are each electrically connected to the marker controller 100 and are configured to light up in response to a control signal input from the control unit 103. Details of the control of the indicator 11 will be described later.

As shown in Figures 3B and 5, one of the two ventilation holes 12, 12 is located on the lower side of the front surface 10f near the left end, and the other of the two ventilation holes 12, 12 is located on the lower side of the front surface 10f near the right end. Both of the two ventilation holes 12, 12 penetrate the front surface 10f in the thickness direction, and each communicates with the second storage section H2, which will be described later.

As shown in Figures 3B and 5, the cutout 10c is formed by cutting out a portion of the front surface 10f that includes the lower end, and is connected to the front end (the end on the -X direction side) of the offset portion 16a. The cutout 10c is positioned between the two air vents 12, 12 in the Y direction.

More specifically, the notch 10c is formed in a generally trapezoidal shape that tapers in diameter in the +Z direction so that its cross section roughly matches the cross section of the trapezoid with the offset portion 16a as its upper base. By providing the notch 10c in its lower half, the front surface 10f in this embodiment is configured as an at least partially open user-access surface (open surface) that leads to the exit window 6 via the offset portion 16a.

-Details of the front 10f 1 (dust collector and camera)-
The cutout 10c according to this embodiment can be used for various purposes in addition to maintenance of the exit window 6 (for example, cleaning performed by inserting a cleaning tool through the cutout 10c).

Generally, when a UV laser is irradiated onto a workpiece W such as film, smoke is generated. Therefore, a dust collector separate from the marker head 1 may be connected to the front surface 10f, and the smoke may be sucked in through the cutout 10c. Note that instead of attaching the dust collector externally to the marker head 1, such as connecting it to the front surface 10f, the dust collector may be built into the marker head 1.

In addition, after a UV laser is irradiated onto a workpiece W such as film to perform the printing process, a camera may be built into or attached externally to the marker head 1 to inspect the printed content. Such a camera may be attached, for example, to the cutout 10c or the offset portion 16a. In the former case, a reflective mirror may be provided around the exit window 6 so that the irradiation area R1 can be imaged from as directly above (-Z side) as possible. Lighting may also be provided around the camera or exit window 6 to obtain the brightest possible image.

--Details of the front surface 10f 2 (cover member 13 and open/close sensor)--
A cover member 13 that can open and close the front surface 10f is attached to the front surface 10f as an open surface. The cover member 13 has a first cover part 13a fixed to the upper half of the front surface 10f, a second cover part 13b that can swing to open and close the lower half of the front surface 10f, particularly the open portion defined by the notch 10ca, and a hinge mechanism 13c that connects the first cover part 13a and the second cover part 13b (see FIGS. 3A and 3B).

The first cover part 13a is formed in a rectangular plate shape that covers the upper half of the front face 10f and has a through-hole (number omitted) formed in approximately the same position as the indicator 11. The first cover part 13a is fixed to the upper half of the front face 10f with fasteners such as screws.

The second cover part 13b is formed in the shape of a rectangular plate that can cover the lower half of the front surface 10f, particularly the cutout 10c, and has through holes (reference numerals omitted) formed in approximately the same positions as the two air vents 12, 12. The second cover part 13b is supported by the first cover part 13a via a hinge mechanism 13c.

The hinge mechanism 13c is located in the center of the front surface 10f in the Z direction and pivotally connects the upper edge of the second cover part 13b to the lower edge of the first cover part 13a.

With the first cover portion 13a fixed to the front surface 10f, the hinge mechanism 13c can swing the second cover portion 13b around a rotation axis extending in the Y direction (see Figures 3A and 3B). By swinging the second cover portion 13b in the opening direction, the cutout 10c in the front surface 10f can be exposed. By exposing the cutout 10c, various maintenance tasks, such as cleaning the exit window 6, can be performed through the offset portion 16a connected to the cutout 10c.

Note that the cover member 13 is not required. The front surface 10f may be exposed without providing the cover member 13.

In addition, although not shown, an opening/closing sensor that detects whether the cover member 13 is open or closed may be provided on at least one of the cover member 13 (particularly the second cover portion 13b) and the front surface 10f (particularly the area surrounding the notch 10c on the front surface 10f).

Such an open/close sensor can be, for example, a magnetic sensor consisting of a magnet provided on one of the second cover portion 13b and the front surface 10f, and a magnetic sensor (e.g., a Hall element) provided on the other of the second cover portion 13b and the front surface 10f. Note that a magnetic sensor is merely one example, and optical sensors, mechanical sensors, etc. may also be used.

This magnet sensor is electrically connected to the marker controller 100 and/or the circuit board inside the marker head 1, and can output a detection signal indicating the open/closed state of the cover member 13, particularly the second cover portion 13b, to the marker controller 100 and/or the circuit board.

By providing such an open/close sensor, it is possible to detect the open/closed state of the cover member 13 and perform various controls based on that open/closed state. As one example, the marker controller 100 according to this embodiment will emergency stop the emission of laser light if the cover member 13 is opened while laser light is being emitted. After that, by closing the cover member 13 and performing an operation to release the emergency stop via the operation unit 302, it is possible to resume the emission of laser light.

If the cover member 13 is considered to be one outer surface of the housing 10, this cover member 13 will be visible to the user when attaching the marker head 1, etc. In this case, a first mark M1 can be attached to, for example, the second cover portion 13b of the cover member 13, as shown in Figure 3A.

The first mark M1 is composed of a first center line M11 indicating the center of the irradiation area R1 (the intersection of the diagonal lines of the irradiation area R1), a +Y edge M12 indicating the edge on the +Y side of the irradiation area R1, and a -Y edge M13 indicating the center on the -Y side of the irradiation area R1.

Note that the cover member 13 is not required. If the front surface 10f is considered to be the outer surface of the housing 10 without providing the cover member 13, the first mark M1 can also be attached to the front surface 10f.

-Back side 10b-
3B and 5 , the rear surface 10b, one of the six surfaces, is disposed on the opposite side of the laser beam scanning unit 5 from the front surface 10f, and is formed in a plate shape extending along the YZ direction. The rear surface 10b according to this embodiment can be regarded as one outer surface of the housing 10 (an outer surface different from the cover member 13), and serves as a connection surface to which an electric cable 200 that supplies power to the inside of the housing 10 is connected. The rear surface 10b as a connection surface, together with the front surface 10f as an open surface, the top surface 10u as a mounting surface, and the bottom surface 10d as an emission surface, surrounds the laser beam scanning unit 5 as a laser beam deflection unit.

As shown in Figure 7, a connection cover 14 is provided on the rear surface 10b, which serves as the connection surface, to cover the connection portion between the rear surface 10b and the electric cable 200. This connection cover 14 restricts the extension direction Ae of the electric cable 200 so that the electric cable 200 is unwound in the in-plane directions (YZ directions) of the rear surface 10b, more specifically, in the in-plane directions (YZ directions) that intersect the irradiation direction (Z direction) (Y direction).

In other words, the connection cover 14 is configured to unwind the electric cable 200 in a direction (Y direction or Z direction) perpendicular to the X direction, which is the direction connecting the front surface 10f and the back surface 10b.

Specifically, the connection cover 14 according to this embodiment includes an enclosure 14a that surrounds the connection terminal with the electric cable 200 in the marker head 1, a lid 14b that closes the enclosure 14a, a sealing member 14c that provides a liquid-tight seal between the enclosure 14a and the lid 14b, and a wire diameter conversion connector 14d that adjusts the wire diameter of the electric cable 200.

Of these, the enclosure 14a is formed to surround the connector opening on the back surface 10b from the sides (YZ directions). Specifically, the enclosure a in this embodiment is formed in the shape of a thin rectangular box that opens in the +X direction.

When the enclosure 14a is considered to be a thin box, the bottom surface 14e has two openings (reference numerals omitted), each leading to a different connection terminal. Of the multiple side walls that make up the enclosure 14a, the left wall 14f facing the +Y side has a first through-hole 14g that penetrates the left wall 14f along the Y direction, which is the extension direction Ae. When the electric cable 200 is inserted through this first through-hole 14g, its extension direction Ae is restricted.

The wire diameter conversion connector 14d is disposed inside the enclosure 14a and is housed in a storage space partitioned by the enclosure 14a and the lid 14b. The electrical cable 200 according to this embodiment is composed of a first cable portion 201 that extends from the marker controller 100 and connects to the wire diameter conversion connector 14d, and a second cable portion 202 that extends from the wire diameter conversion connector 14d and connects to the connection terminal of the marker head 1. The wire diameter of the second cable portion 202 is set smaller than that of the first cable portion 201 so that it fits the connection terminal of the marker head 1.

In other words, in this embodiment, the electrical cable 200 is connected to the marker head 1 with its wire diameter converted by the wire diameter conversion connector 14d.

Generally, there is a need to change the cable length of the electric cable 200 depending on the installation environment of the marker head 1. Here, if an electric cable 200 longer than normal is used, there is a concern of voltage drop compared to a relatively short electric cable, so one possible solution is to use an electric cable 200 with a larger wire diameter.

As such, since the wire diameter of the electrical cable 200 can change depending on the installation environment of the marker head 1, it is possible to consider using the wire diameter conversion connector 14d as described above. However, simply using the wire diameter conversion connector 14d raises concerns about water exposure at the connection between the first cable portion 201 and the wire diameter conversion connector 14d, and at the connection between the second cable portion 202 and the wire diameter conversion connector 14d.

In response to this, as shown in Figure 7, by housing the wire diameter conversion connector 14d within the connection cover 14, it is possible to prevent water from getting into the aforementioned connection parts. This makes it possible for the marker head 1 to be adapted to a wider range of installation environments.

-Left side 10l-
As shown in Figures 3A, 3B and 10, the left side surface 10l of the six surfaces is arranged on the +Y side with respect to the laser light scanning unit 5, and is formed in a plate shape extending along the ZX direction.

If the left side surface 10l is considered to be one of the outer surfaces of the housing 10, this left side surface 10l will be visible to the user when attaching the marker head 1. As shown in Figure 3A, a second mark M2 can also be attached to this left side surface 10l.

The second mark M2 is composed of a second center line M21 indicating the center of the irradiation area R1 (the intersection of the diagonal lines of the irradiation area R1), a +X edge M22 indicating the edge on the +X side of the irradiation area R1, and a -X edge M23 indicating the edge on the -X side of the irradiation area R1.

-Right side 10r-
4, 5, and 10, the right side surface 10r of the six surfaces is disposed on the -Y side with respect to the laser beam scanning unit 5, and is formed in a plate shape extending along the ZX direction. The right side surface 10r is disposed on the opposite side of the left side surface 10l with the laser beam scanning unit 5 in between.

If the right side surface 10r is considered to be one of the outer surfaces of the housing 10, a third mark M3 configured in the same manner as the second mark M2 can be attached to this right side surface 10r.

The third mark M3 is composed of a third center line M31 indicating the center of the irradiation area R1 (the intersection of the diagonal lines of the irradiation area R1), a +X edge M32 indicating the edge on the +X side of the irradiation area R1, and a -X edge M33 indicating the edge on the -X side of the irradiation area R1.

Note that it is not necessary to have both the second mark M2 and the third mark M3; it may be possible to have either the second mark M2 or the third mark M3.

(Internal space of the housing 10)
The housing 10 defines an internal space surrounded by six sides: a bottom side 10d, a top side 10u, a front side 10f, a rear side 10b, a left side side 10l, and a right side side 10r. This internal space is divided into multiple storage sections by plate-like members arranged inside the housing 10.

The marker head 1 according to this embodiment has a first base plate 15, a second base plate 16, and a third base plate 17 as such plate-like members. In this embodiment, the first base plate 15, the second base plate 16, and the third base plate 17 are separate from one another. Of these plate-like members, the first base plate 15 is configured as a support plate capable of supporting the solid-state laser crystal 41.

The structure of each plate-shaped member will be explained in order below.

-First base plate 15-
8, 9, and 10, the first base plate 15 is configured as a metal plate-like member extending in the X direction and is housed in the housing 10 (in other words, it is surrounded by six sides of the housing 10). The thickness of the first base plate 15 is set to be greater than the thickness of at least the left side surface 10l and the right side surface 10r of the six sides of the housing 10.

In particular, the first base plate 15 according to this embodiment has an inverted L-shape when viewed from the -X side. Here, "inverted L-shape" refers to a shape obtained by inverting an L-shape with respect to an axis of symmetry extending in the Z direction. Hereinafter, the portion of the first base plate 15 corresponding to the vertical side of the inverted L-shape may be referred to as the vertical side portion 15a, and the portion corresponding to the horizontal side of the inverted L-shape may be referred to as the horizontal side portion 15b.

The first base plate 15 is positioned between the left side surface 10l and the right side surface 10r in the Y direction, and is positioned on the +Y side of the second base plate 16. The first base plate 15 is positioned on the +Y side of the third base plate 17, with the second base plate 16 in between.

Here, a sealing member (not shown) is provided between the left end (end on the +Y side) of the horizontal side portion 15b and the left side surface 10l of the housing 10 to liquid-tightly seal the gap between the first base plate 15 and the left side surface 10l.

The first base plate 15 is positioned below the top surface 10u in the Z direction.

Here, as shown in the boxed area C1 in Figure 10, the upper end (the end on the -Z side) of the vertical side portion 15a faces the top surface 10u with a predetermined gap between them. This causes the first base plate 15 to be non-integral with the top surface 10u of the housing 10 (a state in which relative displacement of the first base plate 15 with respect to the top surface 10u is permitted).

