JP4889064B2 - Mold set, processed plate manufacturing method, and product plate manufacturing method - Google Patents

Description

  The present invention relates to a mold set, a method of manufacturing a processed plate, and a method of manufacturing a product plate, and more particularly, various processed plates such as a mounting substrate in which a printed circuit board is temporarily fixed to a frame portion by a pushback method. Mold set consisting of a set of N molds for manufacturing a base plate, a method of manufacturing a processed plate using such a mold set, and a product from a processed plate obtained by such a method The present invention relates to a method of manufacturing a product board for obtaining a board (printed circuit board).

  In recent years, with the miniaturization of electronic devices, there has been an increasing demand for miniaturization and modification of printed circuit boards used in electronic devices. On the other hand, an electronic component automatic placement machine (hereinafter referred to as “self-mounting machine”) such as a chip mounter or an automatic insertion machine for mounting electronic components on a printed circuit board is referred to as the size of a workpiece because of its conveyance. Have upper and lower limits. Moreover, the external shape of the workpiece | work used for a self-machine is required to be substantially rectangular, ie, at least one side is a straight line, and at least one of the orthogonal sides is a straight line.

  Therefore, when mounting electronic components on a small and irregular printed circuit board using a self-mounting machine, first, a plurality of printed circuit boards are formed on the printed wiring board, and the V-cut method and pushback method are used. Using a perforation method, etc., the printed circuit board is temporarily fixed to the original printed wiring board, and then the printed wiring board has a size and shape that can be conveyed by the self-equipment. A method of cutting a substrate (mounting substrate) is used.

Of these, the V-cut method inserts V-shaped, U-shaped and other concave grooves (V-cut) along the printed circuit boundary printed on the printed wiring board, and mounts electronic components on the printed circuit. And then breaking along the V-cut. Therefore, the V-cut method can be applied only to a printed circuit board whose outer shape is linear.
The perforation method is a method in which a large number of small holes are formed along the boundary line of the printed circuit board and the holes are broken along the small holes. The perforation method is applicable only to a printed circuit board that does not require dimensional accuracy of the outer shape, because unevenness remains on the boundary line after fracture. In addition, instead of perforations, a method is also known in which discontinuous long holes are discretely formed along the boundary line of the printed circuit board and temporarily fixed to the frame portion with a narrow connecting portion.

  On the other hand, in the pushback method, the printed circuit board is punched out using a blade having a predetermined shape while holding the printed wiring board between the upper mold and the lower mold, and then the punched printed circuit board is removed from the original hole. It is a method of fitting. The pushback method has a high dimensional accuracy of the outer shape and there is no restriction on the shape of the printed circuit board, and is therefore an effective method particularly when electronic components are automatically mounted on a deformed printed circuit board.

The processing of printed wiring board using the pushback method is generally
(1) Form a reference hole for pushback on the printed wiring board on which the electric circuit is printed,
(2) Push-back processing of the printed circuit board using the push-back mold, and drilling of component holes as necessary,
(3) Cutting the outer shape of the printed wiring board using an outer cutting die and cutting out a mounting board including a predetermined number of printed circuit boards from the mother board.
Has been done.

  However, the pushback process generally tends to warp because a strong shearing force acts on the printed wiring board. Conventionally, pushback processing and outline cutting are generally performed using separate molds. However, if only pushback processing is performed continuously on the mother board, a large warp will occur on the mother board. There is a problem that it becomes difficult to cut the outer shape. In addition, a pushback mold and an outer cutting mold are required, which increases the cost. Further, when the manufactured mounting board is warped or has a relatively large residual stress, it is difficult to remove the printed circuit board from the frame.

In order to solve this problem, various proposals have heretofore been made.
For example, in Patent Document 1, the printed circuit board is disposed upstream of the printed wiring board conveyance direction, and the printed circuit board is punched from the printed wiring board, and the punched printed circuit board is fitted into the original hole. And a pushback means, and a printed circuit board that is disposed downstream of the printed wiring board transport direction and includes one or more printed circuit boards that are pushed back. A printed wiring board processing die having an outer shape cutting means is disclosed.
In this document, since the area pushed back by the pushback means is sequentially separated by the outline cutting means, the outline cutting can be easily performed without being greatly affected by the warp of the printed wiring board, and one metal It describes that the die cost can be reduced because push back processing and external cutting processing can be performed with the mold.

Further, in Patent Document 2, a printed circuit board is punched from a printed wiring board, pushback means for fitting the punched printed circuit board into an original hole, and at least one of the punched printed circuit boards. Vertical slit forming means for forming continuous vertical slits serving as reference sides of the processed board by sequentially forming vertical slit pieces parallel to the conveyance direction of the printed wiring board on the side. A printed wiring mother board processing mold provided is disclosed.
In the same document,
(1) Since a continuous vertical slit is formed on at least one side of the printed circuit board that has been pushed back, the outline cutting can be simplified as compared with the conventional method.
(2) When the horizontal slit forming means is further provided, a discontinuous horizontal slit perpendicular to the vertical slit is formed between the printed circuit boards arranged in the transport direction of the printed wiring mother board. After the back processing is completed, a processed board including a predetermined number of printed circuit boards pushed back can be obtained simply by breaking the connecting portion of the horizontal slit formed at a predetermined position, and
(3) Since a separate mold for outline cutting or an outline cutting process becomes unnecessary or simplified, the mold cost can be greatly reduced, and workability is improved,
Is described.

Furthermore, Patent Document 3 includes:
(1) Push-back processing of the first product plate is performed when the base plate is fed forward, and new push-back processing of the second product plate is performed when the base plate is fed in the reverse direction. Pushback means are provided,
(2) The vertical slit is such that the vertical slit piece does not communicate when the mother board is fed forward and the vertical slit piece is continuous and continuous when the mother board is fed in the reverse direction. A mother board processing mold provided with a piece forming means is disclosed.
In this document, it is possible to manufacture a large-area processed plate incorporating a large number of product plates using a small press machine with a small pressing capability by using such a base plate processing mold. The point that becomes.

JP 2002-233996 A JP 2003-089097 A Japanese Patent No. 4341929

When electronic components are automatically mounted on a printed circuit board incorporated in a mounting board, the mounting efficiency increases as the number of printed circuit boards incorporated in the mounting board increases. However, in order to manufacture a mounting board in which a large number of printed circuit boards are incorporated, a mold capable of forming a large number of printed circuit boards in the mounting board is required. Therefore, as the number of printed circuit boards incorporated in the mounting board increases, there is a problem that the structure of the mold becomes complicated and the number of necessary parts increases.
Further, as the number of printed circuit boards incorporated in the mounting board increases, the area of the mounting board increases, and the mold also increases in size accordingly. For this reason, there is a problem that the press pressure required for the processing increases, and a larger press machine is required. In particular, when the printed circuit board is pushed back, it is necessary to punch the printed circuit board against the urging force of the elastic member for fitting the punched printed circuit board back into the original hole. The larger the area on which pushback processing is performed, the larger the press machine is required.
Furthermore, in order to incorporate a large number of printed circuit boards on the mounting substrate, it is necessary to incorporate a mechanism for performing various processing in the mold. However, if a large number of mechanisms are incorporated in a limited area, the strength of the mold may be lowered, and the durability may be lowered.

The problem to be solved by the present invention is that the mold structure is complicated even when a processed board (for example, a mounting board) subjected to push back processing is manufactured by a large number of product boards (for example, a printed circuit board). The present invention provides a mold set that does not make or increase the number of necessary parts, a method of manufacturing a processed plate using the mold set, and a method of manufacturing a product plate that manufactures a product plate from such a processed plate There is.
In addition, another problem to be solved by the present invention is a mold set that does not increase the press pressure required for processing even when manufacturing a processed plate in which a large number of product plates are push-back processed. An object of the present invention is to provide a method for producing a processed plate using the same, and a method for producing a product plate for producing a product plate from the processed plate.
Furthermore, another problem to be solved by the present invention is that it is possible to manufacture a processed plate in which a large number of product plates are push-back processed, and a mold set having excellent durability, and processing using the same. It is providing the manufacturing method of a board, and the manufacturing method of the product board which manufactures a product board from such a processed board.

In order to solve the above-mentioned problems, the first mold set according to the present invention is summarized as having the following configuration.
(1) The mold set includes N (N ≧ 2) mother board machining dies, and the mother board is moved forward with respect to the same mother board using the mother board machining dies. The base plate is subjected to a total of 2N press processes, including N forward press processes that perform press processing while feeding and N reverse press processes that perform press processing while feeding the base plate in the reverse direction. Therefore, the product plate pushed back is used to manufacture a processed plate temporarily fixed to the frame portion.
(2) Each of the N molds for processing a base plate has at least one pushback means for punching out the product plate from the base plate and fitting the punched product plate into the original hole. Prepared,
The pushback means provided in the i-th (1 ≦ i ≦ N) of the base plate processing mold is provided in the j-th (1 ≦ j ≦ N, j ≠ i) of the base plate processing die. In a portion different from the portion to be pushed back by the push back means, the product plate is arranged so that a new product can be pushed back from the base plate.
(3) Each of the pushback means provided in the i-th die for processing a base plate,
(A) When the base plate is forwardly fed, the first product plate can be pushed back in a part of the region to be the processed plate; and
(B) The second product plate is newly provided in a portion different from the first product plate in the region to be the processed plate when the base plate is fed forward and then further fed in the reverse direction. It is arranged so that it can be pushed back.
(4) The mold set may be any one or more of the N mother board processing molds,
A vertical slit piece forming means for forming a vertical slit piece parallel to the conveying direction of the mother board at at least one side end of the mother board, and
Any one of the horizontal slit piece forming means for forming a horizontal slit piece perpendicular to the conveying direction of the mother board is provided.
(5) The vertical slit piece forming means communicates with each other by performing the press processing twice or more using the same or different molds for processing the base plate, thereby conveying the processed plate. Arranged in the same or different mold for processing the base plate so as to be a continuous vertical slit that becomes a side parallel to the direction,
The horizontal slit piece forming means communicates with each other by performing press processing two or more times using the same or different molds for processing the base plate, so that the horizontal slit piece communicates with the conveying direction of the processed plate. Are arranged in the same or different molds for processing a base plate so as to form continuous horizontal slits having vertical sides.

The manufacturing method of the 1st processed board which concerns on this invention uses the said N mother board processing metal mold | die with which the 1st metal mold | die set concerning this invention is equipped, the said mother board with respect to the same mother board. By performing a total of 2N times of press work of N times of forward direction press work that performs press work while feeding in the forward direction and N times of reverse direction press work that performs press work while feeding the base plate in the reverse direction, A press process is provided for manufacturing a processed plate in which a product plate that is pushed back is temporarily fixed to the frame portion from the mother plate.
The gist of the first product plate manufacturing method according to the present invention is to separate the product plate from the processed plate obtained by the first processed plate manufacturing method according to the present invention.

