JP5621225B2 - Boiling cooler - Google Patents

Description

  The present invention relates to a boiling cooling apparatus that radiates heat of a high-temperature medium by boiling and evaporating a refrigerant with the heat of the high-temperature medium, and then condensing the refrigerant.

  This kind of boiling cooling device is used for cooling inside a sealed storage box having an electronic component or the like that generates heat inside a base station of a mobile phone.

  In recent years, higher performance of electronic components and higher density of electronic components with respect to the control board have progressed, the amount of heat generated from the control board has increased dramatically, and the storage boxes for electronic components etc. have also become smaller, cooling There is a demand for higher performance and downsizing of equipment, and improved flexibility in layout that can be installed on either the side or top surface of a storage box for electronic components and the like.

  For this reason, a cooling method using a heat pipe is known as a cooling method with few components and a large amount of heat transfer (for example, Patent Document 1).

  However, in the heat pipe, the refrigerant vapor that rises by boiling and the refrigerant liquid that condensates and descends move in the same pipe, so that there is a problem that the refrigerant circulation efficiency and the refrigerant circulation efficiency deteriorate and the heat exchange efficiency deteriorates. is there.

  Therefore, the high temperature side heat exchanger in which the refrigerant evaporates and the low temperature side heat exchanger in which the refrigerant condensates are separated, and the refrigerant boiled and evaporated in the high temperature side heat exchanger moves to the low temperature side heat exchanger. And a refrigerant vapor pipe that connects the high temperature side heat exchanger and the low temperature side heat exchanger to each other, and the refrigerant condensed and liquefied in the low temperature side heat exchanger moves to the high temperature side heat exchanger, so that A boiling cooling device that can efficiently dissipate heat by forming a refrigerant circuit with a refrigerant liquid tube that communicates with the side heat exchanger and circulating the refrigerant is known (for example, Patent Document 2).

  Hereinafter, a conventional boiling cooling apparatus will be described with reference to FIG.

  As shown in FIG. 10, the boiling cooling device 101 includes a main body box 107 partitioned by a partition plate 106 so that the high temperature portion 103 through which the high temperature air 102 passes and the low temperature portion 105 through which the low temperature air 104 passes are at the top. A high-temperature side heat exchanger 109 disposed in the high-temperature portion 103 and enclosing therein a refrigerant 108 that receives heat from the high-temperature air 102 and evaporates to boil; and a high-temperature side heat exchanger 109 disposed in the low-temperature portion 105. 109 and boiled and evaporated refrigerant 108 radiates heat to the low-temperature air 104 to condense and liquefy, and a low-temperature side heat exchanger 110 that penetrates the partition plate 106 and the high-temperature side heat exchanger 109 and the low-temperature side heat. A refrigerant vapor pipe 111 and a refrigerant liquid pipe 112 communicating with the exchanger 110, an indoor fan 113 that blows the high-temperature air 102 to the high-temperature portion 103, An outdoor blower 114 that blows the low-temperature air 104 to the portion 105, a low-temperature side partition member 115 that prevents the refrigerant vapor pipe 111 from being exposed to the low-temperature air 104 blown by the outdoor blower 114, and the refrigerant A high temperature side partition member 116 that prevents the liquid pipe 112 from being exposed to the high temperature air 102 blown by the indoor fan 113, and the refrigerant 108 that has boiled and evaporated in the high temperature side heat exchanger 109 is caused by a difference in density. The refrigerant 108 that has flowed and moved through the refrigerant vapor pipe 111 from the high temperature side heat exchanger 109 to the low temperature side heat exchanger 110 and condensed and liquefied in the low temperature side heat exchanger 110 causes the low temperature side due to the density difference. As the refrigerant 108 moves through the refrigerant liquid pipe 112 from the heat exchanger 110 to the high-temperature side heat exchanger 109, the refrigerant 108 itself is moved. Circulating is the heat of the hot air 102 which dissipates into the cold air 104.

  At this time, when the outside air temperature is below, for example, below freezing point, the temperature of the low-temperature air 104 becomes low. Therefore, the refrigerant vapor pipe 111 is exposed to the low-temperature air 104 passing through the low-temperature portion 105, thereby the refrigerant. The refrigerant 108 that has boiled and evaporated in the vapor pipe 111 is condensed in the refrigerant vapor pipe 111 to prevent circulation of the refrigerant 108, so that the low-temperature partition member 115 causes the refrigerant vapor pipe 111 to be in the low-temperature air. I was prevented from being exposed to 104.

  Similarly, when the temperature in the storage box for electronic components or the like exceeds 60 ° C. due to heat generated by the electronic components or the like, the temperature of the high-temperature air 102 becomes high, so that the refrigerant liquid pipe 112 is placed in the high-temperature portion 103. The refrigerant liquid pipe 112 is heated by being exposed to the high-temperature air 102 that is ventilated, and the density of the refrigerant 108 is reduced, so that the circulation of the refrigerant 108 is slowed down. The refrigerant liquid pipe 112 was prevented from being exposed to the high temperature air 102.

  In this way, the conventional boiling cooling device efficiently circulates the refrigerant and prevents the heat exchange efficiency from being lowered.

Japanese Patent Publication No. 02-003320 JP 09-326582 A

  In such a conventional boiling cooling device, the high-temperature side partition member and the low-temperature side partition member are provided in order to efficiently circulate the refrigerant. However, this increases the number of parts and reduces the size of the boiling cooling device. There was a problem that it was hindered and the cost increased.

  In addition, in conventional boiling cooling devices, hot air has a lower density than cold air, and hot air tends to accumulate in the upper part of a storage box for electronic components. The high-temperature part is ventilated, and low-temperature air is sucked in from the front of the boiling cooling device and discharged to the front, so the air passage structure through which high-temperature air and low-temperature air are vented is complicated, and the height of the main body is high. The size in the depth direction is smaller than the size in the direction, and it is a configuration that is specially arranged on the side surface of the storage box for electronic components, etc. The installation area is large, and dust and wind and rain directly enter the low-temperature heat exchanger, making it difficult to install on the top.

  The present invention solves such a problem. By changing the arrangement of the constituent members, it is possible to easily and efficiently circulate the refrigerant without using the high temperature side partition member and the low temperature side partition member. It can be installed on either the side or top of the storage box for electronic parts, etc., corresponding to the downsizing of the storage box, minimizing cost and enabling efficient heat exchange with a simple configuration The purpose is to obtain a boiling cooling device.

  And in order to achieve this object, the present invention is in a main body box partitioned by a partition plate so that a high-temperature portion through which high-temperature air passes is at the bottom and a low-temperature portion through which low-temperature air is through is at the top, At least one high-temperature side heat exchanger disposed in the high-temperature portion, having a high-temperature side steam header on the upper side and a high-temperature side liquid header on the lower side and enclosing therein a refrigerant that receives heat from the high-temperature air and evaporates to the boiling; At least a low-temperature side steam header on the upper side and a low-temperature side liquid header on the lower side, communicated with the high-temperature side heat exchanger and radiated to the low-temperature air by the refrigerant that has boiled and evaporated to at least condense and liquefy the refrigerant One low temperature side heat exchanger, at least one refrigerant vapor pipe passing through the partition plate and communicating the high temperature side steam header and the low temperature side steam header, and through the partition plate and passing through the high temperature side liquid header. And at least one refrigerant liquid pipe communicates between the low temperature side liquid header with.

