JP6428839B2 - Exposure method, exposure apparatus, and device manufacturing method - Google Patents

Description

The present invention relates to an exposure method for projection exposure of the pattern on the mask onto the plate, relates to an exposure apparatus and a device manufacturing how.

In recent years, thin display panels using elements such as liquid crystal or organic EL (Electro Luminescence) have been widely used as information display devices. These display panels are manufactured by patterning transparent thin film electrodes on a thin glass substrate by a photolithography technique. In this photolithography process, as an apparatus for projecting and exposing a pattern formed on a mask onto a photosensitive substrate (hereinafter also referred to as a plate), an image of the pattern is projected onto the plate using a lens array such as an MLA (Micro Lens Array). There exists an exposure apparatus (for example, patent document 1). In the exposure apparatus described in Patent Document 1, when a pattern image is exposed on a plate, a mask and a wafer, an illumination optical system that illuminates the mask, and an MLA as a projection optical system that projects the pattern image are relative to each other. Displacement is disclosed.

JP-A-9-244255

For example, when a display panel is manufactured, a plurality of patterns are stacked on a plate by repeating pattern exposure and development on one plate. In this case, the exposure apparatus exposes the pattern multiple times on the same plate. Here, the plate to be exposed may expand and contract due to development processing or the like. When the exposure apparatus includes a general projection optical system that transmits and reflects light with an optical member such as a lens or a mirror instead of the MLA, the exposure apparatus copes with a pattern shift caused by expansion and contraction of a plate in a part of the projection optical system. Therefore, some have a mechanism for adjusting the projection magnification and the like.

However, since an exposure apparatus having a lens array as in Patent Document 1 has a configuration in which the distance between the mask and the substrate is narrowed, it is difficult to provide a mechanism for adjusting the projection magnification.
Further, if a mechanism for adjusting the projection magnification is provided between the mask and the substrate in addition to the lens array, the distance between the mask and the substrate is widened, so that the effect obtained by providing the lens array is significantly reduced.

Aspect of the present invention, while using a lens array, an exposure method capable of exposing a more appropriate pattern of the mask on the position of the plate, and an object thereof is to provide an exposure apparatus and device manufacturing how.

According to a first aspect of the present invention, there is provided an exposure method for irradiating a mask with illumination light through an illumination optical system, and transferring a pattern formed on the mask to a plate through a lens array,
A plurality of strip-shaped masks are arranged along a non-scanning direction that is a direction perpendicular to the scanning direction in a direction in which the scanning direction is a longitudinal direction, and the illumination optical system, the lens array, the mask, and the plate, Is moved relatively in the scanning direction along the mask and the plate, the illumination light is irradiated to the pattern from the illumination optical system, and an image of the pattern formed on the mask is passed through the lens array. Projecting onto the plate, and in a non-scanning direction that is perpendicular to the scanning direction during relative movement of the illumination optical system, the lens array, the mask, and the plate in the scanning direction. Changing an interval between the plurality of masks.

According to the second aspect of the present invention, an illumination optical system for irradiating the mask with illumination light, and an image of a pattern formed on the mask illuminated by the illumination optical system are projected onto the plate,
An exposure comprising: a lens array that transfers a pattern formed on the mask to the plate; and a moving device that relatively moves the illumination optical system and the lens array in a scanning direction along the mask and the plate. An apparatus, wherein a plurality of strip-shaped masks are arranged along a non-scanning direction that is a direction perpendicular to the scanning direction in a direction in which a scanning direction is a longitudinal direction, and a non-direction that is perpendicular to the scanning direction. By a mask support mechanism having a mask interval adjustment mechanism for changing the interval between the plurality of masks in the scanning direction, a support base for supporting the mask interval adjustment mechanism, a plate support mechanism for supporting the plate, and the moving device An exposure apparatus comprising: a control device that adjusts intervals of the plurality of masks by the mask interval adjustment mechanism during relative movement. It is.

According to the third aspect of the present invention, the pattern formed on the mask is transferred to a plate by the above exposure method, and the plate to which the pattern is transferred is transferred to the plate based on the transferred pattern. And a device manufacturing method is provided.

According to a fourth aspect of the present invention, there is provided an exposure mask for projecting a pattern onto a plate and transferring the pattern onto the plate, and having a strip-shaped base portion with one long side and the other short side. The base is provided with a mask in which a plurality of pattern regions in which the pattern is formed are formed along the long side, and a shielding region is formed between the pattern regions.

According to the aspect of the present invention, by changing the interval between the plurality of masks in the non-scanning direction orthogonal to the scanning direction and changing the relative position between the mask and the plate, the position of the mask pattern to be projected on the plate can be changed. It can be adjusted according to the deviation of the pattern of the plate. Thus, the mask pattern can be exposed to a more appropriate position on the plate while using the lens array.

FIG. 1 is a side view of the exposure apparatus according to the first embodiment. FIG. 2 is a top view of the mask support mechanism of the exposure apparatus shown in FIG. FIG. 3 is a side view of the mask support mechanism shown in FIG. FIG. 4 is a view of the exposure apparatus according to the first embodiment as seen from between the projection optical system and the plate. FIG. 5 is a view of the exposure apparatus according to the first embodiment when viewed from the direction in which the illumination optical system and the projection optical system move. FIG. 6 is a side view showing a state in which the position detection device is installed in the exposure apparatus shown in FIG. FIG. 7 is a top view showing a state in which the position detection device is installed in the exposure apparatus shown in FIG. FIG. 8 is a side view showing a state in which a mask is arranged in the exposure apparatus shown in FIG. FIG. 9 is a top view showing a state in which the mask of the exposure apparatus shown in FIG. 7 is arranged. FIG. 10 is a flowchart showing an example of the operation of the exposure apparatus according to the first embodiment. FIG. 11 is a flowchart showing an example of the operation of the exposure apparatus according to the first embodiment. FIG. 12 is an explanatory diagram for explaining the operation of the exposure apparatus according to the first embodiment. FIG. 13 is a flowchart showing an example of the operation of the exposure apparatus according to the first embodiment. FIG. 14 is an explanatory diagram for explaining the operation of the exposure apparatus according to the first embodiment. FIG. 15 is an explanatory diagram for explaining the operation of the exposure apparatus according to the first embodiment. FIG. 16 is an explanatory diagram for explaining the operation of the exposure apparatus according to the first embodiment. FIG. 17 is an explanatory diagram for explaining the operation of the exposure apparatus according to the first embodiment. FIG. 18 is a side view of the exposure apparatus according to the second embodiment. FIG. 19 is a side view of the exposure apparatus according to the third embodiment. FIG. 20 is a view of the exposure apparatus according to the third embodiment as seen from between the projection optical system and the plate. FIG. 21 is a view of the exposure apparatus according to the third embodiment as viewed from the direction in which the illumination optical unit and the projection optical system move. FIG. 22 is a flowchart showing each step of the device manufacturing method according to the present embodiment.

DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings.
The present invention is not limited to the embodiments described below. In the following, the lower side is the direction (vertical direction) in which gravity acts, and the upper side is the direction opposite to the direction in which gravity acts.

(Embodiment 1)
The exposure apparatus according to the first embodiment will be described below with reference to FIGS. FIG. 1 is a side view of the exposure apparatus according to the first embodiment. FIG. 2 is a top view of the mask support mechanism of the exposure apparatus shown in FIG. FIG. 3 is a side view of the mask support mechanism shown in FIG. FIG. 4 shows the first embodiment.
It is the figure which looked at the exposure apparatus which concerns on from between the projection optical system and the mask. FIG. 5 is a view of the exposure apparatus according to the first embodiment when viewed from the direction in which the illumination optical system and the projection optical system move. The exposure apparatus 1 uses a micro lens array (MLA) as a projection optical system, and moves (scans) the illumination optical unit and the projection optical system with respect to the mask and the plate (photosensitive substrate), thereby forming a mask pattern on the plate. This is a scanning type exposure apparatus that exposes (mask pattern). Note that the exposure apparatus 1 of the present embodiment supports a mask unit M including a plurality of masks, and exposes a plurality of mask patterns onto a plate, respectively. In the following, the optical axis A of the projection optical system
The Z axis is taken in a direction parallel to XL (see FIG. 1), and X is set in the scanning direction of the illumination optical system and the projection optical system.
An axis is taken, and a Y axis is taken in a direction perpendicular to the Z axis and the X axis. First, the outline of the exposure apparatus 1 will be described.

<Outline of exposure apparatus>
The exposure apparatus 1 includes a frame 1F, an illumination optical system 2, a projection optical system 3, a moving device 21,
including. In the exposure apparatus 1, a light source 6 that outputs light toward the illumination optical system 2 is disposed. The exposure apparatus 1 guides the light emitted from the light source 6 to the mask unit M by the illumination optical system 2, and guides the light that has passed through the mask unit M by the projection optical system 3, thereby changing the pattern of the mask unit M to the plate P. To project. The exposure apparatus 1 is controlled by the control device 9. Further, the exposure apparatus 1 includes a position detection device that detects the position of the pattern formed on the mask unit M and the position of the pattern formed on the plate. The position detection device will be described later.

The frame 1F includes a base 1V, side portions 1W attached to the base 1V, a pair of illumination system guides 5L that support the illumination optical system 2, and a pair of projection system guides 5P that support the projection optical system 3. . The base 1 </ b> V is attached to an installation target (for example, a foundation) of the exposure apparatus 1 and is positioned below the exposure apparatus 1. A side portion 1W is attached to the upper portion of the base portion 1V. A pair of illumination system guides 5L and a pair of projection system guides 5P are attached to the side portion 1W. The illumination system guide 5L and the pair of projection system guides 5P are supported by the side portion 1W with the former disposed above the latter.

The illumination system guide 5L and the projection system guide 5P extend in a direction parallel to the X axis. The pair of illumination system guides 5L and the pair of projection system guides 5P are arranged at a predetermined interval in the Y direction. The illumination optical system 2 is supported by these across the pair of illumination system guides 5L. The illumination optical system 2 moves in the X direction (the direction indicated by the arrow xl in FIG. 1) along the pair of illumination system guides 5L. The projection optical system 3 is supported by these across the pair of projection system guides 5P. Then, the projection optical system 3 moves along the X direction (arrow xp in FIG.
Move in the direction indicated by Since the illumination system guide 5L is disposed above the projection system guide 5P, the illumination optical system 2 is disposed above the projection optical system 3.