The gist of the second mold set according to the present invention is as follows.
(1) The mold set includes N (N ≧ 2) mother board machining dies, and the mother board is moved forward with respect to the same mother board using the mother board machining dies. By performing N times of forward pressing processes that perform the pressing process while feeding, it is used to manufacture a processed plate in which the product plate pushed back is temporarily fixed to the frame portion from the base plate.
(2) Each of the N molds for processing a base plate has at least one pushback means for punching out the product plate from the base plate and fitting the punched product plate into the original hole. Prepared,
The pushback means provided in the i-th (1 ≦ i ≦ N) of the base plate processing mold is provided in the j-th (1 ≦ j ≦ N, j ≠ i) of the base plate processing die. In a portion different from the portion to be pushed back by the push back means, the product plate is arranged so that a new product can be pushed back from the base plate.
(3) The mold set may be any one or more of the N mother board processing molds,
A vertical slit piece forming means for forming a vertical slit piece parallel to the conveying direction of the mother board at at least one side end of the mother board, and
Any one of the horizontal slit piece forming means for forming a horizontal slit piece perpendicular to the conveying direction of the mother board is provided.
(4) The vertical slit piece forming means communicates with each other by performing the pressing process two or more times using the same or different molds for processing the base plate so that the vertical slit pieces communicate with each other. Arranged in the same or different mold for processing the base plate so as to be a continuous vertical slit that becomes a side parallel to the direction,
The horizontal slit piece forming means communicates with each other by performing press processing two or more times using the same or different molds for processing the base plate, so that the horizontal slit piece communicates with the conveying direction of the processed plate. Are arranged in the same or different molds for processing a base plate so as to form continuous horizontal slits having vertical sides.

The manufacturing method of the 2nd processed board which concerns on this invention uses the said N mother board processing metal mold | die with which the 2nd metal mold set which concerns on this invention is equipped, The said mother board is used with respect to the same mother board. A press process for manufacturing a processed plate in which a product plate that is pushed back is temporarily fixed to a frame portion from the base plate by performing N times of forward press processing that performs press processing while feeding forward. Yes.
The gist of the second product plate manufacturing method according to the present invention is to separate the product plate from the processed plate obtained by the second processed plate manufacturing method according to the present invention.

Push-back means for performing push-back processing of the product plate to be formed on one processed plate are distributed and arranged in N base plate processing molds, and each of them is performed by N times of forward pressing. When push back processing of product plates is performed, the press pressure can be reduced to about 1 / N compared to the case of performing push back processing of all product plates by one press processing.
Similarly, push-back means for performing the push-back processing of the product plate formed on one processed plate is distributed and arranged in N mother plate processing molds, and N times of forward pressing and When pushback processing of individual product plates is performed by N times of reverse direction press processing, the press pressure is reduced to about 1 / 2N compared to the case of performing pushback processing of all product plates by one press processing. Can be lowered. Therefore, as long as it does not hinder the conveyance of the mother board, it is possible to manufacture an extremely large processed board in which a large number of product boards are pushed back without any restrictions on the pressing ability.
Furthermore, at the same time, when the vertical slit piece forming means and / or the horizontal slit piece forming means are dispersed and arranged in N mother plate processing molds, when the final pressing is completed, Sides parallel to the transport direction and / or sides perpendicular to the transport direction can be formed simultaneously.

FIG. 1A and FIG. 1B are a plan view of a lower mold of a first mother board machining mold constituting a first specific example of a mold set according to the present invention, and a second mother, respectively. It is a top view of the lower mold | type of a metal mold | die for plate processing. It is process drawing of the forward direction press work of the printed wiring mother board using the 1st mother board processing metal mold | die shown to Fig.1 (a). FIG. 3 is a continuation of the process diagram shown in FIG. 2. It is process drawing of the reversal direction press work of the printed wiring mother board using the 1st mother board processing metal mold shown in Drawing 1 (a). It is process drawing of the forward direction press work of the printed wiring mother board using the 2nd mother board processing metal mold | die shown in FIG.1 (b). FIG. 6 is a continuation of the process diagram shown in FIG. 5. It is process drawing of the reverse direction press processing of the printed wiring mother board using the 2nd mother board processing metal mold | die shown in FIG.1 (b).

8 (a), 8 (b) and 8 (c) are plan views of the lower mold of the first mother board machining mold constituting the second specific example of the mold set according to the present invention, respectively. FIG. 4 is a plan view of a lower mold of a second mother board machining mold and a plan view of a lower mold of a third mother board machining mold. FIG. 9 is a process diagram of forward press working of a printed wiring mother board using the first mother board machining die shown in FIG. FIG. 10 is a process diagram of forward press working of a printed wiring mother board using the second mother board machining die shown in FIG. FIG. 10 is a process diagram of forward press working of a printed wiring mother board using the third mother board machining die shown in FIG. It is process drawing of the reverse direction press processing of the printed wiring mother board using the 1st mother board processing metal mold | die shown to Fig.8 (a). It is process drawing of the reversal direction press work of the printed wiring mother board using the 2nd mother board processing metal mold shown in Drawing 8 (b). It is process drawing of the reversal direction press work of the printed wiring mother board using the 3rd mother board processing metal mold shown in Drawing 8 (c).

FIG. 15A and FIG. 15B are a plan view of a lower die of a first mother board machining die constituting a third specific example of the die set according to the present invention, and a second mother respectively. It is a top view of the lower mold | type of a metal mold | die for plate processing. FIG. 16 is a process diagram of forward press working of a printed wiring mother board using the first mother board machining die shown in FIG. It is process drawing of the reversal direction press work of the printed wiring mother board using the 1st mother board processing metal mold | die shown to Fig.15 (a). FIG. 16 is a process diagram of forward press working of a printed wiring mother board using the first mother board machining die shown in FIG. It is process drawing of the reversal direction press work of the printed wiring mother board using the 1st mother board processing metal mold shown in Drawing 15 (b).

Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.
In the following description, a mold set composed of a set of N mother board processing molds for manufacturing a mounting board including a printed circuit board from a printed wiring board, and such a mold. A method for manufacturing a mounting board using a set will be described. The present invention relates to a "base board" other than a printed wiring board, a "work board" other than a mounting board, and a "product board" other than a printed circuit board. Can also be applied.

[1. Mold set (1)]
[1.1. Basic configuration]
The mold set according to the first embodiment of the present invention has the following configuration.
[1.1.1. Number of molds]
The mold set is composed of N (N ≧ 2) mother board machining molds, and N times of forward pressing and N are performed on the same printed wiring mother board using each mother board machining die. This is for performing a total of 2N presses in the reverse direction press. A substrate for mounting can be manufactured from the printed wiring board by performing 2N pressing.

  The number N of the mother board machining dies is not particularly limited, and can be arbitrarily selected according to the purpose. In general, the larger the number N of mother board machining dies, the more the mold production costs and the number of mold exchange man-hours increase. However, since complicated machining can be performed in a distributed manner, the mold structure is simplified. The press pressure per press can be lowered.

“Forward press processing” refers to performing press processing n times (n ≧ 1) while conveying the printed wiring board in a certain direction (forward direction).
“Reverse direction pressing” refers to pressing n ′ times (n ′ ≧ 1) while conveying the printed wiring board in a direction 180 ° different from the forward direction (reverse direction).
“Pressing once in the forward direction (or reverse direction)” means that when pressing a plurality of times while stepping the printed wiring board in the forward direction (or reverse direction), the forward direction (or , A series of press operations (multiple times) performed while step-feeding in the reverse direction. Depending on the size of the printed wiring board, the press work may be performed only once in one forward (or reverse) press process.

The mounting substrate manufactured by the mold set according to the present invention is obtained by temporarily fixing a push-back printed circuit board to a frame portion. When a plurality of mounting boards are manufactured from the printed wiring board, each mounting board has a mold set configuration (vertical slit element forming means, horizontal slit element forming means, and intermediate vertical slit elements described later). Depending on the length and arrangement of the piece forming means, they may be separated from each other or may be connected via any part.
When a plurality of mounting boards manufactured by a mold set are connected via any part, after the processing by the mold set is completed, other means (for example, general-purpose shearing device, dedicated for cutting) The connecting portion may be cut using a press die.
Further, when a plurality of mounting boards are manufactured from the printed wiring board, depending on the configuration of the mold set (the length and arrangement of the horizontal slit piece forming means and the intermediate vertical slit piece forming means described later), In some cases, the individual mounting substrates are separated before the final pressing is performed. Even if individual mounting substrates are separated during processing, forward pressing and reverse direction pressing are possible, so in the present invention, even when the mounting substrate is separated before the final press, The mounting board before the final press is called “printed wiring mother board”.

[1.1.2. Pushback means]
Each of the N mother board processing molds includes at least one pushback means for punching out the printed circuit board from the printed wiring board and fitting the punched printed circuit board into the original hole. . That is, in the mold set according to the present invention, the push-back processing of the printed circuit board formed on one mounting board is distributed to N mother board processing molds. This point is different from the conventional mold.
Therefore, the pushback means provided in the i-th (1 ≦ i ≦ N) base plate processing mold is provided in the j-th (1 ≦ j ≦ N, j ≠ i) base plate processing die. The printed circuit board is arranged so that a new printed circuit board can be pushed back from a printed wiring board at a portion different from the portion to be pushed back by the pushback means.
Each pushback means should just be arrange | positioned so that the position and / or magnitude | size of a pushback process performed with each metal mold | die for a base plate process may differ. That is, each pushback means may be newly pushed back in an unprocessed portion (blank portion) of the printed wiring board, or may not be the same as the portion subjected to pushback processing in another mold. However, a pushback process may be performed on the overlapping portion.

Furthermore, the die set according to the present embodiment causes one forward press and one reverse press to be performed for each base plate processing die. Therefore, the pushback means provided in each i-th base plate processing mold is respectively
(A) When the printed wiring board is forwardly fed, the first printed circuit board can be pushed back in a part of the region to be the mounting board; and
(B) When the printed wiring board is fed forward and then the printed wiring board is fed in the reverse direction, the second printed circuit board is newly added in a portion different from the first printed circuit board in the region to be the mounting board. The printed circuit board is arranged so that it can be pushed back.
“Different portions” refers to unprocessed portions (blank portions) or overlapping portions that are not the same as described above.

[1.1.3. Vertical slit piece forming means, horizontal slit piece forming means]
The mold set according to the present embodiment includes one or both of the vertical slit piece forming means and the horizontal slit piece forming means in any one or more of the N mother board processing molds. ing.
The “longitudinal slit piece forming means” means means for forming a vertical slit piece parallel to the transport direction of the printed wiring board at at least one side end of the printed wiring board. Vertical slit pieces (or continuous vertical slits) may be formed only on one side of the printed wiring board or on both sides.
“Horizontal slit piece forming means” means means for forming a horizontal slit piece perpendicular to the direction of conveyance of the printed wiring board.

The vertical slit piece forming means communicates with each other by performing press processing (forward press processing or reverse direction press processing) two or more times using the same or different molds for base plate processing. They are arranged on the same or different base plate processing molds so as to be continuous vertical slits which become reference sides (sides parallel to the transport direction) of the mounting substrate.
Similarly, the horizontal slit piece forming means performs the press processing (forward press processing or reverse direction press processing) twice or more using the same or different base plate processing molds so that the horizontal slit pieces are mutually connected. They are arranged in the same or different base plate processing molds so as to form continuous horizontal slits that are in communication and serve as reference sides (sides perpendicular to the transport direction) of the mounting substrate.

