JP5352359B2 - Semiconductor device module cooling device - Google Patents

Description

  The present invention relates to a cooling device for a semiconductor element module in which a semiconductor element module having a plurality of chips arranged in a flow direction in the cooling water passage is mounted on a water-cooled heat sink having a cooling water passage.

  In order to enhance the cooling performance of the heat sink on which the semiconductor element module is mounted, cooling fins are disposed in the cooling water passage of the heat sink, the cooling fins extend along the flow direction of the cooling water passage, and the cooling water passage Japanese Patent Application Laid-Open No. H10-228707 has already been known which is integrally formed over the entire length.

JP 2004-349324 A

  By the way, when cooling water flows through the cooling water passage, there is a temperature run-up section in the vicinity of the entrance due to the change in flow velocity distribution, and in the run-up section, the heat transfer coefficient decreases toward the downstream side, and the temperature run-up section It is known that the heat flow rate gradually approaches a constant heat transfer coefficient in a developed region where the flow velocity distribution becomes constant after elapse of time. For this reason, as disclosed in Patent Document 1, the cooling fins extending along the flow direction of the cooling water passage are integrally formed over the entire length of the cooling water passage. Only the temperature run-up section, and it is difficult to obtain high heat transfer efficiency in the entire cooling water passage.

  The present invention has been made in view of such circumstances, and an object thereof is to provide a cooling device for a semiconductor element module in which the cooling efficiency of a heat sink having cooling fins is improved.

To achieve the above object, the present invention is the water-cooled heat sink having a cooling water passage, a semiconductor element module having a plurality of chips arranged in flow direction in the cooling water passage is mounted, the semiconductor element module A cooling device , wherein a plurality of cooling fins separated into each chip along the flow direction and offset in a direction orthogonal to the flow direction extend in the flow direction in the cooling water passage. The semiconductor element module is provided with a pair of semiconductor elements arranged at positions separated from each other along the flow direction of the cooling water passage. Of these, the semiconductor element module having a high heat generation amount is arranged on the lower surface side of the heat sink so that it is distributed on both the upper and lower surfaces of the heat sink. It is in shall be the first feature to be mounted.

The present invention, in addition to the first feature, the semiconductor device module, the second, characterized in that in a state sealed in the coating layer composed of a plurality of semiconductor elements from a synthetic resin is attached to the heat sink And

Furthermore, in the present invention, in addition to the configuration of the first or second feature, each of the cooling fins has a U-shaped or V-shaped valley portion and a mountain portion when viewed in a cross section orthogonal to the flow direction. A third feature is that the two are integrally formed in a continuous waveform .

  The first to eighth switching element modules 27A, 27B, 27C, 27D, 27E, 27F, 27G, and 27H of the embodiment correspond to the semiconductor element module of the present invention, and the first to eighth plus sides of the embodiment. The switching elements 31A, 31B, 31C, 31D, 31E, 31F, 31G, 31H and the first to eighth negative side switching elements 32A, 32B, 32C, 32D, 32E, 32F, 32G, 32H correspond to the semiconductor elements of the present invention. The first heat sink 40 of the embodiment corresponds to the heat sink of the present invention, and the first cooling water passage 43 of the embodiment corresponds to the cooling water passage of the present invention.

According to the first feature of the present invention, a plurality of cooling fins that are separated for each chip along the flow direction and offset in a direction perpendicular to the flow direction are disposed in the cooling water passage of the heat sink. Therefore, the cooling efficiency in the whole cooling water passage can be improved by generating a temperature run-up section for each portion corresponding to each chip arranged in the flow direction . Further, by arranging the pair of semiconductor elements constituting the semiconductor element module at positions separated along the flow direction of the cooling water passage, a temperature run-up section is generated for each semiconductor element, thereby further improving the cooling efficiency. Can be increased .

Furthermore, since a plurality of semiconductor element modules are mounted on the upper and lower surfaces of the heat sink, the cooling performance can be enhanced while the entire cooling device is compactly configured. In addition, among the plurality of semiconductor element modules, the semiconductor element module having a high calorific value is arranged on the lower surface side of the heat sink that is easier to cool.

According to the second feature of the present invention, the semiconductor element module is mounted on the heat sink in a state in which the semiconductor element is enclosed in the synthetic resin coating layer, so that the heat radiation from the coating layer and the cooling from the heat sink The semiconductor element module can be cooled more effectively.

Further, according to the third feature of the present invention, each of the cooling fins is continuously arranged with U-shaped or V-shaped valleys and peaks alternately arranged as viewed in a cross section perpendicular to the flow direction. It is integrally formed in a corrugated shape, so that the position of the downstream cooling fin can be reliably placed at the center position between the upstream cooling fins, reducing the cooling effect due to the displacement of the downstream cooling fin. The anxiety is eliminated and the designed cooling effect can be obtained.

1 is a schematic overall circuit diagram of a power conversion apparatus according to a first embodiment. It is a side view of a switching element assembly unit. FIG. 3 is a view taken along arrow 3 of FIG. 2 in a state where a control circuit is omitted. FIG. 4 is a view taken along arrow 4 of FIG. 2 in a state where a control circuit is omitted. FIG. 5 is a sectional view taken along line 5-5 of FIG. It is a principal part notched perspective view of a switching element assembly unit. FIG. 7 is a cross-sectional view taken along line 7-7 in FIG. It is a figure which shows the change of the heat transfer rate in the cooling water distribution direction in a 1st heat sink by contrasting with the longitudinal cross-section of a switching element assembly unit. It is a perspective view of a power converter. FIG. 10 is a plan view taken in the direction of arrow 10 in FIG. 9. It is 11 arrow line view of FIG. 12 is a sectional view taken along line 12-12 of FIG. It is sectional drawing of the 2nd heat sink which follows the 13-13 line of FIG. It is a figure which shows the circulation circuit of a cooling water. FIG. 15 is a cross-sectional view taken along line 15-15 in FIG. 10. It is a disassembled perspective view of a capacitor unit. It is a disassembled perspective view of a switching element assembly unit, a DC link capacitor unit, and an external bus bar unit. It is a disassembled perspective view of an external bus bar unit. It is a figure which simplifies and shows the current path | route between a converter and an inverter in the state (a) without an external bus-bar unit, and the state (b) with an external bus-bar unit. It is a simplified diagram showing an example of a path of commutation current in a DC link capacitor unit in a state where there is an external bus bar unit. FIG. 6 is a simplified diagram showing another example of a commutation current path in a DC link capacitor unit in a state where there is an external bus bar unit. FIG. 12 is a simplified diagram showing still another example of a commutation current path in a DC link capacitor unit in a state where there is an external bus bar unit. FIG. 10 is a plan view showing an upper surface of a switching element assembly unit in a state in which a control circuit is omitted according to a second embodiment. It is a bottom view which shows the lower surface of the switching element assembly unit in the state which abbreviate | omitted the control circuit. FIG. 25 is a sectional view taken along line 25-25 in FIG. 23. It is the 26-26 sectional view taken on the line of FIG. It is a figure which shows the change of the heat transfer rate in the cooling water distribution direction in a 1st heat sink by contrasting with the longitudinal cross-section of a switching element assembly unit.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

