JP6431871B2 - Resin supply method and resin supply apparatus - Google Patents

Description

  The present invention relates to a resin supply technique.

  Japanese Unexamined Patent Application Publication No. 2012-126075 (hereinafter referred to as “Patent Document 1”) describes a liquid resin supply apparatus. This liquid resin supply apparatus discharges and supplies liquid resin with which the syringe was filled to a workpiece | work from a tube nozzle.

  Japanese Unexamined Patent Application Publication No. 2007-111862 (hereinafter referred to as “Patent Document 2”) describes a vacuum dispensing apparatus. In this vacuum dispensing apparatus, an article to be coated is placed in a vacuum chamber and a liquid resin is supplied in a vacuum environment. Further, in this vacuum dispensing apparatus, a liquid dripping receptacle is provided outside the vacuum chamber in order to prevent the apparatus from being soiled by liquid dripping from the nozzle.

JP 2012-126075 A JP 2007-111182 A

  When resin molding is performed on an object to be supplied (for example, a workpiece or a film), the liquid resin can be supplied onto the object to be supplied using the liquid resin supply device described in Patent Document 1. However, for example, when a liquid resin is supplied to a workpiece that is a substrate on which a plurality of chip components (chip-shaped electronic components) are mounted as an article to be supplied, the liquid resin that covers the plurality of chip components may form a drop-like lump. is there. In this case, there is a problem that air remains between the substrate and the liquid resin, and as a result, the molded product is likely to be unfilled. Furthermore, there is a possibility that so-called underfill is not properly performed on a chip component flip-chip connected on a substrate as a workpiece.

  Therefore, it is conceivable that the liquid resin is supplied not in an air atmosphere as in the technique described in Patent Document 1 but in a vacuum atmosphere as in the technique described in Patent Document 2 to remove residual air. However, since the technique described in Patent Document 2 is configured to move the dripping container under the nozzle after opening the vacuum chamber to the atmosphere (see in particular paragraph [0026] of the specification), the liquid resin on the workpiece is used. There is a risk of dust.

  An object of the present invention is to provide a technique capable of preventing problems such as air entrapment in a resin. One and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

A resin supply method according to one solution of the present invention includes: (a) a step of evacuating the interior of a chamber; and (b) discharging a liquid resin from a nozzle to a material to be supplied inside the chamber in a vacuum state. to the step, the discharge of (c) the liquid resin is stopped, after stopping the evacuation of the interior of the chamber, viewed including the the steps of the draining of the nozzle in the interior of said chamber, said In the step (b), the liquid resin is discharged while moving the nozzle in parallel with the supply object . In the step (c), it is more preferable that the discharge of the liquid resin is stopped and the evacuation of the inside of the chamber is stopped, and then the nozzle is reciprocated inside the chamber. According to this, it is possible to prevent problems such as air entrapment in the resin. Further, the liquid resin can be supplied into the surface of the supply object at an arbitrary discharge position.

  Here, in the step (b), it is more preferable to discharge the liquid resin while measuring the weight of the liquid resin with a weight meter provided in the chamber. According to this, the weight of the liquid resin can be accurately measured.

  A resin supply method according to another solution of the present invention includes: (a) a step of discharging a liquid resin from a nozzle to an object to be supplied inside the chamber; and (b) a step of evacuating the inside of the chamber. (C) stopping the discharge of the liquid resin, and stopping the evacuation of the interior of the chamber, and then draining the nozzle in the interior of the chamber. According to this, it is possible to prevent problems such as air entrapment in the resin.

  A resin sealing method according to one solution of the present invention includes a step of supplying the liquid resin to the supply using any one of the resin supply methods described above, and a mold using the supply And a step of heat-pressing and sealing the resin into a predetermined shape. According to this, it is possible to perform high-quality resin sealing that prevents voids and unfilling due to air entrapment.

A resin supply apparatus according to one solution of the present invention includes a chamber in which a material to be supplied is set, and a nozzle that discharges a liquid resin toward the material to be supplied, and the nozzle is the inside of the chamber. A discharge unit provided in the chamber, a vacuum unit that evacuates the interior of the chamber, a nozzle elevating drive unit that reciprocates the nozzle, and a control that controls the discharge unit, the vacuum unit, and the nozzle elevating drive unit A nozzle raising / lowering drive unit that causes the control unit to reciprocate the nozzle in a state where discharge of the liquid resin from the discharge unit is stopped and evacuation by the vacuum unit is stopped. is controlled, the chamber comprises a one and the other chamber portion, and a seal portion for sealing between said the one of the chamber portions the other chamber portion, openably provided with Made is, the discharge portion is provided in the chamber portion of the one, and further comprising the other chamber drive unit that moves forward and backward movement and parallel to the one chamber portion with respect to the chamber portion. According to this, inside the chamber, the discharged liquid resin can be drained and separated from the supply object. Further, the liquid resin can be supplied into the surface of the supply object at an arbitrary discharge position.

  Here, it is more preferable to further include a weigh scale provided inside the chamber so as to set the supply object and measuring the weight of the discharged liquid resin. According to this, the weight of the liquid resin can be accurately measured.

  Of the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows. According to the solution means of the present invention, problems such as air entrapment in the resin can be prevented.

