JP7644976B2 - Packaged electronic module and method of manufacture thereof - Google Patents

Description

The present invention relates to electronic modules and more specifically to packaged electronic modules with embedded electronics for use in smart cards.

CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a continuation-in-part of U.S. patent application Ser. No. 15/645,234, filed Jul. 10, 2017, the entire contents of which are hereby incorporated by reference herein in their entirety for all purposes.

Semiconductor technology has made tremendous advances in the past few decades. Contactless smart cards are now widely used in many areas such as the transportation and banking sectors to identify individuals as well as objects. Smart cards, also known as chip cards and 1C cards, are plastic that encapsulates one or more semiconductor chips. In most of their applications, smart cards are contactless, which means that they use radio frequency (RF) technology to transfer data between the card and a receiver/transmitter. In addition to this, dual interface cards can have both functions using a single chip module. In general, many different applications have arisen for smart cards or integrated circuit cards, for example in the field of personal identification (ID cards, access cards, authentication cards), in the field of data encryption (code cards), for personal use (bank smart cards, payment cards) and similar fields.

With the progress of electronics industry, electronic products are developed towards the trend of miniaturization and multi-function. Therefore, various package types have been developed. Electronic packaging refers to the packaging of integrated circuit chips or dies. Materials play an important role in electronic packaging, and most of the research on electronic packaging focuses on packaging schemes rather than materials. The traditional approach to electronic packaging and interconnection is to package individual integrated circuit (IC) chips into single packages and attach these packages to printed circuit boards to provide interconnections between the individual IC chips.

Another approach describes a double-sided electronic module of a hybrid contact-contactless smart card designed to be stored in a cavity of a card, which is assembled in a blank in a special manufacturing format. This device includes a unit for depositing and pre-gluing a protective layer on at least one blank, a lamination unit including means for compressing, heating and cooling at least one blank, and a unit for cutting the blank into a smart card. The means for compressing, heating and cooling include two supports placed opposite each other and displaceable towards each other to apply pressure on the above-mentioned blank. Each support includes at least one ceramic heating and cooling device including a stack composed of a ceramic block and a metal lamination plate. However, this method has a high probability of damaging components since it includes high or low temperature lamination steps. Moreover, it requires additional capital expenditure and special equipment for lamination.

Another approach describes an integrated circuit (IC) film that does not need to be covered with any packaging molding compound, especially using a conventional packaging step. The IC chip is mounted directly onto a flexible printed circuit (FPC) substrate. The IC chip is placed on the FPC substrate and bonded to, i.e., electrically connected to, the leads of the FPC substrate. Also, a flexible plastic substrate is required to mount the components in the FPC, i.e., increasing the cost of the FPC. Furthermore, additional operations such as pre-lamination and lamination operations are required before the IC chip is embedded.

Yet another approach describes a method for producing a smart card module, the arrangement of which includes arranging a smart card module on a first carrier layer, the first carrier layer being free of a prefabricated smart card module receptacle cutout for receiving the smart card module, the first carrier layer being able to include a plastic (polymer). The smart card module includes a substrate, a chip on the substrate, and a first mechanical reinforcement structure between the chip and the substrate. The smart card module can be embedded between the first carrier layer and the second carrier layer. The embedding of the smart card module can be performed, for example, using lamination, for example, using low-temperature lamination or high-temperature lamination, or using lamination and additional compression. In addition to this, the embedding of the smart card module can be performed using compression. The substrate (or carrier) for providing the smart card module can be made of a flexible material, for example a plastic or polymer, and/or has a corresponding thickness, so that the substrate is flexible. However, this method does not include embedded electronics. Also, this method of making cards by lamination is difficult to do, and only a limited number of card manufacturers can do it properly.

Thus, there is a need for an efficient electronic packaged module and method of manufacture thereof. This method would assemble all of the necessary electronics into the module rather than on a flexible printed circuit (FPC). The cost of the module would be lower than an FPC. Such a method would not require a flexible plastic substrate to mount the components. Furthermore, it would not include any lamination steps, thus reducing the risk of damaging the components. It would provide companies with the ability to avoid the additional capital expenditure required for specialized equipment. Such a necessary method would lower the unit cost of packaged chips. This embodiment would enable all existing card manufacturers to manufacture smart cards with embedded electronics. The embodiments of the present invention overcome the shortcomings in the field by achieving these very important objectives.

In order to minimize the limitations found in the prior art and to minimize other limitations that will become apparent upon reading this specification, the present invention is a packaged electronics module with embedded electronics for use in smart cards. The present invention is a new type of packaged electronics module that is used to manufacture value-added smart cards with embedded electronics. The packaged electronics module of the present invention packages all the electronics components normally found on a flexible printed circuit (FPC) into a module along with an integrated circuit chip and contact plate. This module can then be embedded into a plastic card by the card manufacturer using conventional milling techniques.

The present invention provides an efficient electronic packaged module and method of manufacture that assembles all the necessary electronic components into the module rather than on a flexible printed circuit (FPC). The present invention provides companies with the ability to avoid the additional capital expenditure required for specialized equipment. Also, the present invention reduces the unit cost of packaged chips, allowing all existing card manufacturers to manufacture smart cards with embedded electronics.

Other features and advantages of the present invention will become apparent from the following more detailed description, taken in conjunction with the accompanying drawings, which illustrate, by way of example, the principles of the invention.

The elements of the figures are not necessarily drawn to scale in order to enhance their clarity and improve understanding of the various elements and embodiments of the present invention. Additionally, elements that are well known and well understood by those skilled in the art are not drawn to provide a clear view of the various embodiments of the present invention, i.e., the figures are generalized in form for clarity and conciseness.

