JP6019855B2 - IC tag - Google Patents

Description

The present invention also relates to the IC tag.

  The RFID tag has an inlet as a main component. The inlet includes an antenna and an IC chip connected to the antenna. Various information can be stored in the IC chip, and information can be exchanged with an external reader / writer through an antenna. For example, an RFID tag can be attached to a product and the product ID, production history, management history, etc. can be stored in the IC chip.

  There are various products to which the RFID tag is attached, and examples thereof include linens such as sheets and towels, and clothes. RFID tags attached to linens and clothes are required to have sufficient durability against external forces because they are subjected to external forces such as pressure, slap, and itch by washing and cleaning. For example, Patent Document 1 discloses a coin-type RFID tag having high durability against external force.

  The coin-type RFID tag disclosed in Patent Document 1 includes a disk-shaped resin case, an inlet disposed on the resin case, and a lid-like portion that covers the resin case. The lid portion is formed by injection molding. At that time, a high temperature molten sealing resin (that is, molten resin) is injected into the mold while the inlet is fixed on the resin case with a double-sided tape or the like. When viewed from the IC chip, the molten resin is introduced from the horizontal direction or from above.

JP 2009-110143 A

When the molten resin strikes the IC chip vigorously, the force with which the molten resin presses the IC chip overcomes the adhesive force of the double-sided tape or the like, and the IC chip may be misaligned. If the IC chip is misaligned, for example, a load may be applied to the joint portion between the IC chip and the antenna, and the joint portion may be disconnected.
Therefore, the present invention has been made in view of such circumstances, and an object of the present invention is to provide an IC tag and a container that can prevent positional displacement of an IC chip when an inlet is sealed with a resin.

  In order to solve the above-described problem, an IC tag according to one embodiment of the present invention includes an annular antenna, an inlet having an IC chip located inside the annular antenna and connected to the annular antenna, and the inlet includes A container having a placement surface to be placed; a protective resin covering at least a side surface of the IC chip; and a first protrusion formed on the placement surface and interposed between the annular antenna and the IC chip. And a sealing resin that seals the protective resin and the inlet on the placement surface.

The IC tag may include a second convex portion that is formed on the mounting surface and projects outside the annular antenna.
In the IC tag, the second convex portion may be higher in height than the first convex portion.
In the IC tag, the surface on which the IC chip is placed may be a sparse surface.

Further, in the above IC tag, a protruding portion that protrudes laterally may be formed on the first convex portion.
A container according to another aspect of the present invention has a mounting surface for mounting an annular antenna and an inlet having an IC chip located inside the annular antenna and connected to the annular antenna. The container includes a first convex portion positioned between the annular antenna and the IC chip when the inlet is placed on the placement surface.

  According to one aspect of the present invention, when the inlet is resin-sealed, the flow of molten sealing resin (that is, molten resin) injected into the mold and directed to the IC chip is blocked by the first convex portion. It is possible to prevent the molten resin from coming into contact with the IC chip vigorously. Thereby, it is possible to prevent the IC chip from being displaced. Further, the protective resin covers at least the side surface of the IC chip 11. Thereby, when resin-sealing the inlet, it is possible to prevent the molten resin from coming into direct contact with the side surface of the IC chip, and to reduce the thermal stress applied to the IC chip.

The figure which shows the structural example of the RFID tag 100 which concerns on 1st Embodiment. FIG. 3 is a diagram illustrating an example of an external shape of an RFID tag 100. The figure which shows the structural example of the plate body. The figure which shows the manufacturing method of the RFID tag 100 in order of a process. The figure which shows the 1st modification of 1st Embodiment. The figure which shows the 2nd modification of 1st Embodiment. The figure which shows the structural example of the RFID tag 200 which concerns on 2nd Embodiment. The figure which shows the structural example of the plate body 220 which concerns on 3rd Embodiment. The figure which shows the structural example of the RFID tag 300 which concerns on 3rd Embodiment.

Hereinafter, embodiments of the present invention will be described in detail. Note that, in each drawing described below, parts having the same configuration are denoted by the same reference numerals, and repeated description thereof is omitted.
<First Embodiment>
(Constitution)
FIG. 1 is a plan view and a cross-sectional view showing a configuration example of an RFID (Radio Frequency IDentification) tag 100 according to the first embodiment of the present invention. FIG. 2 is a diagram illustrating an example of the external shape of the RFID tag 100. In FIG. 1A, the sealing resin is not shown in order to clearly show the internal configuration of the RFID tag 100.

  As shown in FIGS. 1A and 1B, the RFID tag 100 includes an inlet 10, a dish body 20 having a placement surface 20 a on which the inlet 10 is placed, and at least a side surface 11 a of the IC chip 11. The protective resin 30 to cover and the sealing resin 40 which seals the inlet 10 and the protective resin 30 on the mounting surface 20a are provided. As shown in FIG. 2, the RFID tag 100 is, for example, a coin type, and has a diameter of about 10 to 20 mm and a thickness of about 2 to 5 mm.

As shown in FIG. 1, the inlet 10 includes, for example, an IC chip 11 and an antenna coil 12. The IC chip 11 is located inside the annular antenna coil 12. Further, the first and second electrode portions 18 and 19 of the IC chip 11 are joined to the one end 12a and the other end 12b of the antenna coil 12, respectively. This joining is performed by solder, for example.
The first and second electrode portions 18 and 19 of the IC chip 11 are provided on the active surface (that is, element formation surface) side of the IC chip 11. The IC chip 11 is attached to the dish 20 with its active surface facing downward (that is, the mounting surface 20a side of the dish 20). That is, in this example, the active surface of the IC chip 11 is the bottom surface 11b.

  As the antenna coil 12, for example, a wound wire or a wire manufactured by etching, printing, vapor deposition, plating, or the like can be used. In this embodiment, it is preferable to use a wire wound. The reason is that the winding is easy to lap, has a relatively large cross-sectional area, has a small resistance value, and can be manufactured at low cost. The material of the antenna coil 12 is an arbitrary metal such as Cu, Al, Ag, or Au. The frequency transmitted and received by the inlet 10 is, for example, the HF band, the UHF band, or the LF band.

  FIG. 3 is a plan view and a cross-sectional view illustrating a configuration example of the dish body 20. The dish 20 has a first convex portion 21 and a second convex portion 22 on the mounting surface 20a. The first convex portion 21 is formed at the central portion of the dish body 20, and the second convex portion 22 is formed at the outer peripheral portion of the dish body 20. The dish 20 is formed by, for example, injection molding using a mold, and the first convex portion 21 and the second convex portion 22 are integrated with the main body 20. In this dish 20, a region surrounded by the first convex portion 21 is a chip housing portion 13 for housing the IC chip 11. Further, an area between the first convex portion 21 and the second convex portion 22 is an antenna accommodating portion 14 that accommodates the antenna coil 12.

  The first convex portion 21 is provided with a slit 23 that allows the chip housing portion 13 and the antenna housing portion 14 to communicate with each other in at least one place. In this example, two slits 23 are provided (two or more may be used). One end 12 a and the other end 12 b of the antenna coil 12 are drawn from the antenna accommodating portion 14 to the chip accommodating portion 13 through the slit 23.

  As shown in FIG. 1, in the dish body 20, the contact surface between the dish body 20 and the sealing resin 40 is lateral (that is, in the X-axis direction) by the first convex portion 21 and the second convex portion 22. , The Y-axis direction) as well as the thickness direction of the sealing resin 40 (that is, the Z-axis direction), and the contact interface has two or more planes that intersect each other. In the dish 20, the second convex portion 22 is higher than the first convex portion 21. For example, the height of the first convex portion 21 when the bottom surface of the IC chip housing portion is the reference position is h1, and the height of the second convex portion 22 when the bottom surface is the reference position is h2. H2 is greater than h1 (ie h1 <h2). Further, the height h1 of the first protrusion is preferably higher than the height h3 of the IC chip 11 (that is, h3 <h1).

  The dish body 20 is preferably made of the same type of resin as the sealing resin 40 from the viewpoint of adhesiveness with the sealing resin 40. For example, as the constituent materials of the plate 20 and the sealing resin 40, PP (polypropylene), ABS (thermoplastic resin made of acrylonitrile, butadiene, styrene), PPS (polyphenylene sulfide), PSU (polysulfone), PPSU (poly Any one of phenylsulfone) and PEEK (polyetheretherketone) is used.

