JP4504485B2 - Solar cell lead wire soldering equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a solar cell lead wire soldering apparatus for connecting a lead wire to positive and negative electrodes of a solar cell panel and taking out an output.
[0002]
[Prior art]
A solar cell module that directly converts solar energy into electric energy includes a laminate in which a transparent electrode layer, a semiconductor photoelectric conversion layer, and a back electrode layer are sequentially formed on an insulating substrate such as a glass substrate. The stacked body is separated into a plurality of photoelectric conversion cells by laser scribing or the like, and the photoelectric conversion cells are electrically connected in series or in parallel.
[0003]
Further, as shown in, for example, JP-A-9-326497, JP-A-9-135035, and JP-A-9-83001, lead wire attachment regions are provided at both ends of the solar cell module. Solder bumps are formed as positive and negative electrodes in the wire attachment region, and the output of the solar cell module is taken out by connecting lead wires to the solder bumps. And a lead wire is connected to the terminal box attached to the back surface of a solar cell module.
[0004]
Further, as an ultrasonic soldering apparatus for forming solder bumps in a lead wire attachment region, for example, Japanese Patent No. 2691685 and Japanese Patent Laid-Open No. 9-295133 are known, and ultrasonic vibration is applied to a soldering iron. Thus, it is configured to be soldered efficiently and reliably.
[0005]
In these methods, solder bumps having a spot diameter of about 2 mm are formed in rows at intervals of about 20 mm by ultrasonic soldering in lead wire attachment regions at both ends of the solar cell module, and then soldered onto the solder bump rows. A lead wire such as a plated copper foil is lined up and soldered by pressing the lead wire against a solder bump while heating the solder bump from above the lead wire.
[0006]
By the way, conventionally, in order to attach lead wires to the lead wire attachment regions at both ends of the solar cell module, a solder bump is formed as a preliminary solder in the lead wire attachment region, and then a solder-plated copper foil on the solder bump row The operation of aligning lead wires such as the above and soldering the lead wires to the solder bumps is performed manually.
[0007]
That is, when a lead wire is placed on a row of solder bumps and soldered by pressing a soldering iron from the upper surface of the lead wire, the lead wire may be displaced or wrinkles may occur. Therefore, a weight is suspended from the end of the lead wire, and soldering is performed while applying tension to the lead wire.
[0008]
[Problems to be solved by the invention]
However, the operation of manually soldering the lead wires to the solder bumps is inefficient, and requires a lot of man-hours for mass production, leading to an increase in cost. In addition, when soldering is performed by applying tension to the lead wires with weights, the lead wires between the soldered solder bumps are stretched, and when the solar cell module is installed on the roof of a building, etc. There is a risk that the lead wire may be detached from the solder bump or damaged due to thermal contraction of the lead wire.
[0009]
In addition, it has been attempted to continuously supply lead wires onto a row of solder bumps and perform automatic soldering by an automatic soldering apparatus. However, as described above, lead wires are made of solder-plated copper. Because it is formed of foil, solder may adhere to the guide surface due to friction with the guide surface that guides the lead wire, clogging may occur on the lead wire, or the lead wire may break, causing the lead wire to be smooth. There is a problem that can not be supplied to.
[0010]
The present invention has been made paying attention to the above circumstances, and the object of the present invention is to smoothly supply the lead wire to the lead wire mounting region of the solar cell and to automatically connect the lead wire to the solder bump. An object of the present invention is to provide a solar cell lead wire soldering apparatus which can be carried out easily and can improve work efficiency.
[0011]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a solar cell lead wire soldering apparatus for attaching a lead wire to a lead wire attachment region of a solar cell, wherein the solder bumps are formed in rows in the lead wire attachment region. A mounting section for mounting the battery;
A lead wire having a guide for continuously guiding a lead wire on the solder bump row of the solar cell, and at least a guide surface of the guide is coated with a material having a smaller coefficient of friction than a material forming the guide And a lead wire soldering iron that presses the lead wire against the solder bump and connects the lead wire to the solder bump.
[0012]
According to the above configuration, the lead wire guide surface of the lead wire supply unit is formed of, for example, Teflon (polytetrafluoroethylene, registered trademark) or nylon having a small friction coefficient, so that the lead wire can be smoothly placed on the solder bump array. The solder plated on the lead wire does not adhere to the guide surface due to friction, and the lead wire can be automatically connected to the solder bump.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0014]
1 to 3 show a lead wire soldering device for a solar cell, FIG. 1 is a side view, FIG. 2 is a partially enlarged side view, FIG. 3 is a side view showing a soldering portion, and FIG. FIG. 5 is a perspective view of a state in which solder bumps are formed on the solar cell, and FIG. 6 is a perspective view of a state in which lead wires are attached to the solar cell.
