JP6789031B2 - Heat dissipation structure - Google Patents
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- JP6789031B2 JP6789031B2 JP2016157541A JP2016157541A JP6789031B2 JP 6789031 B2 JP6789031 B2 JP 6789031B2 JP 2016157541 A JP2016157541 A JP 2016157541A JP 2016157541 A JP2016157541 A JP 2016157541A JP 6789031 B2 JP6789031 B2 JP 6789031B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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Description
本発明は、放熱構造に関する。 The present invention relates to a heat dissipation structure.
電子基板に実装された電子部品は、電子部品の動作時に発熱することがある。そこで、電子部品の熱を放熱する放熱構造が提案されている（例えば、特許文献１参照）。 The electronic components mounted on the electronic board may generate heat during the operation of the electronic components. Therefore, a heat dissipation structure that dissipates heat from electronic components has been proposed (see, for example, Patent Document 1).
特許文献１には、電子基板の一方の面に電子部品を実装し、電子基板の他方の面に冷却器を当接させる放熱構造が示されている。この放熱構造では、電子部品の熱を、電子基板を介して冷却器に伝達させて、電子部品の熱を放熱させる。 Patent Document 1 discloses a heat dissipation structure in which an electronic component is mounted on one surface of an electronic substrate and a cooler is brought into contact with the other surface of the electronic substrate. In this heat dissipation structure, the heat of the electronic component is transferred to the cooler via the electronic substrate to dissipate the heat of the electronic component.
上述のような電子部品の熱を放熱する放熱構造において、放熱効率の向上が求められている。そこで、例えば図３に示す電子機器１００のように、電子部品の熱を、冷却器といった放熱部に、電子基板を介することなく伝達させる放熱構造が考えられる。
なお、以下に示す各図には、説明と理解を容易にするために、図中にＸＹＺ直交座標系を設けたが、これらは単に図中の向きを統一して説明するために設定したものであり、絶対的な座標を示すものではない。
In the heat dissipation structure that dissipates heat from electronic components as described above, improvement in heat dissipation efficiency is required. Therefore, for example, as in the electronic device 100 shown in FIG. 3, a heat radiating structure is conceivable in which the heat of the electronic component is transferred to a heat radiating portion such as a cooler without using an electronic substrate.
In addition, in each of the figures shown below, an XYZ Cartesian coordinate system is provided in the figure for easy explanation and understanding, but these are set only for the purpose of unifying the orientation in the figure. It does not indicate the absolute coordinates.
電子機器１００は、電子部品１０、電子基板２０、ヒートシンク３０、半田部４０、放熱グリス５０、および固定部６０を備える。 The electronic device 100 includes an electronic component 10, an electronic substrate 20, a heat sink 30, a solder portion 40, a thermal paste 50, and a fixing portion 60.
電子部品１０は、電子基板２０の一方の面（Ｙマイナス方向側の面）に実装される。具体的には、電子部品１０は、電子基板２０の一方の面側に設けられ、電子部品１０には、図示しない複数の電極が電子基板２０側に設けられており、これら電極が、半田部４０により電子基板２０に固着される。 The electronic component 10 is mounted on one surface (the surface on the Y-minus direction side) of the electronic substrate 20. Specifically, the electronic component 10 is provided on one surface side of the electronic substrate 20, and the electronic component 10 is provided with a plurality of electrodes (not shown) on the electronic substrate 20 side, and these electrodes are soldered portions. 40 is fixed to the electronic substrate 20.
ヒートシンク３０は、電子基板２０の一方の面側に、電子部品１０との間に間隔を空けて設けられており、ヒートシンク３０と電子部品１０との間には、放熱グリス５０が設けられる。 The heat sink 30 is provided on one surface side of the electronic substrate 20 with a space between the heat sink 30 and the electronic component 10, and a thermal paste 50 is provided between the heat sink 30 and the electronic component 10.