  A first embodiment of the present invention will be described with reference to FIGS. 1 to 22. First, in FIG. 1, the power conversion device includes a direct current power obtained by a fuel cell 15 as a first direct current power source, The DC power obtained by the storage battery 16 that is a DC power source is mounted on the vehicle so as to be converted into three-phase AC power supplied to the electric motor 17 that exhibits the power for driving the drive wheels. A first converter 18 that steps up and down a DC voltage obtained from the battery 15, a second converter 19 that steps up and down a DC voltage obtained from the storage battery 16, and a DC voltage from the first and second converters 18 and 19 is converted into an AC voltage. And an inverter 20 for driving the electric motor 17 and a DC link capacitor unit 21 provided between the converters 18 and 19 and the inverter 20.

  The first converter 18 includes a first input capacitor 22, a first inductor 24, a three-phase transformer 26 having a primary winding 26A, a secondary winding 26B, and a tertiary winding 26C, and first, second, and third. Switching element modules 27A, 27B, and 27C are provided.

  A ground line 28 that is common to the first converter 18, the second converter 19, and the inverter 20 is connected to the negative terminal of the fuel cell 15, and the first input capacitor 22 is connected to the positive terminal of the fuel cell 15. Provided between the first input side plus line 29 and the ground line 28 to be connected, one end of the first inductor 24 is connected to the first input side plus line 29. One end of the primary winding 26A, the secondary winding 26B, and the tertiary winding 26C in the three-phase transformer 26 is connected in parallel to the other end of the first inductor 24.

  The first switching element module 27A includes a first plus side switching element disposed between the common plus line 30 common to the first converter 18, the second converter 19 and the inverter 20 and the primary winding 26A of the three-phase transformer 26. 31A and a first negative side switching element 32A disposed between the primary winding 26A and the ground line 28. The second switching element module 27B includes two common positive lines 30 and a three-phase transformer 26. A second switching element 31B disposed between the secondary windings 26B and a second switching element 32B disposed between the secondary windings 26B and the ground line 28; The element module 27C includes the common plus line 30 and the three-phase transistor. And a third positive side switching element 31C is disposed between 26 tertiary winding 26C, and a third negative side switching element 32C is disposed between the tertiary winding 26C and the ground line 28.

  The second converter 19 includes a second input capacitor 23, a second inductor 25, a two-phase transformer 33 having a primary winding 33A and a secondary winding 33B, and fourth and fifth switching element modules 27D and 27E. Prepare.

  The second input capacitor 23 is provided between a second input side plus line 34 connected to the plus side terminal of the storage battery 16 and a ground line 28 connected to the minus side terminal of the storage battery 16, and the second inductor 25. Is connected to the second input side plus line 34. One end of the primary winding 33 </ b> A and the secondary winding 33 </ b> B in the two-phase transformer 33 is connected in parallel to the other end of the second inductor 25.

The fourth switching element module 27D includes a fourth positive switching element 31D disposed between the common plus line 30 and the primary winding 33A of the two-phase transformer 33, and between the primary winding 33A and the ground line 28. And a fifth switching element module 27E is provided between the common plus line 30 and the secondary winding 33B of the two-phase transformer 33. An element 31E and a fifth negative switching element 32E disposed between the secondary winding 33B and the ground line 28 are provided.

  The inverter 20 includes sixth, seventh, and eighth switching element modules 27F, 27G, and 27H.

  The sixth switching element module 27F includes a sixth plus-side switching element 31F disposed between the common plus line 30 and the U-phase power supply line 35U connected to the electric motor 17 which is a three-phase AC motor, And a sixth negative switching element 32F disposed between the power line 35U and the ground line 28. The seventh switching element module 27G includes a V-phase power line 35V connected to the common positive line 30 and the electric motor 17. A seventh plus-side switching element 31G disposed between the V-phase power supply line 35V and the ground line 28, and an eighth switching element module 27H includes: The common plus line 30 and the electric motor 17. Comprising an eighth positive side switching element 31H disposed between becomes W phase power supply line 35W, and an eighth negative side switching element 32H disposed between the W phase power supply line 35W and the ground line 28.

  By the way, in this embodiment, the first to eighth plus side switching elements 31A to 31H and the first to eighth minus side switching elements 32A to 32H in the first to eighth switching element modules 27A to 27H are IGBTs (Insulatead Gate). Bipolar Transistor) and a diode connected in parallel to each IGBT with the side from the emitter toward the collector as the forward direction.

  The DC link capacitor unit 21 has smoothing capacitors 36... Provided between the common plus line 30 and the ground line 28. Although only one smoothing capacitor 36 is shown in FIG. 1 for the sake of simplification, the DC link capacitor unit 21 includes a U-phase, a V-phase, and a W-phase of the electric motor 17 that is a three-phase AC motor. Smoothing capacitors 36... Provided between the common plus line 30 and the ground line 28 corresponding to the phases are provided.

  A series circuit including a pair of discharge resistors 37 and 37 is connected between the common plus line 30 and the ground line 28.

  2 to 4, the first, second and third switching element modules 27A, 27B and 27C included in the first converter 18 and the fourth and fifth switching element modules included in the second converter 19 are referred to. 27D and 27E and the sixth, seventh and eighth switching element modules 27F, 27G and 27H included in the inverter 20 are disposed on both upper and lower surfaces of the water-cooled first heat sink 40.

  5 to 7 together, the first heat sink 40 forms a first cooling water passage 43 between the heat sink body 41 formed long in one direction and the heat sink body 41. Thus, the cover body 42 is coupled to the heat sink body 41 from above. Thus, the first cooling water passage 43 includes an outward path 43a extending in the longitudinal direction of the heat sink 40 from one end of the first heat sink 40 toward the other end, and one end side from the other end of the first heat sink 40. A return path 43b extending in parallel with the forward path 43a is formed to communicate with each other on the other end side of the first heat sink 40, and at one end of the first heat sink 40, A cooling water inlet pipe 44 leading to the forward path portion 43 a in the first cooling water passage 43 and a cooling water outlet pipe 45 leading to the return path portion 43 b in the first cooling water passage 43 are provided. The cooling water introduced into one cooling water passage 43 flows in the forward path portion 43a to the other end side of the first heat sink 40 along the flow direction indicated by the arrow 46 in FIG. Other Will be derived from the cooling water outlet pipe 45 at one end of the first heat sink 40 is inverted to return part 43b side on the side.

