JP7358222B2 - 板状物保持具 - Google Patents
板状物保持具 Download PDFInfo
- Publication number
- JP7358222B2 JP7358222B2 JP2019220939A JP2019220939A JP7358222B2 JP 7358222 B2 JP7358222 B2 JP 7358222B2 JP 2019220939 A JP2019220939 A JP 2019220939A JP 2019220939 A JP2019220939 A JP 2019220939A JP 7358222 B2 JP7358222 B2 JP 7358222B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- ring
- wafer
- holding
- suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- H10P72/78—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
- B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
-
- H10P72/0428—
-
- H10P72/3202—
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Manipulator (AREA)
Description
4:保持基台
14:連結口
18:吸引源
28:第一のOリング
30:第二のOリング
32:吸引孔
34:液体供給手段
S:液体シール
Claims (1)
- 板状物を吸引保持する板状物保持具であって、
吸引源に連結する連結口を備えると共に保持面を備えた保持基台と、該保持面に配設された第一のOリングと、該第一のOリングの内側に配設された第二のOリングと、該第一のOリングと該第二のOリングとの間に開口し該連結口に連通する吸引孔と、該第一のOリングの外周で該保持面と板状物との間に液体シールを形成する液体供給手段と、を備えた板状物保持具。
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019220939A JP7358222B2 (ja) | 2019-12-06 | 2019-12-06 | 板状物保持具 |
| TW109141905A TWI846986B (zh) | 2019-12-06 | 2020-11-27 | 板狀物保持具 |
| KR1020200164388A KR102746758B1 (ko) | 2019-12-06 | 2020-11-30 | 판상물 유지구 |
| US17/109,907 US12100612B2 (en) | 2019-12-06 | 2020-12-02 | Plate-shaped workpiece holding tool |
| CN202011398218.9A CN112917386B (zh) | 2019-12-06 | 2020-12-04 | 板状物保持器具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019220939A JP7358222B2 (ja) | 2019-12-06 | 2019-12-06 | 板状物保持具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2021090028A JP2021090028A (ja) | 2021-06-10 |
| JP7358222B2 true JP7358222B2 (ja) | 2023-10-10 |
Family
ID=76163722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019220939A Active JP7358222B2 (ja) | 2019-12-06 | 2019-12-06 | 板状物保持具 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12100612B2 (ja) |
| JP (1) | JP7358222B2 (ja) |
| KR (1) | KR102746758B1 (ja) |
| CN (1) | CN112917386B (ja) |
| TW (1) | TWI846986B (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102746708B1 (ko) * | 2020-08-19 | 2024-12-24 | 가부시키가이샤 신가와 | 기판 홀더 및, 본딩 시스템 및 본딩 방법 |
| JP7798542B2 (ja) | 2021-11-22 | 2026-01-14 | 株式会社ディスコ | ウェーハ保持具 |
| JP2023140438A (ja) * | 2022-03-23 | 2023-10-05 | 株式会社ディスコ | 保持パッド及び搬送装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005123387A (ja) | 2003-10-16 | 2005-05-12 | Seiko Epson Corp | 基板保持具及び基板の表面処理方法 |
| JP2010114353A (ja) | 2008-11-10 | 2010-05-20 | Disco Abrasive Syst Ltd | 研削装置 |
| JP2020145258A (ja) | 2019-03-05 | 2020-09-10 | 株式会社ディスコ | ウエーハ搬送機構および研削装置 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5096536A (en) * | 1990-06-12 | 1992-03-17 | Micron Technology, Inc. | Method and apparatus useful in the plasma etching of semiconductor materials |
| DE4116392C2 (de) * | 1991-05-18 | 2001-05-03 | Micronas Gmbh | Halterung zur einseitigen Naßätzung von Halbleiterscheiben |
| JPH09225768A (ja) * | 1996-02-23 | 1997-09-02 | Nippon Telegr & Teleph Corp <Ntt> | 基板保持装置 |
| JPH10135316A (ja) * | 1996-10-28 | 1998-05-22 | Sony Corp | 薄板状基板の真空吸着方法及びその真空吸着テーブル装置 |
| JP2000094221A (ja) | 1998-09-24 | 2000-04-04 | Toyo Advanced Technologies Co Ltd | 放電式ワイヤソー |
| JP2000180469A (ja) * | 1998-12-18 | 2000-06-30 | Fujitsu Ltd | 半導体装置用コンタクタ及び半導体装置用コンタクタを用いた試験装置及び半導体装置用コンタクタを用いた試験方法及び半導体装置用コンタクタのクリーニング方法 |
| US6939206B2 (en) * | 2001-03-12 | 2005-09-06 | Asm Nutool, Inc. | Method and apparatus of sealing wafer backside for full-face electrochemical plating |
| US6746318B2 (en) * | 2001-10-11 | 2004-06-08 | Speedfam-Ipec Corporation | Workpiece carrier with adjustable pressure zones and barriers |