When cutting out a plurality of mounting boards arranged in a line along the conveying direction from the printed wiring board, only the vertical slit piece forming means is provided in any one or more of the N mother board processing molds. Is provided, an assembly (intermediate product) is obtained in which a plurality of mounting substrates are integrally connected via sides perpendicular to the transport direction. In this case, after N times of forward pressing and N times of reverse pressing, the connecting portion may be cut by other means.
Further, in the case where only one of the N mother plate processing molds is provided with the horizontal slit piece forming means, the continuous horizontal slit formed thereby reaches both ends of the printed wiring mother plate. In some cases, the mounting boards may be separated before the final forward pressing or reverse pressing is performed. Even in such a case, subsequent press working is possible. However, in order to facilitate the conveyance of the printed wiring board before the final press processing, the continuous horizontal slits do not reach both ends of the printed wiring board (that is, each side through the side edge of the mother board). It is preferable to arrange the horizontal slit piece forming means so that the mounting substrate is connected. When press working is performed using a mold set having only horizontal slit piece forming means, after N times of forward pressing and N times of reverse pressing, the mounting substrate is moved in the transport direction. The side parallel to the other may be formed by other means.

Further, when a plurality of mounting boards arranged in a line along the conveying direction are cut out from the printed wiring board, any one or more of the N mother board processing molds is provided with a vertical slit element. When both the forming means and the horizontal slit piece forming means are provided, each mounting substrate is inserted through any part before the final press is performed in order to facilitate the conveyance of the printed wiring board. The vertical slit piece forming means and the horizontal slit piece forming means are arranged so that the mounting substrate is sequentially separated from the printed wiring board when the final press is performed. preferable.
That is, the vertical slit piece forming means and the horizontal slit piece forming means are:
(A) At the time when the (2N-1) -th press work (forward press work or reverse press work) is completed, at least one of the vertical slit pieces and the horizontal slit pieces does not communicate with each other, and the print All the mounting boards in the wiring mother board are integrally connected via any part, and
(B) The vertical slit pieces and / or the horizontal slit pieces that were not communicated during the 2N-th press work (forward press work or reverse press work) communicated with each other, and each continuous vertical slit. It is preferable that the mounting boards that are integrally connected to each other are arranged in the same or different molds for processing the mother board so as to be sequentially separated from the printed wiring board.

[1.1.4. Intermediate vertical slit piece forming means]
The mold set according to the present embodiment includes an intermediate vertical slit in addition to the vertical slit piece forming means and / or the horizontal slit piece forming means in addition to any one or more of the N base plate processing molds. You may provide the piece formation means.
The “intermediate vertical slit piece forming means” refers to means for forming an intermediate vertical slit piece parallel to the transport direction of the printed wiring mother board at the intermediate portion of the printed wiring mother board. The “intermediate portion” does not necessarily mean the center line of the printed wiring board, and the intermediate vertical slit may be shifted from the center line of the printed wiring board to the left and right.
The intermediate vertical slit piece forming means communicates with each other by performing press processing (forward press processing or reverse direction press processing) two or more times using the same or different base plate processing molds. And it is arrange | positioned at the same or different mother board processing metal mold | die so that it may become the continuous intermediate | middle vertical slit used as the reference | standard side (side parallel to a conveyance direction) of the board | substrate for mounting.

  The width of the printed wiring board may be a width that allows the mounting boards to be arranged in one row along the transport direction, or a width that allows two or more mounting boards to be arranged along the transport direction. It may be. When two or more mounting substrates are arranged along the transport direction, the connecting portion between each row of the mounting substrate may be separated using other means. However, if the connecting portion between each row of the mounting substrate is cut simultaneously with the push-back of the printed circuit board using the intermediate vertical slit piece forming means, the mounting substrate separating step using other means becomes unnecessary. Become.

In the case where the mounting boards are arranged in two or more rows along the transport direction of the printed wiring mother board, if the intermediate vertical slit piece forming means is provided, the intermediate vertical slit communicates with the horizontal slit and the final press is performed. Before, individual mounting boards may be separated. Even if the individual mounting boards are separated, it is possible to continue the forward press and the reverse press, but the conveyance of the printed wiring board becomes complicated.
Therefore, in the case of having an intermediate vertical slit piece forming means in addition to the vertical slit piece forming means and / or the horizontal slit piece forming means, the vertical slit piece forming means, the horizontal slit piece forming means, and The intermediate vertical slit piece forming means is:
(A) When the (2N-1) -th press work (forward press work or reverse press work) is completed, at least one of the vertical slit piece, the horizontal slit piece, and the intermediate vertical slit piece is Not in communication with each other, all the mounting boards in the printed wiring board are integrally connected via any part, and
(B) In the 2N-th press work (forward press work or reverse direction press work), the longitudinal slit piece, the transverse slit piece and / or the intermediate longitudinal slit piece that were not communicated with each other communicated with each other, The same or different molds for processing the mother board so that each of them becomes a continuous vertical slit, a horizontal slit and / or an intermediate vertical slit so that the integrally connected mounting board is sequentially separated from the printed wiring board. Is preferably arranged.

[1.2. First Specific Example of Mold Set (1)]
[1.2.1. Configuration of First Specific Example]
FIG. 1 shows a first specific example of a mold set according to the present embodiment. In FIG. 1, a mold set 10 includes a first base plate processing mold (only the lower mold 20a is shown in FIG. 1 (a)) and a second base plate processing mold (FIG. 2 (b)). , Only the lower mold 20b is shown).
The mold set 10 basically divides the mold described in Patent Document 3 into an upstream side and a downstream side with respect to the conveying direction, and a total of six pushback means are used for the first base plate processing. Three are each distributed and arranged in the mold and the second base plate processing mold. The mold set 10 includes a total of 4 forward presses and reverse presses using the first base plate processing die, and forward presses and reverse presses using the second base plate processing die. This is for manufacturing a mounting substrate by one press working.

A total of three lower mold strippers 22a, 22b, and 22c for embedding the printed circuit board are embedded in the lower mold 20a of the first mother board processing mold. The lower mold strippers 22a to 22c are urged upward by urging means (not shown). The upper die (not shown) is provided with punches for pressing them downward at positions corresponding to the lower die strippers 22a to 22c.
The lower mold strippers 22a to 22c are respectively
(A) When the printed wiring board is forwardly fed, the first printed circuit board can be pushed back in a part of the region to be the mounting board; and
(B) When the printed wiring board is forwardly fed and then the printed wiring board is fed in the reverse direction, the second printed circuit board is newly pushed back in the blank portion in the region to be the mounting board. Arranged to be able to.

Similarly, a total of three lower mold strippers 22d, 22e, and 22f for pushing back the printed circuit board are embedded in the lower mold 20b of the second mother board processing mold. The lower mold strippers 22d to 22f are urged upward by urging means (not shown). The upper die (not shown) is provided with punches for pressing them downward at positions corresponding to the lower die strippers 22d to 22f.
The lower mold strippers 22d to 22f are respectively
(A) When the printed wiring board is forwardly fed, the first printed circuit board can be pushed back in a part of the region to be the mounting board; and
(B) When the printed wiring board is forwardly fed and then the printed wiring board is fed in the reverse direction, the second printed circuit board is newly pushed back in the blank portion in the region to be the mounting board. Arranged to be able to.

Furthermore, the lower mold strippers 22a to 22c provided in the lower mold 20a of the first mother board processing mold and the lower mold strippers 22d to 22f provided in the lower mold 20b of the second mother board processing mold In different portions (blank portions), the printed circuit board is arranged so that a new printed circuit board can be pushed back.
That is, the lower mold strippers 22a to 22c are arranged so that the printed circuit boards are pushed back in a zigzag manner when the forward press and the reverse press are performed using the first base plate processing mold. Yes.
Similarly, the lower mold strippers 22d to 22f are subjected to pushback processing by the first base plate processing mold when the forward press and the reverse direction press are performed using the second base plate processing mold. In the part (blank part) which did not exist, it arrange | positions so that a printed circuit board may be pushed back in zigzag form newly.

A plurality of through-hole forming pin guide holes 24 are provided in the lower mold 20a of the first mother board processing mold. The upper mold (not shown) is provided with through-hole forming pins for punching through-holes at positions corresponding to the through-hole forming pin guide holes 24. The through holes forming pin guide holes 24 of the lower mold 20a are for forming through holes in the printed circuit board pushed back by the lower mold strippers 22d to 22f of the lower mold 20b. These through-hole forming pin guide holes 24 can be provided as necessary.
Similarly, a plurality of through-hole forming pin guide holes 24 are provided in the lower mold 20b of the second mother board processing mold. The upper mold (not shown) is provided with through-hole forming pins for punching through-holes at positions corresponding to the through-hole forming pin guide holes 24. The through holes forming pin guide holes 24 of the lower mold 20b are for forming through holes in the printed circuit board pushed back by the lower mold strippers 22a to 22c of the lower mold 20a. These through-hole forming pin guide holes 24 can be provided as necessary.

Vertical slit piece forming pin guide holes 26a and 26b are provided on the left side with respect to the conveyance direction of the lower mold 20a of the first base plate machining die, and the vertical slit piece is provided on the right side with respect to the conveyance direction. A forming pin guide hole 26c is provided. The upper mold (not shown) is provided with vertical slit element forming pins at positions corresponding to the vertical slit element forming pin guide holes 26a to 26c.
The vertical slit piece forming pin guide holes 26a to 26c are not completely communicated with each other when the vertical slit piece formed by these is forward-pressed. The length and arrangement of the vertical slits are determined so as to form continuous vertical slits in communication with each other. In addition, the vertical slit piece forming pin guide holes 26a to 26c are arranged so that the upper and lower ends of the continuous vertical slit reach the upper and lower ends of the printed wiring board, and the elongated end members at the left and right ends are completely separated from the mother board. Its length and position are defined.

Horizontal slit segment forming pin guide holes 28a and 28b are provided on the upstream side with respect to the conveying direction of the lower mold 20b of the second mother board processing mold. The upper mold (not shown) is provided with a horizontal slit element forming pin at a position corresponding to the horizontal slit element forming pin guide holes 28a and 28b.
The transverse slit piece forming pin guide holes 28a, 28b are not connected to each other when the transverse slit pieces formed by these are forward-pressed, and after performing the forward-direction press, the reverse-direction press is further performed. When performed, the length and arrangement are determined so as to form a continuous horizontal slit communicating with each other. In addition, the length and position of the horizontal slit piece forming pin guide holes 28a and 28b are determined so that both ends of the continuous horizontal slit communicate with the vertical slit but do not reach both ends of the printed wiring board. ing.

Further, the vertical slit segment forming pin guide holes 26a to 26c and the horizontal slit segment forming pin guide holes 28a and 28b are respectively
(A) At the time when the (2N-1) -th (third) press work (forward press work or reverse press work) is completed, at least one of the vertical slit pieces and the horizontal slit pieces is connected to each other. All the mounting boards in the printed wiring are connected integrally through any part, and
(B) During the 2N-th (fourth) press work (forward press process or reverse direction press process), the longitudinal slit pieces and / or the transverse slit pieces that were not communicated with each other communicated with each other, The length and the arrangement are determined so that the mounting boards that are integrally connected by the vertical slits and / or the horizontal slits are sequentially separated from the printed wiring board.