  By the way, the first converter 18 includes three first, second, and third switching element modules 27A, 27B, and 27C, and the second converter 19 includes two fourth and fifth switching element modules 27D and 27E. The inverter 20 includes three sixth, seventh, and eighth switching element modules 27F, 27G, and 27H. Therefore, an even number is provided on both surfaces of the first heat sink 40, in this embodiment. Eight switching element modules 27 </ b> A to 27 </ b> H are mounted on the upper and lower surfaces of the first heat sink 40 in a substantially symmetrical arrangement.

  Moreover, when the heat generation amount of the first to third switching element modules 27A to 27C is 700 W, for example, the heat generation amount of the fourth and fifth switching element modules 27D and 27E is 500 W, for example, and the sixth to eighth switching element modules 27F. Since the heating value of .about.27H is 1100 W, for example, the switching element modules having a higher heating value are arranged on the lower surface side of the first heat sink 40 that is easier to cool, while the first to eighth switching element modules. 27A to 27H are mounted on the upper and lower surfaces of the first heat sink 40 in a substantially symmetrical arrangement. In this embodiment, the second and third switching element modules 27B and 27C are arranged on the upper surface of the first heat sink 40. , Fourth and fifth switching element modules 27D, 27E, Is disposed, and a first switching element module 27A, sixth, seventh and eighth switching element modules 27F, 27G, and the 27H is disposed on the lower surface of the first heat sink 40.

  Focusing on FIG. 5, the first to eighth switching element modules 27 </ b> A to 27 </ b> H replace the first to eighth plus-side switching elements 31 </ b> A to 31 </ b> H on one side in the width direction of the first heat sink 40, in this embodiment. The first cooling water passage 43 is disposed on the forward path 43a side, and the first to eighth negative side switching elements 32A to 32H are arranged on the other side in the width direction of the first heat sink 40, in this embodiment, the first cooling water. The first heat sink 40 is disposed on both upper and lower surfaces so as to be disposed on the return path 43 b side of the passage 43.

  A plurality of chips constituting the first to eighth plus side switching elements 31A to 31H and the first to eighth minus side switching elements 32A to 32H, respectively, in this embodiment, six chips 47, 48, 49, 50, As shown in FIGS. 3 and 4, 51 and 52 are arranged so as to be arranged two by two in the direction along the flow direction 46 of the cooling water in the first cooling water passage 43, as shown in FIG. 5. As described above, the copper electrode 56 disposed on the copper electrode 53 via the solder layer 54 and sandwiching the insulating substrate 55 between the copper electrode 53 is fixed onto the copper base plate 58 via the solder layer 57.

  On the copper base plate 58, the first to eighth plus-side switching elements 31A to 31H and the first to eighth minus-side switching elements 32A to 32H are arranged for the first to eighth switching element modules 27A to 27H. Are made of a synthetic resin and each has a portion 59... And is formed in a rectangular frame shape. The copper base plate 58 and the case 60 are fixed to the first heat sink 40. The

  In the first heat sink 40, as clearly shown in FIG. 6, a plurality of stud bolts 63 each having screw shafts 63a, 63a at both ends correspond to the four corners of each case 60, respectively. The screw shafts 63a... Are planted so as to protrude from both the upper and lower surfaces of the first heat sink 40 at the position. Thus, the cases 60 of the first to eighth switching element modules 27A to 27H and the copper base plate 58 are screwed into the screw shafts 63a of the stud bolts 63 selected from the stud bolts 63. The first to eighth switching element modules 27 </ b> A to 27 </ b> H are mounted on the upper and lower surfaces of the first heat sink 40 by tightening and fastening the nuts 64.

  In addition, in the case 60, the chips 47 to 52, the copper electrode 53, the solder layer 54, the insulating substrate 55, the copper electrode 56, and the solder layer 57 are buried, and the covering layer 65 made of a synthetic resin is buried. The first to eighth plus side switching elements 31A to 31H and the first to eighth minus side switching elements 32A to 32H of the first to eighth switching element modules 27A to 27H are formed of the covering layer. 65... In the case 60, the first to eighth plus side switching elements 31A to 31H and the first to eighth minus side switching elements 32A to 32H in the first to eighth switching element modules 27A to 27H are electrically connected and cut off, respectively. Control circuits 66 for switching control are attached so as to cover the first to eighth switching element modules 27A to 27H.

  The first heat sink 40 and the first to eighth switching element modules 27A to 27H mounted on the upper and lower surfaces of the first heat sink 40 constitute a switching element assembly unit 67 including their control circuits 66.

  By the way, in the first to eighth switching element modules 27A to 27H, the terminals to be connected to the three-phase transformer 26, the two-phase transformer 33, and the electric motor 17 are arranged on one side in the width direction of the first heat sink 40. Terminal members 68A, 68B, and 68C that are attached to the first heat sink 40 and are connected to the terminals to be connected to the three-phase transformer 26 of the first to third switching element modules 27A to 27C; Terminal members 68D and 68E connected to the terminals to be connected to the two-phase transformer 33 of the five switching element modules 27D and 27E, and terminals to be connected to the electric motor 17 of the sixth to eighth switching element modules 27F to 27H. The terminal members 68F, 68G, 68H are arranged on one side in the width direction of the first heat sink 40. And to so that, attached to the case 60 ....

  In each of the switching element modules 27A to 27H, the plus side connection terminals 69, 69... To be connected to the common plus line 30 and the minus side connection terminals 70, 70. One heat sink 40 is attached to the case 60 in such a manner that it is arranged in parallel for each of the switching element modules 27A to 27H on the other side in the width direction.

In the first cooling water passage 43 of the first heat sink 40 , an aluminum alloy having a cross-section orthogonal to the flow direction 46 as a continuous waveform in which U-shaped or V-shaped valleys and peaks are alternately arranged. A plurality of cooling fins 71 </ b> A, 71 </ b> A... Integrally formed of a light metal such as the like are arranged so as to extend in the flow direction 46 while dividing the inside of the first cooling water passage 43 into a plurality in the width direction.

  On the other hand, the plurality of chips 47 to 52 constituting the first to eighth plus side switching elements 31A to 31H and the first to eighth minus side switching elements 32A to 32H in the first to eighth switching element modules 27A to 27H, respectively. The chips 47 and 48, the chips 49 and 50, and the chips 51 and 52 are arranged in the flow direction 46 so as to be arranged two by two in the direction along the flow direction 46 of the cooling water in the first cooling water passage 43. Arranged side by side.

