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JP5065780B2 - RFID tag mounting board - Google Patents

RFID tag mounting board Download PDF

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Publication number
JP5065780B2
JP5065780B2 JP2007174711A JP2007174711A JP5065780B2 JP 5065780 B2 JP5065780 B2 JP 5065780B2 JP 2007174711 A JP2007174711 A JP 2007174711A JP 2007174711 A JP2007174711 A JP 2007174711A JP 5065780 B2 JP5065780 B2 JP 5065780B2
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Japan
Prior art keywords
antenna
chip
rfid tag
printed circuit
circuit board
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Expired - Fee Related
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JP2007174711A
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JP2009015475A (en
Inventor
坂間功
芦沢実
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Hitachi Ltd
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Hitachi Ltd
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Priority to JP2007174711A priority Critical patent/JP5065780B2/en
Priority to EP08003309A priority patent/EP2012259A3/en
Priority to US12/039,422 priority patent/US8049626B2/en
Priority to TW097108863A priority patent/TW200919329A/en
Priority to KR1020080028467A priority patent/KR101116207B1/en
Priority to CN2008100903050A priority patent/CN101339626B/en
Publication of JP2009015475A publication Critical patent/JP2009015475A/en
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Publication of JP5065780B2 publication Critical patent/JP5065780B2/en
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G06K19/0726—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs the arrangement including a circuit for tuning the resonance frequency of an antenna on the record carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Details Of Aerials (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Credit Cards Or The Like (AREA)
  • Structure Of Printed Boards (AREA)

Description

本発明は、電子部品装置に関するものである。その中でも特に、電子部品を実装するプリント基板やこれに実装される部品の管理をＲＦＩＤ(Radio Frequency IDentification)タグを用いて行う技術に関する。さらにその中でも特に、部品の管理を行うＲＦＩＤタグをプリント基板上に形成するための技術に関する。   The present invention relates to an electronic component device. In particular, the present invention relates to a technique for managing a printed circuit board on which electronic components are mounted and components mounted thereon using RFID (Radio Frequency IDentification) tags. In particular, the present invention relates to a technique for forming an RFID tag for managing components on a printed board.

従来、プリント基板上の電子部晶の履歴管理を、ＲＦＩＤタグを利用して行うものとして、特許文献１がある。本特許文献１では、プリント基板内にアンテナとＩＣチップを有するＲＦＩＤタグを実装して、電子部晶の履歴管理を行うことが開示されている。より具体的には、少なくとも１層の導体層を形成し、内部または表面にＲＦＩＤタグを装着したプリント基板において、装着されたＲＦＩＤタグの上下面には、導体層による配線パターンが設けられていない構成としている。別方式として、少なくとも１層の導体層を形成し、ＲＦＩＤタグを装着したプリント基板において、導体層による配線パターンの設けられていないプリント基板箇所にＲＦＩＤタグと同等の縦横寸法の貫通穴が設けられ、貫通穴にＲＦＩＤタグが嵌め込まれた構造としている。   Conventionally, Patent Document 1 discloses that history management of electronic part crystals on a printed circuit board is performed using an RFID tag. In this patent document 1, it is disclosed that an RFID tag having an antenna and an IC chip is mounted in a printed circuit board to manage the history of electronic part crystals. More specifically, in a printed circuit board in which at least one conductor layer is formed and an RFID tag is mounted inside or on the surface, a wiring pattern of the conductor layer is not provided on the upper and lower surfaces of the mounted RFID tag. It is configured. As another method, in a printed board on which at least one conductor layer is formed and an RFID tag is mounted, through holes having vertical and horizontal dimensions equivalent to those of the RFID tag are provided in a printed board portion where no wiring pattern is provided by the conductor layer. The RFID tag is fitted in the through hole.

また、特許文献２には、プリント基板面、またはプリント基板内の金属層にＲＦＩＤタグのアンテナを形成していることが開示されている。ＲＦＩＤタグは、電子パッケージに含まれる半導体回路を含み、ＰＣＢはＰＣＢ内あるいはＰＣＢ上のどちらかにタグのＲＦアンテナ部分が形成されている。電子パッケージはＰＣＢのパッドを通してアンテナに接続することが開示されている。   Patent Document 2 discloses that an RFID tag antenna is formed on a printed circuit board surface or a metal layer in the printed circuit board. An RFID tag includes a semiconductor circuit included in an electronic package, and an RF antenna portion of the tag is formed on the PCB either on the PCB or on the PCB. The electronic package is disclosed to connect to the antenna through a pad on the PCB.

特開２００７−６６９８９号公報JP 2007-66989 A 特表平１１−５１５０９４号公報Japanese National Patent Publication No. 11-515094

特許文献１は、一般的なＩＣタグ、即ちアンテナにＩＣチップを実装したものをプリント基板に貼り付けた形態となっている。このため、特許文献１では、プリント基板上のアンテナが配置された領域にはプリント配線を施すことができない。   Patent Document 1 has a general IC tag, that is, an antenna in which an IC chip is mounted on a printed circuit board. For this reason, in patent document 1, printed wiring cannot be performed to the area | region where the antenna on a printed circuit board is arrange | positioned.

また、特許文献２は、プリント基板上にアンテナを形成し、ＩＣチップを実装しているものである。このため、多層基板を使用し各層を利用してアンテナを形成（特許文献２：図２参照）しているが、これを実現するにはＩＣチップと比較してより大きな面積が必要になる。つまり、特許文献１、２では、プリント基板上にアンテナが存在するため、プリント基板の部品実装密度が低下する問題がある。   In Patent Document 2, an antenna is formed on a printed board and an IC chip is mounted. For this reason, an antenna is formed using a multilayer substrate using each layer (see Patent Document 2: FIG. 2), but in order to realize this, a larger area is required as compared with an IC chip. In other words, in Patent Documents 1 and 2, since an antenna exists on the printed board, there is a problem that the component mounting density of the printed board decreases.

さらに、ＲＦＩＤタグの周辺のプリントパターン配置により、アンテナとプリントパターン（配線パターン）間の容量変化により、アンテナの同調周波数が変化し、ＲＦＩＤタグの通信距離が変動してしまう恐れもある。したがって、ＩＣチップとアンテナとのインピーダンスマッチングを含めたアンテナ設計、更に周辺パターンを考慮したアンテナ設計が必要となり、プリント基板ごとの設計が必要となり，設計工数の増大となる。   Furthermore, due to the layout of the printed pattern around the RFID tag, the tuning frequency of the antenna may change due to a change in capacitance between the antenna and the printed pattern (wiring pattern), and the communication distance of the RFID tag may vary. Therefore, the antenna design including impedance matching between the IC chip and the antenna and the antenna design considering the peripheral pattern are required, and the design for each printed circuit board is required, which increases the design man-hours.

次の課題としては、連続的に多数の電子基板を製造する場合、即ち複数の電子基板を１単位として生産管理するとき、その途中で実装部品のロット交換が発生した場合がある。ここでは生産の１単位を１バッチと称することとする。従来のバーコードなどでは同一バッチ内で部品Ａが欠品し、部品Ａのリール交換が発生した場合，管理情報として「バッチ内で部品Ａの部品リールが交換された」、と言う情報は管理されるが、バッチ内のどのプリント基板から部品Ａのリールが変わったかが判定できない。即ち、使用部品Ａのロット管理ができないこととなる。また、バーコードよりも個別管理し易いＲＦＩＣチップを実装した場合でも、通常ＲＦＩＣチップがリフロー工程後、すなわちプリント基板にＲＦＩＣチップが半田づけされるまで、ＩＤを読取ることができる為、バーコードと同様に同一バッチ内での部品Ａのリール交換（ロット交換）のタイミングを判定することができない。   As a next problem, when a large number of electronic boards are manufactured continuously, that is, when production management is performed with a plurality of electronic boards as one unit, there is a case where a lot of mounted parts is changed during the process. Here, one unit of production is referred to as one batch. In the case of a conventional barcode, etc., when the part A is missing in the same batch and the reel replacement of the part A occurs, the management information “the part reel of the part A has been replaced in the batch” is managed. However, it cannot be determined from which printed circuit board in the batch the reel of the component A has changed. That is, the lot management of the used part A cannot be performed. Even when an RFIC chip that is easier to manage individually than a barcode is mounted, the ID can be read after the RFIC chip is normally reflowed, that is, until the RFIC chip is soldered to the printed circuit board. Similarly, the timing of reel replacement (lot replacement) of part A within the same batch cannot be determined.

