JP5695509B2 - Superconducting wire and method for manufacturing the same - Google Patents

Description

  The present invention relates to a superconducting wire and a method for manufacturing the same.

The RE-123 oxide superconductor (REBa ₂ Cu ₃ O _7-X : RE is a rare earth element) discovered in recent years exhibits superconductivity at a liquid nitrogen temperature or higher, and is therefore an extremely promising material for practical use. There is a strong demand for processing this into a wire and using it as a conductor for power supply. Among these, superconducting wires using a Y-based oxide superconductor (YBa ₂ Cu ₃ O _7-X ) or a Gd-based oxide superconductor (GdBa ₂ Cu ₃ O _7-X ) are strong against an external magnetic field and strong. High current density can be maintained even in a magnetic field, so that it can be used as a conductor for superconducting coils or as a power supply cable, or to cut off fault currents that may occur when energizing a superconducting wire. Research and development as a conductor for the superconducting fault current limiter is also underway.

As an example of the structure of this type of RE-123 oxide superconducting wire, a film is formed on a tape-like metal substrate 101 by IBAD (Ion-Beam-Assisted Deposition) as shown in FIG. There is known a superconducting wire 100 in which an intermediate layer 102 formed thereon, a cap layer 103 formed thereon, and an oxide superconducting layer 104 are laminated (see, for example, Patent Document 1).
In the above structure, the higher the in-plane orientation of the cap layer 103, the higher the oxide superconducting layer 104 formed thereon, and the higher the in-plane orientation of the oxide superconducting layer 104. The higher the value, the higher the superconducting wire material 100 having excellent superconducting properties such as the critical current value.

The IBAD method irradiates mixed ions of rare gas ions and oxygen ions generated from an ion gun simultaneously from an oblique direction (for example, 45 degrees) when depositing constituent particles knocked out of a target by a sputtering method on a substrate. According to this method, the thin intermediate layer 102 having a thickness of several to several tens of nm can be formed on the substrate with good crystal orientation.
In the superconducting wire 100 having the structure shown in FIG. 10, the intermediate layer 102 and the cap layer 103 adjust the crystal orientation of the oxide superconducting layer 104, suppress unnecessary diffusion of elements accompanying heat treatment during film formation, A layer having an intermediate expansion coefficient between the base material 101 and the oxide superconducting layer 104 to obtain a combined effect such as relieving thermal stress. The layer is formed by laminating these layers in order. An oxide superconducting layer 104 having crystal orientation close to crystals and excellent superconducting characteristics can be obtained.

JP 2004-71359 A

  As described above, a superconducting wire in which an oxide superconducting layer is laminated on a metal substrate via an intermediate layer or a cap layer is used for stress or impact on the wire in the manufacturing process of the wire or the processing of the superconducting coil. When an oxide is loaded, the oxide superconducting layer may be peeled off from the cap layer below it, or a crack may be generated in the oxide superconducting layer. When peeling or cracking occurs in the oxide superconducting layer, peeling or cracking tends to propagate over the entire width direction of the wire.

  The present invention has been made in view of the conventional situation as described above, and suppresses the propagation of cracks and cracks throughout the superconducting layer even when the cracks and cracks are partially generated in the superconducting layer. An object of the present invention is to provide a superconducting wire that can be produced and a method for producing the same.

To solve the above problems, the superconducting wire of the present invention, the intermediate layer and the oxide superconducting layer and the stabilizing layer are laminated in this order is composed superconducting laminate over the substrate, before Kimoto material side It has a plurality of penetrating portions dispersedly formed in the width direction and the length direction of the superconducting laminate so as to reach at least the oxide superconducting layer.
The superconducting wire of the present invention has a structure including a penetrating portion reaching from the base material side to the oxide superconducting layer. Therefore, in the unlikely event that peeling or cracking occurs partially in the oxide superconducting layer, the peeling or cracking is concentrated on the penetrating part, and peeling or cracking occurs in parts other than where the penetrating part of the oxide superconducting layer is formed. Can be prevented from propagating.

In the superconducting wire of the present invention, it is preferable that the inside of the through portion is filled with a filler.
In this case, when the through groove is filled with the filler and the through portion is configured, it is possible to prevent moisture from entering the oxide superconducting layer through the through portion, and the oxide superconducting layer is hardly deteriorated by the water. Therefore, it becomes a superconducting wire having good characteristics.

