JP5923001B2 - Reflector molding mold release film and method for manufacturing substrate for light emitting device having reflector using the mold release film - Google Patents

Description

  The present invention relates to a mold release film for reflector molding, a method for producing a light emitting device substrate having a reflector using the same, and a light emitting device substrate having a reflector.

  A light-emitting device including a light-emitting element such as a light-emitting diode (LED) or a laser diode (LD) emits light in a bright color with a small size and high power efficiency. In addition, since the light-emitting element is a semiconductor element, there is little fear of a broken ball. Furthermore, the light emitting element has excellent initial driving characteristics, and can withstand vibration and repeated lighting / flashing (on / off). Therefore, light emitting devices including light emitting elements are used as various light sources.

  FIG. 5 is a partial schematic diagram illustrating a basic configuration of a surface-mounted light-emitting device. As shown in FIG. 5, the surface-mounted light-emitting device 1 includes a light-emitting element 3 and an attachment body 5 having a recess for mounting the light-emitting element 3. The light emitting element mounting body 5 usually includes an electrode substrate 5A and a reflector 5B provided on the electrode substrate 5A and forming the above-described recess. Then, the light emitted from the light emitting element 3 is reflected by the bottom surface and side surface (reflector 5B) of the concave portion of the attachment body 5, and the light emitted from the light emitting element 3 in various directions is condensed in one direction. The brightness is improved. Here, the electrode substrate 5A is a substrate provided with electrodes for electrical connection with the light emitting element 3, and is a lead frame, an inner lead, or the like.

  It is known that the reflector 5B is, for example, a thermosetting resin molded body (for example, Patent Document 1). Further, it is proposed that a light reflecting portion made of a light-reflecting metal powder aggregate or a fluorescent paint is provided on the side surface of the reflector 5B (the side surface of the concave portion of the light-emitting element mounting body 5) to reflect light more strongly. (For example, Patent Document 2).

  It is known that such a light emitting element mounting body 5 is obtained by molding a thermosetting resin in a mold (for example, Patent Document 1). Specifically, by providing a release film on the inner surface of the mold, an attachment body obtained after molding can be easily taken out from the mold (for example, Patent Document 2).

  There are various release films used for mold forming. For example, as a mold release film for a semiconductor mold, it includes a layer (A layer) responsible for release from a molded product and a layer (B layer) responsible for heat resistance during molding, and has a peeling force from the molded product. Has been proposed (for example, Patent Document 3). Specifically, a release film having a three-layer structure of poly-4-methyl-1-pentene / adhesive layer / PET is disclosed.

  Moreover, as a release film for multilayer printed circuit board manufacture, A layer (surface layer), B layer (adhesive layer), C layer (base material layer), B 'layer (adhesive layer) and A' layer (surface layer) A film in which the A layer (surface layer) and the A ′ layer (surface layer) contain 4-methyl-1-pentene polymer resin has been proposed (for example, Patent Document 4). Moreover, as a release film for semiconductor resin package manufacture, A layer (surface layer), B layer (adhesive layer), C layer (base material layer), B ′ layer (adhesive layer) and A ′ layer (surface layer) The A layer (surface layer) and the A ′ layer (surface layer) contain a 4-methyl-1-pentene polymer as a main component; the B layer (adhesive layer) is a modified 4-methyl A film containing a -1-pentene polymer; a C layer (base material layer) containing a polyamide resin has been proposed (for example, Patent Document 5).

  On the other hand, as a release film used for press molding, a film having a layer (A) formed from a 4-methyl-1-pentene copolymer and having the surface of the layer (A) embossed is proposed. (Patent Documents 6 and 7).

JP 2006-156704 A JP 2003-188422 A JP 2002-158242 A JP 2004-82717 A International Publication No. 2010/023907 International Publication No. 2008/001682 JP 2008-246882 A

  A light-emitting element mounting body (a substrate for a light-emitting device having a reflector) in a surface-mounted light-emitting device tends to have a complicated shape because the light-emitting element is small. In particular, in a surface-mounted light-emitting device in which a plurality of light-emitting elements are mounted, the light-emitting element mounting body tends to have a more complicated shape.

  As described above, the light emitting element mounting body is obtained by molding a thermosetting resin on the electrode substrate in a mold. In order to make it easy to take out the obtained molded product from the mold, a mold release film is disposed between the inner surface of the mold and the molded product at the time of molding the mold.

  However, relatively large unevenness such as embossing is formed on the surface of the conventional release film. Therefore, a gap is easily formed between the surface of the release film and the electrode substrate in the mold, and the liquid molding resin is likely to enter the gap. As a result, as shown in FIG. 6, there is a problem that burrs are likely to occur on the electrode substrate of the obtained molded product.

  In the above-described light emitting device 1, the light emitting element 3 is mounted on the electrode substrate 5A (lead frame) and electrically connected to the electrode substrate 5A through the wire 7A. Therefore, if the surface of the electrode substrate 5A connected to the light emitting element 3 is contaminated with a molding resin or the like or burrs are generated, a problem occurs in the electrical connection between the electrode substrate 5A and the light emitting element 3. There was a fear.

  By the way, in the manufacture of a semiconductor resin package other than a light emitting element mounting body; for example, in the manufacture of a semiconductor resin package of Patent Document 5, even if burrs are caused by molding resin, most of the burrs are removed together with other unnecessary parts. Less likely to be a problem. On the other hand, the light emitting element mounting body obtained after molding has almost no unnecessary portion, and therefore, it takes time to remove burrs. Therefore, a release film that can suppress the contamination of the electrode substrate and the generation of burrs is particularly necessary.

  Further, as described above, the conventional release film has a problem in that the release property of the release film from the obtained molded product tends to be lowered because the liquid molding resin is likely to enter the unevenness of the surface.

  Further, as in the conventional case, the release film is also required to have high mold followability and be less likely to be wrinkled. That is, if the inner surface of the mold is not sufficiently adhered, a space is likely to be generated between the inner surface of the mold and the release film. Therefore, as shown in FIG. 6, the shape of the mold and the shape of the molded product may be greatly different. In addition, if wrinkles are easily generated in the release film, the wrinkles generated in the release film are transferred to the attachment body, and a molded product having a desired shape may not be obtained with high dimensional accuracy.

  In this way, in order to obtain a light-emitting element mounting body with high dimensional accuracy, it not only has excellent releasability from the mold, but also suppresses contamination of the electrode part and generation of burrs, and sufficiently follows the mold shape. A release film is desired.

  The present invention has been made in view of the above circumstances, has excellent releasability from molds and molded products, can suppress the generation of burrs, has good follow-up to the mold shape, and is less likely to cause wrinkles. It aims at providing a release film. Another object of the present invention is to provide a method for manufacturing a substrate for a light-emitting device having a reflector, using the release film, which has less electrode contamination and burrs and high dimensional accuracy.