予めプリント基板にＩＣタグが取付けた場合、部品実装工程の前（チップマウンタに入る前）にＲＦＩＣのＩＤを読取れれば部品リールの交換履歴をプリント基板ごとに管理できるが、リーダアンテナ設置位置をプリント基板の大きさやＲＦＩＤタグの取付け位置により調整する必要がある。また、ＲＦＩＤタグを貼り付けた場合、半田ペーストのシルク工程でタグ厚さによるシルク不良が発生したりする。また、プリント基板内にＲＦＩＤタグを埋めこんだ場合、コストと埋めこみ工程の歩留まりが課題となる。   If the IC tag is attached to the printed circuit board in advance, the component reel replacement history can be managed for each printed circuit board if the RFIC ID can be read before the component mounting process (before entering the chip mounter). It is necessary to adjust according to the size of the printed circuit board and the mounting position of the RFID tag. In addition, when an RFID tag is attached, a silk defect may occur due to the tag thickness during the solder paste silk process. Further, when an RFID tag is embedded in a printed circuit board, the cost and the yield of the embedding process become problems.

本発明は、上記問題点に鑑みてなされたものであって、その種たる目的は電子基板上にＲＦＩＣを効率良く実装する方法を提供することにある。本発明の他の目的は電子基板上に実装されている各部品の履歴を管理することにある。   The present invention has been made in view of the above problems, and its object is to provide a method for efficiently mounting an RFIC on an electronic substrate. Another object of the present invention is to manage the history of each component mounted on an electronic board.

前記した課題を解決するため、本発明のプリント基板上へのＲＦＩＣチップの実装方法は、前記プリント基板外から電磁波を送受することによってＲＦＩＣチップの固有情報を読取り可能なＲＦＩＣチップでの実装方法であって、プリント基板上にＲＦＩＣチップと、アンテナと、ＲＦＩＣチップとアンテナ間のインピーダンスマッチング回路と、を具備したことを特徴とする。   In order to solve the above-mentioned problems, the mounting method of the RFIC chip on the printed circuit board according to the present invention is a mounting method using an RFIC chip capable of reading the unique information of the RFIC chip by transmitting and receiving electromagnetic waves from the outside of the printed circuit board. The printed circuit board includes an RFIC chip, an antenna, and an impedance matching circuit between the RFIC chip and the antenna.

また、本発明のプリント基板上における各実装部品の履歴管理方法は、前記プリント基板にＲＦＩＣチップを実装する前にチップマウンタでＲＦＩＣチップの情報を読取り、これに前記プリント基板上に実装された各部品の情報をリンクする管理方法であって、ＲＦＩＣチップを実装するチップマウンタにＲＦＩＣチップの読取り装置と、ＲＦＩＣチップとアンテナを接続する接続パッドを有するアンテナと、を具備することを特徴とする。ここで、管理対象の実装部品は基板上の全てのものとしてもよい。   Further, according to the history management method of each mounted component on the printed board of the present invention, the information of the RFIC chip is read by the chip mounter before mounting the RFIC chip on the printed board, and each mounted on the printed board is read by this. A management method for linking component information, wherein a chip mounter on which an RFIC chip is mounted includes an RFIC chip reader and an antenna having a connection pad for connecting the RFIC chip and the antenna. Here, the mounted components to be managed may be all on the board.

これらの具体的手段については、後記する実施形態を通じて、詳細に説明するものとする。   These specific means will be described in detail through an embodiment described later.

本発明によれば、プリント基板にＲＦＩＤタグを実装してもプリント基板に対する部品実装密度の低下を最小限に抑えることが可能となる。また、プリント基板に実装されている各部品の履歴管理することができる。   According to the present invention, even if an RFID tag is mounted on a printed circuit board, it is possible to minimize a decrease in component mounting density on the printed circuit board. In addition, the history of each component mounted on the printed circuit board can be managed.

以下、図面を参照しながら、本発明に係わるＲＦＩＤ実装基板及び基盤に実装された電子部品の履歴管理に好適な実施形態をあげて詳細に説明する。尚、以下に説明する各実施形態に用いる図面では、同一構成要素は同一符号を付すことし、重複する説明を省略することがある。   Hereinafter, an embodiment suitable for history management of an electronic component mounted on an RFID mounting board and a substrate according to the present invention will be described in detail with reference to the drawings. In the drawings used for each embodiment described below, the same constituent elements are denoted by the same reference numerals, and redundant description may be omitted.

（第１の実施形態）
以下、本発明の実施の形態について、説明をする。図１は従来技術の構成を示す図である。従来では、図示したように、例えば、１／２λ長のダイポールアンテナがプリント基板表面上に配置されている。小型のプリント基板であればＲＦＩＤタグが使用するアンテナが占有する面積が高くなり、プリント基板の部品実装密度が低下する。図２は、これに対する本発明の構成を示す図である。（a）にはプリント基板５にＩＣチップ１とＩＣチップ１とスルーホール３とを接続するプリントパターン２ａ、２ｂが配置された上面図を示す。（ｂ）には（ａ）におけるＡ−Ａ’断面図を示す。また、（ｃ）には、ＩＣチップ１に接続される外部アンテナを、（ｄ）にはその外部アンテナがＩＣチップ１に接続された状態を示す。 (First embodiment)
Hereinafter, embodiments of the present invention will be described. FIG. 1 is a diagram showing the configuration of the prior art. Conventionally, as shown in the figure, for example, a 1 / 2λ-long dipole antenna is disposed on the surface of a printed circuit board. If the printed circuit board is small, the area occupied by the antenna used by the RFID tag increases, and the component mounting density of the printed circuit board decreases. FIG. 2 is a diagram showing the configuration of the present invention for this. FIG. 4A is a top view in which the printed circuit board 5 is provided with printed patterns 2a and 2b for connecting the IC chip 1, the IC chip 1 and the through hole 3 to each other. (B) shows an AA ′ cross-sectional view in (a). (C) shows an external antenna connected to the IC chip 1, and (d) shows a state where the external antenna is connected to the IC chip 1.

図２（ｂ）に示したようにプリント基板５上にプリントパターン２ａ、２ｂを形成し、プリント基板５の厚さ方向にスルーホール３を設ける。スルーホール３を介しプリント基板５の裏面側のプリントパターン２ｃと接続されている。つまり、このスルーホール３を利用してインピーダンスマッチング回路用のスタブを形成している。さらに、この構造ではＩＣチップ１のインピーダンスマッチングと同時に、ＩＣチップ１の両端子が直流的に接続されていることから、ＩＣチップ１の静破壊耐性を向上させる効果が得られる。   As shown in FIG. 2B, the print patterns 2 a and 2 b are formed on the printed board 5, and the through holes 3 are provided in the thickness direction of the printed board 5. It is connected to the printed pattern 2 c on the back side of the printed circuit board 5 through the through hole 3. That is, a stub for an impedance matching circuit is formed using this through hole 3. Further, in this structure, since both terminals of the IC chip 1 are connected in a DC manner simultaneously with impedance matching of the IC chip 1, an effect of improving the static breakdown resistance of the IC chip 1 can be obtained.

図２（ｃ）はＩＣチップ１に接続する外部アンテナ４０を示す。外部アンテナ４０はＰＣ（ポリカーボネート）、ＰＰ（ポリプロピレン）、ＰＥＴ（ポリエチレンテレフタレート）などの樹脂基材を構造材に、電波放射部４１と導波線路４２から成るアンテナ部と、ＩＣチップ１と接続する接続部４３から構成されている。ＩＣチップ１と接続部４３との接続はＩＣチップ１のピン９０ａ、９０ｂに直接接触させるか、ＩＣチップ１と接続されているプリントパターン２ａ、２ｂに接触させれば良い。   FIG. 2C shows the external antenna 40 connected to the IC chip 1. The external antenna 40 is connected to the IC chip 1 and the antenna part composed of the radio wave radiation part 41 and the waveguide line 42 by using a resin base material such as PC (polycarbonate), PP (polypropylene), PET (polyethylene terephthalate) as a structural material. The connection part 43 is comprised. The connection between the IC chip 1 and the connection portion 43 may be made by directly contacting the pins 90 a and 90 b of the IC chip 1 or by contacting the printed patterns 2 a and 2 b connected to the IC chip 1.

外部アンテナ４０内の導波線路４１はケーブルセミリジッドケーブルなどの同軸ケーブルなどに置換えることができる。   The waveguide line 41 in the external antenna 40 can be replaced with a coaxial cable such as a cable semi-rigid cable.