固定部６０は、ヒートシンク３０に立設する脚部６１と、雄ねじ６２と、を備える。脚部６１の先端は、電子基板２０の一方の面に当接する。また、脚部６１の先端部分には、雌ねじが形成され、電子基板２０には、雄ねじ６２が挿通される貫通孔が形成される。脚部６１に形成された雌ねじと、電子基板２０の貫通孔に挿通された雄ねじ６２と、が螺着することで、電子基板２０とヒートシンク３０とが締結される。 The fixing portion 60 includes a leg portion 61 standing upright on the heat sink 30 and a male screw 62. The tip of the leg 61 abuts on one surface of the electronic substrate 20. Further, a female screw is formed at the tip portion of the leg portion 61, and a through hole through which the male screw 62 is inserted is formed in the electronic substrate 20. The electronic substrate 20 and the heat sink 30 are fastened by screwing the female screw formed on the leg portion 61 and the male screw 62 inserted into the through hole of the electronic substrate 20.
以上の電子機器１００では、電子部品１０の熱は、電子基板２０を介してではなく、放熱グリス５０を介してヒートシンク３０に伝達される。 In the above electronic device 100, the heat of the electronic component 10 is transferred to the heat sink 30 not through the electronic substrate 20 but through the thermal paste 50.
しかし、電子機器１００の各構成には、公差が存在する。
例えば図４に示すように、脚部６１には、長さ方向（Ｙ方向）に基準寸法Ａに対する公差（±α）が存在する。
また、図５に示すように、電子部品１０には、厚さ方向（Ｙ方向）に基準寸法Ｂに対する公差（±β）が存在し、半田部４０には、厚さ方向（Ｙ方向）に基準寸法Ｃに対する公差（±γ）が存在する。
また、図６に示すように、電子基板２０には、厚さ方向（Ｙ方向）に反り公差（±δ）が存在する。
However, there are tolerances in each configuration of the electronic device 100.
For example, as shown in FIG. 4, the leg portion 61 has a tolerance (± α) with respect to the reference dimension A in the length direction (Y direction).
Further, as shown in FIG. 5, the electronic component 10 has a tolerance (± β) with respect to the reference dimension B in the thickness direction (Y direction), and the solder portion 40 has a tolerance (± β) in the thickness direction (Y direction). There is a tolerance (± γ) with respect to the reference dimension C.
Further, as shown in FIG. 6, the electronic substrate 20 has a warp tolerance (± δ) in the thickness direction (Y direction).
放熱効率を向上させるには、放熱グリス５０の高さをできるだけ低く抑えることが好ましい。しかしながら、製造バラツキにより、脚部６１の仕上がり寸法がマイナス公差に振れて短くなり、一方で、半田部４０および電子部品１０の厚みがプラス公差に振れて長くなると、脚部６１に形成された雌ねじに電子基板２０の貫通孔に挿通された雄ねじ６２を螺着させた場合に、電子部品１０とヒートシンク３０とが接触してしまうおそれがある。
電子部品１０とヒートシンク３０とが接触してしまうと、電子部品１０や、電子部品１０の電極に外力が加わってしまい、これらが破損してしまうおそれがある。
また、電子部品１０の熱の放熱効率をさらに向上させるために、電子部品１０の上面（Ｙマイナス方向側の面）に放熱電極を設ける場合がある。この場合において、電子部品１０とヒートシンク３０とが接触してしまうと、電子部品１０とヒートシンク３０とが電気的に短絡してしまう。
In order to improve the heat dissipation efficiency, it is preferable to keep the height of the thermal paste 50 as low as possible. However, due to manufacturing variations, the finished dimensions of the leg 61 swing to a negative tolerance and become shorter, while the thickness of the solder portion 40 and the electronic component 10 swings to a positive tolerance and become longer, the female screw formed on the leg 61. When the male screw 62 inserted into the through hole of the electronic substrate 20 is screwed into the electronic component 10, the electronic component 10 and the heat sink 30 may come into contact with each other.
If the electronic component 10 and the heat sink 30 come into contact with each other, an external force is applied to the electronic component 10 and the electrodes of the electronic component 10, and these may be damaged.
Further, in order to further improve the heat dissipation efficiency of the electronic component 10, a heat dissipation electrode may be provided on the upper surface (the surface on the Y minus direction side) of the electronic component 10. In this case, if the electronic component 10 and the heat sink 30 come into contact with each other, the electronic component 10 and the heat sink 30 are electrically short-circuited.
