JP5384027B2 - Package and method for producing the same - Google Patents

Description

  The present invention relates to a package formed of a multilayer structure having a metal layer and a method for manufacturing the same.

  Conventionally, RFID (Radio Frequency Identification) technology for exchanging information by short-range wireless communication using radio waves or magnetic flux (magnetic field) is known, and an IC tag (RFID tag) is attached to a package. ing. For example, by recording product information such as the manufacturing factory, manufacturing date, identification number assigned to each product in the IC tag, the IC tag communicates with the tag reader, and the information is read or written, Product distribution management, inventory management, etc. can be performed. As a communication method between the IC tag and the tag reader, for example, an electromagnetic induction method in which a signal is transmitted by magnetically coupling the antenna of the IC tag and the antenna of the tag reader, and radio waves are exchanged between the antenna of the IC tag and the antenna of the tag reader. Radio wave systems that transmit signals are known.

  As a package with an IC tag, a package disclosed in Patent Document 1 is known. As shown in FIG. 11, the package of Patent Document 1 is an inner bag formed of a laminated film including a metal layer such as aluminum inside a square box-shaped outer box 51 formed of a material not including a metal material. 52 is accommodated. A wireless IC tag 53 is attached to the outer surface of the outer box 51. An interval holding member 54 is inserted between the surface of the outer box 51 where the wireless IC tag 53 is attached and the inner bag 52. The spacing member 54 is made of a non-metallic material such as cardboard or foamed plastic, and has a thickness of 10 mm or more. Due to the presence of the spacing member 54, the wireless IC tag 53 and the metal layer of the inner bag 52 are separated by 10 mm or more.

When communicating by the electromagnetic induction method, the antenna of the wireless IC tag 53 is electromagnetically induced by the magnetic flux generated from the antenna of the tag reader. Therefore, the magnetic flux must be able to pass around the antenna of the wireless IC tag 53. In the package of Patent Document 1, since the wireless IC tag 53 and the inner bag 52 are separated by 10 mm or more, the magnetic flux passing around the wireless IC tag 53 is suppressed from being blocked by the metal layer, and the electromagnetic induction method is used. Good communication is realized.
JP 2006-056602 A

  In the package of Patent Document 1, the outer box 51 to which the wireless IC tag 53 is attached is essential. Furthermore, a spacing member 54 must be inserted between the outer box 51 and the inner bag 52. In such a configuration, the outer box 51 and the spacing member 54 are necessary to make the wireless IC tag 53 function, and this leads to an increase in material cost and a complicated manufacturing method. Unavoidable. For example, the manufacturing cost can be reduced by directly attaching an IC tag to a package having a metal layer. However, in this case, since the magnetic flux is blocked by the metal layer of the package, there is a possibility that the IC tag cannot be electromagnetically induced and communication by the electromagnetic induction method cannot be performed.

  Moreover, even if it is the package body of patent document 1, or the package body which directly attached IC tag, the electromagnetic wave and magnetic flux emitted from an IC tag will be absorbed and attenuate | damped by a metal layer. Therefore, radio waves and magnetic fields do not reach the side where the IC tag is attached and the opposite side across the metal layer. Therefore, even if communication is attempted from the side opposite to the side where the IC tag is attached using a tag reader, the sensitivity may be significantly reduced or communication may not be possible.

  The present invention has been made in view of such a problem of the prior art, and suppresses deterioration of the communication state to a minimum while the IC package for wireless communication is provided in the package having the metal layer. An object is to provide a package. Moreover, it aims at providing the manufacturing method which can manufacture such a package body easily.

In order to achieve the above object, an invention according to claim 1 is directed to an IC chip and a wireless device on a bonding body side of a packaging main body portion made of a multilayer structure having a metal layer and a seal member made of a non-metallic material. A package body including an IC unit provided with a communication antenna unit, wherein the package body unit allows transmission of radio waves and magnetic flux to the metal layer in a thickness direction of the metal layer and A transmission part that allows transmission of radio waves and magnetic flux to the metal layer is formed in the surface direction of the metal layer, and at least a part of the antenna part is located in the transmission part, and the transmission part is formed by the seal member It is characterized by being covered .

According to this configuration, since the transmission part formed in the packaging body part supports communication between the IC part and the IC reader in the thickness direction and the surface direction of the metal layer, the communication is optimized. Multi-directional communication is realized. Moreover, since the structure of an outer box and a space | interval holding member which are in patent document 1 is not essential, it becomes possible to simplify the structure of a package so much.
Moreover, since the transmission part is covered with the sealing member, it is possible to suppress the strength of the packaging main body part from being lowered or the appearance from being deteriorated by forming the transmission part. Moreover, since the seal member is formed of a non-metallic material, it is possible to suppress the radio wave and the magnetic flux from being disturbed and maintain good communication.