[1] A base material layer C, an outermost layer A containing a 4-methyl-1-pentene-based polymer as a main component, and an adhesive layer B that bonds the base material layer C and the outermost layer A. The mold release film for reflector molding, wherein the outermost layer A is a release layer, and the ten-point average roughness RzJIS of the surface of the outermost layer A is 0 μm or more and 15 μm or less.
[2] The reflector mold release film according to [1], wherein the base material layer C includes a polyamide resin, and the adhesive layer B includes a modified 4-methyl-1-pentene polymer.
[3] The base layer C, the base layer C, the outermost layer A and other layers A ′ containing 4-methyl-1-pentene polymer as a main component, and the outermost layer A The reflector according to [1] or [2], including a pair of the adhesive layers B that adhere between the base layer C and the other layer A ′ and the base layer C Mold release film for molding.
[4] The mold release mold for reflector molding according to [3], wherein the ten-point average roughness RzJIS of the surface of the other layer A ′ is larger than the ten-point average roughness RzJIS of the surface of the outermost layer A. the film.
[5] The reflector mold release film according to [2], wherein the polyamide resin is polyamide 6 or polyamide 66.

[6] A step of disposing the reflector molding die release film according to any one of [1] to [5] such that a surface opposite to the outermost layer A of the film is in contact with the inner surface of the die. A step of disposing an electrode substrate in the mold, and a step of obtaining a substrate for a light emitting device having a reflector by filling the mold with a molding resin composition. Manufacturing method for industrial use.
[7] The method for manufacturing a substrate for a light emitting device having a reflector according to [6], further including a step of peeling the release film for forming a reflector from the substrate for a light emitting device having the reflector.
[8] The method for manufacturing a substrate for a light emitting device having the reflector according to [6] or [7], wherein the reflector is a reflector for a light emitting diode element.
[9] A step of disposing the reflector mold release film such that a surface opposite to the outermost layer A of the film is in contact with the inner surface of the mold, and a step of disposing an electrode substrate in the mold. And filling the mold with a molding resin composition to obtain a light emitting device substrate having a reflector, and peeling the reflector molding release film from the light emitting device substrate having the reflector. The mold release film for forming a reflector according to any one of [1] to [5], which is used in a process for producing a substrate for a light emitting device having a reflector containing the.
[10] A substrate for a light emitting device having a reflector, obtained by the production method according to any one of [6] to [8].

  The release film of the present invention is excellent in releasability from a mold or a molded product, and can suppress the generation of burrs. In addition, the release film of the present invention has good followability to the mold shape, hardly causes wrinkles, and does not easily cause pinholes or tears. Furthermore, by using the release film of the present invention, a substrate for a light-emitting device having a reflector having high dimensional accuracy and shape accuracy with less contamination and burrs on the electrode surface while suppressing mold contamination due to leakage of molding resin. Can be obtained.

It is a schematic diagram which shows an example of a structure of the release film of this invention. It is a schematic diagram which shows an example of the arrangement | positioning method of the release film and electrode substrate in a metal mold | die. It is an enlarged view which shows an example of a cavity part when a metal mold | die is clamped. It is a schematic diagram which shows an example of the resin molding obtained after shaping | molding. It is the elements on larger scale which show an example of the light-emitting device containing a light emitting element. It is the elements on larger scale which show the example of the malfunction of the board | substrate for light-emitting devices containing a light emitting element.

1. Reflector-molding mold release film The reflector-molding mold release film (release film) of the present invention includes a base material layer C and an outermost layer A containing a 4-methyl-1-pentene polymer as main components. And an adhesive layer B that adheres the base material layer C and the outermost layer A.

  The release film in the present invention is disposed on the inner surface of a molding die when a resin molded body (preferably a light emitting device substrate having a reflector) is produced inside the molding die. By disposing the release film of the present invention on the inner surface of the mold, the obtained resin molded body (preferably a substrate for a light emitting device having a reflector) can be easily peeled from the mold.

About Outermost Layer A (Release Layer) The outermost layer A has a function of imparting release properties to the film. The outermost layer A is disposed in contact with the resin molded body. Therefore, the outermost layer A is required to have high release properties and heat resistance.

  The outermost layer A contains a 4-methyl-1-pentene polymer as a main component. The 4-methyl-1-pentene-based polymer has a high melting point of 220 to 240 ° C. and does not melt at the mold temperature in the production process of the resin molding, and is excellent in releasability because of low surface energy. In the present invention, the symbol “˜” includes the range of both ends thereof, and the same applies to the following.

  The 4-methyl-1-pentene polymer is a homopolymer of 4-methyl-1-pentene (4-methyl-1-pentene homopolymer), or 4-methyl-1-pentene and 4-methyl- It refers to a copolymer with other monomers other than 1-pentene (4-methyl-1-pentene copolymer).

  Examples of other monomers in the 4-methyl-1-pentene copolymer include α-olefins having 2 to 20 carbon atoms. Examples of the α-olefin having 2 to 20 carbon atoms include ethylene, propylene, 1-butene, 1-hexene, 1-heptene, 1-octene, 1-decene, 1-tetradecene, 1-hexadecene and 1-heptadecene. 1-octadecene, 1-eicosene and the like. These α-olefins may be used alone or in combination of two or more.

  Among the α-olefins having 2 to 20 carbon atoms, α-olefins having 7 to 20 carbon atoms are preferable, α-olefins having 8 to 20 carbon atoms are more preferable, and α-olefins having 10 to 20 carbon atoms. Is more preferable.

  The repeating unit derived from 4-methyl-1-pentene in the 4-methyl-1-pentene copolymer is preferably 93% by mass or more, more preferably 93 to 99% by mass, and still more preferably 95 to 98% by mass. . Such 4-methyl-1-pentene copolymer has good rigidity derived from 4-methyl-1-pentene and good moldability derived from α-olefin.

  The 4-methyl-1-pentene polymer preferably has crystallinity. Specifically, the 4-methyl-1-pentene polymer preferably has an isotactic structure or a syndiotactic structure, and more preferably has an isotactic structure. The molecular weight of the 4-methyl-1-pentene polymer is not particularly limited as long as it satisfies the moldability and mechanical properties.

  According to ASTM D1238, the melt flow rate (MFR) measured at a load of 5.0 kg and a temperature of 260 ° C. of the 4-methyl-1-pentene polymer is 0.5 to 250 g / 10 minutes. Preferably, it is 1.0 to 150 g / 10 min. When the MFR of the 4-methyl-1-pentene polymer is in the above range, the film forming property and the mechanical properties of the resulting film are excellent.

  The 4-methyl-1-pentene polymer can be produced by any method. For example, it can be obtained by polymerizing 4-methyl-1-pentene in the presence of a known catalyst such as a Ziegler-Natta catalyst or a metallocene catalyst. The 4-methyl-1-pentene polymer used in the present invention may be one produced as described above; or a commercially available product. Examples of commercially available 4-methyl-1-pentene polymers include TPX manufactured by Mitsui Chemicals.

  The outermost layer A may further contain a resin other than the 4-methyl-1-pentene polymer as long as the object of the present invention is not impaired.

  The outermost layer A may further contain an additive as long as the object of the present invention is not impaired. Examples of the additive include known additives usually blended in polyolefins such as a heat resistance stabilizer, a weather resistance stabilizer, a rust inhibitor, a copper damage resistance stabilizer, and an antistatic agent. The addition amount of the additive is preferably 0.0001 to 10 parts by mass with respect to 100 parts by mass of the 4-methyl-1-pentene copolymer resin.

  In the present invention, in the manufacturing process of a substrate for a light emitting device having a reflector, which will be described later, in order to improve releasability from the obtained resin molding and to suppress contamination and burrs on the surface of the electrode substrate due to the molding resin composition. In this case, it is preferable that the surface roughness of the outermost layer A in contact with the resin molded body is not more than a certain level.

