JP4689611B2 - 薄膜状構造部材を製造する方法と製造設備 - Google Patents
薄膜状構造部材を製造する方法と製造設備 Download PDFInfo
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- JP4689611B2 JP4689611B2 JP2006527277A JP2006527277A JP4689611B2 JP 4689611 B2 JP4689611 B2 JP 4689611B2 JP 2006527277 A JP2006527277 A JP 2006527277A JP 2006527277 A JP2006527277 A JP 2006527277A JP 4689611 B2 JP4689611 B2 JP 4689611B2
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- substrate
- structural member
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- belt
- thin film
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0005—Separation of the coating from the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0296—Processes for depositing or forming copper oxide superconductor layers
- H10N60/0576—Processes for depositing or forming copper oxide superconductor layers characterised by the substrate
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Laminated Bodies (AREA)
- Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
- Electrolytic Production Of Metals (AREA)
- Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
Description
Claims (9)
- 形状記憶合金より成り、伸張された基板(12)上に薄膜状構造部材(16)を、該基板(12)を被覆することにより製造し、
薄膜状構造部材(16)で被覆された基板(12)を、形状記憶効果により該基板の長さの変化が生ずるように両側から温度調整し、
薄膜状構造部材(16)を基板(12)と分離し、
前記基板のテクスチュア構造を、薄膜状構造部材(12)の準エピタキシャルな成長により薄膜状構造部材(12)上に転写する
薄膜状構造部材(16)の製造方法。 - 基板(12)を被覆する前に伸張させ、被覆後に基板が元の形に移行するように加熱することで一方向効果を利用することを特徴とする請求項1記載の方法。
- 被覆前に基板(12)を伸張した形に変形させ、被覆後に基板(12)が別の形に移行するように温度調整して二方向効果を利用することを特徴とする請求項1記載の方法。
- 被覆後に基板(12)が伸張した形に、次いで別の形に移行するように、交互に加熱、冷却することを特徴とする請求項3記載の方法。
- ベルト形の基板(12)を、薄膜状構造部材用製造装置(17)と、前記基板(12)の両側に配置された温度調整装置を有する温度調整可能な分離装置(15)に案内し、かつ形状記憶合金より成る基板(12)を使用して、ベルト形の薄膜状構造部材(16)を製造する製造設備において、
前記基板(12)上に薄膜状構造部材(16)を準エピタキシャルに成長させる製造装置(17)を備える基板(12)によりベルト形の薄膜状構造部材を被覆により製造する製造設備。 - 製造装置が、PVDによる被覆装置又は電気的析出装置であることを特徴とする請求項5記載の製造設備。
- 製造装置(17)に変形装置が前置接続されたことを特徴とする請求項5又は6記載の製造設備。
- 製造装置(17)に基板用の温度調節装置(22)が前置接続されたことを特徴とする請求項5又は6記載の製造設備。
- 基板(12)を、製造設備内を周回する無端のベルトとして形成したことを特徴とする請求項5から8の1つに記載の製造設備。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10346368A DE10346368B4 (de) | 2003-09-29 | 2003-09-29 | Verfahren und Herstellungsanlage zum Herstellen eines schichtartigen Bauteils |
| DE10346368.2 | 2003-09-29 | ||
| PCT/DE2004/002203 WO2005031043A1 (de) | 2003-09-29 | 2004-09-28 | Verfahren und herstellungsanlage zum herstellen eines schichtartigen bauteils |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007506861A JP2007506861A (ja) | 2007-03-22 |
| JP4689611B2 true JP4689611B2 (ja) | 2011-05-25 |
Family
ID=34384360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006527277A Expired - Fee Related JP4689611B2 (ja) | 2003-09-29 | 2004-09-28 | 薄膜状構造部材を製造する方法と製造設備 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20070035062A1 (ja) |
| EP (1) | EP1668173B1 (ja) |
| JP (1) | JP4689611B2 (ja) |
| AT (1) | ATE491826T1 (ja) |
| DE (2) | DE10346368B4 (ja) |
| DK (1) | DK1668173T3 (ja) |
| WO (1) | WO2005031043A1 (ja) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10346370A1 (de) * | 2003-09-29 | 2005-04-28 | Siemens Ag | Verfahren und Herstellungsanlage zum Herstellen eines Bandes auf einem Substratband |
