JP7224575B2 - probe card - Google Patents

Description

The present invention relates to probe cards.

The quality of IC wafers, electronic components, and the like is determined by examining their electrical characteristics. This determination is performed by bringing a probe of the probe head into contact with a connection electrode provided on the electronic component, inputting an inspection signal from the inspection device to the probe, and comparing the output with a reference value.

As a known technology related to a probe head and a probe card having the same, for example, there is a technology described in Patent Document 1 below.

WO2015/027741

By the way, when the electrical characteristics of an electronic component are inspected using a probe card, the electronic component or the probe card is usually moved so that the probe at the tip of the probe head comes into contact with the electrode pad of the electronic component to be inspected. After that, the contact is stabilized by further pushing for a predetermined distance (this pushing is called "overdrive").

By the way, in recent years, there are cases where more overdrives than usual are required due to further progress in integration. For example, there is a case where the chip pieces themselves arranged on the tray are measured. In such a case, since the individual pieces themselves are slanted, more overdrive is required to match the slanting.

However, if overdrive is performed beyond the normal level (approximately 30 to 50 μm), the repulsive range of the probe is exceeded, and there is a risk of breakage, such as breaking or not returning while being bent.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a probe card having a probe head capable of coping with greater overdrive.

That is, a probe card according to one aspect of the present invention for solving the above problems includes a main board, an elastic member connected to the main board, and a probe unit having a probe head and connected to the elastic member. It is.

As described above, according to the present invention, it is possible to provide a probe card having a probe head capable of coping with larger overdrive.

1 is a schematic perspective view of a probe card according to Embodiment 1; FIG. 1 is a schematic cross-sectional view of a probe card according to Embodiment 1; FIG. 4 is a diagram showing details of the vicinity of the sub-board of the probe card according to the first embodiment; FIG. 4 is a schematic diagram of another example of the probe card according to Embodiment 1. FIG. 4 is a schematic cross-sectional view of another example of the probe card according to Embodiment 1; FIG. 4 is a diagram showing an example of wiring in the vicinity of the probe unit according to Embodiment 1; FIG. 4 is a diagram showing details of the vicinity of the probe head of the probe card according to the first embodiment; FIG. 4 is a diagram showing an outline of an inspection process of the probe card according to Embodiment 1; FIG. FIG. 5 is a schematic cross-sectional view of a probe card according to Embodiment 2;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. This invention may, however, be embodied in many different forms and should not be limited to the specific exemplifications in the embodiments set forth below.

(Embodiment 1)
FIG. 1 is a schematic perspective view of a probe card (hereinafter referred to as "the present probe card") 1 according to this embodiment, and FIG. 2 is a schematic cross-sectional view of the present probe card 1. As shown in FIG.

As shown in these figures, the probe card 1 includes a main board 2, an elastic member 3 connected to the main board 2, and a probe unit 4 having a probe head 41 and connected to the elastic member 3. ,

In the probe card 1 , the main substrate 2 is a substrate forming a main skeleton of the probe card 1 .

The main board 2 of the probe card 1 preferably has a connector 21, although not limited thereto. Also, the connector 21 is electrically connected to the probe head through at least one of metal wiring and conducting wire. When inspecting an electronic component or the like, it is possible to connect this connector to an inspection device and to inspect whether or not the object to be inspected is operating normally by input/output of signals from the inspection device.

The connector 21 on the main board 2 of the probe card 1 is not limited as long as it is electrically connected to the probes of the probe head 41, but it may be a metal terminal connected to a single conductor wire. It may be a coaxial cable connector.

Further, it is preferable that an observation window W is provided on the main board 2 and the sub-board 4 of the probe card 1 . By providing an observation window W so that the tip of the probe can be seen when the observation window W is removed from above, the tip position of the probe can be accurately positioned on the electrode pad of the electronic component to be inspected. can be placed.

In the probe card 1, the elastic member 3 is connected to the main board 2. More specifically, the elastic member 3 connects the main board 2 and the probe unit 4 and pushes the probe unit 4. It functions as a cushioning material when the position (horizontal and vertical tilts; hereinafter referred to as "position") changes, and can return to the original position when the force is released. It is something that can function as a material.