このため、電子部品１０とヒートシンク３０との間に間隙が確実に形成されるように、上述のような公差を考慮しつつ電子機器１００を設計する必要がある。しかし、上述の間隙を確実に形成しようとすると、電子機器１００の設計時に、上述の間隙を大きめに設計することになる。その結果、放熱グリス５０が厚くなってしまい、電子部品１０の熱の放熱効率を十分には向上させることができないおそれがあった。 Therefore, it is necessary to design the electronic device 100 in consideration of the above-mentioned tolerance so that a gap is surely formed between the electronic component 10 and the heat sink 30. However, in order to surely form the above-mentioned gap, the above-mentioned gap is designed to be large when designing the electronic device 100. As a result, the heat radiating grease 50 becomes thick, and there is a possibility that the heat radiating efficiency of the electronic component 10 cannot be sufficiently improved.
そこで、本発明は、上述の課題に鑑みてなされたものであり、電子部品の熱の放熱効率を十分に向上させる放熱構造を提供する。 Therefore, the present invention has been made in view of the above-mentioned problems, and provides a heat dissipation structure that sufficiently improves the heat dissipation efficiency of electronic components.
本発明の１またはそれ以上の実施形態は、電子基板の一方の面に実装された電子部品の熱を放熱する放熱構造であって、前記電子基板の一方の面側に、前記電子部品との間に間隔を空けて設けられた放熱部と、前記電子部品と前記放熱部との間に設けられた熱伝導部と、前記電子基板および前記放熱部の少なくともいずれかに対して、前記電子基板と前記放熱部との間隔を狭める方向に外力を印加する外力印加部と、を備えることを特徴とする。 One or more embodiments of the present invention is a heat dissipation structure that dissipates heat of an electronic component mounted on one surface of an electronic substrate, and the electronic component is placed on one surface side of the electronic substrate. The electronic substrate is provided with respect to at least one of a heat radiating portion provided at intervals, a heat conductive portion provided between the electronic component and the radiating portion, and the electronic substrate and the radiating portion. It is characterized by including an external force applying portion for applying an external force in a direction of narrowing the distance between the heat radiating portion and the heat radiating portion.
本発明の１またはそれ以上の実施形態によれば、電子部品の熱の放熱効率を十分に向上させることができる。 According to one or more embodiments of the present invention, the heat dissipation efficiency of electronic components can be sufficiently improved.
以下、本発明の実施の形態について図面を参照しながら説明する。なお、以下の実施形態における構成要素は適宜、既存の構成要素などとの置き換えが可能であり、また、他の既存の構成要素との組み合わせを含む様々なバリエーションが可能である。このため、以下の実施形態の記載をもって、特許請求の範囲に記載された発明の内容を限定するものではない。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. The components in the following embodiments can be appropriately replaced with existing components and the like, and various variations including combinations with other existing components are possible. Therefore, the description of the following embodiments does not limit the content of the invention described in the claims.
＜第１実施形態＞
図１を用いて、本発明の第１実施形態について説明する。
<First Embodiment>
The first embodiment of the present invention will be described with reference to FIG.
図１は、本発明による放熱構造を用いた電子機器１を示す側面図である。電子機器１は、図３に示した従来例に係る電子機器１００とは、外力印加部７０および絶縁部材８０を備える点で異なっており、他の部分については同様の形態をしている。このため、電子機器１００と同様の形態をしている部分については、同一の符号を付して、その説明を省略する。 FIG. 1 is a side view showing an electronic device 1 using the heat dissipation structure according to the present invention. The electronic device 1 is different from the electronic device 100 according to the conventional example shown in FIG. 3 in that it includes an external force applying portion 70 and an insulating member 80, and other portions have the same form. Therefore, the parts having the same shape as the electronic device 100 are designated by the same reference numerals, and the description thereof will be omitted.
外力印加部７０は、電子基板２０に対して、電子基板２０と放熱部としてのヒートシンク３０との間隔を狭める方向に外力を印加する。この外力印加部７０は、板状部材としての樹脂板７１と、弾性部材としてのばね７２と、締結部材としての雄ねじ６２と、を備える。 The external force applying unit 70 applies an external force to the electronic substrate 20 in a direction that narrows the distance between the electronic substrate 20 and the heat sink 30 as a heat radiating portion. The external force applying portion 70 includes a resin plate 71 as a plate-shaped member, a spring 72 as an elastic member, and a male screw 62 as a fastening member.