1 is an exploded perspective view of a smart card according to a preferred embodiment of the present invention; FIG. 2 illustrates a first assembly of a packaged electronic module according to a preferred embodiment of the present invention. FIG. 3 is a schematic diagram illustrating the embedding of the first assembly shown in FIG. 2 according to a preferred embodiment of the present invention. FIG. 3 is a schematic diagram illustrating the embedding of the first assembly shown in FIG. 2 according to a preferred embodiment of the present invention. FIG. 2 illustrates a second assembly of a packaged electronic module according to a preferred embodiment of the present invention. FIG. 4 is a schematic diagram illustrating the embedding of the second assembly shown in FIG. 3 according to the present invention. FIG. 13 illustrates a third assembly of a packaged electronic module according to a preferred embodiment of the present invention. FIG. 5 is a schematic diagram illustrating the embedding of the third assembly shown in FIG. 4 according to the present invention. FIG. 13 illustrates a fourth assembly of a packaged electronic module according to a preferred embodiment of the present invention. FIG. 6 is a schematic diagram illustrating the embedding of the fourth assembly shown in FIG. 5 according to the present invention. FIG. 13 illustrates a fifth assembly of a packaged electronic module according to a preferred embodiment of the present invention. FIG. 7 is a schematic diagram illustrating the embedding of the fifth assembly shown in FIG. 6 according to the present invention. 1 illustrates aspects of a packaged electronic module according to an exemplary embodiment thereof. 1 illustrates aspects of a packaged electronic module according to an exemplary embodiment thereof. 1 illustrates aspects of a packaged electronic module according to an exemplary embodiment thereof. 7A-7C, showing how the packaged electronic module of FIG. 7A is embedded into a smart card according to an exemplary embodiment thereof; 1 illustrates aspects of a packaged electronic module according to an exemplary embodiment thereof. 1 illustrates aspects of a packaged electronic module according to an exemplary embodiment thereof. 1 illustrates aspects of a packaged electronic module according to an exemplary embodiment thereof. 9A-9C depict the embedding of the packaged electronic module of FIG. 9A into a smart card according to an exemplary embodiment thereof. 1 illustrates aspects of a packaged electronic module according to an exemplary embodiment thereof. 1 illustrates aspects of a packaged electronic module according to an exemplary embodiment thereof. 1 illustrates aspects of a packaged electronic module according to an exemplary embodiment thereof. 11A-11C depict the embedding of the packaged electronic module of FIG. 11A into a smart card according to an exemplary embodiment thereof. 1 illustrates aspects of a packaged electronic module according to an exemplary embodiment thereof. 1 illustrates aspects of a packaged electronic module according to an exemplary embodiment thereof. 1 illustrates aspects of a packaged electronic module according to an exemplary embodiment thereof. 13A-13C, showing how the packaged electronic module of FIG. 13A-13C may be embedded into a smart card according to an exemplary embodiment thereof; 1 illustrates aspects of a packaged electronic module according to an exemplary embodiment thereof. 1 illustrates aspects of a packaged electronic module according to an exemplary embodiment thereof. 1 illustrates aspects of a packaged electronic module according to an exemplary embodiment thereof.

In the following discussion dealing with certain embodiments and applications of the present invention, reference is made to the accompanying drawings which form a part hereof, and in which is shown, by way of illustration, specific embodiments in which the invention may be practiced. It is to be understood that other embodiments may be utilized and changes may be made without departing from the scope of the present invention.

Various inventive features are described below that can each be used independently of one another or in combination with other features. However, any single inventive feature may not address all of the problems discussed above or may address only one of the problems discussed above. Moreover, one or more of the problems discussed above may not be fully addressed by any of the features described below. The present invention will now be described with reference to the accompanying drawings, which do not limit the scope and scope of the invention. In the following discussion dealing with certain embodiments and applications of the present invention, reference is made to the accompanying drawings that form a part hereof, and which show, by way of illustration, specific embodiments in which the invention may be practiced. It is to be understood that other embodiments may be utilized and changes may be made without departing from the scope of the invention.

The term "facility" as used herein refers to any device, process, service, or combination thereof. The facility may be implemented in hardware, software, firmware, using dedicated devices, or any combination thereof. The facility may be mechanical, electronic, or a combination thereof. The facility may be integrated into a single device or distributed across multiple devices. The various components of the facility may be co-located or distributed. The facility may be formed from other facilities. In general, the term "facility" as used herein may be considered shorthand for the terms device and/or process and/or service.

The present invention will now be described in more detail below with reference to exemplary embodiments herein with reference to Figures 1-15.

FIG. 1 illustrates a fully exploded perspective view of a value-added smart card 100 according to an exemplary embodiment of the present invention. The value-added smart card 100 includes a card body 105, a number of plastic card layers 115, and a packaged electronics module 120 including and/or coupled to a contact plate 125. The card 100 may also include a card antenna 110 or an embedded battery (not shown).

According to its exemplary embodiment, the packaged electronics module 120 may generally include a contact plate 142, one or more electronic readers 138, one or more integrated circuit (IC) chips 144, a number of electronic components 146, and any other components or elements that may be required for the packaged electronics module 120 to perform its function. This is shown in Figures 2, 3, 4, 5, 6, 7A-7C, 9A-9C, 11A-11C, 13A-13C, 14, and 15A-15C in relation to a packaged electronics module corresponding to the packaged electronics module 120 of Figure 1. Thus, the packaged electronics module may be a self-contained unit that may include all the necessary components required to perform its function. Due to this, the packaged electronics module 120 may also be referred to as an integrated assembly.

The contact plate 142 allows the module 120 to make electrical contact with a card reader as needed. The electronic reader 138 can provide real-time information such as the current balance available on the card or an associated bank account, the number of trips available (e.g., in the case of a transit card), a dynamic security code to essentially tokenize the CVx2 data to prevent fraud, and other information.