  Moreover, the chips 47, 49, 51 are arranged on the upstream side along the flow direction 46 at the same position along the flow direction 46, and the chips 48, 50, 52 are arranged downstream on the flow direction 46 in the flow direction 46. , And the second to fifth plus-side switching elements 31B to 31E and the second to fifth in the second to fifth switching element modules 27B to 27E on the upper surface side of the first heat sink 40. Minus-side switching elements 32B to 32E and first and sixth to eighth plus-side switching elements 31A and 31F in the first and sixth to eighth switching element modules 27A and 27F to 27H on the lower surface side of the first heat sink 40. To 31H and the first and sixth to eighth minus side switching elements 32A and 32F to 32H, FIG. As shown, the position along the said circulation direction 46 of each chip 47 to 52 is set to the same.

  On the other hand, the cooling fins 71A, 71A... Are arranged between the upstream chips 47, 49, 51 and the downstream chips 48, 50, 52 as shown in FIGS. While separating the chips 47, 49, 51; 48, 50, 52 aligned along the flow direction 46, while determining the length along the flow direction 46 corresponding to the interval along the flow direction 46, As clearly shown in FIG. 7, the chips 47, 49, 51; 48, 50, 52 arranged along the flow direction 46 are arranged offset in the direction orthogonal to the flow direction 46.

  By the way, when cooling water flows along the cooling fins 71A, 71A, there is a temperature run-up section in the vicinity of the inlet of the cooling fins 71A, 71A ... It is known that the heat transfer rate decreases toward the temperature and gradually approaches the constant heat transfer coefficient in the developed region where the flow velocity distribution becomes constant after passing through the temperature run-up section, which is relatively high in the run-up section Although the heat transfer coefficient can be obtained, in the developed region, the boundary layer between the surfaces of the cooling fins 71A, 71A... Becomes thick and the heat transfer efficiency is lowered. For this reason, in the case where fins that extend long along the flow direction 46 are arranged in the first cooling water passage 43, it is difficult to obtain high cooling efficiency in the entire first cooling water passage 43. However, as described above, the cooling fins 71A, 71A,... Are separated for each of the chips 47, 49, 51; 48, 50, 52 arranged along the flow direction 46, and the chips 47, 49, 51; , 50, 52 are offset in the direction orthogonal to the flow direction 46, so that the cooling fins 71A separated for each chip 47, 49, 51; 48, 50, 52 arranged along the flow direction 46 are arranged. A temperature run-up section as shown in FIG. 8B can be formed for each inlet of 71A..., Whereby high cooling efficiency can be obtained in the entire first cooling water passage 43.

  9 to 12 together, a terminal member attached to the case 60 is arranged on one side of the first heat sink 40 in one side of the switching element assembly unit 67. A substrate 72 for disposing a current sensor or the like is disposed so as to penetrate through 68 </ b> A to 68 </ b> H, and the substrate 72 is fixed to the first heat sink 40. A second heat sink 73 is disposed above the switching element assembly unit 67, and the first inductor 24 and the three-phase transformer 26 in the first converter 18, and the second inductor 25 and the two-phase transformer in the second converter 19. 33 and a capacitor unit 38 in which the first input capacitor 22 of the first converter 18 and the second input capacitor 23 of the second converter 19 are integrated, and a second heat sink 73 is connected to the switching element assembly unit 67. It is disposed above the second heat sink 73 so as to be interposed therebetween.

  The second heat sink 73 includes a heat sink body 74 that is formed long in the same direction as the longitudinal direction of the first heat sink 40, and a second cooling water passage 76 formed between the heat sink body 74 and the heat sink body 74. The lid body 75 is coupled to the main body 74 from below, and is formed thinner than the first heat sink 40.

  In FIG. 13, the second cooling water passage 76 has an outward path portion 76 a extending in the longitudinal direction of the heat sink 73 from one end of the second heat sink 73 toward the other end, and one end from the other end of the second heat sink 73. A return path portion 76b extending in parallel with the forward path portion 76a toward the side is formed between the heat sink body 74 and the lid body 75 so as to communicate with each other on the other end side of the second heat sink 73. One end of the second heat sink 73 is provided with a cooling water inlet pipe 78 leading to the forward path portion 76a and a cooling water outlet pipe 79 leading to the backward path portion 76b. The cooling water introduced into the water passage 76 flows in the forward path portion 76a of the second cooling water passage 76 along the flow direction indicated by the arrow 77 to the other end side of the second heat sink 73, and further to the second. Will be derived from one end of the cooling water outlet pipe 79 of the second heat sink 73 is inverted to return part 76bb side at the other end of the heat sink 73. The heat sink main body 74 of the second heat sink 73 is integrally provided with a rectifying wall portion 74 a disposed in the forward path portion 76 a of the second cooling water passage 76 so as to extend along the flow direction 77.

  In FIG. 14, the first cooling water passage 43 in the first heat sink 40 and the second cooling water passage 76 in the second heat sink 73 have discharge ports of a cooling water pump 80 that is a cooling water supply source. The cooling water that is connected in parallel and led out from the first and second cooling water passages 43 and 76 cools the electric motor 17, is then cooled by the radiator 81, and returns to the inlet of the cooling water pump 80.

  The three-phase transformer 26 of the first converter 18 is one side in the width direction of the first and second heat sinks 40, 73, that is, the side on which the substrate 72 is disposed, and one end side of the first and second heat sinks 40, 73. That is, the first cover 84 is fixed on the second heat sink 73 so as to be arranged on the side where the cooling water inlet pipes 44 and 78 and the cooling water outlet pipes 45 and 79 are provided, and covers the three-phase transformer 26. Is fixed to the second heat sink 73.

  The two-phase transformer 33 of the second converter 19 is arranged at a position aligned with the three-phase transformer 26 on one side in the width direction of the first and second heat sinks 40 and 73, and the second inductor 25 of the second converter 19 is The two-phase transformer 33 is disposed on one side in the width direction of the first and second heat sinks 40 and 73 so as to sandwich the two-phase transformer 33 between the three-phase transformer 26 and fixed on the second heat sink 73. The transformer 33 and the second inductor 25 are commonly covered with a second cover 85 fixed to the second heat sink 73. In addition, a first terminal block 86 positioned above the substrate 72 is fixed to the first cover 84, and a second terminal block 87 positioned above the substrate 72 is fixed to the second cover 85.

  The first terminal block 86 includes a common terminal 88 for connecting the windings 26A, 26B, and 26C of the three-phase transformer 26 to the first inductor 24, and the windings 26A, 26B, and 26C to the first to third switching elements. Individual terminals 89, 90 and 91 for individually connecting to the modules 27A to 27C are provided, and the individual terminals 89 to 91 are provided with the three-phase transformer 26 of the first to third switching element modules 27A to 27C. Terminal members 68A, 68B, and 68C penetrating through the board 72 connected to terminals to be connected to the board are connected via bus bars 92, 93, and 94 located outside the board 72.