<Plate stage>
A plate stage 1S is provided above the base 1V. Plate stage 1S
Puts the plate P to be exposed. In the present embodiment, the plate stage 1S is
The plate P is placed while being held by the holder. The plate stage 1S includes a support part 32 that supports the plate P and a base 34 that supports the support part 32 in a movable state. The base 34 is fixed to the base 1V. The plate stage 1S can move the plate P relative to the frame 1F by moving the support portion 32 that supports the plate relative to the base 34. The plate stage 1S serves as a moving mechanism in which the support portion 32 and the base 34 move the plate P. The plate stage 1S can move the plate P in the scanning direction. That is, the plate stage 1 </ b> S can use various linear actuators as a mechanism for moving the support portion 32 relative to the base 34.

<Mask stage>
The mask stage 1T will be described with reference to FIGS. The mask stage 1T supports the mask unit M. The mask unit M is above the plate stage 1S.
It is supported by the mask stage 1T protruding from the side 1W to the inside of the frame 1F. In the present embodiment, the plate stage 1S is placed and supported while the plate P is held by the holder.

The mask unit M held by the mask stage 1T will be described. Mask unit M
As described above, a plurality of masks, in this embodiment, five masks Ma, Mb, Mc, M
Includes d and Me. In the mask unit M, the masks Ma, Mb, Mc, Md, and Me are arranged in a row on the surface of the mask unit M in a direction orthogonal to the scanning direction, that is, in the Y direction (also referred to as a non-scanning direction). That is, masks Ma, Mb, Mc, Md, and Me are arranged adjacent to each other in the Y direction. The masks Ma, Mb, Mc, Md, and Me have basically the same configuration except for the arrangement positions. Therefore, the mask Ma will be described below as a representative. The mask Ma has a long side (longitudinal direction) in the scanning direction and a short side (short direction) in the Y direction.
This is a rectangular shape. The mask Ma has a plurality of pattern regions 50 formed on a rectangular base. The pattern area 50 is an area where a transfer pattern is formed, and is arranged in a row in the scanning direction. The mask Ma is between the pattern area 50 and the pattern area on the base,
A shielding area 52 for shielding the illumination light is arranged. As described above, the mask Ma has the pattern areas 50 and the shielding areas 52 alternately arranged at the base in the scanning direction, and the shielding areas 52 are arranged between the adjacent pattern areas 50. The shielding region 52 is a region where a transfer pattern is not formed, and a film that does not substantially transmit illumination light, such as a chromium film, is formed.

The mask unit M includes masks Ma to M in which a plurality of pattern regions 50 are arranged in the scanning direction.
e is arranged in parallel in the non-scanning direction. Here, in the plurality of pattern regions 50 included in the masks Ma to Me, it is preferable that one pattern region 50 be a mask pattern for constituting a TFT array substrate of a small-sized liquid crystal display panel. On the masks Ma to Me, for example, a pattern for constituting a TFT array substrate of a medium-sized liquid crystal display panel is drawn. Medium and small liquid crystal panels are, for example, 10 inches (205.2 mm wide x 153.9 m long)
m) A liquid crystal panel having a screen size of up to about. Since the exposure apparatus 1 of the present embodiment performs the same size exposure as described later, the pattern region 50 corresponding to one liquid crystal panel has the same size. Accordingly, one pattern region 50 has a size of 205.2 mm wide × 153.9 mm long or less. In the masks Ma to Me, a plurality of pattern regions 50 having these sizes are arranged in the scanning direction. The size of the masks Ma to Me is, for example, 160 mm wide × 700 mm long × 10 mm thick. Further, the masks Ma to Me of the present embodiment have the same shape as the pattern formed in the pattern region. Thereby, the mask unit M can transfer a plurality of the same patterns onto the plate P.

As shown in FIGS. 1 and 2, the mask stage 1 </ b> T includes a support base 40 and a plurality of mask interval adjustment mechanisms 41. The support base 40 is fixed to the side portion 1W. The support base 40 of this embodiment is one member connected to the side portion 1W. The mask interval adjustment mechanism 41 is installed on the support base 40. The mask interval adjusting mechanism 41 is installed for each of the masks Ma to Me included in the mask unit M. The mask interval adjustment mechanism 41 is
It is installed at both ends of each mask Ma-Me. That is, the mask stage 1T is
Two mask interval adjustment mechanisms 41 are provided corresponding to one mask Ma to Me, respectively. Therefore, the mask stage 1T of the present embodiment has ten mask interval adjustment mechanisms 4.
1 is installed.

The mask interval adjustment mechanism 41 includes a support portion 42 that supports a corresponding mask among the masks Ma to Me, and a base 44 that supports the support portion 42 in a movable state. The base 44 is fixed to the support base 40. The mask interval adjusting mechanism 41 can move the mask relative to the frame 1F by moving the support portion 42 that supports the mask with respect to the base 44. The mask interval adjusting mechanism 41 can move the mask in the Y direction, that is, in the direction of the arrow 45. Here, the Y direction is a direction orthogonal to the X direction, which is the scanning direction, in a plane parallel to the surfaces of the mask unit M and the plate P, and can be said to be a non-scanning direction. The mask interval adjusting mechanism 41 can use various linear actuators. That is, the support part 4
Various mechanisms can be used as a mechanism for moving 2 with respect to the base 44. In addition,
In the present embodiment, the mask Mc is the center of the mask unit M in the Y direction. For this reason, the mask interval adjustment mechanism 41 arranged corresponding to the mask Mc does not move the mask Mc in the Y direction. Note that the exposure apparatus 1 may move the mask at the center of the mask unit M in the Y direction.

The mask stage 1T can independently adjust the positions of the masks Ma to Me in the Y direction by providing the mask interval adjustment mechanism 41 corresponding to the masks Ma to Me. Thereby, the mask stage 1T can change the position of each of the masks Ma to Me in the Y direction, and can change the interval between the masks Ma to Me and the adjacent mask.

The exposure apparatus 1 supports the mask unit M using the mask stage 1T and supports the plate P using the plate stage 1S, so that the plate P is placed in a state of being opposed to the mask unit M supported by the mask stage 1T. Support. While the mask pattern is projected and exposed onto the plate P, the mask unit M is air adsorbed and fixed by a vacuum chuck provided on the mask stage 1T. When the mask unit M is replaced, the air suction is released and the mask unit M can be replaced with a desired mask unit M. The mask unit M is disposed above the plate P. When exposing the plate P, the plate P is disposed at the bottom, and the projection optical system 3, the mask unit M, and the illumination optical system 2 are disposed in this order upward. The illumination optical system 2 and the projection optical system 3 project and expose the mask pattern onto the plate P while moving in the X direction in synchronization.

The exposure apparatus 1 includes a moving device 21. The moving device 21 includes a support unit 22 that supports the illumination optical system 2 and the projection optical system 3, and the support unit 22 is used as the illumination system guide 5 </ b> L and the projection system guide 5.
By moving in the X direction along P, the illumination optical system 2 and the projection optical system 3 are moved to the illumination system guide 5.
Move in the X direction along L and the projection system guide 5P. That is, the moving device 21 moves the illumination optical system 2 and the projection optical system 3 in the X direction by moving the support unit 22 in the direction along the surfaces of the mask unit M and the plate P. Further, the moving device 21 supports the light source 6 by the support portion 22, and moves the light source 6 together with the illumination optical system 2 and the projection optical system 3.

The exposure apparatus 1 includes a support stage 40 for the mask stage 1T and a base 34 for the plate stage 1S.
Is attached and fixed to the frame 1F. Thereby, the exposure apparatus 1 can make the position of the mask unit M and the plate P with respect to the frame 1F a predetermined position.
The illumination optical system 2 and the projection optical system 3 project and expose the mask pattern onto the plate P while moving in the X direction with respect to the mask stage 1T and the plate stage 1S. The illumination optical system 2 and the projection optical system 3 move in the X direction with respect to the mask stage 1T and the plate stage 1S when projecting and exposing the mask pattern onto the plate P.

<Illumination optics>
The illumination optical system 2 guides the light emitted from the light source 6 and enters it as light for illuminating the mask unit M. The exposure apparatus 1 includes a plurality of light sources 6. In addition, the exposure apparatus 1 should just be provided with two or more output parts which output light, and you may implement | achieve the several light source 6 with one apparatus. In the present embodiment, the light source 6 is a laser light source, but is not limited thereto. The illumination optical system 2 includes partial illumination optical units 10L and 10R that form the illumination fields SR and SL shown in FIG. 4, and a partial illumination optical unit 10C that forms the illumination field SC. The light output from the light source 6 is incident on the partial illumination optical units 10 </ b> L and 10 </ b> R, and the relay optical system 12 projects the emission end surface of the light source 6 onto the incident surface of the fly-eye lens 13. At this time, the relay optical system 12 enlarges the exit end face of the light source 6 to a predetermined multiple and projects it onto the entrance face of the fly-eye lens 13. The fly-eye lens 13 has a plurality of element lenses arranged and joined. In the present embodiment, eight element lenses are arranged in the column direction and ten element lenses are arranged in the row direction, and a total of 80 elements are joined.

The light emitted from the fly-eye lens 13 passes through the σ stop 14. The σ stop 14 determines the illumination NA by limiting the diameter of light. The light that has passed through the σ stop 14 has two condenser lenses 15.
Then, the light is condensed on the surface of the mask unit M (surface on the illumination optical system 2 side) via the mirror 16 to form an illumination field. The incident surface of the fly-eye lens 13 and the surface of the mask unit M have a conjugate relationship, and the illuminance distribution on the incident surface of the fly-eye lens 13 is the fly-eye lens 13.
Each element lens is overlapped and averaged, and a uniform illuminance distribution is obtained on the surface of the mask unit M. The illumination fields SR and SL shown in FIG. 4 are formed on the surface of the mask unit M by such partial illumination optical units 10L and 10R. The partial illumination optical unit 10C that forms the illumination field SC also has the same structure as the partial illumination optical units 10L and 10R, except that the arrangement of the condenser lens 15 and the mirror 16 is different.