図３は、プリント基板５に実装されたＩＣチップ１の情報を読み取る場合の各装置配置を示したものである。プリント基板５と、外部アンテナ４０と、リーダ装置３７とリーダ装置からの電磁エネルギーを送出するリーダアンテナ３８から構成されている。リーダアンテナ３８はパッチアンテナやダイポールアンテナなどの汎用アンテナが使用できる。ここではリーダを制御するコンピュータなどは図示していない。リーダアンテナ３８から送出された電磁エネルギーは外部アンテナ４０により受信され、導波線路４１を介し、ＩＣチップ１の端子に電磁エネルギーを伝達する。ＩＣチップ１からの情報は先と逆に、外部アンテナ４０を介し、リーダアンテナ３８に向け送出される。   FIG. 3 shows the arrangement of each device when reading information of the IC chip 1 mounted on the printed circuit board 5. The printed circuit board 5, an external antenna 40, a reader device 37, and a reader antenna 38 that sends out electromagnetic energy from the reader device. The reader antenna 38 can be a general-purpose antenna such as a patch antenna or a dipole antenna. Here, a computer for controlling the reader is not shown. The electromagnetic energy transmitted from the reader antenna 38 is received by the external antenna 40 and is transmitted to the terminals of the IC chip 1 through the waveguide line 41. On the contrary, the information from the IC chip 1 is sent to the reader antenna 38 via the external antenna 40.

このようにして、プリント基板５上に実装されたＩＣチップ１の情報は外部アンテナ４０を介し送出することにより、汎用的なリーダ装置により容易にその情報を読み取ることができる。したがって、プリント基板５の部品実装密度の低下を最小限に抑え、かつ、汎用的なリーダ装置が使用でき、装置コストの増加を抑えることが可能となる。   In this way, the information of the IC chip 1 mounted on the printed circuit board 5 is sent through the external antenna 40, so that the information can be easily read by a general-purpose reader device. Therefore, it is possible to minimize a decrease in the component mounting density of the printed circuit board 5 and use a general-purpose reader device, thereby suppressing an increase in device cost.

次に、図４を用いプリントパターン２ｃの形状について説明する。ＩＣチップ１のピン９０ａ、９０ｂはプリントパターン２ａ、２ｂに接続されている。プリントパターン２ａ、２ｂ上のスルーホール３はプリント基板５のＩＣチップ１実装面の裏面に形成されたプリントパターン２ｃを接続する。このプリントパターン２ａ、２ｂ、２ｃはＩＣチップ１と外部アンテナ４０が接続したときの相互のインピーダンス整合を行うスタブを形成する。図４（ａ）は基本形状である。図４（ｂ）はプリントパターン２ｄをメアンダ形状とし、基本形状に比べ占有面積を変えずにスタブのインダクタンス容量を大きくする形状である。   Next, the shape of the print pattern 2c will be described with reference to FIG. The pins 90a and 90b of the IC chip 1 are connected to the print patterns 2a and 2b. The through holes 3 on the printed patterns 2a and 2b connect the printed pattern 2c formed on the back surface of the printed circuit board 5 where the IC chip 1 is mounted. The printed patterns 2a, 2b, and 2c form stubs that perform mutual impedance matching when the IC chip 1 and the external antenna 40 are connected. FIG. 4A shows a basic shape. FIG. 4B shows a shape in which the printed pattern 2d has a meander shape, and the inductance capacity of the stub is increased without changing the occupied area compared to the basic shape.

ここで形成するスタブはＩＣチップ１と外部アンテナ４０とのインピーダンス整合を行うものである。外部アンテナ４０の電波放射部４１と導波線路４２の長さを調整することによって接続部４３のインピーダンスを変化させることができる。したがって、プリント基板５に形成するスタブは最小形状とすることが、課題であるプリント基板の部品実装密度の低下を最小に抑える効果的な方法である。プリント基板５上にスタブを形成しＩＣチップ１に接続することにより静電気によるＩＣチップの破壊を防止する効果があり、本構造を用いることにより、ＩＣチップ１を長期間に亘り安定した状態で使用することができる。   The stub formed here performs impedance matching between the IC chip 1 and the external antenna 40. The impedance of the connection portion 43 can be changed by adjusting the lengths of the radio wave radiation portion 41 and the waveguide line 42 of the external antenna 40. Therefore, the stub formed on the printed circuit board 5 is an effective method of minimizing the reduction in the component mounting density of the printed circuit board, which is a problem, to have a minimum shape. By forming a stub on the printed circuit board 5 and connecting it to the IC chip 1, there is an effect of preventing the destruction of the IC chip due to static electricity. By using this structure, the IC chip 1 can be used in a stable state for a long period of time. can do.

本実施の形態のＲＦＩＤタグでは電波を送受信するアンテナがプリント基板５から離れた位置に配置されことになる。これにより、従来構造のようにプリント基板の配線とアンテナパターンが同一平面に形成される場合に比べ、ＲＦＩＤタグ形成領域と他の配線パターンの距離が近くても影響が受けにくい。これゆえ、さらに効率よくプリント基板５上にＩＣチップ１を実装することができる。   In the RFID tag of the present embodiment, an antenna for transmitting and receiving radio waves is arranged at a position away from the printed board 5. Thereby, compared with the case where the wiring of the printed circuit board and the antenna pattern are formed on the same plane as in the conventional structure, even if the distance between the RFID tag forming region and the other wiring pattern is close, it is less affected. Therefore, the IC chip 1 can be mounted on the printed circuit board 5 more efficiently.

次に、図５を用いてＲＦＩＤタグの占有面積について説明する。周辺パターン９ａ、９ｂはスタブを形成しているプリントパターン２ａ、２ｂとのスペース幅は０.５ｍｍ程度まで接近させることができる。また、周辺パターンからの影響が少ないため、プリント基板作成用ＣＡＤシステムのライブラリーに登録しておくことにより、新規プリント基板を設計する場合、このスタブパターンを任意に配置することにより容易にＲＦＩＤタグを実装することができる。   Next, the occupation area of the RFID tag will be described with reference to FIG. The space width between the peripheral patterns 9a and 9b and the print patterns 2a and 2b forming the stubs can be made close to about 0.5 mm. In addition, since there is little influence from the peripheral pattern, the RFID tag can be easily arranged by arbitrarily arranging this stub pattern when designing a new printed board by registering it in the library of the CAD system for creating the printed board. Can be implemented.

（第２の実施形態）
第１の実施形態では外部アンテナ４０は平衡型のアンテナ、たとえば、ダイポールアンテナを使用した。第２の実施形態では不平衡型のアンテナである、モノポール型アンテナを使用した外部アンテナ５０を使用した実施形態を示す。 (Second Embodiment)
In the first embodiment, the external antenna 40 is a balanced antenna, for example, a dipole antenna. The second embodiment shows an embodiment using an external antenna 50 using a monopole antenna, which is an unbalanced antenna.

図６は、プリント基板５に形成するスタブの形状を示す。ＩＣチップ１の実装面のプリントパターン２ａ、２ｂは実施形態１と同様である。裏面側のパターンをプリントパターン２ｅのような形状とする。これはプリントパターン２ｃの一端を自パターンよりも面積の大きいパターンに接続した形態とする。具体的には、多くのプリント基板の場合、プリント基板の裏面はグランド（接地電位）パターンが敷設されており大きな面性のパターンが多数存在する場合が多い。こんのグランドパターンにプリントパターン２ｃに対応するパターンを接続する。   FIG. 6 shows the shape of the stub formed on the printed circuit board 5. The printed patterns 2a and 2b on the mounting surface of the IC chip 1 are the same as those in the first embodiment. The back side pattern is shaped like the print pattern 2e. In this configuration, one end of the print pattern 2c is connected to a pattern having a larger area than the self pattern. Specifically, in the case of many printed circuit boards, a ground (ground potential) pattern is laid on the back surface of the printed circuit board, and there are many large surface patterns in many cases. A pattern corresponding to the print pattern 2c is connected to this ground pattern.