To solve the above problems, the method of manufacturing a superconducting wire of the present invention, with respect to the intermediate layer and the oxide superconducting layer and the stabilizing layer and the superconducting laminate are laminated in this order over the substrate, before Kimotozai A plurality of holes or grooves are processed so as to reach at least the oxide superconducting layer from the side, and a plurality of through portions are dispersedly formed in the width direction and the length direction of the superconducting laminate .
According to the method for producing a superconducting wire of the present invention, a superconducting wire having a penetrating portion extending from the base material side to the oxide superconducting layer can be produced. Since the superconducting wire manufactured by the method for manufacturing a superconducting wire of the present invention has a structure including a penetrating portion, in the unlikely event that partial peeling or cracking occurs in the oxide superconducting layer, the oxide superconducting layer It is possible to suppress peeling and cracks from propagating to a portion other than the portion where the penetrating portion is formed.

In the method of manufacturing a superconducting wire according to the present invention, the inside of the through portion can be filled with a filler.
In this case, by filling the through groove with a filler to form the through portion, it is possible to suppress moisture from entering the oxide superconducting layer through the through portion, and the oxide superconducting layer is unlikely to deteriorate due to moisture. A superconducting wire having good characteristics can be provided.

  According to the present invention, even if peeling or cracking partially occurs in the superconducting layer, the superconducting wire that can suppress the propagation of peeling or cracking to the entire superconducting layer due to the presence of the through portion and the manufacturing method thereof Can provide.

1 is a schematic perspective view showing a first embodiment of a superconducting wire according to the present invention. It is a partial expanded sectional view of the superconducting wire shown in FIG. It is a schematic perspective view which shows 2nd Embodiment of the superconducting wire which concerns on this invention. It is process explanatory drawing which shows one Embodiment of the manufacturing method of the superconducting wire shown in FIG. It is a partial expanded sectional view which shows 3rd Embodiment of the superconducting wire which concerns on this invention. It is a partial expanded sectional view which shows 4th Embodiment of the superconducting wire which concerns on this invention. It is a partial expanded sectional view which shows 5th Embodiment of the superconducting wire which concerns on this invention. It is a partial expanded sectional view which shows 6th Embodiment of the superconducting wire which concerns on this invention. It is sectional drawing which shows 7th Embodiment of the superconducting wire which concerns on this invention. It is a schematic block diagram which shows one structural example of the conventional superconducting wire.

  Embodiments of a superconducting wire and a method for manufacturing the same according to the present invention will be described below with reference to the drawings. In FIG. 1 to FIG. 9, some components are shown large so that the configuration of the superconducting wire can be easily understood, and the dimensional relationship of each component is different from the actual dimensional relationship of the superconducting wire.

FIG. 1 is a schematic perspective view of a first embodiment of a superconducting wire according to the present invention, and FIG. 2 is a partially enlarged sectional view of the superconducting wire shown in FIG.
The superconducting wire 10 shown in FIGS. 1 and 2 includes a superconducting laminate S1 in which an intermediate layer 12, an oxide superconducting layer 13, and a stabilizing layer 14 are sequentially laminated on one surface of a tape-like substrate 11. The superconducting laminate S1 includes a through portion 7 that penetrates from the surface 14A side of the stabilization layer 14 to the upper portion of the intermediate layer 12 through the interface A between the oxide superconducting layer 13 and the intermediate layer 12. The penetrating portion 7 is configured by filling the through groove 5 formed with a predetermined length along the longitudinal direction of the wire with the filler 6, and a plurality of the penetrating portions 7 in the width direction and the length direction of the superconducting laminate S1. Randomly formed.

The base material 11 may be any material that can be used as a base material for ordinary superconducting wires, and is preferably in the form of a long plate, sheet, or tape, and is preferably made of a heat-resistant metal. Among heat resistant metals, an alloy is preferable, and a nickel alloy or a copper alloy is more preferable. Among them, if it is a commercially available product, Hastelloy (trade name, manufactured by US Haynes Co., Ltd.) is suitable, and any of Hastelloy B, C, G, N, W, etc. having different component amounts such as molybdenum, chromium, iron, cobalt, etc. Types can also be used. Alternatively, an oriented metal substrate such as an oriented Ni—W substrate in which a texture is introduced into a nickel alloy or the like may be used as the base material 11.
What is necessary is just to adjust the thickness of the base material 11 suitably according to the objective, and it can usually be set as the range of 10-500 micrometers.

The intermediate layer 12 controls the crystal orientation of the oxide superconducting layer 13 and prevents diffusion of the metal element in the base material 11 into the oxide superconducting layer 13. Furthermore, it functions as a buffer layer that alleviates the difference in physical properties (thermal expansion coefficient, lattice constant, etc.) between the base material 11 and the oxide superconducting layer 13, and the material has physical properties that are different from those of the base material 11 and oxide. A metal oxide showing an intermediate value with the superconducting layer 13 is preferable. Specifically, preferred materials for the intermediate layer 12 are Gd ₂ Zr ₂ O ₇ , MgO, ZrO ₂ —Y ₂ O ₃ (YSZ), SrTiO ₃ , CeO ₂ , Y ₂ O ₃ , Al ₂ O ₃ , Gd _2. Examples thereof include metal oxides such as O ₃ , Zr ₂ O ₃ , Ho ₂ O ₃ , and Nd ₂ O ₃ .
The intermediate layer 12 may be a single layer or a plurality of layers. For example, the layer made of the metal oxide (metal oxide layer) preferably has crystal orientation, and when it is a plurality of layers, the outermost layer (the layer closest to the oxide superconducting layer 13). Preferably have at least crystal orientation.