<Projection optical system>
Next, the projection optical system 3 will be described in more detail. The projection optical system 3 is an optical system for forming an image of the mask pattern on the surface of the plate P and projecting it. The projection optical system 3 includes a mask unit M supported by the mask stage 1T and a plate P supported by the plate stage 1S.
The image of the pattern formed on the mask unit M is projected onto the plate P. In the present embodiment, the projection optical system 3 forms an image of the mask pattern on the surface of the plate P and projects it using an imaging optical system using a microlens array. A microlens array is an imaging element in which a number of element lenses are two-dimensionally arranged. The projection optical system includes a plurality of micro lens arrays (MLA).
8. As shown in FIGS. 1 and 4, the MLA 8 is a stage 3 </ b> S of the projection optical system 3.
Mounted on. As the stage 3S moves along the projection system guide 5P, the MLA 8
Moves in the X direction. Although the projection optical system 3 of the present embodiment uses the MLA 8, a lens array other than the micro lens array can be used. The stage 3 </ b> S that supports the projection optical system 3 becomes a part of the support unit 22.

In the present embodiment, MLA8R, MLA8C, and MLA8L are arranged at positions corresponding to the illumination fields SR, SC, and SL formed by the illumination optical system 2, respectively. Hereinafter, when MLA8R, MLA8C, and MLA8L are not distinguished, they are simply referred to as MLA8. In the present embodiment, the illumination visual fields SR, SC, SL are arranged in a staggered manner with a predetermined distance from each other in the X direction toward the Y direction. In this way, MLA8R, MLA8C, M
Since LA8L is also arranged in a staggered pattern in the Y direction, these interferences can be avoided. As a result, the illumination visual field in the Y direction can be enlarged. Because MLA8 is thin,
The projection optical system 3 is also thinned.

The exposure apparatus 1 also includes a distance meter that measures the distance between the mask stage 1T and the plate stage 1S as a detection unit. The exposure apparatus 1 can detect the distance between the mask unit M and the plate P by measuring the distance between the mask stage 1T and the plate stage 1S with a distance meter. The exposure apparatus 1 projects and exposes a mask pattern onto the plate P.
Based on the distance between the mask unit M and the plate P measured by the distance meter, the mask stage 1
The relative position of T and the plate stage 1S in the optical axis direction is adjusted. Thereby, the exposure apparatus 1
Can correctly arrange the mask and the plate at the in-focus position of the projection lens (in this embodiment, the MLA 8 included in the projection optical system 3). The exposure apparatus 1 can correct a focus shift caused by the variation in the thickness of the plate P, and can suppress a decrease in exposure performance.

The exposure apparatus 1 also includes a measurement system that measures position information of each stage. As the measurement system, a measurement system that measures position information of each stage using an interferometer system including a laser interferometer may be used, or an encoder system that detects a scale (diffraction grating) provided in each stage. May be used.

Next, the position detection device 80 will be described with reference to FIGS. FIG. 6 is a side view showing a state in which the position detection device is installed in the exposure apparatus shown in FIG. FIG. 7 is a top view showing a state in which the position detection device is installed in the exposure apparatus shown in FIG. FIG. 8 is a side view showing a state in which a mask is arranged in the exposure apparatus shown in FIG. FIG. 9 is a top view showing a state in which the mask of the exposure apparatus shown in FIG. 7 is arranged. The exposure apparatus 1 includes a plurality of position detection devices 80 as described above. In the exposure apparatus 1, a position detection device 80 is arranged corresponding to each of the masks Ma to Me. Further, in the exposure apparatus 1, position detection devices 80 are disposed in the vicinity of both ends in the scanning direction of the masks Ma to Me, respectively.
That is, in the exposure apparatus 1, as with the mask interval adjustment mechanism 41, two position detection devices 80 are arranged for each of the five masks Ma to Me, and a total of ten position detection devices 80 are arranged. .

In the exposure apparatus 1 of the present embodiment, each of the five position detection devices 80 arranged at one end in the scanning direction of the region where the masks Ma to Me are arranged is referred to as a position detection device 80a, and the other end. Each of the five position detection devices 80 arranged in FIG. The position detection devices 80a and 80b are devices that detect the position of the pattern region 50 formed in each of the corresponding masks Ma to Me of the mask unit M and the position of the pattern that has already been exposed and developed on the plate P. . In the position detection device 80a, a portion in the detection area 89a of the masks Ma to Me or the plate P is a detection target area. Position detection device 80b
In the masks Ma to Me or the portion of the plate P in the detection area 89b, the detection target area is set.

The five position detection devices 80a are supported by the support portion 86a. The support portion 86a is movable in the scanning direction along the rail 87a. The support part 86a can move from a position facing the masks Ma to Me on the XY plane to a position not facing by moving along the rail 87a. The five position detection devices 80b are supported by the support portion 86b.
The support portion 86b is movable in the scanning direction along the rail 87b. The support part 86b can move from the position facing the masks Ma to Me on the XY plane to the position not facing by moving along the rail 87b. The exposure apparatus 1 includes position detection devices 80a and 80a.
By moving b to a position where it does not face the masks Ma to Me, the masks Ma to Me can be attached to and detached from the mask stage. As a result, the exposure apparatus 1 performs the steps shown in FIGS.
It is possible to switch between a state where the masks Ma to Me are not arranged on the mask stage and a state where the masks Ma to Me are arranged on the mask stage as shown in FIGS.

The position detection devices 80a and 80b detect masks Ma to Me and marks formed on the plate P, so-called alignment marks, and detect the positions of the respective patterns. The position detection device 80 is a so-called alignment microscope, and includes a light source 81, an image detection unit 82, and an index 8.
3, a beam splitter 84, and an optical system 85. The light source 81 is a light emission source that outputs light, and outputs light having a wavelength that the plate P does not sensitize. The image detection unit 82 is a device that reads an image such as a CCD. The index 83 is disposed on the optical path of the light output from the light source 81. Specifically, it is disposed between the light source 81 and the beam splitter 84. Indicator 8
Reference numeral 3 denotes a plate-like member that has a predetermined shape at a portion that transmits light, and the other portion that blocks light. The light output from the light source 81 is light having a predetermined shape. The predetermined shape is a reference shape, and includes a line segment, a curve, a circle, a cross, and the like. The beam splitter 84 reflects part of light and transmits part of light. The beam splitter 84 reflects a part of the light that has passed through the index 83, and transmits a part of the light reflected by the masks Ma to Me or the plate P in the detection regions 89a and 89b. The optical system 85 is disposed between the beam splitter 84 and the detection areas 89a and 89b. The optical system 85 guides the light reflected by the beam splitter 84 to a predetermined position of the detection areas 89a and 89b, and guides the light reflected by the detection areas 89a and 89b to a predetermined position of the beam splitter 84. The optical system 85 includes an objective lens and the like. The light reflected by the masks Ma to Me or the plate P in the detection regions 89 a and 89 b and passing through the optical system 85 and the beam splitter 84 enters the image detection unit 82.

The light output from the light source 81 passes through the index 83 and has a predetermined shape, is reflected by the beam splitter 84, passes through the optical system 85, and reaches the detection areas 89a and 89b. The light reaching the detection areas 89a and 89b is reflected by the detection areas 89a and 89b, passes through the optical system 85 and the beam splitter 84, and reaches the image detection unit 82. As a result, the position detecting device 80
a and 80b are the shape of the light processed into a predetermined shape by the index 83 and the detection areas 89a and 89b.
The positions of the alignment marks formed on the masks Ma to Me or the plate P are specified by comparing the specific patterns formed on the masks Ma to Me or the plate P in FIG. The position detection devices 80a and 80b only need to be able to specify the position of the pattern formed on the masks Ma to Me or the plate P, and various mechanisms can be used as the detection mechanism.

Here, the position detection devices 80a and 80b move the position of the optical system 85 in the optical axis direction to adjust the focus to the mask position or the plate position. The position detection devices 80a and 80b
The index 83 is projected onto the detection areas 89a and 89b, and the positions of the alignment marks in the detection areas 89a and 89b are detected using the position of the index 83 as a reference. Thereby, the influence by the drive error of the optical system 85 can be avoided. It is preferable that the movement stroke of the optical system 85 in the optical axis direction is equal to or longer than the distance between the mask surface (pattern surface) and the plate surface. Thereby, the focus can be adjusted to an appropriate position.

<Exposure method>
Next, an exposure method will be described with reference to FIGS. The exposure method according to the present embodiment can be realized by the exposure apparatus 1. FIG. 10 is a flowchart showing an example of the operation of the exposure apparatus according to the first embodiment. Note that neither the mask unit M nor the plate P is installed in the exposure apparatus 1 before the start of the processing of FIG. The exposure apparatus 1 can realize the processing shown in FIG. 10 by controlling the operation of each unit by the control device 9.

The exposure apparatus 1 installs a plate as step S110. That is, the exposure apparatus 1
The target plate P to be processed is placed on the plate stage 1S. The exposure apparatus 1 installs the plate P on the plate stage 1S by a plate supply apparatus or the like. As a result, in the exposure apparatus 1, as shown in FIGS. 8 and 9, the plate P is installed on the plate stage 1S. When the plate is set on the plate stage 1S, the exposure apparatus 1 performs step S1.
12, the position of the plate P is detected. The exposure apparatus 1 acquires images of portions of the plate P included in the detection areas 89a and 89b by the position detection devices 80a and 80b, and acquires the positions and shapes of the alignment marks formed on the plate P. The exposure apparatus 1 detects the position of the pattern formed on the plate P from the position and shape of the acquired alignment mark.
The exposure apparatus 1 can detect the position of the alignment mark by comparing the alignment mark with the index image projected onto the plate P.

