JP5673117B2 - Optical module and optical analyzer - Google Patents

Description

  The present invention relates to an optical module including a wavelength variable interference filter that acquires light of a specific wavelength, and an optical analyzer.

  2. Description of the Related Art Conventionally, an optical device including a wavelength variable interference filter (optical filter element) that extracts light having a specific wavelength from light having a plurality of wavelengths is known (see, for example, Patent Document 1).

  The variable wavelength interference filter (optical filter device) described in Patent Document 1 includes a first substrate including a movable portion (first portion) and a diaphragm (second portion) that supports the movable portion, and a first substrate. And an opposing second substrate. In addition, a movable mirror is formed on the movable part of the first substrate, and a fixed mirror is formed on the surface facing the movable part of the second substrate. The first substrate and the second substrate are respectively provided with ring-shaped electrodes, and lead-out wirings are formed from these electrodes toward the outer peripheral edge of each substrate.

JP 2009-251105 A

By the way, when the wavelength variable interference filter described in Patent Document 1 is fixed to the substrate or case of the optical device, the substrate of the wavelength variable interference filter may be bent. In addition, it is necessary to connect a wiring to each extraction electrode of the variable wavelength interference filter incorporated in the substrate or case, and stress may be applied to the substrate during the wiring work, which may cause the substrate to bend.
As described above, when the substrate is bent, the parallelism of the pair of reflection films cannot be maintained, and there is a problem that the resolution of the wavelength variable interference filter is lowered.

  In view of the above problems, an object of the present invention is to provide an optical module and an optical analyzer that can suppress a decrease in resolution.

  The optical module of the present invention includes a first substrate, a second substrate facing the first substrate, a first reflection film provided on the first substrate, and a first reflection film provided on the second substrate. A wavelength tunable interference filter comprising: a second reflective film facing the film through a gap; and a first electrode provided on a substrate facing surface of the first substrate facing the second substrate; and the wavelength tunable filter Provided between a fixed portion for fixing the interference filter, a fixed facing surface opposite to the substrate facing surface of the wavelength variable interference filter, and the fixed portion, and joining the wavelength variable interference filter to the fixed portion An anisotropic conductive layer, wherein the first substrate has a fixed counter electrode provided on a fixed counter surface facing the fixed portion, and electrically connects the first electrode and the fixed counter electrode. A connecting portion, and the fixing portion is Wherein a third electrode facing the fixed counter electrode, the anisotropic conductive layer is characterized by conducting said fixed counter electrode, and said third electrode.

In this invention, the 1st electrode provided in the board | substrate opposing surface of the 1st board | substrate is connected to the stationary counter electrode formed on the stationary opposing surface, and this stationary opposing electrode is fixed to a fixed part by an anisotropic conductive member. By being joined, it is electrically connected to the third electrode of the fixed portion facing the fixed counter electrode.
Here, examples of the anisotropic conductive layer include an ACF (Anisotropic Conductive Film) and an ACP (Anisotropic Conductive Paste), and adhere electrodes facing each other. And a layer having conductive particles uniformly dispersed in the adhesive. In such an anisotropic conductive layer, the conductive particles in the adhesive come into contact with each other by pressing, and therefore conductivity is generated along the pressing direction.
In the present invention, since such an anisotropic conductive layer is provided between the wavelength tunable interference filter and the fixed part, the wavelength tunable interference filter and the fixed part are pressed in a direction close to each other, thereby changing the wavelength. The fixed counter electrode of the interference filter can be electrically connected to the third electrode of the fixed part. For this reason, it is not necessary to perform wiring work directly on the wavelength tunable interference filter, and power can be supplied from the third electrode to the second electrode of the wavelength tunable interference filter.
In addition, for example, when the side edge of the wavelength tunable interference filter is held by a locking portion with strong rigidity provided in a case or the like, the substrate of the wavelength tunable interference filter may be bent by the holding force of the locking portion. On the other hand, in the case of using the anisotropic conductive layer as described above, the wavelength variable interference filter is placed on the anisotropic conductive layer provided on the fixed portion and pressed slightly. The wavelength variable interference filter can be bonded and fixed to the fixing portion. In this case, the stress to the wavelength tunable interference filter at the time of fixing is small, and the deflection of the wavelength tunable interference filter can be suppressed.

  In the optical module of the present invention, the first substrate includes a through hole penetrating the substrate thickness direction in at least a part of the region where the first electrode is formed, and the conductive connection portion passes through the through hole. The first electrode and the fixed counter electrode are preferably connected.

As a conduction | electrical_connection connection part, it is good also as a structure which connects a 1st electrode and a fixed counter electrode, for example along the outer peripheral side surface of a 1st board | substrate. However, when manufacturing a 1st board | substrate, several 1st board | substrates may be formed in one wafer, they may be cut, and one 1st board | substrate may be taken out. In such a case, after cutting the first substrate, it is necessary to form a conductive connection portion on the outer peripheral side surface of the first substrate again, which reduces manufacturing efficiency and is disadvantageous in terms of cost.
On the other hand, in this invention, a through-hole is provided in the 1st board | substrate and the conductive connection part which passes along this through-hole is provided. In such a configuration, since the conductive connection portion is formed before the first substrate is cut from the wafer, the post-cut processing is unnecessary, the manufacturing efficiency can be improved, and the cost is advantageous.

  In the optical module of the present invention, the conductive connection portion is a conductive member filled in the through hole, and the fixed counter electrode is configured by a surface facing the fixed counter surface from the through hole of the conductive member. It is preferred that

  In the present invention, the first electrode and the conductive member can be reliably electrically connected by filling the through hole provided in the first substrate with the conductive member. In addition, when connecting a separately provided fixed counter electrode and a conductive connection portion, it is necessary to ensure the connection reliability. However, in the present invention, the surface facing the fixed portion of the conductive member filled in the through hole is provided. Since the fixed counter electrode is configured, it is not necessary to consider the connection reliability between the conductive connection portion and the fixed counter electrode, and the first electrode and the fixed counter electrode can be reliably brought into conduction by the conductive member.

  In the optical module of the present invention, the second electrode facing the first electrode on the surface of the second substrate facing the first substrate, and the electrically connecting electrically the first electrode and the second electrode. And a portion.

  In this invention, the 2nd electrode provided in the 2nd board | substrate is connected to the 1st electrode by the electroconductive part. Further, as in the above invention, the first electrode is connected to the fixed counter electrode by the conductive connecting portion, and the fixed counter electrode is connected to the third electrode of the fixed portion by the anisotropic conductive layer. For this reason, the second electrode provided on the second substrate can be easily connected to the third electrode of the fixing portion without performing wiring work or the like.

  In the optical module according to the aspect of the invention, the anisotropic conductive layer may be configured such that the wavelength-variable interference filter is the first of the fixed opposing surfaces in a plan view of the first substrate and the second substrate viewed from the substrate thickness direction. It is preferable to cover the reflective film and a region that does not overlap the second reflective film.

  The variable wavelength interference filter includes a reflective filter that reflects light that has undergone multiple interference by the first reflective film and the second reflective film, and a transmissive filter that transmits the light that has undergone multiple interference. In this case, it is necessary to provide a transmission part for transmitted light. In the present invention, since the anisotropic conductive layer is not provided in a region overlapping the first reflective film and the second reflective film in plan view, light transmitted through the transmission filter can be passed through this portion.

In the optical module of the present invention, a plurality of the fixed counter electrode and the third electrode are provided,
The anisotropic conductive layer is preferably provided corresponding to a set of the fixed counter electrode and the third electrode facing each other.