  Specifically, the 10-point average roughness RzJIS of the surface of the outermost layer A is preferably 0 μm or more and 15 μm or less, more preferably 0 μm or more and 10 μm or less, and further preferably 0 μm or more and 8 μm or less. .

  That is, when the surface roughness of the outermost layer A is too large, the liquid molding resin composition enters the irregularities on the surface of the outermost layer A during mold molding, so that the release film is released from the resin molded body. May decrease. Further, if the surface roughness of the outermost layer A is too large, the liquid molding resin composition enters the gap formed between the irregularities on the surface of the outermost layer A and the electrode substrate. May be contaminated and burrs may occur. The burr generated on the electrode substrate may cause an electrical failure. On the other hand, if the 10-point average roughness RzJIS of the surface of the outermost layer A is in the range of 0 μm or more and 15 μm or less, the liquid molding resin composition does not easily enter the unevenness of the surface of the outermost layer A. Release from the body is easy. Further, since a gap is hardly formed between the release film and the electrode substrate in the mold, it is possible to suppress burr on the electrode surface.

  The ten-point average roughness RzJIS of the surface of the outermost layer A is a method in accordance with JIS-B0601; specifically, using a surface roughness type measuring machine (manufactured by Tokyo Seimitsu Co., Ltd., surfcom 130A), a measurement length of 40 mm, It can be measured at a speed of 0.3 mm / s.

  The surface roughness of the outermost layer A can be adjusted by, for example, the surface roughness of the cast roll when a release film is produced by co-extrusion of the melt of each layer material.

About the base material layer C The base material layer C has a function as a base material of a release film. Therefore, it is preferable that the base material layer C is excellent in heat resistance and mechanical properties. In particular, the resin that is the main component of the base material layer C is preferably superior in strength and creep resistance at a higher temperature than the 4-methyl-1-pentene polymer that is the main component of the outermost layer A. The high temperature here means the mold temperature when producing the resin molded body.

  Examples of such resins include polycarbonate resins, polyester resins and polyamide resins. Of these, polyamide resins are preferable, and aliphatic polyamide resins are more preferable. Since these polyamide resins have higher adhesiveness with the modified 4-methyl-1-pentene polymer contained in the adhesive layer B described later, compared to polyester resins such as polyethylene terephthalate resin, the outermost layer A and the base resin Delamination with the material layer C can be effectively suppressed.

  The aliphatic polyamide resin can be obtained by ring-opening polymerization of lactam; polycondensation reaction between an aliphatic diamine component and an aliphatic dicarboxylic acid component; or polycondensation of an aliphatic aminocarboxylic acid.

  Examples of the aliphatic polyamide obtained by ring-opening polymerization of lactam include polyamide 6, polyamide 11, polyamide 12 and polyamide 612. Examples of the aliphatic polyamide obtained by polycondensation of an aliphatic diamine component and an aliphatic dicarboxylic acid component include polyamide 66, polyamide 610, polyamide 46, polyamide MXD6, polyamide 6T, polyamide 6I, and polyamide 9T.

  Of these, polyamide 6 or polyamide 66 is preferred; polyamide 66 is more preferred. This is because these polyamides not only have good adhesion to the adhesive layer B described later, but also have a high melting point and a high elastic modulus, and are excellent in heat resistance and mechanical properties. The release film having the base material layer C containing these polyamides is not only less likely to be wrinkled in the mold, but also less likely to be pinhole-shaped. If leakage of the molding resin composition through pinhole-like breakage is significant, a part of the component of the molding resin composition adheres and accumulates on the inner wall of the mold cavity and contaminates the mold in a short time. It is not preferable.

  The melting point of aliphatic polyamide measured by DSC method is preferably 190 ° C. or higher. This is because a release film having an aliphatic polyamide having a melting point lower than 190 ° C. as the base material layer (C) may not have sufficient heat resistance and is likely to be wrinkled.

  The base material layer C may be a multilayer, for example, three layers as indicated by “C / C ′ / C”. In that case, it is preferable that at least one of the base material layer C and the base material layer C ′ includes polyamide 66.

  The base material layer C may further include other resins other than the above-described polyamide resin and the like. Preferred examples of other resins include heat-resistant elastomers that are superior in creep resistance to tensile stress and compressive stress at high temperatures and stress relaxation than 4-methyl-1-pentene polymers that are the main component of outermost layer A. Heat resistant elastomers that are difficult to resist and have high elastic recovery properties are included.

  Examples of such heat resistant elastomers include thermoplastic polyamide-based elastomers, thermoplastic polyester-based elastomers, and the like in consideration of adhesiveness with the adhesive layer B.

  Examples of the thermoplastic polyamide-based elastomer include a block copolymer having polyamide as a hard segment and polyester or polyether as a soft segment. Examples of the polyamide constituting the hard segment include polyamide 6, polyamide 66, polyamide 610, polyamide 612, polyamide 11 and the like. Examples of the polyether constituting the soft segment include polyethylene glycol (PEG), polypropylene glycol (PPG), polytetramethylene glycol (PTMG), and the like.

  Examples of thermoplastic polyester elastomers include block copolymers in which a crystalline polymer composed of crystalline aromatic polyester units is used as a hard segment, and an amorphous polymer composed of polyether units or aliphatic polyester units is used as a soft segment. A polymer is included. Examples of the crystalline polymer comprising crystalline aromatic polyester units constituting the hard segment include polybutylene terephthalate (PBT) and polybutylene naphthalate (PBN). Examples of the amorphous polymer composed of polyether units constituting the soft segment include polytetramethylene ether glycol (PTMG). Examples of the amorphous polymer composed of aliphatic polyester units constituting the soft segment include aliphatic polyesters such as polycaprolactone (PCL).

  Specific examples of the thermoplastic polyester elastomer include a block copolymer of polybutylene terephthalate (PBT) and polytetramethylene ether glycol (PTMG); a block copolymer of polybutylene terephthalate (PBT) and polycaprolactone (PCL). Polymers; block copolymers of polybutylene naphthalate (PBN) and aliphatic polyesters are included.

  The melting point of the thermoplastic polyamide-based elastomer and the thermoplastic polyester-based elastomer measured by the DSC method is preferably 190 ° C. or higher. Even if the melting point of the thermoplastic elastomer is less than 190 ° C., the thermoplastic elastomer is chemically crosslinked with a crosslinking agent or a crosslinking aid, or physically crosslinked with ultraviolet rays, electron beams, gamma rays, or the like. Thus, creep resistance and elastic recovery at high temperatures may be improved.

  The base material layer C may further contain a known additive as long as the object of the present invention is not impaired. When the base material layer C contains a polyamide resin as a main component, the additive is, for example, a heat-resistant stabilizer containing a copper compound for the purpose of improving heat aging; known additives such as lubricants such as calcium stearate and aluminum stearate It may be an agent.

Adhesive layer B The adhesive layer B is disposed between the base material layer C and the outermost layer A and has a function of adhering them. By arranging the adhesive layer B, when molding a light emitting device substrate having a reflector, when the mold is clamped or a resin is injected, the base material layer C in a location where stress tends to concentrate on the release film in the mold The delamination with the outermost layer A can be suppressed. The part where the stress tends to concentrate is, for example, a peripheral part of the mold cavity (a boundary part between the cavity surface of the mold and the parting surface).