  According to a second aspect of the present invention, in the package according to the first aspect of the present invention, at least the metal layer of the multi-layer structure is cut off from the transmission portion. According to this configuration, since at least the metal layer is cut out of the multilayer structure to form the transmission part, it is possible to suppress the passage of radio waves and magnetic flux by the metal layer.

  The invention according to claim 3 is the package of the invention according to claim 1 or claim 2, wherein the packaging body part is provided with a cutout part that is cut off when the packaging body part is opened, The transmission part is formed in the cutout part.

  According to this configuration, when the packaging main body portion is opened and the cutout portion is cut out, the IC portion is also separated from the packaging main body portion together with the cutout portion. Therefore, even if the user is not conscious of removing the IC part, the IC part can be removed simultaneously with the opening of the packaging body part.

In order to achieve the above-mentioned object, the invention according to claim 4 is characterized in that an IC chip and a wireless communication device are formed on the side of the adhesive surface of a packaging body portion made of a multilayer structure having a metal layer and a seal member made of a non-metallic material. A method of manufacturing a package including an IC unit provided with a communication antenna unit, wherein radio waves and magnetic flux are allowed to pass through the metal layer in the thickness direction of the metal layer, and the metal layer A step of forming a transmission part that allows radio waves and magnetic fluxes to pass through the metal layer in a plane direction; and at least a part of the antenna part is located in the transmission part and the sealing member covers the transmission part. characterized in that it comprises a step of attaching the IC unit on the packing main body portion.

  According to this configuration, communication between the IC unit and the IC reader in the thickness direction and the surface direction of the metal layer is supported by passing the process of attaching the IC unit to the packaging body. Moreover, since the package with IC can be manufactured by passing the process of attaching the IC part to the package main body, the manufacturing method of the package is forced to be significantly changed from the conventional manufacturing method. There is nothing.

  The package of the present invention can ensure a good communication state while minimizing the deterioration of the communication state, even though the multilayer structure having the metal layer includes the IC portion. Moreover, according to the manufacturing method of the package of this invention, such a package can be manufactured comparatively simply.

  Hereinafter, the embodiment regarding the package of this invention is described according to FIGS. As shown in FIG.1 and FIG.3, the package of this embodiment is equipped with the IC part 30 which performs radio | wireless communication while being provided with the bag-shaped packaging main-body part 10 which consists of a some sheet | seat.

  As shown in FIG. 2, the packaging main body 10 is composed of a bottom sheet 11 that is folded in two so that the fold line faces upward (in FIG. 2), and a pair of side sheets 12 that sandwich the bottom sheet 11. . The bottom sheet 11 and the side sheet 12 have a base material layer made of a flexible resin sheet. A heat welding layer is provided on one side of the base layer of the bottom sheet 11 and the side sheet 12 and a metal layer is provided on the other side, and the bottom sheet 11 and the side sheet 12 are It is a multilayer structure consisting of three layers.

  As shown in FIG. 2, the bottom sheet 11 in a folded state is formed in a quadrilateral shape, and a long hole-like adhesive hole 11a is formed on the side edge so as to penetrate the front and rear. The bottom sheet 11 is arranged in a folded state so that the surface on the heat-welded layer side is on the outside (side facing the side sheet 12) and the surface on the metal layer side is on the inside. The pair of side sheets 12 are formed in a vertically long rectangular shape, and when the bottom sheet 11 is sandwiched from both sides, the side sheets 12 are arranged so that the surfaces of the side sheets 12 on the side of the heat-welding layer face each other.

  As shown in FIGS. 1 and 3, the folded bottom sheet 11 and the pair of side sheets 12 are bonded to each other by thermal welding at a bottom edge bonding portion 21. As shown in FIG. 3, the bottom edge bonding portion 21 has a curved line that is recessed in an arc shape in the height direction of the packaging main body portion 10 (vertical direction in FIG. 3) and the packaging main body portion 10 (side sheet 12). It is formed to be a region surrounded by the side edge and the bottom edge. Further, in the bottom edge bonding portion 21, the pair of side surface sheets 12 are bonded to each other through the bonding holes 11 a formed in the bottom sheet 11.