If one of the six outer surfaces of the housing 10 other than the top surface 10u is used as the mounting surface, instead of providing a gap between the top surface 10u and the vertical side portion 15a, a gap may be provided between the outer surface used as the mounting surface and the first base plate 15. For example, if the left side surface 10l of the housing 10 is used as the mounting surface, a gap can be provided between the left end of the horizontal side portion 15b and the left side surface 10l.

The first base plate 15 is disposed between the front surface 10f and the rear surface 10b in the X direction. As shown in Figure 11, the first base plate 15 is fixed to the front surface 10f by front-side fasteners 15c and to the rear surface 10b by rear-side fasteners 15d.

In other words, the first base plate 15, which serves as a support plate, is attached to the housing 10 via the front surface 10f and back surface 10b while remaining separate from the top surface 10u, which serves as the mounting surface.

Next, to describe the vertical side portion 15a in detail, the vertical side portion 15a in this embodiment is formed as a thick plate extending along the Z direction, which is the irradiation direction, and the X direction. As shown in Figure 11, at least two through holes 15e, 15f are formed in the vertical side portion 15a.

Of the two through holes 15e, 15f, the second through hole 15e located on the +X side is used to optically couple the excitation light guide unit 3 and the laser light output unit 4. The second through hole 15e forms the first entrance window 91 that allows excitation light to enter the laser light output unit 4 from the excitation light guide unit 3.

Of the two through holes 15e, 15f, the third through hole 15f located on the -X side is used to optically couple the laser light output unit 4 and the laser light scanning unit 5. An optical member 15h, such as glass that transmits laser light, is fitted into the third through hole 15f. The third through hole 15f and the optical member 15h, together with the fifth through hole 50b described below, form a second entrance window 92 that allows laser light to enter the laser light scanning unit 5 from the laser light output unit 4.

Of the two left and right side surfaces of the vertical side portion 15a, the left side surface facing the +Y side forms a partition surface 15g that defines the crystal housing section H12 (described below). Various optical components, including the solid-state laser crystal 41, are fastened to this partition surface 15g.

Furthermore, of the left and right side surfaces of the vertical side portion 15a, the right side surface facing the -Y side supports the first casing 50 from the left, which defines the mirror housing section H11 described below. Instead of supporting the first casing 50 with the right side surface of the vertical side portion 15a, this right side surface may define part of the mirror housing section H11.

Next, to describe the horizontal side portion 15b in more detail, the horizontal side portion 15b in this embodiment is formed as a thick plate extending in the X and Y directions. As shown in Figure 10, a first heat sink 81, which serves as a heat sink in this embodiment, is provided on the underside of the horizontal side portion 15b.

The first heat sink 81 is composed of multiple fins that protrude in the +Z direction. These fins are aligned in the Y direction. Each fin is formed to extend in the X direction. The first heat sink 81 is thermally coupled to components of the laser light output unit 4 (e.g., the solid-state laser crystal 41) via the first base plate 15.

In the example shown in Figure 10, the horizontal side portion 15b and the first heat sink 81 are formed integrally, but this is not limiting; the horizontal side portion 15b and the first heat sink 81 may also be formed separately.

- Second base plate 16 -
As shown in Figures 8, 9, and 10, the second base plate 16 is configured as a metal plate-like member extending in the X direction, and defines a portion of the six surfaces of the housing 10, particularly an offset portion 16a on the bottom surface 10d.

In particular, the second base plate 16 according to this embodiment is formed in a Z-shape when viewed from the -Y side. When the second base plate 16 is considered to be Z-shaped, the upper edge corresponds to the offset portion 16a in this embodiment. In the X direction, the length of the offset portion 16a as the upper edge is set to be longer than the length of the bottom edge when the second base plate 16 is considered to be Z-shaped.

The second base plate 16 is disposed between the left side surface 10l and the right side surface 10r in the Y direction, more specifically, between the first base plate 15 and the third base plate 17. The second base plate 16 is supported by the first base plate 15 and the third base plate 17 via fasteners such as screws (not shown).

The second base plate 16 is positioned below the top surface 10u in the Z direction. The second base plate 16 is positioned on the -Z side of the horizontal side 15b of the first base plate 15. Specifically, on the second base plate 16, the offset portion 16a, which serves as the upper side of the Z shape, is positioned at approximately the same Z position as the +Z side portion (lower portion) when the vertical side 15a of the first base plate 15 is divided in half in the Z direction. Furthermore, on the second base plate 16, the portion corresponding to the bottom of the Z shape is positioned at approximately the same Z position as the +Z side ends (lower ends) of the left side surface 10l and right side surface 10r.

Here, a sealing member (not shown) is provided between the +Y side end (left end) of the offset portion 16a of the second base plate 16 and the right side surface of the vertical side portion 15a of the first base plate 15, sealing the gap between the offset portion 16a and the right side surface in a liquid-tight manner.

Similarly, a sealing member (not shown) is provided between the -Y side end (right end) of the offset portion 16a and the left side surface of the vertical side portion 17a of the third base plate 17, sealing the gap between the offset portion 16a and the left side surface in a liquid-tight manner.

The second base plate 16 is disposed between the front surface 10f and the rear surface 10b in the X direction. The second base plate 16 is fixed to the front surface 10f and the rear surface 10b via the first base plate 15 and the third base plate 17. The second base plate 16 may also be directly fastened to the front surface 10f and the rear surface 10b.

Next, to describe the offset portion 16a in detail, the offset portion 16a according to this embodiment is formed as a thick plate extending in the X and Y directions. Furthermore, when the offset portion 16a is divided into two in the X direction, the +X side portion (the rear portion in the front-to-rear direction) is where the exit window 6 according to this embodiment is formed.

The exit window 6 has an exit hole 61 that penetrates the +X side portion of the offset portion 16a, a cover glass 62 that fits into this exit hole 61, and a sealing member (not shown) that liquid-tightly seals the gap between the exit hole 61 and the cover glass 62 (see Figure 10). The cover glass 62 is configured as an optical member that transmits laser light that is deflected by the laser light scanning unit 5 and directed toward the irradiation area R1. This cover glass 62 can be formed in a rectangular shape that corresponds to the shape of the irradiation area R1, for example, a rectangular shape that is approximately similar to the irradiation area R1 but smaller than the irradiation area R1.

Furthermore, as shown in Figures 8, 9, and 10, of the upper and lower surfaces of the offset portion 16a, the upper surface facing the -Z side supports the first casing 50 from below. More specifically, the first casing 50 can be fastened to the upper surface of the offset portion 16a, and this fastening allows the first casing 50 to be fixed to the second base plate 16. Instead of the upper surface of the offset portion 16a supporting the first casing 50, the upper surface may also define part of the mirror housing portion H11.

-Third base plate 17-
8, 9, and 10, the third base plate 17 is configured as a metal plate-like member extending in the X direction and is housed in the housing 10 (in other words, it is surrounded by six sides of the housing 10). The thickness of the third base plate 17 is set to be greater than the thicknesses of at least the left side surface 10l and the right side surface 10r of the six sides of the housing 10.

In particular, the third base plate 17 according to this embodiment has an L-shape when viewed from the -X side. Hereinafter, the portion of the third base plate 17 corresponding to the vertical side of the L-shape may be referred to as the vertical side portion 17a, and the portion corresponding to the horizontal side of the L-shape may be referred to as the horizontal side portion 17b.

The third base plate 17 is positioned between the left side surface 10l and the right side surface 10r in the Y direction, and is positioned on the -Y side of the second base plate 16. The third base plate 17 is positioned on the -Y side of the first base plate 15, with the second base plate 16 in between.

Here, a sealing member (not shown) is provided between the right end (end on the +Y side) of the horizontal side 17b of the third base plate 17 and the right side surface 10r of the housing 10 to liquid-tightly seal the gap between the third base plate 17 and the right side surface 10r.

The third base plate 17 is positioned below the top surface 10u in the Z direction.

The third base plate 17 is disposed between the front surface 10f and the rear surface 10b in the X direction. The third base plate 17 is fixed to the front surface 10f and the rear surface 10b by fasteners (not shown).

Next, the vertical side 17a of the third base plate 17 will be described in detail. In this embodiment, the vertical side 17a is formed as a thick plate extending along the -Z direction, which is the irradiation direction, and the X direction. In the Z direction, the dimension of the vertical side 17a of the third base plate 17 is shorter than the dimension of the vertical side 15a of the first base plate 15. This vertical side 17a supports the second base plate 16 from the -Y side.

Next, regarding the horizontal side portion 17b of the third base plate 17, the horizontal side portion 17b in this embodiment is formed as a thick plate extending in the X and Y directions. Various components can be attached to this horizontal side portion 17b. Components that can be attached to the horizontal side portion 17b include the first control board 53 of the laser light scanning unit 5. In addition, as shown in FIG. 10, a second heat sink 82, which serves as a heat sink in this embodiment, is provided on the underside of the horizontal side portion 17b facing the -Z side.

The second heat sink 82 is composed of multiple fins that protrude in the +Z direction. These fins are aligned in the Y direction. Each fin is formed to extend in the X direction. This second heat sink 82 is thermally coupled to components of the excitation light generation unit 2 (e.g., excitation light source 21) via the third base plate 17.

In other words, in this embodiment, the first heat sink 81 for cooling the laser light output unit 4 is configured separately from the second heat sink 82 for cooling the excitation light generation unit 2.

In the example shown in Figure 10, the horizontal side portion 17b and the second heat sink 82 are formed integrally, but this is not limiting; the horizontal side portion 17b and the second heat sink 82 may also be formed separately.

Furthermore, when the first base plate 15 and the third base plate 17 are separate bodies, as in this embodiment, the first heat sink 81 provided on the first base plate 15 and the second heat sink 82 provided on the third base plate 17 are separate bodies. However, the present disclosure is not limited to such a configuration, and the first heat sink 81 and the second heat sink 82 can also be configured as an integrated unit.

(Outline of the first storage section H1 and the second storage section H2)
As described above, the internal space of the housing 10 is partitioned into a plurality of storage sections by the first base plate 15 , the second base plate 16 , and the third base plate 17 .

As such storage sections, the housing 10 according to this embodiment is formed with a first storage section H1 in which a cover glass 62 serving as an optical element is provided, and a second storage section H2 in which at least a portion of the periphery of the cover glass 62 protrudes beyond the cover glass 62 toward the irradiation area R1 (see dashed line S1 in Figure 10).

The first storage unit H1 and the second storage unit H2 are aligned along the irradiation direction (-Z direction), with the first storage unit H1 located on one side of the irradiation direction (-Z side) and the second storage unit H2 located on the other side of the irradiation direction (+Z side). The boundary between the first storage unit H1 and the second storage unit H2 is defined by the first base plate 15, the second base plate 16, and the third base plate 17.

The first housing unit H1 houses optical components related to the generation of excitation light, the generation of laser light, and the deflection of laser light. Specifically, the first housing unit H1 in this embodiment houses the excitation light generation unit 2, the excitation light guide unit 3, the laser light output unit 4, and the laser light scanning unit 5.

In the example shown in Figure 10, the first storage section H1 is configured as a space surrounded by the top surface 10u, the upper portion of the front surface 10f, the lower portion of the back surface 10b, the upper portion of the left side surface 10l, the upper portion of the right side surface 10r, the portion of the bottom surface 10d formed by the second base plate 16, the first base plate 15, and the third base plate 17.

On the other hand, the second housing section H2 houses cooling components related to cooling the optical components housed in the first housing section H1. Specifically, the second housing section H2 in this embodiment houses a first heat sink 81 and a second heat sink 82 that are thermally coupled to the optical components housed in the first housing section H1, a first blower fan 83 that serves as an air blower for blowing air to the first heat sink 81, and a second blower fan 84 that also serves as an air blower for blowing air to the second heat sink 82.

In the example shown in Figure 10, the second storage section H2 is configured as a space surrounded by the lower portion of the front surface 10f, the lower portion of the back surface 10b, the lower portion of the left side surface 10l, the lower portion of the right side surface 10r, the portion of the bottom surface 10d formed by the non-offset portion 18 excluding the offset portion 16a, the first base plate 15, and the third base plate 17.

Furthermore, of the first housing section H1 and the second housing section H2, at least the first housing section H1 is configured to meet the IP standard established by the International Electrotechnical Commission (IEC). This allows the marker head 1 to be washed with water without causing water to get on the optical components such as the solid-state laser crystal 41 and first mirror 51a. This contributes to improving the ease of cleaning the marker head 1.

Furthermore, the housing 10 that constitutes the first storage section H1 and the second storage section H2 can be designed with an exterior shape that makes it difficult for water to accumulate when washed. Such an exterior shape can be achieved, for example, by tilting the top surface 10d with respect to the XY plane. Such an exterior shape contributes to improving the sanitation of the marker head 1.

In this case, as mentioned above, the front surface 10f can be opened and closed using the cover member 13, making it easy to wipe after washing with water (especially the area around the exit window 6). This contributes to improving the maintainability of the marker head 1.

(Details of the first storage section H1)
Here, of the first housing section H1 and second housing section H2 described above, the first housing section H1 is further divided into three housing sections aligned in directions (X and Y directions) perpendicular to the irradiation direction, for example, along the Y direction. Specifically, the housing 10 according to this embodiment has a mirror housing section H11, a crystal housing section H12, and a substrate housing section H13.