The intermediate layer 12 may have a multi-layer structure in which a bed layer is interposed on the substrate 11 side. The bed layer has high heat resistance and is used for reducing interfacial reactivity, and is used for obtaining the orientation of a film disposed thereon. Such a bed layer is arranged as necessary, and is made of, for example, yttria (Y ₂ O ₃ ), silicon nitride (Si ₃ N ₄ ), aluminum oxide (Al ₂ O ₃ , also referred to as “alumina”), or the like. Is done. The bed layer is formed by a film forming method such as a sputtering method, and has a thickness of 10 to 200 nm, for example.

Further, in the present invention, the intermediate layer 12 may have a multi-layer structure in which a diffusion prevention layer and a bed layer are laminated on the base material 11 side. In this case, a diffusion preventing layer is interposed between the base material 11 and the bed layer. The diffusion preventing layer is formed for the purpose of preventing the diffusion of the constituent elements of the substrate 11, and is composed of silicon nitride (Si ₃ N ₄ ), aluminum oxide (Al ₂ O ₃ ), rare earth metal oxide, or the like. The thickness is, for example, 10 to 400 nm. Note that since the crystallinity of the diffusion preventing layer is not questioned, it may be formed by a film forming method such as a normal sputtering method.
In this way, by interposing the diffusion preventing layer between the base material 11 and the bed layer, when forming the other layer constituting the intermediate layer 12, the oxide superconducting layer 13 or the like, it is inevitably heated. When receiving a thermal history as a result of the heat treatment, it is possible to effectively suppress a part of the constituent elements of the base material 11 from being diffused to the oxide superconducting layer 13 side through the bed layer. As an example of the case where a diffusion preventing layer is interposed between the base material 11 and the bed layer, a combination using Al ₂ O ₃ as the diffusion preventing layer and Y ₂ O ₃ as the bed layer can be exemplified.

  The intermediate layer 12 may have a multi-layer structure in which a cap layer is further laminated on the metal oxide layer. The cap layer has a function of controlling the orientation of the oxide superconducting layer 13, diffuses the elements constituting the oxide superconducting layer 13 into the intermediate layer 12, and uses a gas and an intermediate used when the oxide superconducting layer 13 is laminated. It has a function of suppressing the reaction with the layer 12 and the like.

The cap layer is formed through a process of epitaxially growing on the surface of the metal oxide layer, and then growing the grains in the lateral direction (plane direction) (overgrowth) and selectively growing the crystal grains in the in-plane direction. The ones made are preferred. Such a cap layer has a higher degree of in-plane orientation than the metal oxide layer.
The material of the cap layer is not particularly limited as long as it can exhibit the above functions, but specifically, preferred examples include CeO ₂ , Y ₂ O ₃ , Al ₂ O ₃ , Gd ₂ O ₃ , and Zr ₂ O. ₃ , Ho ₂ O ₃ , Nd ₂ O ₃ , HfO _{2 and the} like. When the material of the cap layer is CeO ₂ , the cap layer may contain a Ce—M—O-based oxide in which part of Ce is substituted with another metal atom or metal ion.
The cap layer can be formed by a PLD method (pulse laser deposition method), a sputtering method, or the like, but it is preferable to use the PLD method from the viewpoint of obtaining a high film formation rate.

The thickness of the intermediate layer 12 may be appropriately adjusted according to the purpose, but is usually 0.1 to 5 μm.
When the intermediate layer 12 has a multi-layer structure in which a cap layer is laminated on the metal oxide layer, the thickness of the cap layer is usually 0.1 to 1.5 μm.

The intermediate layer 12 is formed by physical vapor deposition such as sputtering, vacuum vapor deposition, laser vapor deposition, electron beam vapor deposition, ion beam assisted vapor deposition (hereinafter abbreviated as IBAD); chemical vapor deposition (CVD). ); Coating pyrolysis method (MOD method); lamination can be performed by a known method for forming an oxide thin film such as thermal spraying. In particular, the metal oxide layer formed by the IBAD method is preferable in that the crystal orientation is high and the effect of controlling the crystal orientation of the oxide superconducting layer 13 and the cap layer is high. The IBAD method is a method of orienting crystal axes by irradiating an ion beam at a predetermined angle with respect to a crystal deposition surface during deposition. Usually, an argon (Ar) ion beam is used as the ion beam. For example, the intermediate layer 12 made of Gd ₂ Zr ₂ O ₇ , MgO, or ZrO ₂ —Y ₂ O ₃ (YSZ) can reduce the value of ΔΦ (FWHM: full width at half maximum) that is an index representing the degree of orientation in the IBAD method. Therefore, it is particularly suitable.