  As shown in FIGS. 1 and 3, the side edges of the pair of side sheets 12 are bonded to each other by thermal welding at the side edge bonding portion 22. As shown in FIG. 3, the side edge bonding portion 22 is formed so as to maintain a constant width (width in the left-right direction in FIG. 3) in the height direction of the packaging main body portion 10. Further, the upper edges of the pair of side surface sheets 12 are bonded by heat welding at the upper edge bonding portion 23. As shown in FIG. 3, the upper edge bonding portion 23 is formed to have a horizontally long rectangular shape.

  As shown in FIGS. 2 and 3, a sealing chuck 13 capable of sealing the opening when the packaging body 10 is opened is formed on the surface of the pair of side sheets 12 on the heat-welding layer side. The sealing chuck 13 is formed to extend in the width direction of the packaging main body 10 at a height position below the lower edge 23 a of the upper edge adhesive portion 23. In FIG. 3, the sealing chuck 13 is indicated by a dotted line.

  As shown in FIGS. 1 and 3, triangular cutouts 14 are formed in the side edge bonding portions 22 on both sides of the packaging main body portion 10. The cutout opening 14 is formed at a height above the sealing chuck 13 and below the lower edge 23 a of the upper edge bonding portion 23. In the packaging body of the present embodiment, the opening is opened along the width direction of the packaging main body 10 starting from the cut opening 14, so that the portion of the packaging main body 10 above the cut opening 14 is cut off at the time of opening. Part C.

  As shown in FIGS. 2 and 5, the upper edge adhesive portion 23 is formed with a cut portion 15 as a transmission portion formed by cutting the entire pair of side surface sheets 12 having a multilayer shape. The cutout portion 15 is cut out in a substantially circular shape from one side edge (the right side edge in FIG. 3) of the packaging main body portion 10 toward the center in the width direction of the packaging main body portion 10 so as to have a side edge opening 15a. ing. With such a configuration, the cut portion 15 is opened from the center in both directions in the thickness direction of the packaging body 10 (metal layer) (X direction and Y direction in FIG. 1), and the packaging body 10 (metal layer) from the center. ) In one direction (Z direction in FIG. 1). In the present embodiment, the one direction of the surface direction is the same as the width direction of the packaging body 10. In the present embodiment, the upper edge adhesive portion 23 is located above the cutout opening 14, and the upper edge adhesive portion 23 is included in the cutout portion C. Since the cut portion 15 of the present embodiment is formed in the upper edge bonding portion 23, it can be said that it is formed in the cutout portion C.

  As shown in FIG. 4, the IC part 30 is formed by bonding a circular IC body 32 to a seal member 31 formed of a non-metallic material. The sealing member 31 has a pair of disk parts 31a and a connection part 31b that connects the disk parts 31a, and when the connection part 31b is folded in half, the disk parts 31a overlap each other so that the cut part 15 It is formed to have a similar shape.

  As shown in FIG. 6, the disc part 31a is formed in a substantially circular shape, and its diameter R1 is set larger than the maximum width (diameter) R2 of the cutout part 15 in the height direction of the packaging body part 10. Has been. The connection part 31b is formed in a substantially rectangular shape, and the width W1 in the direction orthogonal to the connection direction of the pair of disk parts 31a is in the height direction of the packaging body part 10 of the side edge opening 15a of the cut part 15. It is set larger than the width W2. In FIG. 6, the cut portion 15 is indicated by a dotted line.

  As shown in FIG. 4, a circular IC body 32 is provided on the bonding surface of the seal member 31. The IC body 32 includes a circular sheet 33 having a diameter R3 that is set smaller than the maximum width R2 of the cut portion 15. An IC chip 34 for storing and calculating information is attached to the center of the surface of the circular sheet 33, and an antenna unit 35 for wireless communication extends from the IC chip 34. The antenna portion 35 extends outward from the central IC chip 34 of the circular sheet 33 and is drawn in a substantially circular shape along the outer periphery of the circular sheet 33.

  As shown in FIG. 1, the IC part 30 is folded in two at a connecting part 31 b and is attached so as to cover the excision part 15 with the upper edge adhesive part 23 sandwiched from both sides. Further, the entire area of the IC main body 32 of the IC section 30 is located in the cutout section 15 of the packaging main body section 10.

  Next, a method for manufacturing the above-described packaging body, particularly a method for attaching the IC portion 30 to the packaging main body portion 10 will be described. In this embodiment, a package is manufactured through the process of forming the cut-out part 15 by forming the bag-shaped package main body part 10 and the process of attaching the IC part 30.