The elastic member 3 in the present probe card 1 is not limited as long as it has the above function, and for example, at least one of a spring and an elastomer can be exemplified, but it is not limited to this.

When the elastic member 3 is a spring, springs of various shapes such as leaf springs and spiral springs can be employed. For example, in the example of the probe card 1, a plate spring having a curved S-like shape on a plane is used. A detailed diagram of this case is shown in FIG. 3, for example. Although the material of the spring is not particularly limited, it is preferable to use metal or resin.

Further, when the elastic member 3 is an elastomer, it may be rubber (thermosetting elastomer) or the like, or may be a thermoplastic elastomer. Also, in this case, it can be used in the same manner as the example of FIG. An example of this case is shown in FIGS. 4 and 5. FIG. The example in this figure shows an example of rubber filled between the sub-board and the main board.

In the probe card 1 , the probe unit 4 has a sub-board 42 and a probe head 41 connected to the sub-board 42 .

In this probe card 1 , the sub-board 42 is a board that holds the probe head 41 and is provided independently of the main board 2 . By providing the sub-board 42 , the probe head 41 can be stably held, and together with the elastic member 3 , the position of the probe head relative to the main board 2 can be changed.

Further, as described above, the probe unit 4 of the probe card 1 is connected to the main board 2 via the elastic member 3 . In the example of this embodiment, the sub-board 42 and the main board 2 are connected via the elastic member 3 .

In the probe card 1, the probe head 41 includes at least probes 411 to be brought into contact with the electrode pads and probe fixing members 412 to fix the probes 411. As shown in FIG.

The probe 411 is electrically connected to the connector 21 arranged on the main substrate. The connection between the probe 411 and the connector 21 preferably uses a metal lead wire (including a coaxial cable) or a conductive wire formed on the substrate.

The probe 411 and the connector 21 may be directly connected without the sub-board 42, but they are connected to a metal lead C or a conductive wire fixed on the sub-board 42, and further connected to the main board 2 from there. It may be connected to the connector 21 . When the probe 411 and the connector 21 are directly connected without passing through the sub-board 42, there is an advantage that the wiring can be easily performed. and the sub-board 42 are fixed to suppress the fluctuation of the conducting wire in the vicinity of the probe, and only the part of the fluctuation of the positional relationship between the sub-board 42 and the main substrate 2 becomes the range of fluctuation of the conducting wire, and A more flexible conductor can be employed than with a direct connection. That is, it becomes possible to adjust the variation in the distance between the probe and the connector 21 caused by overdrive at a position away from the probe, thereby increasing the reliability of the wiring. An image of this case is shown in FIG.

Moreover, the probes 411 of the probe head 41 in the probe card 1 are preferably fixed by a probe fixing member 412 connected to the sub-board 42 . This makes it possible to reliably fix the positional relationship of the probe 411 . An image of this case is shown in FIG.

More specifically, the probe fixing member 412 of the probe head 41 shown in this figure is composed of a resin layer 4121 and a ring 4122 serving as the base of the resin layer 4121, and the ring 4122 is adhered. It is connected to the sub-board 42 by an adhesive.

The resin layer 4121 is for fixing the probe, and can directly fix the probe. An example of the resin layer 4121 is not limited, but epoxy resin or the like that functions as an adhesive with excellent insulating properties and handling properties can be exemplified, but the resin layer 4121 is not limited to this.

The ring 4122 is a useful member for temporarily arranging the probe 411 and serving as a base for highly fluid resin when fixing the probe 411 in this temporarily arranged state. That is, by using the ring 4122, the arrangement of the probe 411 is surely fixed, and in this state, it becomes easy to arrange it on the sub-board 42. FIG. The material of the ring 4122 is not particularly limited, and is preferably a thin film of resin.

As described above, the probe card 1 is a probe card having a probe head capable of coping with larger overdrive. This point will be described more specifically with reference to FIG.