  The adhesive layer B preferably contains a resin that is easily compatible with both the outermost layer A and the base material layer C. Therefore, the resin that is the main component of the adhesive layer B is a modified 4-methyl-1-pentene polymer that is the main component of the outermost layer A so as to be easily compatible with the base material layer C (modified 4-methyl). -1-pentene polymer). Since the base material layer C preferably contains a polyamide resin, the modified 4-methyl-1-pentene polymer is obtained by converting the 4-methyl-1-pentene polymer into an unsaturated carboxylic acid and its acid anhydride. It is preferably modified with at least one (hereinafter also referred to as “unsaturated carboxylic acid etc.”).

  The 4-methyl-1-pentene polymer modified with an unsaturated carboxylic acid or the like is obtained by copolymerizing a 4-methyl-1-pentene polymer with an unsaturated carboxylic acid or the like, preferably 4-methyl- It can be obtained by graft polymerization of a 1-pentene polymer and an unsaturated carboxylic acid. Graft polymerization of 4-methyl-1-pentene polymer and unsaturated carboxylic acid or the like can be carried out by a known method, for example, 4-methyl-1-pentene polymer and unsaturated carboxylic acid or the like such as peroxide. It can be carried out by melt-kneading in the presence.

  As the 4-methyl-1-pentene polymer to be modified, those described above can be used. The intrinsic viscosity [η] of the modified 4-methyl-1-pentene polymer measured in decahydronaphthalene at 135 ° C. is preferably 0.5 to 25 dl / g, preferably 0.5 to 5 dl / g. Is more preferable.

  Examples of the unsaturated carboxylic acid include unsaturated compounds having 3 to 20 carbon atoms having a carboxyl group and an unsaturated group, unsaturated compounds having 3 to 20 carbon atoms having a carboxylic anhydride group and an unsaturated group, and the like. It is. Examples of the unsaturated group include a vinyl group, a vinylene group, and an unsaturated cyclic hydrocarbon group.

  Specific examples of unsaturated carboxylic acids include unsaturated monocarboxylic acids such as acrylic acid and methacrylic acid; maleic acid, fumaric acid, itaconic acid, citraconic acid, allyl succinic acid, mesaconic acid, glutaconic acid, nadic acid TM Unsaturated dicarboxylic acids such as methyl nadic acid, tetrahydrophthalic acid, methyl hexahydrophthalic acid; and maleic anhydride, itaconic anhydride, citraconic anhydride, allyl succinic anhydride, glutaconic anhydride, nadic acid anhydride TM, methyl nadic anhydride Examples thereof include unsaturated dicarboxylic acid anhydrides such as acid, tetrahydrophthalic anhydride, and methyltetrahydrophthalic anhydride. Among these, maleic acid, maleic anhydride, nadic acid TM, or nadic anhydride TM is preferable, and maleic anhydride is more preferable. These may be used alone or in combination of two or more.

  The graft ratio of the modified 4-methyl-1-pentene polymer (hereinafter also referred to as “modified 4-methyl-1-pentene polymer”) is preferably 20% by mass or less. More preferably, it is 5 mass%, and it is further more preferable that it is 0.5-2 mass%. The modified 4-methyl-1-pentene polymer having a graft ratio in the above range has good adhesion to both the outermost layer A and the base material layer C.

  It is preferable that the modified 4-methyl-1-pentene polymer has substantially no crosslinked structure. The fact that the modified 4-methyl-1-pentene polymer does not have a crosslinked structure means that the modified 4-methyl-1-pentene polymer is dissolved in an organic solvent such as p-xylene, and the gel-like product is formed. It can be confirmed by not existing.

  The intrinsic viscosity [η] of the modified 4-methyl-1-pentene polymer measured in decahydronaphthalene at 135 ° C. is preferably 0.2 to 10 dl / g, and preferably 0.5 to 5 dl / g. More preferably, it is g.

  The resin as the main component of the adhesive layer B may be only the modified 4-methyl-1-pentene polymer described above, or the modified 4-methyl-1-pentene polymer and other α-olefin polymers. It may be a mixture with coalescence. The content of the modified 4-methyl-1-pentene polymer in the mixture of the modified 4-methyl-1-pentene polymer and other α-olefin polymer is preferably 20 to 40% by mass. .

  The α-olefin polymer is preferably an α-olefin polymer having 2 to 20 carbon atoms. Examples of the α-olefin polymer having 2 to 20 carbon atoms include polymers such as ethylene, propylene, 1-butene, 1-hexene, 1-octene, 1-decene, 1-tetradecene and 1-octadecene. It is. Among these, a 1-butene polymer is preferable.

  The 1-butene polymer may be a homopolymer of 1-butene or a copolymer of 1-butene and an α-olefin having 2 to 20 carbon atoms other than 1-butene. Examples of α-olefins having 2 to 20 carbon atoms other than 1-butene include ethylene, propylene, 1-hexene, 1-octene, 1-decene, 1-tetradecene, 1-octadecene, etc .; preferably Ethylene or propylene.

  The 1-butene polymer preferably contains 60% by mass or more, more preferably 80% by mass or more of a repeating unit derived from 1-butene. This is because such a 1-butene polymer is excellent in miscibility (or compatibility) with the modified 4-methyl-1-pentene polymer.

  The melt flow rate (MFR) of the 1-butene polymer measured at a load of 2.16 kg and a temperature of 190 ° C. in accordance with ASTM D1238 is preferably 0.01 to 100 g / 10 min. It is more preferable that it is 1-50 g / 10min. The 1-butene polymer having an MFR within the above range has good mixing properties (or compatibility) with the modified 4-methyl-1-pentene polymer, and can improve the adhesion of the adhesive layer B.

  Similar to the outermost layer A and the base material layer C, the adhesive layer B may also contain the aforementioned additives in addition to the main component.

  The substrate layer C and the adhesive layer B included in the release film of the present invention may be either one or plural. When the base material layer C is a multilayer, a plurality of base material layers may be directly laminated, or another layer (for example, an adhesive layer) may be disposed between the base material layer and the base material layer. .

About other layer A 'The release film of this invention may further contain layers other than the layer mentioned above as needed. Such a layer may be, for example, another layer A ′ that constitutes a surface opposite to the outermost layer A of the release film. The other layer A ′ preferably contains a 4-methyl-1-pentene polymer as a main component. That is, the other layer A ′ can be configured in the same manner as the outermost layer A, except that the surface roughness is not limited to the range defined by the outermost layer A.

  In order to obtain not only mold releasability from the resin molded body but also mold releasability from the mold, the layer constituting the surface opposite to the outermost layer A of the release film is 4-methyl-1- Another layer A ′ containing a pentene polymer as a main component is preferable. That is, the release film is composed of the base layer C, the outermost layer A and the other layer A ′ sandwiching the base layer C, the base layer C and the outermost layer A, or the base layer C and the other. It is more preferable to have a pair of adhesive layers B arranged between the layer A ′. Thus, it is more preferable that the release film of the present invention has a symmetric laminated structure with respect to the center layer. This is because a film having a symmetric laminated structure is not easily deformed (warped or the like) due to a difference in thermal expansion or moisture absorption when it is loaded in a mold and heated.