  In the process of forming the packaging body 10, first, the bottom sheet 11 extending in a belt shape is folded in two along its longitudinal direction. Then, the bottom sheet 11 in a folded state is sandwiched between a pair of side sheets 12 that extend in a belt shape and are previously attached at predetermined intervals along the longitudinal direction thereof with a sealing chuck 13. In this superposed state, the bottom sheet 11 and the pair of side sheets 12 are thermally welded by heat sealing means to form the bottom edge adhesive portion 21 and the pair of side sheets 12 are thermally welded to form a side edge adhesive portion. 22 and the upper edge bonding portion 23 are formed. Then, the heat-welded belt-shaped bottom sheet 11 and side sheet 12 are cut along the short direction at predetermined intervals in the longitudinal direction to obtain a bag-shaped packaging body 10. And the cutout opening 14 is formed in the both-sides edge of the packaging main-body part 10. FIG. Further, in the upper edge bonding portion 23 of the packaging body portion 10, the pair of side sheets 12 are punched to form the cut portion 15.

  Next, a process of attaching the IC part 30 to the packaging body part 10 is performed. In this step, transmission of radio waves and magnetic flux to the metal layer is allowed in the thickness direction of the metal layer (side sheet 12), and transmission of radio waves and magnetic flux to the metal layer in the plane direction of the metal layer (side sheet 12) is allowed. The IC part 30 is attached to the packaging main body part 10 as allowed. Specifically, as shown in FIG. 5, the IC portion 30 is arranged so that the center of the circular cut portion 15 coincides with the center of the circular sheet 33 of the IC body 32. And the upper edge adhesion part 23 (cutting part 15) of the packaging main-body part 10 is folded, folding the sealing member 31 so that the surface in which the IC main body 32 of the sealing member 31 is provided may be inside (valley side). Install it so that it is pinched. At this time, the diameter R1 of the disc portion 31a of the seal member 31 is set to be larger than the maximum width R2 of the cut portion 15, and the width W1 of the connecting portion 31b is larger than the width W2 of the side edge opening 15a of the cut portion 15. Since it is set large, the entire region of the cut portion 15 is covered with the seal member 31. Further, since the diameter R3 of the circular sheet 33 is set to be smaller than the maximum width R2 of the cut portion 15, the entire area of the IC body 32 (antenna portion 35) is not in contact with the package main body portion 10. Will be located.

Next, the usage aspect of said package is described.
In the package of the present embodiment, the IC unit 30 and an IC reader (not shown) perform wireless communication by an electromagnetic induction method or a radio wave method. The method of driving the IC main body 32 of the IC unit 30 differs between the electromagnetic induction method and the radio wave method.

  In the case of communication using the electromagnetic induction method, the IC body 32 of the IC unit 30 is driven by magnetic flux (magnetic field) generated from the IC reader. In the cut portion 15 of the packaging body portion 10, the metal sheet is also cut by cutting the side sheet 12, and the magnetic flux in the thickness direction (X direction and Y direction in FIG. 1) of the metal layer (side sheet 12). Is allowed to pass. Further, in the side edge opening 15 a of the cut portion 15, the passage of magnetic flux in one direction (Z direction in FIG. 1) among the surface directions of the metal layer (side sheet 12) is allowed. Therefore, in the vicinity of the side edge opening 15a of the cut portion 15 in the antenna portion 35 of the IC body 32, the magnetic flux generated from the IC reader can pass so as to surround the antenna portion 35 of the IC body 32. Then, when the magnetic flux emitted from the IC reader and surrounding the antenna unit 35 of the IC unit 30 changes, a current flows through the antenna unit 35 by electromagnetic induction.

  On the other hand, in the case of communication using the radio wave system, the IC body 32 of the IC unit 30 is driven by radio waves emitted from the IC reader. In the present embodiment, passage of magnetic flux in the thickness direction (X direction and Y direction in FIG. 1) of the metal layer (side sheet 12) is allowed in the cut portion 15 of the packaging main body portion 10. Accordingly, the radio wave from the IC reader can be applied to the antenna unit 35 of the IC body 32 from either side (from the X direction or the Y direction in FIG. 1) in the thickness direction of the metal layer of the side sheet 12. Since the IC reader emits a radio wave having a frequency corresponding to the resonance frequency of the antenna unit 35 of the IC main body 32, the antenna unit 35 irradiated with the radio wave resonates and a current flows. In the present embodiment, the diameter R3 of the circular sheet 33 is smaller than the maximum width R2 of the cut portion 15 and the centers thereof are set to coincide with each other. Not in contact with. Therefore, the resonance frequency of the antenna unit 35 is not shifted due to the metal layer of the side sheet 12.