The packaged electronics module 120 may be embedded in the card body 105. It should be noted that the smart card 100 and packaged electronics module 120 of FIG. 1 are for illustrative and conceptual purposes, and one skilled in the art will understand that the packaged electronics module 120 may be configured with the smart card 100 in any manner that enables the packaged electronics module 120 to perform its functions. In addition, while FIG. 1 shows the module 120 generally configured on the top (front) surface of the smart card 100, the module 120 or portions thereof may be configured on any one or more surfaces of the card, and/or on any one or more intermediate layers of the card, and/or on any combination of surfaces and/or layers of the card, as described below in a later section.

The card body 105 is flat with different layers of plastic or other materials, one or more of which may include an antenna (e.g., used for contactless card functions such as RFID communication) or an embedded battery (not shown), etc. To support the card 100, which may include one or more antennas 110, the packaged electronic module 120 may be connected to the antenna 110 using a connector, micro-antenna, or other connection mechanism. In all embodiments described herein, it may be preferable that the embedding of the module 120 does not interfere with or otherwise impede any of the other components and elements of the card 100, such as the internal antenna 110.

The packaged electronic module 120 can be used in the manufacturing and/or fabrication and/or assembly process of the value-added smart card 100 with embedded electronics. The value-added smart card 100 can be contactless only, contact only, or dual interface (contact and contactless). The exemplary embodiment allows components typically found on a flexible printed circuit (FPC) that can be configured with the smart card 100 to be combined to form an integrated module 120. This module 120 can then be embedded in a plastic card by the card manufacturer using common milling techniques or other manufacturing methods. Depending on the relative sizes of the electronic components and the contact plate, different assemblies are possible. The present invention does not involve high or low temperature lamination, so there is less risk of damaging the electronic components. The present invention allows all existing card manufacturers to manufacture these value-added smart cards with embedded electronics.

In some exemplary embodiments, the visible components of the module 120 may be located and/or visible on both sides of the smart card 100. For example, the contact plate 142 may be located on the top (front) side of the card 100 and the electronic reader 138 may be located and/or visible on the bottom (back) side of the card 100, or vice versa. Additionally, in some exemplary embodiments, the visible components of the module 120 may be located and/or visible on the same side of the smart card 100. For example, both the contact plate 142 and the electronic reader 138 may be located and/or visible on the top (back) side of the card 100.

Visible Components on Both Sides of the Card FIG. 2 shows a first assembly of a packaged electronic module 140 (which may correspond to the packaged electronic module 120 of FIG. 1) according to a preferred embodiment of the present invention. The first assembly 140 includes an integrated assembly in which the footprint of the electronic components (e.g., electronic reader) is no larger than the footprint of the contact plate 142. The first assembly of the packaged electronic module 140 includes a contact plate 142 connected to an integrated circuit chip 144, a number of electronic components 146 connected to the contact plate 142 and the integrated circuit chip 144, an electronic display 138 connected to the number of electronic components 146, and a number of connectors (not shown) that can connect the packaged electronic module 140 to the card antenna 110 (shown in FIG. 1) or to an embedded battery (not shown). The thickness of the packaged electronic module 140 may be equal to or less than, and preferably not greater than, the thickness of the plastic card. The packaged electronic module 140 may have a micro-antenna that connects to an antenna in the card using inductive coupling. Also note that in addition to or in place of the electronic display 138, value-added components such as a fingerprint sensor, LEDs, and/or electronic or mechanical buttons may also be included.

2A-2B are schematic diagrams showing the embedding of the first assembly shown in FIG. 2 according to the present invention. The manufacturing method of the value-added smart card 100 (shown in FIG. 1) includes embedding the integrated assembly of the first assembly 140 by milling the card 150 from the front ("face") of the card through the back and embedding the packaged electronic module 140 from the "face" of the card. The manufacturing method of the value-added smart card 100 (shown in FIG. 1) further includes milling the card 150 from the front of the card to the back protective overlay 164, but embedding the packaged electronic module 140 from the front of the card leaving the protective overlay 164 intact, which should be transparent, for example if 138 is an electronic display. In this case, the thickness of the packaged electronic module 140 will be equal to the thickness of the card minus the thickness of its back protective layer. The milling area 154 must fit the shape of the packaged electronic module 140.

3 illustrates a second assembly of a packaged electronic module according to a preferred embodiment of the present invention. The second assembly 160 (which may correspond to the packaged electronic module 120 of FIG. 1) includes an integrated assembly in which the footprint of the electronics 158 is larger than the footprint of the contact plate 142. The second assembly of the packaged electronic module 160 includes a contact plate 142 connected to an integrated circuit chip 144, a plurality of electronic components 146 connected to the contact plate 142 and the integrated circuit chip 144, an electronic display 138 connected to the plurality of electronic components 146, and a plurality of connectors (not shown) that can connect the packaged electronic module 160 to a card antenna 110 (shown in FIG. 1) or an embedded battery (not shown). The thickness of the packaged electronic module 160 is equal to or less than the thickness of the smart card. Depending on the size of the electronic components 146, the module may include an asymmetric shape so that some electronic components do not get too close to the borders of the card. The packaged electronic module 160 may have a micro-antenna that connects to an antenna in the card using inductive coupling. Also note that value-added components such as a fingerprint sensor, LEDs, and/or electronic or mechanical buttons may be included in addition to or in place of the electronic display 138.

Figure 3A is a schematic diagram showing the embedding of the second assembly shown in Figure 3 according to the present invention. The method of making the value-added smart card 100 (shown in Figure 1) includes embedding the integral assembly of the second assembly 160 by milling the card 150 from its back side through the front side and embedding the module from the back side of the card, since the back side of the second assembly is larger than its front side. The milling area 154 is larger on the back side of the card than on the front side to fit the shape of the packaged electronic module 160.