It is a figure for demonstrating the resin supply apparatus which concerns on one Embodiment of this invention. It is a figure for demonstrating the resin supply apparatus which concerns on the operation | movement following FIG. It is a figure for demonstrating the resin supply apparatus which concerns on the operation | movement following FIG. It is a figure for demonstrating the resin supply apparatus which concerns on the operation | movement following FIG. It is a figure for demonstrating the resin supply apparatus which concerns on the operation | movement following FIG. It is a figure for demonstrating the resin supply apparatus which concerns on the operation | movement following FIG. It is a figure for demonstrating the resin supply apparatus which concerns on the operation | movement following FIG. It is a figure for demonstrating the resin supply apparatus which concerns on the operation | movement following FIG. It is a figure for demonstrating the resin supply apparatus which concerns on other embodiment of this invention. It is a figure for demonstrating the resin supply apparatus which concerns on the operation | movement following FIG. It is a figure for demonstrating the resin supply apparatus which concerns on the operation | movement following FIG. It is a figure for demonstrating the resin supply apparatus which concerns on the operation | movement following FIG. It is a figure for demonstrating the resin supply apparatus which concerns on the operation | movement following FIG. It is a figure for demonstrating the resin supply apparatus which concerns on the operation | movement following FIG. It is a figure for demonstrating the resin supply apparatus which concerns on the operation | movement following FIG. It is a top view of the to-be-supplied material to which liquid resin was supplied. It is a side view of the to-be-supplied material to which liquid resin was supplied. It is a figure for demonstrating an example of the structure of a syringe.

  In the following embodiments of the present invention, the description will be divided into a plurality of sections when necessary. However, in principle, they are not irrelevant to each other, and one of them is related to some or all of the other modifications, details, etc. It is in. For this reason, the same code | symbol is attached | subjected to the member which has the same function in all the figures, and the repeated description is abbreviate | omitted. In addition, the number of components (including the number, numerical value, quantity, range, etc.) is limited to that specific number unless otherwise specified or in principle limited to a specific number in principle. It may be more than a specific number or less. In addition, when referring to the shape of a component, etc., it shall include substantially the same or similar to the shape, etc., unless explicitly stated or in principle otherwise considered otherwise .

(Embodiment 1)
A resin supply apparatus 10 according to an embodiment of the present invention will be described with reference to FIGS. 1-8 is a figure for demonstrating the resin supply apparatus 10 which concerns on resin supply operation | movement. The resin supply device 10 is described as being in a three-dimensional (XYZ) orthogonal coordinate system, and the vertical direction (vertical direction) in the figure corresponds to the direction along the Z axis, and the horizontal direction is the X axis and the Y axis. It becomes the direction along.

  In the present embodiment, the workpiece W is used as the supply object to which the liquid resin R is supplied. The workpiece W is a 12-inch (about 30 cm) round metal (SUS, etc.) carrier plate having a heat-peelable adhesive sheet (adhesive tape) attached thereto, and a plurality of semiconductor chips on the adhesive sheet. Are adhered in a matrix. The liquid resin R is supplied onto the workpiece W, and resin molding called E-WLP (Embedded Wafer Level Package) or eWLB (Embedded Wafer Level BGA) is performed. As the liquid resin R, for example, a thermosetting resin such as a silicone resin or an epoxy resin is used.

  The resin supply device 10 includes a control unit 11. The control unit 11 includes a CPU (Central Processing Unit) and a storage unit such as a ROM and a RAM. The CPU reads out and executes various control programs recorded in the storage unit, whereby the resin supply device 10 is configured. Controls the operation of each component. The operation of each part is the operation of the resin supply device 10.

  Further, the resin supply device 10 includes a discharge unit 20 that discharges and supplies the liquid resin R. The discharge unit 20 includes a syringe 21 in which the liquid resin R is stored, a nozzle 22 provided at the tip of the syringe 21, and a plunger 23 that is inserted into the syringe 21 and can press the liquid resin R. Further, the discharge unit 20 includes a pinch valve 24 that is provided so as to grip a tubular nozzle 22 made of, for example, an elastic body and opens and closes by a driving mechanism (not shown). In addition, in the nozzle 22, if the opening and closing of the nozzle 22 (in other words, whether or not the liquid resin can pass) can be arbitrarily switched, the nozzle 22 made of an elastic body is picked as described above to pick up the nozzle 22 The pinch valve 24 that opens and closes may not be used. For example, it is good also as a structure provided with the shutter at the nozzle front-end | tip, or the structure provided with the on-off valve.

  The discharge unit 20 discharges the liquid resin R from the nozzle 22 by opening and closing the pinch valve 24 by a drive mechanism (not shown) and causing the plunger 23 to move downward to cause the liquid resin R in the syringe 21 to flow. On the other hand, the discharge unit 20 stops the downward movement of the plunger 23 and the pinch valve 24 is closed to stop the discharge of the liquid resin R from the nozzle 22.

  Moreover, the resin supply apparatus 10 includes a chamber 30 in which a work W (supplied object) is set in the interior 30a. The chamber 30 includes a pair of chamber portions 31 and 32 (one is an upper chamber portion 31 and the other is a lower chamber portion 32) and is configured to be openable and closable. In addition, the resin supply device 10 includes a seal portion 33 (for example, an O-ring) that seals between the upper chamber portion 31 and the lower chamber portion 32. Thereby, when the chamber 30 is in a closed state, the upper chamber portion 31 and the lower chamber portion 32 are in contact with each other via the seal portion 33, and the interior 30a of the chamber 30 is formed (becomes a closed state). ). The chamber 30 is provided with a temperature adjustment unit (not shown) that arbitrarily adjusts the temperature inside the chamber 30. Moreover, the lower chamber part 32 may be comprised as a table part of an apparatus housing | casing, for example, and it is good also as a structure by which the plate-shaped member was fixed to the apparatus housing | casing.

