JP7661761B2 - Cooler, semiconductor device, and power conversion device - Google Patents

Description

This disclosure relates to a cooler, a semiconductor device, and a power conversion device.

Cooling pipes that circulate refrigerant inside the power semiconductor package are used to prevent the temperature from rising due to heat generation.

Patent Document 1 discloses a stacked cooler having multiple cooling pipes arranged in a stacked manner so that electronic components can be clamped from both sides, a supply header section, and a discharge header section. The cooling pipes have a first joint section connected to the supply header section, a second joint section connected to the discharge header section, and an expansion section formed between the first joint section and the second joint section.

Patent Document 2 discloses a refrigerant-cooled double-sided semiconductor device that includes multiple flat refrigerant pipes, an inlet header, an outlet header, and a clamping section that clamps the semiconductor module (semiconductor package) and the flat refrigerant pipes in the stacking direction.

JP 2008-016718 A JP 2004-214623 A

In electronic devices that use semiconductor packages, there is a need to efficiently cool the semiconductor packages while they are in operation.

This disclosure provides a technology for efficiently cooling a semiconductor package while the semiconductor package is in operation.

According to one aspect of the present disclosure, a cooler is provided that includes a plurality of multi-hole pipes arranged in a line and spaced apart in a first direction, a first header to which one end of each of the plurality of multi-hole pipes is joined, and a second header arranged in a second direction intersecting the first direction and spaced apart from the first header, to which the other end of each of the plurality of multi-hole pipes is joined, and a first multi-hole pipe of any one of the plurality of multi-hole pipes has a first inclined portion at one end of the first multi-hole pipe that is inclined in the first direction with respect to the second direction, and a second inclined portion at the other end of the first multi-hole pipe that is inclined in the first direction with respect to the second direction.

According to the present disclosure, a semiconductor package can be efficiently cooled while the semiconductor package is in operation.

FIG. 1 is a perspective view of a semiconductor device according to the present embodiment. FIG. 2 is an exploded perspective view of the semiconductor device of the present embodiment. FIG. 3 is a top view of the semiconductor package of the semiconductor device of the present embodiment. FIG. 4 is a bottom view of the semiconductor package of the semiconductor device of the present embodiment. FIG. 5 is a perspective view of a cooler for the semiconductor device according to the present embodiment. FIG. 6 is an exploded perspective view of the cooler of the semiconductor device of the present embodiment. FIG. 7 is a perspective view of a header of a cooler for the semiconductor device of this embodiment. FIG. 8 is a cross-sectional view of a multi-hole pipe of a cooler for a semiconductor device according to this embodiment. FIG. 9 is a cross-sectional view of the semiconductor device of this embodiment. FIG. 10 is a cross-sectional view of the semiconductor device of this embodiment. FIG. 11 is a side view showing an outline of the cooler of the semiconductor device of the present embodiment. FIG. 12 is a side view showing an outline of a modification of the cooler of the semiconductor device of the present embodiment. FIG. 13 is a diagram showing the connection between the multi-hole pipe of the cooler and the header of the semiconductor device of this embodiment. FIG. 14 is a diagram showing the connection between the multi-hole pipe of the cooler and the header of the semiconductor device of this embodiment. FIG. 15 is a diagram showing the connection between the multi-hole pipe of the cooler and the header of the semiconductor device of this embodiment. FIG. 16 is a perspective view of a power converter using the semiconductor device of this embodiment. FIG. 17 is a perspective view of a power converter using the semiconductor device of this embodiment.

Each embodiment of the present invention will be described below with reference to the attached drawings. Note that, in the description of the specification and drawings relating to each embodiment, components having substantially the same or corresponding functional configurations may be given the same reference numerals to avoid redundant description. Also, to facilitate understanding, the scale of each part in the drawings may differ from the actual scale.

In directions such as parallel, right-angled, orthogonal, horizontal, vertical, up-down, left-right, and the like, deviations are permitted to the extent that they do not impair the effects of the embodiment. The shape of the corners is not limited to right angles, and may be rounded in a bow shape. Parallel, right-angled, orthogonal, horizontal, and vertical may include approximately parallel, approximately right-angled, approximately orthogonal, approximately horizontal, and approximately vertical.

<<Semiconductor device 1>>
Fig. 1 is a perspective view of a semiconductor device 1 according to the present embodiment. Fig. 2 is an exploded perspective view of the semiconductor device 1 according to the present embodiment. The semiconductor device 1 is, for example, a power converter that converts direct current into alternating current using two semiconductor packages 20 and supplies power to each phase of a three-phase motor. The semiconductor device 1 is used, for example, in a power conversion device that drives a motor.