  Of course, when the base material layer C has not only heat resistance but also releasability, the layer constituting the surface opposite to the outermost layer A of the release film may be the base material layer C. .

Examples of a specific laminated structure of the release film include the following aspects. In the following embodiments, A is the outermost layer A; B is the adhesive layer B; C is the substrate layer C; A ′ is the other layer A ′; C ′ is the substrate layer C ( D is an adhesive layer that bonds the base material layer C and the base material layer C ′.
A / B / C
A / B / C / B / A '
A / B / C / C '/ C / B / A'
A / B / C / D / C '/ D / C / B / A'

  Among these, a laminated structure of “A / B / C / B / A ′” in which the base material layer (center layer) is a single layer is preferable. It is because manufacture is easy. FIG. 1 is a schematic view showing an example of a preferred configuration of the release film of the present invention. As shown in FIG. 1, the release film 10 includes a base material layer 11, an outermost layer 15 and other layers 15 ′ sandwiching the base material layer 11, and between the base material layer 11 and the outermost layer 15. Or it has a pair of contact bonding layer 13 arrange | positioned between the base material layer 11 and other layer 15 '. The base material layer 11 is the base material layer C; the outermost layer 15 is the outermost layer A; and the adhesive layer 13 is the adhesive layer B.

  The outermost layer 15 constituting one surface of the release film 10 is in contact with the obtained resin molding; the other layer 15 'constituting the other surface is in contact with the inner surface of the mold. Therefore, the release film 10 can improve not only the release property from the obtained resin molding but also the release property from the inner surface of the mold.

  Moreover, when the thickness of a pair of layers (layers made of the same material) arranged at positions symmetrical to the center layer, such as a pair of outermost layers A and a pair of adhesive layers B, is the same, This is preferable because warping can be suppressed by canceling out deformation amounts caused by thermal expansion coefficient and the like.

Physical Properties of Film The release film is used such that the outermost layer A is in contact with the resin molding; the surface opposite to the outermost layer A is in contact with the inner surface of the mold. Therefore, it is desirable that the releasability from the inner surface of the mold is high and that the release film can be installed on the mold with good followability. For this purpose, it is preferable that air between the inner surface of the mold and the release film can be discharged, and the roughness of the surface opposite to the outermost layer A of the release film is larger than the surface roughness of the outermost layer A. Is preferred. Specifically, the 10-point average roughness RzJIS of the surface of the release film opposite to the outermost layer A is preferably 1 to 15 μm larger than the 10-point average roughness RzJIS of the surface of the outermost layer A. . Moreover, it is preferable that 10-point average roughness RzJIS of the surface on the opposite side to the outermost layer A of a release film is 1-30 micrometers.

  The layer constituting the surface opposite to the outermost layer A is a “base layer C” in a three-layer structure of A / B / C or a five-layer structure of A / B / C / B / A ′ It may be “another layer A ′”. In order to make the roughness of the surface opposite to the outermost layer A within the above range, for example, it is preferable to emboss the surface opposite to the outermost layer A.

  The total thickness of the release film is preferably 20 to 100 μm, and more preferably 35 to 50 μm. By setting the thickness of the release film to a certain value or more, the mechanical strength of the film can be ensured. On the other hand, by setting the thickness of the release film to a certain value or less, it is possible to follow a mold having fine irregularities.

  The thickness of each layer of a release film should just be adjusted so that the total thickness of a release film may become the said range. Specifically, the outermost layer A is preferably 1 to 30 μm, and more preferably 3 to 10 μm. The adhesive layer B is preferably 1 to 20 μm, and the base material layer C is preferably 10 to 40 μm. When there are a plurality of adhesive layers B and a plurality of substrate layers C, the total thickness of the plurality of adhesive layers B is preferably 1 to 20 μm, and the total thickness of the plurality of substrate layers C is preferably 10 to 40 μm. . When there are a plurality of adhesive layers B, the thickness of each adhesive layer B is preferably 1 to 6 μm.

  The thickness of the other layer A ′ may be the same as that of the outermost layer A, and may be, for example, 1 to 30 μm, preferably 3 to 10 μm.

  In addition, the total thickness of the release film is increased; in particular, when the total thickness of the outermost layer A and the adhesive layer B is increased, wrinkles are likely to occur on the surface of the resin molded body, which may cause an appearance defect or a mold release defect. That is, when the resin molded body is manufactured, if the compression yield stress of the constituent material of the release film is lower than the mold clamping pressure generated at the mold clamping portion at the periphery of the mold cavity, the surface of the resin molded body is likely to be wrinkled. . In particular, the resin constituting the outermost layer A and the adhesive layer B is soft at high temperatures and has a relatively low compressive yield stress, which may cause wrinkles on the surface of the resin molded body.

  It is considered that wrinkles on the surface of the resin molded body are caused by the following mechanism. That is, when the upper and lower molds are clamped in a state where the release film is placed in the mold, the release films arranged on the inner surface of the mold are crushed by the clamping pressure. The part of the release film that has been crushed and surplus protrudes into the mold cavity. As a result, a dent is generated on the surface of the resin molded body facing the portion where the excess release film protrudes. The dents on the surface of the resin molded body exhibit a wrinkled pattern on the appearance. Since the surface shape affects the reflection performance of the reflector, wrinkles and dents are not preferable.

  In addition, the concave portion that appears to be wrinkled in appearance is that the release film that is excessive in the mold bites into the resin molded body immediately before the mold release (mold opening). For this reason, when the resin molded body is released, the excess release film portion may not be released while being bitten into the resin molded body.

  In order to prevent this wrinkle, as will be described later, it may be avoided by adjusting molding conditions such as reducing the clamping force. However, if it is difficult to prevent wrinkles only by adjusting the molding conditions, the total thickness of the release film should be reduced within a range that does not cause wrinkles, burrs, tears, etc .; in particular, the outermost layer A and the adhesive layer B It is preferable to reduce the total thickness within a range that does not impair the releasability and interlayer adhesion.

  The total thickness of the outermost layer A and the adhesive layer B is the total thickness of the outermost layer A and the plurality of adhesive layers B when there are a plurality of adhesive layers B. The total thickness of the outermost layer A and the adhesive layer B is preferably 8 to 32 μm. When the other layer A ′ is included, the total thickness of the outermost layer A, the adhesive layer B, and the other layer A ′ is preferably 8 to 32 μm.

  The release film of the present invention preferably has a tensile elastic modulus at a mold temperature of 60 MPa or more. Specifically, the tensile elastic modulus at 150 ° C. is 60 MPa to 150 MPa, and the tensile elastic modulus is about the same in both the film flow direction (Machine Direction (MD)) and the vertical direction (Transverse Direction (TD)). More preferred. A mold for manufacturing a reflector has a pattern in which fine irregularities having a width of 1 mm or less and a height of 1 mm or less are arranged at a pitch of 10 mm or less. If the tensile modulus of the release film at the mold temperature is in the above range, it will follow the fine irregularities of the mold well and follow the sharp corners without breaking. Can do.

The tensile elastic modulus can be measured according to the following method.
1) As a test piece, a strip piece cut out from a release film with a width of 10 mm is prepared. The longitudinal direction of the strip should be parallel to the film transport direction.
2) The test piece is held by a tensile tester with a thermostat adjusted to the same temperature as the mold temperature so that the distance between chucks is 10 mm. Then, the test piece is pulled at a tensile speed of 20 mm / min (constant). From the slope of the initial straight line portion in the obtained tensile stress-strain curve, the tensile elastic modulus is determined according to JIS-K7161.

  The release film of the present invention can be produced by a known method. The release film can be obtained by a method of co-extruding a resin constituting each layer, a method of laminating a film-like body of each layer by lamination, or the like. In the present invention, in order to highly suppress burrs on the electrode substrate in the obtained resin molded body, the surface of the outermost surface A in contact with the resin molded body of the release film of the present invention is embossed. Preferably not. However, if the ten-point average roughness RzJIS of the surface of the outermost layer A in contact with the resin molding is in the range of 0 μm or more and 15 μm or less, fine irregularities are formed on one or both sides of the release film as necessary. Also good.

2. Manufacturing method of light emitting device substrate having reflector The manufacturing method of a light emitting device substrate having a reflector of the present invention includes: 1) a step of placing the release film of the present invention in a mold; A step of disposing an electrode substrate between the outer layer A and the inner surface of the mold facing the outermost layer A, 3) a step of filling a molding resin in the mold to obtain a light emitting device substrate having a reflector, 4) The process of peeling a release film from the board | substrate for light-emitting devices which has a reflector is included.

  A metal mold | die is a type | mold for molding used in order to obtain a desired resin molding. The shape of the mold may be a known shape. The material of the mold may also be a known material. For example, in a mold for manufacturing a substrate for a light emitting device having a reflector, a plurality of minute recesses may be arranged at a constant interval on a parting surface. The width of the recesses on the parting surface can be about 1 mm or less, the depth of the recesses can be about 1 mm or less, and the interval (pitch) between the recesses can be about 10 mm or less.

  FIG. 2 is a schematic diagram illustrating an example of a method for arranging a release film and an electrode substrate in a mold in a manufacturing process of a light emitting device substrate having a reflector.

  In the step 1), as shown in FIG. 2, the release film 25 of the present invention is disposed between the upper mold 21 and the lower mold 23. In the release film 25 of the present invention, the surface opposite to the outermost layer A is in contact with the inner surface of the mold (the upper mold 21 in FIG. 2); the outermost layer A (release layer) is the electrode substrate (FIG. 2). Then, it arrange | positions so that the lead frame 29A) may be touched. For example, when the release film 25 of the present invention has a five-layer structure of outermost layer A / adhesive layer B / base material layer C / adhesive layer B / other layer A ′, A ′ is in contact with the upper mold 21; the outermost layer A (release layer) may be disposed in contact with the lead frame 29A.

  The arrangement method of the release film 25 is not particularly limited. It is also possible to apply a certain tension to the release film 25 in the mold by the film unwinding device 27A and the winding device 27B.

  In the step 2), the lead frame 29A is disposed in the mold (on the lower mold 23 in FIG. 2).

  The preceding and following steps 1) and 2) may be reversed. That is, after the lead frame 29A is disposed, the release film 25 may be disposed; the release film 25 and the lead frame 29A may be disposed simultaneously.

  Next, air is sucked from an exhaust port provided in the cavity surface 21 </ b> A of the upper mold 21 to discharge air between the release film and the upper mold. Thereby, the release film 25 is vacuum-sucked to the parting surface 21B and the cavity surface 21A of the upper mold 21 (see FIG. 3). The cavity surface 21 </ b> A is a surface constituting the cavity of the upper mold 21. The parting surface 21 </ b> B is a surface of the upper mold 21 that contacts the lower mold 23 when the upper mold 21 and the lower mold 23 are closed. The depth from the parting surface 21B of the upper mold 21 to the deepest part of the cavity 21A is about 0.2 to 1.0 mm, preferably 0.5 to 1.0 mm.

  FIG. 3 is an enlarged view showing an example of a cavity portion when the mold is clamped. As shown in FIG. 3, the upper mold 21 and the lower mold 23 are closed and clamped. In order to suppress wrinkles on the surface of the obtained resin molded body, the molding conditions may be adjusted, for example, by reducing the clamping pressure within a range where burrs do not cause a problem.

  The temperature of the mold is not particularly limited as long as the temperature of the thermosetting resin can be cured when the main component of the molding resin composition described later is a thermosetting resin. When the main component of the molding resin is an epoxy resin, the mold temperature is preferably 150 to 200 ° C, and more preferably 150 to 180 ° C. The release film may be disposed at a predetermined position in the mold after being preheated.

  In the step 3), a molding resin composition is filled between the release film 25 and the lead frame 29A in the mold to obtain a resin molded body 29 (light emitting device substrate having a reflector).

  The molding resin composition is a resin composition for molding a reflector. The molding resin composition may be a known one and may contain a thermosetting resin or a thermoplastic resin as a main component. Since the viscosity in a molten state is relatively low and the moldability is good, the molding resin composition preferably contains a thermosetting resin as a main component.

  Examples of the thermosetting resin include an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, an acrylate resin, a urethane resin, and the like, and preferably an epoxy resin, a silicone resin, a modified silicone resin, and the like. Thus, a light emitting device substrate having excellent heat resistance, light resistance, and mass productivity can be obtained.

  The molding resin composition may further contain additives such as a filler, a diffusing agent, a pigment, a fluorescent material, a reflective material, and a light shielding material. The molding resin composition may further contain, for example, a filler, a diffusing agent, a reflective substance and the like in order to uniformly disperse the emitted light. Moreover, the resin composition for molding may further contain titanium oxide, silica, alumina or the like in order to improve heat resistance.

  Filling the mold with the molding resin composition can be performed by an arbitrary method such as transfer molding, compression molding, or injection molding. For example, when a molding resin composition containing a thermosetting resin is formed by transfer molding, the molding resin composition that has become above the softening point due to heat conduction from the mold is liquefied into the cavity by raising the plunger. Let it fire. While keeping the plunger raised, the plunger is held at a predetermined pressure for a predetermined time, and the molding resin composition is heated and cured. At this time, the injection speed, holding pressure, and holding time are adjusted so that molding defects (warping, voids, burrs) do not occur in the resin molded body. The holding pressure is preferably 1 to 12 MPa, for example.

  FIG. 4 is a schematic view showing an example of a resin molded body obtained after molding. Through the above steps, as shown in FIG. 4, a resin molded body 29 (light emitting device substrate having a reflector) having a lead frame 29A and a reflector 29B integrally formed thereon can be obtained. it can.

  Since the surface roughness of the outermost layer A of the release film of the present invention is adjusted to a certain level or less, it may be difficult to form a gap between the surface of the outermost layer A of the release film and the lead frame 29A. it can. Therefore, it is possible to prevent the liquid molding resin composition from entering the gap and generating burrs on the lead frame of the resin molded body 29.

  In the step 4), the upper mold and the lower mold are opened, and the release film 25 is peeled from the resin molded body 29 (light emitting device substrate). As described above, since the surface roughness of the outermost layer A of the release film of the present invention is adjusted to a certain level or less, the resin composition for molding is formed on the unevenness of the surface of the outermost layer A of the release film during molding. Is difficult to enter. Therefore, the release film of the present invention is excellent in releasability and can be easily peeled from the resin molded body 29. Moreover, when the mold release film of this invention has the outermost layer A also in the side which contact | connects a metal mold | die, it can release easily from the upper mold | type of a metal mold | die.

  In order to continuously perform the next sealing step after the step 4), a new release film may be rearranged in the mold. To reposition a new film, after separating and collecting the formed light emitting device substrate with a reflector, it replaces the used release film with a new release film between the upper mold and the lower mold. Between them. For example, while winding a used release film with a film winder, a new release film is unwound (between the upper mold and lower mold) with a film unwinder. The mold film can be rearranged.

  As described above, the release film of the present invention can suppress generation of burrs and the like while having excellent release properties.

  In addition, when the release film of the present invention has a symmetric laminated structure with respect to the center layer, deformation such as warpage of the release film when the release film is placed in the mold, Wrinkles can be made more difficult to occur. Further, when the base layer C (center layer) of the release film contains an aliphatic polyamide having excellent strength at high temperatures as a main component, vertical wrinkles at the mold temperature can be made more difficult to occur. Therefore, the shape and dimensional accuracy of the light emitting device substrate having the obtained reflector can be increased.

  Moreover, the ratio of the total thickness of the outermost layer A and the adhesive layer B with respect to the total thickness of the release film is set to a certain value or less, so that the release film is less likely to be wrinkled in the mold. Therefore, wrinkles generated on the surface of the resin molded body can be suppressed.

  Furthermore, since the mold release film of the present invention has good mold followability and good mold release characteristics, the resin in the mold can be stably flowed even if the molding process is continuously performed. Moreover, the release film of this invention can maintain the high release property with respect to a resin molding stably. Therefore, a substrate for a light-emitting device having a reflector with good dimensional accuracy and few burrs that can hinder electrical connection can be obtained.

  The obtained light emitting device substrate having a reflector can be preferably used as a light emitting device substrate for a light emitting diode element. The size of the light emitting diode element may be about 320 μm to 1 mm in diameter.

  In the following, the invention will be described in more detail with reference to examples. These examples do not limit the scope of the present invention.

1) Preparation of material for outermost layer A A copolymer of 4-methyl-1-pentene and 1-decene was produced by a conventional method. The 1-decene content was 2.5% by mass.

2) Preparation of material for adhesive layer B Synthesis of modified 4-methyl-1-pentene copolymer 4-Methyl-1-pentene and diallene 168 (Mitsubishi Chemical Corporation, mixture of α-olefins having 16 and 18 carbon atoms) ) And a copolymer (dialene 168 content is 6.5 mass%) was prepared by a conventional method.

  98.8 parts by weight of the copolymer, 1 part by weight of maleic anhydride, and 0.2 parts by weight of 2,5-dimethyl-2,5-di (t-butylperoxy) hexane as the organic peroxide. And mixed with a Henschel mixer. The mixture was then kneaded with a twin screw extruder using a temperature of 280 ° C. As a result, a modified 4-methyl-1-pentene copolymer graft-modified with maleic anhydride was obtained. The graft ratio of this modified 4-methyl-1-pentene copolymer was 0.9% by mass.

Preparation of material for adhesive layer B 25 parts by mass of modified 4-methyl-1-pentene copolymer obtained in the previous step, 50 parts by mass of 4-methyl-1-pentene and diallene 168 (Mitsubishi Chemical, carbon number Copolymer of 16 and 18 α-olefin) (dialene 168 content 6.5% by mass), 25 parts by mass of 1-butene copolymer, 0.10 parts by mass of Irganox 1010 (as stabilizer) Irganox 1010) (manufactured by BASF Corp.) and 0.03 parts by mass of calcium stearate (manufactured by NOF Corp.) were mixed at a low speed for 3 minutes using a Henschel mixer. Next, this mixture was extruded at 280 ° C. using a twin-screw extruder to obtain an adhesive layer B material.

3) Preparation of material for base material layer C Material C-1:
As an aliphatic polyamide resin, polyamide 66 (manufactured by DuPont, trade name Zytel (R) 45HSB, melting temperature 262 ° C.) was prepared.
Material C-2:
A polyester elastomer (manufactured by Toray DuPont, trade name Hytrel 4777, melting point 200 ° C.) was prepared.

4) Preparation of other material for layer A ′ A copolymer of 4-methyl-1-pentene and 1-decene was produced by a conventional method. The 1-decene content was 2.5% by mass.

Example 1
Using a T-die molding machine, melt the above-mentioned outermost layer A material, adhesive layer B material, base layer C material and other layer A ′ material on a cast roll whose surface is mirror-finished. A release film having a width of 400 mm having a five-layer structure of A / B / C / B / A ′ was produced. The material C-1 was used for the base material layer C material. The thickness of each layer of the release film was A / B / C / B / A ′ = 5/3/22/3/5 μm (total thickness 38 μm). RzJIS of the surface of the outermost layer A (release layer) in contact with the resin molded body is measured according to JIS-B0601, using a surface roughness type measuring machine (manufactured by Tokyo Seimitsu Co., Ltd., surfcom 130A), measuring length 40 mm, As a result of measuring at a speed of 0.3 mm / s, it was 0.5 μm. On the other hand, the RzJIS of the surface of the release film opposite to the outermost layer A (the surface of the other layer A ′) was 8 μm.

  The obtained release film was disposed between the upper mold and the lower mold. The depth of the deepest part from the parting surface of the cavity in the upper mold and the lower mold was set to 0.2 mm. Next, the release film was placed in the upper mold, and the aluminum substrate (thickness 100 μm) for the lead frame was placed in the lower mold. The mold temperature at this time was 150 ° C.

  A white epoxy resin was prepared as a molding resin composition. Then, the molding resin composition was arranged on the release film arranged in the upper mold, the upper mold and the lower mold were closed, and the molding resin was injected into the cavity. After injecting the molding resin, it was held at a pressure of 2 MPa for 60 seconds to cure the molding resin. Thereafter, the mold was opened to obtain a resin molded body. The release film was peeled from the resin molded body to obtain an aluminum substrate having a reflector.

  The presence or absence of transfer of burrs and wrinkles in the aluminum substrate having the obtained reflector, and the release property and followability of the release film were evaluated by the following methods.

1) Release property The release property of the release film from the aluminum substrate having the reflector was evaluated according to the following criteria.
○: The release film naturally peels off as soon as the mold is opened. △: The release film can be peeled by hand. ×: The release film cannot be peeled by hand, and is attached to the inner surface of the aluminum substrate or the mold having a reflector. In close contact

2) The boundary portion between the reflector and the aluminum substrate in the aluminum substrate having the burr reflector was visually observed. The presence or absence of burrs was evaluated according to the following criteria.
○: Burr size is less than 50 μm ×: Burr size is 50 μm or more

3) Followability In the aluminum substrate having a reflector, the edge portion of the reflector was cut, the cut surface was observed with a microscope, and the curvature radius of the edge portion was measured. The mold followability of the release film was evaluated according to the following criteria.
○: radius of curvature 0-100 μm
Δ: radius of curvature is 101-200 μm
×: The radius of curvature is 201 μm or more

4) Wrinkles on the surface of the reflector In the aluminum substrate having the reflector, the presence or absence of wrinkle transfer of the release film was visually observed on the surface of the reflector, and evaluated according to the following criteria.
○: Wrinkle transfer of the release film is not observed at all ×: Wrinkle transfer of the release film is observed on the surface or edge of the reflector

(Example 2)
The surface roughness of the cast roll is adjusted so that the outermost layer A (release layer) of the release film has a surface roughness RzJIS of 10 μm, and the surface roughness RzJIS of the other layer A ′ becomes 12 μm. A release film was obtained in the same manner as in Example 1 except for the above. Using the obtained release film, an aluminum substrate having a reflector was produced in the same manner as in Example 1, and the same evaluation was performed.