The oxide superconducting layer 13 can be widely applied with an oxide superconductor having a generally known composition, such as REBa ₂ Cu ₃ O _y (RE is Y, La, Nd, Sm, Er, Gd, etc. A material made of a material that represents a rare earth element, specifically, Y123 (YBa ₂ Cu ₃ O _y ) or Gd123 (GdBa ₂ Cu ₃ O _y ) can be exemplified. Further, other oxide superconductors, for _{example, Bi 2 Sr 2 Ca n-} 1 Cu n for _{O 4 + 2n + δ} becomes may be used in compositions such as those made of other oxide superconductors having high critical temperatures representative Of course.
The oxide superconducting layer 13 is laminated by physical vapor deposition such as sputtering, vacuum vapor deposition, laser vapor deposition, or electron beam vapor deposition; chemical vapor deposition (CVD); coating pyrolysis (MOD). Among them, the laser vapor deposition method is preferable.
The oxide superconducting layer 13 has a thickness of about 0.5 to 5 μm and preferably a uniform thickness.

The stabilization layer 14 stacked on the oxide superconducting layer 13 functions as a current bypass when a partial region of the oxide superconducting layer 13 attempts to transition to a normal conducting state, thereby It is the main component that stabilizes the superconducting layer 13 and prevents burning.
The stabilizing layer 14 is preferably made of a metal having good conductivity, and specifically, can be exemplified by silver, a silver alloy, copper or the like. The stabilization layer 14 may have a single layer structure or a laminated structure of two or more layers.
The stabilization layer 14 can be laminated by a known method. When the stabilization layer 14 has a single layer structure, a method of forming a silver layer by plating or sputtering is used. Further, when the stabilization layer 14 has a two-layer structure, a method of forming a silver layer by plating or sputtering and bonding a copper tape or the like thereon can be employed. The thickness of the stabilization layer 14 can be in the range of 3 to 300 μm.

  As shown in FIG. 2, the penetrating portion 7 penetrates from the surface 14A of the stabilizing layer 14 to the upper portion of the intermediate layer 12 through the interface A between the oxide superconducting layer 13 and the intermediate layer 12, and the longitudinal direction of the wire A filling material 6 is filled in a through groove 5 formed with a predetermined length along the length of the through groove 5. By filling the through groove 5 with the filler 6 and forming the through portion 7, it is possible to prevent moisture from entering the oxide superconducting layer 13 through the through portion 7. Since it does not easily deteriorate, the superconducting wire 10 has good characteristics. The filler 6 is not particularly limited as long as it can fill the through groove 5, and a conductive and non-conductive material can be applied. Specific examples of the filler 6 include epoxy resin, carbon paste, and silver paste. Note that the filler 6 may be omitted and the through groove 5 may be used as it is as the through portion 7.

The penetrating portion 7 is formed to prevent peeling and propagation of cracks in the event that peeling between the oxide superconducting layer 13 and the intermediate layer 12 or a crack in the oxide superconducting layer 13 occurs. The through portion 7 is more susceptible to cracking than the portion of the oxide superconducting layer 13 where the through portion 7 is not formed. In this way, by deliberately forming a portion where cracks are likely to occur, in the unlikely event that peeling or cracking occurs partially in the oxide superconducting layer 13, the cracks concentrate on the penetrating portion 7. It is possible to suppress peeling and cracks from propagating to a portion other than the portion where the through portion 7 of the superconducting layer 13 is formed.
Usually, peeling of the oxide superconducting layer 13 often occurs from the end side of the superconducting wire 10. Therefore, by forming more through portions 7 on the width direction end portion side than the width direction center portion of the superconducting wire 10, penetration and cracks generated at the end portion of the superconducting wire 10 are formed on the end side. It is preferable because it is possible to prevent clogging at the portion 7 and to prevent peeling and cracks from propagating to the central portion side.