4 illustrates a third assembly of a packaged electronic module according to a preferred embodiment of the present invention. The third assembly of packaged electronic module 170 (which may correspond to the packaged electronic module of FIG. 1) includes an integrated circuit chip 144, a number of electronic components 146, an electronic display 138 connected to the number of electronic components 146, and a number of connectors (not shown) that may connect the packaged electronic module 170 to a card antenna 110 (shown in FIG. 1) or to an embedded battery (not shown). The thickness of the packaged electronic module 170 is no greater than the thickness of a plastic card. Depending on the size of the electronic components 146, the module may include an asymmetric shape so that some electronic components do not get too close to the border of the card. The third assembly does not have a contact plate and may therefore be used for contactless-only cards, one-time password cards, or other value-added cards that do not require a contact plate to function. The packaged electronic module may have a micro-antenna that connects to an antenna in the card using inductive coupling. Also note that value-added components such as a fingerprint sensor, LEDs, and/or electronic or mechanical buttons may be included in addition to or in place of the electronic display 138.

4A is a schematic diagram showing the embedding of the third assembly shown in FIG. 4 according to the present invention. The method of making the value-added smart card 100 (shown in FIG. 1) includes embedding the third assembly of packaged electronic modules 170 by milling the card 176 from either the back or front side of the card and embedding the packaged electronic modules 170. The packaged electronic modules 170 can be embedded virtually anywhere on the card because they do not have a contact plate 142. The milling area 154 must conform to the shape of the packaged electronic modules 170. It should be noted that while FIG. 4A may depict the card 176 milled from the top side of the card 176 to embed the modules 170 from the top side and milled from the bottom side to embed the modules 170 from the bottom side, this is shown for illustrative and conceptual purposes and the card 176 may include only top-embedded modules 170, only bottom-embedded modules 170, or any combination thereof.

5 illustrates a fourth assembly of a packaged electronic module according to a preferred embodiment of the present invention. The fourth assembly 180 (which may correspond to the packaged electronic module 120 of FIG. 1) includes a two-part assembly in which the footprint of the total electronics is no larger than the footprint of the contact plate 142. The fourth assembly of the packaged electronic module 180 includes a plurality of electronic components 146 connected to the contact plate 142 and the integrated circuit chip 144, an electronic display 138 connected to the plurality of electronic components 146, and a plurality of connectors (not shown) that can connect the packaged electronic module 180 to the card antenna 110 (shown in FIG. 1) or to an embedded battery (not shown). The thickness of the packaged electronic module 180 may be equal to or less than, and preferably not greater than, the thickness of a plastic card. The fourth assembly 180 may be further defined as an assembly consisting of an upper half and a lower half of a packaged electronic module. In the fourth assembly 180, the upper half and the lower half are assembled into an asymmetric packaged electronic module. The packaged electronics module 180 may have a micro-antenna that connects to an antenna in the card using inductive coupling. Also note that value-added components such as a fingerprint sensor, LEDs, and/or electronic or mechanical buttons may be included in addition to or in place of the electronic display 138.

Figure 5A is a schematic diagram showing the embedding of the fourth assembly shown in Figure 5 according to the present invention. The method of making the value-added smart card 100 (shown in Figure 1) includes the steps of milling the card from its front side and embedding the fourth assembly 180 by embedding the top half of the module from the front side of the card and the bottom half from the back side of the card, connecting the two halves to assemble the complete module. The milling area 154 must fit the shape of the packaged electronic module 180.

6 illustrates a fifth assembly of a packaged electronic module according to a preferred embodiment of the present invention. The fifth assembly 190 (which may correspond to the packaged electronic module 120 of FIG. 1) includes a two-part assembly in which the footprint of the total electronics is larger than the footprint of the contact plate 142. The fifth assembly of the packaged electronic module 190 includes a plurality of electronic components 146 connected to the contact plate 142 and the integrated circuit chip 144, an electronic display 138 connected to the plurality of electronic components 146, and a plurality of connectors (not shown) that can connect the packaged electronic module 190 to the card antenna 110 (shown in FIG. 1) or an embedded battery (not shown). The thickness of the packaged electronic module 190 may be less than, equal to, and preferably not greater than, the thickness of a plastic card. The fifth assembly 190 may be further defined as an assembly consisting of an upper half and a lower half of the packaged electronic module. In a fifth assembly, the bottom half of the packaged electronics module is larger than the top half, and the top and bottom halves are assembled into an asymmetric packaged electronics module such that some electronic components are not too close to the borders of the card. The packaged electronics module 190 can have a micro-antenna that connects to an antenna in the card using inductive coupling. Also, note that value-added components such as a fingerprint sensor, LEDs, and/or electronic or mechanical buttons can be included in addition to or in place of the electronic display 138.

Figure 6A is a schematic diagram showing embedding of the fifth assembly shown in Figure 6 according to the present invention. The method of making the value-added smart card 100 (shown in Figure 1) includes embedding the fifth assembly 190 by milling the card from its back side through its front side, placing the top half of the module on the card, and then embedding the bottom half through the back side of the card to connect the two halves to assemble the complete module. The milling area 154 must fit the shape of the packaged electronic module 190.

Visible Components on the Same Side of the Card In some exemplary embodiments, the visible components of packaged electronics module 120 may be located and/or visible on the same side of smart card 100. For example, portions of contact plate 142 and/or portions of electronic reader 138 may both be located and/or visible on the top side of card 100, on the bottom side of card 100, on any other side of card 100, and any combination thereof.

With reference to Figures 7A-7C, in accordance with an exemplary embodiment thereof, packaged electronic module 200 (which may correspond to packaged electronic module 120 of Figure 1) may generally be an integrated assembly that may include contact plate 142, electronic reader 138, integrated circuit (IC) chip 144, a number of electronic components 146, and other elements and/or components necessary for module 200 to perform its desired functions as described herein or otherwise. Figures 7A, 7B, and 7C may generally depict top, bottom, and side views, respectively, of module 200.

The components 142, 138, 144, 146 (and any other components) may be connected (electrically and/or physically) to one another as necessary for the module 200 to operate properly. For example, the contact plate 142 may be connected to an IC chip 144, which may be connected to a number of electronic components 146 and an electronic reader 138. It is understood that any of the elements 138, 142, 144, 146 may be connected to any other of the elements 138, 142, 144, 146 in any combination. Any type of connection may be used between any of the components.

In one exemplary embodiment, the packaged electronics module 200 and/or elements 138, 142, 144, 146 may include other connectors or connection mechanisms that may be used to connect the module 200 to other components. For example, the module 200 may have a micro-antenna that connects (and/or communicates) with an internal antenna 110 (best seen in FIG. 1) in the card through inductive coupling. Similarly, other types of connectors or connection mechanisms may be used as needed. For example, the module 200 and/or elements 138, 142, 144, 146 may include electrical and/or physical contacts (connectors) that may be positioned and configured to connect (electrically and/or physically) with possible other elements configured with the card 100 (e.g., other components configured within the card 100 and/or configured external to the card 100). For example, the module 200 may include other connectors that may be used to connect the module 200 to other components, such as an embedded battery. In another example, the module 200 may include a connector that can be connected to a value-added component, such as a fingerprint sensor, one or more antennas, LEDs, and/or electronic or mechanical buttons that may be included in addition to or instead of the electronic display 138. In this case, the value-added component may include a portion that may be positioned and/or visible on the same side as the contact plate 142 and/or the electronic reader 138.

The module 200 may also include an encapsulation 148 material (e.g., resin) to help secure the components together and to protect the components from moisture, corrosion, and other undesirable elements.

In one example, the contact plate 142 and the electronic reader 138 may include portions that may be visible on the same side of the card 100. As shown in FIGS. 7A-7C, these visible components 142, 138 may be configured such that portions of their visible sides (e.g., their top surfaces as shown in FIG. 7A) both face the same direction (e.g., facing up). In this way, when the packaged electronics module 200 is configured on the face of the smart card 100 (e.g., on the top surface of the card 100), both of these portions of the contact plate 142 and the electronic reader 138 may be visible on the same side of the smart card 100. In one preferred implementation, these portions of the top surface of the contact plate 142 and the electronic reader may be visible on the top surface of the smart card 100.

The thickness D1 (shown in FIG. 7C) of the packaged electronic module 200 may preferably be less than the thickness D (shown in FIG. 8) of the smart card 100. In this manner, the module 200 may be embedded in the top or bottom surface of the smart card 100 without penetrating the card. However, it should be noted that the thickness D1 may be equal to, and preferably not greater than, the thickness D.

8 shows a process and method for fabricating a value-added smart card 100 by embedding an integrated packaged electronic module 200 therein. As shown in step 1, a smart card 100 having a thickness D can be provided. In step 2, a face of the smart card 100 (e.g., the top face 102 or "front face" of the card 100) can be milled using a milling bit 152 or other mechanism that can remove a portion of the card 100 suitable for insertion of the module 200. Again, techniques such as laser etching or other techniques can be used. The card can also be formed to include an open area suitable for embedding the module 200 during its general manufacturing process.

Note that the milling area 154 can extend from a face of the card 100 (e.g., the top surface 102 or "front" of the card 100) to an intermediate depth within the card 100, but preferably does not extend all the way through the card 100. The integrated assembly 200 having a thickness D1 less than the overall thickness D of the card 100 can be received in the milling area 154 and thereby embedded within the card 100. In this manner, the visible portions of the module 200 (e.g., at least a portion of the top surface of the contact plate 142 and at least a portion of the top surface of the electronic reader 138) can be visible on the top surface 102 of the card 100 when the components 138, 142 are embedded in the card 100. This is depicted in step 3 of FIG. 8.

However, it should be noted that if the thickness D1 of the module 200 is equal to the thickness D of the card 100, the milling area 154 may extend from the top surface 102 (front) of the card 100 to the bottom surface 104 (back) of the card 100, and a portion of the module 200 may be visible at the bottom surface 104 of the card 100. However, portions of the module 200 that are intended to be visible at the top surface of the card 100 (e.g., at least a portion of the top surface of the contact plate 142 and at least a portion of the top surface of the electronic reader 138) may still be so in this scenario. If the card 100 includes a protective overlay on its bottom surface 104, the protective overlay may be left intact or milled through, depending on the thickness D1 of the module 200 relative to the thickness D of the card 100.

The milling area 154 may preferably approximately correspond to the size, shape, and dimensions of the module 200 such that the milling area 154 receives the module 200 without any gaps, protrusions, or separations at the interface between the milling area 154 and the module 200. Also, when embedded, the top surface of the module 200 may preferably be approximately flush with the top surface of the card 100. The module 200 may be held within the opening area 154 with an adhesive, by a press fit, or by other attachment mechanisms, methods, or means.

As discussed above in connection with other exemplary embodiments herein, the footprint of the electronic reader 138 (which may or may not include an integrated circuit (IC) chip 144 and/or multiple electronic components 146) may be approximately equal in size to, smaller than, or larger than the footprint of the contact plate 142. In conventional embodiments, the footprint size of the electronic reader 138 relative to the footprint size of the contact plate 142 may affect how the module 200 can be embedded within the card 100, since the contact plate 142 and visible portions of the electronic reader 138 may be configured on both sides (front and back) of the card 100.

However, when the visible portion of the contact plate 138 and the visible portion of the electronic display 138 are configured on the same side of the card 100, the footprint size of the electronic display 138 relative to the footprint size of the contact plate 142 may not necessarily have the same or similar impact on how the module 200 can be embedded within the card as in other embodiments.

For example, in accordance with an exemplary embodiment herein, FIGS. 7A-7C depict a packaged electronic module 200 that may include an electronic reader 138 having a footprint size approximately smaller than or equal to the footprint size of the associated contact plate 142. Meanwhile, FIGS. 9A, 9B, and 9C respectively show top, bottom, and side views of an integrated packaged electronic module 202 that may include a reader 138 having a footprint size larger than the footprint size of the associated contact plate 142. However, in FIG. 10, it can be seen that the process of embedding the module 202 into the card 100 is similar to the process shown and described in connection with FIG. 8, but may include a slightly larger milled area 154 that can accommodate the footprint of the larger electronic reader 138. All other aspects of this exemplary embodiment of the module 202 may be the same or similar to those of the exemplary embodiment of the module 200 described in connection with FIGS. 7A-7C and FIG. 8.