The anisotropic conductive layer may be provided on the entire surface facing the fixed portion of the wavelength tunable interference filter. However, in the configuration in which the wavelength variable interference filter is provided with a plurality of fixed counter electrodes, each fixed It may be provided only at a position facing the counter electrode. With such a configuration, even when a transmission filter is used as the variable wavelength interference filter, the transmitted light can be guided without being inhibited by the anisotropic conductive layer.
Also, when the anisotropic conductive layer is provided on the entire surface of the variable wavelength interference filter, the anisotropic conductive layer is not applied to the portion where the fixed counter electrode is not provided, even if only the position where the fixed counter electrode is provided is pressed. There is a risk of applying stress due to the layer. On the other hand, when the anisotropic conductive layer is provided only at the position where the fixed counter electrode is provided, there is no stress on the first substrate by the anisotropic conductive layer in the region that does not overlap the fixed counter electrode, and the first substrate Can be reliably prevented.

  And in the said invention, the said anisotropic conductive layer is a virtual circle centering on the center point of said 1st reflective film in the planar view which looked at the said wavelength variable interference filter from the substrate thickness direction of said 1st substrate. Above, it is preferable that they are arranged at equiangular intervals with respect to the center point.

  In the present invention, even if stress is applied to the first substrate by the anisotropic conductive layer, these stresses are applied evenly to the first substrate, and the bending of the first substrate can be prevented more reliably.

  The optical analyzer of the present invention comprises the optical module as described above and a control device connected to the optical module, and the optical module detects light extracted by the wavelength variable interference filter. And the control device further includes an analysis processing unit that analyzes the light characteristics of the light based on the light detected by the detection unit.

Here, as an optical analyzer, based on the electrical signal output from the optical module as described above, an optical measuring device that analyzes the chromaticity and brightness of light incident on the optical module, the absorption wavelength of the gas Examples thereof include a gas detection device that detects the type of gas by detecting it, and an optical communication device that acquires data included in light of that wavelength from received light.
In the present invention, the optical analyzer includes the optical module as described above. As described above, the optical module can suppress bending when the wavelength variable interference filter is fixed to the fixed portion, and can extract light with high resolution by the wavelength variable interference filter. Moreover, since the optical module can detect the light extracted with such a high resolution by the detection unit, it is possible to acquire an accurate light amount of the light to be measured.
Therefore, in the optical analyzer provided with such an optical module, it is possible to perform an accurate optical analysis process based on the accurate light amount acquired by the optical module. Further, since the wiring reliability of the optical module is high, the device reliability in the optical analyzer can also be improved.

1 is a diagram illustrating a schematic configuration of a color measurement device (light analysis device) according to a first embodiment of the present invention. It is a top view which shows schematic structure of the wavelength variable interference filter of 1st embodiment. FIG. 3 is a cross-sectional view of the wavelength tunable interference filter along the line A-O-A ′ in FIG. 2. It is the top view which looked at the fixed board | substrate in the wavelength variable interference filter of 1st embodiment from the movable board | substrate side. It is the top view which looked at the movable board | substrate in the wavelength variable interference filter of 1st embodiment from the fixed board | substrate side. It is the expanded sectional view which expanded the vicinity of the fixed electrode pad of a wavelength variable interference filter. In 1st embodiment, it is a top view which shows the position in which an anisotropic conductive layer is provided with respect to a wavelength variable interference filter. It is a figure which shows the manufacturing process of the fixed board | substrate of the wavelength variable interference filter of 1st embodiment. It is a figure which shows the manufacturing process of the movable substrate of the wavelength variable interference filter of 1st embodiment. It is a figure which shows the joining process of joining the fixed board | substrate and movable board | substrate of a wavelength variable interference filter of 1st embodiment. It is a top view which shows the position in which an anisotropic conductive layer is provided with respect to a wavelength variable interference filter in the colorimetric sensor of 2nd embodiment.

[First embodiment]
Hereinafter, a first embodiment according to the present invention will be described with reference to the drawings.
[1. Overall configuration of the color measuring device]
FIG. 1 is a diagram showing a schematic configuration of a color measurement device (light analysis device) according to the first embodiment of the present invention.
The colorimetric device 1 is an optical analyzer of the present invention, and as shown in FIG. 1, a light source device 2 that emits light to a measurement object A, a colorimetric sensor 3 that is an optical module of the present invention, and a colorimetric device. And a control device 4 that controls the overall operation of the color device 1. The colorimetric device 1 reflects the light emitted from the light source device 2 by the measurement object A, receives the reflected inspection target light by the colorimetry sensor 3, and outputs the light from the colorimetry sensor 3. It is an apparatus that analyzes and measures the chromaticity of the inspection target light, that is, the color of the measurement target A based on the detection signal.

[2. Configuration of light source device]
The light source device 2 includes a light source 21 and a plurality of lenses 22 (only one is shown in FIG. 1), and emits white light to the measurement target A. The plurality of lenses 22 may include a collimator lens. In this case, the light source device 2 converts the white light emitted from the light source 21 into parallel light by the collimator lens and measures from the projection lens (not shown). Inject toward A.
In the present embodiment, the color measuring device 1 including the light source device 2 is illustrated, but when the measurement target A is a light emitting member, for example, the light source device 2 may not be provided.

[3. (Configuration of colorimetric sensor)
The colorimetric sensor 3 constitutes the optical module of the present invention. As shown in FIG. 1, the colorimetric sensor 3 receives and detects the wavelength variable interference filter 5 fixed to the module substrate 30 which is the fixing unit of the present invention and the light transmitted through the wavelength variable interference filter 5. A detection unit 31 and a voltage control unit 32 that applies a drive voltage to the variable wavelength interference filter 5 are provided. In addition, the colorimetric sensor 3 includes an incident optical lens (not shown) that guides the reflected light (inspection target light) reflected by the measurement target A at a position facing the wavelength variable interference filter 5. In the colorimetric sensor 3, the wavelength variable interference filter 5 separates only light having a predetermined wavelength from the inspection target light incident from the incident optical lens, and the detected light is received by the detection unit 31.
The detection unit 31 includes a plurality of photoelectric exchange elements, and generates an electrical signal corresponding to the amount of received light. And the detection part 31 is connected to the control apparatus 4, and outputs the produced | generated electric signal to the control apparatus 4 as a light reception signal.

(3-1. Configuration of wavelength tunable interference filter)
FIG. 2 is a plan view of the wavelength tunable interference filter 5 as seen from the thickness direction of the substrate, and FIG. 3 is a cross-sectional view of the wavelength tunable interference filter 5 along the line A-O-A ′ in FIG. .
As shown in FIG. 2, the wavelength variable interference filter 5 is a planar square plate-like optical member. As shown in FIG. 3, the variable wavelength interference filter 5 includes a fixed substrate 51 that is a first substrate of the present invention and a movable substrate 52 that is a second substrate of the present invention. These two substrates 51 and 52 are each formed of, for example, various glasses such as soda glass, crystalline glass, quartz glass, lead glass, potassium glass, borosilicate glass, and alkali-free glass, or crystal. . And these two substrates 51 and 52 are bonded by bonding films 513A and 523A such as a plasma polymerized film mainly composed of siloxane, with bonding surfaces 513 and 523 formed in the vicinity of the outer peripheral portion. It is constructed integrally.

The fixed substrate 51 is provided with a fixed reflective film 56 constituting the first reflective film of the present invention, and the movable substrate 52 is provided with a movable reflective film 57 constituting the second reflective film of the present invention. Here, the fixed reflective film 56 is fixed to the surface of the fixed substrate 51 facing the movable substrate 52 (substrate facing surface), and the movable reflective film 57 is fixed to the surface of the movable substrate 52 facing the fixed substrate 51. Yes. In addition, the fixed reflection film 56 and the movable reflection film 57 are disposed to face each other via a gap.
Further, an electrostatic actuator 54 for adjusting the size of the gap between the fixed reflection film 56 and the movable reflection film 57 is provided between the fixed substrate 51 and the movable substrate 52. The electrostatic actuator 54 includes a fixed electrode 541 as the first drive electrode of the present invention provided on the fixed substrate 51 side, and a movable electrode 542 as the second drive electrode of the present invention provided on the movable substrate 52 side. ing.
Further, in the plan view as shown in FIG. 2 in which the wavelength variable interference filter 5 is viewed from the substrate thickness direction of each of the substrates 51 and 52, the center point O of each of the substrates 51 and 52 is the fixed reflection film 56 and the movable reflection film 57. And the center point of the movable part 521 described later.