他の形態としては図７に示すように、ＩＣチップ１が実装されている面、すなわちプリント基板５の表側にあるプリントパターン２ａ、２ｂに対し、プリントパターン２ａ、２ｂよりも面積や長さが大きいパターンに接続する。図７ではＩＣチップ１がプリントパターン２ｆに接続されている形態を示している。接続するパターンは使用する周波数の１/４λ長以上の配線パターンに接続することにより、ＩＣチップ１を効率良く動作させることができる。ＩＣチップ１とスタブ部が配線ラインに接続され、その配線の動作に影響がない配線ラインを選択する必要がある。直流動作をしている電源ラインを使用すると容易に効果を得ることができる。この構造にし、十分な面積の接続パターンが得られる場合、外部アンテナを使用せずにＩＣチップ１に記録されている情報を読み出すことができ、利便性が向上する利点がある。   As another form, as shown in FIG. 7, the area and length of the surface on which the IC chip 1 is mounted, that is, the printed patterns 2a and 2b on the front side of the printed circuit board 5, are larger than the printed patterns 2a and 2b. Connect to a large pattern. FIG. 7 shows a form in which the IC chip 1 is connected to the print pattern 2f. The IC chip 1 can be efficiently operated by connecting the pattern to be connected to a wiring pattern having a length of ¼λ or more of the frequency to be used. The IC chip 1 and the stub portion are connected to the wiring line, and it is necessary to select a wiring line that does not affect the operation of the wiring. The effect can be easily obtained by using a power supply line operating in direct current. When this structure is used and a connection pattern with a sufficient area can be obtained, information recorded on the IC chip 1 can be read without using an external antenna, and there is an advantage that convenience is improved.

次に、モノポール型の外部アンテナ５０について図８を用いて説明する。図８（ａ）は外部アンテナ５０の構成を示す図である。外部アンテナ５０はＰＣ（ポリカーボネート）、ＰＰ（ポリプロピレン）、ＰＥＴ（ポリエチレンテレフタレート）などの樹脂基材を構造材にした外装部５３と、アンテナ部５１と、ＩＣチップ１と接続する接続部５２から構成されている。ＩＣチップ１と接続部５２との接続はＩＣチップ１のピン９０ａ、９０ｂに直接接触させるか、ＩＣチップ１と接続されているプリントパターン２ａ、２ｂに接触させれば良い。外部アンテナ５０をモノポール型にすることにより、ペン型の外部アンテナ５０を使用することができ作業性が向上する利点がある。リーダ装置３７とリーダ装置用アンテナ３８は実施形態１と同様の形態で使用することができる。また、外部アンテナ５０内のアンテナ部５１の一部をケーブルセミリジッドケーブルなどの同軸ケーブルなどに置換えることができる。   Next, the monopole external antenna 50 will be described with reference to FIG. FIG. 8A shows the configuration of the external antenna 50. The external antenna 50 includes an exterior part 53 made of a resin base material such as PC (polycarbonate), PP (polypropylene), PET (polyethylene terephthalate), etc., an antenna part 51, and a connection part 52 connected to the IC chip 1. Has been. The connection between the IC chip 1 and the connecting portion 52 may be made by directly contacting the pins 90a and 90b of the IC chip 1 or by contacting the printed patterns 2a and 2b connected to the IC chip 1. By making the external antenna 50 a monopole type, there is an advantage that the pen type external antenna 50 can be used and workability is improved. The reader device 37 and the reader device antenna 38 can be used in the same manner as in the first embodiment. Further, a part of the antenna portion 51 in the external antenna 50 can be replaced with a coaxial cable such as a cable semi-rigid cable.

（第３の実施形態）
第１及び第２の実施形態ではＩＣチップ１の情報を読み出すとき、外部アンテナ４０，５０をＩＣチップ１に接続する形態で使用する。第３の実施形態では一定の期間ＩＣチップ１の情報を連続的に、または断続的に読取る必要がある場合の実施形態を説明する。この形態は、例えば、プリント基板の修理や検査で、各工程でプリント基板の情報を読取る必要が発生することを想定している。 (Third embodiment)
In the first and second embodiments, when reading information of the IC chip 1, the external antennas 40 and 50 are used in a form of being connected to the IC chip 1. In the third embodiment, an embodiment in which information of the IC chip 1 needs to be read continuously or intermittently for a certain period of time will be described. This form assumes that information on a printed circuit board needs to be read in each process, for example, in the repair or inspection of the printed circuit board.

図９に示すようなクリップ形状で、ＩＣチップ１を挟み込み、外部アンテナ４０ａを保持するような構造と成っている。詳細にはクリップを形成するＰＣ（ポリカーボネート）やＰＰ（ポリプロピレン）などの樹脂成型品の構造材４４ａ、アンテナ部４１ａ、導波線路部４２ａ、ＩＣチップ１との接続部４３ａで構成されている。接続部４３ａはりん青銅などのばね性のある金属を用い、接続部４３ａの電極がＩＣチップ１の電極に押し付けられるような構造にする。さらに接続部４３ａの表面に金メッキを施すとにより、電気的安定性が向上し、より使いやすさが向上する。   In the clip shape as shown in FIG. 9, the IC chip 1 is sandwiched and the external antenna 40a is held. Specifically, it is composed of a structural member 44a of a resin molded product such as PC (polycarbonate) or PP (polypropylene) forming a clip, an antenna portion 41a, a waveguide line portion 42a, and a connection portion 43a with the IC chip 1. The connecting portion 43a is made of a springy metal such as phosphor bronze and is structured such that the electrode of the connecting portion 43a is pressed against the electrode of the IC chip 1. Further, by applying gold plating to the surface of the connection portion 43a, the electrical stability is improved and the usability is further improved.

（第４の実施形態）
次に、プリント基板製造ラインでの課題とその解決方法について説明する。図１０（ａ）には従来方式の製造ラインの概略図を示す。主要な工程装置のみを図示し、他は省略している。部品が実装されていないプリント基板がローダ６１上のカセットにセットされている。カセットには複数枚のプリント基板がセットされている。通常この１カセット分を1バッチと称する。ローダ６１よりプリント基板が順じ各装置向けて搬送される。図示しない半田ペーストの印刷工程をへ、部品実装工程にプリント基板が進むと、チップマウンタ６２により必要な部品がプリント基板上に実装される。チップマウンタ６２にはリール上になった部品リール６０ａ〜６０ｅがセットされている。ここで、部品リール６０ｃがＲＦＩＤタグを形成するＩＣチップ１のリールとする。部品リール６０ｃのＩＣチップ１はチップマウンタ６２により他の部品と共にプリント基板上に実装される。次にリフロー工程でリフロー機６３により半田付けされ、部品が固定される。リフロー後、初めてＩＣチップ１に記録されている情報を読取ることができるようになる。通常、検査装置６４の検査工程や、案ローダ６５の直前でＩＣチップ１の情報を読取ることが多い。 (Fourth embodiment)
Next, the problem in the printed circuit board production line and its solution will be described. FIG. 10A shows a schematic diagram of a conventional production line. Only the main process equipment is shown and the others are omitted. A printed circuit board on which no component is mounted is set in a cassette on the loader 61. A plurality of printed circuit boards are set in the cassette. Usually, one cassette is called one batch. The printed circuit board is sequentially conveyed from the loader 61 toward each device. When the printed circuit board proceeds to the component mounting process through the solder paste printing process (not shown), the necessary components are mounted on the printed circuit board by the chip mounter 62. In the chip mounter 62, component reels 60a to 60e on the reel are set. Here, it is assumed that the component reel 60c is a reel of the IC chip 1 on which the RFID tag is formed. The IC chip 1 on the component reel 60c is mounted on the printed board together with other components by the chip mounter 62. Next, it is soldered by the reflow machine 63 in the reflow process, and the parts are fixed. After the reflow, the information recorded on the IC chip 1 can be read for the first time. Usually, the information of the IC chip 1 is often read immediately before the inspection process of the inspection device 64 or the plan loader 65.

従来方法での処理フローの課題は、ローダにセットした１バッチ単位で製品を管理している点にある。履歴管理している部品はプリント基板のロット番号、各部品リールのロット番号である。しかし、バッチ途中で部品リール６０ａの部品Ａが欠品した場合、部品リール６０ａを交換する。この交換により、同一バッチ内でも部品リール６０ａより実装された部品Ａのロット番号が異なる製品が作られることになる。全てのプリント基板に部品が実装されアンロードカセットに戻った時、どのプリント基板から部品リール６０ａが交換されたかが判別できない課題がある。各装置のバッチ制御によりプリント基板の管理をした場合でも、アンローダ６５より取り出し後にプリント基板の取り違いが発生することは皆無ではなく、課題は解決できない。なお、本実施形態では、全てのプリント基板、としたが例外があってもよい。   The problem of the processing flow in the conventional method is that the products are managed in units of one batch set in the loader. The components whose history is managed are the lot number of the printed circuit board and the lot number of each component reel. However, if the part A of the part reel 60a is missing during the batch, the part reel 60a is replaced. By this exchange, products with different lot numbers of the parts A mounted from the parts reel 60a are produced even in the same batch. When components are mounted on all printed boards and returned to the unload cassette, there is a problem that it is impossible to determine from which printed board the component reel 60a has been replaced. Even when the printed circuit boards are managed by batch control of each device, it is not impossible that the printed boards are mixed after being taken out from the unloader 65, and the problem cannot be solved. In the present embodiment, all printed circuit boards are used, but there may be exceptions.