| JP2007294588A (ja) | 2006-04-24 | 2007-11-08 | Disco Abrasive Syst Ltd | ウエーハ保持具 |
| JP5669518B2 (ja) * | 2010-10-18 | 2015-02-12 | 株式会社ディスコ | ウエーハ搬送機構 |
| JP5944724B2 (ja) * | 2012-04-12 | 2016-07-05 | 株式会社ディスコ | チャックテーブル |
| JP5999972B2 (ja) * | 2012-05-10 | 2016-09-28 | 株式会社ディスコ | 保持テーブル |
| JP5989501B2 (ja) * | 2012-10-22 | 2016-09-07 | 株式会社ディスコ | 搬送方法 |
| JP6399913B2 (ja) | 2014-12-04 | 2018-10-03 | 株式会社ディスコ | ウエーハの生成方法 |
| US20170317225A1 (en) * | 2014-12-10 | 2017-11-02 | Applied Materials, Inc. | System and method for all wrap around porous silicon formation |
| JP6829590B2 (ja) * | 2016-11-28 | 2021-02-10 | 株式会社ディスコ | 研削装置 |
| JP6920063B2 (ja) | 2017-01-11 | 2021-08-18 | 株式会社ディスコ | 板状ワークの保持方法 |
| JP7096674B2 (ja) * | 2018-01-31 | 2022-07-06 | 株式会社ディスコ | 研削研磨装置及び研削研磨方法 |
| TW202002135A (zh) * | 2018-06-18 | 2020-01-01 | 美商維克精密表面處理股份有限公司 | 用於支撐及操縱晶圓的設備 |
| US10672631B2 (en) * | 2018-08-15 | 2020-06-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and system for substrate thinning |
| US11587818B2 (en) * | 2019-07-18 | 2023-02-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Chuck design and method for wafer |
-
2019
- 2019-12-06 JP JP2019220939A patent/JP7358222B2/ja active Active
-
2020
- 2020-11-27 TW TW109141905A patent/TWI846986B/zh active
- 2020-11-30 KR KR1020200164388A patent/KR102746758B1/ko active Active
- 2020-12-02 US US17/109,907 patent/US12100612B2/en active Active
- 2020-12-04 CN CN202011398218.9A patent/CN112917386B/zh active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005123387A (ja) | 2003-10-16 | 2005-05-12 | Seiko Epson Corp | 基板保持具及び基板の表面処理方法 |
| JP2010114353A (ja) | 2008-11-10 | 2010-05-20 | Disco Abrasive Syst Ltd | 研削装置 |
| JP2020145258A (ja) | 2019-03-05 | 2020-09-10 | 株式会社ディスコ | ウエーハ搬送機構および研削装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202123365A (zh) | 2021-06-16 |
| KR102746758B1 (ko) | 2024-12-26 |
| TWI846986B (zh) | 2024-07-01 |
| CN112917386B (zh) | 2024-07-02 |
| CN112917386A (zh) | 2021-06-08 |
| KR20210072698A (ko) | 2021-06-17 |
| US12100612B2 (en) | 2024-09-24 |
| US20210175113A1 (en) | 2021-06-10 |
| JP2021090028A (ja) | 2021-06-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7358222B2 (ja) | 板状物保持具 | |
| CN105196162A (zh) | 搬送装置 | |
| JP6622140B2 (ja) | チャックテーブル機構及び搬送方法 | |
| JP2012099755A (ja) | 搬送装置 | |
| TWI246499B (en) | Plate-like object carrying mechanism and dicing device with carrying mechanism | |
| CN101364562A (zh) | 卡盘工作台机构以及被加工物的保持方法 | |
| CN111300670B (zh) | 切削装置 | |
| JP2024026194A (ja) | ウエハ搬送装置 | |
| TWI713751B (zh) | 搬送單元 | |
| JP6822857B2 (ja) | 搬出機構 | |
| JP5989501B2 (ja) | 搬送方法 | |
| CN112276792B (zh) | 晶片搬送机构和磨削装置 | |
| JP5412261B2 (ja) | 加工装置 | |
| JP2022172553A (ja) | 吸引保持テーブル及び加工装置 | |
| TWI815953B (zh) | 卡盤台以及晶圓加工方法 | |
| JP2003273055A (ja) | スピンナー洗浄装置 | |
| JP2014150206A (ja) | 板状物の搬送装置 | |
| JP7202131B2 (ja) | 板状ワークの搬送装置及び搬送方法 | |
| TW202044481A (zh) | 保持裝置 | |
| JP2020145258A (ja) | ウエーハ搬送機構および研削装置 | |
| JP2023142824A (ja) | 搬送装置 | |
| JP2021114520A (ja) | 切削装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20221021 |
|
| RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20230824 |
|
| TRDD | Decision of grant or rejection written | ||
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20230831 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230905 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230927 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7358222 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |