JP6009751B2 - Flip chip mounting sealant and method for manufacturing semiconductor chip mounting body - Google Patents

Description

The present invention relates to an encapsulant for flip chip mounting, which is excellent in dispensing properties and capable of producing a highly reliable semiconductor chip mounting body by performing good electrode bonding. Moreover, this invention relates to the manufacturing method of the semiconductor chip mounting body using this sealing agent for flip chip mounting.

2. Description of the Related Art In recent years, flip-chip mounting using a semiconductor chip having protruding electrodes (bumps) made of solder or the like has been widely used in order to cope with miniaturization and high integration of a semiconductor device that is further progressing.
In flip-chip mounting, a method is generally used in which a protruding electrode of a semiconductor chip and an electrode portion of a substrate or another semiconductor chip are joined and then an underfill is injected to perform resin sealing. Yes. Further, instead of injecting an underfill after electrode bonding, a method in which a sealing agent is supplied in advance to a substrate or a semiconductor chip and electrode bonding and resin sealing are performed simultaneously has been studied.

For example, Patent Document 1 describes a method of bonding and sealing a semiconductor element and a printed circuit board by reflow preheating at a temperature lower than the melting point of solder and reflow main heating at a temperature higher than the melting point of solder. The viscosity in the viscoelasticity measurement of the liquid encapsulating resin composition decreases during reflow preheating, is 1 Pa · s or less in the temperature range during reflow preheating, and the gel time at the peak temperature during reflow main heating is 30 s. It is described that:

In the method described in Patent Document 1, the liquid sealing resin composition has a sufficiently low viscosity at the time of preheating, and the connection electrode portion of the semiconductor element and the printed circuit board are in contact with each other only by the weight of the semiconductor element. And then, while raising the temperature to the main heating temperature, the connecting electrode part is melted, and then the liquid sealing resin composition is cured within 30 seconds.
According to such a method, it is possible to eliminate the resin only by the weight of the semiconductor chip, and it is possible to manufacture a semiconductor chip mounting body having high connection reliability with a voidless. However, in such a method, there is a problem that, for example, a portion where the sealant protrudes, that is, a so-called fillet shape collapses, or a molten electrode material flows and contacts an adjacent electrode portion. It is difficult to obtain a semiconductor chip mounting body having characteristics.

JP 2009-96886 A

An object of the present invention is to provide an encapsulant for flip chip mounting that is excellent in dispensing properties and that can perform electrode bonding in a favorable manner to produce a highly reliable semiconductor chip mounting body. Another object of the present invention is to provide a method for producing a semiconductor chip package using the flip-chip packaging sealant.

The present invention contains an epoxy compound, an epoxy curing agent, a curing accelerator, an inorganic filler, and a viscosity modifier, and the viscosity modifier is a thermoplastic resin particle or a reactive monomer and is an E-type viscometer at 25 ° C. Is a sealant for flip-chip mounting having a viscosity of 10 to 200 Pa · s measured with a rheometer and a melt viscosity of 100 to 10,000 Pa · s measured at 150 ° C. using a rheometer.
The present invention is described in detail below.

In order to obtain a semiconductor chip mounting body having sufficient reliability, for example, it is possible to dispense the sealing agent well and sufficiently fill the sealing region with the sealing agent to form a good fillet. is necessary. On the other hand, it is also necessary to suppress creeping of the sealing agent on the upper part of the semiconductor chip. In addition, it is necessary to prevent the melted electrode material from flowing and coming into contact with adjacent electrode portions, and biting the sealant between the electrodes.
The present inventor considered that in order to solve these problems, it is important to control the viscosity of the sealant when performing electrode bonding and resin sealing (at the time of bonding). If the viscosity of the sealant at the time of bonding is too low, the sealant can be sufficiently filled with the sealant, but the shape of the fillet may be deformed, or the molten electrode material may flow to the adjacent electrode part Or contact. If the viscosity of the sealant during bonding is too high, filling of the sealant will be insufficient, the sealant will creep up on the top of the semiconductor chip, or the sealant may be bitten between the electrodes. Resulting in.

However, in an epoxy compound curing system generally used for a sealant, a curing reaction of the sealant proceeds in the process of raising the temperature to a bonding temperature of about 200 to 300 ° C. It is difficult to directly measure and control the viscosity of the sealant.
In response to such a problem, the present inventor determines the viscosity of the sealing agent by a mechanism different from the curing system of the epoxy compound at a temperature lower than the temperature at the time of bonding with respect to the sealing agent containing the epoxy compound. By adding a viscosity modifier to increase, it is possible to control the melt viscosity of the sealant at 150 ° C, and as a result, control the viscosity of the sealant during bonding, although it cannot be measured directly. The present inventors have found that a highly reliable semiconductor chip mounting body can be manufactured.
That is, the inventor contains an epoxy compound, an epoxy curing agent, a curing accelerator, an inorganic filler, and a viscosity modifier, and the viscosity modifier is a thermoplastic resin particle or a reactive monomer, and the viscosity at 25 ° C. It has been found that a flip chip mounting sealant having a melt viscosity at 150 ° C. within a predetermined range is excellent in dispensing properties, and can perform a good electrode bonding to produce a highly reliable semiconductor chip mounting body. It came to complete.

The flip-chip mounting sealant of the present invention contains an epoxy compound, an epoxy curing agent, a curing accelerator, an inorganic filler, and a viscosity modifier.
Examples of the epoxy compound include bisphenol type epoxy resins such as bisphenol A type, bisphenol F type, bisphenol AD type, and bisphenol S type, novolac type epoxy resins such as phenol novolak type and cresol novolak type, resorcinol type epoxy resin, and trisphenol. Aromatic epoxy resins such as methanetriglycidyl ether, naphthalene type epoxy resins, fluorene type epoxy resins, dicyclopentadiene type epoxy resins, polyether modified epoxy resins, NBR modified epoxy resins, CTBN modified epoxy resins, and hydrogenation thereof And the like. Among them, bisphenol F type epoxy resin, resorcinol type epoxy resin, and polyether-modified epoxy resin are preferable because a sealant for flip chip mounting having a low viscosity can be obtained.

Among the bisphenol F-type epoxy resins, as commercial products, for example, EXA-830-LVP, EXA-830-CRP (manufactured by DIC) and the like can be mentioned. Moreover, EX-201 (made by Nagase ChemteX Corporation) etc. are mentioned as a commercial item among the said resorcinol type epoxy resins. Moreover, as a commercial item among the said polyether modified epoxy resins, EX-931 (made by Nagase ChemteX), EXA-4850-150 (made by DIC), EP-4005 (made by ADEKA) etc. are mentioned, for example. It is done.

The epoxy curing agent can be appropriately selected from conventionally known epoxy curing agents according to the epoxy compound. For example, heat curing acid anhydride curing agents such as trialkyltetrahydrophthalic anhydride, phenol curing agents And latent curing agents such as amine-based curing agents and dicyandiamide, and cationic catalyst-type curing agents. These curing agents may be used alone or in combination of two or more.

The content of the epoxy curing agent may be 0.6 to 1.0 equivalent with respect to the functional group amount of the epoxy compound when an epoxy curing agent that reacts in an equivalent amount with the functional group of the epoxy compound is used. preferable. Moreover, when using the epoxy hardener which functions as a catalyst, as for content of the said epoxy hardener, a preferable minimum is 1 weight part with respect to 100 weight part of epoxy compounds, and a preferable upper limit is 20 weight part.

Moreover, it is preferable that content of the said epoxy hardening | curing agent shall be below an equivalent theoretically required with respect to the epoxy group in the said epoxy compound. When the content of the epoxy curing agent exceeds the theoretically required equivalent, chlorine ions may be easily eluted by moisture from a cured product obtained by curing the sealing agent for flip chip mounting. That is, when the epoxy curing agent is excessive, for example, when the elution component is extracted with hot water from the cured product of the obtained flip chip mounting sealant, the pH of the extracted water becomes about 4 to 5, Large amounts of chloride ions may elute from epoxy compounds. Accordingly, it is preferable that the pH of pure water after 1 g of the cured product of flip-chip mounting sealant to be obtained is immersed in 10 g of pure water at 100 ° C. for 2 hours is 6 to 8, and the pH is 6.5 to 6.5. More preferably, it is 7.5.

Examples of the curing accelerator include imidazole-based curing accelerators and tertiary amine-based curing accelerators. Of these, an imidazole curing accelerator is preferred because it is easy to control the reaction system for adjusting the curing speed and the physical properties of the cured product. These hardening accelerators may be used independently and may use 2 or more types together.

Examples of the imidazole-based curing accelerator include 1-cyanoethyl-2-phenylimidazole in which the 1-position of imidazole is protected with a cyanoethyl group, and an imidazole-based curing accelerator with basicity protected with isocyanuric acid (trade name “2MA-OK”). 2MZ, 2MZ-P, 2PZ, 2PZ-PW, 2P4MZ, C11Z-CNS, 2PZ-CNS, 2PZCNS-PW, 2MZ-A, 2MZA-PW, C11Z-A, 2E4MZ-A, 2MAOK-PW, 2PZ-OK, 2MZ-OK, 2PHZ, 2PHZ-PW, 2P4MHZ, 2P4MHZ-PW, 2E4MZ · BIS, VT, VT-OK, MAVT, MAVT-OK (manufactured by Shikoku Kasei Kogyo Co., Ltd.) Can be mentioned. These imidazole type hardening accelerators may be used independently and may use 2 or more types together.

As for content of the said hardening accelerator, a preferable minimum is 1 weight part with respect to 100 weight part of epoxy compounds, and a preferable upper limit is 10 weight part.

The inorganic filler is preferably a surface-treated silica filler. The surface-treated silica filler is preferably a silica filler surface-treated with a phenylsilane coupling agent.
The content of the inorganic filler is preferably 30 parts by weight and preferably 400 parts by weight with respect to 100 parts by weight of the epoxy compound. If the content is less than 30 parts by weight, the flip-chip mounting sealant may not be able to maintain sufficient reliability. When the content exceeds 400 parts by weight, the viscosity of the sealing agent for flip chip mounting becomes too high, and the dispensing property may be lowered.

The viscosity modifier is a component that raises the viscosity of the flip-chip mounting sealant at a temperature lower than the bonding temperature by a mechanism different from the epoxy compound curing system. By blending such a viscosity modifier, the melt viscosity of the sealant for flip chip mounting at 150 ° C. can be controlled. As a result, although it cannot be directly measured, flip chip mounting at the time of bonding is possible. By controlling the viscosity of the sealing agent for a semiconductor, a highly reliable semiconductor chip mounting body can be manufactured.
The temperature at which the viscosity modifier increases the viscosity of the sealing agent for flip chip mounting is preferably the temperature in the preheating step in which the protruding electrode of the semiconductor chip is brought into contact with the electrode portion of the substrate in flip chip mounting. Specifically, the temperature is preferably about 80 to 180 ° C.

The viscosity modifier is a thermoplastic resin particle or a reactive monomer.
The thermoplastic resin particles are melted at a temperature lower than the temperature at the time of bonding, thereby increasing the viscosity of the sealant for flip chip mounting. The reactive monomer is polymerized at a temperature lower than the temperature at the time of bonding, thereby increasing the viscosity of the sealant for flip chip mounting.

The thermoplastic resin particles are preferably thermoplastic resin particles made of a polymer having a glass transition temperature of 70 to 180 ° C. When the glass transition temperature is less than 70 ° C., the pot life at the time of bonding of the flip-chip mounting sealant may be shortened. If the glass transition temperature exceeds 180 ° C., the expected increase in viscosity due to the thermoplastic resin particles cannot be achieved, and the shape of the fillet may be lost, or the molten electrode material may flow and contact the adjacent electrode part. is there.
Examples of such thermoplastic resin particles include acrylic resin, polyethersulfone (PES), polyester resin, ethylene acrylate copolymer, polyamide resin, polyimide resin, butadiene rubber-styrene copolymer, phenoxy resin, and the like. Examples thereof include thermoplastic resin particles.

Among the thermoplastic resin particles, JF001JF-003, KP0929 and KP0930 (manufactured by Mitsubishi Rayon Co., Ltd.) which are acrylic polymer fillers are preferable as commercial products.

When the viscosity modifier is the thermoplastic resin particle, the content of the viscosity modifier is preferably 5 parts by weight with respect to 100 parts by weight of the epoxy compound, and 20 parts by weight with respect to the preferred upper limit. If the content is less than 5 parts by weight, the expected increase in viscosity due to the thermoplastic resin particles may not be achieved. If the content exceeds 20 parts by weight, the viscosity may be excessively increased by the thermoplastic resin particles. A more preferred lower limit of the content is 10 parts by weight, and a more preferred upper limit is 15 parts by weight.

The reactive monomer is preferably at least one reactive monomer selected from the group consisting of acrylic monomers, methacrylic monomers, maleimides, allyl monomers, and vinyl monomers.
Among the reactive monomers, examples of commercially available products include DPCA-120, DPCA-60, DPHA (manufactured by Nippon Kayaku Co., Ltd.), and the like.

When the said viscosity modifier is the said reactive monomer, as for content of the said viscosity modifier, the preferable minimum with respect to 100 weight part of epoxy compounds is 20 weight part, and a preferable upper limit is 60 weight part. If the content is less than 20 parts by weight, the expected increase in viscosity due to the reactive monomer may not be achieved. When the content exceeds 60 parts by weight, the viscosity may increase too much due to the reactive monomer. A more preferred lower limit of the content is 30 parts by weight, and a more preferred upper limit is 50 parts by weight.

When the viscosity modifier is the reactive monomer, the flip chip mounting sealant of the present invention preferably contains a radical polymerization initiator having a half-life temperature (1 hour) of 60 to 120 ° C.
Examples of the radical polymerization initiator include peroxides and azo initiators. Among the above radical initiators, for example, perhexyl PV, perbutyl PV, perocta O, perbutyl O, perhexa HC, pertetra A (above, manufactured by NOF Corporation), V-40, V-59 (above, sum) Kogure Pharmaceutical Co., Ltd.).

The flip-chip mounting sealant of the present invention may contain other additives such as a thixotropy imparting agent, a solvent, an inorganic ion exchanger, a bleed inhibitor, and an imidazole silane coupling agent as necessary. You may contain.

The sealant for flip chip mounting of the present invention has a viscosity of 10 to 200 Pa · s measured using an E-type viscometer at 25 ° C. By setting it as such a viscosity, the dispensing property of the sealing agent for flip chip mounting can be improved.
If the viscosity is less than 10 Pa · s, the flip chip mounting sealant lacks shape retention after dispensing. When the viscosity exceeds 200 Pa · s, stringing or the like occurs when the flip-chip mounting sealant is dispensed using a dispenser, resulting in poor discharge stability. The preferable lower limit of the viscosity is 20 Pa · s, the preferable upper limit is 100 Pa · s, the more preferable lower limit is 25 Pa · s, and the more preferable upper limit is 50 Pa · s.

The sealant for flip chip mounting of the present invention has a melt viscosity of 100 to 10,000 Pa · s measured at 150 ° C. using a rheometer. By setting it as such melt viscosity, the flow characteristic of the sealing agent for flip chip mounting at the time of bonding is controllable.
When the melt viscosity is less than 100 Pa · s, the viscosity of the sealant for flip chip mounting at the time of bonding becomes too low, and the shape of the fillet is deformed, or the molten electrode material flows and contacts the adjacent electrode portion. I will. If the melt viscosity exceeds 10,000 Pa · s, the viscosity of the sealing agent for flip chip mounting at the time of bonding becomes too high and the filling of the sealing agent for flip chip mounting becomes insufficient, or the flip chip on the top of the semiconductor chip The mounting sealant creeps up, or the flip-chip mounting sealant is bitten between the electrodes. The preferable lower limit of the melt viscosity is 150 Pa · s, the preferable upper limit is 5000 Pa · s, the more preferable lower limit is 200 Pa · s, and the more preferable upper limit is 1000 Pa · s.

Viscosity behavior as described above can be achieved by adjusting each compounding component, particularly the type and amount of the viscosity modifier, or adjusting the average particle size of the inorganic filler and the type of surface treatment. You may add a leveling agent etc. suitably.

The flip-chip mounting sealant of the present invention preferably has a gel time at 240 ° C. of 5 to 30 seconds. By using such a gel time, the pot life at the time of bonding of the flip chip mounting sealant can be extended, and the semiconductor chip mounting in which the flip chip mounting sealant is supplied in advance to the substrate or semiconductor chip The range of selection in the body manufacturing method (pre-coating method) can be expanded.
If the gel time is less than 5 seconds, the pot life at the time of bonding of the sealant for flip chip mounting is shortened, which may cause mounting failure. When the gel time exceeds 30 seconds, the physical properties of the cured product of the sealant for flip chip mounting may be deteriorated, or the production efficiency of the semiconductor chip mounted body may be reduced. A more preferable lower limit of the gel time is 6 seconds, and a more preferable upper limit is 15 seconds.
The gel time at 240 ° C. can be measured according to JIS C2161 B.

As a method for producing the flip-chip mounting sealant of the present invention, for example, an epoxy compound, an epoxy curing agent, a curing accelerator, an inorganic filler, and a viscosity modifier are blended with a predetermined amount of other additives as necessary. And mixing them.
Examples of the mixing method include a method using a homodisper, a universal mixer, a Banbury mixer, a kneader and the like.

The dispensing step of dispensing the sealing agent for flip chip mounting of the present invention on a substrate having an electrode portion at 120 ° C. or lower, and the protruding electrodes of the semiconductor chip are higher than the dispensing temperature in the dispensing step, and 120 to A preheating step in which the substrate is brought into contact with the electrode portion of the substrate through the flip-chip mounting sealant of the present invention while being heated to 180 ° C., and the protruding electrode of the semiconductor chip is heated to 200 to 320 ° C. to form the substrate A manufacturing method of a semiconductor chip mounting body including a connecting step for bonding to the electrode portion and a curing step for completely curing the sealant for flip chip mounting of the present invention is also one aspect of the present invention.

In the method for producing a semiconductor chip package according to the present invention, first, a dispensing process is performed in which the flip-chip mounting sealant of the present invention is dispensed at 120 ° C. or lower on a substrate having an electrode portion.
When the dispensing temperature exceeds 120 ° C., the viscosity increase due to the viscosity adjusting agent may start, and the dispensing property of the sealant for flip chip mounting is deteriorated.

As a method for dispensing the flip-chip mounting sealant of the present invention on a substrate, for example, a syringe is filled with the flip-chip mounting sealant of the present invention, a precision nozzle is attached to the syringe tip, and a dispenser device is used. And a method of discharging onto the substrate.

In the method for manufacturing a semiconductor chip mounting body of the present invention, the protruding electrode of the semiconductor chip is then brought into contact with the electrode portion of the substrate through the flip chip mounting sealant of the present invention while heating to 120 to 180 ° C. A preheating step is performed.
When the heating temperature is less than 120 ° C., the expected viscosity increase by the viscosity modifier cannot be achieved. If the heating temperature exceeds 180 ° C., the curing reaction of the epoxy compound proceeds in addition to the increase in viscosity by the viscosity modifier, and the viscosity increases excessively.

In the preheating step, a load may be applied to the semiconductor chip. At this time, the preferable lower limit per one protruding electrode is 0.009N, and the preferable upper limit is 0.050N.

Examples of the semiconductor chip include a semiconductor chip made of a semiconductor such as silicon or gallium arsenide and having a protruding electrode such as a solder formed on the surface thereof.

In the method for manufacturing a semiconductor chip package according to the present invention, a connecting step is then performed in which the protruding electrode of the semiconductor chip is heated to 200 to 320 ° C. and joined to the electrode portion of the substrate.
When the heating temperature is less than 200 ° C., the projecting electrode or the electrode portion does not melt and electrode bonding cannot be performed satisfactorily. When the heating temperature exceeds 320 ° C., the molten electrode material may flow and come into contact with adjacent electrode portions.

In the connection step, a load may be applied to the semiconductor chip. At this time, the preferable lower limit per one protruding electrode is 0.009N, and the preferable upper limit is 0.050N.