  The second terminal block 87 has a common terminal 95 for connecting the windings 33A and 33B of the two-phase transformer 26 to the second inductor 25, and the windings 33A and 33B as fourth and fifth switching element modules 27D and 27E. The individual terminals 96 and 97 for connection to the second inductor are provided such that the individual terminal 96 is disposed below the common terminal 95 and the individual terminal 97 is disposed above the common terminal 95, and the second inductor. Terminals 98 and 99 connected to both ends of 25 are provided. The individual terminals 96 and 97 include terminal members 68D and 68E penetrating through the substrate 72 connected to terminals to be connected to the two-phase transformer 33 of the fourth and fifth switching element modules 27D and 27E. They are connected via bus bars 100 and 101 located outside. The common terminal 95 and the terminal 98 are connected via a bus bar 102.

  The first inductor 24 of the first converter 18 is the other side in the width direction of the first and second heat sinks 40 and 73, that is, the side opposite to the side where the substrate 72 is disposed, and the first and second heat sinks 40 and 73. Is arranged on the second heat sink 73 so as to be aligned with the three-phase transformer 26 on one end side thereof, that is, on the side where the cooling water inlet pipes 44 and 78 and the cooling water outlet pipes 45 and 79 are provided. A third cover 105 covering the first inductor 24 is fixed to the second heat sink 73. Moreover, the third terminal block 106 is fixed to the third cover 105 so as to be disposed on one end side of the first and second heat sinks 40 and 73.

  The third terminal block 106 is provided with terminals 107 and 108 connected to both ends of the first inductor 24. One terminal 107 has a second gap between the switching element assembly unit 67 and the second heat sink 73. The bus bar 109 extending to the other end in the longitudinal direction of the heat sink 73 is connected, and the common terminal 88 provided on the first terminal block 86 is connected to the other terminal 108 via the bus bar 110.

  The capacitor unit 38 is arranged on the other side in the width direction of the first and second heat sinks 40, 73, that is, on the opposite side to the side on which the substrate 72 is arranged so as to be aligned with the first inductor 24. The capacitor unit 38 is covered with a fourth cover 111 fixed to the second heat sink 73.

  15 and 16, the first input capacitor 22 constituting a part of the capacitor unit 38 is formed by connecting a plurality of first capacitor elements 112, 112... Arranged in parallel. The second input capacitor 23 is formed by connecting a plurality of second capacitor elements 113, 113... Arranged in parallel with the arrangement direction of the first capacitor elements 112, 112. The first and second capacitor elements 112, 112... 113, 113... That are set to the same number are arranged so that the minus sides thereof face each other, and the first and second capacitor elements 112, 112 are arranged. The common bus bar 114 having a plurality of negative side connection pieces 114a, 114a ... connected to the negative side of 113, 113 ... by soldering leads the first and second capacitor elements 112, 112 ...; 113, 113 ... from above. A first individual bus bar 115 having a plurality of positive side connection pieces 115a, 115a,..., Which are arranged so as to be covered and soldered to the positive side of the first capacitor elements 112, 112. 2nd individual bus bar having a plurality of plus side connection pieces 116a, 116a,. 16 and is disposed on the common bus bar 114 so as to sandwich the insulating sheet 117 between the common bus bar 114. Thus, the capacitor unit 38 in which the first and second capacitor elements 112, 112,..., 113, 113... Are connected by the common bus bar 114 and the first and second bus bars 115, 116 is a covering layer made of a synthetic resin. The case 119 is accommodated in the case 119 so as to be embedded in the case 118, and the case 119 is covered with the fourth cover 111.

  In addition, the common bus bar 114 is integrally provided with a ground terminal 120 common to the first and second input capacitors 22 and 23 so as to protrude from the covering layer 118, and the first and second individual bus bars 115, 116, positive terminals 121 and 122 individually corresponding to the first and second input capacitors 22 and 23 are integrally projected so as to sandwich the ground terminal 120 from both sides, and both the positive terminals 121 and 122 are also provided with the covering layer. Protrudes from 118.

  A fourth terminal block 123 is fixed on the other end of the second heat sink 73 at a position where the capacitor unit 38 is sandwiched between the first inductor 24 and a fuel cell. 15 are provided, plus and minus terminals 124 and 125 for the fuel cell for connecting 15, and plus and minus terminals 126 and 127 for the storage battery for connecting the storage battery 16.

  Thus, the positive terminal 121 of the capacitor unit 38 and the bus bar 109 connected to the terminal 107 provided on the third terminal base 106 connected to the first inductor 24 are connected to the positive terminal 124 for the fuel cell. The positive terminal 122 of the capacitor unit 38 and the bus bar 128 connected to the terminal 99 provided on the second terminal block 87 so as to be connected to the second inductor 25 are connected to the fourth terminal block 123. It is connected to the fourth terminal block 123 so as to be connected to the side terminal 126.

  A fifth terminal block 130 for connecting U-phase, V-phase and W-phase power supply lines 35U, 36V, 35W connected to the electric motor 17 is fixed to the other end of the first heat sink 40. Bus bars 131, 132, and 133 are connected to terminals to be connected to the electric motor 17 of the sixth to eighth switching element modules 27 </ b> F to 27 </ b> H and are connected to terminal members 68 </ b> F to 68 </ b> H penetrating the substrate 72. It extends to the terminal block 130.

  By the way, the DC link capacitor unit 21 is disposed on the opposite side of the substrate 72. The DC link capacitor unit 21 is supported by the first heat sink 40 by the stays 135 and 135, and the first heat sink 40 and the DC An external bus bar unit 136 is disposed between the link capacitor units 21.

  In FIG. 17, on the side surface of the DC link capacitor unit 21 on the first heat sink 40 side, the first to eighth switching element modules 27A to 27H mounted on the upper and lower surfaces of the first heat sink 40 are respectively provided on the plus side. The plus side connection terminals 139 and minus side connection terminals 140 to be connected to the connection terminals 69 and minus side connection terminals 70 are projected.

  18, the external bus bar unit 136 includes a plurality of positive side terminals connected to the positive side connection terminals 69 of the first to eighth switching element modules 27A to 27H and the positive side connection terminals 139 of the DC link capacitor unit 21. Are connected to the positive external bus bar 141 projecting the connection pieces 141a, 141a from both sides, the negative connection terminal 70 of the first to eighth switching element modules 27A to 27H, and the negative connection terminal 140 of the DC link capacitor unit 21. A plurality of minus side connection pieces 142a, 142a... That project from both sides, and a plus side and minus side external bus bar 141, 142, and between the plus side and minus side external bus bar 141, 142. Flat sandwiched between And the flat insulating members 144 and 145 sandwiching the positive and negative external bus bars 141 and 142 between the insulating member 143 and the insulating member 143 are stacked. An external bus bar unit 136 is formed.

