JP6981047B2 - Quality display IC tag - Google Patents

Description

The present invention relates to an IC tag used for product management.

In recent years, an increasing number of apparel stores have introduced product management using IC tags. When introducing product management using IC tags in apparel stores, IC tags are attached to products sold in apparel stores. By attaching IC tags to products sold at apparel stores, the IC tags attached to each product can be read at once, so work related to product management such as inventory can be made much more efficient than when using barcodes. ..

When attaching an IC tag to a product sold at an apparel store, it is common to use a paper IC tag as disclosed in Patent Document 1. Similar to the apparel tag printed with the brand name, a hole is made in the paper IC tag, and the IC tag is attached to the product by passing a string through this hole. When the tag is attached, the IC tag may be torn and the IC tag may be missing from the product when the customer picks up the product.

As a method for preventing the IC tag from being torn and missing from the product, it is conceivable to sew the IC tag on an apparel product such as clothing. An IC tag configured to be sewn on an apparel product has already been disclosed. For example, Patent Document 2 discloses an IC tag using a group of woven fabric and paper as a base material, such as a shirt collar and a shirt. It is described that this IC tag is sewn on the folded back of the towel. Further, Patent Document 3 discloses a cloth IC tag using a cloth base material, and describes that the cloth IC tag is sewn on clothing as a name tag.

Japanese Unexamined Patent Publication No. 2008-174860 Japanese Unexamined Patent Publication No. 2007-18487 Japanese Unexamined Patent Publication No. 2011-186842

By law such as the Household Goods Quality Labeling Law, it is obligatory to attach a quality label (laundry label or care label) to apparel products such as clothing. If it can be integrated with the quality display tag, it is possible to omit the work of attaching the IC tag used for product management of the apparel store to the apparel product, but the conventional IC tag is not configured to be integrated with the quality display tag.

Therefore, an object of the present invention is to provide an IC tag or the like that can be integrated with a quality display tag.

In the first invention to solve the above-mentioned problems, an inlet having an IC chip and an antenna connected to the IC chip is mounted on one side of the base base material, and a thermoplastic resin layer using a thermoplastic resin is placed under the inlet. The IC tag formed in the above is integrated with the quality display tag base material using the fabric woven with fibers in a state where the portion of the thermoplastic resin layer on which the inlet is not mounted is impregnated. It is a characteristic quality display IC tag.

The IC tag and the IC tag reel according to the present invention are configured to be integrated with the quality display tag by a thermoplastic resin layer. Further, the quality display IC tag according to the present invention is a medium in which the IC tag according to the present invention and the quality control tag are integrated, and the thermoplastic resin layer is used for adhering the IC tag and the quality display tag according to the present invention. As a result, the IC tag according to the present invention and the quality display tag are integrated in a state where a part of the thermoplastic resin layer is impregnated.

The figure explaining the IC tag which concerns on this embodiment. The figure explaining the IC tag reel which concerns on this embodiment. The figure explaining the manufacturing method of the IC tag reel which concerns on this embodiment. The figure explaining the quality display IC tag which concerns on this embodiment. The figure explaining the IC tag which concerns on the modification 1. The figure explaining the IC tag reel which concerns on modification 1. FIG. The figure explaining the manufacturing method of the IC tag reel which concerns on modification 1. FIG. The figure explaining the quality display IC tag which concerns on modification 1.

From here, suitable embodiments of the present invention will be described. The following description does not constrain the technical scope of the present invention, but is intended to aid understanding.

FIG. 1 is a diagram illustrating an IC tag 1 according to the present embodiment. FIG. 1A is a perspective view of the IC tag 1 according to the present embodiment. The IC tag 1 according to the present embodiment is a tag devised on the premise that it is integrated with a quality display tag sewn on an apparel product such as clothing, and the size and shape of the IC tag 1 according to the present embodiment are as follows. It has a size and shape (here, a rectangle) corresponding to the quality display tag. Although the edge of the IC tag 1 is a straight line in FIG. 1, the edge of the IC tag 1 can also be a corrugated line.