  At this time, a refrigerant circuit is formed in which the refrigerant circulates in the order of the high temperature side heat exchanger → the refrigerant vapor pipe → the low temperature side heat exchanger → the refrigerant liquid pipe → the high temperature side heat exchanger. Is a boiling cooling device that radiates heat of the high-temperature air to the low-temperature air by circulating the refrigerant with a phase change.

In such a boiling cooling apparatus, the high temperature side heat exchanger is inclined at a predetermined angle at an acute angle or an obtuse angle with respect to the flow direction of the high temperature air, and the low temperature side heat exchanger is inclined in the flow direction of the low temperature air. On the other hand, the refrigerant vapor pipe is inclined at an acute angle or an obtuse angle by a predetermined angle, the refrigerant vapor pipe is arranged on the leeward side of the low temperature side heat exchanger with respect to the flow direction of the low temperature air, and the refrigerant vapor pipe and the refrigerant liquid pipe are 1 The refrigerant vapor pipe connects one end of each of the high temperature side vapor header and the low temperature side vapor header, and the refrigerant liquid pipe is the other of the high temperature side liquid header and the low temperature side liquid header. The ends are connected to each other, the flow direction of the high-temperature air and the flow direction of the low-temperature air are opposed, and the high-temperature side heat exchanger is disposed on the windward side of the low-temperature side heat exchanger with respect to the flow direction of the high-temperature air. Is The main body box is installed on the top surface of a storage box such as an electronic component, and in the high temperature side heat exchanger, the high temperature side liquid header is arranged on the windward side of the high temperature side steam header with respect to the flow direction of the high temperature air. In the low temperature side heat exchanger, the low temperature side liquid header is arranged on the windward side of the low temperature side steam header with respect to the flow direction of the low temperature air .

  Another means is that the refrigerant liquid pipe is arranged on the leeward side of the high temperature side heat exchanger with respect to the flow direction of the high temperature air.

  Another means includes a plurality of high temperature side heat exchangers and low temperature side heat exchangers.

  The other means includes a holding member that holds the high temperature side heat exchanger and the low temperature side heat exchanger in a predetermined posture.

  Another means is provided with a refrigerant liquid reservoir capable of accumulating refrigerant in the refrigerant liquid pipe.

  In another means, the partition plate also serves as a partition plate for high-temperature air.

  Another means includes a heat transfer member thermally connected to the partition plate in each of the high temperature side steam header and the low temperature side liquid header.

  Another means includes a sealing valve in the refrigerant vapor pipe.

  According to the present invention, the height direction of the main body box can be reduced by inclining the high-temperature side heat exchanger and the low-temperature side heat exchanger, and the refrigerant vapor pipe is connected to the low-temperature side heat with respect to the flow direction of the low-temperature air. Even if the outside air temperature is low, for example, below the freezing point by placing it on the leeward side of the exchanger, the refrigerant vapor pipe is exposed only to the air after being heat-exchanged in the low-temperature side heat exchanger. It is possible to prevent the temperature of the refrigerant vapor pipe from cooling down and the refrigerant from condensing, preventing the refrigerant flow from being interrupted and lowering the heat exchange efficiency. Even if the temperature in the storage box for electronic components etc. becomes higher than, for example, 60 ° C. due to the heat generated by the electronic components etc. by arranging it on the leeward side of the high temperature side heat exchanger, the refrigerant liquid tube becomes a high temperature side heat exchanger. Because it is exposed only to air after heat exchange Since the medium liquid pipe is warmed and the inside of the refrigerant liquid pipe is heated and the density of the refrigerant is reduced, the flow of the refrigerant liquid can be prevented from slowing down and the heat exchange efficiency can be prevented from being lowered. In addition, since it is possible to reduce the size of the boiling cooling device since the installation of the high temperature side partitioning member and the low temperature side partitioning member can be omitted, the boiling cooling device can be downsized with a simple configuration without reducing the heat exchange efficiency.

  Furthermore, since the boiling cooling device can be reduced in size, it is possible to obtain a boiling cooling device that can be installed on either the side surface or the top surface of the storage box for electronic components, etc. it can.

1 is a schematic side sectional view showing a boiling cooling device according to Embodiment 1 of the present invention. (A) Schematic perspective view showing the heat exchanger part of the boiling cooling device of the first embodiment of the present invention (b) Partial enlarged schematic diagram showing the B part of the heat exchanger of the first embodiment of the present invention Side cross-sectional schematic which shows the boiling cooling device of Embodiment 2 of this invention. Side cross-sectional schematic which shows the boiling cooling device of Embodiment 3 of this invention. (A) Side cross-sectional schematic diagram showing the boiling cooling device of Embodiment 4 of the present invention (b) Schematic perspective view showing the heat exchanger part of the boiling cooling device of Embodiment 4 of the present invention (A) Side sectional view showing the boiling cooling device of Embodiment 5 of the present invention (b) Schematic perspective view showing the heat exchanger part of the boiling cooling device of Embodiment 5 of the present invention The perspective outline figure which shows the heat exchanger part of the boiling cooling device of Embodiment 6 of this invention Side cross-section outline figure which shows the boiling cooling device of Embodiment 7 of this invention. Side cross-section outline figure which shows the boiling cooling device of Embodiment 8 of this invention. (A) Schematic side sectional view showing a conventional boiling cooling device (b) Schematic sectional view taken along the line AA ′ showing a conventional boiling cooling device

The boiling cooling device according to claim 1 of the present invention is in a main body box partitioned by a partition plate so that a high-temperature portion through which high-temperature air passes is at the bottom and a low-temperature portion through which low-temperature air is through is at the top, At least one high-temperature side heat exchanger that is arranged in the high-temperature part and has a high-temperature side steam header on the upper side and a high-temperature-side liquid header on the lower side and that encloses a refrigerant that receives heat from high-temperature air and evaporates to the inside. And at least one low temperature side which comprises a low temperature side vapor header on the upper side and a low temperature side liquid header on the lower side and communicates with the high temperature side heat exchanger to dissipate heat to the low temperature air and to condense and liquefy the refrigerant. A heat exchanger, at least one refrigerant vapor pipe that passes through the partition plate and communicates between the high-temperature side steam header and the low-temperature side steam header, and a small amount that communicates between the high-temperature side liquid header and the low-temperature side liquid header through the partition plate. A refrigerant circuit including at least one refrigerant liquid pipe, wherein the refrigerant circulates in the order of the high temperature side heat exchanger → refrigerant vapor pipe → low temperature side heat exchanger → refrigerant liquid pipe → high temperature side heat exchanger, The refrigerant that has received the heat of high-temperature air in the high-temperature side heat exchanger and boiled and evaporated passes through the refrigerant vapor pipe and moves from the high-temperature side heat exchanger to the low-temperature side heat exchanger due to the density difference. The refrigerant that radiates heat to low-temperature air in the exchanger and condensates and liquefies naturally circulates by moving through the refrigerant liquid tube from the low-temperature side heat exchanger to the high-temperature side heat exchanger due to the density difference, A boiling cooling device that dissipates heat from high-temperature air to low-temperature air. The high-temperature side heat exchanger is inclined at a predetermined angle at an acute angle or an obtuse angle with respect to the flow direction of the high-temperature air, and the low-temperature side heat exchanger is low-temperature air. The coolant vapor pipe is inclined at an acute angle or obtuse angle with respect to the flow direction of the To the flow direction of warm air is located on the leeward side of the low-temperature heat exchanger, the includes a refrigerant vapor pipe and the refrigerant liquid pipe one by one, the refrigerant vapor pipe of the high temperature side steam header and the low-temperature side steam header Either one of the ends is connected to each other, and the refrigerant liquid pipe connects the other ends of the high-temperature side liquid header and the low-temperature side liquid header to each other, and the flow direction of the high-temperature air and the flow direction of the low-temperature air Facing the flow direction of the high-temperature air, the high-temperature side heat exchanger is arranged on the windward side of the low-temperature side heat exchanger, the main body box is installed on the top surface of a storage box such as an electronic component, In the high temperature side heat exchanger, the high temperature side liquid header is arranged on the windward side of the high temperature side steam header with respect to the flow direction of the high temperature air, and in the low temperature side heat exchanger, the high temperature side liquid header is in the flow direction of the low temperature air. From the low-temperature side steam header The low-temperature side liquid header is arranged on the windward side , the high-temperature side heat exchanger is inclined at an acute angle or an obtuse angle with respect to the flow direction of the high-temperature air, and the low-temperature side heat exchanger is inclined with respect to the flow direction of the low-temperature air. For example, by tilting at an acute angle or an obtuse angle, the height direction of the boiling cooling device can be reduced, so that the boiling cooling device can be reduced in size, and the heat transfer area larger than the cross-sectional area of the high temperature part through which high temperature air passes can be obtained. The high temperature side heat exchanger can be installed, and similarly, the low temperature side heat exchanger with a larger heat transfer area than the cross-sectional area of the low temperature part through which the low temperature air passes can be installed, so the heat exchange efficiency is reduced In addition, the refrigerant vapor pipe is arranged on the leeward side of the low-temperature side heat exchanger with respect to the flow direction of the low-temperature air, so that the refrigerant vapor pipe can be used even when the outdoor air is at a low temperature such as below the freezing point. Because it is exposed only to the air after heat exchange in the warm side heat exchanger, the refrigerant vapor pipe is cooled, the refrigerant vapor condenses in the refrigerant vapor pipe, and the flow of the refrigerant vapor is hindered, resulting in a decrease in heat exchange efficiency. Therefore, it is possible to obtain a boil cooling device that can reduce costs with a simple configuration, perform heat exchange efficiently, and has a small size and a high degree of freedom in installation.

  Further, each of the refrigerant vapor pipe and the refrigerant liquid is provided, the refrigerant vapor pipe connects one end of each of the high temperature side vapor header and the low temperature side vapor header, and the refrigerant liquid pipe is connected to the high temperature side liquid header and the low temperature side. The other end of the liquid header is connected to each other. By disposing the refrigerant vapor pipe and the refrigerant liquid pipe separately from each other, the high-temperature side heat exchanger and the low-temperature side heat exchanger can easily circulate the refrigerant throughout. Therefore, since the heat transfer area is maximized, a boiling cooling device capable of efficiently exchanging heat can be obtained.

  Further, the flow direction of the high-temperature air and the flow direction of the low-temperature air are opposed to each other, and the high-temperature side heat exchanger is disposed on the windward side of the low-temperature side heat exchanger with respect to the flow direction of the high-temperature air. When the high-temperature side heat exchanger is arranged so that the high-temperature side steam head is on the windward side and the high-temperature side liquid head is on the leeward side with respect to the flow direction, the low-temperature side steam header is low Place the low-temperature side heat exchanger so that the side liquid header is on the leeward side, and the high-temperature side heat exchanger is so that the high-temperature side steam head is on the leeward side and the high-temperature side liquid head is on the upwind side with respect to the flow direction of the high-temperature air. If the low-temperature side heat exchanger is arranged so that the low-temperature side steam header is on the leeward side and the low-temperature side liquid header is on the upwind side with respect to the flow direction of the low-temperature air, the refrigerant vapor pipe and the refrigerant liquid pipe The bend can be reduced, and the refrigerant steam It is possible to suppress the pressure loss in the pipe and a refrigerant liquid pipe to a minimum, it is possible to obtain a compact cooling apparatus capable of performing efficient heat exchange reduced cost with a simple configuration.

  Furthermore, the main body box is installed on the top surface of the storage box for electronic components, etc., and the high temperature side heat exchanger has a high temperature side liquid header arranged on the windward side of the high temperature side steam header with respect to the flow direction of the high temperature air. In the heat exchanger, the low temperature side liquid header is arranged on the windward side of the low temperature side steam header with respect to the flow direction of the low temperature air, and the high temperature side heat exchanger alternately arranges the refrigerant conduits and the heat transfer fins in the horizontal direction. The heat transfer fins are arranged between the refrigerant conduits and are installed so as to form an air passage in a direction perpendicular to the refrigerant flow direction of the refrigerant conduit.

  At this time, the high-temperature air in the storage box such as electrical parts flows into the high-temperature part from the high-temperature air inlet provided in a part of the bottom surface of the main body box, and passes through the high-temperature side heat exchanger to a part of the bottom surface of the main body box. Since high-temperature air flows out from the provided high-temperature air outlet into a storage box for electronic components, etc., the high-temperature side heat header is located on the windward side of the high-temperature side heat exchanger rather than the high-temperature side steam header in the flow direction of the high-temperature air. Since the air path direction formed by the heat transfer fins follows the annular flow of high-temperature air that circulates between the storage box such as the electronic component and the high-temperature part of the main body box, The ventilation resistance of the heat exchanger can be reduced, and a small boiling cooling device capable of reducing the cost with a simple configuration and efficiently exchanging heat can be obtained.

  Further, the boiling cooling device according to claim 2 is configured such that the refrigerant liquid pipe is disposed on the leeward side of the high temperature side heat exchanger with respect to the flow direction of the high temperature air, and the temperature in the storage box of the electronic component or the like. Even if the temperature of the electronic component or the like increases to a temperature exceeding 60 ° C., for example, the refrigerant liquid tube is exposed only to the air after heat exchange in the high temperature side heat exchanger, so the refrigerant liquid tube is warmed. Since the density of the refrigerant liquid is reduced and the flow of the refrigerant liquid is slow, it is possible to prevent the heat exchange efficiency from being lowered. Can be obtained.

In the boiling cooling device according to claim 3 , the main body box is installed on a side surface of a storage box such as an electronic component, and in the high temperature side heat exchanger, the high temperature side steam is higher than the high temperature side liquid header in the flow direction of high temperature air. The header is arranged on the windward side, and the low-temperature side heat exchanger is configured such that the low-temperature side steam header is arranged on the windward side than the low-temperature side liquid header in the flow direction of the low-temperature air. The high temperature air in the box flows into the high temperature part from the high temperature air inlet provided on the bottom or part of the side of the main body box, passes through the high temperature side heat exchanger, and is provided on part of the side of the main body box. Since high-temperature air flows out from the high-temperature air outlet into a storage box such as an electronic component, in the high-temperature side heat exchanger, the high-temperature side steam header is arranged on the windward side with respect to the flow direction of the high-temperature air. So that hot air is more electronic than hot air outlet When the air flows into the storage box, the direction of the air path formed by the heat transfer fins follows the flow of the high-temperature air so that it is easier to face away from the high-temperature air inlet. It is possible to obtain a small boiling cooling device that can efficiently agitate the air that has flowed into the storage box for electronic components and the like, prevent a short circuit, reduce costs with a simple configuration, and perform heat exchange efficiently. .

