JP4770065B2 - RFID tag with high design and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an RFID tag and a method for manufacturing the RFID tag, and more particularly to an RFID tag having an improved design of an antenna portion that communicates with a reader / writer, and a method for manufacturing the RFID tag.
[0002]
[Prior art]
Conventionally, as an antenna portion where an RFID tag communicates with a reader / writer, a metal foil such as an aluminum foil or a copper foil laminated on an RFID tag base is formed into a coiled antenna pattern by photoetching or etching after resist printing. The antenna part of the electrostatic coupling type RFID tag is composed of two antenna patterns that form a pair, and the antenna pattern is formed by using conductive ink, offset, gravure, flexo, silk screen printing, etc. Form. As the conductive ink, a method of using an ink in which carbon, graphite, aluminum powder, silver powder, or a mixture thereof is dispersed in a vehicle is known.
[0003]
However, the external appearance of the coiled antenna pattern is a mechanical geometric pattern and has a drawback that it does not match human sensitivity. In addition, the appearance of the two antenna patterns that form a pair is that the conductive ink to be formed is black or close in color tone, and more than a certain area is required to function as an antenna that communicates with the reader / writer. There is a problem that the RFID tag occupies most of the area and impairs the appearance when it is placed on a medium that is the final application.
[0004]
[Problems to be solved by the invention]
Therefore, in order to solve such problems, the present invention is configured such that an antenna pattern is composed of a light diffraction structure layer such as a hologram or a diffraction grating and a conductive light reflection layer, and the antenna pattern is previously transferred to a transfer foil. Alternatively, the present invention has been completed with the idea of placing it on a sheet-like substrate of an RFID tag as a tack label.
[0005]
[Means for Solving the Problems]
  In order to solve the above-mentioned problem, the gist of the first invention is an RFID tag in which an IC chip and an antenna pattern are electrically connected to a sheet-like substrate.BecauseThe antenna pattern is a light diffraction structure layer and a conductive light reflection layer.The light reflecting layer is a transparent metal compound.It is characterized by that. The gist of the second invention is as follows:SaidRFID tag manufacturing methodBecauseAntenna transfer foil or antenna tack labelUsingTransfer or stick to sheet-like substrateAntenna patternIC chip that can communicate with the antenna patternTheIt is characterized by being attached.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described in detail with reference to the drawings.
First, the RFID tag used in the present invention is a tag capable of non-contact information exchange using radio waves as a medium of an RFID (Radio Frequency Identification) system. The RFID tag includes an antenna pattern and an IC chip provided on a base material such as paper or plastic, and a resonance circuit is formed by the antenna pattern and a capacitive element built in the IC chip. When the resonance circuit receives a calling radio wave having a certain frequency from the reader / writer, the resonance circuit transmits information stored in the memory to the reader / writer serving as a transmission source and returns the information. In this way, the RFID tag can communicate information with the reader / writer in a non-contact manner.
[0007]
The “RFID tag” includes “contactless IC tag”, “contactless data carrier”, “wireless IC tag”, “contactless IC”, “contactless IC label”, “contactless IC card”, “ Since it may be expressed by various names such as “transponder” or the like, in the present invention, it is expressed as “RFID tag” as a representative and includes the names expressed as described above. .
[0008]
There are UHF-SHF bands (850 to 950 MHz, 2.4 to 5 GHz), HF bands (10 to 15 MHz), and LF-MF bands (100 to 500 KHz) as frequencies used by the RFID tag for communication. An RFID tag using any frequency can be applied. An electromagnetic induction type RFID tag using a frequency in the UHF-SHF band or the HF band has a long communication distance but is expensive. The capacitive coupling type RFID tag using the frequency of the LF-MF band has a relatively short reading distance, but the price of the entire system including the RFID tag, the reader / writer and the control device is comparatively low and has a wide range of applications. The present invention can be preferably used.
[0009]
FIG. 1 is a plan view and a cross-sectional view showing an example of an RFID tag used in the present invention.
1A is a plan view of the RFID tag, and FIG. 1B is a cross-sectional view. In the RFID tag 10, an antenna pattern 14 is formed on an RFID tag base 17, and a resonance circuit is formed by the antenna pattern and a capacitive element built in the IC chip 11. When the resonance circuit receives a paging radio wave of a certain frequency from the reader / writer, it also receives the driving power of the RFID tag and transmits the information stored in the memory of the IC chip 11 to the reader / writer as the transmission source and returns it. .
[0010]
The antenna pattern 14 has a coil shape and a conductive member 13 that forms a jumping circuit on the back surface of the RFID tag base 17 and is connected to the bumps or pads of the IC chip 11 by the coil connection elements 15 and 16. The material of the RFID tag base 17 is not particularly limited as long as it is an insulating material. For example, films such as polyethylene terephthalate, polyvinyl chloride, polypropylene, polycarbonate, polyethersulfone, polyamide, and cellulose acetate can be applied. . The thickness of the film is not particularly limited, and is preferably about 12 to 100 μm. The RFID tag substrate 17 may be mixed with additives such as a colorant, an antistatic agent, a lubricant, and a stabilizer as long as the function is not affected.
[0011]
The antenna pattern of a conventional RFID tag is formed by forming a metal foil such as an aluminum foil or a copper foil laminated on the RFID tag base 17 into a coil shape by photo etching or etching after resist printing. ing. In the present invention, the antenna pattern 14 is composed of a light diffraction structure layer and a conductive light reflection layer. The light diffractive structure layer uses a hologram or diffraction grating that can be designed with design, and a metal or a transparent metal compound having a refractive index difference of 0.1 or more from the light diffractive structure layer is used as the light reflecting layer. As a result, the brilliancy is enhanced and a higher designability is realized. In addition, since the transparent metal compound having a refractive index difference of 0.1 or more from the metal or the light diffraction structure layer serves as an antenna for communicating with the reader / writer, there is no problem in the function as the RFID tag. .
[0012]
  An IC chip 11 can be mounted on the antenna pattern. The size can be 50 mm × 50 mm or less. Specifically, the product name “accuwave” manufactured by Dai Nippon Printing Co., Ltd. can be exemplified. The antenna pattern of the RFID tag has a coil shape and can improve the design that is the gist of the present invention as will be described later. The capacitively coupled RFID in which the antenna pattern described below is configured in a solid state. The tag is more suitable for improving the design, and claims3Embodiment.
[0013]
FIG. 2 is a plan view showing another example of the RFID tag used in the present invention.
FIG. 2 is a plan view of an electrostatic coupling type RFID tag in which an IC chip label 100L having an IC chip 100 is attached so as to be connected to both of a pair of antenna patterns 111 and 112. A pair of antenna patterns in a conventional RFID tag is formed by using offset ink, gravure, flexo, silk screen printing or the like using a conductive ink. As the conductive ink, an ink in which carbon, graphite, aluminum powder, silver powder, or a mixture thereof is dispersed in a vehicle is used. Therefore, the conductive ink has a black color or a similar color tone and poor design.
[0014]
In the present invention, the antenna pattern 14 is composed of a light diffraction structure layer and a conductive light reflection layer. The light diffractive structure layer uses a hologram or diffraction grating that can be designed with design, and a metal or a transparent metal compound having a refractive index difference of 0.1 or more from the light diffractive structure layer is used as the light reflecting layer. As a result, the brilliancy is enhanced and a higher designability is realized. In addition, since the transparent metal compound having a refractive index difference of 0.1 or more from the metal or the light diffraction structure layer serves as an antenna for communicating with the reader / writer, there is no problem in the function as the RFID tag. .
[0015]
Specifically, the product name “Bistatix” manufactured by Motorola can be exemplified, and it is inexpensive, highly reliable, and has a short distance to communicate with the reader / writer, but in the case of improving the design as in the present invention, the antenna pattern Can be suitably used for RFID tags configured in a solid state.
[0016]
The “IC chip label” refers to a state in which an IC chip 100 in which an integrated circuit and / or memory is provided on a silicon substrate is tack-labeled so that it can be attached to the pair of antenna patterns 111 and 112 of the RFID tag 101. In some cases, the tack label itself has a small pair of sub antenna patterns connected to the IC chip.
[0017]
In general, the IC chip label 100L is used by being attached to the antenna patterns 111 and 112 formed on the base of the RFID tag, but the IC chip label 100L is also small and has a pair of sub antenna patterns that are conductive. It is printed with printing ink.
[0018]
The antenna patterns 111 and 112 formed on the base of the RFID tag 101 and the pair of sub antenna patterns of the IC chip label 100L are bonded and bonded with an anisotropic conductive or non-conductive adhesive. The adhesive is applied in advance to a pair of child antenna pattern surfaces of the IC chip label 100L to form a tack label.
[0019]
As for the recording capacity of the RFID tag, in the case of a general IC memory of the IC chip 100, 128 characters can be recorded at 1024 bits, and it can be sufficiently applied to the minimum information recording of normal products and packed packages. . In addition, if it is several kilobits, it is possible to record more than the two-dimensional barcode used in conventional package management. Furthermore, unlike a two-dimensional bar code, there is an advantage that information can be additionally recorded and rewritten sequentially as needed, and it can be used for delivery and quality control of products as well as management of loading and unloading of packages.
[0020]
As an application of the RFID tag of the present invention, it is attached to the product itself, a packaged cardboard box or a container. It can also be used by sticking to a delivery slip or delivery slip. The product for use is not particularly limited, and for example, products such as daily necessities, beverages, foods, apparel products, machines and machine parts, electrical products, building supplies, and a box in which a plurality of them are packed may be used. It can also be applied as an automatic recognition system for loading / unloading and lending such as for airline industry packages, transportation / distribution industry distribution, library collection management, rental CD and video management.
[0021]
FIG. 3 is a perspective view showing a product to which the RFID tag of the present invention is attached.
In the present invention, the RFID tags 10 and 101 have various shapes such as a tag shape, a label shape, a card shape, a coin shape, and an inlet shape, but any shape RFID tag can be applied. As described above, one or more products are attached to or attached to an outer package such as a decorative box, cardboard, wooden box, wrapping, sealed letter, handbag, or container in which one or more products are packaged or packed. Alternatively, they may be directly attached to various products or may be combined. The sticking method is not particularly limited, and it may be stuck with an adhesive or a cellophane, or may be stuck in a small bag such as paper or polyethylene. In addition, the RFID tag is attached in advance as a tack label or tied with a string or the like.
[0022]
Further, the RFID tags 10 and 101 can communicate wirelessly, have a beautiful appearance and are beautiful, and the RFID tag 10 and 101 base may also be used as a nameplate label that is normally used. It may be covered with a transparent nameplate label. The RFID tags 10 and 101 are attached between a transparent nameplate label and a product or cardboard, or are also used as a nameplate label, so that the beauty is improved and the price is more suitable. Moreover, depending on a use, it may be inside a package or a package.
[0023]
The nameplate label is displayed by handwriting or printing such as offset printing, resin letterpress printing, gravure printing, flexographic printing, silk screen printing, etc. Adhesive labels and tack labels can be applied. The printed display portion may be either the antenna-side surface of the base or the non-antenna-side surface.
[0024]
There are no particular restrictions on the base of the above-mentioned tag with a string or glued label / tack label, for example, paper such as fine paper, coated paper, impregnated paper, synthetic paper, polyethylene terephthalate, polypropylene, polychlorinated Synthetic resins such as vinyl / ethylene vinyl acetate copolymer, metal foils such as aluminum, and laminates of two or more layers thereof can be applied.
[0025]
FIG. 4 is a cross-sectional view showing an example of the antenna transfer foil of the present invention.
A protective layer 23, a light diffraction structure layer 24, a light reflection layer 25, and a thermal adhesive layer 26 are provided on the transfer substrate 21 via a release layer 22. Since the transfer substrate 21 is peeled off after the antenna pattern is bonded to the RFID tag substrate 17, the material, thickness, and optical characteristics are not limited. Specific examples include polyethylene terephthalate, polybutylene. Examples include terephthalate, polypropylene, polymethyl methacrylate, polystyrene, and polycarbonate. A release layer 22 is provided on the surface of the transfer substrate 21 where the protective layer 23 and / or the light diffraction structure layer 24 is formed in order to facilitate peeling. Examples of the release layer 22 include acrylic resins, cellulose resins, waxes, melamine resins, and the like.
[0026]
The protective layer 23 functions to enhance the peelability between the transfer substrate 21 and the light diffraction structure layer 24 and to protect the light diffraction structure layer 24 after the transfer substrate 21 is peeled off. Examples of the material of the protective layer 23 include acrylic resins, polyester resins, amide resins, cellulose resins, vinyl resins, urethane resins, olefin resins, epoxy resins, and the like. Although 5-5 micrometers is suitable, it is not limited to these. The protective layer 23 does not need to be provided when used as an RFID tag, for example, when attached inside a cardboard box.
[0027]
The light diffractive structure layer 24 is colorless or colored transparent or translucent, and may be a single layer or a multilayer. Specific examples of materials include acrylic resins, polyester resins, Thermoplastic resins such as vinyl chloride; thermosetting resins such as urethane resins, unsaturated polyester resins, melamine resins, and epoxy resins; or ultraviolet rays or ionizing radiation such as acrylic resins, urethane resins, and polyester resins Any conventionally known material such as a curable resin can be used.
[0028]
The release layer 22, the protective layer 23, and the light diffraction structure layer 24 are formed by dissolving or dispersing each of the above-described materials in a solvent and adding an appropriate additive, for example, by known roll coating or gravure coating. In this way, each layer is obtained by applying and drying. The thickness after drying is about 0.1 μm to 5 μm for the release layer 2, about 1 μm to 10 μm for the protective layer 23, and about 0.1 μm to 10 μm for the optical diffraction structure layer 24.
[0029]
The light diffraction structure layer 24 is formed with a surface unevenness pattern (light diffraction pattern) capable of reproducing a two-dimensional or three-dimensional image. As this surface concavo-convex pattern, a hologram or diffraction grating in which the intensity distribution of the interference fringe light due to the interference between the object light and the reference light is recorded in the concavo-convex pattern can be applied. Holograms include Fresnel holograms, Fraunhofer holograms, lensless Fourier transform holograms, laser reproduction holograms such as image holograms, and white light reproduction holograms such as rainbow holograms, as well as color holograms, computer holograms, holograms using these principles There are displays, multiplex holograms and holographic stereograms.
[0030]
  Examples of the diffraction grating include a holographic diffraction grating using a hologram recording means. In addition, an arbitrary diffraction light can be obtained based on a calculation by mechanically creating a diffraction grating using an electron beam drawing apparatus or the like. A diffraction grating can also be mentioned. Claims to use these holograms and / or diffraction gratings4In this embodiment, recording may be performed in a single or multiple manner, or in combination.
[0031]
The surface unevenness pattern (light diffraction pattern) for recording the hologram and / or the diffraction grating is provided on the light reflection layer 25 side of the light diffraction structure layer 24. When replicating a light diffraction pattern, the master itself can be used, but there is a risk of wear and damage, so as with analog records, etc., a metal plating or UV curable resin is applied to the master and irradiated with UV light. The metal or resin is replicated by a method such as curing and peeling, and commercial replication is performed using the replicated mold.
[0032]
Commercial replication methods use molds or resin molds, use thermoplastic synthetic resins as materials, duplicate holograms by pressing, or ionizing radiation curable resin on the mold or resin mold surface, etc. A liquid resin is applied and cured by irradiation with ultraviolet rays or electron beams. This commercial duplication is carried out in a long shape, whereby a continuous duplication operation can be performed, and an optical diffraction structure layer 24 having a hologram on one surface is obtained. Furthermore, in press duplication using a metal mold, the duplication process may be performed after the light reflecting layer 25 described below is provided.
[0033]
  The light diffraction pattern provided on the light diffraction structure layer 24 is provided with the light reflection layer 25 on the surface of the light diffraction pattern so that the reproduced image of the hologram and / or the diffraction grating can be clearly seen.Become. As the light reflection layer 25, a metal or a conductive transparent metal compound having a refractive index different from that of the light diffraction structure layer 24 can be applied.
[0034]
The metal is a thin film of a metallic element having a metallic luster and reflecting light, which can be obtained by vapor deposition or sputtering, but can also be formed by plating or the like. As the metal thin film of the light reflecting layer 25, aluminum, chromium, nickel, gold, silver or the like is particularly preferable, and vapor deposition, sputtering, or the like is performed so that the thickness of the light diffraction structure layer 24 is 200 angstroms or more. Provide.
[0035]
Further, the light reflecting layer 25 can be made to be able to visually recognize a hologram, because its optical refractive index is different from that of the hologram forming layer. When a light reflection layer 25 having a refractive index different from that of the light diffraction structure layer 24 is used, a hologram can be visually recognized even though it has a substantially colorless and transparent hue and no metallic luster. Thus, a transparent hologram is produced. It can function and functions as an antenna by having conductivity. For example, ITO, tin oxide, etc. are mentioned as what is electroconductive, has a refractive index larger than the light diffraction structure layer 24, and is transparent in the region of visible light.