The mirror housing section H11 houses the first mirror 51a and the second mirror 52a of the laser light scanning unit 5. In this embodiment, the mirror housing section H11 is defined by a first casing 50 that can hermetically seal the first mirror 51a and the second mirror 52a. As described above, the first casing 50 may be defined using an offset section 16a. When defining the first casing 50 using the offset section 16a, it is preferable to provide a buffer material between the offset section 16a and the first casing 50. Because the offset section 16a is part of the bottom surface 10d, it is susceptible to distortion, vibration, and the like. The buffer material can reduce the impact of such external influences on the first casing and the components housed therein. Alternatively, the crystal housing section H12 may be defined using a first base plate 15, similar to the crystal housing section H12 described below.

Here, the first casing 50 is formed in the shape of a box with a bottom that opens toward the -Z side. The first casing 50 is held by the first base plate 15.

The dimensions of the first casing 50 in the X direction are approximately the same as the dimensions of the offset portion 16a in the X direction. Similarly, the dimensions of the first casing 50 in the Y direction are approximately the same as the dimensions of the offset portion 16a in the Y direction.

The opening on the -Z side of the first casing 50 can be closed, for example, by the lid 59 shown in FIG. 10. Instead of sealing the opening with the lid 59, the opening of the first casing 50 may be sealed by, for example, the top surface 10u. When sealing the opening of the first casing 50 with the top surface 10u, it is preferable to provide a buffer material between the top surface 10u and the first casing 50. This reduces the impact of distortion, vibration, etc. that occurs on the top surface 10u on the first casing 50 and the components housed in the first casing 50.

Furthermore, at least four through holes 50a, 50b, 50c, and 50d are formed in the first casing 50. Of the four through holes 50a, 50b, 50c, and 50d, the fourth through hole 50a formed in the left wall portion of the first casing 50 communicates with the third through hole 15f of the first base plate 15 when the marker head 1 is assembled, and together with the third through hole 15f and the optical member 15h fitted into the third through hole 15f, constitutes the second entrance window 92.

On the other hand, of the four through holes 50a, 50b, 50c, and 50d, the fifth through hole 50b formed in the bottom of the first casing 50 is located on the +X side when the first casing 50 and therefore the offset portion 16a are divided in half in the X direction. A defocus lens 57 serving as an optical element is provided in this fifth through hole 50b. This defocus lens 57 will be described later.

Of the four through holes 50a, 50b, 50c, and 50d, the sixth through hole 50c, formed in the right wall portion (the wall portion located on the -Y side) of the first casing 50, is located on the +X side when the first casing 50 and, by extension, the offset portion 16a are divided in half in the X direction. The second motor 52b that constitutes the second scanner 52 can be inserted and fixed into this sixth through hole 50c.

Of the four through holes 50a, 50b, 50c, and 50d, the seventh through hole 50d, which is formed in the rear wall portion (the wall portion located on the +X side) of the first casing 50, is located on the +X side when the first casing 50 and, by extension, the offset portion 16a are divided in half in the X direction. In the Z direction, the seventh through hole 50d is located on the +Z side of the sixth through hole 50c. In addition, in the Y direction, the center of the seventh through hole 50d (the center of the circle when the seventh through hole 50d is considered to have a circular cross section) is located at approximately the same position as the optical axis of the cover glass 62. The first motor 51b that constitutes the first scanner 51 can be inserted and fixed into this seventh through hole 50d.

The crystal housing section H12 is defined by a support plate (first base plate 15) having a partition surface 15g extending along the irradiation direction, and is positioned on the opposite side of the partition surface 15g from the mirror housing section H11 (the +Y side in the illustrated example) to house a solid-state laser crystal 41. The crystal housing section H12 houses the optical components that make up the laser light output section 4, such as the solid-state laser crystal 41. The crystal housing section H12 is defined by a second casing 40 that can hermetically seal these optical components. The crystal housing section H12 in this embodiment can house a nonlinear optical crystal 45 in a sealed state.

Here, the second casing 40 is formed in the shape of a bottomed box that opens toward the -Y side. The second casing 40 is attached to the vertical side 15a of the first base plate 15 and is supported from the -Y side by the partition surface 15g of the vertical side 15a. The opening on the -Y side of the second casing 40 can be closed by the partition surface 15g.

The internal space of the crystal housing section H12 can be divided into two sections aligned in the X direction: a Q-switch housing section H121 and a wavelength conversion section H122. The Q-switch housing section H121 is a space that houses the Q-switch 43. The wavelength conversion section H122 is a space that houses the nonlinear optical crystal 35.

Here, the Q switch accommodating section H121 and the wavelength conversion section H122 are aligned along the X direction, and both are configured as spaces enclosed by the second casing 40 and the partition surface 15g. More specifically, the second casing 40 is configured with a box-shaped body corresponding to the Q switch accommodating section H121 and a box-shaped body corresponding to the wavelength conversion section H122, and the spaces enclosed by the respective box-shaped bodies and the partition surface 15g are the Q switch accommodating section H121 and the wavelength conversion section H122. The Q switch accommodating section H121 and the wavelength conversion section H122 are optically coupled by an optical member (not shown). By configuring the Q switch accommodating section H121 and the wavelength conversion section H122 as separate spaces in this way, the risk of impurities generated in the Q switch 43 (described later) adhering to the wavelength conversion element 45 (described later) and reducing the output of the laser light is reduced.

The substrate housing section H13 is located on the opposite side of the mirror housing section H11 from the crystal housing section H12, and houses the first control board 53. In this embodiment, the substrate housing section H13 is defined as the internal space of the first housing section H1 excluding the mirror housing section H11 and the crystal housing section H12.

In other words, in this embodiment, the phrase "a specific member is housed in the mirror housing section H11" indicates that the specific member is surrounded on all six sides by the first casing 50, and the phrase "a specific member is housed in the crystal housing section H12" indicates that the specific member is surrounded on all six sides by the second casing 40 and the partition surface 15g.

In contrast, the phrase "a specific component is housed in the substrate housing section H13" simply indicates that the component is located in the space within the housing 10 excluding the mirror housing section H11 and the crystal housing section H12. Of course, this configuration is not limited to this, and a casing dedicated to the substrate housing section H13 (a third casing, so to speak) may be provided, similar to the first casing 50 and second casing 40.

(Details of the second storage section H2)
On the other hand, the second housing H2 is partitioned into the +Z side portion of the housing 10 by a first plate-like member 18l and a second plate-like member 18r. The second housing H2 has two spaces spaced apart in a direction perpendicular to the irradiation direction, for example, in the arrangement direction (Y direction) of the mirror housing H11, the crystal housing H12, and the substrate housing H13.

The second housing section H2 in this embodiment has two such spaces: a crystal-side housing section H21 and a light source-side housing section H22. Because the crystal-side housing section H21 and the light source-side housing section H22 are spaced apart in the Y direction, a space that does not belong to the second housing section H2 is separated between the crystal-side housing section H21 and the light source-side housing section H22.

In this embodiment, the first plate-shaped member 18l and the second plate-shaped member 18r are configured to separate the space that contains the second storage section H2, which is a space for storing the members, as well as the space that includes the optical path of the laser light connecting the first mirror 51a (scanner mirror) and the irradiation area R1, which is closer to the irradiation area R1 (the optical path on the +Z side). Hereinafter, this space will be referred to as the "optical path partition section" and will be denoted by the symbol H3. The optical path partition section H3 in this embodiment is configured as a space that is surrounded on three sides, the +Y side, the -Y side, and the -Z side, by the first plate-shaped member 18l, the second plate-shaped member 18r, and the cover glass 62.

In the illustrated example, the optical path partition H3 is configured as an open space at the lower end on the +Z side, but this configuration is not limited to this. The +Z side end of the optical path partition H3 may be covered with an optical member such as glass. The optical member covering the +Z side end of the optical path partition H3 may be provided alternatively to the cover glass 62, or may be used in combination with the cover glass 62.

Of the two spaces that make up the second storage section H2, the crystal-side storage section H21 stores the first heat sink 81 and the first blower fan 83. The first heat sink 81 and the first blower fan 83 are arranged side by side in the X direction.

As previously explained, the first heat sink 81 in this embodiment is thermally coupled to at least the optical components attached to the first base plate 15 among the optical components that make up the laser light output unit 4.

On the other hand, the first blower fan 83 is positioned on the +X side of the first heat sink 81, as shown in FIG. 13. The first blower fan 83 is configured as a so-called axial fan, and generates an airflow that passes through the first heat sink 81 in accordance with a control signal received from the marker controller 100. The first blower fan 83 may also be positioned on the -X side of the first heat sink 81. In this embodiment, power and signals for driving the first blower fan are supplied via an electric cable 200 whose connection portion is covered by a connection cover 14 provided on the +X side. Therefore, if the first blower fan 83 is configured on the +X side of the first heat sink 81, the space required for wiring is reduced, which is advantageous for miniaturizing the marker head 1.

As shown by arrow Al1 in Figure 13, the airflow generated by the first blower fan 83 flows into the crystal-side accommodation section H21 through the ventilation opening 12 provided on the front surface 10f of the housing 10. The airflow then flows along the X direction from the -X side to the +X side, passing through the first heat sink 81 and the first blower fan 83. As shown by arrow Al2 in Figure 13, the airflow that has passed through the first blower fan 83 flows out through an exhaust opening provided on the rear surface 10b of the housing 10.

Here, a first rectifying plate 85 that aligns the airflow direction is attached to the rear surface 10b of the housing 10 (see also Figure 6). As shown by arrow A13 in Figure 13, this first rectifying plate 85 guides the airflow flowing out from the rear surface 10b to the opposite side (-Z side) of the direction from the housing 10 toward the workpiece W. This prevents the exhaust air from colliding with the workpiece W, which is advantageous for stabilizing the posture of the workpiece W.

The light source side housing H22 houses the second heat sink 82 and the second blower fan 84. The second heat sink 82 and the second blower fan 84 are arranged side by side in the X direction.

The second heat sink 82 in this embodiment is thermally coupled to at least the excitation light source 21 attached to the third base plate 17, among the optical components housed in the substrate housing portion H13.

On the other hand, the second blower fan 84 is positioned on the +X side of the second heat sink 82, as shown in FIG. 12. The second blower fan 84 is configured as an axial fan, like the first blower fan 83, and generates an airflow that passes through the second heat sink 82 in accordance with a control signal received from the marker controller 100. The second blower fan 84 may also be positioned on the -X side of the second heat sink 82. In this embodiment, power and signals for driving the first blower fan are supplied via an electric cable 200 whose connection portion is covered by the connection cover 14 provided on the +X side. Therefore, if the first blower fan 83 is configured to be on the +X side of the second heat sink 82, the space required for wiring is reduced, which is advantageous for miniaturizing the marker head 1.

As indicated by arrow Ar1 in FIG. 12, the airflow generated by the second blower fan 84 flows into the light source-side housing section H22 through the ventilation opening 12 provided on the front surface 10f of the housing 10. The airflow then flows along the X direction from the -X side to the +X side, passing through the second heat sink 82 and the second blower fan 84. As indicated by arrow Ar2 in FIG. 12, the airflow that has passed through the second blower fan 84 flows out through an exhaust opening provided on the rear surface 10b of the housing 10.

A second rectifying plate 86 that aligns the airflow direction is attached to the rear surface 10b of the housing 10 (see also Figure 6). As shown by arrow Ar3 in Figure 12, this second rectifying plate 86 changes the flow direction of the airflow flowing out from the rear surface 10b to the opposite side (-Z side) of the direction from the housing 10 toward the workpiece W. This reduces collisions between the exhaust air and the workpiece W, which is advantageous for stabilizing the posture of the workpiece W.

Below, the configuration of the excitation light generation unit 2, excitation light guide unit 3, laser light output unit 4, laser light scanning unit 5, etc., which are provided in the first storage unit H1 and the second storage unit H2, will be described in detail, including their relative positional relationships within the housing 10.

(Excitation light generation unit 2)
The excitation light generating unit 2 includes an excitation light source 21 that generates laser excitation light (excitation light) based on power (driving current) supplied from the power supply unit 104, a metal plate 22 that supports the excitation light source 21, a temperature control unit 23 that adjusts the temperature of the excitation light source 21, and a light source control board 24 that supports the excitation light source 21 based on a control signal input from the marker controller 100.

The excitation light source 21, metal plate 22, temperature adjustment unit 23, and light source control board 24 that make up the excitation light generation unit 2 are all housed in the board housing section H13. As a result, the excitation light generation unit 2, and in particular the excitation light source 21, is positioned on the opposite side of the mirror housing section H11 from the laser light output unit 4. This allows the excitation light generation unit 2 and the laser light output unit 4 to be separated as far as possible.

-Metal plate 22-
The metal plate 22 is made of metal and is configured as a thin plate-like member. As shown in Figures 11 and 12, when the third base plate 17 is divided into three parts in the X direction: a +X side part, a central part, and a -X side part, the metal plate 22 is placed on the -X side part. The metal plate 22 is fastened to the upper surface of the third base plate 17 (more specifically, to the upper surface of the horizontal side part 17b of the third base plate 17), and is thermally coupled to the second heat sink 82 via the third base plate 17.

In addition, an excitation light source 21 is placed on the upper surface of the metal plate 22, while a plate-shaped temperature control unit 23 is sandwiched between the lower surface of the metal plate 22 and the third base plate 17.