In the center of the left side of the lower mold 20a of the first mother board processing mold, slit forming pin guide holes 32 for forming slits for stress relaxation are provided on the left and right sides of the mounting board. The upper mold (not shown) is provided with a slit forming pin for punching the slit at a position corresponding to the slit forming pin guide hole 32.
Similarly, slit forming pin guide holes 34a and 34b for forming slits for stress relaxation are provided on the upper and lower sides of the mounting board on the left and upper sides of the lower die 20b of the second mother board processing mold. ing. The upper mold (not shown) is provided with slit forming pins for punching the slits at positions corresponding to the slit forming pin guide holes 34a and 34b.
In the example shown in FIG. 1B, the slit forming pin guide hole 34b has not only a function of forming a slit for stress relaxation in the upper and lower pieces of the mounting board, but also a cut in the outer peripheral portion of the printed wiring board. The length and arrangement of the printed wiring board after cutting the mounting substrate are determined so as to have a function of subdividing the end material of the printed wiring board.

Further, positioning pins 36a, 36b, 36c and 36d used for positioning the printed wiring mother board are erected on the lower die 20a of the first mother board processing mold.
Similarly, positioning pins 36e, 36f, 36g, 36h, 36i, and 36j used for positioning of the printed wiring mother board are erected on the lower mold 20b of the second mother board processing mold.
The positioning pins 36e to 36h are provided at positions corresponding to the positioning pins 36a to 36d provided on the lower mold 20a of the first base plate processing mold. The positioning pins 36i and 36j are used when performing press working for forming a continuous slit at the most distal portion of the printed wiring board. In FIG. 1B, the distance between the positioning pins 36e-36i is the transport distance for step-feeding the printed wiring board.

[1.2.2. Method for Manufacturing Mounting Board Using First Specific Example]
2 to 7 show process diagrams of press working of a printed wiring board using the mold set 10 shown in FIG.
First, as shown in FIG. 2, the printed wiring mother board 100 is mounted on the upper surface of the lower mold 20a of the first mother board processing mold. In the printed wiring board 100, reference holes 102 are formed in advance at positions corresponding to the positioning pins 36a to 36j. The printed wiring board 100 is positioned by inserting positioning pins 36a to 36d provided on the upper surface of the lower mold 20a into the reference holes 102.
In this state, when the first press of the forward press using the first base plate processing mold is performed, the printed circuit board is pushed back by the lower mold strippers 22a to 22c and a punch (not shown). At the same time, through holes are punched by through hole forming pin guide holes 24 and through hole forming pins (not shown), vertical slit piece forming pins 26a to 26c and vertical slit piece forming pins (not shown). The vertical slit piece is punched, and the slit is punched by the slit forming pin guide hole 32 and the slit forming pin (not shown).

Hereinafter, forward pressing is performed while stepping the printed wiring board 100. FIG. 3 shows a state before the final press processing of the forward press using the first base plate processing mold (lower mold 20a).
The printed circuit board 104a, 104b, 104c, etc. punched by the previous pushback process is fitted in the original holes on the printed wiring board 100 before the final press of the forward press. Yes. At the same time, the printed wiring board 100 is formed with through holes 106, vertical slit pieces 108 a to 108 c, and slits 110. At this time, a part of the vertical slit piece 108a formed by the vertical slit piece forming pin 26a and a part of the vertical slit piece 108b formed by the vertical slit piece forming pin 26b communicate with each other, so that a long vertical slit piece is formed. 108a + 108b.
In this state, when the final (third) press process of the forward press using the first base plate processing mold is performed, the last printed circuit boards 104a to 104c are pushed back, the through holes 106 are punched, The vertical slit pieces 108a to 108c are punched and the slits 110 are punched.

Next, the printed wiring mother board 100 is rotated by 180 °, and the reverse direction pressing using the first mother board machining die is performed while stepping the printed wiring mother board 100. FIG. 4 shows a state before the final press working of the reverse direction press using the first base plate working mold (lower mold 20a).
The lower mold strippers 22a to 22c are arranged so that pushback processing is performed at a position different from the forward press in the reversing direction. Therefore, when the forward direction press and the reverse direction press are finished, the printed circuit boards 104a to 104c are in a state of being pushed back in a zigzag manner.
At the same time, through holes 106 and slits 110 are newly formed in the printed wiring board 100.

Further, on the left side of the printed wiring board 100, a space between the vertical slit pieces 108c formed by the forward direction press is cut by the vertical slit pieces (108a + 108b) formed at the time of the reverse direction press. 108c + (108a + 108b).
Similarly, on the right side of the printed wiring mother board 100, the vertical slit pieces (108a + 108b) formed by the forward direction press are cut by the vertical slit pieces 108c formed at the time of the reverse direction press, and continuous vertical lengths are formed. Slit (108a + 108b) + 108c. As a result, the elongated end members 100 a and 100 b are separated from both ends of the printed wiring board 100.

Next, the printed wiring mother board 100 is rotated by 180 ° again, and forward pressing using a second mother board machining die is performed.
First, as shown in FIG. 5, the printed wiring mother board 100 is placed on the upper surface of the lower mold 20b of the second mother board processing mold. At this time, the positioning pins 36 i and 36 j are inserted into the reference holes at the forefront of the printed wiring motherboard 100. In FIG. 5, for ease of viewing, the printed circuit board pushed back by the first mother board machining die is hatched. The same applies to FIGS.
When the first press is performed in this state, the horizontal slit piece is formed at the forefront of the printed wiring board 100 by the horizontal slit piece forming pin guide holes 28a and 28b and the horizontal slit piece forming pin (not shown). It is formed.

Hereinafter, forward pressing is performed while stepping the printed wiring board 100. FIG. 6 shows a state before the final press processing of the forward press using the second base plate processing die (lower die 20b).
The lower mold strippers 22d to 22f are arranged so that pushback processing is performed at positions different from the lower mold strippers 22a to 22c of the first mother board processing mold. Therefore, when the forward pressing is finished, the printed circuit boards 104d, 104e,..., 104f, are newly pushed back in an area that is not processed by the first base plate processing mold.
At the same time, through-holes 106 and slits 112a, 112b, ... are newly formed in the printed wiring board 100.
Further, lateral slit pieces 114a... 114b. In addition, since the length and arrangement of the vertical slit piece forming pin guide holes 26a to 26c and the horizontal slit piece forming pin guide holes 28a and 28b are optimized, the individual mounting boards can be separated at this point. It is in an integrated state.

Finally, the printed wiring mother board 100 is rotated again by 180 °, and the reverse direction pressing is performed using the second mother board machining die while stepping the printed wiring mother board 100. FIG. 7 shows a state before the final press working in the reverse direction press using the second base plate working die (lower die 20b).
The lower mold strippers 22d to 22f are arranged so that pushback processing is performed at a position different from the forward press in the reverse press. Therefore, when the forward press and the reverse press are finished, the printed circuit boards 104d to 104f are newly pushed back in a staggered manner in the region not processed by the first base plate processing mold.
At the same time, through-holes 106 and slits 112a, 112b, ... are newly formed in the printed wiring board 100.
Further, lateral slit pieces 114a... 114b. In addition, since the length and arrangement of the vertical slit piece forming pin guide holes 26a to 26c and the horizontal slit piece forming pin guide holes 28a, 28b are optimized, the mounting substrate 140... Are sequentially separated from the printed wiring board 100. Further, the end materials 100 c and 100 d are cut off from the upper and lower ends of the printed wiring board 100.

  By the above method, the mounting boards 140... In which the printed circuit boards 104a to 104f pushed back are temporarily fixed to the frame portion are obtained. The obtained mounting substrates 140 are sent to an automatic mounting process, and various electronic components are mounted on the surface. After completion of automatic mounting, the frame portion and the printed circuit board can be separated by breaking the frame portion, and the separated printed circuit board can be incorporated into various electronic devices.

[1.2.3. Operation of First Specific Example]
The punching process can be performed only with a load (shear load) for shearing the printed wiring board. On the other hand, in the pushback process, in order to return the punched printed circuit board to the original hole by the biasing force of the elastic member, in addition to the shear load, there is also a load for pushing down the stripper against the biasing force of the elastic member. Necessary. Therefore, when manufacturing a mounting board on which a printed circuit board is pushed back, a press machine having a larger capacity is required as the number and area of printed circuit boards to be pushed back are increased.
On the other hand, the pushback means is distributed and arranged in N molds, and the individual printed circuit boards are pushed back by N times of forward pressing and N times of reverse pressing. Compared with a case where all printed circuit boards are pushed back by a single press process, the press pressure can be reduced to about 1 / 2N. Therefore, an extremely large mounting board on which a large number of printed circuit boards are pushed back can be manufactured without any restriction on the press capability, as long as the conveyance of the mother board is not hindered. In addition, it is not necessary to make a new capital investment in order to manufacture a large mounting board.

Further, at the same time, when the vertical slit piece forming means and the horizontal slit piece forming means are distributed and arranged in N base metal molds, two or more forward presses or reverse presses are completed. At that time, a side parallel to the transport direction of the mounting substrate and a side vertical to the mounting substrate can be formed at the same time.
In addition, when the length and arrangement of the vertical slit piece forming means and the horizontal slit piece forming means are optimized, the individual mounting substrates are joined in any part before the final press processing is performed, and the final press At the time of processing, the individual mounting boards can be sequentially separated. Therefore, conveyance of the mother board in the middle of processing becomes extremely easy.

Furthermore, the means for that can be arrange | positioned to one metal mold | die so that the pushback process of a printed circuit board and formation of a vertical slit piece and a horizontal slit piece may be performed by one press. However, in order to perform such a plurality of processes with a single press, it is necessary to form various through holes densely in the mold. When the through holes are densely packed, the wall thickness between the through holes is reduced, and the mold strength is remarkably lowered.
On the other hand, when various processing means are distributed and arranged in N molds, the mold manufacturing cost increases, but it is not necessary to form various through holes in the mold. Therefore, complicated processing is possible without reducing the durability of the mold.

2 to 7, (1) forward press using a first base plate processing mold, (2) reverse direction press using a first base plate processing mold, and (3) first Although the example of processing in the order of the forward direction press using the mold for 2 base plate processing and the reverse direction press using the mold for the second base plate processing is shown, even if these orders are changed, Similar effects can be obtained.
Also, for example, in the mold set 10 shown in FIG. 1, if either one of the vertical slit piece forming means or the horizontal slit piece forming means is omitted, the mounting set having only continuous horizontal slits or continuous vertical slits. An assembly of substrates is obtained.

[1.3. Second Specific Example of Mold Set (1)]
[1.3.1. Configuration of Second Specific Example]
FIG. 8 shows a second specific example of the mold set according to the present embodiment. In FIG. 8, the mold set 10a includes a first mother board machining mold (only the lower mold 20a is shown in FIG. 8A) and a second mother board machining mold (FIG. 8B). And only a lower mold 20b) and a third base plate processing mold (only the lower mold 20c is shown in FIG. 8C). In FIG. 8, portions corresponding to those in FIG.
The mold set 10a basically includes a mold described in Patent Document 3, which is divided into a left part, a middle part, and a right part with respect to the transport direction, and a total of six pushback means are provided for the first to third mothers. Two pieces are dispersed and arranged in each plate processing mold.
The mold set 10a is for manufacturing a mounting substrate by a total of six press processes including a forward press and a reverse press using the first to third base plate processing molds.