The boiling cooling device according to claim 4 is a configuration in which the partition plate also serves as a wind direction plate for high-temperature air, and when the boiling cooling device is installed on either the top surface or the side surface of a storage box such as an electronic component. The high-temperature air that has flowed in from the high-temperature air inlet provided on the bottom surface or part of the side surface of the main body box can easily be directed to the high-temperature side heat exchanger, and the high-temperature air after passing through the high-temperature side heat exchanger When flowing out from the high temperature air outlet provided in the bottom or side of the inside of the storage box such as the electronic component, the flow direction of the high temperature air can be the most away from the high temperature air inlet, A boiling cooling device capable of efficiently exchanging heat can be obtained.

The boiling cooling device according to claim 5 is configured to include a plurality of high temperature side heat exchangers in the flow direction of high temperature air and a plurality of low temperature side heat exchangers in the flow direction of low temperature air. By installing the refrigerant circuit in the main body box, a large heat transfer area can be secured, and a boiling cooling device capable of efficiently exchanging heat can be obtained.

The boiling cooling device according to claim 6 includes a plurality of high-temperature side heat exchangers and a plurality of low-temperature side heat exchangers, forms a plurality of refrigerant circuits, and the refrigerant vapor pipes between the adjacent refrigerant circuits are the high-temperature side vapor header. In addition, the position where the refrigerant liquid pipe is connected to the high temperature side liquid header and the low temperature side liquid header is also symmetrical. In the heat exchanger, the refrigerant circulation is biased in the left-right direction, so that the left-right direction can be reduced on the lee side of the high-temperature side heat exchanger in the direction of hot air flow or on the lee side of the low-temperature side heat exchanger in the direction of low-temperature air flow. Since the temperature distribution is biased, when a plurality of refrigerant circuits are provided, the layout of the refrigerant vapor pipe and the refrigerant liquid pipe are arranged symmetrically so that the temperature distribution of the high-temperature air or low-temperature air generated in one refrigerant circuit can be reduced. Left and right Ri to eliminate by passing a plurality of refrigerant circuits, in a storage box, such as electronic components, it is possible to obtain a cooling apparatus which can circulate the air in the uniform temperature stably.

The boiling cooling device according to claim 7 includes a holding member that holds the high-temperature side heat exchanger and the low-temperature side heat exchanger in a predetermined posture, and the refrigerant vapor pipe and the refrigerant liquid are provided between the holding member and the main body box. It can be easily installed in the main body box while maintaining the high temperature side heat exchanger and the low temperature side heat exchanger in a predetermined posture, and at least one of the refrigerant vapor pipe and the refrigerant liquid pipe. The part is placed between the holding member and the main body box, making it difficult for the refrigerant vapor pipe and the refrigerant liquid pipe to be exposed to high-temperature air and low-temperature air, reducing the cost with a simple configuration, and allowing efficient heat exchange A cooling device can be obtained.

Moreover, the boiling cooling device according to claim 8 includes two refrigerant vapor pipes and two refrigerant liquid pipes, and holds the high temperature side heat exchanger and the low temperature side heat exchanger by the refrigerant vapor pipe and the refrigerant liquid pipe. The two refrigerant vapor pipes connect both ends of the high temperature side vapor header and the low temperature side vapor header, respectively, and the two refrigerant liquid pipes connect both ends of the high temperature side liquid header and the low temperature side liquid header, respectively. In the side heat exchanger and the low temperature side heat exchanger, the deviation in the flow of the refrigerant circulation in the left-right direction is reduced, so heat can be exchanged efficiently, and the refrigerant liquid pipe and the refrigerant vapor pipe are on the high temperature side. By serving also as a holding member that holds the heat exchanger and the low-temperature side heat exchanger at predetermined positions, it is possible to obtain a small boiling cooling device that can reduce the cost and efficiently perform heat exchange with a simple configuration. .

The boiling cooling device according to claim 9 is a configuration including a refrigerant liquid reservoir capable of storing the refrigerant in a portion where the refrigerant liquid pipe and the high temperature side liquid header are connected, and a refrigerant necessary for a required cooling capacity. Since more refrigerant than the amount enclosed can be stored in the refrigerant circuit, even if the refrigerant in the refrigerant circuit leaks, the predetermined amount of refrigerant enclosed can be maintained, and heat can be efficiently exchanged without reducing heat exchange efficiency. A boiling cooling device that can be exchanged can be obtained.

The boiling cooling device according to claim 10 is provided with a heat transfer member thermally connected to each of the partition plates on the high temperature side steam header and the low temperature side liquid header, and the heat of the high temperature air is transferred to the low temperature air. It is possible to obtain a boiling cooling device that assists in heat dissipation and can efficiently perform heat exchange.

The boiling cooling device according to claim 11 is provided with a sealing valve in the refrigerant vapor pipe, and when heat exchange is not necessary in winter or at night, the cooling valve is closed to circulate the refrigerant. Since the heat exchange can be stopped by stopping, a boiling cooling device that can prevent the temperature in the storage box of electronic components and the like from dropping excessively and can stably maintain the temperature in the storage box of electronic components and the like. Can be obtained.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a schematic side sectional view of the boiling cooling device of the present embodiment, FIG. 2 (a) is a schematic perspective view of a heat exchanger portion, and FIG. 2 (b) is an enlarged schematic view of a B portion.

  As shown in FIG. 1, the boiling cooling device 1 is installed on the top surface of a sealed storage box 2 that includes electronic components that generate heat inside a base station of a mobile phone, for example. The outdoor blower 4 blows air so that the high temperature air 5 and the low temperature air 6 face each other.

  As shown in FIG. 1 and FIG. 2 (a), the boil cooling device 1 has a partition plate 9 so that the high temperature portion 7 through which the high temperature air 5 is vented is at the bottom and the low temperature portion 8 through which the low temperature air 6 is at the top. A refrigerant 13 which is disposed in the main body box 10 and is disposed in the high temperature portion 7 and has a high temperature side steam header 11 on the upper side and a high temperature side liquid header 12 on the lower side and receives heat from the high temperature air 5 and evaporates to boiling, for example, R134a , And one high temperature side heat exchanger 14 enclosed in the inside, and a low temperature side steam header 15 disposed on the upper side and a low temperature side liquid header 16 disposed on the lower side, and communicated with the high temperature side heat exchanger 14. One of the low-temperature side heat exchangers 17 that radiate and evaporate the vapor of the refrigerant 13 that has boiled and evaporated to the low-temperature air 6 and condense and liquefy it, and the high-temperature side steam header 11 and the low-temperature side steam header 15 communicate with each other through the partition plate 9. One refrigerant vapor pipe 18 And a single refrigerant liquid pipe 19 that penetrates the partition plate 9 and communicates the high-temperature side liquid header 12 and the low-temperature side liquid header 16, and exchanges the high-temperature air 5 in the storage box 2 such as an electronic component with high-temperature side heat exchange. The indoor side blower 3 that blows air to the cooler 14, for example, a propeller fan or a turbo fan, and the outdoor side blower 4 that blows outside air as the low temperature air 6 to the low temperature side heat exchanger 17 are provided.