-Excitation light source 21-
The excitation light source 21 is configured to receive power from the power supply unit 104 via the electric cable 200 and to generate excitation light in accordance with the power. The output of the excitation light generated by the excitation light source 21 increases as the driving current increases.

The excitation light source 21 in this embodiment is composed of a laser diode (LD). The laser light emitted from the excitation light source 21 is focused by a focusing lens (not shown) or the like and output as laser excitation light (excitation light). The excitation light source 21 is optically coupled to a fiber cable 31 that constitutes the excitation light guide unit 3. The laser excitation light output from the excitation light source 21 is guided to the excitation light guide unit 3 via the fiber cable 31.

As shown in Figures 11 and 12, the excitation light source 21 is formed in the shape of a rectangular thin plate and is fixed to the upper surface of the metal plate 22 with its thickness oriented in the Z direction. Like the metal plate 22, the excitation light source 21 is arranged on the -X side when the third base plate 17 is divided into thirds in the X direction. By arranging it in this manner, the excitation light source 21 in this embodiment is arranged at the upstream end of the airflow generated by the second blower fan 84 (the -X side end away from the second blower fan 84) compared to the downstream end of the airflow (the +X side end adjacent to the second blower fan 84).

In addition, one side of the excitation light source 21 faces obliquely toward the +X and +Y sides, and the upstream end of the fiber cable 31 is connected to this obliquely facing side.

-Temperature control section 23-
The temperature control unit 23 is configured to adjust the temperature of the excitation light source 21 so that it falls within a predetermined temperature range. Here, the temperature range (the predetermined temperature range) realized by the temperature control unit 23 is set based on the guaranteed environment of the marker head 1, and is preferably set to be higher than the guaranteed environment of the marker head 1, and more preferably set to be 40°C or higher and 60°C or lower.

Specifically, the temperature adjustment unit 23 according to this embodiment is composed of a substantially thin-plate Peltier element and is sandwiched between the upper surface of the third base plate 17 (more specifically, the upper surface of the horizontal side portion 17b) and the lower surface of the metal plate 22. The temperature adjustment unit 23 dissipates heat from the metal plate 22. A harness (not shown) for supplying current to the temperature adjustment unit 23 is connected to the side of the temperature adjustment unit 23. When current is supplied via the harness, the temperature adjustment unit 23 absorbs heat on the surface facing the metal plate 22 and generates heat on the surface facing the third base plate 17.

-Light source control board 24-
The light source control board 24 is electrically connected to the marker controller 100 and controls the power supplied from the power supply unit 104 to the excitation light source 21 .

The light source control board 24 in this embodiment is composed of a circuit board in the shape of a substantially rectangular thin plate. The light source control board 24 is positioned with both its front and back surfaces aligned along the ZX direction, and is fastened to, for example, the vertical side 17a of the third base plate 17 from the -Y side (fastening structure not shown).

As shown in FIG. 12, the light source control board 24 is also positioned on the -Z side of the excitation light source 21 in the Z direction, and is electrically connected to the excitation light source 21 via wiring (not shown).

(Excitation light guide section 3)
The excitation light guide unit 3 as a light guide optical system has a fiber cable 31 that optically couples the excitation light source 21 with the solid-state laser crystal 41 in the laser light output unit 4, and a fiber guide 32 configured to wind the fiber cable 31 with a predetermined bending radius. The fiber cable 31 and the fiber guide 32 are both housed in a substrate housing portion H13 inside the housing 10.

- Fiber Cable 31 -
The fiber cable 31 is composed of a so-called optical fiber, one end of which (one end as viewed in the direction of light propagation) is connected to the excitation light source 21, while the other end (the end located opposite the one end in the direction of light propagation) is connected to the first entrance window 91.

The other end of the fiber cable 31 is optically coupled to the solid-state laser crystal 41 via the first entrance window 91 and the first deflection mirror 42 described below. Furthermore, at least a portion of the midway section connecting one end of the fiber cable 31 to the other end is wound around the fiber guide 32.

The fiber cable 31 can guide the excitation light generated by the excitation light source 21 and lead it to the solid-state laser crystal 41.

- Fiber guide 32 -
The fiber guide 32 is configured to wind the fiber cable 31 with a predetermined bending radius. The bending radius of the fiber guide 32 is set to be equal to or greater than the minimum bending radius of the fiber cable 31.

Specifically, the fiber guide 32 according to this embodiment is formed in the shape of a generally cylindrical reel around which the fiber cable 31 can be wound multiple times. This fiber guide 32 is positioned with the central axis of its cylindrical shape aligned along the Y direction, and is attached to the vertical side 17a of the third base plate 17 from the -Y side.

As shown in FIG. 12, the fiber guide 32 is arranged in the X direction in a range from the front end of the light source control board 24 to the rear end of the second control board 54. As shown in FIG. 11, the fiber guide 32 is arranged in the Y direction on the +Y side of the light source control board 24 and the second control board 54, and on the -Y side of the right wall of the first casing 50.

(Laser light output unit 4)
The laser light output unit 4 has the first deflection mirror 42 that bends the optical path of the excitation light, the solid-state laser crystal 41 that generates a fundamental wave based on the excitation light, a Q switch 43 that pulses the fundamental wave based on a control signal input from the marker controller 100, and a first reflecting mirror 44 for reflecting the fundamental wave. These optical components are hermetically housed in a Q switch housing section H121 that is obtained by dividing the crystal housing section H12 in half. Of these optical components, at least the solid-state laser crystal 41 can also be housed in the wavelength conversion section H122.

The laser light output unit 4 also includes a nonlinear optical crystal 45 that receives the laser light (fundamental wave) generated by the solid-state laser crystal 41 and wavelength-converts the laser light to a shorter wavelength; a second reflecting mirror 46 that forms a resonant optical path together with the first reflecting mirror 44; a laser light separation unit 47 that separates the laser light wavelength-converted to a shorter wavelength from the resonant optical path; and a second deflection mirror 48 that bends the optical path of the laser light separated by the laser light separation unit 47. These optical components are hermetically housed within the wavelength conversion unit H122, which is formed when the crystal housing unit H12 is divided in half.

In particular, the laser light output unit 4 according to this embodiment is configured as a so-called intracavity laser oscillator. That is, along the path from the first reflecting mirror 44 to the second reflecting mirror 46, the Q switch 43, the first deflection mirror 42, the solid-state laser crystal 41, the first separator 47a constituting the laser light separation unit 47, the second wavelength conversion element 45b as a nonlinear optical crystal 45, and the first wavelength conversion element 45a also as a nonlinear optical crystal 45 are arranged in this order. In other words, the first reflecting mirror 44, the second reflecting mirror 46, and the components between the first reflecting mirror 44 and the second reflecting mirror 46 constitute a resonant unit, and the first wavelength conversion element 45a and the second wavelength conversion element 45b are arranged inside the resonant unit. In this embodiment, the laser light output unit 4 is configured as an intra-cavity laser oscillator, but it may also be an extra-cavity laser oscillator in which the nonlinear optical crystal 45 is not located between the first reflecting mirror 44 and the second reflecting mirror 46.

Here, the first deflection mirror 42 is positioned so as to merge the optical axis of the excitation light guided by the excitation light guide section 3 and passing through the first entrance window 91 (the optical axis extending along the Y direction as indicated by reference symbol A1 in Figure 11) with the optical axis of the resonant light path (the optical axis extending along the X direction as indicated by reference symbol A2 in Figures 11 and 12).

The first separator 47a is also positioned to separate laser light containing, for example, the third harmonic wave from the resonant optical path connecting the first reflecting mirror 44 and the second reflecting mirror 46. In other words, the laser light output unit 4 amplifies laser light composed of photons emitted by stimulated emission from the solid-state laser crystal 41 through multiple reflections between the first reflecting mirror 44 and the second reflecting mirror 46, while converting the wavelength to the shorter wavelength side. The amplified laser light is then separated by the laser light separation unit 47 and output from the laser light output unit 4.

The laser light output unit 4 also has a Q-switch driver 49 that drives the Q-switch 43, which is a component located outside the crystal housing unit H12. As shown in FIG. 13, the Q-switch driver 49 is attached to the +X side when the top surface 10u is divided in half in the X direction. The Q-switch driver 49 is also located on the +Y side of the vertical side 15a of the first base plate 15.

The Q-switch driver 49 may also be attached to the left side surface 10l, rear surface 10b, etc. of the housing 10. The Q-switch driver 49 can be attached to a plate-like member that forms the outer surface of the housing 10.

First Reflecting Mirror 44
The first reflecting mirror 44 is accommodated in the Q switch accommodating portion H121 and is configured to reflect at least the fundamental wave. The first reflecting mirror 44 constitutes a resonator together with the second reflecting mirror 46. Note that the first reflecting mirror 44 according to this embodiment is configured as a total reflecting mirror that reflects the fundamental wave.

In addition, the first reflecting mirror 44 in this embodiment is attached to the partition surface 15g that defines the crystal storage section H12, and is thermally coupled to the first heat sink 81 via the first base plate 15.

--Second reflecting mirror 46--
The second reflecting mirror 46 is housed in the wavelength converting unit H122 and is configured to reflect at least the fundamental wave. The second reflecting mirror 46 forms a resonator together with the first reflecting mirror 44. Note that the second reflecting mirror 46 according to this embodiment is configured as a total reflecting mirror that reflects not only the fundamental wave but also a second harmonic having a wavelength higher than that of the fundamental wave and a third harmonic having an even higher wavelength than that of the second harmonic.

Furthermore, the second reflecting mirror 46 according to this embodiment is attached to the partition surface 15g in the same manner as the first reflecting mirror 44, and is thermally coupled to the first heat sink 81 via the first base plate 15. In this way, in order to form a highly accurate resonant optical path, it is preferable that the first reflecting mirror 44 and the second reflecting mirror 46, which are at both ends of the resonant optical path, are positioned by the same first base plate 15.

-Q switch 43-
The Q switch 43 is housed in the Q switch housing portion H121, and is configured to pulse oscillate the fundamental wave generated by the solid-state laser crystal 41. Specifically, the Q switch 43 is disposed so as to be located on the optical axis of the resonance optical path (optical path of the resonator), and is interposed between the solid-state laser crystal 41 and the first reflecting mirror 44.

The Q switch 43 in this embodiment is a so-called active Q switch that operates based on an RF signal applied from the Q switch driver 49. In other words, when the Q switch 43 is turned on, the laser light incident on the Q switch 43 is deflected and separated from the resonant optical path. In this case, multiple reflections of the laser light are restricted, which promotes the generation of a population inversion in the solid-state laser crystal 41.

When the Q switch 43 is turned on for a predetermined period of time and then turned off, the laser light undergoes multiple reflections without being separated by the Q switch 43, and is amplified by these multiple reflections. In this case, high-power laser light is pulsed.

In addition, the Q switch 43 according to this embodiment is attached to the partition surface 15g, similar to the first reflecting mirror 44, and is thermally coupled to the first heat sink 81 via the first base plate 15.

-Q switch driver 49-
The Q-switch driver 49 is housed inside the housing 10 and outside the crystal housing section H12, and generates an RF signal to be applied to the Q-switch 43 based on a control signal input from the marker controller 100.

The Q-switch driver 49 is attached to the top surface 10u via a metal support plate and is thermally coupled to the housing 10 via the support plate and the top surface 10u.

First deflection mirror 42
The first deflection mirror 42 is housed in the Q switch housing H121 and is disposed between the Q switch 43 and the solid-state laser crystal 41 in the X direction. The first deflection mirror 42 according to this embodiment is configured by a so-called beam splitter. The first deflection mirror 42 totally reflects the excitation light incident from the first entrance window 91 toward the +Y side so that the light propagates along the X direction. On the other hand, the first deflection mirror 42 transmits the fundamental wave propagating along the X direction without reflecting it. The fundamental wave transmitted through the first deflection mirror 42 reaches the first reflecting mirror 44 via the Q switch 43.

Furthermore, the first deflection mirror 42 according to this embodiment is attached to the partition surface 15g, similar to the first reflection mirror 44, and is thermally coupled to the first heat sink 81 via the first base plate 15.

-Solid-state laser crystal 41-
The solid-state laser crystal 41 is housed in the Q-switch housing H121 and is made of a laser medium capable of forming a population inversion. The solid-state laser crystal 41 is configured to perform stimulated emission corresponding to the incident laser excitation light when the laser excitation light is incident on its end face. The wavelength of the photons emitted by stimulated emission (the so-called fundamental wavelength) varies depending on the specific configuration of the solid-state laser crystal 41, but in this embodiment it is in the infrared range of around 1 μm.

In this embodiment, rod-shaped Nd: _YVO4 (yttrium vanadate) is used as the laser medium constituting the solid-state laser crystal 41. Laser excitation light is incident on one end face of the rod-shaped solid-state laser crystal 41, and laser light having a fundamental wavelength (so-called fundamental wave) is emitted from the other end face (so-called one-directional excitation method using end pumping). In this example, the fundamental wavelength is set to 1064 nm. Meanwhile, the wavelength of the laser excitation light is set near the center wavelength of the absorption spectrum of Nd: _YVO4 to promote stimulated emission. However, this example is not limiting, and other laser media, such as rare-earth doped YAG, YLF, or GdVO4 _, can also be used. Various solid-state laser media can be used depending on the application of the laser processing device L.

In addition, the solid-state laser crystal 41 in this embodiment is attached to the partition surface 15g, similar to the first reflecting mirror 44, and is thermally coupled to the first heat sink 81 via the first base plate 15.