When the position of the plate is detected in step S112, the exposure apparatus 1 installs a mask in step S114. Specifically, the exposure apparatus 1 retracts the position detection devices 80a and 80b from the area where the mask unit M is disposed. Thereafter, the exposure apparatus 1 installs the masks Ma to Me to be used on the corresponding support portion 42 of the mask stage 1T by using a mask supply device or the like. When the masks Ma to Me are installed, the exposure apparatus 1 adsorbs air with a vacuum chuck. The exposure apparatus 1 may install the masks Ma to Me one by one, or may move the masks Ma to Me included in the mask unit M together and install them simultaneously. As a result, the exposure apparatus 1 is in a state where the plate P is installed on the plate stage 1S and the mask unit M is installed on the mask stage 1T, as shown in FIGS.

When the exposure apparatus 1 installs the mask on the mask stage in step S114, the exposure apparatus 1 performs step S114.
The position of the mask is detected as 116. The exposure apparatus 1 moves the support portions 86a and 68b to move the position detection devices 80a and 80b to positions facing the masks Ma to Me. The exposure apparatus 1 includes a mask Ma included in the detection areas 89a and 89b by the position detection devices 80a and 80b.
The image of the part of ~ Me is acquired, and the position and shape of the alignment mark formed on the masks Ma to Me are acquired. The exposure apparatus 1 detects the position of the pattern region 50 formed on the masks Ma to Me from the acquired position and shape of the alignment mark. The exposure apparatus 1 can detect the position of the alignment mark by comparing the alignment mark with the index image projected onto the masks Ma to Me.

After detecting the position of the mask in step S116, the exposure apparatus 1 detects the relative positional relationship between the mask and the plate in step S118. Specifically, the exposure apparatus 1 detects the relative position between the position of the plate pattern detected by the position detection devices 80a and 80b and the position of the pattern area 50 of the mask. When the relative position relationship is detected in step S118, the exposure apparatus 1 determines a position correction amount at the time of exposure based on the relative position relationship in step S120.
Specifically, the exposure apparatus 1 detects the relative position between the mask and the plate, where the mask pattern overlaps the exposed pattern when the pattern P is exposed to the plate P for the second and subsequent times. The amount of movement to be moved to the position is defined as a position correction amount. The position correction amount includes at least an interval in the non-scanning direction of the mask that can be adjusted by the mask interval adjustment mechanism 41. The position correction amount includes the position in the scanning direction of the plate P that can be moved by the plate stage 1S. Exposure device 1
The plate stage 1S moves the plate P in the scanning direction, so that the relative position between the mask and the plate in the scanning direction can be adjusted. At the time of exposure, it is preferable to calculate for each relative position of the illumination optical system 2 and projection optical system 3 and the mask or plate, that is, for each position of the support portion 22 in this embodiment. Thereby, the relative position of the mask and the plate can be corrected for each position of the plate P, and the pattern of the mask can be projected to a more appropriate position on the plate.

After determining the position correction amount in step S120, the exposure apparatus 1 adjusts the mask interval in step S122. The exposure apparatus 1 uses a mask interval adjustment mechanism 41 to perform a mask M
A to Me are moved by the calculated position correction amount. Thus, the exposure apparatus 1 changes the mask interval by moving the mask to a position corresponding to the first exposure position on the installed plate P.

After adjusting the mask interval in step S122, the exposure apparatus 1 performs exposure in step S124. The exposure apparatus 1 moves the position detection devices 80a and 80b to positions that do not interfere with the exposure process. When the projection exposure is started, the exposure apparatus 1 moves (scans) the illumination optical system 2 and the projection optical system 3 in the X direction with respect to the mask and the plate. The exposure apparatus 1 is, for example,
By moving the illumination optical system 2 and the projection optical system 3 by the moving device 21, the illumination optical system 2 and the projection optical system 3 are scanned with respect to the mask unit M and the plate P. Accordingly, the exposure apparatus 1 transfers the pattern formed on the mask unit M to the plate P. In addition,
The exposure apparatus 1 does not have to move the illumination optical system 2 and the projection optical system 3 over the entire area in the X direction.

Next, an example of an operation for adjusting the mask interval performed by the exposure apparatus 1 during exposure will be described with reference to FIGS. 11 and 12. FIG. 11 is a flowchart showing an example of the operation of the exposure apparatus according to the first embodiment. FIG. 12 is an explanatory diagram for explaining the operation of the exposure apparatus according to the first embodiment.

In step S130, the exposure apparatus 1 starts relative movement of the mask, the plate, the illumination optical system, and the projection optical system. The exposure apparatus 1 of the present embodiment starts moving the illumination optical system 2 and the projection optical system 3 in the scanning direction by the moving device 21. After starting the relative movement in step S130, the exposure apparatus 1 determines whether the illumination position is a shielding area as step S132. Here, the illumination position is a position that becomes an illumination visual field. That is, the exposure apparatus 1 determines whether the mask area irradiated with the illumination light is the mask shielding area 52, that is, whether the illumination visual field does not include the pattern area 50.

In the exposure apparatus 1, the illumination position is a shielding area in step S132 (Y in step S132).
es), the process proceeds to step S134. If it is determined in step S132 that the illumination position is not a shielding area (No in step S132), the process proceeds to step S136.

If the exposure apparatus 1 determines Yes in step S132, as step S134,
Adjust the mask spacing. The exposure apparatus 1 uses a mask interval adjustment mechanism 41 to perform a mask Ma.
-Me is moved by the calculated position correction amount. Here, the exposure apparatus 1 moves the masks Ma to Me based on the position correction amount calculated with respect to the pattern region 50 through which the illumination field (illumination position) passes next to the shielding region 52 through which the illumination field of view (illumination position) currently passes. Let The exposure apparatus 1 is a mask Ma
The distance between the masks is changed by moving ~ Me. The exposure apparatus 1 has a position correction amount of 0.
In this case, the mask is not moved, that is, the mask interval is not changed. The exposure apparatus 1 may not change the mask interval depending on the shielding area. Note that the position correction amount is 0 when the intervals between the patterns formed on the plates corresponding to the pattern areas sandwiching the shielding area are the same. As described above, when transferring the pattern formed on the mask of the mask unit M, the exposure apparatus 1 may perform adjustment without changing the mask interval depending on the pattern area of the mask. After adjusting the mask interval in step S134, the exposure apparatus 1 proceeds to step S136.

When it is determined No in step S132 or when the process of step S134 is executed, the exposure apparatus 1 determines whether the exposure is completed as step S136. That is, the exposure apparatus 1 determines whether the transfer of the patterns of the masks Ma to Me to the plate P has been completed. The exposure apparatus 1 is, for example, the case where the support unit 22 is moved to the end of the moving range by the moving device 21, or
When the illumination field of view is moved to the edge of the mask in the scanning direction, it is determined that the exposure is completed.
If the exposure apparatus 1 determines in step S136 that the exposure has not ended (No in S136), the exposure apparatus 1 returns to step S132, and executes the processes in and after step S132 again. If the exposure apparatus 1 determines that the exposure is completed in step S136 (Yes in S136), the exposure apparatus 1 ends this process.

The plate P1 shown in FIG. 12 shows an example of a state where the pattern of the mask unit M is transferred. In the plate P1, the pattern 60 corresponding to one pattern region 50 is “F”.
Is shown. The exposure apparatus 1 can form the pattern 60 with the arrangement of the plates P1 by transferring the pattern with the gap between the masks widened each time it passes through the shielding region 52 of the mask unit M. In addition, the plurality of patterns 60 formed on the plate P1 are spaced apart from the adjacent patterns 60 in the non-scanning direction as they go from one end in the scanning direction to the other end in the scanning direction. The plate P1 has the smallest interval 62 between the patterns 60a formed at one end of the pattern 60, and the largest interval 64 between the patterns 60b formed at the other end of the pattern 60. Note that the mask interval at the time of exposure is not limited to a simple increase. The exposure apparatus 1 may be adjusted based on the detected position of the plate pattern so that the mask pattern overlaps the plate pattern.

As described above, the exposure apparatus 1 can adjust the interval between the mask and the mask with the mask interval adjustment mechanism 41. Thereby, in the non-scanning direction, the position on the plate P where the pattern of the pattern region 50 is formed can be changed depending on the position of the plate in the scanning direction. The exposure apparatus 1 can change the distribution of the area where the pattern area is transferred to the entire plate P by adjusting the distance between the masks. Thereby, it is possible to reduce the influence of the difference in size between the pattern formed on the plate in the exposure apparatus 1 and the pattern formed on the mask, and the pattern of the pattern region 50 is placed at an appropriate position on the plate P. Can be transferred. The position of the pattern formed on the mask is also the position of the image formed on the plate by the pattern formed on the mask.

The exposure apparatus 1 can also be used when the plate expands and contracts with respect to a reference size and the mask size projected on the plate is shifted from the size of the pattern formed on the plate. By adjusting the interval, the pattern deviation can be suppressed. More specifically, when the mask unit is a single mask, when the plate expands and contracts,
The amount of deviation between the pattern of the plate and the pattern projected from the mask increases toward the end of the plate in the non-scanning direction. On the other hand, the exposure apparatus 1 can individually adjust the position of the mask of the mask unit. As a result, the amount of misalignment between the mask and the plate can be individually adjusted, and the pattern area in the non-scanning direction can be projected with a small shift on the corresponding plate pattern.

The exposure apparatus 1 is not limited to the process of FIG. 11, and the mask Ma to Me may be moved in the Y direction by the mask interval adjustment mechanism 41 while the pattern region 50 is irradiated with illumination light. In this case, the exposure apparatus 1 may move the masks Ma to Me in the Y direction at a set constant speed, or may change the moving speed of the masks Ma to Me. It should be noted that the amount of movement of the masks Ma to Me in the Y direction by the mask interval adjusting mechanism 41 (the adjustment amount of the mask interval) is preferably about 30 μm.

The exposure apparatus 1 makes it easy to install the mask by making the position detection devices 80a and 80b movable on the XY plane and retracting from the arrangement area of the mask M.

Next, an example of an operation for adjusting the mask interval performed by the exposure apparatus 1 during exposure will be described with reference to FIGS. FIG. 13 is a flowchart showing an example of the operation of the exposure apparatus according to the first embodiment.