  As will be described later, the liquid resin R is discharged from the nozzle 22 toward the workpiece W set in the interior 30a (see FIG. 3) of the chamber 30. For this reason, the resin supply apparatus 10 is configured such that the discharge portion 20 is provided in the upper chamber portion 31. Specifically, the resin supply device 10 is configured such that the nozzle 22 is provided in the interior 30 a of the chamber 30 through the upper chamber portion 31 in a state where the syringe 21 is held outside the chamber 30. Therefore, the resin supply device 10 includes a discharge holding unit 34 and seal units 35 and 36 (for example, O-rings). The discharge holding unit 34 holds the syringe 21 in a state where the nozzle 22 is penetrated. Moreover, the discharge holding part 34 is provided as a cover part of the opening of the penetration protrusion part 31a so that the penetration protrusion part 31a which the upper chamber part 31 has may be covered. The seal part 35 seals between the syringe 21 and the discharge holding part 34. The seal part 36 seals between the penetrating protrusion part 31 a of the upper chamber part 31 and the discharge holding part 34. Thereby, the nozzle 22 is provided in the interior 30a formed by closing the chamber 30.

  The resin supply device 10 also includes a weigh scale 40 that measures the weight of the liquid resin R discharged from the nozzle 22. The weigh scale 40 is provided in the interior 30a of the chamber 30 so that the workpiece W is set therein. In this case, as shown in FIG. 1, the lower chamber portion 32 can be provided with a recessed portion 32 b that is recessed from the surface 32 a. The weight part 40 is provided in a state where the weight part 40 is fixed. In the weighing scale 40, the weight of the liquid resin R discharged to the workpiece W is measured in a state where the workpiece W is set. According to this, the weight meter 40 can stably measure the weight of the liquid resin R supplied to the workpiece W in the interior 30 a of the chamber 30, and can be accurately measured. The weighing scale 40 is electrically connected to the control unit 11, and the measurement data of the weighing scale 40 is processed by the control unit 11.

  The resin supply apparatus 10 also includes a vacuum unit 41 (for example, a vacuum pump) that evacuates the interior 30a of the chamber 30 to bring it into a vacuum state (or a reduced pressure state). The vacuum part 41 forms a vacuum state by evacuating the interior 30a via the air passage 42 formed in the lower chamber part 32 when the interior 30a of the chamber 30 is closed. Since resin can be supplied in such a chamber 30, problems such as air entrapment in the resin can be prevented. The vacuum unit 41 is electrically connected to the control unit 11, and the vacuum unit 41 is controlled by the control unit 11.

  In addition, the resin supply device 10 includes a chamber driving unit 50 that opens and closes the chamber 30. The chamber drive unit 50 opens / closes the chamber 30 by moving the upper chamber unit 31 forward / backward in the direction along the Z axis with respect to the lower chamber unit 32 (approaching or moving away). The chamber drive unit 50 includes a holding unit 51, a first rail 52, a first slider 53, and a first motor 54.

  In the chamber driving unit 50, the holding unit 51 is formed in a columnar shape and is provided to stand on the surface 32 a of the lower chamber unit 32. The holding portion 51 is provided with a first rail 52 extending in the vertical direction (direction along the Z axis, vertical direction). A first slider 53 is provided to be slidable on the first rail 52. The first slider 53 slides on the first rail 52 by driving the first motor 54. In the present embodiment, the upper chamber portion 31 is provided on the first slider 53, and the upper chamber portion 31 moves forward and backward (up and down movement) with respect to the lower chamber portion 32 by sliding the first slider 53 in the vertical direction. ). The first motor 54 is electrically connected to the control unit 11, and the chamber driving unit 50 is controlled by the control unit 11. In the following description, an example in which a plurality of drive units other than the chamber drive unit 50 are formed with the same configuration will be described. However, these are not limited to the configuration shown in the figure, but are indirect using a link structure. An arbitrary moving structure such as a robot can be provided.

  The resin supply device 10 also includes a nozzle lifting / lowering drive unit 70 that reciprocates the nozzle 22. The nozzle raising / lowering drive unit 70 reciprocates the nozzle 22 of the discharge unit 20 in the raising / lowering direction inside the chamber 30a. The nozzle lifting / lowering drive unit 70 includes a second rail 72, a second slider 73, and a second motor 74.

  In the nozzle lifting / lowering drive unit 70, the second rail 72 extends in the vertical direction and is provided on the first slider 53 of the chamber drive unit 50 together with the upper chamber unit 31. That is, the second rail 72 and the upper chamber portion 31 are held together with respect to the first slider 53. A second slider 73 is provided to be slidable on the second rail 72. The second slider 73 slides on the second rail 72 by driving the second motor 74. The second slider 73 is provided with a discharge holder 34. In the present embodiment, the second slider 73 slides in the vertical direction, so that the nozzle 22 of the discharge unit 20 is reciprocated (lifted) through the discharge holding unit 34. As will be described later, the liquid resin R can be drained by reciprocating the nozzle 22 that has discharged the liquid resin R. The second motor 74 is electrically connected to the control unit 11, and the nozzle raising / lowering driving unit 70 is controlled by the control unit 11.