樹脂板７１は、樹脂で形成されており、電子基板２０の他方の面（Ｙプラス方向側の面）側に設けられる。この樹脂板７１は、板状の基部７１１と、基部７１１から電子基板２０側に突出する突出部７１２と、を備える。基部７１１の端部には、雄ねじ６２を挿通する貫通孔が形成されている。突出部７１２は、基部７１１のうち、電子部品１０と対向する領域に形成され、電子基板２０の他方の面のうち、電子部品１０が実装されている領域と対向する領域に当接する。 The resin plate 71 is made of resin and is provided on the other surface (the surface on the Y plus direction side) side of the electronic substrate 20. The resin plate 71 includes a plate-shaped base portion 711 and a projecting portion 712 protruding from the base portion 711 toward the electronic substrate 20. A through hole through which the male screw 62 is inserted is formed at the end of the base portion 711. The protruding portion 712 is formed in a region of the base portion 711 facing the electronic component 10, and abuts on the other surface of the electronic substrate 20 facing a region facing the region on which the electronic component 10 is mounted.
ばね７２は、雄ねじ６２により、樹脂板７１に向かって押し付けられて圧縮され、雄ねじ６２の圧縮力とばね７２の反発力が均衡状態をなして、その状態を保持する。このため、樹脂板７１は、ばね７２によりヒートシンク３０に向かって押圧され、樹脂板７１の突出部７１２によって、電子基板２０のうち電子部品１０を実装している領域が、電子基板２０の他方の面側からヒートシンク３０に向かって押圧される。 The spring 72 is pressed against the resin plate 71 by the male screw 62 and compressed, and the compressive force of the male screw 62 and the repulsive force of the spring 72 are in equilibrium to maintain that state. Therefore, the resin plate 71 is pressed toward the heat sink 30 by the spring 72, and the region of the electronic substrate 20 on which the electronic component 10 is mounted is the other portion of the electronic substrate 20 due to the protruding portion 712 of the resin plate 71. It is pressed from the surface side toward the heat sink 30.
絶縁部材８０は、熱伝導部としての放熱グリス５０に含まれる。この絶縁部材８０は、絶縁性を有する材料であって、外力印加部７０により上述のように外力が印加されても電子部品１０とヒートシンク３０と間で形状を保持する強度を有する材料で構成され、本実施形態では球状のガラスビーズで構成される。 The insulating member 80 is included in the thermal paste 50 as a heat conductive portion. The insulating member 80 is made of a material having an insulating property and having a strength of maintaining a shape between the electronic component 10 and the heat sink 30 even when an external force is applied by the external force applying portion 70 as described above. , In this embodiment, it is composed of spherical glass beads.
以上のように、電子機器１は、外力印加部７０により、電子基板２０に対して、電子基板２０とヒートシンク３０との間隔を狭める方向に外力を印加する。
このため、脚部６１の長さ方向（Ｙ方向）における公差（図４参照）や、電子部品１０の厚さ方向（Ｙ方向）における公差（図５参照）や、半田部４０の厚さ方向（Ｙ方向）における公差（図５参照）や、電子基板２０の厚さ方向（Ｙ方向）における反り公差（図６参照）が存在していても、電子基板２０とヒートシンク３０との間隔を狭くすることができる。したがって、放熱グリス５０を薄くすることができ、電子部品１０の熱の放熱効率を十分に向上させることができる。
As described above, the electronic device 1 applies an external force to the electronic substrate 20 in the direction of narrowing the distance between the electronic substrate 20 and the heat sink 30 by the external force applying unit 70.
Therefore, the tolerance in the length direction (Y direction) of the leg portion 61 (see FIG. 4), the tolerance in the thickness direction (Y direction) of the electronic component 10 (see FIG. 5), and the thickness direction of the solder portion 40. Even if there is a tolerance (see FIG. 5) in the (Y direction) and a warp tolerance (see FIG. 6) in the thickness direction (Y direction) of the electronic substrate 20, the distance between the electronic substrate 20 and the heat sink 30 is narrowed. can do. Therefore, the heat radiating grease 50 can be made thin, and the heat radiating efficiency of the electronic component 10 can be sufficiently improved.