Alternatively, the dish body 20 may be made of a resin different from the sealing resin 40. For example, a high hardness resin such as PPS, PSU, PPSU, or PEEK is used for the dish 20, and a low hardness material such as urethane or silicone rubber is used for the sealing resin 40.
The sealing resin 40 is a resin that seals the inlet 10. The sealing resin 40 is formed by, for example, injection molding using a mold, and is integrated with the dish 20 after the formation. The sealing resin 40 is thermoplastic or thermosetting, and specific types thereof are as described above.

  The protective resin 30 has a function of covering and protecting the side surface 11 a of the IC chip 11. Further, the protective resin 30 also functions as an adhesive by being interposed between the IC chip 11 and the mounting surface 20a. In the first embodiment, the protective resin 30 is provided between the side surface 11a of the IC chip and the side surface of the first convex portion 21, and the surface on which the bottom surface 11b of the IC chip 11 and the IC chip of the dish portion 20 are placed. The IC chip 11 is bonded to the dish body 20 respectively.

  Furthermore, in the first embodiment, the protective resin 30 also covers and protects the upper surface (surface opposite to the active surface) 11c of the IC chip 11. That is, the protective resin 30 covers all surfaces such as the side surface 11a, the bottom surface 11b, and the top surface 11c of the IC chip 11. The protective resin 30 is, for example, an epoxy resin. The protective resin 30 is preferably made of a material having high heat resistance to such an extent that the protective resin 30 is not softened even when the inlet 10 is resin-sealed by injection molding.

(Production method)
FIG. 4 is a cross-sectional view showing the manufacturing method of the RFID tag 100 in the order of steps.
First, as shown in FIG. 3, a dish 20 is prepared. As described above, the dish 20 has the first convex portion 21 and the second convex portion 22 on the mounting surface 20a, and the region surrounded by the first convex portion 21 is the chip accommodating portion 13, A region between the first convex portion 21 and the second convex portion 22 is the antenna accommodating portion 14. As shown in FIG. 4A, when the inlet 10 is placed on the placement surface 20a of the dish 20, the first convex portion 21 and the second convex portion 22 function as a guide, so that the IC chip 11 can be disposed in the chip housing portion 13 and the antenna coil 12 can be disposed in the antenna housing portion 14 easily and with high accuracy.

  Further, as shown in FIG. 4B, the protective resin 30 is dropped or applied to the chip housing portion 13 before and after the inlet 10 is placed on the placement surface 20 a of the dish body 20. The protective resin 30 before curing has fluidity and goes around not only the side surface 11a of the IC chip 11 but also the bottom surface 11b. The protective resin 30 that wraps around the bottom surface functions as an adhesive. Moreover, the upper surface 11c of the IC chip 11 can be covered with the protective resin by dropping or applying the protective resin 30 so as to be thicker than the IC chip 11.

  Next, as illustrated in FIG. 4C, the sealing resin 40 is formed on the mounting surface 20 a of the dish body 20 by injection molding using the mold 50. In the formation process of the sealing resin 40, the high-temperature molten sealing resin (that is, the molten resin) from the horizontal direction (X-axis direction, Y-axis direction) toward the IC chip 11 is the first convex portion 21. It hits. Thereby, the momentum of molten resin can be made small. Further, since the IC chip 11 is covered with the protective resin 30, the IC chip 11 does not come into direct contact with the molten resin. Thereby, the thermal stress which the IC chip 11 receives from molten resin can be reduced. Further, the antenna coil 12 is accommodated in the antenna accommodating portion 14 and is sandwiched between the first convex portion 21 and the second convex portion 22. Thereby, even if molten resin contacts the antenna coil 12 vigorously, it is possible to prevent the antenna coil 12 from being displaced.

When the temperature of the molten resin decreases and solidifies, the integrated sealing resin 40 and the dish 20 are removed from the mold 50. In this way, the coin-type RFID tag 100 shown in FIGS. 1 and 2 is completed.
In the first embodiment, the antenna coil 12 corresponds to the “annular antenna” of the present invention, and the dish 20 corresponds to the “container” of the present invention. The bottom surface of the chip housing portion 13 corresponds to the “surface on which the IC chip is placed” of the present invention. The RFID tag 100 corresponds to the “IC tag” of the present invention.

(Effect of 1st Embodiment)
The first embodiment of the present invention has the following effects.
(1) The dish 20 has a first convex portion 21 between the chip accommodating portion 13 and the antenna accommodating portion 14 on the mounting surface 20a. The first convex portion 21 is disposed so as to surround the chip accommodating portion 13. When the inlet 10 is placed on the placement surface 20 a of the dish 20, the IC chip 11 is housed in the chip housing portion 13, the antenna coil 12 is housed in the antenna housing portion 14, and the IC chip 11 and the antenna coil 12 are placed between them. 1st convex part 21 interposes. Thereby, when the inlet 10 is resin-sealed, the flow of the molten resin that is injected into the mold 50 and directed to the IC chip 11 can be prevented by the first convex portion 21, and the molten resin is prevented from flowing into the IC chip 11. It can prevent contact with vigor. For this reason, it is possible to prevent the IC chip 11 from being displaced. Due to the positional deviation of the IC chip 11, it is possible to reduce the possibility that the joint between the IC chip 11 and the antenna coil 12 is disconnected.

(2) The protective resin 30 covers the entire surface of the IC chip 11. As a result, when the inlet 10 is resin-sealed, it is possible to prevent the molten resin from directly contacting the entire surface of the IC chip 11 and to reduce the thermal stress that the IC chip 11 receives. In the present embodiment, since the protective resin 30 covers the entire surface of the IC chip 11, the IC chip 11 does not come into direct contact with the molten resin. In the present embodiment, the protective resin 30 only needs to cover at least the side surface 11 a of the IC chip 11. As a result, the thermal stress applied to the IC chip can be reduced to some extent.

(3) The 1st convex part 21 is formed in the center part of the plate body 20, and the 2nd convex part 22 is formed in the outer peripheral part. Thereby, compared with the case where there is no 1st, 2nd convex part 22, the contact area of the plate body 20 and the sealing resin 40 can be increased, and the adhesive force of the plate body 20 and the sealing resin 40 can be increased. Can be increased. For this reason, it is possible to prevent the sealing resin 40 from peeling from the dish body 20.

(4) The contact interface between the dish 20 including the first and second convex portions 22 and the sealing resin 40 is two or more planes that intersect each other. As a result, even when a force is applied to the outer peripheral portion of the RFID tag 100 to peel off the plate body 20 and the sealing resin 40 and peeling occurs at these contact interfaces, the peeling progress direction and the contact interface Since they cross each other in the middle of peeling, it is possible to stop the peeling from going forward. For this reason, it can prevent that a contact interface peels entirely. The durability against external force can be increased.

(5) The height h2 of the second convex portion 22 is higher than the height h1 of the first convex portion 21. Thereby, the following effects are produced.
That is, when the inlet 10 and the dish body 20 are assembled with respect to the height h1 of the first convex portion 21, if the height h1 is too high, the joint portion of the IC chip 11 and the antenna coil 12 becomes the first convex portion 21. It is conceivable that the workability may be reduced. For this reason, it is preferable to make the height h1 as low as possible. Specifically, the height h1 is preferably suppressed to the same level as the IC chip 11 including the protective resin 30 or slightly higher.

  Further, when the sealing resin 40 is formed with respect to the height h2 of the second convex portion 22, when the mold 50 is a center gate (center in FIG. 4C), the melt is performed from the center toward the outside. The resin spreads. For this reason, it is possible to prevent the antenna coil 12 from being deformed by molten resin by providing a certain margin in the height h2 of the second convex portion 22 with respect to the height of the antenna coil 12 (the antenna coil is In many cases, a plurality of bundles are formed, and in that case, there is a possibility that a part of the upper coil may collapse, but by doing so, it is possible to prevent the coil from collapsing). Further, when the mold 50 is a side gate, the molten resin can be prevented from directly hitting the antenna coil 12 if the height h2 of the second convex portion 22 is high.

From the above viewpoint, the height h1 is low and the height h2 is preferably high. From the viewpoint of protecting the antenna coil 12 when the sealing resin 40 is molded, it is preferable that h1 <h2.
Further, the height h1 of the first convex portion is preferably higher than the height h3 of the IC chip 11. Thereby, it is possible to further prevent the molten resin from coming into contact with the side surface of the IC chip 11 vigorously during resin sealing.