(3-1-1. Configuration of Fixed Substrate)
FIG. 4 is a plan view of the fixed substrate 51 in the variable wavelength interference filter 5 of the first embodiment as viewed from the movable substrate 52 side.
The fixed substrate 51 is formed by processing a glass base material having a thickness of, for example, 500 μm. Specifically, as shown in FIGS. 3 and 4, the fixed substrate 51 is formed with an electrode forming groove 511 and a reflective film fixing portion 512 by etching. The fixed substrate 51 is formed to have a thickness larger than that of the movable substrate 52, and the fixed substrate is caused by electrostatic attraction when a voltage is applied between the fixed electrode 541 and the movable electrode 542 or internal stress of the fixed electrode 541. There is no 51 deflection. In the present embodiment, the surface of the fixed substrate 51 that is not opposed to the movable substrate 52 is a surface that is fixed to the module substrate 30 of the colorimetric sensor 3.

As shown in FIG. 4, the electrode forming groove 511 is formed in a circular shape centered on the plane center point of the fixed substrate 51 in plan view. The reflection film fixing portion 512 is formed so as to protrude from the central portion of the electrode forming groove 511 toward the movable substrate 52 in the plan view.
In addition, the fixed substrate 51 is provided with four electrode extraction grooves 514 extending from the electrode forming groove 511 toward the vertexes C1, C2, C3, and C4 of the outer peripheral edge of the fixed substrate 51.

A fixed electrode 541 is formed on the electrode forming surface 511 </ b> A that is the groove bottom of the electrode forming groove 511 of the fixed substrate 51.
As shown in FIG. 4, the fixed electrode 541 includes a first fixed electrode 541A and a second fixed electrode 541B.
The first fixed electrode 541A is a virtual circle whose center point O is the center of the fixed reflective film 56 in a plan view of the fixed substrate 51 viewed from the substrate thickness direction (a plan view of the fixed substrate 51 viewed from the movable substrate 52 side). It is formed in an annular shape along Q1.
The second fixed electrode 541B is formed in a C shape along a virtual circle Q2 that is concentric with the virtual circle Q1 and has a larger diameter than the virtual circle Q1 in a plan view of the fixed substrate 51 viewed from the substrate thickness direction. ing. The second fixed electrode 541B has a C-shaped opening at a portion facing the vertex C4 of the fixed substrate 51.
An insulating film for preventing discharge between the fixed electrode 541 and the movable electrode 542 is laminated on the first fixed electrode 541A and the second fixed electrode 541B.

From the first fixed electrode 541A, the first fixed extraction electrode 543A constituting the first electrode of the present invention extends, and from the second fixed electrode 541B, the second fixed extraction forming the first electrode of the present invention. The electrode 543B extends.
The first fixed extraction electrode 543A is provided on the C-shaped opening of the second fixed electrode 541B and the vertex C4 side of the fixed substrate 51 from the position closest to the vertex C4 in the outer peripheral edge of the first fixed electrode 541A. It extends to the apex C4 of the fixed substrate 51 through the electrode lead groove 514. The front end portion of the first fixed extraction electrode 543A (the portion located at the vertex C4 of the fixed substrate 51) is formed larger in the width direction than the portion positioned on the electrode extraction groove 514 of the first fixed extraction electrode 543A. The fixed electrode pad 543P is configured.

  The second fixed extraction electrode 543B passes through the electrode extraction groove 514 provided on the vertex C2 side of the fixed substrate 51 from the position closest to the vertex C2 in the outer peripheral edge of the second fixed electrode 541B, and passes through the fixed substrate 51. It extends to the vertex C2. The tip end portion of the second fixed extraction electrode 543B (the portion positioned at the vertex C2 of the fixed substrate 51) is formed to have a larger width direction than the portion positioned on the electrode extraction groove 514 of the second fixed extraction electrode 543B. The fixed electrode pad 543P is configured.

  Then, in the fixed substrate 51, the electrode opposing grooves 514 formed in the direction from the electrode forming groove 511 toward the vertices C1 and C3 of the fixed substrate 51, respectively, the first counter electrode 544 constituting the first electrode of the present invention. Is provided. These first counter electrodes 544 are insulated from the first fixed electrode 541A and the second fixed electrode 541B. In addition, the tip portions of these first counter electrodes 544 (portions located at the vertices C1 and C3 of the fixed substrate 51) are wider in the width direction than the portions positioned on the electrode extraction groove 514 of the first fixed extraction electrode 543A. Is formed large and constitutes the first counter electrode pad 544P.

  In such a configuration, as described above, the first fixed extraction electrode 543A, the second fixed extraction electrode 543B, and the first counter electrode 544 each constitute the first electrode of the present invention, and these are the center points. Arranged so as to be equiangular with respect to O (90 degree intervals).

  As described above, the reflection film fixing portion 512 is formed in a columnar shape coaxial with the electrode forming groove 511 and having a smaller diameter than the electrode forming groove 511. In the present embodiment, as shown in FIG. 3, the reflective film fixing surface 512A facing the movable substrate 52 of the reflective film fixing portion 512 is formed closer to the movable substrate 52 than the electrode forming surface 511A. However, the present invention is not limited to this. The height positions of the electrode forming surface 511A and the reflective film fixing surface 512A are the size and fixing of the gap between the fixed reflective film 56 fixed to the reflective film fixed surface 512A and the movable reflective film 57 formed on the movable substrate 52. It is appropriately set according to the dimension between the electrode 541 and the movable electrode 542 and the thickness dimension of the fixed reflective film 56 and the movable reflective film 57. Therefore, for example, a configuration in which the electrode forming surface 511A and the reflecting film fixing surface 512A are formed on the same surface, or a reflecting film fixing groove on the cylindrical concave groove is formed at the center of the electrode forming surface 511A. A configuration in which a reflecting film fixing surface is formed on the bottom surface of the groove may be employed.

A fixed reflection film 56 formed in a circular shape is fixed to the reflection film fixing surface 512A. The fixed reflective film 56 may be formed of a metal single layer film, or may be formed of a dielectric multilayer film. Further, an Ag alloy is formed on the dielectric multilayer film. It may be configured to be formed. As the metal single layer film, for example, a single layer film of an Ag alloy can be used. In the case of a dielectric multilayer film, for example, a dielectric multilayer film in which the high refractive layer is TiO ₂ and the low refractive layer is SiO ₂ is used. be able to.

  Further, the fixed substrate 51 is provided with an antireflection film (not shown) at a position corresponding to the fixed reflection film 56 on the surface opposite to the substrate facing surface (fixed facing surface). This antireflection film is formed by alternately laminating a low refractive index film and a high refractive index film, and reduces the reflectance of visible light on the surface of the fixed substrate 51 and increases the transmittance.

The fixed substrate 51 is located at a position overlapping the first fixed extraction electrode 543A, the second fixed extraction electrode 543B, and the first counter electrode 544 in plan view as viewed from the substrate thickness direction, from the substrate facing surface to the fixed facing surface. A through hole 515 is provided. More specifically, the through hole 515 of the fixed substrate 51 is provided at a position that overlaps the center of each fixed electrode pad 543P and a position that overlaps the center of the first counter electrode pad 544P.
The through hole 515 is filled with a conductive connection portion 516. The conductive connection portion 516 is not particularly limited as long as it is a conductive member such as a metal such as Ag. Each of the conductive connection portions 516 is in contact with and in contact with the electrode pads 543P (544P) provided on the substrate facing surface of the fixed substrate 51.
The surface of the conductive connection portion 516 facing the module substrate 30 constitutes the fixed counter electrode 516A of the present invention.

(3-1-2. Configuration of movable substrate)
FIG. 5 is a plan view of the movable substrate 52 in the variable wavelength interference filter 5 of the first embodiment as viewed from the fixed substrate 51 side. In FIG. 5, the alternate long and short dash line indicates the outer peripheral edge of the fixed substrate 51.
The movable substrate 52 is formed by processing a glass substrate having a thickness of, for example, 200 μm by etching.
Specifically, the movable substrate 52 holds the movable portion 521 in a plan view as shown in FIGS. 2 and 5, a circular movable portion 521 centered on the substrate center point, and coaxial with the movable portion 521. Holding part 522.
Further, as shown in FIGS. 2 and 5, the movable substrate 52 is provided with a notch 524 corresponding to each vertex C1, C2, C3, C4 of the fixed substrate 51, and the wavelength variable interference filter 5 is formed. The fixed electrode pad 543P and the first counter electrode pad 544P are exposed on the surface viewed from the movable substrate 52 side.

The movable part 521 is formed to have a thickness dimension larger than that of the holding part 522. For example, in this embodiment, the movable part 521 is formed to be 200 μm, which is the same dimension as the thickness dimension of the movable substrate 52. The movable portion 521 includes a movable surface 521A parallel to the reflective film fixing portion 512, and a movable reflective film 57 facing the fixed reflective film 56 via a gap is fixed to the movable surface 521A.
Here, the movable reflective film 57 is a reflective film having the same configuration as the above-described fixed reflective film 56.

  Further, the movable portion 521 has an antireflection film (not shown) formed at a position corresponding to the movable reflective film 57 on the fixed facing surface. This antireflection film has the same configuration as the antireflection film formed on the fixed substrate 51, and is formed by alternately laminating a low refractive index film and a high refractive index film.

The holding unit 522 is a diaphragm that surrounds the periphery of the movable unit 521, and is formed to have a thickness dimension of 50 μm, for example, and is less rigid in the thickness direction than the movable unit 521.
For this reason, the holding part 522 is more easily bent than the movable part 521 and can be bent toward the fixed substrate 51 by a slight electrostatic attraction. At this time, since the movable portion 521 has a thickness dimension larger than that of the holding portion 522 and has a large rigidity, even when a force that bends the movable substrate 52 by electrostatic attraction acts, the movable portion 521 is hardly bent. Deflection of the movable reflective film 57 formed on the movable portion 521 can also be prevented.

A movable electrode 542 constituting the second drive electrode of the present invention is formed on the surface of the holding portion 522 that faces the fixed substrate 51 and faces the fixed electrode 541 with a gap of about 1 μm in the initial state. Has been.
As shown in FIG. 5, the movable electrode 542 includes a first movable electrode 542 </ b> A formed in a ring shape along a virtual circle Q <b> 1 centering on the center point O of the movable portion 521, and a center point O of the movable portion 521. And a second movable electrode 542B formed in a ring shape along a virtual circle Q2 having a diameter larger than that of the virtual circle Q1.
As shown in FIG. 2, the first movable electrode 542A is provided at a position overlapping the first fixed electrode 541A and the second movable electrode 542B is provided at a position overlapping the second fixed electrode 541B in a plan view. .

  As shown in FIG. 2, the first movable electrode 542A and the second movable electrode 542B are connected by a connecting line 545 formed along a diagonal line connecting the vertices C1 and C3 and a diagonal line connecting the vertices C2 and C4. Yes. A pair of common extraction electrodes 546 constituting the second electrode of the present invention extend from the outer peripheral edge of the second movable electrode 542B toward the vertex C1 direction and the vertex C2 direction. That is, the common extraction electrode 546 is provided to face the first counter electrode 544. The tip of the common extraction electrode 546 constitutes a common electrode pad 546P that faces the first counter electrode pad 544P of the first counter electrode 544.

  The movable substrate 52 includes a second counter electrode 547 at a position facing the first fixed extraction electrode 543A and the second fixed extraction electrode 543B. These second counter electrodes 547 are insulated from the movable electrode 542. The tip portions of the second counter electrodes 547 constitute a second counter electrode pad 547P that faces the fixed electrode pad 543P.

  In such a configuration, as described above, the common extraction electrode 546 and the second counter electrode 547 each constitute the second electrode of the present invention, and these are equiangularly spaced with respect to the center point O. Placed in.

  In this embodiment, as shown in FIGS. 2, 4, and 5, the electrode pads 543 </ b> P, 544 </ b> P, 546 </ b> P, and 547 </ b> P are respectively connected to the extraction electrodes 543 </ b> A, 543 </ b> B, 546, the counter electrode 544, in plan view. Although the configuration in which the electrode line width is larger than the electrode line width 547 is illustrated, for example, a configuration in which the line width is the same may be employed.

In the tunable interference filter 5 of the present embodiment, as shown in FIGS. 2 and 3, the conductive portion 55 that connects the surfaces of the electrode pads facing each other is provided between the fixed substrate 51 and the movable substrate 52. Provided. Specifically, the variable wavelength interference filter 5 connects the conductive portion 55 that connects the fixed electrode pad 543P and the second counter electrode pad 547P to each other, and the first counter electrode pad 544P and the common electrode pad 546P that face each other. And a conductive portion 55.
Any conductive portion 55 may be used as long as it has conductivity and can conduct between the pads. However, an Ag paste having a small electric resistance value and functioning also as a conductive adhesive is used. It is preferable to use it.
The conductive portion 55 may be configured such that Ag paste is injected into the outer peripheral side surfaces of the fixed substrate 51 and the movable substrate 52 and enters between the electrode pads 543P and 547P (544P and 546P) facing each other.

(3-1-3. Fixing of wavelength variable interference filter)
Next, fixing the wavelength variable interference filter 5 as described above to the module substrate 30 will be described. FIG. 6 is an enlarged cross-sectional view of the vicinity of the fixed electrode pad 543P of the wavelength variable interference filter 5.
The wavelength variable interference filter 5 is bonded and fixed by providing an anisotropic conductive layer 301 between the fixed substrate 51 and the module substrate 30 as shown in FIGS.
The module substrate 30 is provided with a module electrode 302 that is the third electrode of the present invention at a position facing the fixed counter electrode 516A of the conductive connection portion 516 of the fixed substrate 51. The module electrode 302 is provided with a lead wire (not shown), and is connected to the voltage control unit 32 from a terminal portion provided at an end portion of the lead wire.

  FIG. 7 is a plan view showing a position where the anisotropic conductive layer 301 is provided with respect to the wavelength variable interference filter 5 in the present embodiment. In FIG. 7, broken lines indicate the outer shape of the fixed substrate 51 of the wavelength tunable interference filter 5, the positions where the reflective films 56 and 57 are provided, the positions of the fixed electrode pad 543 </ b> P, the first counter electrode pad 544 </ b> P, and the conductive connection portion 516. . A one-dot chain line indicates the module substrate 30 and the module electrode 302 provided on the module substrate 30. Further, the solid line indicates the anisotropic conductive layer 301.

The wavelength tunable interference filter 5 of the present embodiment causes measurement light incident from the movable substrate 52 side to undergo multiple interference between the reflective films 56 and 57, and light of specific wavelengths strengthened to each other is transmitted to the fixed substrate 51 side and emitted. Transmission type filter. Therefore, the module substrate 30 is provided with a light guide unit 303 for guiding the transmitted light to the detection unit 31.
In addition, as this light guide part 303, it is good also as a structure by which the hole part which penetrates the module board | substrate 30 is provided, for example, and it is good also as a structure by which the recessed part is formed and the detection part 31 is provided in this recessed part. In addition, when the module substrate 30 is formed of a material that is transparent to the wavelength range to be measured, the light guide unit 303 may not be provided.

Then, the anisotropic conductive layer 301 is a reflection film within a plane facing the module substrate 30 of the variable wavelength interference filter 5 in a plan view of the variable wavelength interference filter 5 as shown in FIG. 56 and 57, and the part except the position which overlaps with the light guide part 303 is provided.
The anisotropic conductive layer 301 is, for example, ACF or ACP, and is a layer in which conductive particles are evenly dispersed in an adhesive composed of a thermoplastic resin or the like. Such an anisotropic conductive layer 301 is pressed in a predetermined direction so that the conductive particles come into contact with each other in the pressing direction, and the contact between these conductive particles generates conductivity along the pressing direction. Conductivity does not occur in other directions.
Therefore, when the wavelength variable interference filter 5 is placed on the anisotropic conductive layer 301 on the module substrate 30 and the wavelength variable interference filter 5 is pressed toward the anisotropic conductive layer 301, the fixed counter electrode of the conductive connection portion 516 is fixed. 516A and module electrode 302 are electrically connected by anisotropic conductive layer 301.

At this time, as shown in FIGS. 3 and 6, the movable substrate 52 of the wavelength tunable interference filter 5 is formed with a notch 524, and the fixed substrate on which the fixed electrode pad 543P and the first counter electrode pad 544P are provided. Only the apex portion 51 has a protruding shape. Therefore, it is possible to prevent stress from being applied to the movable substrate 52 by gripping only the apex portion of the fixed substrate 51 and placing and pressing the wavelength variable interference filter 5 on the anisotropic conductive layer 301. That is, the movable substrate 52 is provided with a movable portion 521 and a holding portion 522, and is formed in a shape that is easily bent with respect to external stress. When the external stress or the like is applied, the movable portion 521 is inclined and movablely reflected. There is a possibility that the parallelism between the film 57 and the fixed reflective film 56 cannot be maintained. On the other hand, as described above, the thickness dimension of the movable substrate 52 is formed larger than that of the movable substrate 52, and the rigid substrate 51 having higher rigidity than the movable substrate 52 is gripped and pressed to prevent stress on the movable substrate 52. Can do.
Further, by pressing the fixed electrode pad 543P and the first counter electrode pad 544P of the fixed substrate 51, a pressing force is applied to the anisotropic conductive layer 301 between the fixed counter electrode 516A and the module electrode 302 in the pressing direction. When the dispersed conductive particles come into contact with each other, the fixed counter electrode 516A and the module electrode 302 can be reliably conducted.

(3-2. Configuration of voltage control means)
The voltage control unit 32 controls the voltage applied to the electrostatic actuator 54 based on the control signal input from the control device 4.
Specifically, the voltage control unit 32 includes a first drive voltage source (not shown) for applying a voltage to the first fixed electrode 541A and a second drive voltage for applying a voltage to the second fixed electrode 541B. A source (not shown). In addition, the voltage control unit 32 includes a GND circuit (not shown) for applying a zero potential to the first movable electrode 542A and the second movable electrode 542B.
As a result, a voltage having a potential difference set by the first drive voltage source is applied between the first fixed electrode 541A and the first movable electrode 542A, and the second fixed electrode 541B and the second movable electrode 542B are A voltage having a potential difference set by the two drive voltage sources is applied.

[4. Configuration of control device]
The control device 4 controls the overall operation of the color measurement device 1.
As the control device 4, for example, a general-purpose personal computer, a portable information terminal, other color measurement dedicated computer, or the like can be used.
As shown in FIG. 1, the control device 4 includes a light source control unit 41, a colorimetric sensor control unit 42, a colorimetric processing unit 43 that constitutes an analysis processing unit of the present invention, and the like.
The light source control unit 41 is connected to the light source device 2. Then, the light source control unit 41 outputs a predetermined control signal to the light source device 2 based on, for example, a user setting input, and causes the light source device 2 to emit white light with a predetermined brightness.
The colorimetric sensor control unit 42 is connected to the colorimetric sensor 3. The colorimetric sensor control unit 42 sets a wavelength of light received by the colorimetric sensor 3 based on, for example, a user's setting input, and outputs a control signal for detecting the amount of light received at this wavelength. Output to the colorimetric sensor 3. Accordingly, the voltage control unit 32 of the colorimetric sensor 3 sets the voltage applied to the electrostatic actuator 54 so as to transmit only the wavelength of light desired by the user, based on the control signal.
The colorimetric processing unit 43 analyzes the chromaticity of the measurement target A from the amount of received light detected by the detection unit 31.

[5. Production of tunable interference filter)
Next, a manufacturing method of the wavelength variable interference filter 5 provided in the colorimetric apparatus 1 described above will be described based on the drawings.
FIG. 8 is a diagram illustrating a manufacturing process of the fixed substrate 51, FIG. 9 is a diagram illustrating a manufacturing process of the movable substrate 52, and FIG. 10 illustrates a bonding process of bonding the fixed substrate 51 and the movable substrate 52. FIG. 8 to 10 show states in the respective manufacturing steps of the cross-sectional portion taken along the line A-O-A 'in FIG.

(5-1. Manufacturing process of fixed substrate)
In the manufacture of the fixed substrate 51, first, a polishing process is performed in which the first base material that is a manufacturing material of the fixed substrate 51 is cut and polished. In this polishing step, the thickness of the first base material is formed to, for example, 500 μm, and both surfaces are precisely polished until the surface roughness Ra is 1 nm or less.

After the polishing process, a fixed substrate etching process is performed. In this fixed substrate etching step, a resist is applied to one surface side of the first base material, and is exposed and developed by a photolithography method, and is patterned at a location where the electrode formation groove 511 and the electrode extraction groove 514 are formed.
Then, the electrode formation groove 511 and the electrode extraction groove 514 are etched to a desired depth. Note that wet etching is used as the etching here.
Thereafter, a resist is applied to one surface side of the first base material, and a portion where the reflection film fixing surface 512A is formed is patterned.
Next, after etching the reflection film fixing surface 512A to a desired position, the resist is removed to form the electrode formation groove 511 and the reflection film fixing portion 512, and as shown in FIG. 51 substrate shapes are determined.

After the fixed substrate etching step, a fixed electrode forming step is performed as shown in FIG.
In the fixed electrode formation step, the first fixed electrode 541A, the second fixed electrode 541B, and the first fixed extraction are performed by performing photolithography and etching on the film made of the material constituting the electrode formed on the fixed substrate 51. An electrode 543A, a second fixed extraction electrode 543B, and a pair of first counter electrodes 544 are formed.

After this fixed electrode formation step, a conductive connection portion formation step is performed as shown in FIG.
In the conductive connection portion forming step, first, a resist for forming the through hole 515 is formed on the surface of the fixed substrate 51.
Then, using the fixed electrode pad 543P and the first counter electrode pad 544P as an etching stopper, the surface of the fixed substrate 51 facing the module substrate 30 is etched to form a through hole 515. For forming the through hole 515, for example, a technique such as deep RIE may be used.
Thereafter, the through hole 515 is filled with a conductive paste such as an Ag paste to form a conductive connection portion 516.

And after a conductive connection part formation process, as shown in FIG.8 (D), a fixed reflection film formation process is implemented.
In the fixed reflective film forming step, the fixed reflective film 56 is formed by a lift-off process. That is, a resist (lift-off pattern) is formed on a portion other than the reflective film formation portion on the fixed substrate 51 by photolithography or the like. Then, after forming the fixed reflection film 56 on the fixed substrate 51, the reflection film other than the reflection film formation portion is removed by lift-off.
Further, a first bonding film 513A is formed on the bonding surface 513. The first bonding film 513A is a plasma polymerization film formed by a plasma CVD method using polyorganosiloxane and has a thickness dimension of, for example, 100 nm.
In this way, the fixed substrate 51 is manufactured.