In another exemplary embodiment, the integrated electronic packaging assembly 204 may include two or more subassemblies that may be combined to form the packaging assembly 204. In one example, as shown in FIGS. 11A-11C (which respectively depict top, bottom, and side views of the assembly), the module 204 may include a first subassembly 204-1 and a second subassembly 204-2 (best seen in FIG. 11C). In this example, the first subassembly 204-1 may generally include the contact plate 142 and the electronic components 146, and the second subassembly 204-2 may generally include the electronic reader 138 and the IC 144. However, it should be noted that each and/or both of the first and second subassemblies 204-1, 204-2 may include any of the elements 138, 142, 144, 146, or any other elements required by the module 200. As shown, the footprint size of the electronic reader 138 of the module 204 can be equal to or smaller than the footprint size of the associated contact plate 142, so that when the subassemblies are combined, the resulting module 204 can resemble the module 200 of Figures 7A-7C and 8. All aspects of the module 200 as described above in connection with Figures 7A-7C and 8 can also be applied to the composite module 204.

The packaging module 204 can be constructed with the card 100 in a manner similar to that described above in connection with the module 200 of FIG. 8, but with the addition of combining the subassemblies 204-1 and 204-2 to form the assembly 204.

The subassemblies 204-1, 204-2 can be combined before or during construction of the module 204 with the card 100. In one example, the subassembly 204-1 can first be placed in its respective location within the milling area 154 of FIG. 12, and then the subassembly 204-2 can be placed in its respective location within the milling area 154 (shown in step 3). Note that the order of insertion can be reversed or performed in either order. For example, the subassembly 204-2 can be embedded in the card 100 first, and then the subassembly 204-1 can be embedded in the card 100.

In one exemplary embodiment, the subassemblies 204-1, 204-2 may each include corresponding electrical and/or physical contacts or other connection mechanisms configured to mate with one another. That is, the subassembly 204-1 may include a connection mechanism, and the subassembly 204-2 may also include a connection mechanism, and the connection mechanisms of 204-1 and 204-2 may each be configured to connect with one another. In this way, when the subassemblies 204-1, 204-2 are embedded in the opening area 154 of the card 100 (together, separately, one by one, or in any combination), their corresponding electrical and/or physical contacts contact one another and the subassemblies 204-1, 204-2 may be properly connected to one another (both electrically and physically). This may result in a composite assembly 204 that is capable of properly functioning thereby. It is understood that electrical and/or physical connections between subassemblies 204-1, 204-2 can be configured and contacts can be made within card 100 (e.g., within open area 154), outside card 100 (e.g., on the top or bottom surface of card 100), and any combination thereof.

The above examples are for illustrative purposes, and those skilled in the art will understand upon reading this specification that the integrated assembly 204 can include subassemblies 204-n, where n is any number, and that the subassemblies 204-1, 204-2, 204-n can be configured in any order and/or position relative to one another within the open area 154 of the card 100. Furthermore, not all of the subassemblies 204-n are visible from the face of the card 100, and a portion of the subassembly 204-n can be present on an inner layer of the card 100. However, it may be preferable that the subassembly 204-n, which can include the contact plate 142 and the electronic reader 138, be present in the area of the open area 154, such that the desired visible portion of the contact plate 142 and the desired visible portion of the electronic reader 138 are visible from the same face of the card 100.

The subassemblies 204-1, 204-2, 204-n may also be combined prior to embedding the composite module 204 into the card 100. In addition, some of the subassemblies 204-n may be combined prior to embedding into the card 100, and other subassemblies-n may be combined during embedding into the card 100. It is clear that any combination of the subassemblies 204-n may be combined prior to or during embedding of the subassemblies 204-n into the card 100. It is also understood that any and/or all of the subassemblies 204-n may include corresponding electrical and/or physical contacts that may be configured to electrically and/or physically contact corresponding contacts on other subassemblies 204-n during embedding of the subassemblies 204-n into the card 100 as required by the smart card 100 and/or module 200.

Figures 11A-11C and 12 depict an integrated assembly 204 formed by subassemblies 204-1, 204-2 that, when combined, can include an electronic reader 138 having a footprint size the same as or smaller than that of the associated contact plate 142, while Figures 13A, 13B, and 13C show top, bottom, and side views, respectively, of a packaged electronic module 206 formed by subassemblies 206-1 and 206-2 that, when combined, can include an electronic reader 138 having a footprint size larger than that of its associated contact plate 142.

All aspects of module 204 described above also apply to module 206, with the understanding that embedding module 206 within card 100 may require a larger aperture area 154 to accommodate the larger footprint size of the electronic reader. This is shown in FIG. 14.

Upon reading this specification, it will be understood by those skilled in the art that in any of the embodiments described above in connection with Figures 7A-7C, 8, 9A-9C, 10, 11A-11C, 12, 13A-13C, and 14, at least a portion of the electronic reader 138 may be positioned and/or visible at any location on the same side of the card relative to at least a portion of the contact plate 142. That is, although FIGS. 7A-7C, 8, 9A-9C, 10, 11A-11C, 12, 13A-13C, and 14 generally depict the electronic reader 138 as being positioned next to or nearly adjacent to the contact plate 142, the electronic reader 138 may be positioned in any position relative to the contact plate 142, such as to the right, to the left, above, below, diagonally in any direction, offset any distance in any direction, or otherwise on the same side of the card 100 as the contact plate 142, such that the electronic reader 138, modules 200, 202, 204, 206, and all of their associated components can each perform their desired functions.