In the manufacturing method of the semiconductor chip mounting body of the present invention, a curing step for completely curing the flip chip mounting sealing agent of the present invention is then performed.
A preferable lower limit of the heating temperature for completely curing the flip-chip mounting sealant of the present invention is 160 ° C., and a preferable upper limit is 200 ° C.

According to the method for manufacturing a semiconductor chip mounting body of the present invention, the flip chip mounting sealant is dispensed satisfactorily, the sealing region is sufficiently filled with the flip chip mounting sealant, and a good fillet is obtained. Can be formed. In addition, creeping of the flip chip mounting sealant on the semiconductor chip can be suppressed. In addition, it is possible to prevent the molten electrode material from flowing and coming into contact with adjacent electrode portions, and biting the flip-chip mounting sealant between the electrodes.
The method for manufacturing a semiconductor chip package according to the present invention is particularly useful when the electrode material is solder.

ADVANTAGE OF THE INVENTION According to this invention, the sealing agent for flip chip mounting which can manufacture a reliable semiconductor chip mounting body which is excellent in dispensing property and performs electrode joining favorably can be provided. Moreover, according to this invention, the manufacturing method of the semiconductor chip mounting body using this sealing agent for flip chip mounting can be provided.

Examples of the present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples.

Example 1
(Manufacture of sealant for flip chip mounting)
According to the composition described in Table 1, each material shown below was stirred and mixed using a free stirrer to produce a flip chip mounting sealant.

1. Epoxy compound Epoxy compound A (EXA-850CRP, manufactured by DIC Corporation)
Epoxy compound B (EXA-4710, manufactured by DIC)
2. Epoxy curing agent acid anhydride (YH-306, manufactured by Mitsubishi Chemical Corporation)
3. Curing accelerator imidazole compound (2MA-OK, manufactured by Shikoku Chemicals)
4). Inorganic filler spherical silica (SE-2050-SPJ, manufactured by Admatechs, average particle size 0.5 μm, maximum particle size 2 μm)
5. Viscosity modifier thermoplastic resin particles (acrylic particles, KP0930, manufactured by Mitsubishi Rayon Co., Ltd.)
Reactive monomer (acrylic monomer, DPHA, manufactured by Nippon Kayaku Co., Ltd.)
6). Radical polymerization initiator Radical initiator (Perbutyl O, manufactured by NOF Corporation)

(Viscosity measurement)
Using an E-type viscosity measuring device (trade name “VISCOMETER TV-22”, manufactured by Toki Sangyo Co., Ltd., used rotor φ15 mm, set temperature 25 ° C.), the viscosity of the sealant for flip chip mounting at a rotation speed of 5 rpm was determined. .

(Melt viscosity measurement)
Using a rheometer, the melt viscosity at 150 ° C. of the sealant for flip chip mounting at the time of cone plate shearing was measured at a temperature rising rate of 5 ° C./min and a frequency of 1 rad second.

(Gel time measurement)
About the sealing agent for flip chip mounting, the gel time in 240 degreeC was measured. The gel time was measured according to JIS C2161 B.

<Evaluation>
The following evaluation was performed about the sealing agent for flip chip mounting obtained in the Example and the comparative example. The results are shown in Table 1.

1. When a cross pattern is drawn with an air dispensing device (manufactured by Musashi Engineering Co., Ltd.) using a dispensable flip chip mounting sealant, × when no coating shape or stringing occurs, ○ It was.

2. Fillet shape Flip chip mounting sealant is 20mm x 20mm x 0.75mm thick with copper wired so as to be daisy chain with metal wiring in the semiconductor chip when electrically connected to the semiconductor chip Dispense at 30 ° C. on a substrate (glass / epoxy FR-4). A semiconductor chip having bumps is mounted on a substrate via a flip chip mounting sealant, and the actual temperature applied to the bumps using a bonding apparatus (FC3000, manufactured by Toray Engineering Co., Ltd.) is 180 ° C., 10 seconds, 10 N (preheating process) Thereafter, bonding was performed under the conditions of 240 ° C., 10 seconds, and 10 N (connection process). Then, complete curing was performed in an oven at 170 ° C. for 30 minutes (curing step).
About the space | interval between a board | substrate and a semiconductor chip, the maximum value of the protrusion distance (fillet distance) of the sealing agent for flip chip mounting which protruded from the sealing area | region was measured, and the following reference | standard evaluated.
○ The maximum value of the fillet distance was 400 μm or less.
X The maximum value of the fillet distance exceeded 400 μm, or the sealing region for the flip chip mounting was not filled in the entire sealing region, and the maximum value of the fillet distance was 0 μm.