図１０（ｂ）には本発明のプリント基板の管理方法を説明する。装置構成は図１０（ａ）で示した、従来方式と同構成である。大きな相違は、ＩＣチップ１の情報を読取るＩＤ読取り装置３９の配置位置である。本発明の方式ではＩＤ読取り装置３９はチップマウンタ６６内に配置している。
部品リール６０ｃのＩＣチップ１をプリント基板に実装する前に、チップマウンタ６６に配置されたＩＣ読取り装置３９により、ＩＣチップ１の情報を読取る。読取った情報は各部品の履歴情報と共に管理サーバなどに登録し管理する。 FIG. 10B illustrates a printed circuit board management method according to the present invention. The apparatus configuration is the same as that of the conventional system shown in FIG. The major difference is the arrangement position of the ID reader 39 that reads the information of the IC chip 1. In the system of the present invention, the ID reader 39 is arranged in the chip mounter 66.
Before the IC chip 1 of the component reel 60c is mounted on the printed circuit board, the information of the IC chip 1 is read by the IC reading device 39 arranged in the chip mounter 66. The read information is registered and managed in the management server together with the history information of each component.

このように、製造工程途中からＩＣチップ１に記録されている情報を利用し、プリント基板単位の管理を可能とすることによって、課題であるバッチ途中での部品リール交換が発生してもどのプリント基板であるかを容易に判別することができ、プリント基板上の各部品の履歴管理を確実に実施することが可能となる。   In this way, by using the information recorded on the IC chip 1 from the middle of the manufacturing process and enabling the management of the printed circuit board unit, it is possible to determine which print even if the component reel replacement during the batch, which is a problem, occurs. It is possible to easily determine whether it is a board, and it is possible to reliably manage the history of each component on the printed board.

また、ＩＣチップ１の情報を部品実装前に読取るため、ＩＣチップ１起因のプリント基板不良を排除することができるので、従来方式に比べ歩留まりの観点でも有利である。   In addition, since the information of the IC chip 1 is read before component mounting, printed circuit board defects caused by the IC chip 1 can be eliminated, which is advantageous in terms of yield as compared with the conventional method.

この本方式の効果は、部品Ａのリール交換後、部品Ａに不具合が発生した場合、従来方式では１バッチ分のプリント基板が回収対象となる。それに対し、本方式ではＩＣチップ１の情報を読み出すことにより、対象部品を実装したプリント基板のみを回収することが可能となり、効率良く不良品を選別することができ、費用的損害を最小に抑えることができる。   The effect of this method is that when a defect occurs in the component A after the reel replacement of the component A, in the conventional method, one batch of printed circuit boards is a collection target. On the other hand, in this method, by reading the information of the IC chip 1, it becomes possible to collect only the printed circuit board on which the target component is mounted, and it is possible to efficiently select defective products and minimize cost damage. be able to.

図１１を用いて、ＩＤ読取り装置３９を配置したチップマウンタ６６の動作を説明する。部品リール６０ｃよりＲＦＩＣチップ１が供給される。部品リール６０ｃからの部品は、吸着ステージ３１の保持され、チップ搬送機３０に取付けられた搬送アーム３２の先端にある吸着ノズル３３によりＩＣチップ１をピックアップする。ピックアップしたＩＣチップ１はＩＤ読取りアンテナ３４に作られた接着パッド３６にピン９０ａ、９０ｂを接触させ、ＩＤ読取りアンテナ３４に電気的に接続する。リーダ装置３７とリーダアンテナ３８からなるＩＤ読み取り装置３９によりＩＣチップ１の情報を読取る。ＩＣチップ１の読取りが成功すると、搬送アームによりＩＣチップ１を搬送しプリント基板５上の所定の位置に実装する。   The operation of the chip mounter 66 provided with the ID reader 39 will be described with reference to FIG. The RFIC chip 1 is supplied from the component reel 60c. The components from the component reel 60 c are picked up by the suction nozzle 33 at the tip of the transfer arm 32 held by the suction stage 31 and attached to the chip transfer machine 30. The picked-up IC chip 1 is electrically connected to the ID reading antenna 34 by bringing pins 90 a and 90 b into contact with the adhesive pads 36 formed on the ID reading antenna 34. Information of the IC chip 1 is read by an ID reading device 39 including a reader device 37 and a reader antenna 38. When the reading of the IC chip 1 is successful, the IC chip 1 is transported by the transport arm and mounted at a predetermined position on the printed circuit board 5.

ＩＤ読み取りアンテナ３４でのＩＣチップ１の保持の方法は、接触パッド３６の間に形成した真空吸着孔２９により真空吸着する。別方法としては吸着アームにＩＣチップ１を保持したまま、ＩＣ読み取りアンテナ３６に押し付ける形態で保持する方法がある。   As a method of holding the IC chip 1 with the ID reading antenna 34, vacuum suction is performed by the vacuum suction holes 29 formed between the contact pads 36. As another method, there is a method in which the IC chip 1 is held on the suction arm and is held in a form of being pressed against the IC reading antenna 36.

ＩＤ読み取り用アンテナ３４は図１２に示すような形状で、アンテナ部３４、インピーダンスマッチング用スタブ、接触パッド３６、真空吸着孔２９から構成されている。ＩＤ読み取り用アンテナ３４はセラミック材料やプリント基板材料であるＲＦ４基板などを用いて、基材表面に金属箔や金属蒸着により製作することができる。接触パット部３６には２０〜６０μｍ厚のＡｕメッキやＡｕ蒸着などを施すと電気的安定性が向上する。尚、アンテナ形状はダイポールアンテナとしたが、これに限定することなく、他の放射型アンテナでも良い。   The ID reading antenna 34 has a shape as shown in FIG. 12, and includes an antenna portion 34, an impedance matching stub, a contact pad 36, and a vacuum suction hole 29. The ID reading antenna 34 can be manufactured by metal foil or metal vapor deposition on the surface of a base material using a ceramic material, an RF4 substrate which is a printed board material, or the like. When the contact pad portion 36 is subjected to Au plating or Au deposition having a thickness of 20 to 60 μm, the electrical stability is improved. Although the antenna shape is a dipole antenna, the present invention is not limited to this, and another radiating antenna may be used.

（第５の実施形態）
図１３は、第４の実施形態をシステム化したプリント基板製造履歴システムの概念構成を示したものである。ローダ制御回路６１ａ、チップマウンタ制御回路６６ａ、リフロー炉制御回路６４ａ、アンローダ制御回路６５ａは通信ネットワーク７４を介して、製造履歴管理データを記録する製造履歴管理サーバ７３に接続され、リアルタイムでプリント基板に対する装置の処理条件、装置状態などの履歴を記録する構造となっている。 (Fifth embodiment)
FIG. 13 shows a conceptual configuration of a printed circuit board manufacturing history system obtained by systemizing the fourth embodiment. A loader control circuit 61a, a chip mounter control circuit 66a, a reflow furnace control circuit 64a, and an unloader control circuit 65a are connected to a manufacturing history management server 73 for recording manufacturing history management data via a communication network 74, and are connected to a printed circuit board in real time. It is structured to record a history such as device processing conditions and device status.

さらに詳細に説明すると、プリント基板製造工程より納入されたプリント基板にはロット単位にバーコードまたはＲＦＩＤタグが取付けられている。このプリント基板をローダ６１にセットする前に、前記バーコード又はＲＦＩＤタグをバーコードリーダ又はＲＦＩＤリーダ７２ａにより読取る。読取った情報はローダ制御回路を介してサーバに記録される。チップマウンタ６６にセットされる部品リール６０は装置にセットする前に、部品リールに取付けられたバーコード又はＲＦＩＤタグをバーコードリーダ又はＲＦＩＤリーダ７１により情報を読取り、チップマウンタ制御回路を介して製造履歴管理サーバ７３に記録される。   More specifically, barcodes or RFID tags are attached to the printed circuit boards delivered from the printed circuit board manufacturing process in lot units. Before setting the printed circuit board on the loader 61, the barcode or RFID tag is read by a barcode reader or RFID reader 72a. The read information is recorded in the server via the loader control circuit. Before the component reel 60 set on the chip mounter 66 is set in the apparatus, the barcode or RFID tag attached to the component reel is read by the barcode reader or RFID reader 71 and manufactured via the chip mounter control circuit. Recorded in the history management server 73.