また、電子機器１は、樹脂板７１をばね７２によりヒートシンク３０に向かって押圧して、突出部７１２によって、電子基板２０のうち電子部品１０が実装されている領域を、電子基板２０の他方の面側からヒートシンク３０に向かって押圧する。
このため、電子基板２０とヒートシンク３０との間隔を、電子部品１０が実装されている領域において、特に狭くすることができる。これにより、放熱グリス５０の厚みを結果的に薄くすることができ、電子部品１０の熱の放熱効率を十分に向上させることができる。
また、電子基板２０の厚さ方向に電子基板２０が反っていても、この反りを矯正することができる。
Further, the electronic device 1 presses the resin plate 71 toward the heat sink 30 by the spring 72, and the protruding portion 712 reduces the region of the electronic substrate 20 on which the electronic component 10 is mounted to the other of the electronic substrate 20. Press from the surface side toward the heat sink 30.
Therefore, the distance between the electronic substrate 20 and the heat sink 30 can be narrowed particularly in the region where the electronic component 10 is mounted. As a result, the thickness of the heat radiating grease 50 can be reduced as a result, and the heat radiating efficiency of the electronic component 10 can be sufficiently improved.
Further, even if the electronic substrate 20 is warped in the thickness direction of the electronic substrate 20, this warpage can be corrected.
また、電子機器１は、放熱グリス５０に絶縁部材８０を含む。このため、電子部品１０とヒートシンク３０との間には、絶縁部材８０が存在することになる。したがって、電子基板２０に対して、電子基板２０とヒートシンク３０との間隔を狭める方向に外力を印加しても、電子基板２０とヒートシンク３０との間隔は、絶縁部材８０により確保される。これにより、放熱グリス５０の厚みを薄くしつつ、電子部品１０の熱の放熱効率を十分に向上させ、かつ、電子部品１０とヒートシンク３０とが電気的に短絡してしまうのを防止することができる。 Further, the electronic device 1 includes an insulating member 80 in the thermal paste 50. Therefore, the insulating member 80 is present between the electronic component 10 and the heat sink 30. Therefore, even if an external force is applied to the electronic substrate 20 in a direction that narrows the distance between the electronic substrate 20 and the heat sink 30, the distance between the electronic substrate 20 and the heat sink 30 is secured by the insulating member 80. As a result, while reducing the thickness of the thermal paste 50, it is possible to sufficiently improve the heat dissipation efficiency of the electronic component 10 and prevent the electronic component 10 and the heat sink 30 from being electrically short-circuited. it can.
なお、本実施形態で用いた図１では、突出部７１２を、電子部品１０と同じ数（３つ）設けた例を示した。しかし、これに限らず、突出部７１２を、電子部品１０と比べて、多く設けてもよいし、少なく設けてもよい。 In addition, in FIG. 1 used in this embodiment, an example in which the same number (three) as the number (three) of the electronic components 10 is provided is shown. However, the present invention is not limited to this, and the number of protrusions 712 may be increased or decreased as compared with the electronic component 10.
また、本実施形態では、突出部７１２は、電子基板２０の他方の面のうち、電子部品１０が実装されている領域と対向する領域に当接する。しかし、これに限らず、電子基板２０の他方の面のうち、電子基板２０の一方の面であって電子部品１０が実装されていない領域と対向する領域に当接してもよい。 Further, in the present embodiment, the protruding portion 712 abuts on the other surface of the electronic substrate 20 that faces the region on which the electronic component 10 is mounted. However, the present invention is not limited to this, and the other surface of the electronic substrate 20 may come into contact with a region that is one surface of the electronic substrate 20 and faces the region on which the electronic component 10 is not mounted.