For ease of explanation, an XYZ Cartesian coordinate system may be set in the figures. For coordinate axes perpendicular to the plane of the drawing, a cross in a circle indicates that the direction toward the back of the plane of the paper is positive, and a black circle in a circle indicates that the direction toward the front of the plane of the paper is positive. However, this coordinate system is defined for the purpose of explanation and does not limit the orientation of the semiconductor device 1, etc.

In this disclosure, unless otherwise specified, the X-axis is the extension direction of the first multi-hole tube 30b1, the second multi-hole tube 30b2, and the third multi-hole tube 30b3 of the cooler 30. The Y-axis is the direction in which the first multi-hole tube 30b1, the second multi-hole tube 30b2, and the third multi-hole tube 30b3 of the cooler 30 are adjacent to each other. The Y-axis direction may be referred to as the up-down direction. The Z-axis is the direction perpendicular to the X-axis and Y-axis.

The semiconductor device 1 includes a plurality of semiconductor packages 20 and a cooler 30.

The semiconductor device 1 of this embodiment includes six semiconductor packages 20. Specifically, the semiconductor device 1 includes semiconductor package 21, semiconductor package 22, semiconductor package 23, semiconductor package 24, semiconductor package 25, and semiconductor package 26. In the following description, when there is no need to distinguish between the semiconductor package 21, semiconductor package 22, semiconductor package 23, semiconductor package 24, semiconductor package 25, and semiconductor package 26, they may be collectively referred to as semiconductor package 20.

The semiconductor packages 20 are arranged and held in three rows and two columns between the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 of the cooler 30, which will be described later. The semiconductor packages 20 are provided between two adjacent multi-hole pipes. A refrigerant (thermal refrigerant), for example, cooling water, is introduced into the cooler 30 from the refrigerant inlet 30ap1. The refrigerant introduced into the cooler 30 is discharged from the refrigerant outlet 30ap2. The semiconductor packages 20 are cooled by exchanging heat with the cooling water flowing through the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3.

Between the first multi-hole pipe 30b1 and the second multi-hole pipe 30b2, semiconductor package 21, semiconductor package 22, and semiconductor package 23 are arranged in order from the first header 30a side. Also, between the second multi-hole pipe 30b2 and the third multi-hole pipe 30b3, semiconductor package 24, semiconductor package 25, and semiconductor package 26 are arranged in order from the first header 30a side.

The details of the semiconductor package 20 and the cooler 30 of the semiconductor device 1 will be described below.

<Semiconductor package 20>
Fig. 3 is a top view of the semiconductor package 20 of the semiconductor device 1 of the present embodiment. Fig. 4 is a bottom view of the semiconductor package 20 of the semiconductor device 1 of the present embodiment.

The semiconductor package 20 is, for example, a so-called 2-in-1 semiconductor package in which two semiconductor elements constituting the upper and lower arms for one phase are packaged. The semiconductor package 20 is also a so-called double-sided cooling type semiconductor package. Semiconductor elements such as power transistors, for example, IGBTs (Insulated Gate Bipolar Transistors) and FETs (Field-Effect Transistors), are built into the semiconductor package 20.

The built-in semiconductor element may be a power MOSFET (Metal Oxide Semiconductor Field Effect Transistor) or a FWD (Free Wheeling Diode). The mounted semiconductor element may be a RB-IGBT (Reverse Blocking-Insulated Gate Bipolar Transistor) in which the aforementioned IGBT or FWD is integrated into a single chip. The mounted semiconductor element may be a RC-IGBT (Reverse Conducting-Insulated Gate Bipolar Transistor) in which the aforementioned IGBT or FWD is integrated into a single chip.

The semiconductor package 20 includes a case 20d made of resin, such as epoxy resin, that is substantially rectangular. The case 20d has a top surface 20dA and a bottom surface 20dB on the opposite side to the top surface 20dA.

The semiconductor package 20 has current terminals 20a1, 20a2, and 20a3, and control terminals 20b1, 20b2, 20b3, and 20b4 on the side of the case 20d. The current terminals 20a1, 20a2, and 20a3, and the control terminals 20b1, 20b2, 20b3, and 20b4 are provided protruding from the side of the case 20d of the semiconductor package 20.