(5-2. Manufacturing process of movable substrate)
Next, a method for manufacturing the movable substrate 52 will be described.
In the formation of the movable substrate 52, first, a polishing process for cutting and polishing the second base material, which is a manufacturing material of the movable substrate 52, is performed. In this polishing step, the thickness of the second base material is formed to a uniform thickness of, for example, 200 μm, and both surfaces are precisely polished so that the average surface roughness Ra becomes a smooth surface of 1 nm or less.

  After the polishing process, a movable substrate etching process is performed. In this movable substrate etching process, a resist is applied to one surface side (the surface opposite to the surface facing the fixed substrate 51) of the second base material. Then, a resist pattern for forming the holding portion 522 is formed using a photolithography method. Thereafter, a movable portion 521 and a holding portion 522 as shown in FIG. 9A are formed by wet etching. Thereby, the substrate shape of the movable substrate 52 is determined.

After the movable substrate etching step, a movable electrode forming step and a movable reflective film forming step are performed.
In the movable electrode forming step, the movable electrode 542 (first movable electrode 542A, second movable electrode 542B), connection line 545, common extraction electrode 546, and second electrode are formed by photolithography and etching, as in the fixed electrode formation step. A counter electrode 547 is formed.
In the movable reflective film forming step, the movable reflective film 57 is formed by a lift-off process, as in the fixed reflective film forming step.
Further, a second bonding film 523A is formed on the bonding surface 523. The second bonding film 523A is a plasma polymerization film formed by a plasma CVD method using polyorganosiloxane and has a thickness dimension of, for example, 100 nm.
Thereafter, the apex portions of the movable substrate 52 are cut to form the notches 524. In the movable substrate etching step, the apex portion of the movable substrate 52 may be etched and the thickness dimension may be formed thin in advance. In this case, the cutting process is facilitated.
Thus, the movable substrate 52 as shown in FIG. 9B is manufactured.

(5-3. Joining process)
Next, a bonding process for bonding the substrates 51 and 52 formed in the above-described fixed substrate manufacturing process and movable substrate manufacturing process will be described.
In the joining step, first, as shown in FIG. 10A, the first fixed extraction electrode 543A of the fixed substrate 51, the fixed electrode pad 543P of the second fixed extraction electrode 543B, and the first counter electrode 544 of the first counter electrode 544 are first opposed. A conductive portion 55 (Ag paste) is provided on the electrode pad 544P (conductive member arranging step).

Thereafter, in order to apply activation energy to the first bonding film 513A and the second bonding film 523A formed on each of the substrates 51 and 52, O ₂ plasma processing or UV processing is performed. For example, the O ₂ plasma treatment is performed for 30 seconds under the conditions of an O ₂ flow rate of 20 cc / min, a pressure of 4 Pa, and an RF power of 50 W. In addition, the UV treatment is performed, for example, for 3 minutes using excimer UV (wavelength 172 nm) as a UV light source. The treatment for applying activation energy to the plasma polymerization film is not limited to O ₂ plasma treatment and UV treatment, but may be N ₂ plasma treatment or Ar plasma treatment.

  Then, as shown in FIG. 10B, the fixed substrate 51 and the movable substrate 52 are aligned so that the surfaces on which the movable reflective film 57 and the fixed reflective film 56 are formed face each other. Then, the first bonding film 513A and the second bonding film 523A are overlapped to apply a load, thereby bonding the substrates 51 and 52 to each other. Here, the first bonding film 513A and the second bonding film 523A are bonded.

[6. Effects of this embodiment]
As described above, in the colorimetric sensor 3 of the first embodiment, the fixed substrate 51 of the wavelength variable interference filter 5 and the module substrate 30 are bonded by the anisotropic conductive layer 301. In such a configuration, for example, the external stress applied to the wavelength tunable interference filter 5 can be reduced compared to a configuration in which the wavelength tunable interference filter 5 is locked or gripped by the locking portion, and the substrate caused by the external stress can be reduced. 51 and 52 can be prevented from bending. Therefore, it is possible to prevent the reflection films 56 and 57 from being bent by the substrates 51 and 52, and to suppress a reduction in resolution.
A fixed counter electrode 516A is provided on a surface of the fixed substrate 51 of the variable wavelength interference filter 5 facing the module substrate 30. The fixed counter electrode 516A is electrically connected to the first fixed extraction electrode 543A, the second fixed extraction electrode 543B, and the first counter electrode 544 provided on the substrate facing surface of the fixed substrate 51 by the conductive connection portion 516. Yes. The module substrate 30 is provided with a module electrode 302 facing the fixed counter electrode 516A, and the fixed counter electrode 516A and the module electrode 302 are electrically connected by the anisotropic conductive layer 301.
For this reason, after mounting the wavelength variable interference filter 5 on the module substrate 30, it is not necessary to perform a wiring operation for connecting the respective electrode pads 543 </ b> P and 544 </ b> P of the wavelength variable interference filter 5 and the module electrode 302. Therefore, it is possible to improve the working efficiency when incorporating the wavelength variable interference filter 5 into the colorimetric sensor 3.

The fixed substrate 51 of the variable wavelength interference filter 5 is provided with a through hole 515, and the through hole 515 is filled with the conductive connection portion 516. The surface of the conductive connection portion 516 facing the module substrate 30 is fixedly opposed. The electrode 516A is configured.
For this reason, it is not necessary to separately form an electrode on the fixed substrate 51, and the first fixed extraction electrode 543A and the second fixed extraction electrode 543B can be easily formed with a simple configuration in which the through hole 515 is filled with the conductive connection portion 516. The fixed counter electrode 516A that is electrically connected to the first counter electrode 544 can be formed.
Further, by filling the through hole 515 with the conductive connection portion 516, the conductive connection portion 516 is reliably connected to the first fixed extraction electrode 543A, the second fixed extraction electrode 543B, and the first counter electrode 544. be able to.

Further, for example, a fixed counter electrode is separately provided on the surface of the fixed substrate 51 facing the module substrate 30, and as the conductive connection portion of the present invention, the fixed counter electrode and the first fixed lead are transmitted along the outer peripheral side surface of the fixed substrate 51. The electrode 543A, the second fixed extraction electrode 543B, and the first counter electrode 544 may be connected. However, as the manufacture of the fixed substrate 51, it is rare to form one fixed substrate 51 from one wafer, and in general, a plurality of fixed substrates 51 are formed from one wafer. In this case, after forming the plurality of fixed substrates 51 on the wafer, the plurality of fixed substrates 51 are taken out by cutting each of the fixed substrates 51. In such a case, as described above, in the configuration in which the conductive connection portion is formed on the outer peripheral side surface of the fixed substrate 51, it is necessary to separately form electrodes on the outer peripheral side surface of the fixed substrate 51 after the cutting process, and the number of processes is increased. It increases and manufacturing efficiency falls.
On the other hand, when the through-hole 515 is formed and the conductive connection part 516 is formed as in the present embodiment, the processing after the cutting is unnecessary, so that the disadvantage that the manufacturing efficiency is lowered can be avoided.
Moreover, the electrode formed on the outer peripheral side surface of the fixed substrate 51 is easily peeled off due to a collision or the like, and the wiring reliability is lowered. On the other hand, the conductive connection portion 516 is reliably connected to the first fixed extraction electrode 543A, the second fixed extraction electrode 543B, the first counter electrode 543, and the fixed counter electrode 516A by the through-hole 515, and the high wiring Reliability can be obtained.

  Further, the fixed counter electrode 516A is configured by a surface of the conductive connection portion 516 facing the module substrate 30. Therefore, it is not necessary to separately provide a fixed counter electrode on the surface of the fixed substrate 51 that faces the module substrate 30. Further, when a fixed counter electrode is separately provided on the surface of the fixed substrate 51 corresponding to the module substrate 30, and the conductive connection portion 516 is connected to this electrode, it is necessary to ensure the connection reliability. On the other hand, in the present embodiment, since the end face of the conductive connection portion 516 is the fixed counter electrode 516A, a configuration for ensuring connection reliability is not necessary, and the configuration can be simplified.

In the wavelength variable interference filter 5, a common extraction electrode 546 provided on the movable substrate 52 and a first counter electrode 544 provided on the fixed substrate 51 are connected by a conductive portion 55, and this first counter electrode is provided. The electrode 544 is electrically connected to the module electrode 302 of the module substrate 30 through the conductive connection portion 516 and the anisotropic conductive layer 301.
For this reason, the common extraction electrode formed on the movable substrate 52 can be connected to the module electrode 302 of the module substrate 30 only by installing the variable wavelength interference filter 5 on the module substrate 30, and wiring work can be performed. Easy to do.

  Further, the anisotropic conductive layer 301 is provided at a position where it does not overlap with the reflection films 56 and 57 in a plan view of the wavelength tunable interference filter 5 viewed from the substrate thickness direction. Therefore, light that has been subjected to multiple interference by the reflective films 56 and 57 and transmitted to the fixed substrate 51 side can be incident on the detection unit 31 without being blocked by the anisotropic conductive layer 301.

Further, the movable substrate 52 of the variable wavelength interference filter 5 is provided with a notch 524, and the apex portion where the fixed electrode pad 543 </ b> P and the first counter electrode pad 544 </ b> P of the fixed substrate 51 are provided is the outer peripheral edge of the movable substrate 52. Than protruding. For this reason, when the variable wavelength interference filter 5 is fixed to the module substrate 30, the movable substrate 52 having the holding portion 522 that is structurally flexible is not applied to the movable substrate 52 by gripping the protruding portion, and the movable substrate 52. Can be prevented.
Further, by pressing the apex portion of the fixed substrate 51 against the module substrate 30, the stress due to the pressing is not applied to the movable substrate 52, and the bending of the movable substrate 52 can be prevented. Since the fixed electrode pad 543P and the first counter electrode pad 544P provided at the apex portion of the fixed substrate 51 are pressed toward the module electrode 302 side of the module substrate 30, these fixed electrode pad 543P and the first counter electrode pad 544P and the module electrode 302 can be reliably conducted.

[Second Embodiment]
Next, a second embodiment of the present invention will be described based on the drawings.
In the first embodiment, an example is shown in which the anisotropic conductive layer 301 is provided so as to cover the entire surface of the wavelength tunable interference filter 5 facing the module substrate 30 except for the region overlapping the reflective films 56 and 57. It was. On the other hand, in the second embodiment, the anisotropic conductive layer 301 is provided only at a position corresponding to the position of the fixed counter electrode 516A.
FIG. 11 is a plan view showing a position where the anisotropic conductive layer 301 is provided with respect to the wavelength variable interference filter 5 in the colorimetric sensor of the second embodiment.

As shown in FIG. 11, in the colorimetric sensor of the second embodiment, each anisotropic conductive layer is fixed to the fixed counter electrode of each conductive connection portion 516 provided on the fixed substrate 51 of the wavelength variable interference filter 5. 301 is provided.
Here, the fixed counter electrodes 516A are arranged at equiangular intervals (90 degrees) along the circumference of the virtual circle Q3 with the center point O of the reflection films 56 and 57 as the center in plan view. . Each anisotropic conductive layer 301 is also arranged so that the center position (center of gravity position) of the anisotropic conductive layer 301 is equiangularly spaced (90 degrees) on the circumference of the virtual circle Q3.

(Operational effects of the second embodiment)
In the colorimetric sensor 3 of the second embodiment, the anisotropic conductive layer 301 is provided corresponding to each of the four fixed counter electrodes 516A of the wavelength variable interference filter 5, and each of the fixed counter electrodes 516A and each module electrode is provided. The variable wavelength interference filter 5 is bonded and fixed to the module substrate 30.
Even in such a configuration, the same effect as in the first embodiment can be obtained.
That is, since the wavelength tunable interference filter 5 is fixed to the module substrate 30 by the anisotropic conductive layer 301, the external stress applied to the wavelength tunable interference filter 5 can be reduced, and the deflection of the substrates 51 and 52 due to the external stress can be reduced. Can be prevented. In addition, wiring work after the wavelength tunable interference filter 5 is mounted on the module substrate 30 is unnecessary, and work efficiency when the wavelength tunable interference filter 5 is incorporated into the colorimetric sensor 3 can be improved.

In addition to this, the colorimetric sensor 3 as in the second embodiment is configured to contact the anisotropic conductive layer 301 only in the vicinity of the apex portion of the fixed substrate 51. The bending of the fixed substrate 51 can be reduced.
Further, the anisotropic conductive layer 301 is equidistant from the center point O of the reflective films 56 and 57 and is disposed at equiangular intervals with respect to the center point O. Therefore, even when stress is applied to the fixed substrate 51 due to solidification shrinkage of the anisotropic conductive layer 301, these stresses are evenly distributed to the fixed substrate 51, and the bending of the fixed substrate 51 is suppressed. be able to.

Other Embodiment
It should be noted that the present invention is not limited to the above-described embodiments, and modifications, improvements, and the like within the scope that can achieve the object of the present invention are included in the present invention.

In the first and second embodiments, the fixed extraction electrodes 543A and 543B extending from the fixed electrode 541 and the first counter electrode 544 are exemplified as the first electrode, but the first electrode is not limited thereto.
For example, a charge removal electrode for removing charges remaining on the fixed electrode 451 may be provided on the fixed substrate 51, and the charge removal lead electrode extending from the charge removal electrode may be used as the first electrode of the present invention. In this case, a through hole 515 is provided at a position corresponding to a part (for example, a tip portion) of the charge removal extraction electrode, and a conductive connection portion 516 is provided in the through hole 515, and the module is interposed via the anisotropic conductive layer 301. What is necessary is just to connect to the module electrode 302 of the board | substrate 30.

  In addition, a capacitance measuring electrode for measuring the gap dimension between the reflective films is provided on the fixed substrate 51 and the movable substrate 52 so as to face each other, and a lead electrode drawn from the capacitance measuring electrode on the fixed substrate 51 is provided. May be the first electrode, and the counter electrode on the side of the movable substrate 52 facing the extraction electrode may be the second electrode.

In the first and second embodiments, the through hole 515 is provided in the fixed substrate 51, the conductive connection portion 516 is filled in the through hole 515, and the surface of the conductive connection portion 516 facing the module substrate 30 is fixed to the fixed counter electrode 516A. However, the present invention is not limited to this.
For example, a fixed counter electrode is separately formed on the surface of the fixed substrate 51 facing the module substrate 30, and the fixed electrode pad 543P and the first counter electrode pad 544P are connected to the fixed counter electrode by the conductive connection portion 516. It is good also as a structure.
Further, the conductive connection portion 516 is not limited to the configuration in which the through hole 515 is filled with Ag paste or the like. For example, an electrode extending from the substrate facing surface of the fixed substrate 51 to the fixed facing surface is provided on the inner peripheral surface of the through hole 515. It is good also as a structure in which a layer is formed.
Furthermore, the one end surface of the conductive connection portion 516 is configured to be the same plane as the fixed opposing surface of the fixed substrate 51 to form the fixed counter electrode 516A. For example, the conductive connecting portion 516 is formed from the fixed opposing surface of the fixed substrate 51. It may be configured to protrude to the module substrate 30 side, or the fixed counter electrode 516A of the conductive connection portion 516 may be formed on a convex surface protruding in a convex shape from the fixed counter surface to the module substrate 30 side. . In this case, when the tunable interference filter 5 is attached to the module substrate 30, the convex conductive connecting portion 516 or the convex fixed counter electrode 516A presses the anisotropic conductive layer 301, and the fixed counter electrode 516A is more reliably connected. The module electrode 302 can be electrically connected.