3. Void About the semiconductor chip mounting body obtained in the above “2. Fillet shape”, the presence or absence of voids was confirmed using an ultrasonic imaging device (SAT) (mi-scope hyper, manufactured by Hitachi Construction Machinery Finetech Co., Ltd.). The case where the area of the void was 1% or more was evaluated as x, and the case where it was less than 1% was evaluated as ◯.

4). When the semiconductor chip of the semiconductor chip mounting body obtained in the above-mentioned “2. Fillet shape” was observed from above with an optical microscope, the flip chip mounting sealant was found to wrap around the semiconductor chip. The case where it was up) was marked as x, and the case where it was not going around was marked as ◯.

5. Electrode bonding state The bumps were polished vertically to the semiconductor chip of the semiconductor chip mounting body obtained in “2. Fillet shape” above, and the bonding state of the bumps was observed with an optical microscope. The case where bump bonding was performed on the entire surface of the semiconductor chip was marked as ◯, and the case where the electrodes were disconnected even at one location was marked as x.

6). Reliability About the semiconductor chip mounting body obtained in the above “2. Fillet shape”, moisture was absorbed at 60 ° C., 60% RH for 120 hours, passed through a reflow oven at a peak temperature of 260 ° C. three times, and then −55 to 125 A temperature cycle test at 1000 ° C. (30 minutes / 1 cycle) was performed. The voids before and after the test were observed. The case where there was a change in the state of the voids before and after the test was marked as x, and the case where there was no change was marked as ◯.

7). The pot life flip chip mounting sealant was left at 80 ° C. for 1 hour. The case where the rate of change in viscosity after standing was 2 times or more than the initial viscosity was rated as x, and the case where it was 2 times or less was rated as ◯.

ADVANTAGE OF THE INVENTION According to this invention, the sealing agent for flip chip mounting which can manufacture a reliable semiconductor chip mounting body which is excellent in dispensing property and performs electrode joining favorably can be provided. Moreover, according to this invention, the manufacturing method of the semiconductor chip mounting body using this sealing agent for flip chip mounting can be provided.

Claims (4)

Contains an epoxy compound, an epoxy curing agent, a curing accelerator, an inorganic filler and a viscosity modifier,
The viscosity modifier is a thermoplastic resin particle or a reactive monomer,
The viscosity measured using an E-type viscometer at 25 ° C. is 10 to 200 Pa · s,
A sealant for flip chip mounting having a melt viscosity of 100 to 10,000 Pa · s measured using a rheometer at 150 ° C. The viscosity modifier is thermoplastic resin particles made of a polymer having a glass transition temperature of 70 to 180 ° C.,
The flip-chip mounting sealant according to claim 1, wherein the content of the viscosity modifier is 5 to 20 parts by weight with respect to 100 parts by weight of the epoxy compound. The viscosity modifier is at least one reactive monomer selected from the group consisting of acrylic monomers, methacrylic monomers, maleimides, allyl monomers and vinyl monomers,
2. The flip-chip mounting sealant according to claim 1, wherein the content of the viscosity modifier is 20 to 60 parts by weight with respect to 100 parts by weight of the epoxy compound. Dispensing step of dispensing the sealing agent for flip chip mounting according to claim 1, 2 or 3 on a substrate having an electrode portion at 120 ° C or lower,
A preheating step of bringing the protruding electrode of the semiconductor chip into contact with the electrode portion of the substrate through the flip chip mounting sealant while heating to 120 to 180 ° C .;
A connection step of heating the protruding electrode of the semiconductor chip to 200 to 320 ° C. and bonding it to the electrode portion of the substrate;
And a curing step of completely curing the flip-chip mounting sealant.