In step S140, the exposure apparatus 1 determines the relative movement speed of the mask and the plate in the scanning direction based on the position correction amount. After determining the relative movement speed in step S140, the exposure apparatus 1 starts relative movement between the mask and plate, the illumination optical system, and the projection optical system in step S142. The exposure apparatus 1 of the present embodiment starts moving the illumination optical system 2 and the projection optical system 3 in the scanning direction by the moving device 21. After starting the relative movement in step S142, the exposure apparatus 1 starts the relative movement between the mask and the plate in step S144. Specifically, the exposure apparatus 1 moves the plate P in the scanning direction by moving the support portion 32 of the plate stage 1 </ b> S in the scanning direction with respect to the base 34. The mask does not move in the scanning direction. Thereby, the exposure apparatus 1 can relatively move the plate P and the mask in the scanning direction. Further, by setting the moving speed of the plate P to the above-described relative moving speed, the plate P and the mask can be moved at a relative moving speed in the scanning direction.

When the relative movement between the mask and the plate is started in step S144, the exposure apparatus 1 determines in step S146 whether the exposure is completed. That is, the exposure apparatus 1 determines whether the transfer of the patterns of the masks Ma to Me to the plate P has been completed. The exposure apparatus 1 performs step S
If it is determined in 146 that the exposure has not ended (No in S146), the process returns to step S146, and the process of step S146 is executed again. If it is determined in step S136 that the exposure is complete (Yes in S146), the exposure apparatus 1 ends this process.

Hereinafter, an example of a pattern transferred to a plate when the mask and the plate are relatively moved will be described with reference to FIGS. FIG. 14 is an explanatory diagram for explaining the operation of the exposure apparatus according to the first embodiment. FIG. 15 is an explanatory diagram for explaining the operation of the exposure apparatus according to the first embodiment. FIG. 16 is an explanatory diagram for explaining the operation of the exposure apparatus according to the first embodiment. FIG. 17 is an explanatory diagram for explaining the operation of the exposure apparatus according to the first embodiment.

FIG. 14 shows a case where the mask and the pattern are not moved relatively. An arrow 79 shown in FIG. 14 indicates an arrangement region when the plate P is arranged at a reference position in the present embodiment. Further, in the exposure apparatus shown in FIG. 14, the moving device 21 moves the illumination optical system 2 and the projection optical system 3 from the positive direction in the X direction, from left to right in the drawing. This also applies to FIGS. 15 and 16.

In this case, when the exposure is started, the exposure apparatus 1 moves the illumination optical system 2 and the projection optical system 3 in the positive direction of the X direction by the moving device 21, and passes the position of step S1. The exposure apparatus 1 projects a mask pattern onto a part of the left side of the plate P in the scanning direction when passing through the position of step S1. On the plate P, the pattern is transferred to the region 70 where the light passing through the mask has reached.

Thereafter, the exposure apparatus 1 moves the illumination optical system 2 and the projection optical system 3 in the positive direction of the X direction by the moving device 21 and moves from the position of step S1 to the position of step S2. The exposure apparatus 1 projects a mask pattern onto a part of the center of the plate P in the scanning direction when passing through the position of step S2. On the plate P, the pattern is transferred to the region 72 where the light passing through the mask has reached.

Thereafter, the exposure apparatus 1 moves the illumination optical system 2 and the projection optical system 3 in the positive direction of the X direction by the moving device 21 and moves from the position of step S2 to the position of step S3. The exposure apparatus 1 projects a mask pattern onto a part of the right side of the plate P in the scanning direction when passing through the position of step S3. On the plate P, the pattern is transferred to the region 74 where the light passing through the mask has reached.

The exposure apparatus 1 includes an illumination optical system 2 and a projection optical system 3 as in steps S1 to S3.
Is moved in the positive direction of the X direction, and the pattern of the mask unit M is transferred to the plate P.
A plate P2 shown in FIG. 14 shows an example of a state where the pattern of the mask unit M is transferred. Here, in FIG. 14, the mask and the plate P are not moved relative to each other. For this reason, the plate P2 has an interval 76 between the region 70 and the region 72 and an interval 7 between the region 72 and the region 74.
8 is the same distance as the movement distance of the illumination optical system 2 and the projection optical system 3 when the area is exposed from the corresponding area. In FIG. 14, only the regions 70, 72, and 74 are shown to show the relationship between the regions 70, 72, and 74 to which the pattern is transferred in steps S 1, S 2, and S 3
The area where the pattern is transferred moves in the scanning direction along with the movement of the illumination optical system 2 and the projection optical system 3, and a pattern is formed over the entire scanned area.

FIG. 15 shows a case where the pattern moves in the scanning direction with respect to the mask. In this case, when the exposure is started, the exposure apparatus 1 moves the illumination optical system 2 and the projection optical system 3 in the positive direction of the X direction by the moving device 21, and passes the position of step S11. The exposure apparatus 1 projects a mask pattern onto a part of the left side of the plate P in the scanning direction when passing the position of step S11. For this reason, the plate P has a region 70a where light that has passed through the mask has reached.
The pattern is transferred to. The plate P in step S11 is outside the range indicated by the arrow 79 in the left part of the drawing.

Thereafter, the exposure apparatus 1 moves the illumination optical system 2 and the projection optical system 3 in the positive direction of the X direction by the moving device 21 and moves from the position of step S11 to the position of step S12. Further, the exposure apparatus 1 moves the plate P in the positive direction of the X direction by the plate stage 1S and moves it from the position of step S11 to the position of step S12. Thereby, the plate P of step S12 is arranged within the range indicated by the arrow 79. The exposure apparatus 1
A mask pattern is projected onto a portion of the center of the plate P in the scanning direction when passing the position of step S12. On the plate P, the pattern is transferred to the region 72a where the light passing through the mask has reached.

Thereafter, the exposure apparatus 1 moves the illumination optical system 2 and the projection optical system 3 in the positive direction of the X direction by the moving device 21, and moves from the position of step S12 to the position of step S13. Further, the exposure apparatus 1 moves the plate P in the positive direction of the X direction by the plate stage 1S and moves it from the position of step S12 to the position of step S13. As a result, the plate P in step S13 is outside the range indicated by the arrow 79 on the right side in the drawing.
The exposure apparatus 1 projects a mask pattern onto a part of the right side of the plate P in the scanning direction when passing through the position of step S13. The plate P has a region 7 where light that has passed through the mask has reached.
The pattern is transferred to 4a.

The exposure apparatus 1 moves the illumination optical system 2 and the projection optical system 3 in the positive direction of the X direction while moving the plate P in the positive direction of the X direction as in steps S11 to S13.
The pattern of the mask unit M is transferred to the plate P. A plate P3 shown in FIG. 15 shows an example of a state where the pattern of the mask unit M is transferred. In FIG. 15, the pattern is moved in the scanning direction with respect to the mask. As a result, the plate P3 becomes the region 70
The distance 76a between the area a and the area 72a and the distance 78a between the area 72a and the area 74a are shorter than the moving distance of the illumination optical system 2 and the projection optical system 3 when the area is exposed from the corresponding area. Become. That is, the plate P3 has a shorter area on which the mask pattern is projected.

FIG. 16 shows a case where the pattern moves in the direction opposite to the scanning direction with respect to the mask. In this case, the exposure apparatus 1 causes the illumination optical system 2 to be moved by the moving device 21 when exposure is started.
Then, the projection optical system 3 is moved in the positive direction of the X direction, and passes the position of step S21. The exposure apparatus 1 projects a mask pattern onto a part of the left side of the plate P in the scanning direction when passing through the position of step S21. Therefore, the pattern is transferred from the plate P to the region 70b where the light passing through the mask has reached. In addition, the plate P in step S21 is outside the range indicated by the arrow 79 on the right side in the drawing.

Thereafter, the exposure apparatus 1 moves the illumination optical system 2 and the projection optical system 3 in the positive direction of the X direction by the moving device 21 and moves from the position of step S21 to the position of step S22. Further, the exposure apparatus 1 moves the plate P in the negative direction of the X direction by the plate stage 1S, and moves it from the position of step S21 to the position of step S22. Thereby, the plate P of step S22 is arranged within the range indicated by the arrow 79. The exposure apparatus 1
A mask pattern is projected onto a part of the center of the plate P in the scanning direction when passing the position of step S22. On the plate P, the pattern is transferred to the region 72b where the light passing through the mask has reached.

Thereafter, the exposure apparatus 1 moves the illumination optical system 2 and the projection optical system 3 in the positive direction of the X direction by the moving device 21 and moves from the position of step S22 to the position of step S23. Further, the exposure apparatus 1 moves the plate P in the negative direction of the X direction by the plate stage 1S to move from the position of step S22 to the position of step S23. Thereby, the plate P of step S23 is outside the range indicated by the arrow 79 in the left part of the drawing.
The exposure apparatus 1 projects a mask pattern onto a part of the right side of the plate P in the scanning direction when passing through the position of step S23. The plate P has a region 7 where light that has passed through the mask has reached.
The pattern is transferred to 4b.

The exposure apparatus 1 moves the illumination optical system 2 and the projection optical system 3 in the positive direction of the X direction while moving the plate P in the negative direction of the X direction as in steps S21 to S23.
The pattern of the mask unit M is transferred to the plate P. A plate P4 shown in FIG. 16 shows an example of a state where the pattern of the mask unit M is transferred. Here, in FIG. 16, the pattern is moved in the direction opposite to the scanning direction with respect to the mask. As a result, the plate P4 has a distance 76b between the region 70b and the region 72b and a space 78b between the region 72b and the region 74b, and the illumination optical system 2 and the projection optical system 3 when the region is exposed from the corresponding region. The distance is longer than the moving distance. In other words, the plate P4 has a longer area where the mask pattern is projected.