It is also recognized that, for all of its embodiments, the contact plate 142 and the electronic reader 138 are generally configured and generally visible on both sides of the card 100. For example, the contact plate 142 may be generally configured and generally visible on the top (front or obverse) side of the card 100, and the electronic display 138 may be generally configured and generally visible on the bottom (back) side of the card 100, or vice versa. It is also recognized that the contact plate 142 and the electronic reader, when generally configured and generally visible on both sides of the card 100, may be in any orientation and/or position relative to one another. For example, some or all of the electronic reader 138 may be generally below the contact plate 142 (but positioned on the opposite side of the card 100), or some or all of the electronic reader 138 may be laterally offset from the contact plate 142 (but positioned on the opposite side of the card 100) in any lateral position relative to the contact plate 142. The IC chip 144 and/or electronic components 146 can be located wherever the components 144, 146 can make suitable electrical connections with the contact plate 142 and/or electronic display 138 and/or with each other to fulfill their respective functions as needed. It may also be preferred that electrical connections be made between the contact plate 142 and/or electronic display 138 and/or IC chip 144 and/or electronic components 146, and between any combination of the various components individually and in combination to fulfill their respective functions and composite functions as needed. It is also understood that these electrical connections can be made before or during embedding any of the components 138, 142, 144, 146 into the card 100. In this embodiment, it can be seen that the contact plate 142 can be embedded into the card 100 on one side of the card 100 (e.g., the front or top side of the card 100) and the electronic reader 138 can be embedded into the card 100 on a side of the card that can be opposite the side that can include the contact plate 142.

In all of the embodiments described herein or elsewhere, the integrated circuit chip 144 may include a microprocessor, microcontroller, CPU, memory, and any other components and elements for performing its functions. In all of the embodiments described herein, the electronic components may include resistors, capacitors, inductors, matching networks, and any other components and elements necessary for the module 120, 140, 160, 170, 180, 190, 200, 202, 204, 206 to perform its desired function.

In all of the embodiments described herein or otherwise, the modules 120, 140, 160, 170, 180, 190, 200, 202, 204, 206, and/or any subassemblies thereof (e.g., subassemblies 204-1, 204-2, 204-n) may include elements other than or in addition to those described. For example, in one exemplary embodiment thereof as shown in Figures 15A, 15B, and 15C, in addition to the contact plate 142, electronic reader 138, electronic components 146, and/or ICs 144, the module 208 and/or any subassemblies thereof (e.g., subassemblies 208-1, 208-2, 208-n) may include one or more antennas 166. In one exemplary embodiment, one or more antennas 166 may be configured with subassembly 208-1 as shown, and/or with subassembly 208-2, with both subassemblies 208-1, 208-2, and any combination thereof. In one exemplary embodiment, subassemblies 208-1, 208-2 may be configured within card 100 using the techniques described in connection with the embodiment of FIG. 12, or similar to any other embodiment described herein. Although FIG. 15C shows one antenna 166 configured with subassembly 208-1, any number of antennas 166 may be configured with any subassembly 208-n, or any combination of subassemblies 208-n. It is also understood that in cases where module 208 may not include subassembly 204-n (e.g., similar to module 200), one or more antennas 166 may be configured with module 208 in some manner. In this case, module 208 may be configured within card 100 as described above in connection with the embodiment of FIG. 8, or similar to any other embodiment described herein. It is also understood that one or more antennas 166 may be configured in any manner with any of the modules 200, 202, 204, 206, 208 as desired.

In addition, upon reading this specification, it will be understood by those skilled in the art that the various aspects of the embodiments described herein may be combined in any manner and in any combination. For example, one exemplary embodiment may include an integrated module that includes a visible portion of the contact plate 142 and a visible portion of the electronic reader 138 on the top surface of the smart card 100, and may additionally include a visible portion of an additional electronic reader 138 on the bottom surface of the smart card 100. Another exemplary embodiment may include an integrated module that includes a visible portion of the contact plate 142 on the top surface of the smart card 100, and may include a visible portion of one or more electronic readers on the same surface as the contact plate 142, on a different surface than the contact plate 142, or on any combination of surfaces. In this embodiment, the electronic reader may be positioned on the surface in any position and location relative to the contact plate 142. In another example, another exemplary embodiment may include an IC chip 146 positioned generally below, below, or behind the contact plate 142, and an electronic component 146 positioned generally below, below, or behind the electronic display 138. In another exemplary embodiment, the IC chip 146 and the electronic components 146 can be positioned generally below, below, or behind the electronic display 138. In another exemplary embodiment, the IC chip 146 can be positioned generally below, below, or behind the electronic display 138 and the electronic components 146 can be positioned generally below, below, or behind the contact plate 142. Additionally, any portion of the IC chip 146 and/or any portion of the electronic components 146 can be positioned below the contact plate 142 and/or the electronic reader 138 or any combination thereof. Any and all combinations of any or all aspects of any or all of the exemplary embodiments described herein are hereby contemplated.

As will be appreciated by those skilled in the art, software embodiments may include firmware, resident software, microcode, and the like. Certain components including software or hardware or combining software and hardware aspects may be referred to generally herein as "circuits," "modules," or "systems." In addition, the disclosed subject matter may be implemented as a computer program product embodied in one or more computer readable storage media having computer readable program code embodied therein. Any combination of one or more computer readable storage media may be utilized. The computer readable storage medium may be a computer readable signal medium or a computer readable storage medium. The computer readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing.

In the context of this document, a computer-readable storage medium may be any tangible medium that can encapsulate or store a program for use by or in connection with an instruction execution system, apparatus, or device. A computer-readable signal medium may include a propagated data signal having computer-readable program code embodied therein, for example in baseband or as part of a carrier wave. Such a propagated signal may take any of a variety of forms, including but not limited to electromagnetic, optical, or any suitable combination thereof. A computer-readable signal medium may be any computer-readable medium that is not a computer-readable storage medium but can communicate, propagate, or carry a program for use by or in connection with an instruction execution system, apparatus, or device.

The program code embodied on the computer readable storage medium may be transmitted using any suitable medium, including but not limited to wireless, wired, fiber optic cable, RF, and the like, or any suitable combination of the above. The computer program code for performing the disclosed operations may be written in any combination of one or more programming languages, including object-oriented programming languages such as Java, Smalltalk, C++, and conventional procedural programming languages, such as the "C" programming language or a similar programming language.

The program code may run entirely on the user's computer, partially on the user's computer, as a stand-alone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the latter scenario, the remote computer may be connected to the user's computer over any type of network, including a local area network (LAN) or a wide area network (WAN), or the connection may be to an external computer (e.g., over the Internet using an Internet Service Provider).

As used in this specification, including the claims, the term "at least a portion" means "one or more," including the case of only one. Thus, for example, the term "at least a portion of ABC" means "one or more than one ABC," including the case of only one ABC.

As used herein, the term "portion" means part or all. So, for example, "a portion of X" can include part of "X" or all of "X." In the context of a conversation, the term "portion" can mean part or all of the conversation.

As used herein, including the claims, the phrase "based on" means "based in part on" or "based at least in part on," without limitation. Thus, for example, the phrase "based on factor X" means "based in part on factor X" or "based at least in part on factor X." Unless specifically noted using the word "only," the phrase "based on X" does not mean "based only on X."

The term "use" as used herein, including the claims, means "use at least" and is not limiting. Thus, for example, the term "use X" means "use at least X." Unless specifically specified using the word "only," the term "use X" does not mean "use only X."

Generally, the word "only" when used in this specification, including the claims, should not be read into a statement unless the word is specifically used within that statement.

The term "distinctly different" as used herein, including the claims, means "at least partially distinctly different." Unless specifically stated otherwise, distinctly different does not mean "completely distinctly different." Thus, for example, the term "X is distinctly different from Y" means "X is at least partially distinctly different from Y," and does not mean "X is completely distinctly different from Y." Thus, the term "X is distinctly different from Y" as used herein, including the claims, means that X is different from Y in at least some way.

It is to be understood that the words "first" and "second" in this specification and claims are used for distinction or identification purposes and are not intended to denote sequential or numerical limitations. Similarly, letter or number labels (such as "(a)" and "(b)") are used to aid in distinction and/or identification and are not intended to denote sequential or numerical limitations or order.

While the invention has been described in connection with what are presently considered to be the most practical and preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but rather is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

While certain presently preferred embodiments of the invention have been described herein, it will be apparent to those skilled in the art to which the invention pertains that variations and modifications of the described embodiments are possible without departing from the spirit and scope of the invention.

The foregoing description of the preferred embodiment of the invention has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form disclosed. Many modifications and variations are possible in light of the above teachings. It is intended that the scope of the invention be limited not by this detailed description, but by the claims appended hereto and their equivalents.

100 Value-added smart card 110 Antenna 115 Plastic card layer 120 Packaged electronic module 125 Contact plate

Claims (17)

1. An electronic module for use with a card, comprising:
at least one integrated circuit chip;
a contact plate configured with said at least one integrated circuit chip;
a plurality of electronic components coupled to said at least one integrated circuit chip;
at least one electronic display connected to the plurality of electronic components and/or the at least one integrated circuit chip;
the electronic module is configured with the card, and at least a portion of the contact plate and at least a portion of the at least one electronic display are visible on a first side of the card;
a first part of an electronic module is embedded in the first face of the card from a front side of the first face, and a second part of an electronic module is embedded in the first face of the card separately from the first part and from the front side of the first face, the parts being directly connected to each other to form a value-added smart card;
1. An electronic module comprising: The first surface of the card is a front surface of the card or a back surface of the card.
2. The electronic module of claim 1. and at least one antenna configured with the integrated circuit chip.
2. The electronic module of claim 1. and an electrical connector configured to connect to other electrical components within the card.
2. The electronic module of claim 1. the packaged electronic module is connected within the card to one or more card antennas;
2. The electronic module of claim 1. the packaged electronic module is connected to an embedded battery within the card;
2. The electronic module of claim 1. The electronic display or the touch plate of the packaged electronic module is replaced by at least one value-added component selected from the group of a fingerprint sensor, an LED, an electronic button, and a mechanical button.
2. The electronic module of claim 1. 1. An electronic module for use with a card, comprising:
at least one integrated circuit chip;
a plurality of electronic components coupled to said at least one integrated circuit chip;
at least one electronic display connected to the plurality of electronic components and/or the at least one integrated circuit chip;
a first part of the electronic module is embedded in a first face of the card from in front of the first face, and a second part of the electronic module is embedded in the first face of the card separate from the first part from in front of the first face, the first and second parts being directly connected to each other to form a value-added smart card;
1. An electronic module comprising: a contact plate configured with the at least one integrated circuit chip;
9. The electronic module of claim 8. the contact plate is recessed into the first surface of the card from in front of the first surface;
10. The electronic module of claim 9. The first surface of the card is a front surface of the card or a back surface of the card.
9. The electronic module of claim 8. and at least one antenna configured with the integrated circuit chip.
9. The electronic module of claim 8. and an electrical connector configured to connect to other electrical components within the card.
9. The electronic module of claim 8. A method of assembling an electronic module in a card, comprising the steps of:
(A) preparing a card;
(B) creating an open area on a first side of the card;
(C) embedding a first portion of the electronic module in the first portion of the open area; and (D) embedding a second portion of the electronic module in the second portion of the open area,
the first part of the electronic module and the second part of the electronic module are directly connected to each other by the embedding of the first part of the electronic module and the second part of the electronic module in the opening area.
A method comprising: the first portion of the electronic module includes a contact plate and the second portion of the electronic module includes an electronic display.
15. The method of claim 14. The first surface is a front surface of the card or a back surface of the card.
15. The method of claim 14. the first part of the electronic module and/or the second part of the electronic module are provided with an antenna;
15. The method of claim 14.

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