FIG. 1B is a first diagram illustrating the structure of the IC tag 1 according to the present embodiment, and is a sectional view taken along the line AA'in FIG. 1A. In the IC tag 1 according to the present embodiment, an inlet 12 having an IC chip 120 and an antenna 121 connected to the IC chip 120 is mounted on the base base material 10 of the IC tag 1, and the base base material 10 on which the inlet 12 is mounted is mounted. The structure is such that the thermoplastic resin layer 11 is formed on the surface.

FIG. 1 (c) is a second diagram illustrating the structure of the IC tag 1 according to the present embodiment, and is a sectional view taken along line BB'in FIG. 1 (a). Since the IC chip 120 is mounted in the central portion of the width of the IC tag 1 according to the present embodiment, the cross-sectional shape of the thermoplastic resin layer 11 in the width direction is such that the IC chip 120 is raised.

The base base material 10 of the IC tag 1 will be described. A resin film or a paper base material can be used as the base base material 10 of the IC tag 1. As the resin film, polyethylene terephthalate (PET), polypropylene (PP), polycarbonate (PC) and the like can be used as the base base material 10, but considering the cost, a paper base material such as high-quality paper and coated paper is used as the base base material. It is desirable to use it for 10.

The inlet 12 has an IC chip 120 that stores data used for product management of apparel products and an antenna 121 connected to the IC chip 120. The antenna 121 of the inlet 12 mounted on the thermoplastic resin layer 11 is designed for the frequency band in which the IC tag 1 is used, and in FIG. 1, the antenna 121 of the inlet 12 is described as a planar antenna. , The antenna 121 of the inlet 12 may be a coil antenna.

The thermoplastic resin means a resin that melts when heated to an appropriate temperature and solidifies when cooled, and hot melt is famous as a thermoplastic resin. In the IC tag 1 according to the present embodiment, the thermoplastic resin layer 11 is used for adhering the surface of the base base material 10 on which the inlet 12 is mounted and the quality display tag. For the quality display tag sewn on apparel products such as clothing, a fabric woven with fibers such as polyester satin, nylon taffeta or cotton taffeta is used. The thermoplastic resin layer 11 is used to bond the IC tag 1 and the quality display tag. By using the above, a part of the thermoplastic resin layer 11 is melted and soaks into the texture of the quality display tag, and the IC tag 1 and the quality control tag can be firmly adhered to each other.

The form of the IC tag 1 according to the present embodiment can be not only the rectangular (rectangular) form shown in FIG. 1 but also the reel form. FIG. 2 is a diagram illustrating an IC tag reel 2 in which the IC tag 1 according to the present embodiment is in the form of a reel.

FIG. 2A is a diagram illustrating the appearance of the IC tag reel 2 according to the present embodiment. The IC tag reel 2 illustrated in FIG. 2A has a strip-shaped base base material 20 wound in a reel shape, and the strip-shaped base base material 20 wound in a reel shape is connected to an IC chip 220. A plurality of inlets 22 having the antenna 221 are mounted side by side in the longitudinal direction, and a strip-shaped thermoplastic resin layer 21 is formed so as to cover the plurality of inlets 22. Further, the IC tag reel 2 illustrated in FIG. 2 is printed with a register mark 23 used for adhering to the quality control tag with the inlet 22 as a reference.

FIG. 2B is a diagram illustrating the structure of the IC tag reel 2 according to the present embodiment, and is a cross-sectional view taken along the line CC'in FIG. 2A. In the case of the IC tag reel 2, a plurality of inlets 22 are mounted on the strip-shaped base base material 20 at predetermined intervals, and a strip-shaped thermoplastic resin layer 21 using a thermoplastic resin is formed so as to cover the inlets 22. ing. Similar to the base base material 10 of the IC tag 1, a resin film or a paper base material can be used for the strip-shaped base base material 20, and a hot melt can be used for the strip-shaped thermoplastic resin layer 21.

FIG. 3 is a diagram illustrating a method of manufacturing the IC tag reel 2 according to the present embodiment. In the first step in the method for manufacturing the IC tag reel 2 according to the present embodiment, a strip-shaped base base material 20 using a predetermined material is prepared, and a plurality of inlets 22 are placed on one side of the strip-shaped base base material 20 in the longitudinal direction. In the step (S1) of mounting the antenna 221 on the inlet 22 continuously on one side of the strip-shaped base base material 20, the step of forming the antenna 221 of the inlet 22 on one side of the strip-shaped base base material 20 (S1a) and one side of the strip-shaped base base material 20. The step (S1b) of mounting the IC chip 220 on each of the antennas 221 continuously formed in the above is included.

Printing, etching or stamping can be used to form the antenna 221. When the antenna 221 is formed by printing, the antenna 221 having a predetermined shape is continuously printed on the strip-shaped base base material 20 by using conductive ink by a screen printing machine or the like. Further, when the antenna 221 of the inlet 22 is formed by etching, a metal foil is laminated on the strip-shaped base base material 20 in advance, and the metal foil is etched on the antenna 221 having a predetermined shape. When the antenna 221 of the inlet 22 forms a formation by hot stamping, a hot stamping tape on which a plurality of antennas 221 of a predetermined shape are formed is prepared in advance, and the antenna 221 of the predetermined shape is continuously attached to the strip-shaped base base material 20 by a hot stamping machine or the like. And transfer. When a paper base material is used for the strip-shaped base base material 20, the formation of the antenna 221 of the inlet 22 is stamped. If the register mark 23 is also formed at the same time as the antenna 221 is formed, the register mark 23 can be efficiently formed. A device such as a chip mounter is used to mount the IC chip 220, and a bump provided on the IC chip 220 is used to connect the IC chip 220 and the antenna 221.

The next step is a step (S2) of forming a thermoplastic resin layer using a thermoplastic resin so as to cover the inlet 22 mounted on one side of the strip-shaped base base material 20. In this step, the thermoplastic resin used for the strip-shaped thermoplastic resin layer 21 is coated on one side of the strip-shaped base base material 20 on which the inlet 22 is mounted by a roll coater or the like, and the heat coated on the strip-shaped base base material 20. By cooling the plastic resin by a predetermined method, a strip-shaped thermoplastic resin layer 21 is formed on the strip-shaped base base material 20 so as to cover the inlet 22.

Next, the quality display IC tag 3 in which the IC tag 1 and the quality display tag are integrated will be described. FIG. 4 is a diagram illustrating the quality display IC tag 3. In FIG. 4, the same elements as those in FIG. 1 are designated by the same reference numerals. FIG. 4A is a perspective view of the quality display IC tag 3 according to the present embodiment. The quality display IC tag 3 according to the present embodiment is a medium in which the above-mentioned IC tag 1 and the quality display tag base material 13 are bonded together.

FIG. 4B is a diagram illustrating the structure of the quality display IC tag 3 according to the present embodiment, and is a cross-sectional view taken along the line DD'in FIG. 4A. In the quality display IC tag 3 according to the present embodiment, the IC tag 1 according to the present embodiment and the quality display tag base material 13 are bonded together via the thermoplastic resin layer 11 possessed by the IC tag 1 according to the present embodiment. It has a structure. Since the thermoplastic resin used for the thermoplastic resin layer 11 is melted by heating, a part of the thermoplastic resin layer 11 covering the inlet 12 penetrates into the quality display tag base material 13, so that the IC tag 1 according to the present embodiment is used. And the quality display tag base material 13 are attached to each other. Specifically, with the surface of the base base material 10 on which the thermoplastic resin layer 11 is formed and the back surface (the side not printed) of the quality display tag base material 13 facing each other, appropriate pressure and temperature are applied to melt them. By immersing a part of the thermoplastic resin layer 11 in the quality display tag base material 13 and then cooling it, a part of the thermoplastic resin layer 11 covering the inlet 12 is soaked in the quality display tag base material 13. In the packed state, the IC tag 1 is integrated with the quality display tag base material 13.

Such a quality display IC tag 3 can be manufactured by using the IC tag reel 2 described with reference to FIG. For example, using the register mark 23, the strip-shaped base material on which the quality display tag base material 13 is continuously formed and the register of the IC tag reel 2 are aligned and pasted together, and then cut in units of the quality display IC tag 3. Therefore, the quality display IC tag 3 can be manufactured. Further, the quality display IC tag 3 can also be manufactured by cutting the IC tag reel 2 using the register mark 23 to manufacture the IC tag 1, and then laminating the strip-shaped quality display tag base material 13 and the IC tag 1. Can be manufactured.

Various changes can be made to the IC tag 1 according to the present embodiment described so far. From here, a modification of the IC tag 1 according to the present embodiment will be described.

FIG. 5 is a diagram illustrating the IC tag 4 according to the modified example 1. FIG. 5A is a perspective view of the IC tag 4 according to the modified example 1, and the same elements as those of the IC tag 1 according to the present embodiment are designated by the same reference numerals. The IC tag 4 according to the first modification is different from the IC tag 1 according to the present embodiment in that the inlet 12 is mounted on the thermoplastic resin layer 11 using the thermoplastic resin.

FIG. 5B is a diagram illustrating the structure of the IC tag 4 according to the modified example 1, and is a cross-sectional view taken along the line E-E'in FIG. 5A. As described above, the IC tag 4 according to the modification 1 forms a thermoplastic resin layer 11 using a thermoplastic resin on one side of the base base material 10 of the IC tag 4, and is connected to the IC chip 120. The structure is such that the inlet 12 having the antenna 121 is mounted on the thermoplastic resin layer 11.

Since the base base material 10, the thermoplastic resin layer 11, and the inlet 12 of the IC tag 4 according to the modified example 1 are the same as the IC tag 1 according to the present embodiment, the description thereof is omitted here.

The form of the IC tag 4 according to the modification 1 can be a reel form like the IC tag 1 according to the present embodiment. FIG. 6 is a diagram illustrating an IC tag reel 5 in which the IC tag 4 according to the modification 1 is in the form of a reel, and the same elements as those of the IC tag reel 2 according to the present embodiment are designated by the same reference numerals.

FIG. 6A is a diagram illustrating the appearance of the IC tag reel 5 according to the first modification. The IC tag reel 5 illustrated in FIG. 6A has a strip-shaped base base material 20 wound in a reel shape, and the strip-shaped base base material 20 wound in a reel shape is a strip-shaped base material 20 using a thermoplastic resin. The thermoplastic resin layer 21 of the above is formed, and a plurality of inlets 22 having an IC chip 220 and an antenna 221 connected to the IC chip 220 are mounted on the strip-shaped thermoplastic resin layer 21 side by side in the longitudinal direction. Further, the IC tag reel 5 shown in FIG. 6 is printed with a register mark 23 used for adhering to the quality control tag with the inlet 22 as a reference.

FIG. 6B is a diagram illustrating the structure of the IC tag reel 5 according to the modified example 1, and is a sectional view taken along line FF'in FIG. 6A. In the case of the IC tag reel 5, a strip-shaped thermoplastic resin layer 21 using a thermoplastic resin is formed on one side of the strip-shaped base base material 20, and a plurality of inlets 22 are formed of the strip-shaped thermoplastic resin layer 21 at predetermined intervals. Implemented above. Similar to the base base material 10 of the IC tag 1, a resin film or a paper base material can be used for the strip-shaped base base material 20, and a hot melt can be used for the strip-shaped thermoplastic resin layer 21.

FIG. 7 is a diagram illustrating a method of manufacturing the IC tag reel 5 according to the modified example 1. In the first step in the method for manufacturing the IC tag reel 5 according to the first modification, a strip-shaped base base material 20 using a predetermined material is prepared, and a strip-shaped base material 20 using a thermoplastic resin is used on one side of the strip-shaped base base material 20. This is a step (S10) of forming the thermoplastic resin layer 21 of the above. In this step, the thermoplastic resin used for the strip-shaped thermoplastic resin layer 21 is coated on one side of the strip-shaped base base material 20 by a roll coater or the like, and the thermoplastic resin coated on one side of the strip-shaped base base material 20 is predetermined. By cooling by the above method, a strip-shaped thermoplastic resin layer 21 is formed on one side of the strip-shaped base base material 20.

The next step is a step (S11) of mounting a plurality of inlets 22 at predetermined intervals in the longitudinal direction on the strip-shaped thermoplastic resin layer 21 formed on one side of the strip-shaped base base material 20. An IC chip 220 is provided for each of the step (S11a) of continuously forming the antenna 221 of the inlet 22 on the strip-shaped thermoplastic resin layer 21 and the antenna 221 continuously formed on the strip-shaped thermoplastic resin layer 21. The step of mounting (S11b) is included.

Printing or stamping can be used to form the antenna 221. When the antenna 221 is formed by printing, the antenna 221 having a predetermined shape is continuously printed on the strip-shaped thermoplastic resin layer 21 by using conductive ink by a screen printing machine or the like. When the antenna 221 of the inlet 22 forms a formation by stamping, a foil stamping tape on which a plurality of antennas 221 of a predetermined shape are formed is prepared in advance, and the antenna 221 of the predetermined shape is attached to the strip-shaped thermoplastic resin layer 21 by a foil stamping machine or the like. Transfer on top continuously. If the register mark 23 is also formed at the same time as the antenna 221 is formed, the register mark 23 can be efficiently formed. A device such as a chip mounter is used to mount the IC chip 220, and a bump provided on the IC chip 220 is used to connect the IC chip 220 and the antenna 221.

Next, the quality display IC tag 6 according to the modification 1 will be described. FIG. 8 is a diagram illustrating the quality display IC tag 6 according to the first modification, and in FIG. 8, the same elements as the quality display IC tag 3 according to the present embodiment are designated by the same reference numerals. FIG. 8A is a perspective view of the quality display IC tag 6 according to the first modification. The quality display IC tag 3 according to the modification 1 is a medium in which the IC tag 4 according to the above-mentioned modification 1 and the quality display tag base material 13 are bonded together.

FIG. 8B is a diagram illustrating the structure of the quality display IC tag 6 according to the modified example 1, and is a cross-sectional view taken along the line GG'in FIG. 4A. The quality display IC tag 6 according to the modification 1 uses the thermoplastic resin layer 11 of the IC tag 4 according to the modification 1 to bond the IC tag 4 according to the modification 1 and the quality display tag base material 13. It has a structure. Since the thermoplastic resin used for the thermoplastic resin layer 11 is melted by heating, a part of the thermoplastic resin layer 11 formed under the inlet 12 is of the quality of the inlet 12 mounted on the thermoplastic resin layer 11. By soaking into the display tag base material 13, it is attached to the quality display tag base material 13. Specifically, with the surface of the base base material 10 on which the thermoplastic resin layer 11 is formed and the back surface (the side not printed) of the quality display tag base material 13 facing each other, appropriate pressure and temperature are applied to melt them. By immersing a part of the thermoplastic resin layer 11 in the quality display tag base material 13 and then cooling it, a part of the thermoplastic resin layer 11 formed under the inlet 12 is a quality display tag group. The IC tag 4 is integrated with the quality display tag base material 13 in a state of being soaked in the material 13.

In the above-described embodiment, since the thermoplastic resin layer 11 is formed so as to cover the inlet 12, the quality display tag base material 13 adheres to all one side of the base base material 10, but in the modified example 1, the inlet 12 is adhered. Since the thermoplastic resin layer 11 is formed underneath, not all one side of the base base material 10 but mainly the portion where the inlet 12 is not mounted adheres to the quality display tag base material 13. Even if only the portion where the inlet 12 is not mounted adheres to the quality display tag base material 13, the adhesive strength is not a problem because a part of the thermoplastic resin layer 11 penetrates into the quality display tag base material 13.

Such a quality display IC tag 6 can be manufactured by using the IC tag reel 5 described with reference to FIG. For example, using the register mark 23, the strip-shaped base material on which the quality display tag base material 13 is continuously formed and the register of the IC tag reel 5 are aligned and pasted together, and then cut in units of the quality display IC tag 6. Therefore, the quality display IC tag 6 can be manufactured. Further, the quality display IC tag 6 can also be manufactured by cutting the IC tag reel 5 using the register mark 23 to manufacture the IC tag 4, and then laminating the strip-shaped quality display tag base material 13 and the IC tag 4. Can be manufactured.

1,4 IC tag 10 base base material 11 thermoplastic resin layer 12 inlet 120 IC chip 121 antenna 2,5 IC tag reel 20 band-shaped base base material 21 band-shaped thermoplastic resin layer 22 inlet 220 IC chip 221 antenna 3,6 quality Display IC tag

Claims (1)

An IC tag having an IC chip and an inlet having an antenna connected to the IC chip mounted on one side of the base base material and a thermoplastic resin layer using a thermoplastic resin formed under the inlet is woven with fibers. Quality display tag using fabric A quality display IC tag characterized in that the base material and the portion of the thermoplastic resin layer on which the inlet is not mounted are impregnated and integrated.

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