FIG. 17 shows a plate P2 onto which a pattern is transferred by the exposure methods shown in FIGS.
, P3, P4. As shown in FIG. 17, the plate P3 in which the pattern is formed by moving the plate P in the positive direction of the X direction is shorter in the X direction of the pattern 60 than the plate P2. In other words, the exposure apparatus 1 can transfer the pattern reduced by the magnification shortened in the X direction to the plate P by moving the plate P in the positive direction of the X direction.
Further, the plate P4 formed by moving the plate P in the negative direction of the X direction,
The length of the pattern 60 in the X direction is longer than that of the plate P2. That is, the exposure apparatus 1 can transfer the pattern enlarged by the magnification lengthened in the X direction to the plate P by moving the plate P in the negative direction of the X direction.

As described above, the exposure apparatus 1 performs exposure while relatively moving the plate and the mask in the scanning direction, so that the pattern formed on the plate in the X direction and the pattern formed on the mask The relative position of can be adjusted. The position of the pattern formed on the mask is also the position of the image formed on the plate by the pattern formed on the mask. As a result, the influence of the deviation of the size of the plate pattern and the mask pattern in the scanning direction generated in the exposure apparatus 1 can be reduced.
Can be transferred to the appropriate position above. The exposure apparatus 1 can also be used when the plate expands and contracts with respect to a reference size and the mask size projected on the plate is shifted from the size of the pattern formed on the plate. And the plate and the relative movement at the time of exposure, specifically by moving the plate in the scanning direction with respect to the mask,
Misalignment of the pattern can be suppressed. As a result, the amount of misalignment between the mask and the plate can be individually adjusted, and the pattern region in the scanning direction can be projected with a small shift to the corresponding plate pattern.

Here, it is preferable that the exposure apparatus 1 sets the movement distance of the plate and the mask to move relatively in the scanning direction to 1 mm or less with respect to the movement amount of one scanning exposure of the projection optical system 3. Thereby, the position shift in a scanning direction can be suppressed appropriately. Further, the quality of exposure can be maintained while simplifying the apparatus configuration.

The exposure apparatus 1 is not limited to the processing in FIG. 13, and as in FIG. 11, the relative position in the scanning direction of the mask and the plate may be changed while the illumination position is the masking area 52 of the mask. . Thereby, the position of the pattern on which each pattern region is projected with respect to the entire plate can be adjusted while maintaining the pattern projected on the mask as it is. Specifically, the interval between the pattern areas can be changed, and the shift between the position of the pattern area projected from the mask and the position of the pattern corresponding to the pattern area on the substrate is reduced. be able to.

The exposure apparatus 1 includes an interval in the Y direction of the mask, a relative position in the X direction between the mask and the plate,
Both of them may be adjusted. That is, the process of FIG. 11 and the process of FIG. 13 may be executed in parallel.

In the exposure apparatus 1 of the first embodiment, the movement amount of the mask interval adjustment mechanism 41 disposed at both ends of one mask is set to the same movement amount, and the Y direction is such that the longitudinal direction of the mask is parallel to the X axis.
Although it moved to the direction, it is not limited to this. The longitudinal direction of the mask may be inclined with respect to the X axis by using different amounts of movement of the mask interval adjusting mechanisms 41 disposed at both ends of the mask.

<Embodiment 2>
Hereinafter, the exposure apparatus of Embodiment 2 will be described with reference to FIG. FIG. 18 is a side view of the exposure apparatus according to the second embodiment. The exposure apparatus 201 of Embodiment 2 shown in FIG. 18 has the same configuration as the exposure apparatus 1 except for the configuration of the illumination optical system 202. A description of the same configuration as that of the exposure apparatus 1 is omitted, and a configuration unique to the exposure apparatus 201 will be described. In the exposure apparatus 201, a part of the illumination optical system 202 is supported by the support unit 22, and the other part is a support table 220.
It is supported by. The illumination optical system 202 of the present embodiment includes a guide optical unit 230 having a portion that is not supported by the support unit 22, and an illumination optical unit 231 that is supported by the support unit 22.
And having. In addition, the exposure apparatus 201 has a moving mechanism 240 that moves a part of the guide optical unit 230.

The exposure apparatus 201 includes a light source 206 that outputs light toward the illumination optical unit 231 of the illumination optical system 202. The light source 206 is fixed to a support base 220 that does not move during exposure, and the relative position does not change with the stator side of the moving mechanism 240 during exposure. Support stand 220
Are connected to the frame 1F and the like. The support table 220 is a separate member from the support unit 22 of the moving device 21 that supports a part of the illumination optical system 2 and the projection optical system 3, and is independent of the moving unit. That is, the moving device 21 can move the support portion 22 relative to the support base 220.

<Illumination optics>
The illumination optical system 202 guides light emitted from the light source 206 and enters it as light for illuminating the mask unit M. The illumination optical system 202 includes a guide optical unit 230 and an illumination optical unit 231. The guide optical unit 230 is an optical system that guides the light output from the light source 206 to the illumination optical unit 231. A part of the guide optical unit 230 on the light source 206 side is supported by the support base 220. Further, a part of the guide optical unit 230 on the side of the illumination optical unit 228 is supported by the moving mechanism 240. The moving mechanism 240 is a mechanism that moves the guide optical unit 230, and is fixed to a member that does not move during exposure, such as the frame 1F. The illumination optical unit 231 causes the light guided by the guide optical unit 230 to be incident as light that illuminates the mask unit M. The illumination optical unit 231 is supported by a support unit and is moved by a moving device. The exposure apparatus 201 includes an illumination optical unit 23.
The mechanism for moving 1, that is, the moving device 21 is also included in a part of the moving mechanism 240.

<Guiding optical unit>
The guide optical unit 230 is an optical system that guides the laser light (light) output from the light source 206 to the illumination optical unit 231. The guide optical unit 230 includes a plurality of condenser lenses 20.
6L, a plurality of optical fibers (light guiding fibers) 207, and a bundle 232 are included. In the guide optical unit 230, a part (first end) of the condenser lens 206 </ b> L and the optical fiber 207 on the light source 206 side is supported by the support base 220. In the guide optical unit 230, a part (second end) of the optical fiber 207 on the side of the illumination optical unit 231 is supported by the moving mechanism 240. The exposure apparatus 201 includes a plurality of light sources 206 as with the light source 6. Light source 20
The configuration of 6 is not particularly limited. In the guide optical unit 230, a condenser lens 206 </ b> L and an optical fiber 207 are respectively disposed corresponding to the light source 206. Guide optical unit 23
In 0, the light output from the light source 206 is condensed by the condenser lens 206L and is incident on the optical fiber 207. In the present embodiment, the optical fiber 207 is a single quartz fiber. One end (first end) of the optical fiber 207 is disposed near the focal point of the condenser lens 206L,
The other end (second end) is disposed so as to face the illumination optical unit 231. The other end of the optical fiber 207 is fixed to the movable element of the moving mechanism of the illumination optical unit 231 and moves together with the illumination optical unit 231. The optical fiber 207 is a condensing lens 2
Although condensed at 06L, it is incident from one end. The optical fiber 207 causes light input from one end to be output from the other end. The bundle 232 includes a plurality of optical fibers 207.
The portions other than the vicinity of the end portions are combined into one. The optical fiber 207 of the present embodiment is
One end (the end on the first end side) is fixed to the light source 206, and the other end (the end on the second end side) is fixed to the illumination optical unit 231. Thereby, the guide optical unit 230 can make it difficult to produce a shift in the relative relationship between the light source 206 and the illumination optical unit 231.

<Movement mechanism>
The moving mechanism 240 maintains the optical path length from the end (first end) on the light source 206 side of the guide optical unit 230 to the illumination optical unit 231 within a predetermined range, and guide optical unit 230.
This is a mechanism for moving the position. Here, maintaining the optical path length within a predetermined range means that the optical path length from the end (first end) on the light source 206 side of the guide optical unit 230 to the illumination optical unit 231 is maintained at a substantially constant optical path length. It is. That is, the moving mechanism 240 is the moving device 21.
The guide optical unit 230 is moved in accordance with the movement of the illumination optical unit 231 by
In this mechanism, the change in the optical path length from the end of the guide optical unit 230 on the light source 206 side to the illumination optical unit 231 is less than or equal to a predetermined threshold value. Further, when the first end of the guide optical unit 230 is supported at a predetermined position with respect to the light source 206 and the second end of the guide optical unit 230 is supported at a predetermined position with respect to the illumination optical unit 231, the guide From the light source 206 side end of the optical unit 230 to the illumination optical unit 231, the light source 206 to the illumination optical system 20
It can be said that the portion is supported by the two support portions 22.

The moving mechanism 240 has a fixed pulley 244 and a linear actuator 246. Regular pulley 2
44 is held on the frame 1F by a holding mechanism (not shown), and supports the bundle 232 in a movable state. The linear actuator 246 includes a mover 248 and a stator 2
50. The linear actuator 246 is arranged in a state where the movable element 248 is movable in the X direction with respect to the stator 250. The stator 250 is held on the frame 1F by a holding mechanism (not shown). The mover 248 is a pulley, for example, and is connected to the stator 250 in a state where the fulcrum can move in the X direction while being rotatable. The mover 248 rotates with the movement of the bundle 232. In the linear actuator 246, the pulley of the mover 248 supports the bundle 232.

The moving mechanism 240 moves the position of the bundle 232 by moving the mover 248 of the linear actuator 246 in the X direction. The moving mechanism 240 of the present embodiment is a fixed pulley 2
44, the stator 250 is fixed to, for example, the frame 1F.

<Illumination optical unit>
The illumination optical unit 231 guides the light emitted from the light source 206 and guided and output by the guide optical unit 230, and enters as light for illuminating the mask unit M. The illumination optical unit 231 includes partial illumination optical units 10L and 10R that form the illumination fields SR and SL, and a partial illumination optical unit 10C that forms the illumination field SC. Guide optical unit 23
The light output from the zero optical fiber 207 is incident on the partial illumination optical units 10L and 10R, and the relay optical systems 11 and 12 make the exit end surface of the optical fiber 207 of the guide optical unit 230 the incident surface of the fly-eye lens 13. Project. The illumination optical unit 231 has the same configuration as the illumination optical system 2 except that the illumination optical unit 231 includes the relay optical system 11 as an optical system. At this time, the relay optical systems 11 and 12 enlarge the exit end face of the optical fiber 207 of the guide optical unit 230 to a predetermined multiple and project it onto the incident face of the fly-eye lens 13. The fly-eye lens 13 has a plurality of element lenses arranged and joined. In the present embodiment, eight element lenses are arranged in the column direction and ten element lenses are arranged in the row direction, and a total of 80 elements are joined.