また、本実施形態では、電子基板２０に対して、電子基板２０とヒートシンク３０との間隔を狭める方向に外力を印加して、電子基板２０をヒートシンク３０に向かって押圧した。
しかし、これに限らず、例えばヒートシンク３０に対して、電子基板２０とヒートシンク３０との間隔を狭める方向に外力を印加して、ヒートシンク３０を電子基板２０に向かって押圧してもよい。
また、例えば電子基板２０およびヒートシンク３０のうち少なくともいずれかに対して、電子基板２０とヒートシンク３０との間隔を狭める方向に外力を印加して、電子基板２０をヒートシンク３０に向かって引きつけたり、ヒートシンク３０を電子基板２０に向かって引きつけたりしてもよい。この場合、例えば伸ばした状態のばねにより、樹脂板７１とヒートシンク３０とを接続すればよい。
Further, in the present embodiment, an external force is applied to the electronic substrate 20 in a direction that narrows the distance between the electronic substrate 20 and the heat sink 30, and the electronic substrate 20 is pressed toward the heat sink 30.
However, the present invention is not limited to this, and for example, an external force may be applied to the heat sink 30 in a direction that narrows the distance between the electronic substrate 20 and the heat sink 30 to press the heat sink 30 toward the electronic substrate 20.
Further, for example, an external force is applied to at least one of the electronic substrate 20 and the heat sink 30 in a direction to narrow the distance between the electronic substrate 20 and the heat sink 30 to attract the electronic substrate 20 toward the heat sink 30, or the heat sink. 30 may be attracted toward the electronic substrate 20. In this case, for example, the resin plate 71 and the heat sink 30 may be connected by a spring in a stretched state.
また、本実施形態では、外力印加部７０にばね７２を設けたが、ばね７２は、弾性体であればよく、例えばゴムブッシュであってもよい。 Further, in the present embodiment, the spring 72 is provided in the external force applying portion 70, but the spring 72 may be an elastic body, for example, a rubber bush.
また、本実施形態では、放熱グリス５０が絶縁部材８０を含んでいたが、これに限らず、ヒートシンク３０のＹプラス方向側の面や、電子部品１０の上面（Ｙマイナス方向側の面）を、アルマイト塗装などにより絶縁物で被覆してもよい。この場合、放熱グリス５０が絶縁部材８０を含んでいる必要はない。 Further, in the present embodiment, the thermal paste 50 includes the insulating member 80, but the present invention is not limited to this, and the surface of the heat sink 30 on the Y plus direction side and the upper surface of the electronic component 10 (the surface on the Y minus direction side) are covered. , May be coated with an insulating material such as alumite coating. In this case, the thermal paste 50 does not need to include the insulating member 80.
また、本実施形態において、電子部品１０のパッケージは、例えばＳＯＰ、ＱＦＰ、ＢＧＡなどであってもよい。 Further, in the present embodiment, the package of the electronic component 10 may be, for example, SOP, QFP, BGA, or the like.
また、本実施形態において、電子部品１０は、電子部品１０の上面（Ｙマイナス方向側の面）に、放熱電極を備えていてもよい。これにより、電子部品１０の熱の放熱効率をさらに向上させることができる。 Further, in the present embodiment, the electronic component 10 may be provided with a heat radiating electrode on the upper surface (the surface on the Y-minus direction side) of the electronic component 10. As a result, the heat dissipation efficiency of the electronic component 10 can be further improved.
＜第２実施形態＞
図２を用いて、本発明の第２実施形態について説明する。
<Second Embodiment>
A second embodiment of the present invention will be described with reference to FIG.
図２は、本発明による放熱構造を用いた電子機器１Ａを示す側面図である。電子機器１Ａは、図１に示した本発明の第１実施形態に係る電子機器１とは、外力印加部７０の代わりに外力印加部７０Ａを備える点で異なっており、他の部分については同様の形態をしている。このため、電子機器１と同様の形態をしている部分については、同一の符号を付して、その説明を省略する。 FIG. 2 is a side view showing an electronic device 1A using the heat dissipation structure according to the present invention. The electronic device 1A is different from the electronic device 1 according to the first embodiment of the present invention shown in FIG. 1 in that it includes an external force applying unit 70A instead of the external force applying unit 70, and the other parts are the same. It is in the form of. Therefore, the same reference numerals are given to the parts having the same shape as that of the electronic device 1, and the description thereof will be omitted.