  When a current flows through the antenna unit 35, the IC chip 34 is driven by the current and information stored in the IC chip 34 is emitted from the antenna unit 35 as a radio wave. In the present embodiment, since the entire area of the IC main body 32 is located in the cut portion 15, the radio wave emitted from the antenna portion 35 is not blocked by the metal layer of the side sheet 12, but in both directions in the thickness direction of the metal layer (see FIG. 1 in the X direction and the Y direction). The IC reader can receive the radio wave emitted from the antenna unit 35 regardless of the position of the IC reader with respect to the packaging main body unit 10.

According to said embodiment, the following effects can be acquired.
(1) In the said embodiment, the cut part 15 from which the metal layer of this side surface sheet 12 was excised by the side sheet 12 being excised is formed. The cut-out portion 15 supports communication between the IC unit 30 and the IC reader in the thickness direction and the surface direction of the metal layer (side sheet 12). Multi-direction is realized. In addition, since the configuration of the outer box or the like is not essential in order to make the IC unit 30 function, the configuration of the package can be simplified.

  (2) In the above embodiment, the cut portion 15 is formed in the cut portion C. Therefore, when the packaging main body 10 is opened and the cutout portion C is cut out, the IC portion 30 located in the cutout portion 15 is also separated from the packaging main body portion 10 together with the cutout portion C. Therefore, it is not necessary to remove the IC part 30 in particular. Moreover, since the IC part 30 does not exist in the packaging main body part 10 if the packaging main body part 10 is opened, the communication with the IC reader is interrupted, and the management of the packaging body by the IC reader is also simplified.

  (3) In the above embodiment, the entire region of the cut portion 15 is covered with the seal member 31. Therefore, it can suppress that the intensity | strength of the packaging main-body part 10 falls by forming the cutting part 15, or it looks bad. Further, since the seal member 31 is formed of a non-metallic material, it is possible to suppress the magnetic flux and radio waves from being disturbed and maintain good communication.

  (4) In the above embodiment, the entire antenna portion 35 of the IC main body 32 is located in the cutout portion 15 without contacting the packaging main body portion 10. Therefore, radio waves and magnetic fluxes can be transmitted in the thickness direction (X direction and Y direction in FIG. 1) of the metal layer (side sheet 12) over the entire area of the antenna unit 35, and good communication can be performed. In addition, in the above embodiment, since the antenna unit 35 is not in contact with the metal layer of the side sheet 12, the resonance frequency of the antenna unit 35 is unlikely to change. Therefore, radio waves emitted from the IC reader can be received with higher sensitivity, and good communication by the radio wave system is possible.

  (5) In the above embodiment, the cut portion 15 has the side edge opening 15a, and can transmit radio waves and magnetic flux in one direction (Z direction in FIG. 1) of the surface direction of the metal layer (side sheet 12). It is. Therefore, the magnetic flux can be transmitted so as to surround the antenna portion 35 of the IC body 32, and good communication by the electromagnetic induction method is possible.

  (6) In the above embodiment, since the sealing member 31 is folded in half and attached to the packaging body 10 so that the surface on which the IC body 32 is provided is the inside (valley side), the IC body 32 is also sealed. It will be covered by the member 31. Therefore, the IC chip 34 and the antenna unit 35 of the IC body 32 are prevented from being damaged and broken.

  (7) In the said embodiment, the package body with the IC main body 32 can be manufactured by passing through the process which forms the cutting part 15 with respect to the packaging main-body part 10, and attaches the IC part 30. FIG. Therefore, the manufacturing method of the package is not forced to be significantly changed from the conventional manufacturing method.

The above-described embodiment may be modified as follows, and the following modified examples may be implemented in combination with each other.
-In above-mentioned embodiment, although the cut part 15 was formed in the substantially circular shape, the shape of the cut part 15 is not restricted to this. For example, the cut portion 15 having a polygonal shape such as a quadrangular shape or a triangular shape may be formed so as to have the side edge opening 15a. At this time, if the sealing member 31 of the IC portion 30 is formed so as to have a pair of polygonal plate portions and a connecting portion for connecting the polygonal plate portions, the entire area of the polygonal cut portion 15 is covered with the sealing member 31. Can be covered.

  In the above embodiment, the cut portion 15 is formed so as to have the side edge opening 15a. Instead of this configuration, for example, the cut portion 15 may be formed to have an upper edge opening. At this time, one direction of the metal layer (side sheet 12) is the same as the height direction of the packaging body 10. Thus, the one direction of the surface direction may be the width direction, the height direction, or any other direction of the packaging body 10.