| KR101343951B1 (ko) * | 2011-06-23 | 2013-12-24 | 코닉이앤씨 주식회사 | 금속박의 제조 방법 및 제조 장치 |
| JP6694578B2 (ja) * | 2015-12-21 | 2020-05-20 | 日立金属株式会社 | アルミニウム箔の製造方法およびアルミニウム箔製造用陰極ドラム |
| CN113755678B (zh) * | 2021-09-18 | 2024-05-28 | 无锡东创智能材料科技有限公司 | 一种形状记忆合金丝的训练装置以及训练方法 |
| CN118578569B (zh) * | 2024-06-04 | 2025-08-29 | 江西和烁丰新材料有限公司 | 一种具有双向拉伸设备的基膜涂层生产线 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2849752A (en) * | 1956-12-17 | 1958-09-02 | Ibm | Machine for embossing thermoplastic workpiece |
| GB1421818A (en) * | 1972-05-08 | 1976-01-21 | Xerox Corp | Nickel electroforming process |
| US3966383A (en) * | 1974-12-30 | 1976-06-29 | Ethyl Corporation | Apparatus for embossing film |
| US4055955A (en) * | 1976-08-16 | 1977-11-01 | Alfred Davis Johnson | Memory alloy heat engine and method of operation |
| JPS5462128A (en) * | 1977-10-26 | 1979-05-18 | Hamasawa Kogyo Kk | Peeling of electroforming exterior blade |
| US4530739A (en) * | 1984-03-09 | 1985-07-23 | Energy Conversion Devices, Inc. | Method of fabricating an electroplated substrate |
| US4787837A (en) * | 1986-08-07 | 1988-11-29 | Union Carbide Corporation | Wear-resistant ceramic, cermet or metallic embossing surfaces, methods for producing same, methods of embossing articles by same and novel embossed articles |
| JPH01235606A (ja) * | 1988-03-17 | 1989-09-20 | Canon Inc | 情報記録媒体用基板の製造方法 |
| US5049242A (en) * | 1990-12-24 | 1991-09-17 | Xerox Corporation | Endless metal belt assembly with controlled parameters |
| US5049243A (en) * | 1990-12-24 | 1991-09-17 | Xerox Corporation | Electroforming process for multi-layer endless metal belt assembly |
| US6024907A (en) * | 1998-02-02 | 2000-02-15 | Bruce Jagunich | Embossing with an endless belt composed of a shape memory alloy |
| DE10136890B4 (de) * | 2001-07-25 | 2006-04-20 | Siemens Ag | Verfahren und Vorrichtung zum Erzeugen eines kristallstrukturell texturierten Bandes aus Metall sowie Band |
| DE10136891B4 (de) * | 2001-07-25 | 2004-07-22 | Siemens Ag | Verfahren zum Erzeugen eines flächenhaften Basismaterials aus Metall |
| JP3930306B2 (ja) * | 2001-10-30 | 2007-06-13 | 株式会社ファイム インターナショナル | 金属管の製造方法 |
-
2003
- 2003-09-29 DE DE10346368A patent/DE10346368B4/de not_active Expired - Fee Related
-
2004
- 2004-09-28 DK DK04786902.9T patent/DK1668173T3/da active
- 2004-09-28 US US10/572,939 patent/US20070035062A1/en not_active Abandoned
- 2004-09-28 DE DE502004012006T patent/DE502004012006D1/de not_active Expired - Lifetime
- 2004-09-28 AT AT04786902T patent/ATE491826T1/de active
- 2004-09-28 JP JP2006527277A patent/JP4689611B2/ja not_active Expired - Fee Related
- 2004-09-28 WO PCT/DE2004/002203 patent/WO2005031043A1/de not_active Ceased
- 2004-09-28 EP EP04786902A patent/EP1668173B1/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DK1668173T3 (da) | 2011-04-04 |
| EP1668173B1 (de) | 2010-12-15 |
| WO2005031043A1 (de) | 2005-04-07 |
| DE502004012006D1 (de) | 2011-01-27 |
| ATE491826T1 (de) | 2011-01-15 |
| DE10346368A1 (de) | 2005-05-12 |
| JP2007506861A (ja) | 2007-03-22 |
| US20070035062A1 (en) | 2007-02-15 |
| DE10346368B4 (de) | 2006-05-18 |
| EP1668173A1 (de) | 2006-06-14 |
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