-Nonlinear Optical Crystal 45-
The nonlinear optical crystal 45 is configured by combining a first wavelength conversion element 45a that receives the fundamental wave generated by the solid-state laser crystal 41 and generates a second harmonic wave having a wavelength higher than that of the fundamental wave, and a second wavelength conversion element 45b that generates a third harmonic wave having a wavelength higher than that of the second harmonic. Both the first wavelength conversion element 45a and the second wavelength conversion element 45b are housed in the wavelength conversion unit H122.

The first wavelength conversion element 45a is a nonlinear optical crystal capable of generating second harmonics, and is configured so that when a fundamental wave is incident, it doubles the frequency of the fundamental wave and emits it as a second harmonic (Second Harmonic Generation: SHG). In other words, the wavelength of the laser light generated when a fundamental wave is incident on the first wavelength conversion element 45a is in the visible light range of around 500 nm. In particular, in this embodiment, the wavelength of the second harmonic is set to 532 nm.

In addition, the conversion efficiency of the first wavelength conversion element 45a is generally less than 100%. Therefore, when a fundamental wave is incident on the first wavelength conversion element 45a, laser light containing a mixture of the fundamental wave and the second harmonic wave is emitted.

In this embodiment, LBO (LiB ₃ O ₃ ) is used as the first wavelength conversion element 45 a. However, the first wavelength conversion element 45 a is not limited to this example, and various organic nonlinear optical materials, inorganic nonlinear optical materials, etc. can be used as the first wavelength conversion element 45 a.

The second wavelength conversion element 45b is a nonlinear optical crystal capable of generating third harmonics. When a fundamental wave and a second harmonic are incident (particularly when the propagation directions of the fundamental wave and the second harmonic are the same), the second wavelength conversion element 45b converts the incident fundamental wave and second harmonic into a third harmonic having a frequency three times that of the fundamental wave and then emits the third harmonic (Third Harmonic Generation: THG). In other words, the wavelength of the laser light generated when the fundamental wave and second harmonic are incident on the second wavelength conversion element 45b is in the ultraviolet range of around 350 nm (specifically, near the boundary between the visible light range and the ultraviolet range). In this embodiment, the wavelength of the third harmonic is set to 355 nm.

In addition, the conversion efficiency of the second wavelength conversion element 45b is generally less than 100%. Therefore, when the fundamental wave and second harmonic are incident on the first wavelength conversion element 45a, laser light containing a mixture of the fundamental wave, second harmonic, and third harmonic is emitted.

In this embodiment, LBO (LiB ₃ O ₃ ) is used as the second wavelength conversion element 45 b. However, the second wavelength conversion element 45 b is not limited to this example, and various organic nonlinear optical materials, inorganic nonlinear optical materials, etc. can be used as the second wavelength conversion element 45 b.

In addition, the nonlinear optical crystal 45 according to this embodiment is attached to the partition surface 15g, similar to the first reflecting mirror 44, and is thermally coupled to the first heat sink 81 via the first base plate 15.

--Laser beam separating unit 47--
The laser beam separating unit 47 is housed in the wavelength converting unit H122 and is configured to separate the third harmonic from the resonant optical path of the laser beam to generate UV laser beam for laser processing.

The laser beam separation unit 47 is composed of multiple optical components. Specifically, the laser beam separation unit 47 in this embodiment has a first separator 47a for extracting the second and third harmonics from the laser beam, a concave lens 47b for adjusting the beam diameter of the laser beam consisting of the second and third harmonics, and a second separator 47c for extracting the third harmonic from the laser beam.

The first separator 47a is a so-called beam splitter that is configured to transmit the fundamental wave while reflecting the second and third harmonics. This first separator 47a is positioned so that it intersects with the optical axis of the resonant optical path connecting the first reflecting mirror 44 and the second reflecting mirror 46, and is tilted at approximately 45 degrees with respect to that optical axis. The laser light reflected by the first separator 47a propagates toward the -Z side.

The concave lens 47b is configured to transmit the laser light reflected by the first separator 47a, i.e., the laser light separated from the resonant optical path, thereby expanding the beam diameter of the transmitted laser light. In this embodiment, the concave lens 47b is interposed between the first separator 47a and the second separator 47c, but is not limited to such an arrangement.

The second separator 47c is a beam splitter similar to the first separator 47a, configured to transmit the second harmonic wave while reflecting the third harmonic wave. This second separator 47c is positioned so that it intersects with the optical axis of the laser light that has passed through the concave lens 47b, and is tilted at approximately 45 degrees relative to that optical axis. The laser light reflected by the second separator 47c propagates toward the -X side.

Furthermore, each optical component constituting the laser beam separation unit 47 is attached to the partition surface 15g, similar to the first reflecting mirror 44, and is thermally coupled to the first heat sink 81 via the first base plate 15 (see also Figure 10).

In this way, in order to generate laser light along a highly accurate optical path, it is preferable that the first reflecting mirror 44, second reflecting mirror 46, Q switch 43, first deflection mirror 42, solid-state laser crystal 41, nonlinear optical crystal 45, and laser light separation unit 47 are all positioned by the same first base plate 15.

--Second deflection mirror 48--
The second deflection mirror 48 is housed in the wavelength conversion unit H122 and is disposed closer to the -X side than the other optical members housed in the crystal housing unit H12. The second deflection mirror 48 according to this embodiment is configured by a so-called beam splitter. The second deflection mirror 48 reflects the laser light that passes through the second separator 47c and propagates toward the -X side. The laser light reflected by the second deflection mirror 48 is deflected so as to propagate toward the -Y side.

Furthermore, the second deflection mirror 48 according to this embodiment is attached to the partition surface 15g in the same manner as the first reflection mirror 44, etc., and is thermally coupled to the first heat sink 81 via the first base plate 15. In this way, in order to improve the accuracy of the position at which the generated laser light is output, it is preferable that the second deflection mirror 48, which emits laser light to the outside from the laser light output unit 4, be positioned by the first base plate 15 in the same manner as the first reflection mirror 44, etc.

Finally, the laser light deflected by the second deflection mirror 48 passes through the second entrance window 92 and enters the first casing 50 from the laser light output unit 4. As shown in Figure 11, the laser light that enters the first casing 50 propagates toward the -Y side and reaches the third deflection mirror 56 of the laser light scanning unit 5.

(Laser light scanning unit 5)
The laser light scanning unit 5 has, in addition to the first scanner 51, second scanner 52, first control board 53 and second control board 54 mentioned above, an intermediate deflection unit 55, a third deflection mirror 56, a defocus lens 57 as an optical element, and a first casing 50 that houses at least the first mirror 51a of the first scanner 51 and the second mirror 52a of the second scanner 52.

Below, these components will be explained in the order in which the laser light reaches them during laser oscillation.

-Third deflection mirror 56-
11 , the third deflection mirror 56 is housed in the first casing 50 and is arranged alongside the second deflection mirror 48 and the second entrance window 92 in the Y direction, and is located on the −Y side of these components. The third deflection mirror 56 is arranged between the second entrance window 92 and the light source control board 24 in the Y direction (in other words, on the −Y side of the second entrance window 92 and on the +Y side of the light source control board 24).

The third deflection mirror 56 is, for example, a total reflection mirror that receives laser light that enters the first casing 50 and propagates toward the -Y side, and reflects it toward the +X side. The laser light reflected by the third deflection mirror 56 reaches the second mirror 52a of the second scanner 52. Note that instead of a total reflection mirror, the third deflection mirror 56 may be configured as a mirror that transmits a portion of the laser light. In that case, the output of the laser light entering the first casing 50 from the laser light output unit 4 may be detected using the partially transmitted laser light.

-Second scanner 52-
14, 15, and 16, the second scanner 52 has a second mirror 52a for scanning the laser light in a predetermined second direction and a second motor 52b for rotatably supporting the second mirror 52a. Of these, the second mirror 52a is housed in the mirror housing section H11, and most of the second motor 52b is housed in the board housing section H13.

The second mirror 52a is configured as a so-called galvanometer mirror. The second mirror 52a receives the laser light generated by the solid-state laser crystal 41 via the third deflection mirror 56 shown in FIG. 11 and the like. The second mirror 52a deflects the received laser light by reflecting it toward the +Z side. As the second mirror 52a rotates, the irradiation position of the laser light in the irradiation area R1 is scanned in the second direction.

Here, the second direction, which is the deflection direction by the second mirror 52a, is a direction perpendicular to both the first direction, which is the deflection direction by the first mirror 51a of the first scanner 51, and the -Z direction, which is the irradiation direction, and in this embodiment is set to coincide with the X direction.

Specifically, the second mirror 52a is a generally rectangular, plate-shaped total reflection mirror that is supported on the tip of the rotation shaft of the second motor 52b and is housed within the mirror housing H11. The second mirror 52a rotates integrally with the shaft of the second motor 52b and is configured to be rotated by this second motor 52b around a predetermined second rotation axis Ac2. The amount of deflection by the second mirror 52a, and therefore the irradiation position of the laser light in the second direction, is determined based on the rotation angle of the second mirror 52a around this second rotation axis Ac2.

Here, as shown in Figures 14 and 15, the second rotation axis Ac2, which is the rotation center of the second mirror 52a, extends perpendicular to both the first rotation axis Ac1, which is the rotation center of the first mirror 51a, and the Z direction, which is the irradiation direction, and in this embodiment is set to extend along the Y direction.

The second mirror 52a is also arranged alongside the third deflection mirror 56 in the X direction, and is located on the +X side of the third deflection mirror 56. The second mirror 52a is further located on the -Y side of the first mirror 51a and defocus lens 57 in the Y direction, and on the -Z side of the first mirror 51a and defocus lens 57 in the Z direction.

The second motor 52b is a galvanometer motor such as a DC motor, and is formed in a generally cylindrical shape with the second rotation axis Ac2 as its central axis. The tip end (+Y side end) of the second motor 52b in the direction of the second rotation axis Ac2 (Y direction) is inserted into the sixth through-hole 50c in the first casing 50. Meanwhile, the other end (-Y side end of the second motor 52b) located on the opposite side of the tip end in the direction of the second rotation axis Ac2 protrudes from the sixth through-hole 50c and is exposed inside the substrate accommodating section H13.

The second scanner 52 reflects the laser light via the second mirror 52a. The laser light reflected by the second mirror 52a passes through the intermediate deflection unit 55, the first mirror 51a, and the defocus lens 57 and exits from the exit window 6. At this time, the second scanner 52 adjusts the reflection angle of the laser light using the second motor 52b, allowing the laser light to scan the irradiation area R1 in the second direction (X direction).

-Intermediate deflection section 55-
14, 15, and 16, the intermediate deflection unit 55 has an intermediate mirror 55a that relays the laser light between the second mirror 52a and the first mirror 51a, and a base 55b that supports the intermediate mirror 55a. Both the intermediate mirror 55a and the base 55b are housed in the mirror housing H11.

The intermediate mirror 55a is composed of, for example, a total reflection mirror. The intermediate mirror 55a receives the laser light reflected by the second mirror 52a and reflects the laser light toward the first mirror 51a.

The intermediate mirror 55a is also arranged to be aligned with the second mirror 52a in the Z direction, and is located on the +Z side of the second mirror 52a. The intermediate mirror 55a is also arranged to be aligned with the first mirror 51a in the Y direction, and is located on the -Y side of the first mirror 51a.

The intermediate mirror 55a receives the laser light reflected by the second mirror 52a and propagating toward the +Z side, and reflects it toward the +Y side. The laser light reflected by the intermediate mirror 55a reaches the first mirror 51a of the first scanner 51.

The base 55b is located at the bottom of the first casing 50 and supports the intermediate mirror 55a from the +Z side. In this embodiment, the base 55b supports the intermediate mirror 55a so that the mirror surface faces both the +Y and -Z sides.

-First scanner 51-
14, 15, and 16, the first scanner 51 has a first mirror 51a for scanning the laser light in a predetermined first direction and a first motor 51b for rotatably supporting the first mirror 51a. Of these, the first mirror 51a is housed in the mirror housing section H11, and most of the first motor 51b is housed in the board housing section H13.

The first mirror 51a is configured as a so-called galvanometer mirror. The first mirror 51a receives the laser light reflected by the intermediate mirror 55a. The first mirror 51a deflects the received laser light by reflecting it toward the +Z side. As the first mirror 51a rotates, the irradiation position of the laser light in the irradiation area R1 is scanned in the first direction.

Here, as shown in Figures 14 and 15, the first direction, which is the deflection direction by the first mirror 51a, is a direction perpendicular to both the second direction described above and the Z direction, which is the irradiation direction, and in this embodiment is set to coincide with the Y direction.

Note that the first and second directions are not limited to those set in this embodiment. The first direction may coincide with the X direction and the second direction may coincide with the Y direction, or the first and second directions may be inclined relative to the X and Y directions, respectively.

Specifically, the first mirror 51a is a generally rectangular, plate-shaped total reflection mirror that is supported on the tip of the rotation shaft of the first motor 51b and is housed within the mirror housing H11. The first mirror 51a rotates integrally with the shaft of the first motor 51b and is configured to be rotated by this first motor 51b around a predetermined first rotation axis Ac1. The amount of deflection by the first mirror 51a, and therefore the irradiation position of the laser light in the first direction, is determined based on the rotation angle of the first mirror 51a around this second rotation axis Ac2.

Here, the first rotation axis Ac1, which is the rotation center of the first mirror 51a, extends perpendicular to both the second rotation axis Ac2, which is the rotation center of the second mirror 52a, and the -Z direction, which is the irradiation direction, and in this embodiment is set to extend along the X direction.

By setting them in this way, the first rotation axis Ac1 and the second rotation axis Ac2 both extend in a direction different from the irradiation direction, for example, in a direction perpendicular to the irradiation direction (XY direction). Note that it is not necessary to configure the first rotation axis Ac1 and the second rotation axis Ac2 to be perpendicular to the irradiation direction; they may have an inclination angle of, for example, 20 degrees or less with respect to the XY direction.

In addition, in this embodiment, the first rotation axis Ac1 is offset toward the +Z side relative to the second rotation axis Ac2, but depending on the configuration of the intermediate mirror 55a, the first rotation axis Ac1 and the second rotation axis Ac2 can also be arranged on the same plane.

The first mirror 51a is also arranged alongside the intermediate mirror 55a in the Y direction, and is located on the +Y side of the intermediate mirror 55a. The first mirror 51a is further arranged alongside the cover glass 62 and defocus lens 57 in the Z direction, and is located on the -Z side of the defocus lens 57. As a result of this configuration, the first mirror 51a in this embodiment is arranged to face the workpiece W and, by extension, the irradiation area R1 across the exit window 6. The first mirror 51a is located directly above the exit window 6, and no other reflective mirrors are interposed between the first mirror 51a and the exit window 6. For ease of explanation, this embodiment defines the first mirror 51a as one in which no reflective mirror is interposed between it and the exit window 6, but this does not exclude the possibility of some kind of reflective mirror being interposed therebetween. If a reflective mirror is interposed between the first mirror 51a and the exit window 6, the mirror that scans the irradiation position in the irradiation area R1 just before reaching the irradiation area R1 is considered to be the first mirror 51a. Note that, because the area through which the laser light passes between the first mirror 51a and the exit window 6 expands due to the rotation of the second mirror 52a and the rotation of the first mirror 51a, the reflective mirror interposed must be large enough to cover the area through which the laser light passes. Therefore, in order to reduce the size of the marker head 1, it is preferable that no reflective mirror be interposed between the first mirror 51a and the exit window 6.

The first motor 51b is a galvanometer motor such as a DC motor, and is formed in a generally cylindrical shape with the first rotation axis Ac1 as its central axis. The tip (-X side end) of the first motor 51b in the direction of the first rotation axis Ac1 (X direction) is inserted into the seventh through-hole 50d in the first casing 50. Meanwhile, the other end (+Y side end of the first motor 51b) located on the opposite side of the tip in the direction of the first rotation axis Ac1 protrudes from the seventh through-hole 50d and is exposed inside the substrate accommodating section H13.

The first scanner 51 reflects the laser light via the first mirror 51a. The laser light reflected by the first mirror 51a passes through the defocus lens 57 and exits through the exit window 6. At this time, the first scanner 51 adjusts the reflection angle of the laser light using the first motor 51b, allowing the laser light to scan the irradiation area R1 in the first direction (Y direction).

-Defocus lens 57-
The defocus lens 57 is configured to transmit the laser light deflected by the first mirror 51 a and diffuse the laser light in an outward direction perpendicular to the irradiation direction. In this embodiment, when the irradiation direction is the Z direction, the outward diffusion direction is along the XY plane.

Specifically, the defocus lens 57 can be configured, for example, as a single biconcave lens. In this case, the defocus lens 57 is fitted into the fifth through-hole 50b with its central axis aligned in the Z direction.

The defocusing lens 57 is also arranged on a straight line connecting the first mirror 51a and the center of the cover glass 62 at the exit window 6. The defocusing lens 57 is arranged between the first mirror 51a and the cover glass 62 in the Z direction (in other words, on the +Z side of the first mirror 51a and the -Z side of the cover glass 62).

The defocusing lens 57 is further positioned so that its optical axis is coaxial with the optical axis of the cover glass 62. Hereinafter, the optical axes of the defocusing lens 57 and the cover glass 62 will be collectively referred to as the "laser emission axis" and will be denoted by the symbol Al (see also Figure 4). This laser emission axis Al extends along the Z direction and is offset toward the +Y side relative to the second mirror 52a and intermediate mirror 55a, while intersecting with the mirror surface of the first mirror 51a.

The configuration of the defocus lens 57 as an optical element is not limited to using a single biconcave lens. The optical element may be configured using multiple lenses, or may be configured using lenses other than biconcave lenses. Furthermore, the laser light scanning unit 5 may be configured without using a defocus lens 57 at all.

- Second control board 54 -
The second control board 54 is electrically connected to the marker controller 100 and the second scanner 52, and is configured to control the second scanner 52. More specifically, the second control board 54 can control the rotation angle of the second mirror 52 a by driving the second motor 52 b in accordance with a control signal input from the marker controller 100.

In this embodiment, the second control board 54 is composed of a circuit board in the shape of a substantially rectangular thin plate. The second control board 54 is housed in the board housing section H13 with both its front and back surfaces aligned in the Z and X directions, and is fastened to, for example, the vertical side 17a of the third base plate 17 from the -Y side.

As shown in FIG. 12, the second control board 54 is disposed on the +X side of the light source control board 24 in the X direction, and on the -Y side of the first casing 50 and the light source control board 24 in the Y direction. The second control board 54 is also electrically connected to the second motor 52b by wiring (not shown).

-First control board 53-
The first control board 53 is electrically connected to the marker controller 100 and the first scanner 51, and is configured to control the first scanner 51. More specifically, the first control board 53 can control the rotation angle of the first mirror 51 a by driving the first motor 51 b in accordance with a control signal input from the marker controller 100.

In this embodiment, the first control board 53 is composed of a circuit board in the shape of a substantially rectangular thin plate. The first control board 53 is housed in the board housing section H13 with both its front and back surfaces aligned in the Z and X directions, and is fastened to, for example, the vertical side 17a of the third base plate 17 from the -Y side.

As shown in FIG. 12, the first control board 53 is arranged alongside the second control board 54 in the X direction, and is located on the +X side of the light source control board 24 and the second control board 54. The first control board 53 is also electrically connected to the first motor 51b via wiring (not shown).

<Main operations and main processes of the laser processing device S>
19 is a flowchart illustrating a basic control process of the laser processing apparatus L. Hereinafter, the main operations and main processes of the laser processing apparatus L will be described with reference to FIG.

First, in step S1 of Figure 19, input of the processing pattern Pp to be printed on the setting plane R2 displayed on the display unit 303 is accepted. This input is accepted by the reception unit 103 and read by the control unit 103. The control unit 103 generates printing data based on the input processing pattern Pp. This printing data consists of the trajectory of the laser light on the workpiece W (so-called scanning lines), etc., which is set in accordance with the processing pattern Pp.

In the following step S2, the control unit 103 sets the voltage (supply voltage) to be supplied to the excitation light source 21. Details of this setting will be described later with reference to Figures 20 and 21.

In the following step S3, the control unit 103 inputs a control signal to the light source control board 24, etc., thereby supplying power to the excitation light source 21. This causes excitation light to be generated in the excitation light generation unit 2, and the excitation light is input to the laser light output unit 4.

In the following step S4, the control unit 103 inputs a control signal to the Q switch driver 49, etc., which controls the on/off of the Q switch 43 and pulses the UV laser light. This laser light is output from the laser light output unit 4 and input to the laser light scanning unit 5.

In the following step S5, the control unit 103 inputs control signals to the first control board 53 and the second control board 54, etc., thereby performing two-dimensional scanning with the UV laser light. "Two-dimensional scanning" here means moving the irradiation position of the laser light in two dimensions, i.e., in this embodiment, along the XY plane. Note that the shape of the workpiece W irradiated with the laser light is not limited to a two-dimensional shape along the XY plane, but may also be a three-dimensional shape with different positions in the Z direction (a shape in which the height in the Z direction changes).

At this time, in the laser light scanning unit 5, the UV laser light deflected by the second mirror 52a is reflected by the intermediate mirror 55a and then deflected again by the first mirror 51a. As shown in Figures 10 and 18, the UV laser light deflected by the first mirror 51a passes through the defocus lens 57 and cover glass 62 in sequence, and then passes through the aforementioned light path dividing section H3, and is emitted outside the housing 10. The UV laser light emitted outside the housing 10 is irradiated onto an irradiation area R1 set on the workpiece W. The UV laser light irradiated onto the workpiece W is scanned two-dimensionally within the irradiation area R1, tracing a scanning line in accordance with the print data.

<Measures to prevent heat generation in the excitation light source 21>
Fig. 20 is a block diagram for explaining the circuit structure of the power supply unit 104, and Fig. 21 is a flowchart illustrating an example of a control process related to the power supply unit 104. As described above, the excitation light source 21 is configured to receive power from the power supply unit 104, which serves as a power supply unit.

More specifically, as shown in FIG. 20, the power supply unit 104 according to this embodiment includes a DC power supply 104a that converts externally supplied AC power into DC power and outputs it, and a DC/DC converter 104b that performs DC/DC conversion of the power output from the DC power supply 104a. The power (particularly DC power) converted by the DC/DC converter 104b is input to the excitation light source 21, which is composed of an LD.

Here, a relay 25 is interposed between the DC/DC converter 104b and the excitation light source 21. This relay 25 opens and closes the electrical contacts between the DC/DC converter 104b and the excitation light source 21.

The relay 25 can be configured, for example, by a field effect transistor (FET). The relay 25 in this embodiment is configured by this FET, and opens and closes the electrical contacts based on control signals input from the PLC 902, control unit 103, etc. via the light source control board 24.

Conventionally, the output voltage input from DC/DC converter 104b to excitation light source 21 via a relay has been a fixed value. Variations in the forward voltage (so-called Vf) of excitation light source 21 have been compensated for by heat generation in relay 25. Variations in Vf can occur, for example, due to variations in the quality of the excitation light source 21 itself, which results in different Vf values being required for a given laser light output. For this reason, it is necessary to provide a margin in the output of DC/DC converter 104b (in other words, to set the output voltage of DC/DC converter 104b higher) in order to ensure a minimum laser light output even in the worst case.

However, when using such a conventional configuration, the amount of heat generated by the relay 25 tends to be large. This leads to an increase in the size of heat-generating structures such as heat sinks, which could cause problems when attempting to incorporate the excitation light source 21 into the marker head 1.

The control unit 103 in this embodiment controls the output voltage output from the power supply unit 104, which serves as a power supply unit, and input to the excitation light source 21. To this end, in this embodiment, as shown in FIG. 20, the control unit 103 and DC/DC converter 104b are electrically connected, and the output (the output voltage) from the DC/DC converter 104b is adjusted based on the control signal output from the control unit 103.

Furthermore, the control unit 103 according to this embodiment detects a voltage drop occurring in the relay 25 and controls the output voltage based on the detected voltage drop. Specifically, the control unit 103 controls the output voltage so that the detected voltage drop becomes a predetermined value. To achieve this, this embodiment is provided with a first monitor circuit 26 that monitors the voltage upstream of the relay 25 and a second monitor circuit 27 that monitors the voltage downstream of the relay 25, as shown in FIG. 20. The control unit 103 can estimate the voltage drop occurring in the relay 25 by calculating the difference between the voltage monitored by the first monitor circuit 26 and the voltage monitored by the second monitor circuit 27.

The "predetermined value" that serves as the criterion for determining a voltage drop can be set, for example, to 2.5 V when 1 ampere is flowing through the excitation light source 21. The predetermined value setting is stored in advance in the memory unit 102, and is configured to be read by the control unit 103 as needed.

As mentioned above, when the predetermined value is set to 2.5 V, the control unit 103 adjusts the output voltage of the DC/DC converter 104b so that the voltage drop occurring in the relay 25 is 2.5 V. This configuration eliminates the need to provide a margin in the output voltage of the DC/DC converter 104b, making it possible to suppress the output voltage and reduce heat generation in the relay 25.

Figure 21 is a flowchart illustrating an example of a control process related to the power supply unit 104. This control process can be executed, for example, in step S2 of the control process in Figure 19.

First, in step S101 of FIG. 21, the control unit 103 inputs a control signal to the relay 25 via the light source control board 24, electrically connecting the DC/DC converter 104b and the excitation light source 21. Then, the control unit 103 inputs a control signal to the power supply unit 104, and supplies the output voltage of the DC/DC converter 104b to the excitation light source 21 via the relay 25.

In the following step S102, the control unit 103 detects a voltage drop occurring in the relay 25 based on the detection signals from the first monitor circuit 26 and the second monitor circuit 27.

In the following step S103, the control unit 103 determines whether the voltage drop detected in step S102 matches the predetermined value set as described above. If this determination is NO, the control unit 103 advances the control process to step S105, adjusts the output voltage from the DC/DC converter 104, and returns to step S101. In other words, the control unit 103 is configured to repeat the processing of steps S101 to S103 and step S105 until the voltage drop matches the predetermined value. Note that in this embodiment, the control unit 103 determines whether the voltage drop occurring in the relay 25 matches the predetermined value (step S103 in FIG. 21), but the present disclosure is not limited to this. For example, the control unit 103 may determine whether the voltage drop falls within a certain range above or below the predetermined value. In other words, the control unit 103 may control the output voltage based on the detected voltage drop.

On the other hand, if the determination in step S103 is YES, the control unit 103 advances the control process to step S104 and ends the output adjustment of the DC/DC converter 104 (output determination). In this case, the control unit 103 ends the processing shown in FIG. 21 and advances the control process from step S2 to step S3 in FIG. 19. The subsequent processing is as described above.

<Lighting control of indicator 11>
As described above, the first lamp 11a, second lamp 11b, and third lamp 11c constituting the indicator 11 are lit in response to a control signal input from the marker controller 100. For example, the first lamp 11a emits light when the marker head 1 is powered on. On the other hand, the second lamp 11b is lit in response to the standard requirements of the UV laser light, and the third lamp 11c is lit in response to the state of the laser processing apparatus L, such as the irradiation state of the UV laser light and whether or not an error has occurred in the marker head 1. Details of the lighting states are as shown in Table 1.

Specifically, when the key switch is in the "OFF" state (KSW: OFF), the marker controller 100 turns off the first lamp 11a, second lamp 11b, and third lamp 11c.

When the key switch is in the "POWER ON" state (KSW: POWER ON), the marker controller 100 causes only the first lamp 11a to emit blue light and turns off both the second lamp 11b and the third lamp 11c.

When the key switch is in the "LASER ON" state (KSW: LASER ON), the marker controller 100 causes the first lamp 11a to emit blue light, the second lamp 11b to emit green light, and keeps the third lamp 11c off.

When the marker head 1 is ready to emit UV laser light (ready state), the marker controller 100 causes the first lamp 11a to emit blue light and both the second lamp 11b and the third lamp 11c to emit green light.

While UV laser light is being emitted from the marker head 1 (during laser irradiation), the marker controller 100 causes the first lamp 11a to emit blue light, the second lamp 11b to emit yellow light, and the third lamp 11c to emit green light.

When a warning that should be notified to the user occurs in the laser processing device L (a warning error occurs), the marker controller 100 causes the first lamp 11a to emit blue light, the second lamp 11b to emit green light, and the third lamp 11c to emit orange light.

If an abnormality occurs in the laser processing device L (an abnormality error occurs), the marker controller 100 causes the first lamp 11a to emit blue light, the second lamp 11b to emit green light, and the third lamp 11c to emit red light.

When the laser processing device L is in an interlocked state (for example, when the safety terminal block is in the off state), the marker controller 100 causes the first lamp 11a to emit blue light, the second lamp 11b to turn off, and the third lamp 11c to emit red light.

In this way, by controlling the lighting state of the indicator 11 provided on the front surface 10f of the housing 10, the user can intuitively visually recognize the status of the laser processing device L.

<Setting of the processing equipment 500 and the marker head 1>
18 is a diagram illustrating various dimensions of the marker head 1 and the support member 501. As shown in FIGS. 17A and 17B , the marker head 1 is attached to the support member 501 of the processing equipment 500 by replacing the printing device 1001 such as a TTO. The marker head 1 attached to the support member 501 irradiates UV laser light toward the workpiece W made of a sheet-like film, causing a chemical reaction in a UV reactive layer contained in the workpiece W, thereby performing printing processing on the workpiece W.

The processing equipment 500 and marker head 1 according to this embodiment are configured to suit such usage. Below, we will explain the settings for the processing equipment 500 and marker head 1, as well as the relative positional relationship between the processing equipment 500 and marker head 1.

First, the machining equipment 500 according to this embodiment has, in addition to the transport roller 502 that is driven to transport the workpiece W, a first driven roller 504l that is arranged on the +Y side of the transport roller 502 and around which the workpiece W is wrapped from the +Z side, and a second driven roller 504r that is arranged on the -Y side of the transport roller 502 and around which the workpiece W is wrapped from the -Z side.

The transport roller 504, which serves as a drive roller, transports the workpiece W at a speed of 1500 mm/s or more and 2000 mm/s or less along the Y direction, which serves as the transport direction At. The workpiece W transported by the transport roller 504 moves along a movement path defined by the transport roller 502, the first driven roller 504l, and the second driven roller 504r.

Here, the path of movement of the workpiece W that corresponds to the irradiation area R1 includes sections with different distances from the exit window 6. In other words, as shown in Figure 18, the path of movement of the workpiece W is configured so that its height varies within the range of the irradiation area R1.

In addition, in the movement path of the workpiece W, the first driven roller 504l, which is the roller immediately above the transport roller 502 and closest to the transport roller 502 among the rollers that contact the workpiece W upstream of the transport roller 502, and the second driven roller 504r, which is the roller immediately below the transport roller 502 and closest to the transport roller 502 among the rollers that contact the workpiece W downstream of the transport roller 502, are both driven rollers that rotate as the workpiece W is transported. The rollers immediately above and below the transport roller 502 are not limited to driven rollers, but even if driven by a separately provided drive source, they are preferably rollers that provide a large amount of slippage of the workpiece W relative to the transport roller 502. For example, if the material is one that has a large frictional force with respect to the workpiece W, the amount of slippage is small. Furthermore, if the surface material of each roller is the same, the greater the amount of contact with the workpiece W, the smaller the amount of slippage. If the rollers immediately above and below are driven rollers or rollers that provide a large amount of slippage relative to the transport roller 502, there is less chance of error in the amount of movement of the workpiece W relative to the rotation of the transport roller 502. Therefore, print quality can be improved by controlling printing based on the rotation of the transport roller W. In particular, compared to TTO, the marker head 1 of this embodiment prints on the workpiece W without contact, so if slippage occurs on the transport roller 502, the print position is likely to be misaligned. Therefore, it is preferable to position the marker head 1 so that the transport roller with the smallest amount of slippage relative to the rollers immediately before and after it is located in the irradiation area R1.

Here, the area of the movement path of the workpiece W that is irradiated with UV laser light corresponding to the irradiation area R1 is positioned so that it is farther away from the cover glass 62, which serves as an optical element, in the protruding direction of the second storage section H2 than the end of the second storage section H2 in the protruding direction.

Here, in this embodiment, the protruding direction of the second storage section H2 coincides with the irradiation direction of the UV laser light (i.e., the +Z direction). Furthermore, in this embodiment, the end of the second storage section H2 in the protruding direction corresponds to the +Z side end of the housing 10.

In other words, the area of the movement path of the workpiece W that is irradiated with UV laser light is positioned on the +Z side of the +Z end of the housing 10. In other words, the area of the movement path of the workpiece W that is irradiated with UV laser light does not enter the optical path partition H3 (it is positioned on the +Z side of the optical path partition H3). This configuration makes it easy to insert the workpiece W into the movement path from the front of the movement path of the workpiece W. This makes it easy to set the workpiece W on the movement path.

Also, as shown in Figure 18, the apex 502a of the conveying roller 502 on the cover glass 62 side (-Z side) is offset to the upstream side (+Y side) or downstream side (-Y side) of the conveying direction At, which is approximately aligned with the Y direction, relative to the center line (laser emission axis Al) that passes through the center of the cover glass 62 (offset to the +Y side in the illustrated example).

In other words, the center line Ar, which passes through the rotation axis of the conveying roller 502 and extends in the Z direction, is offset upstream or downstream from the laser emission axis Al. In other words, the laser emission axis Al, which extends in the Z direction, and the rotation axis of the conveying roller 502, which extends in the X direction, are laid out so that they do not intersect with each other.

In other words, the above relationship can be further restated as follows: the laser emission axis Al is offset from the top 502a to the upstream side (+Y side) or downstream side (-Y side) of the conveying direction At (offset to the -Y side in the illustrated example). Specifically, as shown in FIG. 18, between the workpiece W on the upstream side of the top 502a and the workpiece W on the downstream side, the latter workpiece W has a smaller inclination with respect to the plane (XY plane) perpendicular to the laser emission axis Al. In other words, the workpiece W on the downstream side of the top 502a is inclined more gently than the upstream workpiece W. In this embodiment, the laser emission axis Al is offset from the upstream or downstream side of the conveying direction At, toward the side where the inclination of the workpiece W with respect to the plane perpendicular to the laser emission axis Al is smaller, like the downstream workpiece W.

The size of the irradiation area R1 is set to be larger than the printable area (printing area) of the printing device 1001 configured as a TTO before replacement. The TTO prints on the workpiece W by bringing the printing unit 1006, which extends in the short direction of the workpiece W, into contact with the workpiece W. Therefore, even if the printing area on the workpiece W has a constant length in the long direction of the workpiece W, as long as the printable range of the printing unit 1006 in the short direction of the workpiece W is positioned so that it includes the printing area on the workpiece W, it is possible to print on the entire printing area on the workpiece W by passing the workpiece W past the printing unit 1006. In contrast, with the marker head 1, the portion irradiated with laser light at a given moment is point-like, although it has a constant area. Therefore, if the printing area on the workpiece W is an area having a constant length in the long direction of the workpiece W, it is preferable that the irradiation area R1 irradiated with laser light has a constant length (dimension) in the direction corresponding to the long direction of the workpiece W. Specifically, the dimension of the irradiation area R1 in the transport direction At (see symbol L5 in Figure 17A) is set to be 120 mm or greater when the workpiece W is parallel to the XY plane. Note that in this embodiment, the irradiation area R1 refers to the area on the surface of the workpiece W that can be irradiated with laser light by the first scanner 51 and the second scanner 52.

Furthermore, when the workpiece W is parallel to the XY plane, the size of the irradiation area R1 is set so that the irradiation area R1 is covered by the bottom surface 10d of the housing 10 in the XY plane. That is, when viewed in the Z direction perpendicular to the XY plane, the entire irradiation area R1 overlaps the bottom surface 10d, the dimension L5 of the irradiation area R1 in the Y direction is smaller than the Y direction dimension of the bottom surface 10d of the housing 10, and the dimension L6 of the irradiation area R1 in the X direction is smaller than the X direction dimension of the housing 10d. This configuration reduces leakage of laser light irradiated onto the workpiece W. In particular, when the distance from the +Z side end of the housing 10 to the workpiece W (see distance L2 in Figure 18) is set to between 0 mm and 20 mm, laser light leakage is reduced. Furthermore, when the workpiece W is a sheet-like workpiece W transported around multiple transport rollers, the user can easily set the workpiece W on the workpiece W's movement path by inserting the workpiece W from the front of the transport rollers. Therefore, leaving the front of the movement path of the workpiece W open makes it easier to set the workpiece W on the movement path. Therefore, with a configuration in which the entire length of the irradiation area R1 in the X direction fits within the bottom surface 10d, the front of the movement path is open, maintaining ease of setting the workpiece W while reducing leakage of laser light. Note that if a configuration is used to reduce leakage of laser light using a member covering the front side of the workpiece W, there is a risk that the workpiece W will come into contact with this member when the workpiece W travels obliquely, resulting in contamination of the workpiece W. Therefore, a configuration in which the front of the workpiece W is open reduces the risk of contamination of the workpiece W.

These settings are particularly effective when printing eight characters on a workpiece W by irradiating a 3 mm x 2 mm square with UV laser light for 10 ms per character. The parameters for the UV laser light are suitable for printing thick lines using three scan lines, achieving a line width of 0.2 to 0.35 mm (corresponding to a target line width of 100 to 150 μm per scan line).

By setting the irradiation area R1 so that it is larger than the printable area of the TTO, it becomes possible to perform printing within the irradiation area R1 while the irradiation position of the UV laser light follows the transport of the workpiece W. This ensures a printable area similar to that of the TTO.

On the other hand, the output of the laser light generated in the marker head 1 and passing through the exit window 6 is set to between 1 W and 2 W. This setting was determined to achieve a compact marker head 1. The color of the print when laser light is irradiated for a certain period of time varies depending on the power density of the irradiated laser light. When the output of the laser light is between 1 W and 2 W, it is preferable that the spot diameter of the laser light be 160 μm or less to obtain sufficient color development.

More preferably, the spot diameter of the laser light in the irradiation area R1 is set to 60 μm or more and 80 μm or less. This spot diameter can be set so that the focal depth of the laser light corresponds to the part of the irradiation area R1 where the optical path length of the laser light is longest (the edge of the irradiation area R1) and the part of the irradiation area R1 where the optical path length is shortest (the center of the irradiation area R1).

For example, the lower limit of the spot diameter is set to correspond to the number of scanning lines and line width described above. This setting is effective in suppressing the effect of the difference in optical path length between the center and end of the irradiation area R1 without adjusting the focus along the Z direction when the distance from the +Z side end of the housing 10 to the workpiece W (see distance L2 in Figure 18) is set to 0 mm or more and 20 mm or less, and when the dimension of the irradiation area R1 is set to 120 mm or more.

On the other hand, the upper limit of the spot diameter is effective when printing thick lines with a thickness of 200 μm (0.2 mm) or more, such as the line width of 0.2 to 0.35 mm mentioned above. In this case, there is a concern that the processing time required for thick line processing will be relatively long. However, by setting the upper limit of the spot diameter as mentioned above, the irradiation area R1 of the UV laser light can be increased, and the irradiation time can be extended.

The upper limit of the spot diameter (80 μm) is the optimal value when UV laser light is irradiated parallel to the irradiation direction and the distance L2 is set to 10 mm. If the distance L2 is changed within the range of 0 mm to 20 mm, the upper limit of the spot diameter becomes 120 μm.

If there is a concern about differences in optical path length within the irradiation area R1, the depth of focus can be increased by providing the aforementioned defocus lens 57. Increasing the depth of focus is effective in suppressing the effects of differences in optical path length.