(6) When the inlet 10 is placed on the placement surface 20 a of the dish body 20, the inlet 10 is positioned relative to the dish body 20 so that the one end 12 a and the other end 12 b of the antenna coil 12 pass through the slit 23. Need to align. Here, the dish body 20 is provided with two or more slits 23, and one end 12 a and the other end 12 b of the antenna coil 12 may pass through any one of the plurality of slits 23. For this reason, relative alignment with respect to the plate 20 of the inlet 10 is easy compared with the case where there is only one slit 23.

(Modification)
(1) In the first embodiment, the case where the bottom surface of the chip housing portion 13 and the bottom surface of the antenna housing portion 14 are flat is illustrated. However, in the first embodiment, the bottom surface of the chip housing portion 13 and the bottom surface of the antenna housing portion 14 may not be flat. For example, as shown in FIG. 5A, the bottom surface of the chip accommodating portion 13 may be a sparse surface, that is, a groove 26 or unevenness may be formed. With such a configuration, as shown in FIG. 5B, the protective resin 30 can be easily wrapped around the bottom surface (for example, active surface) 11b of the IC chip 11, and the IC chip 11 Bonding with the dish 20 can be performed more easily. Moreover, since the protective resin 30 also contacts the side surfaces of the grooves 26 and the side surfaces of the unevenness, the contact interface between the protective resin 30 and the dish body 20 can be increased. Thereby, the adhesion between the IC chip 11 and the dish 20 can be further strengthened.

(2) In the first embodiment, it has been described that the RFID tag 100 is a coin type as shown in FIG. However, in the first embodiment, the RFID tag 100 is not limited to the coin type. For example, as shown in FIGS. 6A and 6B, the sealing resin 40 may be formed in an arbitrary shape, and the RFID tag 100 may be formed in an arbitrary shape such as a card type. Moreover, you may provide the through-hole 41 in the part in which the plate body 20 of the sealing resin 40 is not arrange | positioned. Then, a key chain type may be used by passing a metal chain or strap 42 through the through hole 41. By making the RFID tag 100 an arbitrary shape, it may be used by being attached to various products.

Second Embodiment
In the first embodiment, for example, as illustrated in FIGS. 1 and 3, the case where the side surface of the first convex portion 21 is a straight line in a sectional view is illustrated. However, in the embodiment of the present invention, the side surface of the first convex portion may be uneven in a sectional view. Moreover, the overhang | projection part may be provided in the side surface of the 1st convex part.
FIG. 7 is a plan view and a cross-sectional view showing a configuration example of an RFID tag 200 according to the second embodiment of the present invention. As shown in FIGS. 7A and 7B, in the RFID tag 200, the dish body 120 has a first convex portion 121 at the center of the surface thereof. Here, the difference between the dish body 120 and the dish body 20 described in the first embodiment is the configuration of the first convex portion. Other configurations are the same between the dish body 120 and the dish body 20.

The shape of the first convex portion 121 in plan view is a shape extending along an arc, and the region surrounded by the first convex portion 121 is the chip accommodating portion 13. The first convex portion 121 is provided with a slit 23 that allows the chip housing portion 13 and the antenna housing portion 14 to communicate with each other in at least one place. In addition, a laterally projecting portion 121 a is provided on the side surface of the first convex portion 121. This overhanging portion 121a functions as a so-called “maple”. That is, when a force is applied to the RFID tag 200 to peel off the dish body 120 and the sealing resin 40, the overhanging portion 121a of the first convex portion 121 holds the sealing resin 40 and tries to peel it off. Opposes the power of For this reason, the joint strength between the dish 120 and the sealing resin 40 can be further increased, and the strength of the RFID tag 200 can be further increased. The durability against external force can be further increased.
In the second embodiment, the RFID tag 200 corresponds to the “IC tag” of the present invention. The second embodiment has the effects (1) to (6) described in the first embodiment. The modifications (1) and (2) described in the first embodiment may be applied to the second embodiment.

<Third Embodiment>
In the first and second embodiments described above, it has been described that the slit that communicates the chip housing portion and the antenna housing portion is provided in at least one of the first convex portions. However, in the embodiment of the present invention, the configuration of the first convex portion is not limited to this, and the slit is not essential. For example, the first convex portion may have a configuration in which a plurality of pillars and cones are arranged apart from each other.