  Furthermore, it is good also as a structure which provides a conductive connection part in the outer peripheral side surface of the fixed board | substrate 51. FIG. In this case, a fixed counter electrode corresponding to each of the first fixed extraction electrode, the second fixed extraction electrode, and the pair of first counter electrodes is separately formed on the surface of the fixed substrate 51 facing the module substrate 30. May be connected by a conductive connection portion formed on the outer peripheral side surface of the fixed substrate 51.

  In the wavelength tunable interference filter 5, the configuration in which the conductive connection portions 516 are provided for the pair of first counter electrode pads 544P is illustrated, but the conductive connection portions 516 are formed only in one of the first counter electrode pads 544P. The module electrode 302 of the module substrate 30 may be provided only for one of the first counter electrode pads 544P.

  In the second embodiment, the module electrode 302 is formed in a size larger than the fixed counter electrode 516A, and the anisotropic conductive layer 301 is also formed in a size corresponding to the module electrode 302 and larger than the fixed counter electrode 516A. Although shown, it is not limited to this. For example, in a plan view, the anisotropic conductive layer 301 may be set to have the same size as the fixed counter electrode 516A.

  Further, the fixed electrode pad 543P and the second counter electrode pad 547P, the first counter electrode pad 544P, and the common electrode pad 546P are provided inside the outer peripheral edge of the movable substrate 52, respectively. Although the structure connected by the electroconductive part 55 was illustrated, it is not restricted to this. For example, by injecting and adhering conductive paste such as Ag paste from the side surface of the cutout portion 524 of the movable substrate 52 between the substrates 51 and 52, the fixed electrode pad 543P and the second counter electrode pad 547P are connected to each other. The electrode pad 544P and the common electrode pad 546P may be connected.

  In the above embodiment, the diaphragm-shaped holding portion 522 is exemplified. For example, as a configuration in which a holding portion having a plurality of pairs of beam structures provided at a point target position with respect to the center of the movable portion is provided. Also good.

Furthermore, in the said embodiment, the movable part 521 is provided in the movable substrate 52 which is a 2nd board | substrate as the wavelength variable interference filter 5, and the movable part 521 of the movable substrate 52 shows the example displaced toward the fixed substrate 51 side. However, it is not limited to this. For example, the movable substrate 52 may be configured as the first substrate of the present invention and fixed to the module substrate 30 which is a fixed portion.
Further, the movable substrate 51 may be provided with a movable portion, and the movable portion may be displaced toward the movable substrate 52.

In the above embodiment, the colorimetric sensor 3 is illustrated as the optical module, and the colorimetric device 1 is illustrated as the optical analyzer, but the present invention is not limited to this.
For example, the optical module of the present invention can be used as a gas detection module that detects the absorption wavelength peculiar to gas by receiving light extracted by the wavelength variable interference filter 5 by a light receiving element. It can also be used as a gas detection device for discriminating the type of gas from the absorption wavelength detected by the gas detection module.
Furthermore, for example, the optical module can be used as an optical communication module that extracts light having a desired wavelength from light transmitted by an optical transmission medium such as an optical fiber. Moreover, it can also be used as an optical analyzer that decodes data from light extracted from such an optical communication module and extracts data transmitted by light.

  In addition, the specific structure and procedure for carrying out the present invention can be appropriately changed to other structures and the like within a range in which the object of the present invention can be achieved.

  DESCRIPTION OF SYMBOLS 1 ... Color measuring device as an optical analyzer, 3 ... Color measuring sensor as an optical module, 4 ... Control apparatus, 5 ... Wavelength variable interference filter, 30 ... Module board | substrate which is a fixed part, 31 ... Detection part, 43 ... Analysis A colorimetric processing unit that is a processing unit, 51 ... a fixed substrate that is a first substrate, 52 ... a movable substrate that is a second substrate, 55 ... a conductive unit, 56 ... a fixed reflective film that is a first reflective film, 57 ... a second Movable reflective film as a reflective film, 301 ... anisotropic conductive layer, 302 ... module electrode as third electrode, 515 ... through hole, 516 ... conductive connection part, 516A ... fixed counter electrode, 543A ... first electrode First fixed extraction electrode, 543B ... second fixed extraction electrode as first electrode, 544 ... first counter electrode as first electrode, 546 ... common extraction electrode as second electrode, 547 ... second as second electrode Two counter electrodes.

Claims (7)

A first substrate;
A second substrate facing the first substrate;
A first reflective film provided on the first substrate;
A second reflective film provided on the second substrate and facing the first reflective film via a gap;
A first electrode provided on the first base plate,
A tunable interference filter provided on the second substrate, the second electrode facing the first electrode; and
A fixed portion to which the wavelength variable interference filter is fixed;
Provided between the tunable interference filter over your and the fixed portion, and the anisotropic conductive layer for joining the variable wavelength interference filter to said fixed portion,
With
The first substrate includes a fixed counter electrode provided on a fixed counter surface facing the fixed portion, and a conductive connection portion that electrically connects the first electrode and the fixed counter electrode,
The fixed portion has a third electrode facing the fixed counter electrode,
The anisotropic conductive layer, said fixed counter electrode and the third electrodes are electrically connected, in a plan view as viewed from the substrate thickness direction of the first substrate, around the center point of the first reflecting film The optical module is arranged at equiangular intervals with respect to the center point on the virtual circle . The optical module according to claim 1,
The first substrate includes a through-hole penetrating the substrate thickness direction in at least a part of the region where the first electrode is formed,
The said electrical connection part connects said 1st electrode and said fixed counter electrode through said through-hole. The optical module characterized by the above-mentioned. The optical module according to claim 2,
The optical module, wherein the conductive connection part is a conductive member filled in the through hole, and has the fixed counter electrode formed of the conductive member on the fixed counter surface . A first substrate;
A second substrate facing the first substrate;
A first reflective film provided on the first substrate;
A second reflective film provided on the second substrate and facing the first reflective film via a gap;
A first electrode provided on the first substrate;
A tunable interference filter provided on the second substrate, the second electrode facing the first electrode; and
A fixed portion to which the wavelength variable interference filter is fixed;
An anisotropic conductive layer provided between the wavelength tunable interference filter and the fixed portion, and joining the wavelength tunable interference filter to the fixed portion;
With
The first substrate is
An extraction electrode electrically connected to the second electrode via a conductive portion provided between the first substrate and the second substrate;
A fixed counter electrode provided on a fixed counter surface facing the fixed portion;
A conductive connection portion for electrically connecting the extraction electrode and the fixed counter electrode;
The fixed portion has a third electrode facing the fixed counter electrode,
The anisotropic conductive layer conducts the fixed counter electrode and the third electrode, and is a virtual centered on the central point of the first reflective film in a plan view as viewed from the substrate thickness direction of the first substrate. An optical module, wherein the optical module is arranged at equiangular intervals with respect to the center point on a circle . The optical module according to any one of claims 1 to 4,
The anisotropic conductive layer includes the first reflective film and the second reflective film on the fixed facing surface in a plan view of the variable wavelength interference filter viewed from the thickness direction of the first substrate and the second substrate. An optical module characterized in that it is provided so as to cover an area that does not overlap the film. The optical module according to any one of claims 1 to 4,
A plurality of the fixed counter electrode and the third electrode are provided,
The optical module, wherein the anisotropic conductive layer is provided corresponding to a set of the fixed counter electrode and the third electrode facing each other. An optical module according to any one of claims 1 to 6 ,
A control device connected to the optical module,
The optical module includes a detection unit that detects light extracted by the wavelength variable interference filter,
The control apparatus includes an analysis processing unit that analyzes an optical characteristic of the light based on the light detected by the detection unit.

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