  In addition, a mounting plate portion 142b that protrudes from one end of the positive-side external bus bar 141 is integrally provided at one end of the negative-side external bus bar 142 in the external bus bar unit 136. The external bus bar unit 136 is directly in contact with the first heat sink 40.

  Thus, the plus side connection terminals 139 of the DC link capacitor unit 21, the plus side connection pieces 141a of the external bus bar unit 136, and the plus side connection terminals 69 of the first to eighth switching element modules 27A to 27H. As shown in FIG. 12, the positive side connection pieces 141a are sandwiched between the positive side connection terminals 139, 69,. The minus side connection terminals 140 of the DC link capacitor unit 21, the minus side connection pieces 142a of the external bus bar unit 136, and the minus side connection terminals 70 of the first to eighth switching element modules 27A to 27H are minus. The negative connection pieces 142a are sandwiched between the side connection terminals 140, 70, and so on by bolts 148.

  By the way, the DC power obtained by the first converter 18 or the second converter 19 is converted into AC power by the inverter 20 and supplied to the electric motor 17. The power from the first converter 18 or the second converter 19 is supplied. Are temporarily stored in the smoothing capacitors 36 of the DC link capacitor unit 21 and the inverter 20 takes out the stored electric power. Such a power flow can be replaced with a current flow. When the external bus bar unit 136 is not provided, the current i1 supplied from the smoothing capacitor 36 and the current i1 supplied from the smoothing capacitor 36 can be obtained as shown by a thin line arrow in FIG. The current i 2 supplied from the first converter 18 or the second converter 19 without passing through the smoothing capacitor 36 flows to the inverter 20 through the internal wiring of the DC link capacitor unit 21. When the internal wiring of the DC link capacitor unit 21 bears all the current in this way, the internal wiring generates heat and enlarges, and the heat generation of the wiring adversely affects the smoothing capacitor 36 thermally. .

  On the other hand, when the external bus bar unit 136 is interposed between the first converter 18 and the second converter 19 and the DC link capacitor unit 21, as shown by a thin line arrow in FIG. Since a part i2 ′ of the current i2 supplied from the second converter 19 flows directly to the inverter 20 side through the plus side external bus bar 141 in the external bus bar unit 136, the current flowing through the internal wiring of the DC link capacitor unit 21 is The heat effect on the smoothing capacitor 36 can be suppressed to a low level.

  Further, the direct current is switched by switching conduction / cutoff of the sixth to eighth plus side switching elements 31F to 31H and the sixth to eighth minus side switching elements 32F to 32H in the sixth to eighth switching element modules 27F to 27H of the inverter 20. A commutation current flows in the link capacitor unit 21, and for simplification, the portion corresponding to the W phase of the inverter 20 is omitted, and the sixth and seventh plus side switching elements 31F and 31G and the first The path of the commutation current flowing in the DC link capacitor unit 21 and the external bus bar unit 136 when the conduction of the sixth and seventh minus side switching elements 32F and 32G is switched will be described with reference to FIGS. .

  First, when the sixth plus-side switching element 31F and the seventh minus-side switching element 32G are turned on and the sixth minus-side switching element 32F and the seventh plus-side switching element 31G are cut off, as shown by the thin line arrows in FIG. The currents i3 'and i4' corresponding to the currents i3 and i4 flowing through the internal wiring of the DC link capacitor unit 21 flow through the positive and negative bus bars 141 and 142 of the external bus bar unit 136. The current flowing through the internal wiring can be kept small.

  Further, when the sixth and seventh minus side switching elements 32F and 32G are made conductive and the sixth and seventh plus side switching elements 31F and 31G are cut off, as shown by thin line arrows in FIG. The current i5 ′ corresponding to the current i5 flowing through the internal wiring flows through the minus side bus bar 142 of the external bus bar unit 136, and the current flowing through the internal wiring of the DC link capacitor unit 21 can be kept small.

  Further, when the sixth and seventh plus side switching elements 31F and 31G are turned on and the sixth and seventh minus side switching elements 32F and 32G are cut off, as shown by the thin line arrows in FIG. The current i6 ′ corresponding to the current i6 flowing through the internal wiring flows through the plus side bus bar 141 of the external bus bar unit 136, and the current flowing through the internal wiring of the DC link capacitor unit 21 can be suppressed to a small value.

  That is, the positive side connection terminals 69 of the first to eighth switching element modules 27A to 27H are commonly connected outside the DC link capacitor unit 21 by the external bus bar unit 136, and the first to eighth switching element modules 27A to 27H are connected. Are connected to the outside of the DC link capacitor unit 21 by the external bus bar unit 136, so that a part of the current supplied from the first converter 18 or the second converter 19 to the inverter 20 is reduced. The commutation current that passes through the outside of the DC link capacitor unit 21 and is generated by switching on / off of the sixth to eighth plus-side switching elements 31F to 31H and the sixth to eighth minus-side switching elements 32F to 32H in the inverter 20 Part of the DC link It can be made to pass through the outside of the capacitor unit 21.

  Next, the operation of the first embodiment will be described. First to eighth switching circuits are configured by forming a part of the first converter 18, the second converter 19 and the inverter 20 on the upper and lower surfaces of the water-cooled first heat sink 40, respectively. The switching element assembly unit 67 is configured by mounting the element modules 27 </ b> A to 27 </ b> H, and a water-cooled second heat sink 73 is interposed between the switching element assembly unit 67 and the switching element assembly unit 67. Thus, since the first inductor 24 and the three-phase transformer 26 in the first converter 18 and the second inductor 25 and the two-phase transformer 33 in the second converter 19 are arranged, the first converter 18 can be made compact while being made compact. To eighth switching element modules 27A to 27H and the first The cooler 24, the three-phase transformer 26, the second inductor 25, and the two-phase transformer 33 can be efficiently cooled, and the first inductor 24, the three-phase transformer 26, the second inductor 25, and the two-phase transformer 33 The second heat sink 73 can suppress the influence of noise on the first to eighth switching element modules 27A to 27H.

  The capacitor unit 38 formed by integrating the first input capacitor 22 included in the first converter 18 and the second input capacitor 23 included in the second converter 19 is connected to the switching element assembly unit 67 with the second heat sink 73. Since it is disposed above the switching element assembly unit 67 so as to be interposed therebetween, the compact arrangement of the first and second input capacitors 22 and 23 enables the power converter to be made compact, and the first In addition, heat transfer from the first to eighth switching element modules 27 </ b> A to 27 </ b> H to the second input capacitors 22 and 23 can be suppressed by the second heat sink 73.

  Moreover, since the capacitor unit 38 has a single ground terminal 120 that is common to the first and second input capacitors 22 and 23, not only can the capacitor unit 38 be made more compact. The wiring inductance can be reduced.

  Further, since the even number of first to eighth switching element modules 27A to 27H are mounted on the upper and lower surfaces of the first heat sink 40 in a substantially symmetrical arrangement, the cooling performance of the first to eighth switching element modules 27A to 27H. Can be optimized.

  Moreover, the first to eighth switching element modules 27A to 27H are mounted on the first heat sink 40 with the same orientation of the connection terminals, and constitute a part of the first and second converters 18 and 19 to form the first The first to fifth switching element modules 27A to 27E mounted on the heat sink 40 and a part of the first and second converters 18 and 19 are arranged on the second heat sink 73 and the first to first switching elements modules 27A to 27E are arranged. Since the three-phase transformer 26 and the two-phase transformer 33 directly connected to the fifth switching element modules 27A to 27E are connected by the bus bars 92, 93, 94, 100, and 101, the bus bars 92 to 94, 100, and 101 are shortened. As well as being easy to assemble.

  Incidentally, a plurality of stud bolts 63 having screw shaft portions 63a, 63a at both ends are implanted in the first heat sink 40 so as to protrude from both the upper and lower surfaces of the first heat sink 40. The cases 60... And the copper base plates 58 of the eighth switching element modules 27A to 27H are tightened with nuts 64 that are screwed into the screw shaft portions 63a of the stud bolts 63 selected from the stud bolts 63. Since the first to eighth switching element modules 27A to 27H are mounted on the upper and lower surfaces of the first heat sink 40, the first to eighth switching element modules are mounted on the upper and lower surfaces of the first heat sink 40. 27A to 27H can be easily mounted with few parts.

  The cooling water pump 80 for supplying cooling water to the first cooling water passage 43 in the first heat sink 40 and the second cooling water passage 76 in the second heat sink 73 includes the first and second cooling water passages 43, 76, since the cooling water from the cooling water pump 80 is distributed and supplied to the first and second heat sinks 40 and 73, the first to eighth switching element modules 27A to 27H and the first Optimum cooling performance can be obtained for cooling the inductor 24, the three-phase transformer 26, the second inductor 25, and the two-phase transformer 33.

  The first to eighth plus side switching elements 31A to 31H and the first to eighth minus side switching elements 32A to 32H constituting the first to eighth switching element modules 27A to 27H include a plurality of chips 47, 48, 49. , 50, 51, 52, and two of these chips 47, 48, 49, 50, 51, 52 are arranged in a direction along the flow direction 46 of the cooling water in the first cooling water passage 43. As shown in FIG. 8A, each of the first heat sinks 40 arranged in the first heat sink 40 is arranged along the flow direction 46. The chips 47, 49, 51; 48, 50, 52 are separated and arranged, and as shown in FIG. 7, the chips 47, 49, 51; A plurality of cooling fins 71A which are arranged offset in the direction perpendicular to the flow direction 46 every 2, 71A ... are provided.

  Thus, for each inlet of the cooling fins 71A, 71A... Separated for each of the chips 47, 49, 51; 48, 50, 52 arranged along the flow direction 46, a temperature running section as shown in FIG. By forming, it becomes possible to obtain high cooling efficiency in the first cooling water passage 43 as a whole.

  The first to eighth plus-side switching elements 31A to 31H and the first to eighth minus-side switching elements 32A to 32H constituting the first to eighth switching element modules 27A to 27H are the first cooling water passages. 43, the first to eighth plus-side switching elements 31A to 31H are arranged in the forward path portion 43a of the first cooling water passage 43 in this embodiment. The first to eighth minus side switching elements 32A to 32H are arranged at positions corresponding to the return path portion 433b of the first cooling water passage 43 while being arranged at corresponding positions. Cooling effect is improved by generating a temperature run-up section for each of the 8 plus side switching elements 31A to 31H and the 1st to 8th minus side switching elements 32A to 32H. It can be increased.

  Further, the first to eighth switching element modules 27A to 27H are formed of a synthetic resin for the first to eighth plus side switching elements 31A to 31H and the first to eighth minus side switching elements 32A to 32H constituting the first to eighth switching element modules 27A to 27H. 65... Are attached to the first heat sink 40 in a state of being enclosed in the first heat sink 40. The first to eighth switching element modules 27 </ b> A to 27 </ b> H are radiated from the covering layer 65 and cooled by the first heat sink 40. Can be cooled more effectively.

  In addition, the plurality of cooling fins 71A are integrally formed so that the position of the downstream cooling fin 71A can be reliably arranged at the center position between the upstream cooling fins 71A. The cooling effect reduction due to the displacement of the cooling fins 71A is eliminated, and the designed cooling effect can be obtained.

  Meanwhile, a DC link capacitor unit 21 having smoothing capacitors 36 is provided between the first and second converters 18 and 19 and the inverter 20, and the first converter 18, the second converter 19 and the inverter 20 are connected to each other. The plus side connection terminals 69... And the minus side connection terminals 70... Of the first to eighth switching element modules 27 </ b> A to 27 </ b> H provided are connected to the plus side connection terminals 139 and the minus side connection terminals 140. The positive side connection terminals 69..., 139... Are connected in common to the plus side external bus bar 141, and the minus side connection terminals 70..., 140. To the outside of the DC link capacitor unit 21 Since the plus side and minus side external bus bars 141 and 142 are stacked with the insulating member 143 interposed therebetween to be integrated as the external bus bar unit 136, the internal bus of the DC link capacitor unit 21 is passed through. It is possible to prevent the generation of heat in the internal wiring of the DC link capacitor unit 21 by reducing the current and causing a thermal adverse effect on the smoothing capacitors 36.

  Further, since the external bus bar unit 136 is directly brought into contact with the first heat sink 40, the heat generated in the external bus bar unit 136 is directly transmitted to the first heat sink 40 side so that the vicinity of the DC link capacitor unit 21 is reached. Temperature rise can be suppressed.

  A second embodiment of the present invention will be described with reference to FIGS. 23 to 27, but the portions corresponding to the first embodiment are only given the same reference numerals and are not illustrated in detail.