Current terminal 20a1, current terminal 20a2, and current terminal 20a3 are, for example, terminals for passing a current through a load. Current terminal 20a1, current terminal 20a2, and current terminal 20a3 are formed of a conductive material. Control terminal 20b1, control terminal 20b2, control terminal 20b3, and control terminal 20b4 are terminals for controlling the current passed through the load. Control terminal 20b1, control terminal 20b2, control terminal 20b3, and control terminal 20b4 are formed of a conductive material.

The semiconductor package 20 also has a heat sink 20c1 and a heat sink 20c2. For example, a power transistor built into the semiconductor package 20 is a heat generating element and therefore needs to be cooled. The heat sink 20c1 and the heat sink 20c2 are provided to dissipate heat from the heat generating element. The heat sink 20c1 and the heat sink 20c2 are each formed of a material with high thermal conductivity, for example, a metal such as copper. The heat sink 20c1 and the heat sink 20c2 are each thermally connected to the heat generating element. The heat sink 20c1 is provided on the upper surface 20dA of the case 20d. The heat sink 20c2 is provided on the lower surface 20dB of the case 20d.

<Cooler 30>
Fig. 5 is a perspective view of the cooler 30 of the semiconductor device 1 of the present embodiment. Fig. 6 is an exploded perspective view of the cooler 30 of the semiconductor device 1 of the present embodiment.

The cooler 30 cools the semiconductor package 20. A refrigerant flows through the inside of the cooler 30. The cooler 30 cools the semiconductor package 20 by exchanging heat between the refrigerant (e.g., cooling water) flowing through the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 and the semiconductor package 20. The refrigerant is not limited to water, and may be a liquid containing antifreeze.

The cooler 30 includes a first header 30a, a first multi-hole pipe 30b1, a second multi-hole pipe 30b2, and a third multi-hole pipe 30b3, and a second header 30c. The second header 30c is provided at a distance from the first header 30a in the X-axis direction. The first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are provided at a predetermined distance in the Y-axis direction, i.e., a direction intersecting the X-axis direction, specifically, at a distance that can hold the semiconductor package 20.

The X-axis direction is an example of the second direction.

The first header 30a is connected to one end of each of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3. Specifically, the first header 30a is connected to the -X side end of each of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3. The second header 30c is connected to the other end of each of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3. Specifically, the second header 30c is connected to the +X side end of each of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3.

[First header 30a]
First, the first header 30a will be described. Fig. 7 is a perspective view of the first header 30a of the cooler 30 of the semiconductor device 1 of this embodiment. The first header 30a introduces the refrigerant into the inside of the cooler 30 and discharges it to the outside of the cooler 30. The first header 30a is a hollow rectangular parallelepiped formed by walls 30aA, 30aB, 30aC, 30aD, 30aE, and 30aF.

A part of the wall 30aE, which is the wall on the +X side of the first header 30a, is released. Specifically, the first header 30a has openings 30ah1, 30ah2, and 30ah3 in the wall 30aE. One end of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 is inserted and fixed into the openings 30ah1, 30ah2, and 30ah3 of the first header 30a, respectively. The first header 30a and the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are fixed, for example, by brazing, to ensure watertightness.

The first header 30a has a refrigerant inlet 30ap1 and a refrigerant outlet 30ap2 in the wall portion 30aF. The refrigerant inlet 30ap1 introduces refrigerant from an external cooling device. The refrigerant outlet 30ap2 discharges the refrigerant to the external cooling device. The first header 30a has a partition wall inside, which will be described later. The partition wall is a wall that separates the refrigerant introduced into the first header 30a from the refrigerant discharged from the first header 30a. The partition wall will be described in detail later.

[First multi-hole pipe 30b1, second multi-hole pipe 30b2, third multi-hole pipe 30b3]
Next, the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 will be described. FIG. 8 is a cross-sectional view of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 of the cooler 30 of the semiconductor device 1 of this embodiment. Note that FIG. 8 representatively shows a cross-sectional view cut at the center of the second multi-hole pipe 30b2. The first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are pipes whose longitudinal ends are open and through which a refrigerant flows. In addition, the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 cool the semiconductor package 20 by exchanging heat with the refrigerant flowing through the inside of the multi-hole pipe.

The cross section of the first multi-hole tube 30b1, the second multi-hole tube 30b2, and the third multi-hole tube 30b3 in the short direction has an external shape that is approximately rectangular. The first multi-hole tube 30b1, the second multi-hole tube 30b2, and the third multi-hole tube 30b3 are so-called microchannels having a divided flow path 30bc inside. Note that the flow path 30bc in this embodiment may be created with dimensions on the order of millimeters.

Each flow path 30bc of the first multi-hole tube 30b1, the second multi-hole tube 30b2, and the third multi-hole tube 30b3 is a rectangular microchannel that is long in the Y-axis direction (up and down direction). Note that the flow path 30bc may be divided into two or more stages in the Y-axis direction.

The Y-axis direction (up-down direction) is an example of the first direction.

The first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 have cooling surfaces 30bA and 30bB. When the semiconductor package 20 is cooled by the cooler 30, the semiconductor package 20 to be cooled is provided in contact with the cooling surface 30bA or the cooling surface 30bB. Specifically, the cooling surface 30bA or the cooling surface 30bB is thermally joined to the heat sink 20c1 or the heat sink 20c2 of the semiconductor package 20 by soldering or a joining member such as thermally conductive grease, which will be described later.

The flow paths 30bc of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 have a uniform cross-sectional area in the extension direction of each of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3. The extension direction of each of the flow paths 30bc of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 and the flow direction of the refrigerant coincide with each other in the X-axis direction. In this disclosure, the cross-sectional area of the flow path 30bc is the cross-sectional area of a plane perpendicular to the extension direction of each of the flow paths 30bc, i.e., the flow direction of the refrigerant.

At least one of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 allows the refrigerant to flow from the first header 30a to the second header 30c, and the remaining multi-hole pipes allow the refrigerant to flow from the second header 30c to the first header 30a. In the following description, the multi-hole pipe through which the refrigerant flows from the first header 30a to the second header 30c may be referred to as the upstream multi-hole pipe, and the multi-hole pipe through which the refrigerant flows from the second header 30c to the first header 30a may be referred to as the downstream multi-hole pipe.

Furthermore, among the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3, the first multi-hole pipe 30b1 and the third multi-hole pipe 30b3 provided at the ends in the Y-axis direction each have an inclined portion that is inclined outward in the Y-axis direction with respect to the X-axis direction. The details of the inclined portion will be described later.

[Second header 30c]
The second header 30c guides the refrigerant introduced from at least one of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 to the remaining multi-hole pipes of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3. In other words, the second header 30c guides the refrigerant introduced from the upstream multi-hole pipe to the downstream multi-hole pipe.

The second header 30c is hollow with one side open. Specifically, the second header 30c has openings 30ch1, 30ch2, and 30ch3 on the -X side surface. The other ends of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are inserted and fixed to the open side of the second header 30c. Specifically, the other end of the first multi-hole pipe 30b1 is inserted and fixed to the opening 30ch1. The other end of the second multi-hole pipe 30b2 is inserted and fixed to the opening 30ch2. The other end of the third multi-hole pipe 30b3 is inserted and fixed to the opening 30ch3. The second header 30c and the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are fixed, for example, by brazing, to ensure watertightness.

<Partition Wall of First Header 30a>
Here, the partition walls provided in the first header 30a will be described.

The refrigerant introduced into the cooler 30 from an external cooling device absorbs heat from the semiconductor package 20 and is discharged from the cooler 30. Therefore, the refrigerant flowing through the cooler 30 is at its lowest temperature immediately after it is introduced, and gradually absorbs heat and becomes hotter. In other words, the temperature of the refrigerant in the downstream multi-hole tube is higher than the temperature of the refrigerant flowing through the upstream multi-hole tube.

Next, the position of the partition provided in the first header 30a will be described. In the semiconductor device 1 of this embodiment, the two multi-hole pipes, the first multi-hole pipe 30b1 and the second multi-hole pipe 30b2, are considered to be upstream multi-hole pipes. In addition, the single multi-hole pipe, the third multi-hole pipe 30b3, is considered to be downstream multi-hole pipe.

Figures 9 and 10 are cross-sectional views of the semiconductor device 1 of this embodiment. Specifically, Figure 9 is a cross-sectional view of the semiconductor device 1 cut at the first header 30a portion along a plane perpendicular to the X-axis direction. Specifically, Figure 10 is a cross-sectional view of the semiconductor device 1 cut at the center portion in the Z direction along a plane perpendicular to the Z-axis direction. Note that the semiconductor package 20 is shown as a uniform cross section, with internal details omitted. Also, the inclined portion of the multi-hole tube is omitted in Figure 10.

In the semiconductor device 1 of this embodiment, the partition wall 30aw is provided so that the first multi-hole pipe 30b1 and the second multi-hole pipe 30b2 are upstream multi-hole pipes, and the third multi-hole pipe 30b3 is downstream multi-hole pipe. The partition wall 30aw extends in the X-axis direction from the wall portion 30aF to the wall portion 30aE of the first header 30a.

The first multi-hole pipe 30b1 and the second multi-hole pipe 30b2 are connected to a space SPin surrounded by a part of the wall 30aA, the wall 30aB, a part of the wall 30aC, the partition wall 30aw, the wall 30aE, and the wall 30aF. A refrigerant is introduced into the space SPin from the refrigerant inlet 30ap1. The refrigerant introduced into the space SPin is discharged from the first multi-hole pipe 30b1 and the second multi-hole pipe 30b2 that are connected to the space SPin.

On the other hand, the third multi-hole pipe 30b3 is connected to a space SPout surrounded by a part of the wall 30aA, the partition wall 30aw, a part of the wall 30aC, the wall 30aD, the wall 30aE, and the wall 30aF. The refrigerant is introduced from the third multi-hole pipe 30b3 that is connected to the space SPout. The refrigerant introduced into the space SPout is discharged from the refrigerant outlet 30ap2.

<Sloped section of multi-hole pipe>
A description will now be given of the inclined portions provided on the first multi-hole pipe 30b1 and the third multi-hole pipe 30b3 of the cooler 30. Fig. 11 is a side view showing an outline of the cooler 30 of the semiconductor device 1 of this embodiment.

Of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3, the first multi-hole pipe 30b1 and the third multi-hole pipe 30b3, which are located on the outermost sides in the Y-axis direction, each have an inclined portion on both sides in the X-axis direction that inclines outward in the Y-axis direction with respect to the X-axis direction.

Specifically, the first multi-hole pipe 30b1 has an inclined portion 30b1a that is inclined outward in the Y-axis direction on the -X side, i.e., toward the -Y side. The first multi-hole pipe 30b1 also has an inclined portion 30b1b that is inclined outward in the Y-axis direction on the +X side, i.e., toward the -Y side. Note that both ends of the first multi-hole pipe 30b1 are inclined toward the X-axis direction with respect to the inclined portion 30b1a and the inclined portion 30b1b.

The third multi-hole pipe 30b3 has an inclined portion 30b3a on the -X side that is inclined outward in the Y-axis direction, i.e., toward the +Y side. The third multi-hole pipe 30b3 also has an inclined portion 30b3b on the +X side end that is inclined outward in the Y-axis direction, i.e., toward the +Y side. Both ends of the first multi-hole pipe 30b1 are inclined toward the X-axis direction with respect to the inclined portions 30b1a and 30b1b.

The first multi-hole pipe 30b1 and the third multi-hole pipe 30b3 each have an inclined portion, creating a step of width H.

One end of each of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 is joined to the first header 30a. The other end of each of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 is joined to the second header 30c.

When the semiconductor device 1 operates, the semiconductor package 20 generates heat. When the semiconductor package 20 generates heat, the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are heated by the semiconductor package 20. When the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are heated from a state in which the first header 30a and the second header 30c are fixed at room temperature, the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 each thermally expand.

For example, when both ends of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are not fixed, they thermally expand in proportion to the length L [m] of the multi-hole pipe, the linear expansion coefficient α [1/K] of the cooling pipe material, and the temperature difference ΔT [K]. That is, the thermal deformation amount (lengthwise) δ of the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 is α×L×ΔT. For example, when the multi-hole pipe is made of aluminum material, the linear expansion coefficient of aluminum material is 23.8×10 ⁻⁶ [1/K], so that when the multi-hole pipe has a length of 0.15 [m], a thermal expansion of 0.2 [mm] occurs.

The first header 30a and the second header 30c are fixed to the housing in which the semiconductor device 1 is mounted. Therefore, even when the semiconductor device 1 is operating, the distance between the first header 30a and the second header 30c does not change. On the other hand, when the semiconductor device 1 is operating, the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 thermally expand.

As a result, the wall portion 30aE of the first header 30a, where the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are joined, is deformed. Also, the wall portion 30cE of the second header 30c, where the first multi-hole pipe 30b1, the second multi-hole pipe 30b2, and the third multi-hole pipe 30b3 are joined, is deformed.

The first multi-hole pipe 30b1 has an inclined portion 30b1a and an inclined portion 30b1b. The third multi-hole pipe 30b3 has an inclined portion 30b3a and an inclined portion 30b3b. The inclined portion 30b1a and the inclined portion 30b3a each push the wall portion 30aE in the direction of the arrow A. The inclined portion 30b1b and the inclined portion 30b3b each push the wall portion 30cE in the direction of the arrow A. Therefore, the first multi-hole pipe 30b1 and the third multi-hole pipe 30b3 are deformed in the Y-axis direction toward the second multi-hole pipe 30b2 on the inside.

By deforming the first multi-hole tube 30b1 toward the inner second multi-hole tube 30b2 in the Y-axis direction, the semiconductor package 20 arranged between the first multi-hole tube 30b1 and the second multi-hole tube 30b2 is more closely sandwiched between the first multi-hole tube 30b1 and the second multi-hole tube 30b2. Also, by deforming the third multi-hole tube 30b3 toward the inner second multi-hole tube 30b2, the semiconductor package 20 arranged between the third multi-hole tube 30b3 and the second multi-hole tube 30b2 is more closely sandwiched between the third multi-hole tube 30b3 and the second multi-hole tube 30b2.

Therefore, when the semiconductor device 1 is operating and the semiconductor package 20 generates heat, the cooler 30 can stably cool the semiconductor package 20.

For example, the first multi-hole pipe 30b1 is an example of a first outer multi-hole pipe, the inclined portion 30b1a is an example of a first inclined portion, and the inclined portion 30b1b is an example of a second inclined portion. The third multi-hole pipe 30b3 is an example of a second outer multi-hole pipe, the inclined portion 30b3a is an example of a third inclined portion, and the inclined portion 30b3b is an example of a fourth inclined portion. The third multi-hole pipe 30b3 may be an example of a first multi-hole pipe, and the second header 30c may be an example of a first header.

The ends of the first multi-hole tube 30b1 and the third multi-hole tube 30b3 are parallel to the X-axis direction, but the shapes of the ends of the first multi-hole tube and the third multi-hole tube are not limited to the shapes of the first multi-hole tube 30b1 and the third multi-hole tube 30b3. Figure 12 is a side view showing an outline of a cooler 130, which is a modified example of the cooler 30 of the semiconductor device of this embodiment.

The first multi-hole tube 130b1 of the cooler 130 has an inclined portion 130b1a and an inclined portion 130b1b at both ends. The third multi-hole tube 130b3 of the cooler 130 has an inclined portion 130b3a and an inclined portion 130b3b at both ends.

In the cooler 130, both ends of the first multi-hole pipe 130b1 are inclined portions 130b1a and 130b1b, and the refrigerant flows obliquely to the X-axis direction to the first header 130a and the second header 130c, respectively. In the cooler 130, both ends of the third multi-hole pipe 130b3 are inclined portions 130b3a and 130b3b, and the refrigerant flows obliquely to the X-axis direction to the first header 130a and the second header 130c, respectively.

<Connection between multi-hole pipe and header>
FIG. 13 is a diagram showing the connection between the multi-hole pipe of the cooler and the header of the semiconductor device of this embodiment.

The first header 230a has a wall portion 230aE that joins the multi-hole pipes. The first multi-hole pipe 230b1 and the third multi-hole pipe 230b3 have inclined portions. To connect the inclined portions, the wall portion 230aE of the first header 230a has wall portion 230aE1 and wall portion 230aE3 that are inclined to fit the inclined portions. The wall portion 230aE of the first header 230a also has a wall portion 230aE2 that connects the wall portion 230aE1 and wall portion 230aE3 and is vertically arranged to fit the second multi-hole pipe 230b2.

The wall portion 230aE1 has an opening 230ah1 into which the first multi-hole pipe 230b1 is inserted. The wall portion 230aE2 has an opening 230ah2 into which the second multi-hole pipe 230b2 is inserted. The wall portion 230aE3 has an opening 230ah3 into which the third multi-hole pipe 230b3 is inserted.

Note that while the first header 230a has been described, the same applies to the second header. For example, wall portion 230aE1 is an example of a first inclined wall portion. The inclined wall portion provided in the second header is an example of a second inclined wall portion.

The opening may also be inclined to connect the multi-hole pipe to the header. Figure 14 shows the connection between the multi-hole pipe and the header of the cooler of the semiconductor device of this embodiment.

The first header 330a has openings 330ah1, 330ah2, and 330ah3 in the wall portion 330aE.

The first multi-hole pipe 330b1 is inserted into the opening 330ah1. The opening 330ah1 penetrates at an angle in the direction in which the inclined portion of the first multi-hole pipe 330b1 extends so as to fit the inclined portion of the first multi-hole pipe 330b1. The second multi-hole pipe 330b2 is inserted into the opening 330ah2. The opening 330ah2 is formed horizontally so as to fit the second multi-hole pipe 330b2. The third multi-hole pipe 330b3 is inserted into the opening 330ah3. The opening 330ah3 penetrates at an angle in the direction in which the inclined portion extends so as to fit the inclined portion of the third multi-hole pipe 330b3.