外力印加部７０Ａは、電子基板２０に対して、電子基板２０とヒートシンク３０との間隔を狭める方向に外力を印加する。この外力印加部７０Ａは、いわゆる板ばねと締結部材としての雄ねじ６２から構成されており、電子基板２０の他方の面のうち、電子部品１０が実装されている領域と対向する領域に当接する。 The external force applying unit 70A applies an external force to the electronic substrate 20 in a direction that narrows the distance between the electronic substrate 20 and the heat sink 30. The external force applying portion 70A is composed of a so-called leaf spring and a male screw 62 as a fastening member, and comes into contact with a region of the other surface of the electronic substrate 20 facing the region on which the electronic component 10 is mounted.
外力印加部７０Ａの端部には、雄ねじ６２が貫通する貫通孔が形成される。脚部６１に形成された雌ねじと、外力印加部７０Ａの端部の貫通孔に挿通された雄ねじ６２と、を螺着することにより、板ばねが電子基板２０に向かって押し付けられる。このため、外力印加部７０Ａにより、電子基板２０のうち電子部品１０が実装されている領域が、電子基板２０の他方の面側からヒートシンク３０に向かって押圧される。 A through hole through which the male screw 62 penetrates is formed at the end of the external force applying portion 70A. The leaf spring is pressed toward the electronic substrate 20 by screwing the female screw formed on the leg portion 61 and the male screw 62 inserted into the through hole at the end of the external force applying portion 70A. Therefore, the region of the electronic substrate 20 on which the electronic component 10 is mounted is pressed by the external force application unit 70A from the other surface side of the electronic substrate 20 toward the heat sink 30.
以上の電子機器１Ａは、電子機器１と同様の効果を奏することができる。 The above electronic device 1A can exert the same effect as that of the electronic device 1.
以上、この発明の実施形態につき、図面を参照して詳述してきたが、具体的な構成はこの実施形態に限られるものではなく、この発明の要旨を逸脱しない範囲の設計なども含まれる。 Although the embodiments of the present invention have been described in detail with reference to the drawings, the specific configuration is not limited to this embodiment, and includes designs within a range that does not deviate from the gist of the present invention.
１、１Ａ、１００ 電子機器
１０ 電子部品
２０ 電子基板
３０ ヒートシンク（放熱部）
４０ 半田部
５０ 放熱グリス（熱伝導部）
６０ 固定部
６１ 脚部
６２ 雄ねじ（締結部材）
７０、７０Ａ 外力印加部
７１ 樹脂板
７２ ばね（弾性部材）
７１１ 基部
７１２ 突出部
８０ 絶縁部材
1, 1A, 100 Electronic equipment 10 Electronic components 20 Electronic board 30 Heat sink (heat sink)
40 Solder part 50 Thermal paste (heat conduction part)
60 Fixing part 61 Leg part 62 Male screw (fastening member)
70, 70A External force application part 71 Resin plate 72 Spring (elastic member)
711 Base 712 Protruding 80 Insulation
Claims (5)
前記電子基板の一方の面側に、前記複数の電子部品との間に間隔を空けて設けられた放熱部と、
前記複数の電子部品と前記放熱部との間に設けられた熱伝導部と、
前記電子基板および前記放熱部の少なくともいずれかに対して、前記電子基板と前記放熱部との間隔を狭める方向に外力を印加する外力印加部と、
を備え、
前記外力印加部は、
板状の基部と、該基部から電子基板側に突出する複数の突出部とからなる板状部材を備え、
前記複数の突出部により、前記電子基板のうち前記複数の電子部品が実装されているそれぞれの領域を、前記電子基板の他方の面側から前記放熱部に向かって押圧することを特徴とする放熱構造。 It is a heat dissipation structure that dissipates heat from multiple electronic components mounted on one surface of an electronic board.
A heat radiating portion provided on one surface side of the electronic substrate at intervals between the plurality of electronic components,
A heat conductive portion provided between the plurality of electronic components and the heat radiating portion,
An external force applying portion that applies an external force to at least one of the electronic substrate and the heat radiating portion in a direction that narrows the distance between the electronic substrate and the heat radiating portion.