The first to third molds for processing the mother board and the upper mold (not shown) are respectively the first processing region 12 on the upstream side with respect to the conveyance direction of the printed wiring mother board and the second on the downstream side with respect to the conveyance direction. It is a processing region 14.
The “first processing region 12” refers to a processing region disposed on the upstream side with respect to the transport direction of the printed wiring mother board and having an area equal to or larger than the mounting substrate.
The “second processing region 14” refers to a processing region disposed on the downstream side with respect to the transport direction of the printed wiring mother board and having an area equal to or larger than the mounting substrate.
Depending on the shape, arrangement, processing method, etc. of the printed circuit board formed in the mounting board, even a mold having only a processing area for one mounting board (for example, the mold shown in FIG. 1) can be used. The method according to the invention can be carried out. However, the processing region of the first to third base plate processing molds is divided into the first processing region 12 and the second processing region 14, and the printed wiring base plate is formed in both the first processing region 12 and the second processing region 14. If these processes are performed sequentially, the function can be shared between the first process area 12 and the second process area 14. For this reason, it is possible to perform complicated processing on the printed wiring board without significantly complicating the structure of the mold or reducing the durability.

A lower mold stripper 22d for pushing back the printed circuit board is embedded in the first processing area 12 of the lower mold 20a of the first mother board processing mold, and the lower mold stripper 22a is embedded in the second processing area 14. Is buried.
Similarly, a lower mold stripper 22e for pushing back the printed circuit board is embedded in the first processing area 12 of the lower mold 20b of the second mother board processing mold, and the second processing area 14 includes a lower mold strip 22e. A mold stripper 22b is embedded.
Similarly, a lower mold stripper 22f for pushing back the printed circuit board is embedded in the first processing area 12 of the lower mold 20c of the third mother board processing mold, and the second processing area 14 includes A lower mold stripper 22c is embedded.

The lower mold strippers 22a to 22f are respectively
(A) When the printed wiring board is forwardly fed, the first printed circuit board can be pushed back in a part of the region to be the mounting board; and
(B) When the printed wiring board is fed forward and then the printed wiring board is further fed in the reverse direction, the second printed circuit board is newly pushed back in the blank portion in the region to be the mounting board. Arranged to be able to do.

  Furthermore, lower mold strippers 22a and 22d provided in the lower mold 20a of the first mother board processing mold, lower mold strippers 22b and 22e provided in the lower mold 20b of the second mother board processing mold, and The lower mold strippers 22c and 22f provided on the lower mold 20c of the third mother board machining mold perform pushback processing of a new printed circuit board from the printed wiring mother board in different portions (blank portions). It is arranged to be able to.

Each of the lower molds 20a to 20c is provided with a plurality of through-hole forming pin guide holes 24. The through hole forming pin guide holes 24 provided in the first processing region 12 of the lower mold 20a are for forming a through hole in a printed circuit board pushed back by the lower mold stripper 22a of the second processing region 14. It is. Similarly, the through-hole forming pin guide holes 24 provided in the second processing region 14 of the lower mold 20a form a through-hole in the printed circuit board pushed back by the lower mold stripper 22d of the first processing region 12. Is for. These through-hole forming pin guide holes 24 can be provided as necessary.
The same applies to the through hole forming pin guide holes 24 provided in the lower molds 20b and 20c.

Longitudinal slit piece forming pin guide holes 26a and 26b are provided on the left side with respect to the conveying direction of the lower mold 20a of the first base plate processing mold. Further, on the right side with respect to the conveying direction of the lower mold 20b of the second mother board processing mold, vertical slit piece forming pin guide holes 26c, 26d are provided.
The vertical slit piece forming pin guide holes 26a and 26b provided in the lower die 20a communicate with the vertical slit piece formed by these during the forward pressing, but the length of the vertical slit piece forming pin guide holes 26a and 26b is not long. The length and arrangement are determined. This also applies to the vertical slit segment forming pin guide holes 26c and 26d provided in the lower mold 20b.
In addition, the longitudinal slit piece forming pin guide holes 26a to 26d are forward-pressed with the lower mold 20a (or the lower mold 20b) and then subjected to the reverse direction pressing with the lower mold 20b (or the lower mold 20a). The length and arrangement of the vertical slit pieces are determined so that the vertical slit pieces are completely connected to form a continuous vertical slit.
Further, the length and arrangement of the vertical slit piece forming pin guide holes 26a to 26d are determined so that both ends of the continuous vertical slit do not penetrate the upper and lower ends of the printed wiring board.

On the boundary line between the first processing region 12 and the second processing region 14 of the lower mold 20c of the third base plate processing mold, horizontal slit element forming pin guide holes 28a, 28b are provided.
The transverse slit piece forming pin guide holes 28a and 28b are not connected to each other when the transverse slit pieces formed by these are forward-pressed, and after the forward-direction press is performed, the reverse-direction press is further performed. When performed, the length and arrangement are determined so as to form a continuous horizontal slit communicating with each other.
In addition, the horizontal slit piece forming pin guide holes 28a and 28b have their lengths and positions determined so that both ends of the continuous horizontal slit communicate with the vertical slit but do not reach both ends of the printed wiring board. Yes.

Further, the vertical slit segment forming pin guide holes 26a to 26d and the horizontal slit segment forming pin guide holes 28a and 28b are respectively
(A) When the (2N-1) -th (fifth) press work (forward press process or reverse press process) is completed, at least one of the vertical slit pieces and the horizontal slit pieces is connected to each other. All the mounting boards in the printed wiring are connected integrally through any part, and
(B) During the 2N-th (sixth) press work (forward press process or reverse press process), the longitudinal slit pieces and / or the transverse slit pieces that were not communicated with each other communicated with each other, The length and the arrangement are determined so that the mounting boards that are integrally connected to each other are successively separated from the printed wiring board by the continuous vertical slit and / or the horizontal slit.

On the left side of the lower mold 20b of the second mother board processing mold, slit forming pin guide holes 32 for forming slits for stress relaxation are provided on the left and right sides of the mounting board.
Similarly, slit forming pin guide holes 34a and 34b for forming slits for stress relaxation are provided on the upper and lower sides of the mounting board on the left side of the lower die 20a of the first base plate processing mold. Yes.
In the example shown in FIG. 8A, the slit forming pin guide holes 34a and 34b can form slits for stress relaxation in the upper and lower pieces of the mounting board, and the outer periphery of the printed wiring board. The length and the arrangement are determined so as not to cut the portion (that is, so that a square end material remains when all the press work is finished).

Further, positioning pins 36a, 36b, 36c, and 36d used for positioning the printed wiring board are provided upright in the second processing region 14 of the lower mold 20a. Further, positioning pins 36e, 36f, 36g, and 36h are erected in positions corresponding to the positioning pins 36a to 36d in the first processing region 12 of the lower mold 20a.
Similarly, positioning pins 36a to 36h are erected on the lower molds 20b and 20c, respectively, at positions corresponding to the lower mold 20a.
In FIG. 8, the distance between the positioning pins 36b-36f is the transport distance for step-feeding the printed wiring board.
Since other points are the same as those of the first specific example, description thereof is omitted.

[1.3.2. Method for Manufacturing Mounting Board Using Second Specific Example]
9 to 14 show process diagrams of press working of the printed wiring board using the mold set 10a shown in FIG.
First, while the printed wiring mother board 100 is stepped, the forward pressing is performed using the first mother board machining die. FIG. 9 shows a state before the final press processing of the forward press using the first base plate processing mold (lower mold 20a).
When the forward pressing is performed using the first base plate processing mold, the printed circuit boards 104a, 104d, ... are pushed back by the lower mold strippers 22a, 22d. At the same time, the vertical slit pieces 108a,..., 108b are punched out by the vertical slit piece forming pin guide holes 26a, 26b. The vertical slit piece 108b formed by the immediately preceding press is connected to a newly formed vertical slit piece 108a, thereby forming a vertical slit piece 108a + 108b whose length is extended in the transport direction. At the same time, the through holes 106 are punched and the slits 112a, 112b are punched.

Next, forward pressing using the second mother board machining die is performed while stepping the printed wiring mother board 100. FIG. 10 shows a state before the final press processing of the forward press using the second base plate processing die (lower die 20b).
When the forward pressing is performed using the second base plate processing mold, the new printed circuit boards 104b, 104e, ... are pushed back by the lower mold strippers 22b, 22e. At the same time, the vertical slit pieces 108c, 108d, ... are punched out by the vertical slit piece forming pin guide holes 26c, 26d. The vertical slit piece 108d formed by the immediately preceding press is connected to a newly formed vertical slit piece 108c, thereby forming a vertical slit piece 108c + 108d whose length is extended in the transport direction. At the same time, the through holes 106 are punched and the slits 110 are punched. The left end of the punched slit 110 communicates with the vertical slit pieces 108a + 108b.

Next, a forward press using a third base plate machining die is performed while stepping the printed wiring base plate 100. FIG. 11 shows a state before the final press working of the forward press using the third base plate working mold (lower mold 20c).
When the forward pressing is performed using the third base plate processing mold, pushback processing of new printed circuit boards 104c, 104f, ... is performed by the lower mold strippers 22c, 22f. At the same time, the horizontal slit pieces 1114a, 114b,... Are punched out by the horizontal slit piece forming pin guide holes 28a, 28b. At this time, the right end of the punched horizontal slit piece 114b communicates with the vertical slit piece 180c + 108d. At the same time, the through holes 106 are punched.

Next, the printed wiring mother board 100 is rotated by 180 °, and the reverse direction pressing using the first mother board machining die is performed while stepping the printed wiring mother board 100. FIG. 12 shows a state before the final press working in the reverse direction press using the first base plate working die (lower die 20a). In FIG. 12, a printed circuit board formed by three forward presses is hatched for easy viewing. This also applies to FIGS. 13 and 14.
When reverse direction pressing is performed using the first base plate processing mold, pushback processing of new printed circuit boards 104a, 104d, etc. is performed by the lower mold strippers 22a, 22d in the blank portion. At the same time, the space between the vertical slit pieces 108c + 108d formed by the forward press is punched out by the vertical slit piece forming pin guide holes 26a, 26b to form continuous vertical slits (108c + 108d) + (108a + 108b). At the same time, punching of the through-holes 106 and punching of the slits 112a, 112b, etc. are newly performed, and the slits 112a, 112b,... Communicate with the horizontal slit element 114b.

Next, the reverse direction press using the 2nd mother board processing metal mold | die is performed while stepping the printed wiring mother board 100. FIG. FIG. 13 shows a state before the final press working in the reverse direction press using the second base plate working die (lower die 20b).
When reverse direction pressing is performed using the second base plate processing mold, pushback processing of new printed circuit boards 104b, 104e, ... is performed by the lower mold strippers 22b, 22e in the blank portion. At the same time, the space between the vertical slit pieces 108a + 108b formed by the forward press is punched out by the vertical slit piece forming pin guide holes 26c, 26d to form continuous vertical slits (108a + 108b) + (108c + 108d). At the same time, the through holes 106 are punched and the slits 110 are punched, and the slits 110 communicate with the vertical slits (108c + 108d) + (108a + 108b).
In addition, since the length and arrangement of the vertical slit piece forming pin guide holes 26a to 26d and the horizontal slit piece forming pin guide holes 28a and 28b are optimized, the individual mounting boards can be separated at this point. It is in an integrated state.