Note that while the first header 330a has been described, the same applies to the second header. Note that, for example, opening 330ah1 is an example of a first inclined opening. Also, the inclined opening provided in the second header is an example of a second inclined opening.

Furthermore, in order to absorb dimensional changes due to thermal expansion of the multi-hole pipe relative to a header whose position is fixed, the wall portion to which the multi-hole pipe is joined may be made more deformable. In other words, the rigidity of the wall portion to which the multi-hole pipe is joined may be reduced.

Figure 15 is a diagram showing the connection between the multi-hole pipe and the header of the cooler of the semiconductor device of this embodiment. The wall portion 430aE that joins with the multi-hole pipe of the first header 430a has a smaller thickness (wall thickness) than the other wall portions. In other words, the wall portion 430aE is formed from a thin plate. The wall portion 430aE has openings 430ah1, 430ah2, and 430ah3 for attaching the multi-hole pipe.

The wall portion 430aE is formed thin, and therefore has a lower rigidity compared to the other wall portions. In other words, the wall portion 430aE has the lowest rigidity of the wall portions constituting the first header 430a. Note that in this embodiment, the wall portion 430aE is formed thinner than the other wall portions to reduce its rigidity, but this is not limited to forming it thin. For example, the wall portion 430aE may be formed locally thin or bellows-shaped, and other possible means for reducing rigidity are also included.

Therefore, even if the first multi-hole tube 430b1, the second multi-hole tube 430b2, and the third multi-hole tube 430b3 each undergo thermal expansion, the amount of deformation caused by thermal expansion can be absorbed.

Note that while the first header 430a has been described above, the same applies to the second header. For example, the wall portion 430aE is an example of a joining wall portion.

<<Power conversion device>>
Next, a power conversion device using the semiconductor device according to this embodiment will be described.

Figures 16 and 17 are perspective views of a power conversion device 5 using the semiconductor device 1 according to this embodiment. Figure 17 is a view of the power conversion device 5 of Figure 16 with the cover 51 removed.

The power conversion device 5 converts, for example, DC power into three-phase AC power of a predetermined frequency. The power conversion device 5 is mounted, for example, on an automobile or the like.

The power conversion device 5 includes a cover 51 and a case 52. The case 52 includes a connector 53 and a connector 54 for connecting an external power source and a load. The combination of the cover 51 and the case 52 may be referred to as a housing 50.

The power conversion device 5 includes a control board 55, a semiconductor device 1, and a capacitor 56 inside the cover 51 and the case 52. The refrigerant is introduced and discharged through the pipes 112 and 113.

The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The above embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims.

For example, the number of multi-hole tubes is not limited to three, and may be two or more. In addition, the multi-hole tubes having an inclined portion are not limited to the first multi-hole tube and the second multi-hole tube, and any of the multi-hole tubes provided in the cooler may have an inclined portion.

1 Semiconductor device 5 Power conversion device 20, 21, 22, 23, 24, 25, 26 Semiconductor package 30, 130 Cooler 30a, 130a, 230a, 330a, 430a First header 230aE1, 230aE3 Wall portion 330ah1, 330ah3 Opening 30b1, 130b1, 230b1, 330b1, 430b1 First multi-hole pipe 30b1a, 30b1b, 130b1a, 130b1b, 230b1a, 330b1a Inclined portion 30b2, 130b2, 230b2, 330b2, 430b2 Second multi-hole pipe 30b3, 130b3, 230b3, 330b3, 430b3 Third multi-hole pipe 30b3a, 30b3b, 130b3a, 130b3b, 230b3a, 330b3a Slanted portion 30c, 130c Second header SPin Space SPout Space

Claims (12)