図１３では製造工程のうち、一部の装置のみを記したが、記していない他の装置の処理条件、装置状態などを製造履歴管理サーバ７３にアップロードし、製造されたプリント基板情報とリンクさせることによりより詳細な履歴管理を行うことができる。   In FIG. 13, only a part of the manufacturing process is shown, but processing conditions, device states, etc. of other devices not shown are uploaded to the manufacturing history management server 73 and linked to the manufactured printed circuit board information. Thus, more detailed history management can be performed.

（第６の実施形態）
複数のプリント基板から構成される電気機器の履歴管理方法について図１５を用いて説明する。図１４では３枚のプリント基板５ａ、５ｂ、５ｃで構成されている場合について説明する。３枚のプリント基板から構成されている電気機器８４が完成すると、一般に製造番号が付与される。製造履歴管理サーバ７３では製品番号をヘッダーとしてプリント基板５ａ〜５ｃに実装された各ＩＣチップ１の情報を相互にリンクした構造で記録する。相互にリンクすることにより、構成基板のうちの１枚が欠品、または、ＲＦＩＤが動作しない場合でも、リンク先のプリント基板情報から対象基板を確定することができる利点がある。同時に筐体や他の電子部品などの履歴も先の譲歩にリンクすることにより広い範囲で管理することができる。 (Sixth embodiment)
A history management method for an electric device composed of a plurality of printed circuit boards will be described with reference to FIG. In FIG. 14, the case where it is comprised by three printed circuit boards 5a, 5b, 5c is demonstrated. When the electric device 84 composed of three printed boards is completed, a manufacturing number is generally given. The manufacturing history management server 73 records the information of each IC chip 1 mounted on the printed circuit boards 5a to 5c with a product number as a header in a structure linked to each other. By linking each other, there is an advantage that the target board can be determined from the printed board information of the link destination even when one of the constituent boards is missing or the RFID does not operate. At the same time, the history of the housing and other electronic components can be managed in a wide range by linking to the previous concessions.

（第７の実施形態）
大きなプリント基板から、複数の小さなプリント基板を製造する方法での課題と解決法について説明する。ここで大きなプリント基板を親基板９２、小さく分割されたプリント基板を子基板９２ａ〜９２ｉと定義する。図１５を用いて、従来方式での課題を示すと、親基板９２上に９枚の子基板９２ａ〜９２ｉが形成され、同時に９個のＦＲＩＤタグ９１ａ〜９１ｉが完成する。この結果、９個のＩＣチップの情報は読取り装置により取得することができるが、子基板９２ａ〜９２ｉとの対応を取ることができない。したがって、実装部品との対応を完全に取れない課題がある。 (Seventh embodiment)
A problem and a solution in a method of manufacturing a plurality of small printed circuit boards from a large printed circuit board will be described. Here, a large printed circuit board is defined as a parent circuit board 92, and small printed circuit boards are defined as child circuit boards 92a to 92i. Referring to FIG. 15, when a problem with the conventional system is shown, nine child boards 92a to 92i are formed on the parent board 92, and nine FRID tags 91a to 91i are completed at the same time. As a result, the information on the nine IC chips can be acquired by the reading device, but the correspondence with the child boards 92a to 92i cannot be taken. Therefore, there is a problem that the correspondence with the mounted component cannot be completely taken.

本実施形態では、親基板これを（例えば、所定の大きさより）大きな１枚のプリント基板からチップマウンタ６６でＩＣチップ１の情報とプリント基板９２上の実装位置を記録しながら部品実装すると、子基板９２ａ〜９２ｉに対応したＩＣチップ１の情報をリンクすることが可能となり、子基板上の各部品の履歴管理を行うことができる。   In the present embodiment, when the main board is mounted on a component while recording the information of the IC chip 1 and the mounting position on the printed board 92 with a chip mounter 66 from a large printed board (for example, larger than a predetermined size), Information on the IC chip 1 corresponding to the boards 92a to 92i can be linked, and history management of each component on the slave board can be performed.

従来技術の構造を示す図。The figure which shows the structure of a prior art. 本発明の一実施形態における構造を示す図。The figure which shows the structure in one Embodiment of this invention. 本発明の一実施形態における相互の位置関係を示す図。The figure which shows the mutual positional relationship in one Embodiment of this invention. プリントパターンの形状を示す図。The figure which shows the shape of a print pattern. プリントパターンがより接近した例を示す図。The figure which shows the example which the print pattern approached more. 裏面側でより大きなプリントパターンと接続された図。The figure connected with the larger print pattern on the back side. チップ実装面側でより大きなプリントパターンと接続された図。The figure connected with the larger print pattern on the chip mounting surface side. 外部アンテナとしてモノポールアンテナを示す図。The figure which shows a monopole antenna as an external antenna. 外部アンテナとしてクリップ形状の外装部を含む図。The figure containing the clip-shaped exterior part as an external antenna. 処理フローを示す図。The figure which shows a processing flow. 本発明における処理フローを示す図。The figure which shows the processing flow in this invention. 本発明のチップマウンタの動作を示す概略図。Schematic which shows operation | movement of the chip mounter of this invention. チップマウンタに取付けたＩＤ読取り用アンテナの図。The figure of the antenna for ID reading attached to the chip mounter. プリント基板製造履歴システムの概念図。The conceptual diagram of a printed circuit board manufacture history system. 複数のプリント基板から構成された機器の概略図。Schematic of the apparatus comprised from the some printed circuit board. 割基板の概略図Schematic diagram of split board 本発明の一実施形態におけるＩＣチップの形状とプリントパターン形状を示す図。The figure which shows the shape of an IC chip in one Embodiment of this invention, and a print pattern shape.

符号の説明Explanation of symbols

１…ＩＣチップ、２ａ，２ｂ，２ｃ，２ｄ，２ｆ…プリントパターン、３…スルーホール、４０、５０…外部アンテナ、５…プリント基板、３７…リーダ装置、３８…リーダアンテナ、６０…
部品リール、６１…ローダ、６２、６６…チップマウンタ、６３…リフロー炉、６４…検査装置、６５…アンローダ DESCRIPTION OF SYMBOLS 1 ... IC chip, 2a, 2b, 2c, 2d, 2f ... Print pattern, 3 ... Through hole, 40, 50 ... External antenna, 5 ... Printed circuit board, 37 ... Reader apparatus, 38 ... Reader antenna, 60 ...
Parts reel, 61 ... loader, 62, 66 ... chip mounter, 63 ... reflow furnace, 64 ... inspection device, 65 ... unloader

Claims (11)