Equipped with a,
The external force applying portion is
A plate-shaped member including a plate-shaped base and a plurality of protruding parts protruding from the base toward the electronic substrate is provided.
The heat dissipation is characterized in that the plurality of protrusions press each region of the electronic board on which the plurality of electronic components are mounted from the other surface side of the electronic board toward the heat dissipation portion. Construction.
前記電子基板の他方の面側に、弾性部材と締結部材とを備え、前記弾性部材と締結部材とが、前記板状部材を介して前記電子基板を前記放熱部に向かって押圧することを特徴とする請求項１に記載の放熱構造。 The external force applying portion is
An elastic member and a fastening member are provided on the other surface side of the electronic substrate, and the elastic member and the fastening member press the electronic substrate toward the heat radiating portion via the plate-shaped member. The heat dissipation structure according to claim 1 .
前記電子基板の他方の面側に、板ばねと締結部材とを備え、前記板ばねと締結部材とが、前記電子基板を前記放熱部に向かって押圧することを特徴とする請求項１に記載の放熱構造。 The external force applying portion is
The first aspect of claim 1, wherein a leaf spring and a fastening member are provided on the other surface side of the electronic substrate, and the leaf spring and the fastening member press the electronic substrate toward the heat radiating portion. Heat dissipation structure.
前記電子基板の一方の面には、半田部が形成されており、
前記電極は、前記半田部により、前記電子基板に固着されることを特徴とする請求項１から４のいずれか１項に記載の放熱構造。 The electronic component includes an electrode formed on the electronic substrate side.
A solder portion is formed on one surface of the electronic substrate.
The heat dissipation structure according to any one of claims 1 to 4 , wherein the electrode is fixed to the electronic substrate by the solder portion.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2016157541A JP6789031B2 (en) | 2016-08-10 | 2016-08-10 | Heat dissipation structure |
| PCT/JP2017/015569 WO2018029909A1 (en) | 2016-08-10 | 2017-04-18 | Heat dissipating structure |
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| JP2016157541A JP6789031B2 (en) | 2016-08-10 | 2016-08-10 | Heat dissipation structure |
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| JP2000196269A (en) * | 1998-12-25 | 2000-07-14 | Toshiba Corp | Circuit module |
| US6386890B1 (en) * | 2001-03-12 | 2002-05-14 | International Business Machines Corporation | Printed circuit board to module mounting and interconnecting structure and method |
| US6743026B1 (en) * | 2003-04-15 | 2004-06-01 | International Business Machines Corporation | Printed wiring board thickness control for compression connectors used in electronic packaging |
| JP2007059608A (en) * | 2005-08-24 | 2007-03-08 | Denso Corp | Electronic control unit |
| JP2007305649A (en) * | 2006-05-09 | 2007-11-22 | Matsushita Electric Ind Co Ltd | Radiator fixing means |
| JP4811933B2 (en) * | 2006-06-08 | 2011-11-09 | 株式会社山武 | Heat dissipation structure in electronic equipment |
| JPWO2008065718A1 (en) * | 2006-11-29 | 2010-03-04 | 富士通株式会社 | Thermally conductive sheet and electronic device |
| JP5585071B2 (en) * | 2009-12-18 | 2014-09-10 | 富士通株式会社 | Electronic device and manufacturing method thereof |
| JP2011249520A (en) * | 2010-05-26 | 2011-12-08 | Mitsubishi Electric Corp | Electronic control device |
| JP2011258831A (en) * | 2010-06-10 | 2011-12-22 | Fujikura Ltd | Fixing structure of cooling device |
| JP5803856B2 (en) * | 2012-09-06 | 2015-11-04 | 株式会社デンソー | Electronic control unit |
| MY170487A (en) * | 2013-01-22 | 2019-08-07 | Shinetsu Chemical Co | Heat conductive silicone composition, heat conductive layer, and semiconductor device |
| US10626311B2 (en) * | 2013-12-18 | 2020-04-21 | Sekisui Polymatech Co., Ltd. | Curable thermally conductive grease, heat dissipation structure, and method for producing heat dissipation structure |
| JP6252550B2 (en) * | 2014-07-31 | 2017-12-27 | 株式会社デンソー | Electronic device, driving device using the same, and method of manufacturing electronic device |
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