A plurality of multi-hole tubes arranged side by side and spaced apart in a first direction;
a first header to which one end of each of the plurality of multi-hole pipes is joined;
a second header provided apart from the first header in a second direction intersecting the first direction, the second header being joined to the other ends of the multiple multi-hole pipes;
Equipped with
A first multi-hole tube of any one of the plurality of multi-hole tubes is
a first inclined portion inclined in the first direction with respect to the second direction at the one end of the first multi-hole pipe;
a second inclined portion inclined in the first direction with respect to the second direction at the other end of the first multi-hole pipe ;
The first multi-hole pipe is a first outer multi-hole pipe that is provided at the outermost position in the first direction among the plurality of multi-hole pipes.
Cooler. The first inclined portion and the second inclined portion are each inclined toward the outside.
The cooler of claim 1 . the plurality of multi-hole pipes include a second outer multi-hole pipe provided on the outermost side opposite to the first multi-hole pipe in the first direction,
The second outer multi-hole tube is
a third inclined portion inclined in the first direction with respect to the second direction at the one end;
a fourth inclined portion inclined in the first direction with respect to the second direction at the other end;
A cooler according to claim 1 or 2 . the third inclined portion and the fourth inclined portion are inclined toward opposite sides of the first outer multi-hole tube,
The cooler according to claim 3 . the first header has a first inclined wall portion to which the one end of the first multi-hole pipe is joined, the first inclined wall portion being inclined in the first direction with respect to the second direction;
the second header has a second inclined wall portion to which the other end of the first multi-hole pipe is joined, the second header having a second inclined wall portion inclined in the first direction with respect to the second direction;
A cooler according to any one of claims 1 to 4 . the first header has a first inclined opening portion which is inclined in a direction in which the first inclined portion extends and to which the one end of the first multi-hole pipe is joined,
the second header has a second inclined opening portion, to which the other end of the first multi-hole pipe is joined, the second header being inclined in a direction in which the second inclined portion extends and penetrating therethrough;
A cooler according to any one of claims 1 to 4 . A plurality of multi-hole tubes arranged side by side and spaced apart in a first direction;
a first header to which one end of each of the plurality of multi-hole pipes is joined;
a second header provided apart from the first header in a second direction intersecting the first direction, the second header being joined to the other ends of the multiple multi-hole pipes;
Equipped with
Each of the first header and the second header includes a plurality of wall portions including a joint wall portion to which the plurality of multi-hole pipes are joined,
The joint wall portion has the lowest rigidity among the plurality of wall portions.
Cooler. A plurality of multi-hole tubes arranged side by side and spaced apart in a first direction;
a first header to which one end of each of the plurality of multi-hole pipes is joined;
a second header provided apart from the first header in a second direction intersecting the first direction, the second header being joined to the other ends of the multiple multi-hole pipes;
Equipped with
A first multi-hole tube of any one of the plurality of multi-hole tubes is
a first inclined portion inclined in the first direction with respect to the second direction at the one end of the first multi-hole pipe;
a second inclined portion inclined in the first direction with respect to the second direction at the other end of the first multi-hole pipe;
the first header has a first inclined wall portion to which the one end of the first multi-hole pipe is joined, the first inclined wall portion being inclined in the first direction with respect to the second direction;
the second header has a second inclined wall portion to which the other end of the first multi-hole pipe is joined, the second header having a second inclined wall portion inclined in the first direction with respect to the second direction;
Cooler . A plurality of multi-hole tubes arranged side by side and spaced apart in a first direction;
a first header to which one end of each of the plurality of multi-hole pipes is joined;
a second header provided apart from the first header in a second direction intersecting the first direction, the second header being joined to the other ends of the multiple multi-hole pipes;
Equipped with
A first multi-hole tube of any one of the plurality of multi-hole tubes is
a first inclined portion inclined in the first direction with respect to the second direction at the one end of the first multi-hole pipe;
a second inclined portion inclined in the first direction with respect to the second direction at the other end of the first multi-hole pipe;
the first header has a first inclined opening portion which is inclined in a direction in which the first inclined portion extends and to which the one end of the first multi-hole pipe is joined,
the second header has a second inclined opening portion, to which the other end of the first multi-hole pipe is joined, the second header being inclined in a direction in which the second inclined portion extends and penetrating therethrough;
Cooler . A plurality of multi-hole tubes arranged side by side and spaced apart in a first direction;
a first header to which one end of each of the plurality of multi-hole pipes is joined;
a second header provided apart from the first header in a second direction intersecting the first direction, the second header being joined to the other ends of the multiple multi-hole pipes;
Equipped with
A first multi-hole tube of any one of the plurality of multi-hole tubes is
a first inclined portion inclined in the first direction with respect to the second direction at the one end of the first multi-hole pipe;
a second inclined portion inclined in the first direction with respect to the second direction at the other end of the first multi-hole pipe;
The first header has a refrigerant inlet and a refrigerant outlet.
Cooler . A plurality of semiconductor packages;
The cooling device according to any one of claims 1 to 10 ,
Each of the plurality of semiconductor packages is provided between two adjacent multi-hole tubes.
Semiconductor device. A semiconductor device comprising :
Power conversion equipment.

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