基板と、
前記基板上に設けられ、情報を記録するＩＣチップと、
前記ＩＣチップに記録された情報を無線で送信するアンテナと、
前記基板に形成された、前記アンテナに対するインピーダンス整合回路と、
前記基板上に形成された、前記インピーダンス整合回路と前記アンテナとの接続部と、
を備え、
前記アンテナは、前記基板の外部に設けられて前記基板上の接続部に接続された外部アンテナであり、
前記インピーダンス整合回路は、当該基板上の厚さ方向に形成されたスルーホール内のスルーホールパターンと、当該スルーホールパターンに接続されたプリントパターンにより形成されていることを特徴とするＲＦＩＤタグ実装基板。 A substrate,
An IC chip provided on the substrate for recording information;
An antenna for wirelessly transmitting information recorded in the IC chip;
An impedance matching circuit for the antenna formed on the substrate;
A connection portion formed on the substrate and between the impedance matching circuit and the antenna;
With
The antenna, Ri connected external antenna der the connection portion of the substrate provided outside the substrate,
The impedance tag matching circuit is formed by a through hole pattern in a through hole formed in a thickness direction on the substrate, and a printed pattern connected to the through hole pattern. . 前記インピーダンス整合回路のプリントパターンは、当該ＲＦＩＤタグ基板上の２層で形成されていることを特徴とする請求項１に記載のＲＦＩＤタグ実装基板。 2. The RFID tag mounting substrate according to claim 1, wherein the printed pattern of the impedance matching circuit is formed of two layers on the RFID tag substrate. 前記インピーダンス整合回路のプリントパターンは、当該ＲＦＩＤタグ基板上の最上層と最下層で形成されていることを特徴とする請求項２に記載のＲＦＩＤタグ実装基板。 3. The RFID tag mounting substrate according to claim 2 , wherein the printed pattern of the impedance matching circuit is formed on an uppermost layer and a lowermost layer on the RFID tag substrate. 前記外部アンテナが、Ｔ字型であることを特徴とする請求項１記載のＲＦＩＤタグ実装基板。   The RFID tag mounting substrate according to claim 1, wherein the external antenna is T-shaped. 前記Ｔ字型外部アンテナは放射アンテナ部を有し、当該放射アンテナ部が１/２λ長のダイポールアンテナであることを特徴とする請求項４記載のＲＦＩＤタグ実装基板。 5. The RFID tag mounting substrate according to claim 4, wherein the T-shaped external antenna has a radiating antenna portion, and the radiating antenna portion is a 1/2 [lambda] long dipole antenna. 前記外部アンテナがＩ字型のモノポールアンテナであることを特徴とする請求項１記載のＲＦＩＤタグ実装基板。   2. The RFID tag mounting substrate according to claim 1, wherein the external antenna is an I-shaped monopole antenna. 前記Ｉ字型外部アンテナは放射アンテナ部を有し、当該放射アンテナ部が１/４λ長の奇数倍のモノポールアンテナであることを特徴とする請求項６記載のＲＦＩＤタグ実装基板。 7. The RFID tag mounting substrate according to claim 6, wherein the I-shaped external antenna has a radiating antenna portion, and the radiating antenna portion is a monopole antenna having an odd multiple of 1 / 4λ length. 前記プリントパターンが、メアンダ形状であることを特徴とする請求項１に記載のＲＦＩＤタグ実装基板。 The RFID tag mounting substrate according to claim 1 , wherein the printed pattern has a meander shape. 前記インピーダンス整合回路を形成するプリントパターンの一端が、隣接するＲＦＩＤタグの構成外のプリントパターンに接続され、モノポールアンテナ構造であることを特徴とする請求項１乃至３のいずれかに記載のＲＦＩＤタグ実装基板。 One end of the printed pattern forming the impedance matching circuit is connected to the structure outside of the printed pattern of adjacent RFID tags, RFID according to any one of claims 1 to 3, characterized in that a monopole antenna structure Tag mounting board. 前記隣接するＲＦＩＤタグの構成外のプリントパターンが、１/４λ長以上であることを特徴とする請求項９に記載のＲＦＩＤタグ実装基板。 The RFID tag mounting substrate according to claim 9 , wherein a print pattern outside the configuration of the adjacent RFID tag has a length of ¼λ or more. 前記外部アンテナはクリップ形状で構成され、前記ＩＣチップを挟み込む形態で当該ＩＣチップと接続することで、前記外部アンテナを保持することを特徴とする請求項１記載のＲＦＩＤタグ実装基板。   2. The RFID tag mounting substrate according to claim 1, wherein the external antenna is configured in a clip shape, and the external antenna is held by being connected to the IC chip in a form sandwiching the IC chip.
JP2007174711A 2007-07-03 2007-07-03 RFID tag mounting board Expired - Fee Related JP5065780B2 (en)

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JP2007174711A JP5065780B2 (en) 2007-07-03 2007-07-03 RFID tag mounting board
EP08003309A EP2012259A3 (en) 2007-07-03 2008-02-22 RFID tag mounting circuit board
US12/039,422 US8049626B2 (en) 2007-07-03 2008-02-28 RFID tag mounting circuit board
TW097108863A TW200919329A (en) 2007-07-03 2008-03-13 RFID tag mounting substrate
KR1020080028467A KR101116207B1 (en) 2007-07-03 2008-03-27 Ｒｆｉｄ tag mounting substrate
CN2008100903050A CN101339626B (en) 2007-07-03 2008-03-28 Rfid tag mounting circuit board