  A part of the bottom surface of the high temperature portion 7 of the main body box 10 is provided with a high temperature air inlet 20 through which the high temperature air 5 flows in and a high temperature air outlet 21 through which the high temperature air 5 flows out. 8 is provided with a low temperature air inlet 22 through which the low temperature air 6 flows and a low temperature air outlet 23 through which the low temperature air 6 flows. The high temperature air inlet 20 and the high temperature air outlet 21 are arranged at positions sufficiently separated from each other so that the high temperature air 5 does not short circuit. Similarly, the low temperature air inlet 22 and the low temperature air outlet 23 are arranged at positions sufficiently separated from each other so that the low temperature air 6 does not short circuit.

  The indoor blower 3 is arranged between the high temperature side heat exchanger 14 and the high temperature air outlet 21 in the high temperature portion 7, and the outdoor blower 4 is arranged in the low temperature portion 8 with the low temperature side heat exchanger 17 and the low temperature air flow. Arranged between the outlets 23.

  As shown in FIG. 2B, the high temperature side heat exchanger 14 and the low temperature side heat exchanger 17 are configured by alternately stacking refrigerant conduits 24 and heat transfer fins 25 in the left-right direction. Is a flat tube having a plurality of holes serving as refrigerant flow paths inside, and heat transfer fins 25, for example, corrugated louver fins, are located between the refrigerant conduits 24 and between the refrigerant 13 and the hot air 5 or the cold air 6. The heat transfer fin 25 is installed so as to form an air passage in a direction perpendicular to the refrigerant flow direction of the refrigerant conduit 24.

  As shown in FIG. 1, the high temperature side heat exchanger 14 and the low temperature side heat exchanger 17 are attached to the main body box 10 by a holding member 26, and the holding member 26 is a part of the refrigerant vapor pipe 18 and the refrigerant liquid pipe 19. It is arranged to cover.

  The high temperature side steam header 11, the high temperature side liquid header 12, the low temperature side steam header 15, and the low temperature side liquid header 16 have holes that match the cross-sectional shape of the flat tube, which is the refrigerant conduit 24, respectively. The number of refrigerant conduits 24 constituting the heat exchanger 17 is opened, and the refrigerant conduits 24 are press-fitted into the holes thereof, whereby the high temperature side liquid header 12, the refrigerant conduit 24, the high temperature side steam header 11, or the low temperature side steam header. 15, the refrigerant conduit 24, and the low temperature side liquid header 16 communicate with each other in an airtight manner.

  Further, the high temperature side steam header 11, the high temperature side liquid header 12, the low temperature side steam header 15, and the low temperature side liquid header 16 are each attached with a hollow pipe as a lead pipe and attached to the high temperature side steam header 11. The lead pipe and one end of the refrigerant vapor pipe 18 are hermetically connected, and the lead pipe attached to the low temperature side steam header 15 and the other end of the refrigerant vapor pipe 18 are hermetically connected, and the high temperature side liquid header. The lead pipe attached to 12 and one end of the refrigerant liquid pipe 19 are airtightly connected, and the lead pipe attached to the low temperature side liquid header 16 and the other end of the refrigerant liquid pipe 19 are airtightly connected.

  The lead pipe attached to the high temperature side steam header 11 and the low temperature side steam header 15 is heated from one end of the high temperature side steam header 11 and the low temperature side steam header 15 so that the refrigerant vapor pipe 18 is parallel to the refrigerant conduit 24. The side steam header 11 and the low temperature side steam header 15 are vertically attached.

  Similarly, the lead pipe attached to the high temperature side liquid header 12 and the low temperature side liquid header 16 is one of the high temperature side liquid header 12 and the low temperature side liquid header 16 so that the refrigerant liquid pipe 19 is parallel to the refrigerant conduit 24. From the end, it is vertically attached to the high temperature side liquid header 12 and the low temperature side liquid header 16.

  At this time, as for the lead pipe attached to the high temperature side steam header 11 and the low temperature side steam header 15 or the lead pipe attached to the high temperature side liquid header 12 and the low temperature side liquid header 16, the refrigerant vapor pipe 18 and the refrigerant liquid pipe 19 are sufficient. It is arranged at a position away from.

  The above-described configuration forms an airtight refrigerant circuit, and the refrigerant 13 circulates in the order of the high temperature side heat exchanger 14 → the refrigerant vapor pipe 18 → the low temperature side heat exchanger 17 → the refrigerant liquid pipe 19 → the high temperature side heat exchanger 14. .

  The high-temperature side heat exchanger 14 is disposed with an inclination of, for example, 45 degrees with respect to the flow direction of the high-temperature air 5 so that the high-temperature side steam header 11 is on the windward side with respect to the high-temperature side liquid header 12. The exchanger 17 is disposed with an inclination of, for example, 45 degrees with respect to the flow direction of the low-temperature air 6 so that the low-temperature side steam header 15 is on the windward side of the low-temperature side liquid header 16. The high temperature side heat exchanger 14 is arranged on the windward side of the low temperature side heat exchanger 17.

  In addition, the refrigerant vapor pipe 18 is arranged on the leeward side of the low temperature side heat exchanger 17 with respect to the flow direction of the low temperature air 6, and the refrigerant liquid pipe 19 is more than the high temperature side heat exchanger 14 with respect to the flow direction of the high temperature air 5. Located on the leeward side.

  Further, the high-temperature air 5 is formed between the left and right ends of the high-temperature side heat exchanger 14 and between the high-temperature side steam header 11 and the high-temperature side liquid header 12 and the main body box 10 or the partition plate 9 by a gap material 27, for example, caulking silicon or an opt sealer. The high-temperature air 5 always passes between the refrigerant conduits 24 of the high-temperature side heat exchanger 14, and similarly, the left and right ends of the low-temperature side heat exchanger 17, the low-temperature side steam header 15 and the low-temperature side liquid. The low-temperature air 6 is prevented from flowing between the header 16 and the main body box 10 or the partition plate 9 by the gap material 27, and the low-temperature air 6 always passes between the refrigerant conduits 24 of the low-temperature side heat exchanger 17.

  Next, the operation of the above boiling cooling device will be described.

  In the high temperature portion 7, the high temperature air 5 flowing from the high temperature air inlet 20 is blown to the high temperature side heat exchanger 14 by the indoor blower 3, and the high temperature side heat exchanger 14 receives the heat of the high temperature air 5 to increase the temperature. The refrigerant 13 enclosed in the side heat exchanger 14 evaporates and evaporates, flows through the refrigerant vapor pipe 18 due to the density difference, and moves to the low temperature side heat exchanger 17. At this time, the refrigerant 13 takes away the amount of latent heat of evaporation from the high-temperature air 5, so that the high-temperature air 5 is cooled, and the cooled high-temperature air 5 flows out from the high-temperature air outlet 21 into the storage box 2 such as an electronic component.

  Further, in the low temperature portion 8, outside air flows from the outdoor air blower 4 as low temperature air 6 through the low temperature air inlet 22 and is blown to the low temperature side heat exchanger 17, and in the low temperature side heat exchanger 17, the high temperature side heat exchanger 17. The refrigerant 13 moved from 14 is condensed and liquefied due to a temperature difference with the low temperature air 6, and the refrigerant 13 flows through the refrigerant liquid pipe 19 due to the density difference and moves to the high temperature side heat exchanger 14. At this time, since the heat quantity of the latent heat of condensation of the refrigerant 13 is taken away by the low temperature air 6, the heat taken by the refrigerant 13 from the high temperature air 5 is radiated to the low temperature air 6, and the low temperature air 6 flows out from the low temperature air outlet 23 to the outside air. To do.

  As described above, the refrigerant 13 naturally circulates in the refrigerant circuit, whereby the inside of the storage box 2 such as an electronic component can be cooled.

  In such a boiling cooling device, the high temperature side heat exchanger 14 and the low temperature side heat exchanger 17 are inclined so that the height direction of the main body box 10 can be reduced and the high temperature portion through which the high temperature air 5 is ventilated. The high temperature side heat exchanger 14 having a heat transfer area larger than the cross sectional area of 7 can be installed, and similarly, the low temperature side having a larger heat transfer area than the cross sectional area of the low temperature portion 8 through which the low temperature air 6 passes. Since it becomes possible to install the heat exchanger 17, the height direction of the boiling cooling device 1 can be reduced, and the high temperature side heat exchanger 14 and the low temperature side heat exchanger 17 having a large heat transfer area can be provided. Since it can be installed, it is possible to reduce the size of the boiling cooling device without lowering the heat exchange efficiency.

  Furthermore, the refrigerant vapor pipe 18 is arranged on the leeward side of the low-temperature side heat exchanger 17 with respect to the flow direction of the low-temperature air 6, so that the refrigerant vapor pipe can be used even when the outside air temperature is low, for example, below the freezing point. 18 is exposed only to the air after heat exchange in the low temperature side heat exchanger 17, the refrigerant vapor pipe 18 is cooled, the refrigerant 13 is condensed in the refrigerant vapor pipe 18, and the flow of the refrigerant 13 is obstructed. In addition, even if the temperature in the storage box 2 for electronic components or the like becomes a high temperature exceeding 60 ° C. due to heat generated by the electronic components or the like, the refrigerant liquid tube 19 is heated by the high-temperature side heat exchanger 14. Since the refrigerant liquid pipe 19 is warmed to reduce the density of the refrigerant 13 and the flow of the refrigerant 13 can be prevented from slowing because the refrigerant liquid pipe 19 is exposed to only the air after the replacement, the refrigerant vapor pipe 18 is exposed to the outside air. Exposed or refrigerant liquid pipe Since the member which prevents 9 from being exposed to the high-temperature air 5 is not required, the boiling cooling device can be downsized, the downsizing of the boiling cooling device can be realized without lowering the heat exchange efficiency, and the boiling cooling device can be downsized. Therefore, since it can be installed on the top surface of the electronic component storage box 2 in response to the miniaturization of the electronic component storage box 2, the cost can be reduced with a simple structure, and heat exchange can be performed efficiently. Thus, a boiling cooling device having a high degree of freedom in installation can be obtained.

  Furthermore, the high temperature side heat exchanger 14 is arranged so that the high temperature side steam header 11 is on the windward side of the high temperature side liquid header 12 with respect to the flow direction of the high temperature air 5, and the low temperature side heat exchanger 17 is the low temperature air 6. The low-temperature side steam header 15 is arranged on the windward side of the low-temperature side liquid header 16 with respect to the flow direction of the hot air, and the high-temperature side heat exchanger 14 is arranged with respect to the flow direction of the high-temperature air 5 from the low-temperature side heat exchanger 17. Is also arranged on the windward side, the direction of the air path formed by the heat transfer fins 25 is an annular flow of the high-temperature air 5 that circulates between the storage box 2 for electronic components and the high-temperature portion 7 of the main body box 10. Therefore, the ventilation resistance of the high temperature side heat exchanger 14 can be reduced, and the bent portions of the refrigerant vapor pipe 18 and the refrigerant liquid pipe 19 can be reduced. Minimizing pressure loss Kill Therefore, it is possible to perform efficiently the refrigerant circulation is suppressed the loss of a pipe, reducing the cost with a simple structure can be obtained efficiently compact cooling apparatus for the heat exchange can be performed.

  Furthermore, the high temperature side heat exchanger 14 and the low temperature side heat exchanger 17 can be easily installed in the main body box 10 by the holding member 26, and the holding member 26 is part of the refrigerant vapor pipe 18 and the refrigerant liquid pipe 19. The refrigerant vapor pipe 18 is less likely to be exposed to the low temperature air 6 and the refrigerant liquid pipe 19 is less likely to be exposed to the high temperature air 5 so that the refrigerant can be circulated more efficiently. The heat exchange efficiency of the boiling cooling device can be improved.

  Furthermore, the outdoor blower 4 is arranged on the leeward side with respect to the flow direction of the low temperature air 6 so that the low temperature air 6 is driven to the low temperature side heat exchanger 17 before the outdoor blower 4 is driven. Since it can prevent warming by heat_generation | fever, the heat exchange efficiency of a boiling cooling device can be improved.

  In addition, by making the partition plate 9 into a sheet metal plate that does not insulate, the high-temperature air 5 and the low-temperature air 6 can exchange heat through the partition plate 9, and the heat exchange efficiency of the boiling cooling device can be improved.

  It should be noted that the surface area of the partition plate 9 may be roughened to increase the surface area, and the heat exchange efficiency of the boiling cooling device can be further improved.

  The refrigerant conduit 24, the heat transfer fin 25, the high temperature side steam header 11, the high temperature side liquid header 12, the low temperature side steam header 15, the low temperature side liquid header 16, and the lead pipe are preferably made of aluminum. Excellent copper or silver may be used, which can further improve the heat exchange efficiency of the boiling cooling device.

  In the low temperature portion 8, the low temperature air inlet 22 into which the low temperature air 6 flows and the low temperature air outlet 23 from which the low temperature air 6 flows out may be provided with louvers 28 to prevent dust and foreign matter from entering, Thereby, the reliability of the boiling cooling device can be improved.

  The inclination angle of the high temperature side heat exchanger 14 and the low temperature side heat exchanger 17 is 40 to 50 degrees in consideration of the fact that the boiling cooling device can be miniaturized and the refrigerant 13 circulates in the refrigerant circuit due to the density difference. Preferably, it can be set arbitrarily so that the high temperature side heat exchanger 14 or the low temperature side heat exchanger 17 can be accommodated in the high temperature portion 7 or the low temperature portion 8 between 20 degrees and 70 degrees according to the installation method of the boiling cooling device. Since the size can be adjusted to the size of the storage box 2 such as parts, a boiling cooling device having a small size and a high degree of freedom in installation can be obtained.

(Embodiment 2)
In the second embodiment of the present invention, the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  FIG. 3 shows a schematic side sectional view of the boiling cooling device of the second embodiment.

  As shown in FIG. 3, the boil cooling device is installed on the side surface in the storage box 2 for electronic components and the like, and a high temperature air inlet 20 is provided on a part of the side surface of the high temperature portion 7 of the main body box 10. A high-temperature air outlet 21 is provided in a part of the side surface of the low-temperature portion 8, and in the high-temperature side heat exchanger 14, the high-temperature side steam header 11 is on the windward side with respect to the flow direction of the high-temperature air 5. The low-temperature side heat exchanger 17 has a configuration in which the low-temperature side steam header 15 is arranged on the windward side of the low-temperature side liquid header 16 with respect to the flow direction of the low-temperature air 6. The hot air 5 in the air 2 flows from the hot air inlet 20 into the high temperature portion 7, passes through the high temperature side heat exchanger 14, and flows out from the hot air outlet 21 into the storage box 2 for electronic components and the like. To do.