  FIG. 8 is a plan view and a cross-sectional view showing a configuration example of the dish body 220 according to the third embodiment of the present invention. A difference between the dish body 220 shown in FIGS. 8A and 8B and the dish body 20 described in the first embodiment is the configuration of the first convex portion. Other configurations are the same between the dish body 220 and the dish body 20. That is, the dish body 220 has a plurality of first convex portions 221 on the surface 220a side. These first convex portions 221 are arranged at regular intervals along the arc. In addition, each of the first convex portions 221 is, for example, a needle-like cone with a sharp tip. If it is such a structure, the front-end | tip part 221a of the 1st convex part 221 will have a diameter smaller than another part, temperature will rise easily, and it will be easy to fuse | melt. For this reason, at the time of resin sealing, the front-end | tip part 221a of the 1st convex part 221 touches high temperature molten resin, is melted, is cooled, and is solidified with molten resin.

FIG. 9 is a cross-sectional view showing a configuration example of an RFID tag 300 according to the third embodiment of the present invention. As shown in FIG. 9, the RFID tag 300 has the dish 220 described above. Thereby, since the contact interface of the 1st convex part 221 and the sealing resin 40 increases, the adhesive force of the dish 220 and the sealing resin 40 can be raised. After the resin sealing, as shown in FIG. 9, the tip 221a of the first convex portion 221 is rounded, and the height of the first convex portion 221 is slightly lower than that before the resin sealing. Become.
In the third embodiment, the RFID tag 300 corresponds to the “IC tag” of the present invention. The third embodiment has the effects (1) to (6) described in the first embodiment. The modifications (1) and (2) described in the first embodiment may also be applied to the third embodiment.

<Others>
The present invention is not limited to the embodiments described above. Based on the knowledge of those skilled in the art, design changes and the like can be made to each embodiment, and such a modified embodiment is also included in the scope of the present invention.

DESCRIPTION OF SYMBOLS 10 Inlet 11 IC chip 11a Side surface 11b Bottom surface 11c Upper surface 12 Antenna coil 12a One end 12b Other end 13 Chip accommodating part 14 Antenna accommodating part 18, 19 Electrode part 20, 120, 220 Plate body 20a Mounting surface 21, 121, 221 1st Convex portion 22 second convex portion 23 slit 26 groove 30 protective resin 40 sealing resin 41 through hole 42 strap 50 mold 100, 200, 300 RFID tag 121a overhang portion 221a tip portion

Claims (5)

An inlet having an annular antenna and an IC chip located inside the annular antenna and connected to the annular antenna;
A housing body having an outer edge located on the outer peripheral side of the mounting surface and the placing surface the inlet is placed on the upper surface,
A protective resin which covers the side surface of the IC chip,
A first protrusion formed on the mounting surface and interposed between the annular antenna and the IC chip;
A sealing resin for sealing the protective resin and the inlet on the placement surface,
A region surrounded by the first convex portion becomes a chip accommodating portion that can accommodate the IC chip without contacting the first convex portion, and the annular shape is formed on the outer peripheral side of the first convex portion. An antenna housing portion for housing an antenna is formed, and the chip housing portion and the antenna housing portion communicate with each other through a slit narrower than the width of the IC chip,
The protective resin is disposed so as to cover the side surface of the IC chip by bonding the side surface of the IC chip and the mounting surface in the chip housing portion,
The sealing resin includes the chip housing part and the antenna housing part, and the chip housing part, the antenna housing part, and the first so as to seal the protective resin and the inlet on the mounting surface. 1 is disposed above the convex portion, and is also disposed so as to cover the outer edge portion located on the outer periphery than the antenna housing portion,
The IC tag , wherein the first protrusion protrudes upward from the outermost peripheral position of the outer edge .   2. The IC tag according to claim 1, wherein a protruding portion that protrudes laterally is formed on the first convex portion, and the protruding portion is positioned above the IC chip. 3. The IC tag according to claim 1, further comprising a second convex portion that projects upward inward from the outermost peripheral position of the outer edge portion . 4. The IC tag according to claim 3 , wherein the second protrusion has a height higher than that of the first protrusion. The IC tag according to any one of claims 1 to 4 , wherein the surface on which the IC chip is placed is a sparse surface.

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