The dimension of the penetrating part 7 is not particularly limited as long as the bottom part of the penetrating part 7 penetrates the interface A between the oxide superconducting layer 13 and the intermediate layer 12, and can be adjusted as appropriate, but the penetrating part 7 is too large. In addition, since the volume of the oxide superconducting layer 13 is reduced and the superconducting characteristics are deteriorated, it is preferable that the width of the penetrating portion 7 is 5 to 800 μm and the length is 0.1 to 50 mm. When the width of the penetrating portion 7 is less than 5 μm, processing with a laser or the like becomes difficult. Moreover, when the length of the penetration part 7 exceeds 50 mm, there exists a possibility that the superconducting wire 10 may be filamentized.
Furthermore, it is preferable that the distance between the adjacent through parts 7 is 100 μm or more. By providing the through-holes 7 with such dimensions and density, the oxide superconducting layer is maintained even when partial peeling or cracking occurs in the oxide superconducting layer 13 while maintaining good superconducting characteristics. It is possible to suppress peeling and crack propagation to the entire 13.

Note that the shape of the penetrating portion 7 is not limited to the slit shape, and the penetrating portion 7B has a round hole shape or a shape in which a filler is filled in the round hole as in the superconducting wire 10B of the second embodiment shown in FIG. There may be. In this case, the penetrating portion 7B extends from the surface 14A of the stabilization layer 14 to the upper portion of the intermediate layer 12 through the interface between the oxide superconducting layer 13 and the intermediate layer 12, and has an outer diameter of 5 μm to 800 μm. It is preferable to be in the range. When the outer diameter of the through-hole 7B having a round hole shape is less than 5 μm, processing with a laser or the like becomes difficult. On the other hand, when the outer diameter of the round hole-shaped through-hole 7B exceeds 800 μm, the volume of the oxide superconducting layer 13 is reduced and the superconducting characteristics are deteriorated.
Moreover, when the penetration part 7B is hole shape, it is preferable that it is formed with the density that the distance of adjacent penetration part 7B becomes more than the outer diameter of the said penetration part 7B. By providing the through-holes 7B with such dimensions and density, the oxide superconducting layer can be used even if partial peeling or cracking occurs in the oxide superconducting layer 13 while maintaining good superconducting characteristics. It is possible to suppress peeling and crack propagation to the entire 13.
Moreover, although the slit shape along the width direction of the superconducting wire 10 may be sufficient as the shape of the penetration part 7, it is a slit shape or hole shape along the length direction of the superconducting wire 10 from a viewpoint of maintaining a favorable superconducting characteristic. Preferably there is.

Next, an embodiment of a method for manufacturing the superconducting wire 10 according to the present invention will be described with reference to the drawings.
FIG. 4 is a process explanatory view showing an embodiment of a method for manufacturing the superconducting wire 10 shown in FIGS. 1 and 2.

  First, as shown in FIG. 4A, the above-described superconducting laminate S1 is prepared. As an example, after a diffusion prevention layer and a bed layer are formed on the substrate 11 by sputtering, a metal oxide layer such as MgO is formed on the bed layer by IBAD, and a cap layer is further formed by PLD. By doing so, the intermediate layer 12 having a multilayer structure is formed on the substrate 11. Next, after forming the oxide superconducting layer 13 on the intermediate layer 12 by the PLD method, the Ag stabilizing layer 14 is formed on the oxide superconducting layer 13 by the sputtering method to obtain the superconducting laminate S1. Can do. The stabilization layer 14 may be formed by forming an Ag layer by sputtering and then laminating a Cu metal tape on the Ag layer via solder.

  Next, as shown in FIG. 4B, a plurality of through grooves 5 are formed that extend from the surface 14 </ b> A of the stabilization layer 14 to the upper portion of the intermediate layer 12 through the stabilization layer 14 and the oxide superconducting layer 13. The through groove 5 may be formed by a conventionally known method, and can be formed by laser processing, intermittent slit processing, processing by pressing a roll with a protrusion from the stabilization layer 14 side, or the like. In the case of manufacturing the superconducting wire 10B shown in FIG. 3, the intermediate layer 12 is penetrated from the surface 14A of the stabilizing layer 14 through the stabilizing layer 14 and the oxide superconducting layer 13 by the same method as the through groove 5. A through hole reaching the top may be formed. The dimensions and density of the through grooves 5 formed by this process are as described above.

Next, as shown in FIG. 4C, the penetrating portion 7 is formed by filling the penetrating groove 5 by filling the penetrating groove 5 with a filler 6. The material of the filler 6 is as described above. 4C may be omitted, the through groove 5 may be formed as shown in FIG. 4B, and the through groove 5 may be used as it is without being filled with the filler 6. Further, as the superconducting laminate S1 shown in FIG. 4A, in the case where the stabilizing layer 14 is composed of one layer of Ag layer, after forming the through portion 7 as shown in FIG. A Cu metal tape may be laminated on the stabilization layer 14 and the penetrating portion 7 via solder. Furthermore, as shown in FIG. 4B, a Cu metal tape is laminated on the Ag stabilizing layer 14 and the through groove 5 with solder on the superconducting laminate S1 in which the through groove 5 is formed. May be. In this case, when the Cu metal tape is laminated, the penetrating part 7 is formed in a state where the solder flows into the upper part or most part of the penetrating groove 5 and solidifies.
Through the above steps, the superconducting wire 10 according to the present invention can be manufactured.