Finally, reverse direction pressing is performed using the third base plate processing mold while stepping the printed wiring base plate 100. FIG. 14 shows a state before the final press working in the reverse direction press using the third base plate working die (lower die 20c).
When the reverse direction pressing is performed using the third base plate processing mold, pushback processing of new printed circuit boards 104c, 104f, ... is performed by the lower mold strippers 22c, 22f. At the same time, the transverse slit piece 114a and the transverse slit piece 114b formed by the forward pressing are punched out by the transverse slit piece forming pin guide holes 28a and 28b to form continuous transverse slits 114a and 114b. At the same time, the through holes 106 are punched out.
Moreover, since the length and arrangement of the vertical slit piece forming pin guide holes 26a to 26d and the horizontal slit piece forming pin guide holes 28a, 28b are optimized, the mounting substrate 140 ... Are sequentially separated from the printed wiring board 100. Furthermore, after all the mounting boards 140 are cut out, a continuous square end material 100e remains.

  By the above method, the mounting boards 140... In which the printed circuit boards 104a to 104f pushed back are temporarily fixed to the frame portion are obtained. The obtained mounting substrates 140 are sent to an automatic mounting process, and various electronic components are mounted on the surface. After completion of automatic mounting, the frame portion and the printed circuit board can be separated by breaking the frame portion, and the separated printed circuit board can be incorporated into various electronic devices.

[1.3.3. Operation of the second specific example]
When the pushback means is distributed and arranged in N molds, and the individual printed circuit boards are pushed back by N times of forward pressing and N times of reverse pressing, once Compared to the case where all the printed circuit boards are pushed back by this pressing, the pressing pressure can be reduced to about 1 / 2N. Therefore, an extremely large mounting board on which a large number of printed circuit boards are pushed back can be manufactured without any restriction on the press capability, as long as the conveyance of the mother board is not hindered.

At the same time, when the vertical slit piece forming means and the horizontal slit piece forming means are distributed and arranged in N base metal molds, the mounting substrate is transported when the final pressing is completed. A side parallel to the direction and a side perpendicular to the direction can be formed at the same time.
In addition, when the length and arrangement of the vertical slit piece forming means and the horizontal slit piece forming means are optimized, the individual mounting substrates are joined in any part before the final press processing is performed, and the final press At the time of processing, the individual mounting boards can be sequentially separated. Therefore, conveyance of the mother board in the middle of processing becomes extremely easy.

  Furthermore, when various processing means are distributed and arranged in N molds, the cost for manufacturing the molds increases, but it is not necessary to form various through holes in the molds. Therefore, complicated processing is possible without reducing the durability of the mold.

In addition, in FIGS. 9-14,
(1) A forward press using the first base plate processing mold,
(2) A forward press using a second base plate machining die,
(3) A forward press using a third base plate machining die,
(4) Reversing direction press using the first base plate processing mold,
(5) Reversing direction press using the second base plate processing mold,
(6) Reversing direction press using the third base plate processing mold,
Although an example of processing in the order is shown, the same effect can be obtained even if these orders are changed.
Also, for example, in the mold set 10a shown in FIG. 8, if either one of the vertical slit piece forming means or the horizontal slit piece forming means is omitted, the mounting set having only continuous horizontal slits or continuous vertical slits is provided. An assembly of substrates is obtained.

[1.4. Third Specific Example of Mold Set (1)]
[1.4.1. Configuration of Third Specific Example]
FIG. 15 shows a third specific example of the mold set according to the present embodiment. In FIG. 15, the mold set 10b includes a first base plate processing mold (only the lower mold 20a is shown in FIG. 15A) and a second base plate processing mold (FIG. 15B). , Only the lower mold 20b is shown). In FIG. 15, parts corresponding to those in FIG. 1 are denoted by the same reference numerals as those in FIG.
The mold set 10b basically divides the push-back means of the mold described in Patent Document 3 into a zigzag shape, and a total of six push-back means are used for the first to second mother board machining dies. Three pieces are distributed and arranged in the mold.
The mold set 10b is for manufacturing a mounting substrate by a total of four press processes including a forward press and a reverse press using the first and second mother board processing molds.

The first and second molds for processing the mother board and the upper mold (not shown) are respectively the first processing region 12 on the upstream side with respect to the conveyance direction of the printed wiring mother board and the second on the downstream side with respect to the conveyance direction. It is a processing region 14.
A lower mold stripper 22e for pushing back the printed circuit board is embedded in the first machining area 12 of the lower mold 20a of the first mother board machining mold, and the lower mold stripper 22a, 22c is buried.
Similarly, lower mold strippers 22d and 22f for pushing back the printed circuit board are embedded in the first processing area 12 of the second mother board processing mold 20b, and the lower mold stripper is embedded in the second processing area 14. 22b is buried.

The lower mold strippers 22a to 22f are respectively
(A) When the printed wiring board is forwardly fed, the first printed circuit board can be pushed back in a part of the region to be the mounting board; and
(B) When the printed wiring board is forwardly fed and then the printed wiring board is fed in the reverse direction, the second printed circuit board is newly pushed back in the blank portion in the region to be the mounting board. Arranged to be able to.

  Furthermore, lower mold strippers 22a, 22c, 22e provided on the lower mold 20a of the first mother board processing mold, and lower mold strippers 22b provided on the lower mold 20b of the second mother board processing mold, 22d and 22f are arranged so that pushback processing of a new printed circuit board can be performed from the printed wiring board at different portions (blank portions).

  Each of the lower dies 20a and 20b is provided with a plurality of through-hole forming pin guide holes 24. The through hole forming pin guide holes 24 provided in the lower mold 20a of the first mother board machining mold (lower mold 20b of the second mother board machining mold) are respectively the second mother board machining molds. The through hole is formed in the printed circuit board pushed back by the lower mold 20b (the lower mold 20a of the first mother board processing mold). These through-hole forming pin guide holes 24 can be provided as necessary.

A vertical slit piece forming pin guide hole 26a is provided on the left side in the conveyance direction of the second processing region 14 of the lower mold 20a. Further, a vertical slit piece forming pin guide hole 26b is provided on the right side with respect to the conveying direction of the second processing region 14 of the lower mold 20b.
The vertical slit piece forming pin guide hole 26a provided in the lower mold 20a and the vertical slit piece forming pin guide hole 26b provided in the lower mold 20b are forward-pressed by the lower mold 20a (or the lower mold 20b). After that, when the reversal direction pressing is performed with the lower mold 20b (or the lower mold 20a), the length and the arrangement are determined so that the vertical slit piece completely penetrates and becomes a continuous vertical slit.
Further, the length and arrangement of the vertical slit piece forming pin guide holes 26a and 26b are determined so that both ends of the continuous vertical slit do not penetrate the upper and lower ends of the printed wiring board.

On the boundary line between the first machining area 12 and the second machining area 14 of the lower mold 20a of the first mother board machining die, a horizontal slit element forming pin guide hole 28b is provided.
Similarly, on the boundary line between the first processing region 12 and the second processing region 14 of the lower mold 20b of the second base plate processing mold, a horizontal slit element forming pin guide hole 28a is provided.
The lateral slit piece forming pin guide holes 28a, 28b become continuous lateral slits in communication with each other when the forward press and the reverse press using the first to second base plate machining dies are performed. The length and arrangement are determined as follows.
The length and arrangement of the horizontal slit piece forming pin guide holes 28a and 28b are determined so that both ends of the continuous horizontal slit communicate with the vertical slit but do not reach both ends of the printed wiring board. Yes.

An intermediate vertical slit segment forming pin guide hole 30 is provided in the second processing region 14 of the lower mold 20b of the second base plate processing mold.
The intermediate vertical slit piece forming pin guide hole 30 does not communicate with each other when the intermediate vertical slit piece punched out by this is forward-pressed using the second base plate processing mold, but further presses in the reverse direction. The length and arrangement of the intermediate longitudinal slits are determined so that the intermediate longitudinal slits are continuous with each other when they are performed.
Also, the length and arrangement of the intermediate vertical slit piece forming pin guide hole 30 are determined so that both ends of the continuous intermediate vertical slit communicate with the horizontal slit but do not reach the upper and lower ends of the printed wiring board. It has been.

Further, the vertical slit segment forming pin guide holes 26a, 26b, the horizontal slit segment forming pin guide holes 28a, 28b, and the intermediate vertical slit segment forming pin guide holes 30, respectively,
(A) When the (2N-1) -th (third) press work (forward press work or reverse press work) is completed, of the vertical slit pieces, horizontal slit pieces, and intermediate vertical slit pieces At least one of them is not in communication with each other, all the mounting boards in the printed wiring are integrally connected via any part, and
(B) During the 2N-th (fourth) press work (forward press work or reverse press work), the longitudinal slit pieces, the transverse slit pieces and / or the intermediate longitudinal slit pieces that were not communicated with each other Communicating into continuous vertical slits, horizontal slits, and / or intermediate vertical slits, the length and arrangement so that the mounting boards that are integrally connected are sequentially separated from the printed wiring board. Is stipulated.

On the right side of the lower mold 20a of the first mother board processing mold, slit forming pin guide holes 32 for forming slits for stress relaxation are provided on the left and right sides of the mounting board.
Similarly, slit forming pin guide holes 34a and 34b for forming slits for stress relaxation on the upper and lower sides of the mounting board are respectively provided on the upper left and upper sides of the lower mold 20b of the second mother board processing mold. Is provided.
In the example shown in FIG. 15A, the slit forming pin guide holes 34a and 34b can form slits for stress relaxation in the upper and lower pieces of the mounting board, and the outer periphery of the printed wiring board. The length and arrangement are determined so as not to cut the part.

Further, positioning pins 36a, 36b, 36c, and 36d used for positioning the printed wiring board are provided upright in the second processing region 14 of the lower mold 20a. Further, positioning pins 36e, 36f, 36g, and 36h are erected in positions corresponding to the positioning pins 36a to 36d in the first processing region 12 of the lower mold 20a.
Similarly, positioning pins 36a to 36h are erected on the lower mold 20b at positions corresponding to the lower mold 20a.
In FIG. 15, the distance between the positioning pins 36b-36f is the transport distance for step-feeding the printed wiring board.
Since other points are the same as those of the first specific example and the second specific example, description thereof will be omitted.

[1.4.2. Manufacturing Method of Mounting Board Using Third Specific Example]
16 to 19 show process drawings of press working of a printed wiring board using the mold set 10b shown in FIG.
First, while the printed wiring mother board 100 is stepped, the forward pressing is performed using the first mother board machining die. FIG. 16 shows a state before the final press working of the forward press using the first base plate working mold (lower mold 20a).
When the forward pressing is performed using the first base plate processing mold, the printed circuit boards 104a, 104c, 104e, ... are pushed back by the lower mold strippers 22a, 22c, 22e. At the same time, the vertical slit element 108a is punched by the vertical slit element forming pin guide hole 26a, and the horizontal slit element 114b is punched by the horizontal slit element forming pin guide hole 28b. At the same time, the through holes 106 are punched and the slits 110 are punched.

Next, the printed wiring mother board 100 is rotated by 180 °, and the reverse direction pressing using the first mother board machining die is performed while stepping the printed wiring mother board 100. FIG. 17 shows a state before the final press working in the reverse direction press using the first base plate working die (lower die 20a).
When reverse direction pressing is performed using the first base plate processing mold, pushback processing of new printed circuit boards 104a, 104c, 104e, ... is performed by the lower mold strippers 22a, 22c, 22e. At the same time, new punching of the vertical slit pieces 108a and the horizontal slit pieces 114b is performed. At this time, the vertical slit piece 108a (or horizontal slit piece 114b) punched by the immediately preceding press and the newly punched horizontal slit piece 114b (or vertical slit piece 108a) are connected. At the same time, the through holes 106 are punched and the slits 110 are punched. The right end of the newly punched slits 110 communicates with the vertical slit pieces 108a.