  Here, the draining of the liquid resin R means that when the liquid resin R is discharged downward from the nozzle 22 and supplied to the workpiece W, the liquid resin R having a high viscosity is stretched without being separated from the nozzle 22 by its own weight. When the state (drawing state) is reached, it means that the nozzle 22 is cut off. In the following embodiments, a method is assumed in which the nozzle 22 that has finished discharging the liquid resin R is moved up and down to repeatedly expand and contract the distance from the workpiece W, and is separated from the nozzle 22. However, the method for removing the liquid is not limited to this, and a method for physically cutting from the tip of the nozzle 22 may be used.

  The discharge unit 20 of the resin supply device 10 includes a discharge drive unit 80 that reciprocates the plunger 23. The discharge driving unit 80 includes a third rail 82, a third slider 83, and a third motor 84.

  In the ejection driving unit 80, the third rail 82 extends in the vertical direction and is provided on the second slider 73. A third slider 83 is provided to be slidable on the third rail 82. The third slider 83 slides on the third rail 82 by driving the third motor 84. The plunger 23 is provided on the third slider 83, and the plunger 23 is reciprocated as the third slider 83 slides in the vertical direction. In this embodiment, the plunger 23 is inserted into the syringe 21, and the liquid resin R stored in the syringe 21 is pressed by the plunger 23, whereby the liquid resin is discharged from the nozzle 22 provided at the tip of the syringe 21. R is discharged. The third motor 84 is electrically connected to the control unit 11, and the control unit 11 controls the discharge driving unit 80 of the discharge unit 20.

  In the resin supply device 10, the discharge of the liquid resin R from the discharge unit 20 is stopped, and the controller 22 reciprocates the nozzle 22 in the interior 30 a of the chamber 30 in a state where the vacuuming by the vacuum unit 41 is stopped. The nozzle lifting / lowering drive unit 70 is controlled. According to this, in the interior 30 a of the chamber 30, the discharged liquid resin R can be drained and separated from the workpiece W. By draining the liquid in the closed space (inside 30a), it is possible to prevent entrainment of dust and the like.

  Next, an operation method of the resin supply apparatus 10 according to the embodiment of the present invention, that is, a resin supply method will be described.

  The resin supply device 10 shown in FIG. 1 is in a state before the workpiece W is supplied. Here, the chamber 30 is open. Further, the nozzle 22 of the syringe 21 is closed by a pinch valve 24, and the plunger 23 is waiting on the upper side. With the chamber 30 open as described above, the workpiece W is conveyed by the conveyance device (for example, a loader), and the workpiece W is supplied to the resin supply device 10 as shown in FIG. In the present embodiment, the workpiece W is set on the weight scale 40.

  Subsequently, as illustrated in FIG. 3, the interior 30 a of the chamber 30 is formed so as to be in a closed state, and evacuation is started with respect to the interior 30 a of the chamber 30. Here, the vacuum unit 41 and the chamber driving unit 50 are controlled by the control unit 11. Specifically, when the first motor 54 of the chamber drive unit 50 is driven, the first slider 53 provided with the upper chamber unit 31 descends on the first rail 52, so that the upper part is interposed via the seal unit 33. The chamber 31 and the lower chamber 32 are brought into contact with each other. Thereby, the inside 30a of the chamber 30 which became the closed state is formed. And the inside 30a of the chamber 30 in which the workpiece | work W was set is made into a vacuum state by the drive of the vacuum part 41. FIG. In addition, it is preferable to control the temperature adjusting unit so that the temperature inside the chamber 30 becomes a predetermined value before or in parallel with the operation of making the vacuum state. In this case, only the chamber 30 need be set to a predetermined temperature, not the entire apparatus, so that temperature adjustment can be performed quickly.

  Subsequently, as shown in FIG. 4, the liquid resin R is discharged from the nozzle 22 to the workpiece W in the interior 30 a of the vacuum chamber 30. Here, the discharge unit 20 (discharge drive unit 80) and the vacuum unit 41 are controlled by the control unit 11. Specifically, the interior 30a of the chamber 30 is continuously evacuated by driving the vacuum unit 41. Then, the third slider 83 provided with the plunger 23 descends on the third rail 82 by driving the third motor 84 of the discharge unit 20. In this case, the plunger 23 presses the liquid resin R in the syringe 21, and the pinch valve 24 is opened by a drive mechanism (not shown) to discharge the liquid resin R from the nozzle 22.

  At this time, the liquid resin R is discharged while measuring the weight of the liquid resin R by the weight meter 40 provided in the interior 30 a of the chamber 30. The control unit 11 processes the measurement data of the weigh scale 40, and can stop the discharge of the liquid resin R when the weight of the liquid resin R reaches a predetermined value, for example. In addition, as described above, when the temperature adjustment unit keeps the interior 30a of the chamber 30 at a predetermined temperature, the liquid resin R can be discharged and the weight can be accurately measured, and the liquid resin R can be supplied more appropriately. can do.

  Subsequently, after the discharge of the liquid resin R is stopped and the evacuation of the interior 30a of the chamber 30 is stopped, the nozzle 22 is reciprocated in the interior 30a of the chamber 30 as shown in FIGS. Here, the discharge unit 20, the vacuum unit 41, and the nozzle lifting / lowering drive unit 70 are controlled by the control unit 11. Specifically, the downward movement of the plunger 23 is stopped by stopping the third motor 84 of the discharge unit 20, and the pinch valve 24 is closed to stop the discharge of the liquid resin R from the nozzle 22. Next, the vacuum state of the interior 30 a of the chamber 30 is released by stopping the vacuuming by the vacuum unit 41. Accordingly, for example, when there is a space where the liquid resin R is not filled below the liquid resin R supplied onto the workpiece W (in other words, when air is trapped), the gap is not increased. It becomes possible to fill the liquid resin R with the pressure of the surrounding atmosphere.