[0036]
As the refractive index of the light reflecting layer 25, the larger the difference in refractive index from the light diffraction structure layer 24, the more effective, and the difference in refractive index of 0.1 or more can be applied. The refractive indexes of ITO and tin oxide are both 2.0 and have a sufficient difference in refractive index. In addition, this transparent should just permeate | transmit visible light enough, and a colorless or colored and transparent thing is also contained. The transparent metal compound is formed on the surface of the light diffraction structure layer 24 by vapor deposition, sputtering or the like so as to have a thickness of 200 angstroms or more, as in the case of the metal thin film.
[0037]
Next, the heat bonding layer 26 is provided on the light reflecting layer 25 surface. As the material of the thermal adhesive layer 26, a heat-sensitive adhesive that melts or softens when heated and exhibits an adhesive effect can be applied. Specifically, a vinyl chloride vinyl acetate copolymer resin, an acrylic resin, Examples thereof include polyester resins. The material resin is dissolved or dispersed in a solvent, an additive such as a pigment is added as appropriate, and it is applied and dried by a known method such as roll coating or gravure coating to form a layer having a thickness of 0.1 μm to 30 μm. obtain. In this way, an antenna transfer foil composed of the light diffraction structure layer 24 and the light reflection layer 25 is obtained.
[0038]
FIG. 5 is a conceptual diagram of a manufacturing method for transferring the antenna transfer foil of the present invention to an RFID tag.
FIG. 6 is a cross-sectional view of an RFID tag manufactured by transferring the antenna transfer foil of the present invention.
A method of manufacturing an RFID tag using the antenna transfer foil described above is the invention of claim 5. As shown in FIG. 5, in a state where the thermal adhesive layer of the antenna transfer foil is superposed on the RFID tag substrate 17, both are thermocompression-bonded by a transfer mold 51. When the thermal adhesive layer 26 melts and adheres to the RFID tag base 17 and then the transfer base 21 is peeled off, an antenna pattern composed of the light diffraction structure layer 24 and the light reflection layer 25 is formed on the RFID tag base 17. The In this case, a predetermined pattern can be obtained by setting the transfer mold 51 in the shape of an antenna pattern.
[0039]
After the predetermined pattern is transferred in a coil shape to form the antenna pattern 14 of FIG. 1, the IC chip 11 is electrically connected to both ends of the antenna pattern 14 by the conductive member 13 via the connection elements 15 and 16. Thus, the electromagnetic induction type RFID tag 10 is obtained. Further, after the predetermined pattern is transferred in a pair of two solid shapes to form the antenna patterns 111 and 112 of FIG. 2, an IC chip label 100L containing the IC chip 100 is attached to the antenna patterns 111 and 112. By sticking so as to be able to communicate, the electrostatic coupling type RFID tag 101 of FIG. 6 is obtained.
[0040]
The transfer mold 51 having a predetermined pattern can form various antenna patterns only by changing the pattern shape. That is, depending on the application, there is a case where it is desired to change the communication distance between the RFID tag and the reader / writer, but the pattern shape of the transfer mold 51 is changed, for example, the outer circumference of the coil and / or the number of turns of the coil. Just to be able to cope with the length of the communication distance.
[0041]
FIG. 7 is a cross-sectional view showing an example of the antenna tack label of the present invention.
The invention of claim 6 is a method for manufacturing an RFID tag by forming an antenna pattern as a tack label and attaching the antenna pattern to an RFID tag substrate, and then mounting the IC chip so as to allow communication. First, a primer layer 42, a light diffraction structure layer 24, a light reflection layer 25, and an adhesive layer 43 are provided in this order on a label base 41, and are detachably placed on a release paper 44, and a tack label having an antenna pattern To do. The label base 41 is the same as the transfer base 21 of the fifth aspect, the light diffraction structure layer 24 and the light reflection layer 25 are the same as the fifth aspect, and the description thereof is omitted.
[0042]
Since the primer layer 42 is provided in order to improve the adhesiveness between the label base 41 and the light diffraction structure layer 24, the primer layer 42 may not be provided if the adhesion is strong due to the combination of the material of the label base 41 and the light diffraction structure layer 24. . Examples of the material of the primer layer 42 include acrylic resins, polyester resins, amide resins, vinyl resins, urethane resins, and the like. The thickness of the layer is preferably 0.1 to 5 μm. It is not limited to.
[0043]
As a material of the adhesive layer 43, a known acrylic ester type or rubber type is used, and it is applied by bar coating, roll coating or the like so that the thickness when dried becomes 10 μm to 50 μm and dried. The release paper 44 is peeled off from the pressure-sensitive adhesive layer 43, and protects the pressure-sensitive adhesive layer until it is peeled off to prevent inadvertent adhesion to surrounding articles. Specifically, a so-called sepa paper having a thin coating of silicone or the like on the surface of high-quality paper or polyethylene terephthalate may be used.
[0044]
In the antenna tack label, first, a primer layer 42 and a light diffraction structure layer 24 are provided on a label base 41, and a surface uneven pattern which is a diffraction structure such as a hologram and / or a diffraction grating is copied to the light diffraction structure layer 24. A light reflection layer 25 is formed on the surface of the light diffraction structure layer 24. Next, the surface of the light reflecting layer 25 is etched into an antenna pattern by a resist or photoetching method to form an antenna pattern.
[0045]
An adhesive is applied to the release paper 44 and dried to overlap the light reflecting layer 25 surface as the adhesive layer 43 to obtain the antenna tack label of FIG. As the antenna pattern, in the pair of two-sided solid antenna patterns 111 and 112, the antenna patterns 111 and 112 are used as one tack label, and one antenna pattern 111 is used as a tack label. 2 may be combined.
[0046]
FIG. 8 is a conceptual diagram of a manufacturing method for attaching the antenna tack label of the present invention to an RFID tag.
FIG. 9 is a cross-sectional view of an RFID tag manufactured by attaching the antenna tack label of the present invention.
The release paper 44 that covers the adhesive layer 43 of the antenna tack label is peeled off and then attached to the RFID tag base 17. At this time, the planar shape of the antenna tack label may be previously made by changing a die shape or the like so as to be a geometric shape such as a circle, a rectangle, an ellipse or the like according to the application.
[0047]
In this manner, after the coiled antenna tack label is attached and the antenna pattern 14 is formed, the IC chip 11 is electrically connected to the both ends of the antenna pattern 14 by the conductive member 13 via the connection elements 15 and 16. By connecting to, an electromagnetic induction type RFID tag 10 is obtained. In addition, two solid antenna tack labels are attached in a pair to form the antenna patterns 111 and 112 in FIG. 2, and then the IC chip label in which the IC chip 100 is built in the antenna patterns 111 and 112. By sticking 100L so that communication is possible, the electrostatic coupling type RFID tag 101 of FIG. 6 is obtained.
[0048]
【Example】
(Example 1) A 12 μm-thick polyethylene terephthalate manufactured by Toray Industries, Inc. was used as the transfer substrate 21, and a cellulose acetate resin (10 parts by weight) was mixed with ethyl acetate (45 parts by weight) and methyl ethyl ketone (45 parts by weight). The paint dissolved in was applied by a gravure coating method and dried to form a release layer 22 having a thickness of 0.5 μm. To the surface of the release layer 22, a paint obtained by dissolving Toyobo's trade name Byron 200 (20 parts by weight) in a mixed solvent of ethyl acetate (40 parts by weight) and toluene (40 parts by weight) is applied by a gravure reverse coating method. Then, it was dried to obtain a protective layer 23 having a thickness of 2.0 μm. Next, a gravure reverse coating is applied to the surface of the protective layer 23 with a paint obtained by dissolving a trade name Iupimer resin (20 parts by weight) manufactured by Mitsubishi Chemical Corporation in a mixed solvent of cyclohexanone (45 parts by weight) and methyl ethyl ketone (45 parts by weight). The optical diffraction structure layer 24 having a thickness of 2.0 μm was formed by applying and drying by the method.