  At this time, in the high temperature side heat exchanger 14, the high temperature side steam header 11 is disposed on the windward side of the high temperature side liquid header 12 with respect to the flow direction of the high temperature air 5, so that the high temperature air 5 is supplied from the high temperature air outlet 21. Since the direction of the air path formed by the heat transfer fins 25 follows the flow of the high-temperature air 5 so that it is easy to face away from the high-temperature air inlet 20 when it flows out into the storage box 2 for electronic components, etc. The air in the storage box 2 can be agitated as a whole, the air flowing out to the storage box 2 such as electronic parts can be prevented from being short-circuited, and the heat exchange efficiency of the boiling cooling device can be improved.

(Embodiment 3)
In the third embodiment of the present invention, the same parts as those in the first or second embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  FIG. 4 shows a schematic side sectional view of the boiling cooling device of the third embodiment.

  As shown in FIG. 4, the boiling cooling device is installed on the top surface of the storage box 2 for electronic components and the like, and the partition plate 9 also serves as a wind direction plate for the high temperature air 5, and the high temperature flowing in from the high temperature air inlet 20. When the air 5 passes through the high temperature side heat exchanger 14 and flows out from the high temperature air outlet 21 into the storage box 2 such as an electronic component, the flow direction of the high temperature air 5 is farthest from the high temperature air inlet 20. Therefore, a boiling cooling device capable of efficiently exchanging heat can be obtained.

  Furthermore, since the surface area of the partition plate 9 increases, the amount of heat exchanged between the high-temperature air 5 and the low-temperature air 6 performed on the partition plate 9 increases, so that the heat exchange efficiency of the boiling cooling device is improved. be able to.

  The indoor blower 3 may be inclined so as to be parallel to the high temperature side heat exchanger 14, and at this time, the flow direction of the high temperature air 5 is easily along the direction of the air path formed by the heat transfer fins 25. The power consumption of the inner blower 3 can be reduced.

(Embodiment 4)
In the fourth embodiment of the present invention, the same parts as those in the first to third embodiments are denoted by the same reference numerals, and detailed description thereof is omitted.

  FIG. 5A shows a schematic side sectional view of the boiling cooling device of the fourth embodiment, and FIG. 5B shows a schematic perspective view of a heat exchanger portion.

  As shown in FIG. 5A, the boiling cooling apparatus includes two high temperature side heat exchangers 14 in the flow direction of the high temperature air 5 and two low temperature side heat exchangers 17 in the flow direction of the low temperature air 6. , Two refrigerant vapor pipes 18, two refrigerant liquid pipes 19, one high temperature side heat exchanger 14, one low temperature side heat exchanger 17, one refrigerant vapor pipe 18, and a refrigerant liquid pipe 19. Are formed side by side in the flow direction of the high-temperature air 5 or the low-temperature air 6, and the refrigerant vapor pipe 18 between the adjacent refrigerant circuits is connected to the high-temperature side steam header 11 and the low-temperature side steam. The position connected to the header 15 is bilaterally symmetric with respect to the plane parallel to the refrigerant conduit 24, and similarly the position where the refrigerant liquid pipe 19 is connected to the high temperature side liquid header 12 and the low temperature side liquid header 16 is parallel to the refrigerant conduit 24. The structure is symmetrical with respect to the plane. By installing the refrigerant circuit in the main body box 10, it is possible to secure a large heat transfer area, and in the high temperature side heat exchanger 14 or the low temperature side heat exchanger 17, the refrigerant circulation is biased in the horizontal direction. Even if the temperature distribution is biased in the left-right direction on the leeward side of the high-temperature side heat exchanger 14 in the flow direction of the high-temperature air 5 or on the leeward side of the low-temperature side heat exchanger 17 in the flow direction of the low-temperature air 6, two refrigerants are generated. By arranging the layout of the refrigerant vapor pipe 18 and the refrigerant liquid pipe 19 symmetrically in the circuit, the horizontal deviation of the temperature distribution of the high temperature air 5 or the low temperature air 6 generated in one refrigerant circuit is passed through the two refrigerant circuits. Therefore, it is possible to stably circulate air at a uniform temperature in the storage box 2 for electronic components and the like, and to obtain a boiling cooling device that can perform heat exchange efficiently.

(Embodiment 5)
In the fifth embodiment of the present invention, the same parts as those in the first to fourth embodiments are denoted by the same reference numerals, and detailed description thereof is omitted.

  FIG. 6A is a side sectional view showing the boiling cooling device of the fifth embodiment, and FIG. 6B is a schematic perspective view of the heat exchanger portion.

  As shown in FIG. 6, the boiling cooling apparatus includes two refrigerant vapor pipes 18 and two refrigerant liquid pipes 19, and the refrigerant vapor pipe 18 and the refrigerant liquid pipe 19 are fixed to the partition plate 9. 18 and the refrigerant liquid pipe 19 hold the high temperature side heat exchanger 14 and the low temperature side heat exchanger 17, and the two refrigerant vapor pipes 18 respectively connect both ends of the high temperature side steam header 11 and the low temperature side steam header 15. The two refrigerant liquid pipes 19 connect the both ends of the high temperature side liquid header 12 and the low temperature side liquid header 16 respectively, so that the refrigerant in the left-right direction can be obtained in the high temperature side heat exchanger 14 and the low temperature side heat exchanger 17. Since the bias of the circulation flow is reduced, heat exchange can be performed efficiently.

  Furthermore, the two refrigerant liquid pipes 19 and the two refrigerant vapor pipes 18 fixed to the partition plate 9 can hold the high temperature side heat exchanger 14 and the low temperature side heat exchanger 17 at predetermined positions at two points, and a holding member Thus, it is possible to obtain a small boiling cooling device capable of reducing the cost and efficiently exchanging heat with a simple configuration.

(Embodiment 6)
In the sixth embodiment of the present invention, the same parts as those in the first to fifth embodiments are denoted by the same reference numerals, and detailed description thereof is omitted.

  FIG. 7 is a schematic perspective view of the heat exchanger portion of the boiling cooling device according to the sixth embodiment.

  As shown in FIG. 7, the boiling cooling device has a configuration in which a refrigerant liquid reservoir 29 is provided at a portion where the refrigerant liquid pipe 19 and the high temperature side liquid header 12 are connected, and the refrigerant 13 can be stored in the refrigerant liquid reservoir 29. Even if the refrigerant 13 in the refrigerant circuit leaks, a predetermined refrigerant filling amount can be maintained, so that a boiling cooling device capable of efficiently exchanging heat without reducing the heat exchange efficiency can be obtained. it can.

  The refrigerant liquid reservoir 29 is preferably a cylindrical container or a spherical container so that even if the internal pressure becomes high, it is preferably a cylindrical container or a spherical container, which can improve the reliability of the boiling cooling device.

(Embodiment 7)
In the seventh embodiment of the present invention, the same parts as those in the first to sixth embodiments are denoted by the same reference numerals, and detailed description thereof is omitted.

  FIG. 8 is a schematic side sectional view of the boiling cooling device of the seventh embodiment.

  As shown in FIG. 8, the boiling cooling device includes a high-temperature side steam header 11 and a low-temperature side liquid header 16 each including a heat transfer member 30 that is thermally connected to the partition plate 9. For example, it is a member having a high thermal conductivity such as a heat pipe, and a boiling cooling device capable of assisting in radiating heat of the high-temperature air 5 to the low-temperature air 6 and performing heat exchange efficiently is obtained. be able to.

  The heat transfer member 30 may be silicon having high thermal conductivity. At this time, the right and left ends of the high temperature side heat exchanger 14 and the high temperature side steam header 11 and the high temperature side liquid header 12 and the main body box 10 or the partition plate 9 are interposed. The gap material 27 can also serve as the gap material 27 to be filled, and similarly, the gap material 27 to be buried between the left and right ends of the low temperature side heat exchanger 17 and the low temperature side steam header 15 and the low temperature side liquid header 16 and the main body box 10 or the partition plate 9. The heat exchange efficiency of the boiling cooling device can be further improved with a simple configuration.

(Embodiment 8)
In the eighth embodiment of the present invention, the same parts as those in the first to seventh embodiments are denoted by the same reference numerals, and detailed description thereof is omitted.

  FIG. 9 shows a schematic side sectional view of the boiling cooling device of the eighth embodiment.

  As shown in FIG. 9, the boiling cooling device is provided with a sealing valve 31 in the refrigerant vapor pipe 18, and when heat exchange is not necessary in winter or at night, the sealing valve 31 is closed to close the refrigerant 13. Since the heat exchange can be stopped by stopping the circulation, it is possible to prevent the temperature in the storage box 2 for electronic components and the like from being lowered excessively, and to stably maintain the temperature in the storage box 2 for electronic components and the like. A boiling cooling device can be obtained.

  In addition, it is preferable that the sealing valve 31 is an electromagnetic valve, and opening / closing is controlled according to the temperature in the storage box 2 for electronic components and the like, and the temperature in the storage box 2 for electronic components and the like falls below, for example, 30 ° C. The sealing valve 31 starts to close gradually from, for example, when the temperature falls below 5 ° C., the sealing valve 31 is controlled so as to be completely closed. Since it can maintain above, the reliability of a boiling cooling device can further be improved.

  The boiling cooling apparatus according to the present invention can efficiently circulate the refrigerant with a simple configuration, has a high degree of freedom in installation corresponding to the downsizing of electronic components, suppresses cost, and efficiently performs heat exchange. It is useful as a boiling cooling device.

DESCRIPTION OF SYMBOLS 1 Boiling cooler 2 Storage box 3 Indoor side fan 4 Outdoor side fan 5 High temperature air 6 Low temperature air 7 High temperature part 8 Low temperature part 9 Partition plate 10 Main body box 11 High temperature side steam header 12 High temperature side liquid header 13 Refrigerant 14 High temperature side heat exchange 15 Low temperature side steam header 16 Low temperature side liquid header 17 Low temperature side heat exchanger 18 Refrigerant vapor pipe 19 Refrigerant liquid pipe 20 High temperature air inlet 21 High temperature air outlet 22 Low temperature air inlet 23 Low temperature air outlet 24 Refrigerant conduit 25 Transmission Heat fin 26 Holding member 27 Gap material 28 Louver 29 Refrigerant liquid reservoir 30 Heat transfer member 31 Sealing valve

Claims (10)

The high-temperature part where the high-temperature air is ventilated is in the lower part and the low-temperature part where the low-temperature air is ventilated is in the upper part of the main body box. At least one high-temperature side heat exchanger having a high-temperature side liquid header on the lower side and encapsulating therein a refrigerant that receives heat from the high-temperature air and evaporates to the inside, and a low-temperature side steam header and a lower side disposed in the low-temperature portion At least one low-temperature side heat exchanger that is provided with a low-temperature side liquid header and that vaporizes the refrigerant boiled and evaporated in communication with the high-temperature side heat exchanger to radiate heat to the low-temperature air to condense and liquefy the refrigerant; At least one refrigerant vapor pipe that penetrates the partition plate and communicates the high temperature side steam header and the low temperature side steam header, and the high temperature side liquid header and the low temperature side liquid header that penetrate the partition plate and communicate with each other. At least one refrigerant liquid pipe, wherein the refrigerant is on the high temperature side heat exchanger, then the refrigerant vapor pipe, then the low temperature side heat exchanger, then the refrigerant liquid pipe, again on the high temperature side. A boiling cooling device that forms a refrigerant circuit that circulates in order, and circulates the refrigerant circuit with a phase change in the refrigerant circuit to dissipate heat of the high-temperature air to the low-temperature air. The heat exchanger is inclined at a predetermined angle at an acute angle or an obtuse angle with respect to the flow direction of the high-temperature air, and the low-temperature side heat exchanger is inclined at a predetermined angle at an acute angle or obtuse angle with respect to the flow direction of the low-temperature air, A refrigerant vapor pipe is disposed on the leeward side with respect to the flow direction of the low-temperature air, and includes the refrigerant vapor pipe and the refrigerant liquid pipe one by one. Of header and cold side steam header Either one of the ends is connected, and the refrigerant liquid pipe connects the other ends of the high-temperature side liquid header and the low-temperature side liquid header, respectively, and the flow direction of the high-temperature air and the low-temperature air The high-temperature side heat exchanger is arranged on the windward side of the low-temperature side heat exchanger with respect to the flow direction of the high-temperature air, and the main body box is installed on the top surface of a storage box such as an electronic component. In the high temperature side heat exchanger, the high temperature side liquid header is arranged on the windward side of the high temperature side steam header with respect to the flow direction of the high temperature air, and in the low temperature side heat exchanger, the high temperature side liquid header is arranged in the flow direction of the low temperature air. On the other hand, the low temperature side liquid header is arrange | positioned on the windward side rather than the said low temperature side steam header, The boiling cooling device characterized by the above-mentioned. The boiling cooling device according to claim 1, wherein the refrigerant liquid tube is arranged on the leeward side of the high temperature side heat exchanger with respect to the flow direction of the high temperature air. Cooling apparatus according to any one of claims 1 to 2 partition plate, characterized in that also serves as a wind direction plate of hot air. The boiling cooling apparatus according to any one of claims 1 to 2 , further comprising a plurality of high temperature side heat exchangers in a flow direction of high temperature air and a plurality of low temperature side heat exchangers in a flow direction of low temperature air. A plurality of high-temperature side heat exchangers are provided in the flow direction of the high-temperature air, and a plurality of low-temperature side heat exchangers are provided in the flow direction of the low-temperature air to form a plurality of refrigerant circuits. The positions of the ends connected to the high-temperature side steam header and the low-temperature side steam header are symmetrical, and similarly, the positions of the ends where the refrigerant liquid pipe is connected to the high-temperature side liquid header and low-temperature side liquid header are symmetrical. The boiling cooling device according to any one of claims 1 to 4 , wherein 2. A holding member for holding the high temperature side heat exchanger and the low temperature side heat exchanger in a predetermined posture, and a refrigerant vapor pipe and a refrigerant liquid pipe are arranged between the holding member and the main body box. The boiling cooling device according to any one of 4 . The refrigerant vapor pipe and the refrigerant liquid pipe are provided two by two, and the high temperature side heat exchanger and the low temperature side heat exchanger are held by the refrigerant vapor pipe and the refrigerant liquid pipe. Boiling cooler. The boiling cooling device according to claim 1 or 2, further comprising a refrigerant liquid reservoir capable of accumulating refrigerant at a portion where the refrigerant liquid pipe and the high temperature side liquid header are connected. The boiling cooling device according to claim 1, wherein the high temperature side steam header and the low temperature side liquid header are each provided with a heat transfer member that is thermally connected to the partition plate. The boiling cooling device according to claim 1, wherein the refrigerant vapor pipe is provided with a sealing valve.

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