  Next, the nozzle 22 of the discharge unit 20 is moved up by driving the second motor 74 of the nozzle lifting / lowering drive unit 70 (see FIG. 5). Next, the nozzle 22 of the discharge unit 20 is moved downward by driving the second motor 74 of the nozzle lifting / lowering drive unit 70 (see FIG. 6). Then, a liquid draining operation is performed in which the reciprocation (lifting) of the nozzle 22 of the discharge unit 20 is repeated a predetermined number of times. Although the vacuum state of the interior 30a of the chamber 30 is released, the discharge holding unit 34 can be moved up and down while the closed state of the chamber 30 is maintained.

  In the present embodiment, the reciprocating operation of the nozzle 22 is performed in a state (closed state) in which the chamber 30 is closed and the interior 30a is formed. Without moving the upper chamber portion 31, the discharge holding portion 34 is reciprocated using the penetrating protrusion 31a of the upper chamber portion 31 as a guide portion, so that it is held by the discharge holding portion 34 while maintaining a closed space. The nozzle 22 is reciprocated. In this way, the liquid resin R is drained in the closed interior 30a. On the other hand, for example, by raising and lowering the upper chamber part 31 as a whole, it is possible to raise and lower the nozzle 22 to perform a liquid draining operation. However, in order to perform such an operation, the components to be lifted / lowered become large. Moreover, when the upper chamber part 31 moves up and down, the atmosphere around the workpiece W flows, and there is a possibility that the dust adheres to the liquid resin R when dust is present in the surroundings. For this reason, as shown in the present embodiment, it is preferable to provide a seal portion 36 between the upper chamber portion 31 and the discharge holding portion 34 so as to raise and lower the syringe 21 having the nozzle 22. In this way, dust can be prevented from adhering while eliminating air entrapment. The resin supply device 10 shown in FIG. 7 is in a state where the liquid resin R has been drained.

  Subsequently, the control unit 11 controls the chamber driving unit 50 to open the chamber 30 and release the work W supplied with the liquid resin R to the atmosphere as shown in FIG. Also here, the atmospheric pressure is applied from the periphery of the liquid resin R, whereby the filling of the liquid resin R on the workpiece W is promoted. For example, when a chip member is mounted as a workpiece W on a substrate or wafer by flip-chip connection, the liquid resin R can be filled between a large number of bumps connecting the chip and the substrate. Even when the flip chip connection is not performed, the liquid resin R does not sufficiently spread in the space in the corner portion formed by the side surface of the chip mounted on the substrate or the like and the plane of the substrate or the like in the work W. There is a possibility that a part (not filled) may occur. It is also conceivable that the liquid resin R is supplied so as to include such a portion (space), so that air is embraced. However, when air pressure is applied from the periphery of the liquid resin R supplied in a vacuum state (under a reduced pressure atmosphere), such air entrapment (region without the liquid resin R) can be crushed.

  Specifically, when the first motor 54 of the chamber driving unit 50 is driven, the first slider 53 provided with the upper chamber unit 31 moves up on the first rail 52, so that the upper chamber unit 31 and the lower chamber The chamber 32 is opened with the part 32 separated. Thereafter, the workpiece W supplied with the liquid resin R is taken out and conveyed by a conveying device (for example, a loader).

  Next, for example, the resin supply device 10 according to the present embodiment and a mold die (not shown) are provided in the mold device, and the liquid resin R supplied onto the workpiece W in the mold die is heated and pressurized in a reduced pressure atmosphere to be predetermined. The shape is resin-sealed. According to this, it is possible to perform high-quality resin sealing that prevents voids and unfilling due to air entrapment. In this case, as described above, since the liquid resin R is supplied to the workpiece W while preventing problems such as air entrapment, resin sealing that prevents unfilling can be performed. In addition, although this embodiment demonstrated the case where it applied to the workpiece | work W as a to-be-supplied material, the liquid resin R can also be supplied by using the release film supplied to a mold die separately from the workpiece | work W as a to-be-supplied material. .

(Embodiment 2)
A resin supply apparatus 10A according to Embodiment 2 of the present invention will be described with reference to FIGS. 9-15 is a figure for demonstrating 10 A of resin supply apparatuses which concern on resin supply operation | movement. 16 and 17 are a plan view and a side view, respectively, of a workpiece W that is a supply object supplied with a liquid resin. Since this embodiment is different from the configuration of the chamber driving unit 50 according to the first embodiment, this point will be mainly described below.

  The resin supply apparatus 10A according to the present embodiment includes a chamber drive unit 50A that configures the chamber 30 at any position in the planar direction and opens and closes the chamber 30A. That is, the chamber drive unit 50A is configured to be able to move the upper chamber unit 31 including the syringe 21 (nozzle 22) in the X direction or the Y direction in FIG. Further, the chamber drive unit 50 </ b> A opens and closes the chamber 30 by moving the upper chamber unit 31 forward and backward with respect to the lower chamber unit 32. With such a structure, it is configured such that the nozzle 22 portion of the syringe 21 can be moved to an arbitrary position in the XY direction with respect to the workpiece W in a state where the chamber 30 is configured (for example, in a decompressed state).

  Specifically, the chamber driving unit 50A includes a holding unit 51, a first rail 52, a first slider 53, a first motor 54, an upper base unit 60, a fourth rail 61, and a fourth slider 62. A fourth motor 63, a fifth rail 64, a fifth slider 65, and a fifth motor 66. In the chamber drive unit 50A, the upper base unit 60 is fixed to the apparatus housing so as not to move. A fourth rail 61 extending in the direction along the Y axis is provided on the lower surface of the upper base portion 60. A fourth slider 62 is provided to be slidable on the fourth rail 61. The fourth slider 62 slides on the fourth rail 61 by driving the fourth motor 63. The fourth slider 62 is provided with a fifth rail 64 extending in the direction along the X axis. A fifth slider 65 is slidable on the fifth rail 64. The fifth slider 65 slides on the fifth rail 64 by driving the fifth motor 66. The holding portion 51 is provided to be suspended from the fifth slider 65.

  The holding portion 51 is provided with a first rail 52 extending in a direction along the Z axis, and a first slider 53 is provided on the first rail 52 so as to be slidable by a first motor 54. The upper chamber portion 31 is provided on the first slider 53. Therefore, the upper chamber portion 31 can be moved in the direction along the three axes (XYZ) by the chamber driving portion 50A. That is, the chamber drive unit 50A can move the upper chamber unit 31 forward and backward (moving in the direction along the Z axis) and parallel movement (moving in the direction along the X and Y axes) with respect to the lower chamber unit 32. . For this reason, in the resin supply apparatus 10A, the upper chamber portion 31 can be translated while the chamber 30 is closed by the chamber driving portion 50A.

  As described in the first embodiment, the upper chamber portion 31 is provided with the discharge portion 20. For this reason, in the resin supply apparatus 10 </ b> A, the liquid resin R can be discharged from the nozzle 22 while the discharge unit 20 is translated in a state where the chamber 30 is closed. According to this, the liquid resin R can be supplied into the surface of the workpiece W at an arbitrary discharge position in addition to the effects in the above-described embodiment (see FIGS. 16 and 17).

  Next, an operation method of the resin supply apparatus 10A according to the embodiment of the present invention, that is, a resin supply method will be described.

  The resin supply apparatus 10 shown in FIG. 9 is in a state after the workpiece W is supplied with the chamber 30 opened. Here, the nozzle 22 of the syringe 21 is closed by the pinch valve 24, and the plunger 23 is waiting on the upper side. A work W is set on the weight scale 40.

  Subsequently, as illustrated in FIG. 10, the interior 30 a of the chamber 30 is formed so as to be in a closed state, and evacuation is started with respect to the interior 30 a of the chamber 30. Here, the control unit 11 controls the vacuum unit 41 and the chamber driving unit 50A. Specifically, when the first motor 54 of the chamber drive unit 50A is driven, the first slider 53 provided with the upper chamber unit 31 descends on the first rail 52, so that the upper part via the seal unit 33 is provided. The chamber 31 and the lower chamber 32 are brought into contact with each other. Thereby, the inside 30a of the chamber 30 which became the closed state is formed. And the inside 30a of the chamber 30 in which the workpiece | work W was set is made into a vacuum state by the drive of the vacuum part 41. FIG.

  Subsequently, as shown in FIG. 11, the upper chamber portion 31 is translated with respect to the lower chamber portion 32 so that the nozzle 22 is located at a predetermined position (discharge start position) with respect to the surface of the workpiece W. Here, the control unit 11 controls the vacuum unit 41 and the chamber driving unit 50A. Specifically, the interior 30a of the chamber 30 is continuously evacuated by driving the vacuum unit 41. Then, at least one of the fourth slider 62 or the fifth slider 65 is slid by driving at least one of the fourth motor 63 or the fifth motor 66 of the chamber driving unit 50A, and the upper chamber unit 31 moves relative to the lower chamber unit 32. Translate. Thereby, the nozzle 22 can be translated to a predetermined position with respect to the surface of the workpiece W.

  Subsequently, the liquid resin R is discharged while moving the nozzle 22 in parallel with the workpiece W with the chamber 30 closed. Here, the discharge unit 20 (discharge drive unit 80), the vacuum unit 41, and the chamber drive unit 50A are controlled by the control unit 11. The liquid resin R can be discharged (supplied) to the workpiece W over the entire surface of the workpiece W. In the present embodiment, as shown in FIGS. 16 and 17, the surface central portion (maximum supply area) of the workpiece W is used. 90). For example, as shown in FIG. 16, the liquid resin R can be supplied in a spiral shape or a plurality of concentric circles. Since the resin supply device 10A is configured to move the nozzle 22 together with the upper chamber portion 31 that constitutes the interior 30a of the chamber 30, the liquid resin R is supplied to the center of the surface of the workpiece W to increase the chamber size. Can be prevented. In addition, the vacuuming time can be shortened by preventing the chamber size from increasing. Further, by supplying the liquid resin R in a spiral shape or a plurality of concentric circles, it is possible to reduce the height of the supplied liquid resin R.

  Specifically, the interior 30a of the chamber 30 is continuously evacuated by driving the vacuum unit 41. Next, as shown in FIG. 12, the plunger 23 is lowered by driving the third motor 84 of the discharge unit 20, and the liquid resin R in the syringe 21 is discharged from the nozzle 22. Next, as shown in FIG. 13, the liquid resin R is discharged from the nozzle 22 while the upper chamber portion 31 is translated relative to the lower chamber portion 32 by the chamber driving portion 50A. Finally, as shown in FIG. 14, the liquid resin R can be supplied to the work W in a spiral shape by translating the nozzle 22 to the center of the work W and discharging the liquid resin R. At this time, the liquid resin R is discharged while measuring the weight of the liquid resin R by the weight meter 40 provided in the interior 30 a of the chamber 30.

  Of course, the liquid resin R may be supplied to the entire surface of the workpiece W in a spiral shape or the like, so that the amount of the resin supplied on the workpiece W may be made uniform. In this case, the bottomed cylindrical upper chamber portion 31 as shown in the above-described figure can be formed into a flat plate shape, and the flat bottom chamber portion 32 can be formed into a bottomed cylindrical shape. A chamber having such a structure is more preferable because the same effect as the above-described structure can be obtained, and even if the movement region of the nozzle 22 is increased, the chamber size does not increase.

  In addition, about the shape which supplies liquid resin R on the workpiece | work W, it can supply to arbitrary shapes besides the spiral shape or concentric shape as mentioned above. For example, the workpiece W can be supplied in an arbitrary shape such as a multi-point shape, a lattice shape, a shape in which a plurality of lines are arranged, or a radial shape.

  Moreover, you may provide the imaging device which images the liquid resin R supplied on the workpiece | work W. FIG. In this case, for example, an imaging window portion made of a translucent material is provided in the upper chamber portion 31, and the shape of the liquid resin R supplied on the workpiece W is imaged by the imaging portion (camera) or the illumination portion. It is preferable that the supply state can be confirmed.

  Subsequently, as described with reference to FIGS. 5 and 6 in the above-described embodiment, the discharge of the liquid resin R is stopped, the evacuation of the interior 30a of the chamber 30 is stopped, and then the nozzle is formed in the interior 30a of the chamber 30. 22 is reciprocated. Thereby, the liquid resin R can be drained in the interior 30a. By draining the liquid in the closed space (inside 30a), it is possible to prevent entrainment of dust and the like.

  Subsequently, as shown in FIG. 15, the chamber 30 is opened, and the work W supplied with the liquid resin R is released to the atmosphere. Here, the controller 11 controls the chamber drive unit 50A. Specifically, when the first motor 54 of the chamber drive unit 50A is driven, the first slider 53 provided with the upper chamber unit 31 is moved up on the first rail 52, so that the upper chamber unit 31 and the lower chamber are separated. The chamber 32 is opened with the part 32 separated. Thereafter, the workpiece W supplied with the liquid resin R is taken out and conveyed by a conveying device (for example, a loader).

  Although the present invention has been specifically described above based on the embodiments, it is needless to say that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

  For example, when a chip component that is flip-chip connected to a substrate is used as a work, when the liquid resin is supplied to the substrate, the space between the substrate and the chip component can be reduced. For this reason, for example, in compression molding, the resin is easily filled between the substrate and the chip component, and so-called underfill can be appropriately performed.

  Moreover, although embodiment mentioned above demonstrated the example which supplies the liquid resin R in a vacuum state (under pressure reduction atmosphere), this invention is not limited to this. That is, according to the resin supply apparatus shown in the above-described embodiment, after discharging (supplying) the liquid resin from the nozzle to the supply object inside the chamber, the air is discharged in a vacuum state (under a reduced pressure atmosphere), and the resin is discharged. It is also possible to prevent problems such as air entrapment inside.

  Further, by reducing the pressure so that the inside 30a of the chamber 30 has a high degree of vacuum, even if the liquid resin R stored in the syringe 21 closes the nozzle 22 with the pinch valve 24, it is discharged into the inside 30a of the chamber 30. It may be possible to end up. In such a case, it is preferable that the liquid resin R is pulled back into the syringe 21. Thereby, it can prevent that liquid resin R discharges unintentionally. For example, as shown in FIG. 18, the space (the upper space) without the liquid resin R inside the syringe 21 can be decompressed to balance with the force for extracting the liquid resin R by the decompression in the chamber 30.

  Specifically, as shown in FIG. 18, it can be set as the plunger 23 provided with the plunger shaft 23a and the plunger seal | sticker part 23b. The plunger shaft 23 a has a tip that is enlarged in diameter, and presses the syringe lid 21 a provided on the syringe 21 to discharge the liquid resin R. The plunger seal portion 23b has an annular structure in which the plunger shaft 23a is inserted in the center, and is combined with the cylindrical syringe body 21b to provide a predetermined space between the syringe lid portion 21a in the syringe body 21b. Use a sealed space. The plunger seal portion 23b includes a seal 23b1 for securing the seal with the edge of the syringe body 21b, a seal 23b2 for maintaining the seal with the plunger shaft 23a, and the inside of the syringe body 21b. A suction path 23b3 for suction is provided. Thereby, in the inside of the syringe 21, an annular sealed space is formed by the syringe lid portion 21a, the syringe body 21b, the plunger shaft 23a, and the plunger seal portion 23b. In a state where such a sealed space is formed, air is sucked by a pipe or a vacuum pump (not shown) through a suction path 23b3 provided in the plunger seal portion 23b, so that the space is decompressed and the syringe lid portion 21a is pulled back. A force for returning the liquid resin R into the syringe 21 can be applied.

  In addition, the syringe 21 is supplied in the apparatus in the state which stored liquid resin R with the syringe main body 21b and the syringe lid | cover part 21a. For this reason, for example, in a state where the unused syringe 21 is set at a position as shown in FIG. 1, the plunger 23 is lowered and the tip of the plunger shaft 23a is inserted into the syringe body 21b. Further, at this time, the plunger seal portion 23b can close the opening at the upper end of the syringe main body 21b, and a force can be applied to return the liquid resin R into the syringe 21 after discharging the appropriate resin. According to this, unintentional discharge of the liquid resin R can be prevented, and even when there is no unintentional discharge, the liquid resin R can be drained by using a force for returning the liquid resin R into the syringe 21.

  Moreover, as a structure which pulls back liquid resin R in the syringe 21, not only the method by the pressure reduction as mentioned above but the structure which pulls back the syringe lid part 21a mechanically can also be used. In this case, the syringe lid 21a can be directly pulled back by the plunger shaft 23a by arbitrarily engaging the tip of the plunger shaft 23a with the syringe lid 21a by screwing or fitting. For example, by providing a male screw at the tip of the plunger shaft 23a and providing a female screw on the main surface of the syringe lid 21a, these can be screwed together. Of course, as long as it can be arbitrarily engaged, the configuration is not limited to such a configuration, and the tip of the plunger shaft 23a may be formed in a T-shape and rotated into a groove provided appropriately in the syringe lid 21a. Good.

22 Nozzle 30 Chamber 30a Inside R Liquid resin W Work (Supply)

Claims (9)

(A) evacuating the interior of the chamber;
(B) discharging the liquid resin from the nozzle to the material to be supplied inside the chamber in a vacuum state;
(C) stopping the discharge of the liquid resin and stopping the evacuation of the interior of the chamber, and then draining the nozzle in the interior of the chamber;
Only including,
In the step (b), the liquid resin is discharged while moving the nozzle in parallel with the supply object . (A) evacuating the interior of the chamber;
(B) discharging the liquid resin from the nozzle to the material to be supplied inside the chamber in a vacuum state;
(C) stopping the discharge of the liquid resin and stopping the evacuation of the interior of the chamber, and then draining the nozzle in the interior of the chamber;
Including
In the syringe filled with the liquid resin connected to the nozzle, the space without the liquid resin is decompressed to generate a force for pulling the liquid resin back into the syringe, and the liquid resin is reduced by the decompression in the chamber. Balancing with the force of withdrawal from the syringe
A resin supply method characterized by the above. In the resin supply method according to claim 1 or 2 ,
In the step (c), after the discharge of the liquid resin is stopped and the evacuation of the inside of the chamber is stopped, the nozzle is reciprocated inside the chamber. In the resin supply method according to any one of claims 1 to 3 ,
In the step (b), the liquid resin is discharged while the weight of the liquid resin is measured by a weight meter provided inside the chamber. (A) a step of discharging a liquid resin from a nozzle to an object to be supplied inside the chamber;
(B) evacuating the interior of the chamber;
(C) stopping the discharge of the liquid resin and stopping the evacuation of the interior of the chamber, and then draining the nozzle in the interior of the chamber;
A resin supply method comprising: Supplying the liquid resin to the material to be supplied using the resin supply method according to claim 1;
A step of heat-pressing with a mold using the material to be supplied and sealing the resin into a predetermined shape;
A resin sealing method comprising: A chamber in which the material to be supplied is set;
A nozzle that discharges a liquid resin toward the material to be supplied, and the nozzle is provided inside the chamber;
A vacuum section for evacuating the interior of the chamber;
A nozzle lifting and lowering drive unit for reciprocating the nozzle;
A control unit for controlling the discharge unit, the vacuum unit, and the nozzle lifting drive unit;
With
In the state where the discharge of the liquid resin from the discharge unit is stopped and the evacuation by the vacuum unit is stopped, the nozzle raising / lowering drive unit is controlled by the control unit to reciprocate the nozzle ,
The chamber includes one and other chamber portions, and a seal portion that seals between the one chamber portion and the other chamber portion, and is configured to be openable and closable.
The discharge part is provided in the one chamber part;
The resin supply apparatus , further comprising a chamber driving unit that moves the one chamber unit forward and backward and translates the other chamber unit . A chamber in which the material to be supplied is set;
A nozzle that discharges the liquid resin toward the supply object, a syringe that is provided at the tip and filled with the liquid resin, and a syringe lid that is provided on the syringe is pressed to discharge the liquid resin. A plunger shaft, and an annular structure into which the plunger shaft is inserted in the center, and in combination with a cylindrical syringe body, a space between the syringe lid portion and the syringe lid portion in the syringe body is a predetermined sealed space. And a plunger seal part provided with a suction path for air suction inside the syringe body, and a discharge part in which the nozzle is provided inside the chamber;
A vacuum section for evacuating the interior of the chamber;
A nozzle lifting and lowering drive unit for reciprocating the nozzle;
A control unit for controlling the discharge unit, the vacuum unit, and the nozzle lifting drive unit;
With
By sucking air through the suction path, the space is decompressed, the syringe lid is pulled back, and a force for returning the liquid resin into the syringe is applied,
In the state where the discharge of the liquid resin from the discharge unit is stopped and the evacuation by the vacuum unit is stopped, the nozzle raising / lowering drive unit is controlled by the control unit to reciprocate the nozzle.
A resin supply device. The resin supply apparatus according to claim 7 or 8 ,
A resin supply apparatus further comprising a weigh scale provided inside the chamber so as to set the supply object and measuring the weight of the discharged liquid resin.

Images