The light emitted from the fly-eye lens 13 passes through the σ stop 14. The σ stop 14 determines the illumination NA by limiting the diameter of light. The light that has passed through the σ stop 14 has two condenser lenses 15.
Then, the light is condensed on the surface of the mask unit M (surface on the illumination optical system 2 side) via the mirror 16 to form an illumination field. The incident surface of the fly-eye lens 13 and the surface of the mask unit M have a conjugate relationship, and the illuminance distribution on the incident surface of the fly-eye lens 13 is the fly-eye lens 13.
Each element lens is overlapped and averaged, and a uniform illuminance distribution is obtained on the surface of the mask unit M. Illumination fields SR and SL are formed on the surface of the mask unit M by such partial illumination optical units 10L and 10R. The partial illumination optical unit 10C that forms the illumination visual field SC is also different in that the arrangement of the condenser lens 15 and the mirror 16 is different.
The structure is the same as that of the partial illumination optical units 10L and 10R.

The exposure apparatus 201 having the above configuration moves the movement mechanism 240 in accordance with the movement of the support portion 22 during exposure.
To move the guide optical unit 230. When the projection exposure is started, the control device 9
The illumination optical unit 231 and the projection optical system 3 are moved (scanned) in the X direction on the movement direction side of A8, that is, on the movement direction side of the projection optical system 3. The exposure apparatus 201 causes the illumination optical unit 231 and the projection optical system 3 to scan the mask unit M and the plate P by moving the illumination optical unit 231 and the projection optical system 3 by the moving device 21. Thus, the exposure apparatus 201 transfers the pattern formed on the mask unit M to the plate P.

The exposure apparatus 201 moves the illumination optical unit 231 and the projection optical system 3 with the moving device 21, and illuminates from the optical path length of the guide optical unit 230 with the moving mechanism 240, that is, from the end (first end) on the light source 206 side. The position of the optical path is moved while maintaining the optical path length to the optical unit 231 within a predetermined range, that is, substantially the same. The moving mechanism 240 of the present embodiment moves the mover 248 of the linear actuator 246 to the illumination optical unit 231 and the projection optical system 3 X
The same distance as the illumination optical unit 231 and the projection optical system 3 is moved in the same direction as the movement in the direction. When the mover 248 of the moving mechanism 240 moves, the bundle 232 supported by the mover 248 also moves. When the mover 248 moves, the relative position between the mover 248 and the fixed pulley 244 changes. The position where the bundle 232 is in contact with the fixed pulley 244 moves corresponding to the change in the relative position between the movable element 248 and the fixed pulley 244. The fixed pulley 244 can rotate and change the position where it comes into contact with the bundle 232, and can smoothly change the contact position.

As described above, when the light source 206 is installed on the support base 220 that does not move together with the support portion 22 and the illumination optical system 202 includes the guide optical unit 230 and the illumination optical unit 231, the mask stage is similar to the above. The 1T mask interval adjusting mechanism 41 is used to adjust the Y-direction interval of the mask, and the plate stage 1S is used to adjust the relative position in the scanning direction between the mask unit M and the plate P. An effect can be obtained.

In the exposure apparatus 201, the guide optical unit 230 that guides the light output from the light source 206 to the illumination optical unit 231 includes the optical fiber 207, and one end of the optical fiber 207 is fixed to the light source 206. The other end is fixed to the illumination optical unit 231. Thereby, the exposure apparatus 201 can maintain the optical path length until the light output from the light source 206 reaches the illumination optical unit 231 within a predetermined range. That is, even if the illumination optical unit 231 moves in the Z direction during exposure, the optical path length between the fixed light source 206 and the moving illumination optical unit 231 can be maintained within a predetermined range. This
The exposure apparatus 201 can suppress the light that illuminates the mask unit M from fluctuating depending on the position of the mask unit M in the X direction, and can irradiate the mask with stable light.
The pattern of the mask unit M can be more appropriately transferred to the plate P.

The exposure apparatus 201 connects the optical fiber 207 of the guide optical unit 230 to one end (first portion).
(The end on the end side) is arranged on the optical path of the illumination light output from the light source 206, and the other end (the end on the second end side) is moved together with the illumination optical unit 231 by the moving mechanism 240. Also good. That is, the exposure apparatus 201 may not fix the end portion of the guide optical unit 230 on the light source 206 side with respect to the light source 206. In this case, the light source 206 and the guide optical unit 23
The optical path length can be maintained within a predetermined range by adjusting the optical path amount based on the relative position shift of zero. Thereby, even when it is set as the structure which can adjust the position of the light source 6, the process similar to the above is realizable.

Further, the exposure apparatus 201 fixes the light source 206 to a position where the light source 206 is not scanned at the time of exposure, such as the frame 1F, in the present embodiment, to the support base 220. By separating, the structure for scanning at the time of exposure can be reduced in weight. Thereby, the enlargement of the drive source which scans the structure to scan can be suppressed, and the enlargement of the mechanism which supports the structure to scan can be suppressed. Therefore, the exposure apparatus 20
1 can reduce the size of the scanning exposure system, and can reduce the energy required for scanning of the scanning exposure system.

Further, the exposure apparatus 201 maintains the optical path amount between the light source 206 and the illumination optical unit 231 within a predetermined range by the guide optical unit 230, so that even if the light source is separated from the scanning optical system,
It is possible to suppress the exposure condition from fluctuating depending on the position of the scanning optical system, and it is possible to perform the exposure with the same performance as when the light source is integrated with the scanning optical system. Further, the exposure apparatus 20
1 is a configuration in which the light source is separated from the scanning optical system, so that the size of the light source can be increased without changing the scanning configuration. Thereby, the output of a light source can be enlarged easily, the illumination intensity of light can be improved, and production efficiency can be improved. For example, the exposure apparatus 201
Is provided with a plurality of light sources that output laser light to one optical fiber 207 (or one partial illumination optical unit), and the light output from the plurality of light sources is incident on one optical fiber 207. Illuminance can be increased.

Further, the exposure apparatus 201 uses the moving mechanism 240 to move the guide optical unit 230 in accordance with the movement of the illumination optical unit 231 and the projection optical system 3, thereby guiding the light output from the light source 206. 207 can be moved smoothly. In the exposure apparatus 201, a part of the other end of the optical fiber 207 is supported by a housing that supports the illumination optical unit 231. For this reason, in the exposure apparatus 201, a housing that supports the illumination optical unit 231 and a movement mechanism that moves the illumination optical unit 231 are also part of the movement mechanism 240.

The exposure apparatus 201 uses an optical system using the optical fiber 207 as the guide optical unit 230, but is not limited to this. The exposure apparatus 201 may use an optical system including a mirror instead of the optical fiber 207 and move the mirror in accordance with the movement of the illumination optical unit 231 or the like to adjust the optical path length.

<Embodiment 3>
Hereinafter, the exposure apparatus 501 according to the third embodiment will be described with reference to FIGS. 19 to 21. FIG. 19 is a side view of the exposure apparatus according to the third embodiment. FIG. 20 is a view of the exposure apparatus according to the third embodiment as seen from between the projection optical system and the plate. FIG. 21 is a view of the exposure apparatus according to the third embodiment as viewed from the direction in which the illumination optical unit and the projection optical system move.

The exposure apparatus 501 includes a frame 1F, an illumination optical unit 502, a projection optical system 503, and a moving apparatus 21. In the exposure apparatus 501, the light output from the light source 506 is incident on the illumination optical system 502. The above-described projection optical system 3 provided in the exposure apparatus 1 (see FIG. 1 and the like) includes a plurality of MLAs 8. However, the projection optical system 503 provided in the exposure apparatus 501 according to the present modification includes
It has one MLA 508 extending in the Y direction. Further, the illumination optical unit 550 emits light to the projection optical system 503 using one concave mirror 516. The exposure apparatus 501 causes the light output from one light source 506 to enter the illumination optical system 502.

The illumination optical system 502 is configured to output light output from the light source 506 as light for illuminating the mask unit M. The illumination optical system 502 has an optical system that forms an illumination field S shown in FIG. In the illumination optical system 502, the light emitted from the light source 506 is converted into the relay optical system 51.
1 is collimated by 1, reflected by a mirror 512, and enters a fly-eye lens 514 through a relay optical system 513. At this time, the relay optical systems 511 and 513 enlarge the exit end face of the optical fiber 532 to a predetermined multiple and enter the incident face of the fly-eye lens 514. The fly-eye lens 514 has a plurality of element lenses arranged and joined. In this embodiment, five element lenses are arranged in the column direction and 17 element lenses are arranged in the row direction, and a total of 85 elements are joined. The light emitted from the fly-eye lens 514 passes through the σ stop 515. The σ stop 515 determines the illumination NA by limiting the diameter of light passing therethrough. The light that has passed through the σ stop 515 is condensed on the surface of the mask unit M (surface on the side of the illumination optical unit 550) by the concave mirror 516 to form an illumination field S.

The projection optical system 503 has one MLA 508 extending in the Y direction. MLA
Reference numeral 508 denotes a position corresponding to the illumination visual field S formed by the illumination optical system 502. M
The LA 508 is mounted on the stage 503S of the projection optical system 503. As the stage 503S moves along the projection system guide 5P, the MLA 508 moves in the X direction.

As described above, even in the case where the entire illumination field S is illuminated by one illumination optical system 502, the mask Y-direction interval of the mask is adjusted by the mask interval adjustment mechanism of the mask stage 1T as described above. By adjusting the relative position of the mask unit M and the plate P in the scanning direction with the plate stage 1S, the same effect as in the above embodiment can be obtained.

<Device manufacturing method>
FIG. 22 is a flowchart showing each step of the device manufacturing method according to the present embodiment. In manufacturing a device by the device manufacturing method according to the present embodiment, first, the function and performance of the device (electronic device) are designed (step S201). Next, a mask based on the design in step S201 is manufactured (step S202). next,
A process in which the mask pattern of the mask manufactured in step S202 is projected and exposed to the plate P coated with resist, a process in which the exposed plate P is developed, and a developed plate P
Substrate processing including the heating process, the etching process, and the like is performed (step S203).

In the process of projecting and exposing the mask pattern onto the plate P in the substrate processing, the exposure apparatus 1
201, 501 execute the exposure method according to the present embodiment, whereby a pattern formed on the mask, that is, a pattern having the same shape as the mask pattern is transferred to the plate P. In the substrate processing, a plurality of masks are used as the mask unit M, and the pattern of each mask of the mask unit M is transferred to the plate P. The plate P to which the mask pattern is transferred is processed based on the transferred pattern by development, heating, and etching. When the substrate processing is completed, device assembly including processing processes such as a dicing process, a bonding process, and a packaging process is performed (step S204), and the device is completed through subsequent inspection (step S205).

Projection system (mainly projection optical system) of exposure apparatuses 1, 201, and 501 of the above embodiment
Has been described as a case where the projection magnification is 1, but the present invention is not limited to this. Exposure device 1
, 201, 501 can change the projection magnification to an arbitrary magnification by changing the arrangement and focal position of the lenses constituting the optical system of the projection system. The exposure apparatus 1, 201, 501
A configuration in which the projection magnification is less than 1 and the line width of the mask pattern is reduced by the projection magnification to form an image on the plate P, that is, the line width of the pattern on which the mask pattern is imaged on the plate P It is good also as a structure which becomes the magnitude | size (2 times, 3 times) of these. Also, exposure apparatuses 1, 201,
501 increases the projection magnification from 1 and enlarges the line width of the mask pattern by the projection magnification;
A configuration in which the image is formed on the plate P, that is, a configuration in which the line width of the mask pattern is a fraction (1/2, 1/3) of the line width of the pattern imaged on the plate P. Good.

In addition, as the above-mentioned plate P, not only the glass substrate for display devices,
A semiconductor wafer for manufacturing a semiconductor device, a ceramic wafer for a thin film magnetic head, or a mask or reticle master (synthetic quartz, silicon wafer) used in an exposure apparatus can be used.

The present invention also relates to a twin stage type exposure having a plurality of plate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. It can also be applied to devices.

Further, the present invention relates to US Pat. No. 6,897,963 and European Patent Application Publication No. 17131.
A plate stage for holding a plate and a measurement stage on which a reference member on which a reference mark is formed and / or various photoelectric sensors are mounted without holding the plate, as disclosed in the specification of No. 13 etc. The present invention can also be applied to a provided exposure apparatus. An exposure apparatus including a plurality of plate stages and measurement stages can be employed.

The types of exposure apparatuses 1, 201, and 501 are not limited to exposure apparatuses for manufacturing liquid crystal display elements or displays, but exposure apparatuses for manufacturing semiconductor elements that expose a semiconductor element pattern on a plate P, thin film magnetic heads, and imaging. Device (CCD), micromachine, MEMS, DN
The present invention can be widely applied to an A-chip, an exposure apparatus for manufacturing a reticle, a mask, or the like.

In the above embodiment, the masks Ma to Me have a structure in which the shielding region 52 is formed between the pattern regions 50. However, the present invention is not limited to this. The masks Ma to Me may be regions that transmit light between the pattern regions 50. In this case, whether or not light is projected onto the plate can be switched by providing a shutter in the projection optical system or illumination optical system of the exposure apparatuses 1, 201, and 501 and switching the opening and closing of the shutter. Here, a shutter may be provided even when the shielding area 52 is formed in the masks Ma to Me. In this case, the exposure apparatus 1,
Reference numerals 201 and 501 denote masks M in a state where the shutter is closed and no light is projected onto the plate.
The interval in the non-scanning direction of a to Me is changed. Thereby, the same effect as the case where the space | interval of mask Ma-Me is changed in the shielding area | region 52 mentioned above can be acquired.

In the above-described embodiment, a light transmissive mask in which a predetermined light shielding pattern (or phase pattern / dimming pattern) is formed on a light transmissive substrate is used.
For example, as disclosed in US Pat. No. 6,778,257, a variable shaping mask (an electronic mask, an active mask, or an image) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. (Also called a generator) may be used. Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element.

The exposure apparatuses 1, 201, and 501 of the above-described embodiments maintain various mechanical accuracy, electrical accuracy, and optical accuracy for various subsystems including the constituent elements recited in the claims of the present application. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. After the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room in which the temperature and cleanliness are controlled.

Note that the requirements of the above-described embodiments and modifications can be combined as appropriate. Some components may not be used. In addition, various omissions, substitutions, or changes of components can be made without departing from the scope of the present invention. In addition, as permitted by law,
The disclosures of all publications and US patents relating to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference. As described above, all other embodiments and operation techniques made by those skilled in the art based on the above-described embodiments are all included in the scope of the present invention.

1, 201, 501 Exposure apparatus 1S Plate stage 1T Mask stage 2 Illumination optical system 3 Projection optical system 3S Stage 6 Light source 9 Controllers 10C, 10L, 10R Partial optical units 12, 511, 513 Relay optical system 13, 514 Fly eye lens DESCRIPTION OF SYMBOLS 15 Condenser lens 16 Mirror 21 Moving apparatus 22 Support part 32, 42 Support part 34, 44 Base 40 Support base 41 Mask space | interval adjustment mechanism 50 Pattern area | region 52 Shielding area 230 Guide optical unit 231 Illumination optical unit 516 Concave mirror M Mask unit Ma, Mb, Mc, Md, Me mask

Claims (12)

An exposure method of irradiating a mask with illumination light through an illumination optical system and transferring a pattern formed on the mask to a plate through a lens array,
A plurality of strip-shaped masks formed by arranging a plurality of predetermined patterns in a scanning direction are arranged along a non-scanning direction that is a direction orthogonal to the scanning direction, with the scanning direction being a longitudinal direction, and the illumination optics The system and the lens array are moved relative to the mask and the plate in the scanning direction, the illumination optical system irradiates the pattern with the illumination light, and an image of the pattern formed on the mask is obtained. Projecting onto the plate via the lens array;
During relative movement of the said scanning direction with respect to the mask and the plate of the illumination optical system and the lens array, and varying the spacing of the plurality of the masks in the non-scanning direction,
The relative positional relationship in the scanning direction between the pattern formed on the mask and the image of the pattern formed on the plate is changed so that the interval in the scanning direction of the predetermined pattern projected onto the plate is changed. And moving the plate relative to the mask in the scanning direction during the relative movement of the illumination optical system and the lens array in the scanning direction with respect to the mask and the plate. Including an exposure method. The mask has a plurality of pattern regions where the pattern is formed along the scanning direction,
After the illumination light illuminates one pattern area, before illuminating the other pattern area downstream in the scanning direction from the one pattern area, the pattern of the other pattern area and the pattern The exposure method according to claim 1, wherein an interval between the plurality of masks in the non-scanning direction is changed based on information on a relative relationship in the non-scanning direction with a pattern formed on the plate on which is projected.   The space between the plurality of masks in the non-scanning direction is changed when the illumination light passes through an area where no pattern is projected onto the plate between one pattern area and another pattern area. 2. The exposure method according to 2.   Based on the information regarding the relative relationship in the non-scanning direction between the pattern formed on the mask and the pattern formed on the plate on which the pattern is projected, the interval between the plurality of masks in the non-scanning direction is changed. The exposure method according to any one of claims 1 to 3.   The exposure method according to any one of claims 1 to 4, wherein a plurality of the masks are individually moved to change the interval between the masks.   The exposure method according to claim 1, wherein the plate is moved in the scanning direction during the relative movement. Detecting the position of the pattern formed on the plate;
The method according to claim 1 , further comprising: determining a relative position in the scanning direction of the relative movement of the mask and the plate based on the detected position of the pattern formed on the plate. Exposure method. The exposure according to claim 7 , further comprising: determining a distance between the plurality of masks in the non-scanning direction during the relative movement based on the detected position of the pattern formed on the plate. Method. Detecting the position of the pattern formed on the plate;
Based on the position of the pattern formed on the plates the detection, either determining a distance of the plurality of masks in the non-scanning direction of the relative moving from claim 1 comprising 6 The exposure method according to claim 1. The exposure method according to claim 7 , wherein an alignment mark formed on the plate is detected to detect a position of a pattern formed on the plate. An illumination optical system that irradiates a mask with illumination light, and a lens that projects an image of a pattern formed on the mask illuminated by the illumination optical system onto a plate and transfers the pattern formed on the mask onto the plate An exposure apparatus comprising: an array; and a moving device that moves the illumination optical system and the lens array relative to the mask and the plate in a scanning direction,
A plurality of strip-shaped masks formed by arranging a plurality of predetermined patterns in a scanning direction are arranged along a non-scanning direction that is perpendicular to the scanning direction in a direction in which the scanning direction is long, and the non-scanning A mask support mechanism comprising: a mask interval adjustment mechanism that changes the interval between the plurality of masks in the direction; and a support base that supports the mask interval adjustment mechanism;
A plate supporting mechanism the plate to the support, that can be moved relative to the scanning direction with respect to the mask,
During the relative movement of the illumination optical system and the lens array with respect to the mask and the plate by the moving device, the mask interval adjusting mechanism adjusts the intervals of the plurality of masks, and the predetermined image projected onto the plate Based on the relative positional relationship in the scanning direction between the pattern formed on the mask and the image of the pattern formed on the plate so that the interval in the scanning direction of the pattern is changed, the plate support mechanism An exposure apparatus comprising: a control device that moves the plate relative to the mask in the scanning direction by at least the length of the predetermined pattern in the scanning direction . Transferring the pattern formed on the mask to a plate by the exposure method according to any one of claims 1 to 10 ;
Processing the plate to which the pattern has been transferred based on the transferred pattern.

Images