Next, the printed wiring mother board 100 is rotated again by 180 °, and the forward pressing using the second mother board machining die is performed while stepping the printed wiring mother board 100. FIG. 18 shows a state before the final press processing of the forward press using the second base plate processing mold (lower mold 20a). In FIG. 18, for ease of viewing, the printed circuit board pushed back by the first mother board machining die is hatched. This also applies to FIG.
When the forward pressing is performed using the second base plate processing mold, pushback processing of new printed circuit boards 104b, 104d, 104f, ... is performed by the lower mold strippers 22b, 22d, 22f. At the same time, the vertical slit piece 108b is punched out by the vertical slit piece forming pin guide hole 26b, the horizontal slit piece 114a is punched out by the horizontal slit piece forming pin guide hole 28a, and the intermediate vertical slit piece forming pin guide is guided. The intermediate longitudinal slit piece 116 is punched out by the hole 30. At this time, at the right end of the printed wiring board 100, the already punched vertical slit piece 108a communicates with the newly punched vertical slit piece 108b to form a continuous vertical slit 108a + 108b. Further, in the left half of the printed wiring mother board 100, the already punched lateral slit piece 114b and the newly punched lateral slit piece 114a communicate with each other to form a lateral slit piece 114a + 114b having an extended length. Further, one end of the newly punched intermediate longitudinal slit 116 communicates with the lateral slit piece 114a + 114b.
At the same time, the through holes 106 are punched and the slits 112a, 112b are punched.
In addition, the length and arrangement of the vertical slit piece forming pin guide holes 26a and 26b, the horizontal slit piece forming pin guide holes 28a and 28b, and the intermediate vertical slit piece forming pin guide holes 30 are optimized. At this time, the individual mounting boards are not separated and are in an integrated state.

Finally, the printed wiring mother board 100 is rotated again by 180 °, and a reverse direction press using the second mother board machining die is performed while stepping the printed wiring mother board 100. FIG. 19 shows a state before the final press working in the reverse direction press using the second base plate working die (lower die 20b).
When reverse direction pressing is performed using the second base plate processing mold, new printed circuit boards 104b, 104d, 104f, ... are pushed back by the lower mold strippers 22b, 22d, 22f. At the same time, the vertical slit pieces 108b, the horizontal slit pieces 114a, and the intermediate vertical slits 116 are newly punched. At the same time, the through holes 106 are punched and the slits 112a, 112b are punched.
Moreover, since the length and arrangement of the vertical slit piece forming pin guide holes 26a to 26b, the horizontal slit piece forming pin guide holes 28a and 28b, and the intermediate vertical slit piece 30 are optimized, each press The mounting boards 140a arranged in two rows are sequentially separated from the printed wiring board 100 for each processing. Furthermore, after all the mounting boards 140a are cut out, the continuous square end material 100e remains.

  By the above method, the mounting boards 140a... In which the printed circuit boards 104a to 104f pushed back are temporarily fixed to the frame portion are obtained. The obtained mounting boards 140a are sent to an automatic mounting process, and various electronic components are mounted on the surface. After completion of automatic mounting, the frame portion and the printed circuit board can be separated by breaking the frame portion, and the separated printed circuit board can be incorporated into various electronic devices.

[1.4.3. Operation of third specific example]
When the pushback means is distributed and arranged in N molds, and the individual printed circuit boards are pushed back by N times of forward pressing and N times of reverse pressing, once Compared to the case where all the printed circuit boards are pushed back by this pressing, the pressing pressure can be reduced to about 1 / 2N. Therefore, an extremely large mounting board on which a large number of printed circuit boards are pushed back can be manufactured without any restriction on the press capability, as long as the conveyance of the mother board is not hindered.

At the same time, when the vertical slit piece forming means, the horizontal slit piece forming means, and the intermediate vertical slit piece forming means are arranged dispersed in N base metal molds, a plurality of forward presses are performed. When the processing or the reverse direction press processing is completed, the side parallel to the mounting direction of the mounting substrate, the vertical side, and the intermediate side can be formed simultaneously.
In addition, if the length and arrangement of the vertical slit piece forming means, the horizontal slit piece forming means, and the intermediate vertical slit piece forming means are optimized, any of the individual mounting substrates is used before the final press processing is performed. In this state, the individual mounting substrates can be sequentially separated at the time of final pressing. Therefore, conveyance of the mother board in the middle of processing becomes extremely easy.

  Furthermore, when various processing means are distributed and arranged in N molds, the cost for manufacturing the molds increases, but it is not necessary to form various through holes in the molds. Therefore, complicated processing is possible without reducing the durability of the mold.

16 to 19, (1) forward press using the first base plate processing die, (2) reverse direction press using the first base plate processing die, and (3) first press. Although the example of processing in the order of the forward direction press using the mold for 2 base plate processing and the reverse direction press using the mold for the second base plate processing is shown, even if these orders are changed, Similar effects can be obtained.
Further, for example, in the mold set 10b shown in FIG. 15, if either one of the vertical slit piece forming means or the horizontal slit piece forming means is omitted, a continuous horizontal slit or a continuous vertical slit and a continuous intermediate vertical piece are provided. An assembly of mounting boards having slits is obtained.

[2. Mold set (2)]
[2.1. Basic configuration]
The mold set according to the second embodiment of the present invention has the following configuration.
(1) The mold set consists of N (N ≧ 2) mother board machining dies, and the printed wiring mother boards are sequentially arranged with respect to the same printed wiring mother board using each mother board machining mold. Used to manufacture a mounting board in which a push-back printed circuit board is temporarily fixed to a frame portion from a printed wiring board by performing N times of forward pressing, which performs pressing while feeding the direction. It is done.
(2) Each of the N mother board processing molds has at least one pushback means for punching out the printed circuit board from the printed wiring board and fitting the punched printed circuit board into the original hole. Prepared,
The push-back means provided in the i-th (1 ≦ i ≦ N) mother board machining die is the push-back means provided in the j-th (1 ≦ j ≦ N, j ≠ i) mother board machining die. In a portion different from the portion to be pushed back by the back means, the printed circuit board is arranged so that a new printed circuit board can be pushed back.
(3) The mold set is one or more of N mother board machining molds.
A vertical slit piece forming means for forming a vertical slit piece parallel to the transport direction of the printed wiring board on at least one side end of the printed wiring board, and
Any one of the horizontal slit piece forming means for forming the horizontal slit piece perpendicular to the transport direction of the printed wiring board is provided.
(4) The vertical slit segment forming means performs the press processing (forward press processing or reverse direction press processing) twice or more using the same or different base plate processing molds so that the vertical slit segments are mutually connected. Communicating, arranged in the same or different mother board processing mold so as to be a continuous vertical slit that becomes the reference side (side parallel to the transport direction) of the mounting substrate,
The horizontal slit piece forming means communicates with each other by performing press processing (forward press processing or reverse direction press processing) twice or more using the same or different base plate processing molds. They are arranged on the same or different base plate processing molds so as to form a continuous horizontal slit that becomes a reference side (side perpendicular to the transport direction) of the mounting substrate.

The mold set according to the present embodiment may further include the following configuration.
(3 ′) The mold set includes both the vertical slit piece forming means and the horizontal slit piece forming means in any one or more of the N mother board processing molds.
(5) The vertical slit piece forming means and the horizontal slit piece forming means are:
(A) At the time when the (N-1) -th press work (forward press work or reverse press work) is completed, at least one of the vertical slit pieces and the horizontal slit pieces is not communicated with each other, and printing is performed. All the mounting boards in the wiring mother board are integrally connected via any part, and
(B) In the N-th press work (forward press work or reverse press work), the vertical slit pieces and / or the horizontal slit pieces that were not communicated with each other communicated with each other, and each continuous vertical slit. And / or it becomes a horizontal slit, and it arrange | positions to the same or different mother board processing metal mold | die so that the mounting board | substrate connected integrally by this may be cut | disconnected sequentially from a printed wiring mother board.

The mold set according to the present embodiment may further include the following configuration.
(6) The mold set includes intermediate vertical slit pieces parallel to the conveyance direction of the printed wiring mother board at the intermediate part of the printed wiring mother board in any one or more of the N mother board machining dies. An intermediate longitudinal slit piece forming means for forming
The intermediate vertical slit piece forming means communicates with each other by performing press processing (forward press processing or reverse direction press processing) two or more times using the same or different base plate processing molds. And it is arrange | positioned at the same or different mother board processing metal mold | die so that it may become the continuous intermediate | middle vertical slit used as the reference | standard side (side parallel to a conveyance direction) of the board | substrate for mounting.
(5 ′) Vertical slit piece forming means, horizontal slit piece forming means, and intermediate vertical slit piece forming means are:
(A) When the (N-1) -th press work (forward press work or reverse press work) is completed, at least one of the vertical slit piece, the horizontal slit piece, and the intermediate vertical slit piece is Not in communication with each other, all the mounting boards in the printed wiring board are integrally connected via any part, and
(B) In the N-th press work (forward press process or reverse press process), the longitudinal slit piece, the transverse slit piece and / or the intermediate longitudinal slit piece that were not communicated with each other communicated with each other, The same or different molds for processing the mother board so that each of them becomes a continuous vertical slit, a horizontal slit and / or an intermediate vertical slit so that the integrally connected mounting board is sequentially separated from the printed wiring board. Is arranged.

  The mold set according to the present embodiment is the same as the first embodiment in that pushback means and other processing means are distributed and arranged in N mother board processing molds. Then, only the forward direction press is performed without performing the reverse direction press of the printed wiring board. This is different from the first embodiment. Since other points are the same as those of the first embodiment, description thereof is omitted.

[2.2. Concrete example]
For example, when only forward pressing is performed using the mold set 10 shown in FIG. 1, the first mother board machining mold (lower mold 20a) and the second mother board machining mold (lower mold 20b) In each case, the printed circuit board can be pushed back at a predetermined position.
On the other hand, in the case of the mold set 10 shown in FIG. 1, the vertical slit pieces do not communicate with each other only by the forward press. Therefore, the vertical slit piece forming pin guiding holes similar to the vertical slit piece forming pin guiding holes 26a to 26c provided in the lower mold 20a are arranged under the second base plate machining mold in a reverse arrangement. When provided in the mold 20b, a continuous vertical slit can be formed by two forward presses.
Similarly, in the case of the mold set 10 shown in FIG. 1, the transverse slit pieces do not communicate with each other only by forward pressing. Therefore, the horizontal slit element forming pin guide holes 28a and 28b provided in the lower mold 20b are arranged under the first base plate processing mold in a reverse arrangement. When provided in the mold 20a, a continuous horizontal slit can be formed by two forward presses.

  These points also apply to the mold set 10a shown in FIG. 8 and the mold set 10b shown in FIG. 15, and the vertical slit piece forming means, the horizontal slit piece forming means, or the intermediate vertical slit piece. When the forming means is optimally arranged, it is possible to form a continuous longitudinal slit and / or a transverse slit and an intermediate longitudinal slit in addition to one or both of them by only N forward pressings.