( Reference Example 1 )
Using the above-mentioned material for each layer as a raw material, it was coextruded using a T-die molding machine to obtain a release film having a width of 400 mm and having a 5-layer structure of A / B / C / B / A ′. The material C-2 was used for the base material layer C. The thickness of each layer of the release film was A / B / C / B / A ′ = 10/5/20/5/10 μm (total thickness 50 μm). RzJIS of the outermost layer A surface was 1.0 μm, and the surface roughness RzJIS of the other layer A ′ was 12 μm. Using the obtained release film, an aluminum substrate having a reflector was produced in the same manner as in Example 1, and the same evaluation was performed.

(Comparative Example 1)
The surface roughness of the cast roll is adjusted so that the outermost layer A (release layer) of the release film has a surface roughness RzJIS of 30 μm, and the surface roughness RzJIS of the other layer A ′ becomes 25 μm. A release film was obtained in the same manner as in Example 1 except for the above. Using the obtained release film, an aluminum substrate having a reflector was produced in the same manner as in Example 1, and the same evaluation was performed.

(Comparative Example 2)
The base material layer C is a mixture of 4-methyl-1-pentene copolymer, polyethylene and polypropylene, does not include the adhesive layer B, and the outermost layer A has a surface roughness RzJIS of 11 μm. A release film having a three-layer structure of A / C / A ′ was obtained in the same manner as in Example 1 except that the surface roughness RzJIS was changed to 10 μm. The thickness of each layer of the release film was A / C / A ′ = 25/70/25 μm (total thickness 120 μm). Using the obtained release film, an aluminum substrate having a reflector was produced in the same manner as in Example 1, and the same evaluation was performed.

(Comparative Example 3)
As a mold release film, a PET film (made by Mitsui Chemicals, Inc., surface not treated with SP-PET) is used, and the surface roughness RzJIS of one surface (the surface in contact with the resin molded product) is 1.0 μm, An aluminum substrate having a reflector was manufactured in the same manner as in Example 1 except that the surface roughness RzJIS of the other surface (the surface in contact with the inner surface of the mold) was 1.1 μm, and the same evaluation was performed.

(Comparative Example 4)
As the release film, a PTFE film (manufactured by Nitto Denko Corporation) is used, and the surface roughness RzJIS of one surface (surface in contact with the resin molding) is 1.7 μm, and the other surface (surface in contact with the mold inner surface) An aluminum substrate having a reflector was produced in the same manner as in Example 1 except that the surface roughness RzJIS was 2.1 μm, and the same evaluation was performed.

Table 1 shows the evaluation results of Examples 1-2, Reference Example 1 and Comparative Examples 1-4.

As shown in Table 1, the release films of the present invention of Examples 1 and 2 gave good results in all items. In particular, the smaller the surface roughness of the outermost layer A of the release film, the better the release property of the release film, and the generation of burrs in the resin molded product could be suppressed. In Reference Example 1 , since the base material layer C is a material having a lower strength than that of polyamide, good results were obtained except that the film was biting into the edge portion of the resin molded body.

  On the other hand, since the release film of Comparative Example 1 has a large surface roughness RzJIS of the outermost layer A, the injected molding resin bites into the irregularities on the surface of the outermost layer A of the release film, and the mold It did not peel off spontaneously as soon as it opened. By pulling the release film by hand, the release film could be peeled cleanly without tearing or opening holes. However, burrs occurred at the boundary between the reflector and the substrate.

  The release film of Comparative Example 2 did not include the adhesive layer B, and the material of the base material layer C was a material that easily adheres to the outermost layer A. Since the base material layer C is a flexible material and the elastic modulus of the film is small, the surplus film extending into the mold bites into the resin molded body, and the dimensional accuracy of the reflector is lowered. Although the release films of Comparative Examples 3 to 4 had a small surface roughness, the followability to the mold shape was insufficient, and the shape accuracy of the resulting resin molding was low.

  The release film of the present invention is excellent in releasability from a mold or a molded body, can suppress the generation of burrs, has good followability to the mold shape, and is less likely to cause wrinkles. In addition, by forming using the release film of the present invention, a light emitting device substrate having a reflector having high dimensional accuracy with less contamination and burrs on the electrode can be obtained.

DESCRIPTION OF SYMBOLS 1 Light-emitting device 3 Light-emitting element 5 Attachment body 5A Electrode board | substrate 5B, 29B Reflector 7A Wire 10, 25 Release film 11 Base material layer 13 Adhesive layer 15 Outermost layer 15 'Other layer 21 Upper metal mold | die 21A Cavity surface 21B Parting surface 23 Lower mold 27A Unwinding device 27B Winding device 29 Resin molded body (substrate for light emitting device having reflector)
29A Lead frame

Claims (6)

A base material layer C containing a polyamide resin as a main component;
An outermost layer A containing 4-methyl-1-pentene polymer as a main component, and another layer A ′ containing 4-methyl-1-pentene polymer as a main component , sandwiching the base material layer C ,
Adhesive layer B which adheres between the base material layer C and the outermost layer A and contains a modified 4-methyl-1-pentene polymer , the base material layer C and the other layer A ′ An adhesive layer B that includes a modified 4-methyl-1-pentene polymer;
Including
The outermost layer A is a release layer, the ten-point average roughness RzJIS of the surface of the outermost layer A is 0 μm or more and 10 μm or less, and the ten-point average roughness RzJIS of the surface of the other layer A ′. Is larger than the ten-point average roughness RzJIS of the surface of the outermost layer A,
A mold release film for reflector molding, which is used so that the other layer A ′ is in contact with the mold.   The mold release film for reflector molding according to claim 1, wherein the polyamide resin is polyamide 6 or polyamide 66. Disposing the reflector mold release film according to claim 1 or 2 so that the other layer A ′ of the film is in contact with the inner surface of the mold;
Placing the electrode substrate in the mold; and
Filling the mold with a molding resin composition to obtain a light emitting device substrate having a reflector;
The manufacturing method of the board | substrate for light-emitting devices which has a reflector containing this. The manufacturing method of the board | substrate for light-emitting devices which has a reflector of Claim 3 further including the process of peeling the said release film for reflector shaping | molding from the board | substrate for light-emitting devices which has the said reflector. The manufacturing method of the board | substrate for light-emitting devices which has a reflector of Claim 3 or 4 whose said reflector is a reflector for light emitting diode elements. Disposing the reflector molding mold release film such that the other layer A ′ of the film is in contact with the inner surface of the mold;
Placing an electrode substrate in the mold;
Filling the mold with a molding resin composition to obtain a light emitting device substrate having a reflector;
Peeling the release film for forming the reflector from the substrate for a light emitting device having the reflector; and
The mold release film for reflector shaping | molding of Claim 1 or 2 used for the manufacturing process of the board | substrate for light-emitting devices which has a reflector containing this.

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