Furthermore, among the relative positions of the workpiece W with respect to the housing 10, the relative positions at which printing is possible with respect to the workpiece W are set so that the distance from the first mirror 51a to the surface of the workpiece W (particularly the distance as viewed along the irradiation direction, which corresponds to the sum of distances L2 and L3 in Figure 19) is 150 mm or less.

In addition to the above, in this embodiment, the distance from the top surface 10u of the housing 10 to the workpiece W is set to 195 mm or less. The TTO as the printing device 1001 before replacement is often used in an environment where the distance from the top surface to the workpiece W is around 200 mm, and can be used in the same environment as the printing device 1001 before replacement. Specifically, in this embodiment, the distance L1 from the top surface 10u of the housing 10 to the +Z side end of the bottom surface 10d is set to 165 mm. The distance L2 from the +Z side end of the bottom surface 10d to the workpiece W is preferably set to 30 mm or less, and more preferably 20 mm or less.

Here, by setting the distance L2 to 30 mm or less, the specularly reflected light from the workpiece W of the laser light irradiated onto the irradiation area R1 can be guided to the area between the first plate-shaped member 18l and the second plate-shaped member 18r, i.e., the optical path partition H3. This is effective in preventing the specularly reflected light from leaking outside the housing 10.

In this embodiment, the distance L3 from the first mirror 51a to the +Z end of the bottom surface 10d is set to 123 mm. The distance L4 from the bottom surface of the defocus lens 57 to the +Z end of the bottom surface 10d is set to 100 mm. Considering that the thickness of the defocus lens 57 is 2 mm, the distance (not shown) from the top surface of the defocus lens 57 to the +Z end of the bottom surface 10d is set to 102 mm.

Here, the distance from the top surface 10u to the first mirror 51a (= L1 - L3) is 42 mm, and the distance from the top surface 10u to the defocus lens 57 (= L1 - L4) is 65 mm. Meanwhile, the center of the housing 10 in the Z direction corresponds to a location approximately 82 mm (= L1/2) from the top surface 10u. Therefore, in this embodiment, both the first mirror 51a and the defocus lens 57 are located on the -Z side of the center of the housing 10 in the Z direction.

<About compact installation space>
As described above, according to this embodiment, the housing 10 is formed with a first housing portion H1 in which the cover glass 62 is provided, and a second housing portion H2 that protrudes so as to surround the periphery of the cover glass 62 (see FIG. 10 ). The second housing portion H2 can block the laser light that has passed through the cover glass 62. Furthermore, by utilizing a portion of the housing 10 to block the laser light, the installation space for the housing 10 can be made more compact than in a configuration in which a light-blocking member is attached to the underside of the housing 10.

Furthermore, as shown in Figure 10, the first storage section H1 and the second storage section H2 are not storage sections that divide an integrated space into two regions for convenience, but are each configured as storage sections that divide independent spaces.

This configuration makes the first housing section H1 suitable for housing components that require liquid-tightness, such as optical elements. On the other hand, the second housing section H2 is connected to the space outside the housing 10, allowing air to be taken in from outside the housing 10, making it suitable for arranging a heat sink or the like.

Furthermore, as shown in Figures 10 to 13, the optical system can be concentrated in the crystal housing section H12 and mirror housing section H11 of the first housing section H1, eliminating the need for a component that deflects the laser light in the direction from the optical components toward the irradiation area R1 (+Z direction). This contributes to the miniaturization of the housing 10.

Furthermore, as shown in Figures 3A and 4, by providing a first mark M1, a second mark M2, and a third mark M3 on the outer surface of the housing 10, positioning of the housing 10 becomes easier. This makes it easier to install the housing 10 than before.

Furthermore, as shown in FIG. 18, the region R1 on the path of movement of the workpiece W where the laser light is irradiated is located below the lower end of the second storage section H2 (farther downward from the cover glass 62 than the lower end). By arranging it in this manner, the workpiece W is prevented from entering the second storage section H2, and thus interference between the second storage section H2 and the workpiece W can be prevented.

Also, as shown in Figure 18, the top 502a of the transport roller 502 is positioned offset in the transport direction from the center (laser emission axis Al) of the cover glass 62. By positioning it in this manner, the workpiece W before and after being wound around the transport roller 502 can face the cover glass 62. This makes it easier to set a long linear path before and after the transport roller 502 within the transport path of the workpiece W. Furthermore, by separating the top 502a of the transport roller 502 from the cover glass 62, a longer distance can be secured between the transport roller 502 and the cover glass 62, which also contributes to improved maintainability.

Also, as shown in Figure 18, the length over which the workpiece W contacts the transport roller 502 on the path between the top 502a and the driven roller 504r is shorter than the length over which the workpiece W contacts the transport roller 502 on the path between the top 502a and the driven roller 504l, and the marker head 1 is positioned with the laser emission axis A1 shifted toward the driven roller 504r relative to the top 502a along the transport direction. As shown in Figure 18, the path between the tops 502a and 504r has a gentler slope, and by positioning the marker head 1 so that the irradiation area includes more of the gentler slope, printing quality is improved.

As shown in Figure 18 and other figures, the interior of the housing 10 is divided into a space (light path partition H3) that includes the light path closer to the irradiation area R1, and a space that houses components (first storage section H1 and second storage section H2). The former space can block the laser light just before it reaches the irradiation area R1. Furthermore, by utilizing a portion of the space in the housing 10 to block the laser light, the installation space for the housing 10 can be made more compact compared to a configuration in which a light-blocking member is attached to the underside of the housing 10.

Other Embodiments
In the above embodiment, the excitation light source 21 is housed in the housing 10 of the marker head 1, but the present disclosure is not limited to such a configuration. For example, the excitation light source 21 may be provided in the marker controller 100.

Furthermore, in the above embodiment, one of the six surfaces of the housing 10 other than the bottom surface 10d on which the exit window 6 is formed (in the above embodiment, this was the top surface 10u) was set as the mounting surface, but the present disclosure is not limited to this setting. Any one of the six surfaces may be considered to be the mounting surface. If the bottom surface 10d is considered to be the mounting surface, the support member 501 of the processing equipment 500 will support the bottom surface 10d, for example, from below.

Furthermore, two or more of the six surfaces of the housing 10 can be considered mounting surfaces. For example, if the left side surface 10l and the top surface 10u are considered mounting surfaces, the attachment 7 may be attached to either the left side surface 10l or the top surface 10u, or it may be attached to both the left side surface 10l and the top surface 10u, as in the marker head 1' shown in Figure 22.

For example, the attachment 2007 shown in Figure 22 has a first portion 2007a that is attached to the top surface 10u and a second portion 2007b that is attached to the left side surface 10l, and the support member 501' also has a shape that is compatible with the attachment 2007. In this way, the attachment surface can be set according to the shape of the support member 501', and an attachment 2007 that corresponds to that setting can be used.

Furthermore, the attachment 7 is not essential in the first place. As with the housing 10" of the marker head 1" shown in Figure 23, the support member 501 can be attached directly to the mounting surface (top surface 10u" in the illustrated example) without using the attachment 7. In this case, a portion of the mounting surface can be considered the attachment. Also, a portion of the mounting surface can be made to protrude in the opposite direction from the exit window 6, and this protrusion can be used as the attachment.

In addition, in the above embodiment, the crystal housing section H12, mirror housing section H11, and substrate housing section H13, which are formed by dividing the first housing section H1 in the housing 10 into three sections, were arranged in this order along the Y direction, which is perpendicular to the irradiation direction. However, the present disclosure is not limited to this configuration. For example, the order of the crystal housing section H12, mirror housing section H11, and substrate housing section H13 may be reversed, or any two of the crystal housing section H12, mirror housing section H11, and substrate housing section H13 may be arranged side by side along the irradiation direction.

S Laser processing system L Laser processing device 1 Marker head 2 Excitation light generating unit 21 Excitation light source 23 Temperature control unit 25 Relay 3 Excitation light guiding unit (light guiding optical system)
31 Fiber cable 32 Fiber guide 4 Laser light output unit 41 Solid-state laser crystal 43 Q switch 45 Nonlinear optical crystal 49 Q switch driver 5 Laser light scanning unit (laser light deflection unit)
51 First scanner 51a First mirror 52 Second scanner 52a Second mirror 53 First control board 55 Intermediate deflection unit 55a Intermediate mirror 57 Defocus lens (optical element)
6 Exit window 62 Cover glass (optical member)
7 Attachment 81 First heat sink (heat sink)
82 Second heat sink (heat sink)
83 First blower fan (blower section)
84 Second blower fan (blower section)
10 Housing 10u Top surface (mounting surface)
10d Bottom 10f Front (open side)
10b Back side (connection surface)
13 Cover member 14 Connection cover 15 First base plate (support plate)
15g Partition surface 18l First plate-shaped member (plate-shaped member)
18r: second plate-shaped member (plate-shaped member)
100 Marker controller 101 Reception unit 103 Control unit 104 Power supply unit (power supply unit)
200 Electric cable 500 Processing equipment 501 Support member 502 Conveying roller 502a Conveying roller top Ac1 First rotation axis Ac2 Second rotation axis Ae Extension direction At Conveying direction H1 First storage section H11 Mirror storage section H12 Crystal storage section H13 Substrate storage section H2 Second storage section H21 Crystal side storage section H22 Light source side storage section H3 Optical path dividing section M1 First mark (mark)
M2 Second Mark (Mark)
M3 3rd Mark (Mark)
Pp Processing pattern R1 Irradiation area W Work

Claims (14)

A laser processing device that processes a workpiece by irradiating an irradiation area with laser light,
a laser beam deflection unit that deflects the laser beam in accordance with a predetermined processing setting;
a housing that houses the laser beam deflection unit,
The housing includes:
a first storage unit having an optical member that transmits the laser light deflected by the laser light deflection unit and directed toward the irradiation area , and having a rectangular plate-shaped top surface extending along orthogonal X and Y directions ;
a second housing portion formed by protruding at least a part of the periphery of the optical member toward the irradiation area beyond the optical member ;
The second housing portion has a plate-like member that extends from a center line that passes through a center portion of the optical member and intersects with the second housing portion to define an internal space whose dimension in the X direction is longer than that in the Y direction.
A laser processing device characterized by: 2. The laser processing apparatus according to claim 1,
The second accommodating portion has a first plate-shaped member and a second plate-shaped member as the plate-shaped member so that two internal spaces are formed with an interval in the Y direction.
A laser processing device characterized by: 2. The laser processing apparatus according to claim 1,
The second housing portion has a vent hole on one surface of the housing in the X direction,
The vent is in communication with the interior space.
A laser processing device characterized by: 4. The laser processing apparatus according to claim 3,
A heat sink is disposed in the internal space at a position where the airflow flowing in from the ventilation opening passes through.
A laser processing device characterized by: 5. The laser processing apparatus according to claim 4,
The interior space further includes a blower fan for generating an airflow that flows in through the ventilation opening.
A laser processing device characterized by: 2. The laser processing apparatus according to claim 1,
the first housing section houses a laser beam output section that generates a laser beam to be deflected by the laser beam deflection section;
The laser processing device is characterized in that the second accommodating section accommodates a heat sink thermally coupled to the laser light output section in an internal space partitioned by the plate-like member . 7. The laser processing apparatus according to claim 1,
the housing has an exit surface on which an exit window having the optical member is formed,
The laser processing device is characterized in that the irradiation area is covered by the emission surface. The laser processing apparatus according to any one of claims 1 to 7 ,
The laser processing device is characterized in that a mark is provided on the outer surface of the housing, the mark being arranged to correspond to the position of the irradiation area. The laser processing apparatus according to any one of claims 1 to 8 ,
The laser processing device is characterized in that the housing has an open surface that is at least partially open so as to communicate with the optical member. 10. The laser processing apparatus according to claim 9 ,
The laser processing device is characterized in that a cover member capable of opening the open surface is provided on the open surface. The laser processing apparatus according to any one of claims 1 to 10 ,
the workpiece is a sheet-like film transported along a predetermined moving path,
A laser processing device characterized in that the area of the movement path onto which laser light is irradiated corresponding to the irradiation area is positioned so as to be farther away from the optical element in the protruding direction of the second accommodating section than the end of the second accommodating section in the protruding direction. The laser processing apparatus according to any one of claims 1 to 11 ,
the workpiece is configured by a sheet-like film that is wound around a conveying roller and conveyed in a longitudinal direction by the rotation of the conveying roller;
A laser processing device characterized in that a center line passing through the center of the optical element is offset upstream or downstream in the conveying direction of the workpiece relative to the top of the conveying roller on the optical element side. 13. The laser processing apparatus according to claim 12 ,
A laser processing device characterized in that a center line passing through the center of the optical element is offset to either the upstream or downstream side in the conveying direction, whichever side has the smaller inclination of the workpiece relative to a plane perpendicular to the center line. A laser processing device that processes a workpiece by irradiating an irradiation area with laser light,
a laser beam deflection unit that deflects the laser beam by driving the first mirror in accordance with a predetermined processing setting;
a housing that houses the laser beam deflector and has a plate-like member that separates a first space that includes a portion of an optical path of the laser beam that connects the first mirror and the irradiation area closer to the irradiation area from a second space that houses a member ;
the housing has a rectangular plate-shaped top surface extending along orthogonal X and Y directions,
The second space is configured so that its dimension in the X direction is longer than its dimension in the Y direction so as to extend from the optical path of the laser light in the first space and intersect with the second space.
A laser processing device characterized by: