JP6865316B2 - Parts supply method and parts supply system - Google Patents

Description

The present specification relates to a component supply method and a component supply system for supplying a component by using a component holder to which a plurality of types of identification codes for different purposes are attached.

Equipment for producing substrates on which a large number of components are mounted includes solder printing machines, component mounting machines, reflow machines, and board inspection machines. It has become common to connect these board production facilities to form a board production line. Of these, the component mounting machine includes a board transfer device, a component supply device, a component transfer device, and a control device. There are various methods for the component supply device, such as a method using a wafer pallet holding wafer parts, a method using a tray pallet on which relatively large electronic parts are placed, and a feeder method for feeding carrier tape. Parts holders such as wafer pallets, tray pallets, and feeder devices are provided with an identification code for identifying the type of parts to be supplied and an identification code for identifying an individual part holder. A technique for reading this type of identification code is disclosed in Patent Document 1.

The method of collecting data related to electric components in Patent Document 1 includes a step of arranging identification tags (identification codes) in a common direction of a large number of electric component trays and a tray stack in which a plurality of electric component trays are stacked. Includes a step of forming and placing at the distal end and a step of collecting the identification tag associated with the component to be picked from the electrical component tray at the distal end. Further, in the embodiment, a tag reader which is mounted on the front side of the column (accommodation magazine) and reads the identification tag of the tray stack to be pulled out is disclosed. According to this, it is possible to reduce the possibility of component mounting error by continuously checking the arrangement of the electric component tray and warning the operator before the incorrect component is arranged.

Japanese Unexamined Patent Publication No. 2006-11145

By the way, some identification codes have a purpose other than specifying the part type, and there are cases where a plurality of types of identification codes are attached to the part holder. For example, as a plurality of types of identification codes attached to the wafer pallet, there are a manufacturer management code, a component type identification code, and a map acquisition code. The manufacturer management code is an identification code attached by the manufacturer of the wafer component, and does not need to be read by the user. On the other hand, the component type identification code and the map acquisition code are identification codes attached by the user in order to improve the efficiency of using the wafer pallet. The part type identification code is used for the purpose of identifying the part type, and the map acquisition code is used for the purpose of acquiring the wafer map.

On the other hand, in the technique of reading the identification code exemplified in Patent Document 1, the part type cannot be identified simply by reading the identification code to obtain the code information, and generally, the code information is collated with the part type database. Data processing to confirm the part type is required. Here, if a plurality of types of identification codes are attached to the component holder, the code information is read and collated with the database even for irrelevant identification codes having different purposes of use. Therefore, the amount of data processing increases and the data processing time becomes long.

Further, if the positions of the plurality of types of identification codes are erroneously attached in reverse, the attachment positions are scattered, or the plurality of types of identification codes are accidentally similar to each other, the robustness is lowered. That is, there is a risk that the identification code may be mistaken for an incorrect data processing result, or that the purpose of use of each identification code may become unknown and data processing may not be possible.

Therefore, it is an issue to be solved in this specification to reduce the data processing time related to the processing of the identification code as compared with the conventional case and to provide a parts supply method and a parts supply system having excellent robustness.

The present specification includes at least one of a part type identification code for holding a plurality of parts and specifying a part type of the held part and a map acquisition code for specifying a wafer map of the held part. This is a component supply method for selectively acquiring one of the component type and the wafer map of the component to be supplied by using the component holder to which the code is attached, wherein the component type identification code and the component type are used. The first step of storing at least one of the association and the association between the map acquisition code and the wafer map in the database, and the component type identification code for the purpose of acquiring the component type of the held component are used. While receiving the notification of the attribute for selecting, the second step of receiving the notification of the attribute for selecting the map acquisition code for the purpose of acquiring the wafer map of the held part, and the received attribute are used. Then, by filtering a plurality of the codes read from the component holder by one code reading unit, the third step of selecting the code matching the purpose and the selected code are collated with the database. The present invention discloses a component supply method including the fourth step of recognizing the component type or the wafer map.
In addition, the present specification holds a part holding sheet to which a plurality of wafer parts are attached, and specifies a part type identification code for specifying the part type of the held part, and a wafer map of the held part. A plurality of cords including at least one of the map acquisition cords to be mounted are separately attached to a plurality of attachment areas on the upper surface, and a plurality of the wafer component holders are selectively retractably accommodated from the outlet. While positioning the accommodating magazine unit, the transport unit that pulls out any of the wafer component holders in the accommodating magazine unit and conveys the wafer component holder to the component supply position, and the conveyed wafer component holder at the component supply position. , A supply unit that pushes up the component holding sheet to supply the wafer component, and a transfer unit on the upper surface of the wafer component holder that is arranged downward at a position above the outlet of the storage magazine unit and is pulled out by the transfer unit. A code reader capable of reading a plurality of the codes of the plurality of attachment areas arranged in a direction, and a specific attachment area corresponding to a difference in purpose of acquiring the component type or the wafer map. receiving the notification, the control the code reading unit, wherein the code selection use section to only read the code attached to a particular said attached areas, discloses a parts supply system equipped with.
Further, the present specification holds a component holding sheet to which a plurality of wafer parts are attached, and a wafer component holder to which a plurality of types of identification codes having different purposes of use are attached, and a plurality of the wafer component holders. A storage magazine unit for selectively pulling out the wafer from the outlet, a transport unit for pulling out any of the wafer component holders in the storage magazine unit and transporting the wafer component holder to the component supply position, and the storage magazine unit for transporting the wafer component holder to the component supply position. A component supply method for supplying the wafer component using a component supply device having a code reading unit that can read the identification code attached to the wafer component holder that is pulled out when the wafer component holder is pulled out. Therefore, the plurality of identification codes are separately attached to a plurality of attachment areas arranged in the transport direction on the upper surface of the wafer component holder, and the code reading unit is a specific attachment corresponding to the purpose of use. A parts supply method for reading only the identification code attached to the area is disclosed.

In the disclosed parts supply method, a code suitable for the purpose can be selected and used based on the attributes assigned to each of the plurality of codes attached to the parts holder. Therefore, data processing for collating other codes that do not match the purpose with the database becomes unnecessary, and the data processing time can be reduced as compared with the conventional case. In addition, even if the positions of multiple codes are incorrect, the attachment positions are scattered, or multiple codes are accidentally similar to each other, it is possible to reliably select the code that matches the purpose from the difference in attributes. Therefore, it has excellent robustness.
Further, in the disclosed parts supply system and the second parts supply method, the attributes given to the plurality of codes are set as the attachment area of the wafer part holder, and are attached to the specific attachment area corresponding to the purpose. You only have to read the code. According to this, since it is not necessary to select and read the code and read all of the plurality of codes, the effect of reducing the data processing time becomes more remarkable.

It is a side view which shows typically the whole structure of the component mounting machine which incorporated the component supply system of 1st Embodiment. It is a block diagram which shows the control structure of a component mounting machine. It is a perspective view which showed the main part of the wafer component supply apparatus. It is a top view which illustrates structure of a wafer pallet. It is a figure which showed the operation of the component supply system of 1st Embodiment. It is a figure which showed the operation of the parts supply system of the prior art. It is a top view of the wafer pallet explaining the attachment area. It is a figure which showed the operation of the component supply system of 2nd Embodiment.

(1. Configuration of component mounting machine 1 and component supply system of the first embodiment)
The parts supply system according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 5. The component supply system of the first embodiment is incorporated in the component mounting machine 1. First, the overall configuration of the component mounting machine 1 will be described. FIG. 1 is a side view schematically showing an overall configuration of a component mounting machine 1 incorporating the component supply system of the first embodiment. Further, FIG. 2 is a block diagram showing a control configuration of the component mounting machine 1. The component mounting machine 1 is configured by assembling a substrate transfer device 2, a wafer component supply device 3, a component transfer device 5, a component camera 6, a control device 7, and the like on the machine base 9. The right side of FIG. 1 is the front side of the component mounting machine 1, and the left side is the rear side of the component mounting machine 1.

The board transfer device 2 is arranged on the upper surface of the machine base 9. The substrate transfer device 2 includes a pair of guide rails 21, a pair of conveyor belts 22, a backup device 23, a transfer control unit 29, and the like. The pair of endless annular conveyor belts 22 rotate along the guide rail 21 with the substrate K placed on the conveyor transport surface, and carry in and out the substrate K to the mounting implementation position. The backup device 23 arranged below the mounting mounting position positions the substrate K at the mounting mounting position by pushing up the backup pin 24. The transfer control unit 29 controls the operations of the conveyor belt 22 and the backup device 23.

The wafer component supply device 3 supplies the wafer component to the component transfer device 5 by using the wafer pallet 31. FIG. 3 is a perspective view showing a main part of the wafer component supply device 3. The wafer component supply device 3 is conveyed using a carriage (not shown), and is detachably mounted on the front side of the upper surface of the machine base 9. The wafer component supply device 3 is composed of a plurality of wafer pallets 31, a storage magazine unit 32, a transport unit 33, a supply unit 34, a code reading unit 35, a supply control unit 39, and the like.

The storage magazine portion 32 is formed in a substantially vertically long box shape, and a plurality of storage shelves are provided inside so as to be movable up and down. Wafer pallets 31 are stored in each storage shelf. A drawer port 321 is provided at a substantially intermediate height on the rear side of the storage magazine portion 32. The wafer pallet 31 is pulled out from the outlet 321 to the rear side after the height of the storage shelf is adjusted.

The transport unit 33 includes a transport table 331, a transport mechanism 332, and the like. The transport table 331 extends from the vicinity of the drawer port 321 of the accommodating magazine portion 32 to the rear side. The transport mechanism 332 is arranged on the upper surface of the transport table 331 and moves in the front-rear direction. The transport mechanism 332 grips the wafer pallet 31 adjusted to the height of the drawer port 321 of the accommodating magazine portion 32 by the grip portion 333. Next, the transport mechanism 332 transports the gripped wafer pallet 31 to the component supply position shown by the broken line in FIG. Further, the transfer mechanism 332 returns the used wafer pallet 31 to the accommodating magazine unit 32.

The supply unit 34 is arranged below the component supply position. The supply unit 34 pushes up the component holding sheet 313 (also referred to as a dicing sheet) while positioning the conveyed wafer pallet 31 at the component supply position to supply the wafer component. As the supply unit 34, a known configuration having a push-up pot and a push-up pin can be adopted, and the present invention is not limited thereto.

FIG. 4 is a plan view illustrating and explaining the structure of the wafer pallet 31. The wafer pallet 31 is configured such that the outer circumference of the component holding sheet 313 (shown with hatching for convenience in FIG. 4) is held between the lower ring 311 and the upper ring 312. As shown, the outer diameter of the lower ring 311 is larger than the outer diameter of the upper ring 312. Grasped portions 313 and 314 gripped by the gripped portion 333 are formed at two locations on the outer circumference of the lower ring 311. The wafer pallet 31 is conveyed in the vertical direction shown in FIG. A plurality of wafer components produced by dicing a semiconductor wafer are attached to the upper surface of the component holding sheet 313. The wafer pallet 31 is an embodiment of the component holder and the wafer component holder of the present invention.

A manufacturer management barcode 41, which is a first identification code, is attached between the two gripped portions 313 and 314 on the upper surface of the lower ring 311. The manufacturer management barcode 41 is an identification code attached by the manufacturer of the wafer component, and does not need to be read by the user. Further, a component type identification bar code 42, which is a second identification code, is attached at a position close to the manufacturer management bar code 41 on the upper surface of the upper ring 312. The code information meant by the component type identification barcode 42 represents the component type of the wafer component attached to the component holding sheet 313.

Further, a map acquisition barcode 43, which is a third identification code, is attached at a position opposite to the component type identification barcode 42 on the upper surface of the upper ring 312. The code information meant by the map acquisition barcode 43 identifies the wafer map of the wafer component attached to the component holding sheet 313. The wafer map shows a reference part among a plurality of wafer parts arranged two-dimensionally on the part holding sheet 313, and also shows the arrangement position of the unusable wafer parts. The component type identification barcode 42 and the map acquisition barcode 43 are attached by the user of the wafer component supply device 3. As the attachment method, a method of attaching a label on which barcodes 42 and 43 are printed can be exemplified, and the attachment method is not limited to this. The three types of barcodes 41 to 43 are arranged on the center line CL of the wafer pallet 31 along the transport direction for convenience of reading.

An example of the code information of each barcode 41 to 43 is shown below. That is, the code information of the manufacturer management barcode 41 consists of 10 characters, for example, "WOF21_9433". The code information of the component type identification barcode 42 consists of 13 characters, for example, "WID_YUF198312". The first four characters "WID_" of the code information of the component type identification bar code 42 are specific keywords indicating that the purpose of use of the code information is for recognizing the component type. The code information of the map acquisition barcode 43 consists of 14 characters, for example, "1420LFJIWID_Ff". The four characters "LFJI" in the middle of the code information of the map acquisition barcode 43 is a specific keyword indicating that the purpose of using the code information is for acquiring a wafer map. The above-mentioned keywords are examples of attributes assigned to each of a plurality of types of identification codes.

As shown in FIGS. 1 and 3, the code reading unit 35 is arranged downward at a position above the drawer port 321 of the accommodating magazine unit 32. As the code reading unit 35, a separation detection type barcode reader can be used. The code reading unit 35 reads three types of barcodes 41 to 43 attached to the upper surface of the wafer pallet 31 to be pulled out, and acquires code information meaning by each barcode 41 to 43. The code information of each barcode 41 to 43 is notified to the control device 7 via the supply control unit 39.

The readable range R of the code reading unit 35 shown in FIG. 4 is widely set on both sides of the center line CL of the wafer pallet 31. Therefore, even if the barcodes 41 to 43 are attached offset from the center line CL, they can be read by the code reading unit 35. Further, even if the barcodes 41 to 43 are attached so as to be inclined with respect to the center line CL, the code reading unit 35 can read the barcodes.

The supply control unit 39 shown in FIG. 2 controls the operations of the storage magazine unit 32, the transport unit 33, the supply unit 34, and the code reading unit 35.

The component transfer device 5 is arranged from above the substrate transfer device 2 to above the wafer component supply device 3. The component transfer device 5 includes a mounting nozzle 51, a mounting head 52, a head drive mechanism 54, a transfer control unit 59, and the like. The mounting nozzle 51 moves up and down to collect wafer components from the wafer component supply device 3 and mounts the wafer components on the substrate K. The mounting head 52 holds the mounting nozzle 51 so as to be able to move up and down, and is driven in two horizontal directions by the head driving mechanism 54. The transfer control unit 59 controls the operations of the mounting nozzle 51 and the head drive mechanism 54.

The component camera 6 is provided upward between the substrate transfer device 2 on the upper surface of the machine base 9 and the wafer component supply device 3. The component camera 6 captures and detects the state of the wafer component collected at the lower end of the mounting nozzle 51 while the mounting head 52 is moving from the wafer component supply device 3 to the substrate K. When the component camera 6 detects an error in the suction position of the wafer component, a deviation in the rotation angle, or the like, the control device 7 fine-tunes the component mounting operation as necessary. The operation of the component camera 6 is controlled by the camera control unit 69.

The control device 7 is a computer device having a CPU and operating by software. As shown in FIG. 2, the control device 7 is communicatively connected to the transfer control unit 29, the supply control unit 39, the transfer control unit 59, and the camera control unit 69. The control device 7 issues commands while appropriately exchanging information with these control units 29, 39, 59, and 69 to control the overall operation of the component mounting machine 1.

Further, the control device 7 is communicatively connected to the host computer 8 arranged away from the component mounting machine 1. The host computer 8 is a higher-level control device that controls not only the component mounting machine 1 but also the board production equipment on the upstream side and the downstream side of the component mounting machine 1. The host computer 8 has a component type database 82 and a map database 83 in the storage device 81. The component type database 82 stores the code information of the barcode 42 for identifying the component type and the component type of the wafer component in association with each other. The map database 83 stores the code information of the map acquisition barcode 43 and the wafer map unique to each wafer pallet 31 in association with each other.

The supply control unit 39 of the wafer component supply device 3 has a function corresponding to the code selection and use unit 36 of the present invention. Further, the code selection and use unit 36 includes a function corresponding to the keyword selection unit 37 of the present invention. The code selection and use unit 36 and the keyword selection unit 37 are realized by software. The code selection and use unit 36 and the keyword selection unit 37 exchange information with the control device 7 as needed. The detailed functions and operations of the code selection unit 36 and the keyword selection unit 37 will be described later.

The parts supply system of the first embodiment is configured by including the wafer parts supply device 3 as hardware and the code selection and use unit 36 and the keyword selection unit 37 of the supply control unit 39 as software.

(2. Operation of the parts supply system of the first embodiment)
Next, the operation of the parts supply system of the first embodiment will be described in comparison with the prior art. FIG. 5 is a diagram showing the operation of the parts supply system of the first embodiment. Further, FIG. 6 is a diagram showing the operation of the parts supply system of the prior art. On the left side of FIG. 5, the operation of the supply control unit 39 is shown in chronological order from top to bottom. Similarly, the operation of the control device 7 is shown in the center of FIG. 5, and the operation of the host computer 8 is shown on the right side of FIG. Further, the arrows in the horizontal direction represent information notifications and commands between the supply control unit 39 and the control device 7, and between the control device 7 and the host computer 8.

In step S1 of FIG. 5, the host computer 8 notifies the control device 7 of a specific keyword corresponding to the desired intended use. In the example of FIG. 5, the desired purpose of use is to identify the component type of the wafer component, and "WID_ *" is notified as a keyword. The "*" added to the initial keyword indicates a wildcard, and indicates that any character string may be concatenated after the "WID_". In the next step S2, the control device 7 transfers the notified keyword to the supply control unit 39. In the next step S3, the code selection and use unit 36 of the supply control unit 39 stores the notified keyword.

In the next step S4, the control device 7 issues a command to bring the wafer pallet 31 to the component supply position and a command to read the respective barcodes 41 to 43 to the supply control unit 39. In the next step S5, the supply control unit 39 controls the transport unit 33 to pull out the wafer pallet 31. At the same time, the code selection and use unit 36 controls the code reading unit 35 to read each barcode 41 to 43 from the wafer pallet 31. The read code information is "WOF21_9433", "WID_YUF198312", and "1420LFJIWID_Ff".

In the next step S6, the keyword selection unit 37 in the code selection use unit 36 filters three code information using the keyword “WID_ *”. As a result of filtering, only one code information "WID_YUF198312" corresponding to the keyword "WID_ *" is selected. The code information "1420LFJIWID_Ff" includes "WID_", but it is not selected because it is included in the middle instead of the beginning. In the next step S7, the code selection and use unit 36 notifies the control device 7 of only the selected code information “WID_YUF198312”.

In the next step S8, the control device 7 transfers the notified code information "WID_YUF198312" to the host computer 8. In the next step S9, the host computer 8 collates the transferred code information "WID_YUF198312" with the component type database 82 to identify the component type of the wafer component. In the next step S10, the host computer 8 notifies the control device 7 of the information of the component type acquired by the collation. As a result, the control device 7 can recognize the component type of the wafer component supplied from the wafer component supply device 3.

When the desired purpose of use is the acquisition of a wafer map, the operation of the component supply system of the first embodiment changes as follows. That is, in step S1 and step S2, "* LFJI *" is notified and transferred as a keyword. The two "*" added to the original keyword "LFJI" indicate a wildcard, indicating that any character string may be concatenated before and after "LFJI". In step S6, the keyword selection unit 37 filters the three code information using the keyword “* LFJI *”. In step S7, only one code information "1420LFJIWID_Ff" corresponding to the keyword "* LFJI *" is notified to the control device 7.

In step S9, the host computer 8 searches the map database 83 using one transferred code information “1420LFJIWID_Ff” and acquires a wafer map. In step S10, the host computer 8 notifies the control device 7 of the wafer map information acquired by the search. As a result, the control device 7 can recognize the wafer map regarding the wafer component on the component holding sheet 313.

In the modified mode of the first embodiment, the code length can be used instead of the keyword as the attribute given to each of the plurality of types of identification codes. The code length means the number of characters in the code information. The code selection and use unit 36 includes a code length selection unit 38 that replaces the keyword selection unit 37. The code length selection unit 38 filters a plurality of types of code information using a specific code length corresponding to a desired purpose of use, and selects code information having a specific code length.

In the modified mode, in step S1, the host computer 8 notifies the information of "13 characters" or "14 characters" instead of the keywords "WID_ *" or "* LFJI *". Then, in step S2, the information "13 characters" or "14 characters" is transferred to the code length selection unit 38. As a result, the code length selection unit 38 can select the same one code information as the keyword selection unit 37 based on the difference in the number of characters.

On the other hand, in the prior art, the code selection and use unit 36 is not provided, and filtering by keywords and code length is not performed. In step S31 of FIG. 6 showing the prior art, the control device 7 issues a command to bring the wafer pallet 31 to the component supply position and a command to read the respective barcodes 41 to 43 to the supply control unit 39. In the next step S32, the supply control unit 39 controls the transport unit 33 and the code reading unit 35 to read each barcode 41 to 43 from the drawn wafer pallet 31. In the next step S33, the supply control unit 39 notifies the control device 7 of the three read code information “WOF21_9433”, “WID_YUF198312”, and “1420LFJIWID_Ff”.

In the next step S34, the control device 7 notifies the host computer 8 of all the read code information. In the next step S35, the host computer 8 collates all the code information with the component type database 82 to identify the component type of the wafer component. In the next step S36, the host computer 8 notifies the control device 7 of the information of the component type acquired by the collation.

In contrast to the point of collating all the code information with the part type database 82 in step S35 of the prior art, in step S9 of the first embodiment, only one code information needs to be collated with the part type database 82. Therefore, according to the first embodiment, the data processing time required for the collation operation can be reduced as compared with the conventional technique. Further, in contrast to the point of notifying all the read code information in steps S33 and S34 of the prior art, in steps S7 and S8 of the first embodiment, only one code information needs to be notified and transferred. .. Therefore, according to the first embodiment, the data communication time required for notification and transfer of code information can be reduced as compared with the prior art.

(3. Aspects and effects of the parts supply system of the first embodiment)
The parts supply system of the first embodiment holds a plurality of parts and has a plurality of types of identification codes for different purposes (manufacturer management barcode 41, component type identification barcode 42, map acquisition barcode 43). It is a parts supply system that supplies parts by using the parts holder (wafer pallet 31) attached with, and is based on the attributes given to each of a plurality of types of identification codes and different for each purpose of use. The code selection and use unit 36 for selecting and using an identification code that matches the desired purpose of use is provided.

In the parts supply system of the first embodiment, the code selection and use unit 36 selects an identification code that matches the desired purpose of use based on the attributes assigned to each of the plurality of types of identification codes attached to the parts holder. To use. Therefore, data processing for collating other identification codes that do not match the purpose of use with the databases (part type database 82, map database 83) becomes unnecessary, and the data processing time can be reduced as compared with the conventional case. In addition, even if the positions of multiple types of identification codes are incorrect, the attachment positions are scattered, or the multiple types of identification codes are accidentally similar to each other, the identification that matches the purpose of use due to the difference in attributes Since the code can be selected reliably, it is excellent in robustness.

In addition, the supply control unit 39, the control device 7, and the host computer 8 are connected by communication to notify all the code information read by the prior art, whereas in the first embodiment, the selection is made. Changed to notify only one code information. Therefore, the data communication time required for notification and transfer of code information can be reduced as compared with the prior art.

Further, in the parts supply system of the first embodiment, the attributes are a plurality of types meaning by a plurality of types of identification codes (manufacturer management barcode 41, component type identification barcode 42, map acquisition barcode 43). It is a keyword (“WID_”, “LFJI”) incorporated in a part of the code information, and the code selection and use unit 36 filters a plurality of types of code information using a specific keyword corresponding to the desired purpose of use. , Includes a keyword selection unit 37 that selects code information in which a specific keyword is incorporated. According to this, by using the keyword, it is possible to surely select the identification code that matches the desired purpose of use.

Further, in the modified mode of the parts supply system of the first embodiment, the attributes mean a plurality of types of identification codes (manufacturer management barcode 41, component type identification barcode 42, map acquisition barcode 43), respectively. It is the code length (the number of characters of the code information) possessed by the plurality of types of code information, and the code selection and use unit 36 filters the plurality of types of code information using the specific code length corresponding to the desired purpose of use. , Includes a code length selection unit 38 that selects code information having a specific code length. According to this, by using the code length, it is possible to surely select the identification code that matches the desired purpose of use.

Further, the component holder holds the component holding sheet 313 to which the wafer component is attached, and has a plurality of types of identification codes (manufacturer management bar code 41, part type identification bar code 42, map acquisition bar code 43). ) Is a wafer component holder (wafer pallet 31) attached to the upper surface, and the component supply system of the first embodiment accommodates a plurality of wafer component holders so that they can be selectively pulled out from the outlet 321. Parts holding while positioning the transfer unit 33, which pulls out one of the wafer component holders in the unit 32 and the accommodating magazine unit 32 and conveys the wafer component holder to the component supply position, and the transferred wafer component holder at the component supply position. The identification code attached to the upper surface of the wafer component holder, which is arranged downward above the supply unit 34 that pushes up the sheet 313 to supply the wafer component and the outlet 321 of the accommodating magazine section 32, is read. A code reading unit 35 for acquiring code information meaning by the identification code is further provided.

The component supply system of the first embodiment is configured in the component mounting machine 1 equipped with the wafer component supply device 3, and the effect of reducing the data processing time as compared with the conventional one and the effect of being excellent in robustness become remarkable. ..

(4. Parts supply system of the second embodiment)
Next, the parts supply system of the second embodiment will be mainly described as being different from the first embodiment. In the second embodiment, the overall configuration itself of the component mounting machine 1 is the same as that in the first embodiment, and the code selection and use unit 36 replaces the keyword selection unit 37 and the code length selection unit 38 with the attachment area selection unit. including. The attached area selection unit selects an identification code attached to a specific attached area corresponding to a desired purpose of use. The detailed functions and operations of the attached area selection unit will be described later.

In the second embodiment, the attachment area of the wafer pallet 31 to which the identification code is attached is used as an attribute assigned to each of the plurality of types of identification codes. FIG. 7 is a plan view of the wafer pallet 31 for explaining the attachment area. As shown, the length of the upper ring 312 in the transport direction is divided into three equal parts, and the front area AF, the central area AM, and the rear area AR are set. The manufacturer management barcode 41 is not attached to the three areas AF, AM, and AR. The component type identification barcode 42 is attached to the front area AF, and the map identification barcode 423 is attached to the rear area AR.

Here, the supply control unit 39 controls both the transport unit 33 and the code reading unit 35. Therefore, when the wafer pallet 31 is pulled out by the transport unit 33, the supply control unit 39 can always grasp the area in which the field of view of the code reading unit 35 is facing.

Next, the operation of the parts supply system of the second embodiment will be described. FIG. 8 is a diagram showing the operation of the component supply system of the second embodiment. In step S11 of FIG. 8, the host computer 8 notifies the control device 7 of a specific attachment area corresponding to the desired intended use. In the example of FIG. 8, the desired purpose of use is to identify the component type of the wafer component, and the front area AF is notified as a specific attachment area. In the next step S12, the control device 7 issues a command to the supply control unit 39 to carry the wafer pallet 31 into the component supply position. At the same time, the control device 7 issues a command to read the barcode attached to the front area AF to the attached area selection unit.

In the next step S13, the supply control unit 39 controls the transport unit 33 to pull out the wafer pallet 31. At the same time, the attachment area selection unit controls the code reading unit 35 to read the component type identification barcode 42 attached to the front area AF of the wafer pallet 31. In the next step S14, the code selection / use unit 36 notifies the control device 7 of one read code information “WID_YUF198312”. In the next step S15, the control device 7 transfers the code information "WID_YUF198312" to the host computer 8. In the next step S16, the host computer 8 collates the transferred code information "WID_YUF198312" with the component type database 82 to identify the component type of the wafer component. In the next step S17, the host computer 8 notifies the control device 7 of the information of the component type acquired by the collation. As a result, the control device 7 can recognize the component type of the wafer component supplied from the wafer component supply device 3.

When the desired purpose of use is the acquisition of a wafer map, the operation of the component supply system of the second embodiment changes as follows. That is, in step S11, the host computer 8 notifies the rear area AR as a specific attached area. Then, in step S12, the information of the rear area AR is transferred to the attached area selection unit. As a result, in step S13, the attachment area selection unit reads the map identification barcode 43 attached to the rear area AR of the wafer pallet 31. In the subsequent steps, only the code information "1420LFJIWID_Ff" of the map identification barcode 43 is the target of data processing.

In the component supply system of the second embodiment, the attributes assigned to each of the plurality of types of identification codes are the attachment areas (front area AF, central area AM, rear area AR) of the wafer pallet 31, and the code selection and use unit 36. Includes an attached area selection unit that selects an identification code attached to a specific attached area corresponding to a desired purpose of use. According to this, since it is not necessary to select and read the identification code and read all of the plurality of types of identification codes, the effect of reducing the data processing time becomes more remarkable.

(5. Application and modification of the embodiment)
The present invention can also be applied to component holders other than the wafer pallet 31 described in the embodiment, for example, a tray pallet or a feeder device to which a plurality of types of identification codes are attached. Further, in the first embodiment and its modification, the code selection and use unit 36, the keyword selection unit 37, and the code length selection unit 38 can be realized by the software of the control device 7. Further, an attached area narrower than the three areas AF, AM, and AR described in the second embodiment may be set, or an area setting method using a coordinate system on the wafer pallet 31 may be adopted. The present invention can be applied and modified in various other ways.

1: Parts mounting machine 2: Substrate transfer device 3: Wafer parts supply device 31: Wafer pallet (part holder, wafer part holder)
311: Lower ring 312: Upper ring 313: Parts holding sheet 32: Storage magazine section 321: Drawer port 33: Transport section 34: Supply section 35: Code reading section 36: Code selection and use section 37: Keyword selection section 38: Code Length selection unit 39: Supply control unit 41: Manufacturer management barcode (identification code)
42: Bar code for component type identification (identification code)
43: Map acquisition barcode (identification code)
5: Parts transfer device 6: Parts camera 7: Control device 8: Host computer 82: Parts type database 83: Map database

Claims (5)

A plurality of codes are attached, including at least one of a part type identification code for specifying the part type of the held part and a map acquisition code for specifying the wafer map of the held part while holding a plurality of parts. This is a component supply method for selectively acquiring one of the component type and the wafer map of the component to be supplied by using the component holder.
The first step of storing at least one of the association between the component type identification code and the component type and the association between the map acquisition code and the wafer map in the database.
For the purpose of acquiring the part type of the held part, the notification of the attribute for selecting the part type identification code is received, while for the purpose of acquiring the wafer map of the held part, the map acquisition code is used. The second step of accepting notification of attributes to select,
A third step of selecting the code that matches the purpose by filtering a plurality of the codes read by one code reading unit from the component holder using the received attributes.
The fourth step of collating the selected code with the database to recognize the part type or the wafer map, and
Parts supply method equipped with. The attribute is a keyword incorporated in a part of a plurality of code information that each of the plurality of codes means.
In the third step, a plurality of the code information is filtered using the specific keyword corresponding to the purpose, and the code information incorporating the specific keyword is selected.
The parts supply method according to claim 1. Wherein the attribute is a code length which has a plurality of code information in which a plurality of pre-Kiko over de means respectively,
In the third step, a plurality of the code information is filtered using the specific code length corresponding to the purpose, and the code information having the specific code length is selected.
The parts supply method according to claim 1. At least a part type identification code that identifies the part type of the held part and a map acquisition code that specifies the wafer map of the held part while holding the part holding sheet to which a plurality of wafer parts are attached. Wafer component holders with multiple cords, including one, separately attached to multiple attachment areas on the top surface,
A storage magazine unit for accommodating a plurality of the wafer component holders so that they can be selectively pulled out from the drawer port,
A transport unit that pulls out any of the wafer component holders in the accommodating magazine unit and transports the wafer component holder to the component supply position.
A supply unit that pushes up the component holding sheet to supply the wafer component while positioning the conveyed wafer component holder at the component supply position.
A code that is arranged downward at a position above the drawer port of the storage magazine section and can read a plurality of the codes of the plurality of attachment areas arranged in the transport direction on the upper surface of the wafer component holder drawn by the transport section. With the reader
It receives notification of the specific attachment area corresponding to the difference in purpose of acquiring the part type or the wafer map, controls the code reading unit, and is attached to the specific attachment area. A code selection and use unit that reads only the above code,
Parts supply system equipped with. A wafer component holder that holds a component holding sheet to which multiple wafer components are attached and has multiple types of identification codes for different purposes.
A storage magazine unit for accommodating a plurality of the wafer component holders so that they can be selectively pulled out from the drawer port,
A transport unit that pulls out any of the wafer component holders in the accommodating magazine unit and transports the wafer component holder to the component supply position.
When the wafer component holder is pulled out from the accommodating magazine, the wafer component is pulled out by using a component supply device having a code reading unit capable of reading the identification code attached to the drawn wafer component holder. It is a parts supply method to supply
The plurality of identification codes are separately attached to a plurality of attachment areas arranged in the transport direction on the upper surface of the wafer component holder.
The code reading unit reads only the identification code attached to the specific attachment area corresponding to the purpose of use.
Parts supply method.

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