[0049]
A replica mold made from a relief hologram is irradiated with ultraviolet rays while heating and pressurizing the light diffraction structure layer 24 from a glass dry plate of a hologram obtained by photographing and developing a three-dimensional model by an interference method using an argon laser beam. After being cured, the light diffraction structure layer 24 is obtained by separating from the replication mold. On the surface of the light diffractive structure layer 24, aluminum was provided to a thickness of 800 angstroms by a vacuum vapor deposition method to form a light reflecting layer 25. Disperse vinyl chloride vinyl acetate copolymer resin (20 parts by weight) and pigment (10 parts by weight of calcium carbonate) in a mixed solvent of ethyl acetate (35 parts by weight) and toluene (35 parts by weight) on the surface of the light reflecting layer 25. The dissolved paint was applied by a gravure reverse coating method and dried to provide a thermal adhesive layer 26 having a thickness of 3.0 μm.
[0050]
The antenna transfer foil thus obtained is overlapped with a 25 μm-thick polyethylene terephthalate made by Toray as an RFID tag base 17, and a transfer mold 51 depicting the antenna pattern of FIG. Was heated to 180 ° C. and pressurized for 1 second to obtain an antenna pattern 14. An IC chip 11 having a built-in 800-bit memory is electrically connected to both ends of the antenna pattern 14 through the connection elements 15 and 16 with an aluminum conductive member 13 to obtain an electromagnetic induction RFID tag 10.
[0051]
The antenna portion of the RFID tag 10 is beautiful with a bright relief hologram, and the light-reflecting layer is not provided in the coiled gap portion, but has a sufficient appeal. I was able to communicate with the reader / writer without any problems.
[0052]
(Example 2) An RFID tag 101 was obtained in the same manner as in Example 1 except that the shape of the antenna pattern was changed to two solid antenna patterns 111 and 112 in pairs as shown in FIG. . The antenna portion of the RFID tag 101 is beautiful with a brilliant relief hologram, and a light reflecting layer is provided on the entire surface of the antenna portion. I was able to communicate with the reader / writer without any problems.
[0053]
Example 3 Using a 25 μm thick polyethylene terephthalate made by Toray as the label base 41, Toyobo's trade name Byron 200 (10 parts by weight), ethyl acetate (45 parts by weight) and toluene (45 parts by weight) Part) was applied by a gravure coating method and dried to form a protective layer 23 having a thickness of 1.0 μm. Next, a gravure reverse coating is applied to the surface of the protective layer 23 with a paint obtained by dissolving a trade name Iupimer resin (20 parts by weight) manufactured by Mitsubishi Chemical Corporation in a mixed solvent of cyclohexanone (45 parts by weight) and methyl ethyl ketone (45 parts by weight). The optical diffraction structure layer 24 having a thickness of 2.0 μm was formed by applying and drying by the method.
[0054]
A duplicate mold made from a glass dry plate of a diffraction grating obtained by photographing and developing the optical diffraction structure layer 24 by an interference method using an argon laser beam is cured by irradiating with ultraviolet rays while heating and pressing, and then duplicated. The light diffraction structure layer 24 is obtained by separating from the mold. On the surface of the light diffraction structure layer 24, ITO was provided by sputtering to a thickness of 200 angstroms to form a transparent light reflection layer 25. Next, using a commercially available PET separator paper having a thickness of 100 μm as a release paper, a paint in which an acrylic resin (30 parts by weight) is dissolved in a mixed solvent of ethyl acetate (35 parts by weight) and toluene (35 parts by weight) is used. After applying and drying by a bar coating method to provide a pressure-sensitive adhesive layer 43 having a thickness of 20 μm, it was bonded to the surface of the light reflecting layer 25.
[0055]
The antenna tack label thus obtained was half-cut into the shape of the antenna pattern 111 in FIG. 2, peeled off from the release paper, adhered to 110 g / m 2 of black quality paper, and another half-cut. The antenna pattern was reversed left and right to obtain two antenna patterns 111 and 112 as a pair as the antenna pattern 112 in FIG. An RFID tag 101 of an electrostatic coupling type is obtained by pasting the product name Bistatix interposer manufactured by Motorola as an IC chip label 100L so as to straddle both antenna patterns 111 and 112.
[0056]
The two antenna portions of the RFID tag 101 are beautiful with a transparent diffraction grating shining with a black background, and there is no gap portion like a coiled antenna, so that a high-class feeling was felt. Moreover, it was possible to communicate with the product name ARCH reader / writer manufactured by Motorola without any problem.