  In the above embodiment, the cut portion 15 is opened in one direction among the plane directions of the metal layer (side sheet 12), but may be opened in two directions or multiple directions of three or more directions. . In the case of opening in two directions, the directions may be directed in opposite directions so that the directions form a straight line, or not.

  In the above embodiment, the entire area of the IC main body 32 is located in the excision part 15, but the relationship between the IC main body 32 and the excision part 15 is not limited thereto. For example, the maximum width (diameter) R2 of the cut portion 15 and the width W2 of the connecting portion 15a are set smaller than the diameter R3 of the circular sheet 33 of the IC body 32, and a part of the antenna portion 35 of the IC body 32 is cut away. 15 and the other part may be located in the metal layer. Specifically, as shown in FIG. 7A, a slit-shaped cut portion 41 a extending from the side edge in the width direction of the packaging main body portion 10 may be formed in the upper edge adhesive portion 23 of the packaging main body portion 10. Good. Moreover, as shown in FIG.7 (b), you may form the slit-shaped cutting part 41b extended in the height direction of the packaging main-body part 10 from an upper edge in the upper edge adhesion part 23 of the packaging main-body part 10. As shown in FIG. Furthermore, as shown in FIG.7 (c), you may form the cutting part 41c of the reverse L-shaped slit shape extended in the height direction of the package main-body part 10 from an upper edge, and also extending in the width direction. When these slit-shaped cut portions 41a to 41c are employed, the IC main body 32 may be attached to the packaging main body portion 10 so that a part of the antenna portion 35 of the IC main body 32 is positioned in the cut portions 41a to 41c. 7A to 7C, the attachment position of the IC body 32 is indicated by a dotted line.

  In the slit-shaped cut portions 41a to 41c, the widths do not have to be equal. For example, the width may be gradually increased or decreased, or the cut portions 41a to 41c may be configured by changing the width to increase or decrease the width. Good.

  As shown in FIG. 8A, the upper corner of the packaging main body 10 is cut away to form a cut-out portion 42, and the IC main body 32 is packaged so that a part of the IC main body 32 protrudes from the cut-out portion 42. You may attach to the main-body part 10. FIG. Alternatively, as shown in FIG. 8B, the IC body 32 may be attached so that a part thereof protrudes outward from the side edge of the packaging body 10. 8A and 8B, the attachment position of the IC body 32 is indicated by a dotted line.

  As shown in FIG. 9, the upper edge bonding portion 23 of the packaging main body portion 10 may be divided into an upper portion 44 a and a lower portion 44 b, and a gap between the upper portion 44 a and the lower portion 44 b may be used as the cut portion 43. Specifically, as shown in FIG. 9, a seal member 45 having a disk portion 45a and a connecting portion 45b extending in both directions is formed. Then, the seal member 45 connects the upper portion 44a and the lower portion 44b so as to ensure a predetermined width. A gap between the upper portion 44 a and the lower portion 44 b becomes the cut portion 43. In FIG. 9, the seal member 45 is indicated by a dotted line.

  In the above embodiment, the center of the circular cut portion 15 and the center of the circular sheet 33 of the IC main body 32 coincide with each other. If it is not in contact with the metal layer of the sheet 12, the same effect as the above embodiment can be obtained. If a part of the antenna part 35 is located in the cut part 15 regardless of the positional relationship between the center of the cut part 15 and the center of the circular sheet 33, the antenna part 35 is a metal layer of the side sheet 12. May be in contact with.

  As described above, the configuration of the excision part 15 and the mounting position of the IC body 32 can be freely changed in consideration of the shape, application, design of the packaging body part 10, the communication method of the IC body 32, and the like.

  In the above embodiment, the entire area of the cut portion 15 is covered by the seal member 31, but the entire area may not be covered. For example, the diameter R1 of the disc portion 31a of the seal member 31 may be set smaller than the maximum width R2 of the cut portion 15, or the width W1 of the connecting portion 31b may be set smaller than the width W2 of the side edge opening 15a. Good. However, in the above embodiment, the IC main body 32 is not in contact with the packaging main body portion 10, and the IC main body 32 is indirectly attached to the packaging main body portion 10 via the seal member 31. A portion to be bonded to the main body 10 must be secured.

  -In above-mentioned embodiment, although the sealing member 31 had a pair of disc part 31a and the connection part 31b, the structure of the sealing member 31 is not restricted to this. For example, the sealing member 31 may be formed in an oblong shape or a rectangular shape, and may be folded in half at the center in the longitudinal direction. Or the connection part 31b is not formed, but you may make it pinch | interpose the cutting part 15 with a pair of disc part 31a which is not mutually connected.