According to the method of manufacturing a superconducting wire of this embodiment, the superconducting wire 10 having the penetrating portion 7 that penetrates from the stabilization layer 14 side to the intermediate layer 12 through the interface between the oxide superconducting layer 13 and the intermediate layer 12 is obtained. Can be manufactured. Since the superconducting wire 10 manufactured by the method of manufacturing a superconducting wire according to the present embodiment is configured to include the penetrating portion 7, even if partial peeling or cracking occurs in the oxide superconducting layer 13, It is possible to suppress peeling and cracks from propagating to a portion other than the portion where the penetrating portion 7 of the oxide superconducting layer 13 is formed.
In the manufacturing method of the superconducting wire of this embodiment, the penetration of moisture from the penetration part 7 to the oxide superconducting layer 13 can be suppressed by filling the penetration groove 5 with the filler 6 to form the penetration part 7. Therefore, the superconducting wire 10 having good superconducting characteristics can be provided.

  In the superconducting wire of the present invention, the penetrating portion is not limited to the structure shown in FIGS. 1 to 3 and is formed from the stabilization layer 14 side as long as it penetrates the interface A between the intermediate layer 12 and the oxide superconducting layer 13. It may be formed and may be formed from the base material 11 side. Hereinafter, other embodiments of the superconducting wire and the method for manufacturing the same according to the present invention will be described with reference to FIGS. 5-9, the same code | symbol is attached | subjected to the component same as the superconducting wire 10 of the said 1st Embodiment, and description of the same element is abbreviate | omitted.

FIG. 5 is a partial enlarged cross-sectional view showing a third embodiment of the superconducting wire according to the present invention.
In the superconducting wire 10C shown in FIG. 5, an intermediate layer 12, an oxide superconducting layer 13 and a stabilizing layer 14 are sequentially laminated on one surface of a tape-shaped substrate 11, and the stabilizing layer 14 and the oxide superconducting layer are laminated. 13 is provided with a plurality of penetrating portions 7 </ b> C that penetrate the oxide superconducting layer 13 from the interface B toward the base material 11 and reach the upper part of the intermediate layer 12. The penetrating portion 7C is integrally formed with the stabilizing layer 14 thereabove, and the same material as the stabilizing layer 14 such as Ag is formed inside the penetrating groove 5C extending a predetermined length along the longitudinal direction of the superconducting wire 10C. Is filled as the filler 6C. The size and density of the through portion 7C are preferably the same as the through groove 7 of the superconducting wire 10 of the first embodiment, and the through groove 7 may have a hole shape as in the superconducting wire 10B shown in FIG.

In order to produce the superconducting wire 10C of this embodiment, first, a superconducting laminate S2 in which an intermediate layer 12 and an oxide superconducting layer 13 are sequentially laminated on a base material 11 is prepared. Then, a plurality of through grooves 5C that penetrate from the surface 13A of the oxide superconducting layer 13 of the superconducting laminate S2 to the upper part of the intermediate layer 12 through the oxide superconducting layer 13 are formed by laser processing or the like. Next, a stabilizing layer 14 such as Ag is formed on the oxide superconducting layer 13 and the through groove 5C by a film forming method such as a sputtering method on the superconducting laminate S2 in which the through groove 5C is formed. When the stabilization layer 14 is formed, sputtered particles such as Ag are also deposited inside the through-groove 5C, whereby the same material as the stabilization layer 14 such as Ag is filled in the through-hole 5C as the filler 6C. Thus, the penetrating portion 7C is formed.
The superconducting wire 10C of the present embodiment can be manufactured through the above steps.
In addition, after forming the stabilization layer 14 as shown in FIG. 5, a Cu metal tape may be laminated on the stabilization layer 14 via solder. Alternatively, the stabilization layer 14 may be formed by laminating a metal tape of Cu on the superconducting laminate S2 having the through groove 5C formed on the oxide superconducting layer 13 and the through groove 5C via solder. Good. In this case, when the Cu metal tape is laminated, the penetrating part 7C is formed in a state where the solder flows into the upper part or most part of the through groove 5C and is solidified.