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Families Citing this family (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8912908B2 (en) 2005-04-28 2014-12-16 Proteus Digital Health, Inc. Communication system with remote activation
PL1889198T3 (en) 2005-04-28 2015-04-30 Proteus Digital Health Inc Pharma-informatics system
US8730031B2 (en) 2005-04-28 2014-05-20 Proteus Digital Health, Inc. Communication system using an implantable device
US8836513B2 (en) 2006-04-28 2014-09-16 Proteus Digital Health, Inc. Communication system incorporated in an ingestible product
US8802183B2 (en) 2005-04-28 2014-08-12 Proteus Digital Health, Inc. Communication system with enhanced partial power source and method of manufacturing same
US9198608B2 (en) 2005-04-28 2015-12-01 Proteus Digital Health, Inc. Communication system incorporated in a container
US9589417B2 (en) 2005-07-14 2017-03-07 Ag 18, Llc Interactive gaming among a plurality of players systems and methods
US10964161B2 (en) 2005-07-14 2021-03-30 Ag 18, Llc Mechanisms for detection of gambling rule violations including assisted or automated gameplay
WO2007024540A1 (en) * 2005-08-25 2007-03-01 Coldtrack, Llc Hierarchical sample coding and storage system
JP5714210B2 (en) 2005-09-01 2015-05-07 プロテウス デジタル ヘルス， インコーポレイテッド Implantable wireless communication system
KR20140018439A (en) 2006-05-02 2014-02-12 프로테우스 디지털 헬스, 인코포레이티드 Patient customized therapeutic regimens
US20080020037A1 (en) * 2006-07-11 2008-01-24 Robertson Timothy L Acoustic Pharma-Informatics System
MY158019A (en) 2006-10-25 2016-08-30 Proteus Digital Health Inc Controlled activation ingestible identifier
US8718193B2 (en) 2006-11-20 2014-05-06 Proteus Digital Health, Inc. Active signal processing personal health signal receivers
WO2008095183A2 (en) 2007-02-01 2008-08-07 Proteus Biomedical, Inc. Ingestible event marker systems
CA2676280C (en) 2007-02-14 2018-05-22 Proteus Biomedical, Inc. In-body power source having high surface area electrode
US9270025B2 (en) 2007-03-09 2016-02-23 Proteus Digital Health, Inc. In-body device having deployable antenna
US8540632B2 (en) 2007-05-24 2013-09-24 Proteus Digital Health, Inc. Low profile antenna for in body device
EP2192946B1 (en) 2007-09-25 2022-09-14 Otsuka Pharmaceutical Co., Ltd. In-body device with virtual dipole signal amplification
ES2661739T3 (en) * 2007-11-27 2018-04-03 Proteus Digital Health, Inc. Transcorporeal communication systems that employ communication channels
DK2268261T3 (en) 2008-03-05 2017-08-28 Proteus Digital Health Inc Edible event markers with multi-mode communications and systems as well as methods for using them
KR101615128B1 (en) 2008-07-08 2016-04-26 프로테우스 디지털 헬스, 인코포레이티드 Ingestible event marker data framework
US8540633B2 (en) 2008-08-13 2013-09-24 Proteus Digital Health, Inc. Identifier circuits for generating unique identifiable indicators and techniques for producing same
WO2010045385A2 (en) * 2008-10-14 2010-04-22 Proteus Biomedical, Inc. Method and system for incorporating physiologic data in a gaming environment
KR101008452B1 (en) * 2008-11-11 2011-01-14 삼성전기주식회사 Manufacturing Process Management Method for Printed Circuit Board with RF Antenna, Printed Circuit Board with RF Antenna and RF Chipset, and Printed Circuit Board Using RF
US8055334B2 (en) 2008-12-11 2011-11-08 Proteus Biomedical, Inc. Evaluation of gastrointestinal function using portable electroviscerography systems and methods of using the same
SG172847A1 (en) 2009-01-06 2011-08-29 Proteus Biomedical Inc Pharmaceutical dosages delivery system
EP2385781A4 (en) 2009-01-06 2014-11-05 Proteus Digital Health Inc Ingestion-related biofeedback and personalized medical therapy method and system
CN102204011B (en) 2009-01-16 2013-12-25 株式会社村田制作所 High frequency device and wireless IC device
CN101561864B (en) * 2009-03-12 2011-05-18 上海秀派电子科技有限公司 Information interactive device
GB2480965B (en) 2009-03-25 2014-10-08 Proteus Digital Health Inc Probablistic pharmacokinetic and pharmacodynamic modeling
WO2010129288A2 (en) 2009-04-28 2010-11-11 Proteus Biomedical, Inc. Highly reliable ingestible event markers and methods for using the same
WO2010132331A2 (en) 2009-05-12 2010-11-18 Proteus Biomedical, Inc. Ingestible event markers comprising an ingestible component
US8378827B2 (en) * 2009-05-27 2013-02-19 Biotillion, Llc Two-dimensional antenna configuration
JP5461068B2 (en) * 2009-06-02 2014-04-02 株式会社日本インフォメーションシステム Multilayer printed wiring board manufacturing method and multilayer printed wiring board
US8558563B2 (en) 2009-08-21 2013-10-15 Proteus Digital Health, Inc. Apparatus and method for measuring biochemical parameters
CN101667678B (en) * 2009-10-12 2013-06-12 嘉兴佳利电子股份有限公司 Radio frequency identification antenna
TWI517050B (en) 2009-11-04 2016-01-11 普羅托斯數位健康公司 System for supply chain management
UA109424C2 (en) 2009-12-02 2015-08-25 PHARMACEUTICAL PRODUCT, PHARMACEUTICAL TABLE WITH ELECTRONIC MARKER AND METHOD OF MANUFACTURING PHARMACEUTICAL TABLETS
US8872627B2 (en) * 2010-02-12 2014-10-28 Biotillion, Llc Tracking biological and other samples using RFID tags
WO2011127252A2 (en) 2010-04-07 2011-10-13 Proteus Biomedical, Inc. Miniature ingestible device
TWI557672B (en) 2010-05-19 2016-11-11 波提亞斯數位康健公司 Computer system and computer-implemented method to track medication from manufacturer to a patient, apparatus and method for confirming delivery of medication to a patient, patient interface device
US8654031B2 (en) * 2010-09-28 2014-02-18 Raytheon Company Plug-in antenna
US9107806B2 (en) 2010-11-22 2015-08-18 Proteus Digital Health, Inc. Ingestible device with pharmaceutical product
JP5641063B2 (en) * 2011-02-04 2014-12-17 株式会社村田製作所 Wireless communication system
US10475754B2 (en) 2011-03-02 2019-11-12 Nokomis, Inc. System and method for physically detecting counterfeit electronics
US9059189B2 (en) 2011-03-02 2015-06-16 Nokomis, Inc Integrated circuit with electromagnetic energy anomaly detection and processing
US9431692B2 (en) 2011-04-07 2016-08-30 Biotillion, Llc Tracking biological and other samples using RFID tags
WO2015112603A1 (en) 2014-01-21 2015-07-30 Proteus Digital Health, Inc. Masticable ingestible product and communication system therefor
US9756874B2 (en) 2011-07-11 2017-09-12 Proteus Digital Health, Inc. Masticable ingestible product and communication system therefor
US20140203950A1 (en) 2011-07-21 2014-07-24 Mark Zdeblick Mobile Communication Device, System, and Method
US9235683B2 (en) 2011-11-09 2016-01-12 Proteus Digital Health, Inc. Apparatus, system, and method for managing adherence to a regimen
US9867291B2 (en) * 2011-11-30 2018-01-09 Digi Internationl Inc. Embedded coplanar interconnect
JP2015523706A (en) * 2012-03-02 2015-08-13 ノコミス，インコーポレイテッド System and method for physically detecting counterfeit electronic devices
WO2014018454A1 (en) 2012-07-23 2014-01-30 Proteus Digital Health, Inc. Techniques for manufacturing ingestible event markers comprising an ingestible component
ES2683709T3 (en) 2012-10-18 2018-09-27 Proteus Digital Health, Inc. Apparatus, system, and procedure for adaptively optimizing energy dissipation and diffusion energy in a power source for a communication device
KR101727936B1 (en) * 2012-11-01 2017-04-18 한국전자통신연구원 Tag integrated circuit apparatus and method for fabricating tag integrated circuit apparatus
TWI659994B (en) 2013-01-29 2019-05-21 美商普羅托斯數位健康公司 Highly-swellable polymeric films and compositions comprising the same
WO2014144738A1 (en) 2013-03-15 2014-09-18 Proteus Digital Health, Inc. Metal detector apparatus, system, and method
JP6511439B2 (en) 2013-06-04 2019-05-15 プロテウス デジタル ヘルス， インコーポレイテッド Systems, devices, and methods for data collection and outcome assessment
US9796576B2 (en) 2013-08-30 2017-10-24 Proteus Digital Health, Inc. Container with electronically controlled interlock
KR101524711B1 (en) * 2013-09-25 2015-06-02 (주)파트론 Rfid tag module
JP2017501605A (en) 2013-10-24 2017-01-12 トムソン ライセンシングＴｈｏｍｓｏｎ Ｌｉｃｅｎｓｉｎｇ Compact wireless antenna implementation for electrostatic discharge protection
US10084880B2 (en) 2013-11-04 2018-09-25 Proteus Digital Health, Inc. Social media networking based on physiologic information
ES2568804T3 (en) * 2014-02-04 2016-05-04 Sick Ag RFID reading device for shelving occupancy detection
EP3155561B1 (en) 2014-06-12 2023-11-08 Metrc LLC Method and apparatus for tracking one or more plants and/or plant based products and/or tracking the sale of products derived from the same, utilizing rfid technology
US11051543B2 (en) 2015-07-21 2021-07-06 Otsuka Pharmaceutical Co. Ltd. Alginate on adhesive bilayer laminate film
FR3042847B1 (en) * 2015-10-23 2019-04-12 Valeo Vision LUMINOUS MODULE FOR A MOTOR VEHICLE WITH ELECTRONIC BIN ENCODING
CN108429564B (en) * 2016-02-25 2019-10-25 Oppo广东移动通信有限公司 Impedance matching circuit design method and mobile terminal
CN111772582A (en) 2016-07-22 2020-10-16 普罗秋斯数字健康公司 Electromagnetic sensing and detection of ingestible event markers
CN109478054B (en) * 2016-07-27 2022-05-13 株式会社富士 Substrate production management device and substrate production management method
CA3041041A1 (en) 2016-10-26 2018-05-03 Proteus Digital Health, Inc. Methods for manufacturing capsules with ingestible event markers
TWI632507B (en) * 2017-06-03 2018-08-11 蔡政育 Product traceability code outputting system
CN118266837A (en) * 2018-06-06 2024-07-02 直观外科手术操作公司 System and method for high speed data transmission across an electrical isolation barrier
US12006126B2 (en) 2019-09-03 2024-06-11 Bio Tillion, Llc Techniques for tracking physical parameters such as temperature of transported biological materials
CN112561258A (en) * 2020-12-02 2021-03-26 鼎勤科技(深圳)有限公司 Intelligent production management system applied to PCB processing
TWI828217B (en) * 2022-06-29 2024-01-01 英業達股份有限公司 System and method for scanning identification after mounting to pair circuit board

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2284324B (en) * 1991-04-22 1995-10-04 Mitsubishi Electric Corp Method of manufacturing antenna circuit for non-contact type portable storage device
JPH04321190A (en) * 1991-04-22 1992-11-11 Mitsubishi Electric Corp Antenna circuit and its production for non-contact type portable storage
GB2305075A (en) 1995-09-05 1997-03-26 Ibm Radio Frequency Tag for Electronic Apparatus
EP0953278B1 (en) * 1997-01-16 2002-06-19 Matsushita Electric Industrial Co., Ltd. Component supplying method, component arrangement data forming method and electronic component mounting apparatus using the methods
US6133834A (en) * 1997-03-06 2000-10-17 Texas Instruments Deutschland, Gmbh Method of trimming film type antennas
US6118379A (en) * 1997-12-31 2000-09-12 Intermec Ip Corp. Radio frequency identification transponder having a spiral antenna
US7190319B2 (en) * 2001-10-29 2007-03-13 Forster Ian J Wave antenna wireless communication device and method
JP4317351B2 (en) * 2002-08-23 2009-08-19 富士機械製造株式会社 Circuit board management method and electronic circuit production system
JP4320580B2 (en) 2003-10-07 2009-08-26 三菱マテリアル株式会社 RFID reader / writer and antenna structure
JP4393228B2 (en) * 2004-02-27 2010-01-06 シャープ株式会社 Small antenna and wireless tag provided with the same
JP4359198B2 (en) 2004-06-30 2009-11-04 株式会社日立製作所 IC tag mounting substrate manufacturing method
JP4028537B2 (en) * 2004-09-07 2007-12-26 松下電器産業株式会社 How to manage parts
US20060055617A1 (en) * 2004-09-15 2006-03-16 Tagsys Sa Integrated antenna matching network
KR100636384B1 (en) * 2004-12-08 2006-10-19 한국전자통신연구원 PIFA, RFID Tag thereof and Antenna Impedance Adjusting Method thereof
JP4087859B2 (en) * 2005-03-25 2008-05-21 東芝テック株式会社 Wireless tag
US8009118B2 (en) * 2005-07-27 2011-08-30 Electronics And Telecommunications Research Institute Open-ended two-strip meander line antenna, RFID tag using the antenna, and antenna impedance matching method thereof
JP2007066989A (en) 2005-08-29 2007-03-15 Hitachi Ltd Printed circuit board with RFID tag

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TWI360081B (en) 2012-03-11
EP2012259A3 (en) 2011-04-27
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US20090009330A1 (en) 2009-01-08
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CN101339626B (en) 2012-10-03
US8049626B2 (en) 2011-11-01

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