  In the above embodiment, the seal member 31 of the IC unit 30 can be omitted. For example, as shown in FIGS. 7A to 7C, FIG. 8A, FIG. 8B, and FIG. 9, when a part of the IC body 32 is located in the cut portion, the circular shape of the IC body 32 is obtained. The sheet 33 is in contact with the packaging body 10. Therefore, if one surface of the circular sheet 33 is an adhesive surface, the IC main body 32 can be bonded to the packaging main body portion 10. In particular, when the surface of the circular sheet 33 on which the IC chip 34 and the antenna unit 35 are formed is an adhesive surface, the antenna unit 35 of the IC body 32 comes into contact with the metal layer of the side sheet 12. Then, since the antenna part 35 and the metal layer of the side sheet 12 cooperate with each other and serve as an antenna, it is easily affected by magnetic flux. Therefore, it is suitable when the electromagnetic induction type communication method is adopted. Further, the circular sheet 33 can be omitted, and in this case, the IC body 32 is directly attached to the seal member 31.

  In the above embodiment, the pair of side sheets 12 is cut to form the cut portion 15 as the transmission portion, but the configuration of the transmission portion is not limited thereto. For example, when the metal layer of the side sheet 12 is formed by vapor deposition, a part of the surface of the side sheet 12 is masked to deposit the metal layer, and then the masking is removed to remove the metal layer. A zone is formed. Then, the pair of side sheets 12 may be bonded so that the non-deposition areas of the pair of side sheets 12 overlap in the thickness direction of the side sheets 12, and the overlapping non-deposition areas may be used as a transmission part. Moreover, when forming a metal layer by bonding a metal sheet to the base material layer of the side sheet 12, after excising a part of the metal sheet beforehand, the metal layer is bonded to the base material layer so that the metal layer is The excised metal layer excision is formed. And a pair of side surface sheet 12 is adhere | attached so that the metal layer cutting part of a pair of side sheet 12 may overlap in the thickness direction of this side sheet 12, and it is good also considering the overlapping metal layer cutting part as a permeation | transmission part.

    In the case where the non-deposition area and the metal layer cut portion are used as a transmission portion, the IC chip 34 and the antenna portion 35 are directly formed on the side sheet 12 instead of the configuration in which the IC chip 34 and the antenna portion 35 are formed on the circular sheet 33. May be. For example, the IC main body 32 can be formed by attaching the IC chip 34 to the base material layer of the side sheet 12 and printing the antenna portion 35 in the non-deposition region and the metal layer cutting portion. In this configuration, the IC body 32 is formed in the same layer as the metal layer.

  The formation position of the cut portion 15 is not limited to the cut portion C (upper edge bonding portion 23). For example, if the IC part 30 is also cut off when the cutout part C of the packaging main body part 10 is cut off, the cutout part 15 on the cutting line of the packaging main body part 10 (the line connecting the two cutout openings 14 in the above embodiment). You may form in. If the space for forming the cut portion 15 can be secured, the cut portion 15 may be formed in the bottom edge bonding portion 21 or the side edge bonding portion 22.

  In the above embodiment, the cutout portion C of the packaging main body 10 can be cut from the cutout opening 14, but the cutout configuration of the cutout portion C is not limited to this. For example, a string body may be attached along the width direction of the packaging main body 10 and the side sheet 12 may be split and opened so as to be divided in the height direction by pulling the string body. In addition, in this structure, since a string body will be cut | disconnected from the packaging main-body part 10, a string body is also contained in the cutting part C. FIG.

  -The opening and sealing structure of the packaging main-body part 10 is not restricted to the said embodiment. For example, the sealing chuck 13 may be omitted if it is not used repeatedly and it is not necessary to seal again after opening. Alternatively, instead of the sealing chuck 13, the content may be allowed to flow, and a mouthpiece having a cap may be provided on the upper edge or the side edge of the packaging body 10. In the case of the configuration employing the mouthpiece, it is not necessary to cut and open the packaging main body portion 10, so that it is not necessary to form the cutout opening 14 in the packaging main body portion 10.

  -The shape of the packaging main-body part 10 is not restricted to the thing of the said embodiment. For example, the packaging body part 10 may be formed in a trapezoidal shape whose width is narrowed upward, or the upper edge of the packaging body part 10 may be formed in an arc shape. Moreover, it is good also as the flat and non-self-supporting packaging main-body part 10 which adhere | attaches a pair of side sheet 12 without interposing the bottom sheet 11.