[0057]
【The invention's effect】
  The conventional antenna pattern is functional only, which is disadvantageous in terms of design, but the RFID tag of the present invention uses the antenna part that performs the function without increasing the area used for the design. The design property can be improved extremely effectively.Further, by making the reflective layer a highly reflective metal layer, the brightness can be increased and an eye catching force is generated. Moreover, by using a transparent reflective layer, a unique high-class feeling can be created by combining with a background color.
[0058]
  Claim3According to the embodiment, in the electrostatic coupling type RFID tag, the antennas are two solid antennas in pairs, which can be increased in area, and the design effect is further enhanced. Claim4According to the embodiment, by using the diffraction structure layer as a hologram and / or a diffraction grating, compared to general printing, there is an effect of shining a three-dimensional image and glitter, and a high-class feeling and unique design can be exhibited. .
[0060]
According to the invention of claim 5, the conventional mass production equipment can be diverted and can be produced as much as necessary. Further, by changing the transfer mold, the change to the antenna pattern due to the communication distance can be coped with. be able to.
According to the sixth aspect of the present invention, it is possible to cope with a small amount, and the label base or the RFID tag base serves as a protective layer, thereby increasing the contamination resistance and mechanical durability.
[Brief description of the drawings]
1A and 1B are a plan view and a cross-sectional view showing an example of an RFID tag used in the present invention.
FIG. 2 is a plan view showing another example of an RFID tag used in the present invention.
FIG. 3 is a perspective view showing a product to which an RFID tag of the present invention is attached.
FIG. 4 is a cross-sectional view showing an example of an antenna transfer foil of the present invention.
FIG. 5 is a conceptual diagram of a manufacturing method for transferring the antenna transfer foil of the present invention to an RFID tag.
FIG. 6 is a cross-sectional view of an RFID tag manufactured by transferring the antenna transfer foil of the present invention.
FIG. 7 is a cross-sectional view showing an example of an antenna tack label according to the present invention.
FIG. 8 is a conceptual diagram of a manufacturing method for attaching an antenna tack label of the present invention to an RFID tag.
FIG. 9 is a cross-sectional view of an RFID tag manufactured by attaching the antenna tack label of the present invention.
[Explanation of symbols]
2 products
10, 101 RFID tag
11, 100 IC chip
12 IC board
13 Conducting member
14, 111, 112 Antenna pattern
15, 16 connection element
17 RFID tag base
21 Transfer substrate
22 Release layer
23 Protective layer
24 Light diffraction structure layer
25 Light reflection layer
26 Thermal bonding layer
41 Label base
42 Primer layer
43 Adhesive layer
44 Release paper
51 Transfer mold
100L IC chip label

Claims (6)

A RFID tag that constitutes an electrically connected state of the IC chip and the antenna pattern in a sheet-like substrate, the antenna pattern Ri light reflecting layer der light-diffracting structure layer and the electrically conductive, said light reflecting layer RFID tags, wherein der transparent metal compound Rukoto. The RFID tag according to claim 1, wherein the transparent metal compound has a refractive index difference of 0.1 or more with respect to the light diffraction structure layer. The RFID tag according to claim 1 or 2, wherein the RFID tag is an electrostatic coupling type RFID tag. The RFID tag according to any one of claims 1 to 3, wherein the light diffraction structure layer is a hologram and / or a diffraction grating. A manufacturing method of an RFID tag that constitutes an electrically connected state of the IC chip and the antenna pattern in a sheet-like base body,
And rolling to shot substrate release layer and the light-diffractive structure layer and the light reflective layer and the thermal adhesive layer, an antenna transfer foil in this order, superimposed thermal adhesive layer surface of the antenna transfer foil to a sheet-like substrate, the antenna heating and pressing the transfer foil side shape of the antenna pattern provided by transferring to the sheet substrate, method of manufacturing the RFID tag, which comprises attaching a communicatively an IC chip to the antenna pattern. A manufacturing method of an RFID tag that constitutes an electrically connected state of the IC chip and the antenna pattern in a sheet-like base body,
An antenna pattern formed of a light-diffractive structure layer and the light reflective layer to label the substrate, provided with the adhesive layer in this order, a label containing the antenna pattern, the tack label is placed in a separable to release paper, the tack method of manufacturing R FID tag you wherein the attaching child in a sheet-like base member with an adhesive layer of the label.

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