  By the above method, a mounting board in which the pushed back printed circuit board is temporarily fixed to the frame portion is obtained. The obtained mounting board is sent to an automatic mounting process, and various electronic components are mounted on the surface. After completion of automatic mounting, the frame portion and the printed circuit board can be separated by breaking the frame portion, and the separated printed circuit board can be incorporated into various electronic devices.

[2.3. Function of mold set (2)]
When the pushback means is distributed and arranged in N dies, and the individual printed circuit boards are pushed back by N times of forward pressing, all printed circuits are obtained by one press. The press pressure can be reduced to about 1 / N as compared with the case where the plate is pushed back. Therefore, an extremely large mounting board on which a large number of printed circuit boards are pushed back can be manufactured without any restriction on the press capability, as long as the conveyance of the mother board is not hindered.

Furthermore, at the same time, when the vertical slit piece forming means and / or the horizontal slit piece forming means, or in addition to these, the intermediate vertical slit piece forming means is distributed and arranged in N base metal molds. When a plurality of press processes are completed, a side parallel to the carrying direction of the mounting substrate, a side that is perpendicular, and / or an intermediate side can be formed at the same time.
Further, if the length and arrangement of the vertical slit piece forming means and / or the horizontal slit piece forming means, or in addition to these, the length and arrangement of the intermediate vertical slit piece forming means are optimized, before the final press working is performed, The mounting substrate is joined at any part, and the individual mounting substrates can be sequentially separated at the time of final press working. Therefore, conveyance of the mother board in the middle of processing becomes extremely easy.

  Furthermore, when various processing means are distributed and arranged in N molds, the cost for manufacturing the molds increases, but it is not necessary to form various through holes in the molds. Therefore, complicated processing is possible without reducing the durability of the mold.

  Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the present invention.

The mold set according to the present invention can be used as a mold set for manufacturing various processed boards such as a mounting board in which a printed circuit board is temporarily fixed to a frame portion by a pushback method.
In addition, a method for manufacturing a processed plate and a method for manufacturing a product plate according to the present invention include a method for manufacturing a mounting substrate using such a mold set, and a frame portion from the mounting substrate obtained by such a method. Can be used as a method for obtaining a printed circuit board.

10 Mold set 20a Lower mold (1st base plate processing mold)
22a-22c Lower mold stripper (pushback means)
26a-26c Longitudinal slit piece forming pin guide hole (longitudinal slit piece forming means)
20b Lower mold (2nd base plate processing mold)
22d-22f Lower mold stripper (pushback means)
28a, 28b Horizontal slit piece forming pin guide hole (transverse slit piece forming means)

Claims (10)

Mold set with the following configuration.
(1) The mold set includes N (N ≧ 2) mother board machining dies, and the mother board is moved forward with respect to the same mother board using the mother board machining dies. The base plate is subjected to a total of 2N press processes, including N forward press processes that perform press processing while feeding and N reverse press processes that perform press processing while feeding the base plate in the reverse direction. Therefore, the product plate pushed back is used to manufacture a processed plate temporarily fixed to the frame portion.
(2) Each of the N molds for processing a base plate has at least one pushback means for punching out the product plate from the base plate and fitting the punched product plate into the original hole. Prepared,
The pushback means provided in the i-th (1 ≦ i ≦ N) of the base plate processing mold is provided in the j-th (1 ≦ j ≦ N, j ≠ i) of the base plate processing die. In a portion different from the portion to be pushed back by the push back means, the product plate is arranged so that a new product can be pushed back from the base plate.
(3) Each of the pushback means provided in the i-th die for processing a base plate,
(A) When the base plate is forwardly fed, the first product plate can be pushed back in a part of the region to be the processed plate; and
(B) The second product plate is newly provided in a portion different from the first product plate in the region to be the processed plate when the base plate is fed forward and then further fed in the reverse direction. It is arranged so that it can be pushed back.
(4) The mold set may be any one or more of the N mother board processing molds,
A vertical slit piece forming means for forming a vertical slit piece parallel to the conveying direction of the mother board at at least one side end of the mother board, and
Any one of the horizontal slit piece forming means for forming a horizontal slit piece perpendicular to the conveying direction of the mother board is provided.
(5) The vertical slit piece forming means communicates with each other by performing the press processing twice or more using the same or different molds for processing the base plate, thereby conveying the processed plate. Arranged in the same or different mold for processing the base plate so as to be a continuous vertical slit that becomes a side parallel to the direction,
The horizontal slit piece forming means communicates with each other by performing press processing two or more times using the same or different molds for processing the base plate, so that the horizontal slit piece communicates with the conveying direction of the processed plate. Are arranged in the same or different molds for processing a base plate so as to form continuous horizontal slits having vertical sides. The mold set according to claim 1, further comprising the following configuration.
(4 ′) The mold set includes both the vertical slit piece forming means and the horizontal slit piece forming means in any one or more of the N mother board processing molds. .
(6) The vertical slit piece forming means and the horizontal slit piece forming means are:
(A) At the time when the (2N-1) -th press work is completed, at least one of the vertical slit pieces and the horizontal slit pieces is not in communication with each other, and all the works in the mother plate The plate is in an integrally connected state via any part, and
(B) During the 2N-th press work, the longitudinal slit pieces and / or the transverse slit pieces that were not communicated with each other communicated with each other to become the continuous longitudinal slit and / or the transverse slit, Accordingly, the processing plates that are integrally connected are arranged in the same or different molds for processing the base plate so as to be sequentially separated from the base plate. The mold set according to claim 1 or 2, further comprising the following configuration.
(7) The mold set includes intermediate vertical slit pieces parallel to the conveyance direction of the mother board at one or more of the N mother board machining molds at an intermediate portion of the mother board. An intermediate longitudinal slit piece forming means for forming
The intermediate vertical slit piece forming means communicates with each other by performing press processing twice or more using the same or different molds for processing the base plate, and the conveying direction of the processed plate Are arranged in the same or different molds for processing a base plate so as to be continuous intermediate longitudinal slits having sides parallel to each other.
(6 ′) The vertical slit piece forming means, the horizontal slit piece forming means, and the intermediate vertical slit piece forming means,
(A) At the time when the (2N-1) th press work is completed, at least one of the vertical slit piece, the horizontal slit piece and the intermediate vertical slit piece is not communicated with each other, and the mother plate All the processed plates inside are connected together through any part, and
(B) The vertical slit piece, the horizontal slit piece and / or the intermediate vertical slit piece, which were not communicated during the 2N-th press working, communicated with each other, and each of the continuous vertical slits, The horizontal slits and / or the intermediate vertical slits are arranged in the same or different base plate processing molds so that the processing plates integrally connected thereby are sequentially separated from the base plate. .   Using the N base plate processing molds provided in the mold set according to any one of claims 1 to 3, press processing is performed while feeding the base plate in the forward direction to the same base plate. A product pushed back from the mother board by performing a total of 2N times of pressing, including N times of forward pressing and N times of pressing in the reverse direction while feeding the mother board in the reverse direction. A method for manufacturing a processed plate, comprising a pressing step for manufacturing a processed plate in which the plate is temporarily fixed to a frame portion.   The manufacturing method of the product board which isolate | separates a product board from the processed board obtained by the method of Claim 4. Mold set with the following configuration.
(1) The mold set includes N (N ≧ 2) mother board machining dies, and the mother board is moved forward with respect to the same mother board using the mother board machining dies. By performing N times of forward pressing processes that perform the pressing process while feeding, it is used to manufacture a processed plate in which the product plate pushed back is temporarily fixed to the frame portion from the base plate.
(2) Each of the N molds for processing a base plate has at least one pushback means for punching out the product plate from the base plate and fitting the punched product plate into the original hole. Prepared,
The pushback means provided in the i-th (1 ≦ i ≦ N) of the base plate processing mold is provided in the j-th (1 ≦ j ≦ N, j ≠ i) of the base plate processing die. In a portion different from the portion to be pushed back by the push back means, the product plate is arranged so that a new product can be pushed back from the base plate.
(3) The mold set may be any one or more of the N mother board processing molds,
A vertical slit piece forming means for forming a vertical slit piece parallel to the conveying direction of the mother board at at least one side end of the mother board, and
Any one of the horizontal slit piece forming means for forming a horizontal slit piece perpendicular to the conveying direction of the mother board is provided.
(4) The vertical slit piece forming means communicates with each other by performing the pressing process two or more times using the same or different molds for processing the base plate so that the vertical slit pieces communicate with each other. Arranged in the same or different mold for processing the base plate so as to be a continuous vertical slit that becomes a side parallel to the direction,
The horizontal slit piece forming means communicates with each other by performing press processing two or more times using the same or different molds for processing the base plate, so that the horizontal slit piece communicates with the conveying direction of the processed plate. Are arranged in the same or different molds for processing a base plate so as to form continuous horizontal slits having vertical sides. The mold set according to claim 6, further comprising the following configuration.
(3 ′) The mold set includes both the vertical slit piece forming means and the horizontal slit piece forming means in any one or more of the N base plate processing molds. .
(5) The vertical slit piece forming means and the horizontal slit piece forming means are:
(A) At the time when the (N-1) -th press work is completed, at least one of the vertical slit pieces and the horizontal slit pieces is not in communication with each other, and all the works in the mother plate The plate is in an integrally connected state via any part, and
(B) During the N-th press work, the vertical slit pieces and / or the horizontal slit pieces that were not communicated with each other communicated with each other to become the continuous vertical slit and / or the horizontal slit, Accordingly, the processing plates that are integrally connected are arranged in the same or different molds for processing the base plate so as to be sequentially separated from the base plate. The mold set according to claim 6 or 7, further comprising the following configuration.
(6) The mold set includes any one or more of the N molds for processing a base plate, and an intermediate vertical slit piece parallel to the transport direction of the base plate at an intermediate portion of the base plate. An intermediate longitudinal slit piece forming means for forming
The intermediate vertical slit piece forming means communicates with each other by performing press processing twice or more using the same or different molds for processing the base plate, and the conveying direction of the processed plate Are arranged in the same or different molds for processing a base plate so as to be continuous intermediate longitudinal slits having sides parallel to each other.
(5 ′) The vertical slit piece forming means, the horizontal slit piece forming means, and the intermediate vertical slit piece forming means are:
(A) When the (N-1) th press work is completed, at least one of the vertical slit piece, the horizontal slit piece, and the intermediate vertical slit piece is not in communication with each other, and the mother plate All the processed plates inside are connected together through any part, and
(B) During the N-th press work, the longitudinal slit piece, the transverse slit piece and / or the intermediate longitudinal slit piece that were not communicated with each other communicated with each other, and the continuous longitudinal slit, The horizontal slits and / or the intermediate vertical slits are arranged in the same or different base plate processing molds so that the processing plates integrally connected thereby are sequentially separated from the base plate. .   Using the N base plate processing molds provided in the mold set according to any one of claims 6 to 8, press processing is performed while feeding the base plate in the forward direction to the same base plate. A method of manufacturing a processed plate comprising a pressing step of manufacturing a processed plate in which a product plate that is pushed back is temporarily fixed to a frame portion from the base plate by performing N times of forward pressing.   The manufacturing method of the product board which isolate | separates a product board from the processed board obtained by the method of Claim 9.

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