  The packaging body 10 is not limited to a bag shape, and may be a rectangular box-shaped packaging body 46 as shown in FIG. 10, for example. In this case, a slit-shaped cut portion 47 extending from one side surface to the side surface facing the one side surface of the side surfaces of the packaging main body portion 46 is formed, and the IC body 32 is placed on the cut portion 47 formed on the one side surface. It only has to be attached. In this case, the excision 47 allows the transmission of magnetic flux and radio waves in the thickness direction (A direction and B direction in FIG. 10) of the side surface to which the IC body 32 is attached. Further, transmission of magnetic flux and radio waves in one direction (C direction in FIG. 10) is permitted among the surface directions of the side surface to which the IC body 32 is attached.

  -The communication form of the IC part 30 of the said embodiment is not restricted to an electromagnetic induction system and a radio wave system. For example, a so-called active type IC unit 30 that incorporates a power supply in the IC unit 30 and can emit radio waves without irradiation of magnetic flux or radio waves from the IC reader may be employed.

  The configuration of the IC body 32 is not limited to that of the above embodiment. For example, the circular sheet 33 is not limited to a circular shape, and may be a polygonal shape such as a triangle or a quadrangle. Further, the IC chip 34 provided on the circular sheet 33 may be provided at the edge of the circular sheet 33, or the antenna part 35 may be routed in a square shape.

Next, a technical idea that can be grasped from the above-described embodiment and modified examples will be described below.
The packaging body is formed in a bag shape by adhering a plurality of the multilayer structures to each other with an adhesive portion, and the transmission portion is formed in the adhesive portion.

  A packaging body including a packaging body portion composed of a multilayer structure having a metal layer and an IC portion including an IC chip and an antenna portion for wireless communication, wherein the packaging body portion includes a thickness of the metal layer. The metal layer is cut in the vertical direction and a cut portion is formed by cutting the metal layer in at least one of the plane directions of the metal layer, and the antenna portion is at least partially located in the cut portion. A package characterized by being made.

The perspective view of the package in an embodiment. The disassembled perspective view of the packaging main-body part in embodiment. The front view of the package in an embodiment. The top view of the IC part in an embodiment. The model perspective view at the time of attachment of the IC main body in embodiment. The elements on larger scale of the package in embodiment. (A), (b) and (c) are the partial front views of the packaging main-body part in a modification. (A) And (b) is a partial front view of the packaging main-body part in a modification. The partial front view of the packaging main-body part in the example of a change. The perspective view of the package in the example of a change. Sectional drawing of the conventional package.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Packaging main-body part, 11 ... Bottom sheet as a multilayer structure, 12 ... Side sheet as a multilayer structure, 15 ... Cutting part as a permeation | transmission part, 30 ... IC part, 31 ... Seal member, 32 ... IC main body, 33 ... Circular sheet, 34 ... IC chip, 35 ... Antenna part, C ... Cut-out part.

Claims (4)

A packaging body comprising a packaging body portion made of a multilayer structure having a metal layer, and an IC portion in which an IC chip and an antenna portion for wireless communication are provided on the bonding surface side of a sealing member made of a non-metallic material. There,
The wrapping body has a transmission portion that allows transmission of radio waves and magnetic flux to the metal layer in the thickness direction of the metal layer and allows transmission of radio waves and magnetic flux to the metal layer in the surface direction of the metal layer. The package is formed, wherein at least a part of the antenna part is located in the transmission part, and the transmission part is covered with the seal member .   The package according to claim 1, wherein at least one metal layer of the transmissive portion is cut out of the multilayer structure.   The said packaging main-body part is provided with the cutting part cut off at the time of opening of this packaging main-body part, The said permeation | transmission part is formed in the said cutting-out part, The Claim 1 or Claim 2 characterized by the above-mentioned. The package described. A packaging body comprising a multilayer body having a metal layer and an IC part provided with an IC chip and an antenna part for wireless communication on the bonding surface side of a sealing member formed of a non-metallic material A manufacturing method comprising:
Forming a transmission part that allows transmission of radio waves and magnetic flux to the metal layer in the thickness direction of the metal layer and allows transmission of radio waves and magnetic flux to the metal layer in the plane direction of the metal layer ; and
Together with at least a portion of the antenna portion is positioned at the transmissive portion, the manufacture of packaging, characterized in that it comprises a step of attaching the IC unit on the packing main body as in the seal member covering said transmissive portion Method.

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