First, in the case of inspection, the user brings the main board 2 and the electronic component to be inspected close to each other and brings at least a part of the probe into contact with the electrode pad. In this case, the main substrate 2 may be moved to bring it closer to the electronic component side, or the electronic components may be moved to bring it closer to the main substrate 2 side.

After at least part of the probe is brought into contact with the electrode pad, the main substrate and the electronic component to be inspected are brought closer together. As a result, the sub-board is pushed toward the inspection target side while being cushioned by the deformation of the elastic member 3, so that the sub-board fits the inspection target while being tilted. Specifically, other probes can also stably contact the electrode pads. By inputting an electrical signal through the connector 21 and checking the output, it is possible to inspect whether the product operates normally.

As is clear from the above example, during overdrive, the probe 411 and the elastic member 3 are configured such that the probe 411 first contacts the electrode pad and bends to some extent, and then the elastic member 3 deforms. It is preferable that First, the probe 411 is bent to some extent to strengthen the contact with the electrode pad, and then the elastic member 3 is deformed while maintaining this contact state, so that the probe 411 and the electrode are stably connected even when the sub-board 42 is tilted. It becomes possible to maintain contact with the pad. On the other hand, the elastic member 3 must have an elastic modulus to the extent that it starts to deform before the limit of restoration of the probe 411 . If the elastic member begins to deform after the limit of restoration of the probe 411, the probe 411 will be damaged. That is, it is preferable that the elastic modulus of the probe 411 and the elastic member 311 is smaller than that of the elastic member 311. More preferably, the elastic member 3 starts to deform within a range equal to or less than the restoration limit of the probe 411. It's becoming Also, as is clear from this description, the present probe card achieves the overdrive amount through cooperation between the probe 411 and the elastic member 3 . This preferred amount of overdrive can be adjusted as appropriate, but can be achieved from 100 μm to 400 μm, of which about 30 to 50 μm (about the normal overdrive amount) is secured by the probe, and the remaining amount is secured by the elastic member. can.

As described above, the present probe card 1 is a probe card having a probe head capable of coping with larger overdrive.

(Embodiment 2)
FIG. 9 shows an outline of a probe card (hereinafter referred to as "this probe card") 1 according to this embodiment. This probe card has substantially the same configuration as the probe card according to the first embodiment, but differs in that the probe head 41 is provided directly on the elastic member 3 without using a sub-board.

Further, in this probe card, a plurality of elastic members 3 are provided according to the number of probe heads 41 , and each of them is fixed by a probe fixing member 412 . By doing so, an effect similar to that of the first embodiment can be obtained.

In this case, the probe fixing member 412 has a resin layer 4121 and a ring 4122 as in the first embodiment, and the ring 4122 and the elastic member 3 are directly connected. is preferred. By doing so, the relationship between the probes 411 can be reliably secured, while the configuration can be simplified by omitting the sub-board 42 .

As described above, the present probe card 1 also becomes a probe card having a probe head capable of coping with larger overdrive.

INDUSTRIAL APPLICABILITY The present invention has industrial applicability as a probe card.

Claims (4)

A probe card comprising a main board, an elastic member, and a probe unit,
The main substrate is ring-shaped and flat-plate -shaped,
The probe unit includes a probe head and a ring-shaped and flat plate-shaped sub-substrate with an observation window,
The main board and the sub-board are connected by the elastic member so that they do not overlap in the thickness direction, and the probe unit is positioned inside the main board ,
The probe head includes a probe whose tip is visible through the observation window and is arranged so as to be bent to some extent when it comes into contact with the electrode pad; a probe fixing portion provided on the sub-board for fixing the probe; is configured with
The main board includes a connector and a metal lead wire connecting the connector and the probe ,
probe card. 2. The probe card according to claim 1, wherein said metal lead directly connects said connector and said probe without passing through said sub-board. 2. The probe card according to claim 1, wherein said metal lead wires are routed once on said sub-board to connect said connectors and said probes. 2. The probe card according to claim 1, wherein said elastic member has a modulus of elasticity smaller than that of said probe.

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