FIG. 6 is a partially enlarged sectional view showing a fourth embodiment of the superconducting wire according to the present invention.
A superconducting wire 10D shown in FIG. 6 includes a stabilizing layer on a superconducting laminate S1 in which an intermediate layer 12, an oxide superconducting layer 13 and a stabilizing layer 14 are sequentially laminated on one surface of a tape-like substrate 11. 14 includes a plurality of penetrating portions 7 </ b> D that penetrate the stabilizing layer 14, the oxide superconducting layer 13, and the intermediate layer 12 from the surface 14 </ b> A side toward the base material 11 side and reach the upper part of the base material 11.
The through portion 7D is configured by filling a filler 6D into a through groove 5D extending a predetermined length along the longitudinal direction of the superconducting wire 10D. In the superconducting wire 10D of the present embodiment, the filler 6D filled in the through groove 5D is not particularly limited, but is preferably a non-conductive material such as resin or glass paste. The filler 6D may be omitted and the through groove 5D may be used as the through portion 7D as it is.
The size and density of the through portion 7D are preferably the same as the through groove 7 of the superconducting wire 10 of the first embodiment, and the through groove 7D may have a hole shape like the superconducting wire 10B shown in FIG.

  The superconducting wire 10D of the present embodiment can be manufactured in the same process as the manufacturing method of the superconducting wire 10 shown in FIGS. 4A to 4C except that the depth of the through groove 5D to be formed is changed. . In addition, after forming penetration part 7D as shown in FIG. 6, you may laminate | stack the metal tape of Cu on the stabilization layer 14 and penetration part 7D via solder. In addition, after the through groove 5D is formed in the superconducting laminate S1, a Cu metal tape is laminated on the stabilization layer 14 and the through groove 5D via solder without filling the through groove 5D with a filler. Also good. In this case, when the Cu metal tape is laminated, the through portion 7D is formed in a state where the solder flows into the upper portion of the through groove 5D or the most part and solidifies.

FIG. 7 is a partially enlarged sectional view showing a fifth embodiment of the superconducting wire according to the present invention.
A superconducting wire 10E shown in FIG. 7 includes a stabilizing layer on a superconducting laminate S1 in which an intermediate layer 12, an oxide superconducting layer 13, and a stabilizing layer 14 are sequentially laminated on one surface of a tape-like substrate 11. A plurality of penetrating portions 7E penetrating from the front surface 14 to the back surface 11A of the base material 11 are formed.
The penetrating portion 7E is configured by filling a filler 6E into a through groove 5D extending a predetermined length along the longitudinal direction of the superconducting wire 10E. In the superconducting wire 10E of the present embodiment, the filler 6E filled in the through groove 5E is not particularly limited, but the nonconductive material exemplified in the superconducting wire 10D of the above-described fifth embodiment is preferable. The filler 6E may be omitted and the through groove 5E may be used as the through portion 7E as it is.
The size and density of the through portion 7E are preferably the same as those of the through groove 7 of the superconducting wire 10 of the first embodiment, and the through groove 7E may have a hole shape like the superconducting wire 10B shown in FIG.

  The superconducting wire 10E of the present embodiment changes the depth of the through groove to be formed in the step of forming the through groove shown in FIG. 4B, and changes the depth from the surface 14A of the stabilization layer 14 of the superconducting laminate S1 to the base material. 11 can be manufactured in the same process as the method of manufacturing the superconducting wire 10 shown in FIGS. 4A to 4C except that the through groove 5E penetrating up to the back surface 11A of the 11 is formed. In addition, after forming penetration part 7D as shown in FIG. 7, you may laminate | stack the metal tape of Cu on the stabilization layer 14 and penetration part 7E via solder.

FIG. 8 is a partially enlarged sectional view showing a sixth embodiment of the superconducting wire according to the present invention.
A superconducting wire 10F shown in FIG. 8 is formed on a superconducting laminate S1 in which an intermediate layer 12, an oxide superconducting layer 13 and a stabilizing layer 14 are sequentially laminated on one surface of a tape-like base material 11. A plurality of penetrating portions 7F that pass through the base material 11, the intermediate layer 12, and the oxide superconducting layer 13 from the back surface 11A side toward the stabilizing layer 14 side and reach the lower portion of the stabilizing layer 14 are provided.
The penetrating part 7F is configured by filling a filler 6F in a through groove 5F extending a predetermined length along the longitudinal direction of the superconducting wire 10F. In the superconducting wire 10F of the present embodiment, the filler 6F filled in the through groove 5F is not particularly limited, but the non-conductive material exemplified in the superconducting wire 10D of the fifth embodiment described above is preferable. The filler 6F may be omitted and the through groove 5F may be used as the through portion 7F as it is.
The size and density of the through portion 7F are preferably the same as those of the through groove 7 of the superconducting wire 10 of the first embodiment, and the through groove 7F may have a hole shape like the superconducting wire 10B shown in FIG.

In order to produce the superconducting wire 10F of the present embodiment, first, a superconducting laminate S1 having a structure shown in FIG.
Next, the superconducting laminate S1 is disposed so that the base material 11 side is on top, and is stably penetrated from the back surface 11A of the base material 11 through the base material 11, the intermediate layer 12, and the oxide superconducting layer 13 by laser processing or the like. A through groove 5 </ b> F reaching the lower portion of the formation layer 14 is formed. Thereafter, the through portion 7F is formed by filling the formed through groove 5F with the filler 6F and filling the through groove 5F.
The superconducting wire 10F of the present embodiment can be manufactured through the above steps.

FIG. 9 is a partially enlarged sectional view showing a seventh embodiment of the superconducting wire according to the present invention.
A superconducting wire 10G shown in FIG. 9 is formed on a superconducting laminate S1 in which an intermediate layer 12, an oxide superconducting layer 13 and a stabilizing layer 14 are sequentially laminated on one surface of a tape-like base material 11. A plurality of penetrating portions 7G that pass through the base material 11 and the intermediate layer 12 from the back surface 11A side to the stabilizing layer 14 side and reach the lower portion of the oxide superconducting layer 13 are provided.
The penetrating part 7G is configured by filling a filler 6G into a through groove 5G extending a predetermined length along the longitudinal direction of the superconducting wire 10G. In the superconducting wire 10F of the present embodiment, the filler 6G filled in the through groove 5F is not particularly limited, and a conductive or non-conductive material can be used. Specific examples of the filler 6G include the same fillers that can be used in the superconducting wire 10 of the first embodiment. The filler 6G may be omitted and the through groove 5G may be used as the through portion 7G as it is.
The size and density of the through portion 7G are preferably the same as those of the through groove 7 of the superconducting wire 10 of the first embodiment, and the through groove 7G may have a hole shape like the superconducting wire 10B shown in FIG.

In order to produce the superconducting wire 10G of the present embodiment, first, a superconducting laminate S1 having the structure shown in FIG. 4A is prepared, and the superconducting laminate S1 is arranged so that the base material 11 side is on top. Through-grooves 5G reaching the lower part of the oxide superconducting layer 13 from the back surface 11A of the base material 11 through the base material 11 and the intermediate layer 12 are formed by laser processing or the like. Thereafter, the through portion 7G is formed by filling the formed through groove 5G with a filler 6G and filling the through groove 5G.
The superconducting wire 10G of the present embodiment can be manufactured through the above steps.

  The superconducting wires 10C, 10D, 10E, 10F, and 10G of the third to seventh embodiments described above penetrate the interface A between the oxide superconducting layer 13 and the intermediate layer 12 from the stabilization layer 14 side or the base material 11 side. It is the structure provided with penetration part 7C, 7D, 7D, 7E, 7F, 7G. Therefore, similarly to the superconducting wire 10 of the first embodiment described above, even if the oxide superconducting layer 13 is partially peeled off or cracked, the cracks penetrate the through portions 7C, 7D, 7D, 7E, It can concentrate on 7F and 7G, and can suppress that a peeling and a crack propagate to parts other than the part in which the penetration parts 7C, 7D, 7D, 7E, 7F, and 7G of the oxide superconducting layer 13 were formed.

  The superconducting wire and the manufacturing method thereof according to the present invention have been described above. However, in the above embodiment, each part of the superconducting wire is an example, and can be appropriately changed without departing from the scope of the present invention.

  The present invention can be used for an oxide superconducting wire used in various electric power devices such as a superconducting motor and a current limiting device.

  5 ... Through groove, 6, 6C, 6D, 6E, 6F, 6G ... Filler, 7, 7B, 7C, 7D, 7E, 7F, 7G ... Through part, 10, 10B, 10C, 10D, 10E, 10F, 10G ... superconducting wire, 11 ... substrate, 12 ... intermediate layer, 13 ... oxide superconducting layer, 14 ... stabilization layer, 100 ... superconducting wire, 101 ... metal substrate, 102 ... intermediate layer, 103 ... cap layer, 104 ... Oxide superconducting layer, A ... interface between oxide superconducting layer and intermediate layer, S1, S2 ... superconducting laminate.

Claims (4)

Laminated with the intermediate layer and the oxide superconducting layer and the stabilizing layer in this order superconductor laminate above the substrate is formed, the superconducting laminate to reach from the front Kimoto material side until at least the oxide superconducting layer A superconducting wire comprising a plurality of penetrating portions dispersedly formed in the width direction and the length direction.   The superconducting wire according to claim 1, wherein the inside of the through portion is filled with a filler. A plurality of holes or grooves as above the substrate and the intermediate layer and the oxide superconducting layer and the stabilizing layer to superconducting laminates are laminated in this order, it is reached before Kimoto material side until at least the oxide superconducting layer A method of manufacturing a superconducting wire, wherein a plurality of through portions are dispersedly formed in the width direction and the length direction of the superconducting laminate.   The method of manufacturing a superconducting wire according to claim 3, wherein the inside of the through portion is filled with a filler.

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