  The six chips 47, 48, 49, 50, 51, 52 constituting the first to eighth plus side switching elements 31A to 31H and the first to eighth minus side switching elements 32A to 32H, respectively, are shown in FIGS. 24, the chips 47 and 48, the chips 49 and 50, and the chips 51 and 52 are arranged two by two in the direction along the flow direction 46 of the cooling water in the first cooling water passage 43. It arrange | positions so that it may rank with the said distribution direction 46. FIG.

  In the first cooling water passage 43 of the first heat sink 40, a plurality of coolings integrally formed with a light metal such as an aluminum alloy as a U-shaped or V-shaped waveform having a continuous cross section perpendicular to the flow direction 46. The fins 71B, 71B,... Are arranged so as to extend in the flow direction 46 while dividing the inside of the first cooling water passage 43 into a plurality in the width direction.

  Moreover, in the second to fifth plus side switching elements 31B to 31E and the second to fifth minus side switching elements 32B to 32E in the second to fifth switching element modules 27B to 27E on the upper surface side of the first heat sink 40, FIG. 23, the chips 47, 50, 51 are arranged upstream in the flow direction with respect to the chips 48, 49, 52, but the relative positions of the chips 47 to 52 in the direction along the flow direction 46 are Second to fifth plus side switching elements 31B to 31E (that is, a portion corresponding to the forward path portion 43a in the cooling water passage 43) and second to fifth minus side switching elements 32B to 32E (that is, a return path portion in the cooling water passage 43). The portion corresponding to 43b).

On the other hand, in the first and sixth to eighth switching element modules 27A and 27F to 27H on the lower surface side of the first heat sink 40, the first and sixth to eighth plus side switching elements 31A, 31F to 31H and the first and first In the sixth to eighth minus side switching elements 32A, 32F to 32H, as shown in FIG. 24, the chips 48, 49, 52 are arranged on the upstream side in the distribution direction with respect to the chips 47, 50, 51. 47-52 in the direction along the flow direction 46, the first and sixth to eighth plus side switching elements 31A, 31F to 31H (that is, the portion corresponding to the forward path portion 43a in the cooling water passage 43), the first and sixth to eighth negative side switching element 32A, 32F~32 H (i.e. backward portion in the cooling water passage 43 It is different than parts) and corresponding to 3b.

  That is, on the upper surface side of the first heat sink 40, the position along the flow direction 46 of each chip 47 to 52 is different between the portion corresponding to the forward path portion 43a of the cooling water passage 43 and the portion corresponding to the return path portion 43b. On the lower surface side of the heat sink 40, the position of the cooling water passage 43 corresponding to the forward path portion 43 a and the portion corresponding to the return path portion 43 b are different in positions along the flow direction 46 of the chips 47 to 52, and the first heat sink 40. The positions along the flow direction 46 of the chips 47 to 52 are different between the upper surface side and the lower surface side.

Therefore, as shown in FIG. 25, partition walls 149 and 150 that divide the forward path portion 43a and the return path portion 43b of the cooling water passage 43 into upper and lower portions are provided in the first heat sink 40, respectively. In the upper part of the partition walls 149 and 150, as shown in FIGS. 26 and 27A, the chips 47 to 52 in the second to fifth switching element modules 27B to 27E on the upper surface side of the first heat sink 40 are provided. The cooling fins 71B, 71B... Having individually corresponding lengths are separated for each of the chips 47, 50 , 51; 48, 49 , 52 arranged along the flow direction 46, and arranged along the flow direction 46. The chips 47, 50 , 51; 48, 49 , 52 are arranged offset in the direction orthogonal to the flow direction 46.

In addition, as shown in FIG. 27A, the first and sixth to eighth switching element modules 27 </ b> A and 27 </ b> F on the lower surface side of the first heat sink 40 are also provided below the partition walls 149 and 150 in the cooling water passage 43. The cooling fins 71B, 71B,... Having lengths individually corresponding to the chips 47 to 52 in .about.27H are separated for the chips 47, 50 , 51; 48, 49 , 52 arranged along the flow direction 46. The chips 47, 50 , 51; 48, 49 , 52 arranged along the flow direction 46 are arranged offset in the direction perpendicular to the flow direction 46.

  According to the second embodiment as well, it is possible to form a temperature run-up section as shown in FIG. 27B and obtain high cooling efficiency in the entire first cooling water passage 43.

  As still another embodiment of the present invention, a plurality of cooling fins having different pitches may be integrally formed.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various design changes can be made without departing from the present invention described in the claims. Is possible.

27A, 27B, 27C, 27D, 27E, 27F, 27G, 27H... Switching element modules 31A, 31B, 31C, 31D, 31E, 31F, 31G, 31H,. Side switching elements 32A, 32B, 32C, 32D, 32E, 32F, 32G, 32H... Negative side switching elements 40, which are semiconductor elements, ... Heat sink 43 ... Cooling water passage 46 ... Flow direction 47, 48 , 49, 50, 51, 52... Chip 65... Coating layers 71A, 71B.

Claims (3)

A plurality of chips (47, 49, 51; 48, 50, 52) arranged in the flow direction (46) in the cooling water passage (43) are arranged on the water cooling type heat sink (40) having the cooling water passage (43). semiconductor element module having (27A, 27B, 27C, 27D , 27E, 27F, 27G, 27H) is mounted, a cooling apparatus for a semiconductor element module,
In the cooling water passage (43), the chips (47, 49, 51; 48, 50, 52) are separated along the flow direction (46) in a direction perpendicular to the flow direction (46). A plurality of offset cooling fins (71A, 71B) are arranged so as to extend in the flow direction (46), and the semiconductor element modules (27A to 27H) are arranged in the flow direction of the cooling water passage (43) ( 46) a pair of semiconductor elements (31A, 31B, 31C, 31D, 31E, 31F, 31G, 31H; 32A, 32B, 32C, 32D, 32E, 32F, 32G, 32H) disposed at positions separated from each other. In what we have,
The plurality of semiconductor element modules (27A to 27H) are arranged such that the semiconductor element modules (27A, 27F, 27G, 27H) having a high calorific value among the semiconductor element modules are arranged on the lower surface side of the heat sink (40). Te, characterized in that it is mounted is divided into upper and lower surfaces of the heat sink (40), the cooling equipment of the semiconductor element module. The semiconductor element modules (27A to 27H) are mounted on the heat sink (40) in a state where a plurality of semiconductor elements (31A to 31H, 32A to 32H) are enclosed in a covering layer (65) made of a synthetic resin. The cooling device for a semiconductor element module according to claim 1 . The individual cooling fins (71A, 71B) are integrally formed into a continuous waveform in which U-shaped or V-shaped valleys and peaks are alternately arranged as viewed in a cross section perpendicular to the flow direction (46). It is the characterized in that the cooling apparatus for a semiconductor element module according to claim 1 or 2.

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