[0015]
First, the solar cell 1 will be described. As shown in FIG. 4, a laminated body 6 in which a transparent electrode layer 3, a semiconductor photoelectric conversion layer 4, and a back electrode layer 5 are sequentially formed on an insulating substrate 2 such as a glass substrate. I have. The stacked body 6 is separated into a plurality of photoelectric conversion cells 7 and each photoelectric conversion cell 7 is electrically connected.
[0016]
Furthermore, as shown in FIG. 5, lead wire attachment regions 8 are provided at both ends of the solar cell 1, and solder bumps 10 are formed in rows at predetermined intervals in the lead wire attachment region 8. . As shown in FIG. 6, a lead wire 11 is pressed onto the solder bump 10 on the row of solder bumps 10, as will be described later, and the lead wire 11 is connected to the solder bump 10. .
[0017]
Next, the lead wire soldering apparatus will be described with reference to FIGS.
[0018]
The solar cell 1 is fixedly supported on the mounting portion 12, and solder bumps 10 are formed in rows in the lead wire attachment regions 8 at both ends of the solar cell 1. A movable frame 13 that intermittently moves one pitch at a time in the direction of arrow A is provided above the mounting portion 12, and a lead wire soldering device 14 is vertically moved to the movable frame 13 via a Z-direction drive mechanism (not shown). It is provided freely.
[0019]
The lead wire soldering device 14 is provided with a mounting plate 15 that can be moved up and down by a Z-direction drive mechanism and extends in the vertical direction. A lead wire feeding portion 16 that feeds the lead wire 11 is provided above the mounting plate 15. ing. This lead wire 11 is a strip-like solder-plated copper foil having a width of about 2 mm, and is wound around a bobbin 17 that is rotatably supported by a mounting plate 15.
[0020]
A lead wire supply unit 18 is provided below the bobbin 17 along the mounting plate 15. In the lead wire supply unit 18, a vertical guide 19 and an arc guide 20 are provided continuously from the lower end of the vertical guide 19, and a horizontal guide 21 is provided continuously from the arc guide 20. The lead wire 11 drawn out from the bobbin 17 is inserted through the guide roller 21 in the order of the vertical guide 19, the arc guide 20, and the horizontal guide 21, and is led to the solar cell 1 on the mounting portion 12. Yes.
[0021]
The vertical guide 19 is provided with a lead wire holding cylinder 22. Further, the radius of curvature of the curved portion 20a of the arc guide 20 is set to R40 mm or more, preferably R60 mm or more. Further, the horizontal guide 21 is provided with a lower surface, that is, a guide groove 23 that opens toward the solar cell 1.
[0022]
Further, the vertical guide 19, the arc guide 20, and the horizontal guide 21 are formed by a gap having a width slightly larger than the thickness of the lead wire 11, and at least a portion of the inner surface that contacts the lead wire 11 has a small friction coefficient, for example, Teflon. Coating or nylon coating is applied, and the lead wire 11 is smoothly slid and guided and supplied. The vertical guide 19, the circular arc guide 20, and the horizontal guide 21 themselves may be formed of Teflon or nylon.
[0023]
Further, the horizontal guide 21 has a large diameter hole 24 penetrating toward the guide groove 23, a long hole 25 at the distal end side of the horizontal guide 21 across the large diameter hole 24, and a small diameter hole 26 at the proximal end side. It is installed. ,
Further, a side plate 27 is integrally provided on the mounting plate 15, and a first air cylinder 28 is attached to the side plate 27 in the vertical direction. A lead wire soldering iron 31 is attached to the lifting rod 29 of the first air cylinder 28 via a bracket 30 in the vertical direction.
[0024]
The lead wire soldering iron 31 includes an ultrasonic vibrator 32 and a iron 33 that is directly connected to the ultrasonic vibrator 32 and has an electric heater (not shown) therein. Is tapered. When no ultrasonic wave is applied, there is no ultrasonic vibrator, and only an electric heater (not shown) and the irons 31 and 33 are present. The iron 33 is opposed to the large diameter hole 24 of the horizontal guide 21 and penetrates the large diameter hole 24 so that the upper surface of the lead wire 11 can be pressed.
[0025]
The side plate 27 is provided with a bracket 34 that is inclined in a mountain shape about the axis of the lead wire soldering iron 31. The bracket 34 has a second air cylinder 35 and a second air cylinder 35 sandwiched between the lead wire soldering iron 31. Three air cylinders 36 are provided to be inclined. A lead wire pressing member 39 is attached to the lifting rod 37 of the second air cylinder 35 by a pin 38. The lead wire pressing member 39 is formed of a substantially triangular plate, and has a long pressing portion 39a along the length direction of the lead wire 11 in order to hold the lead wire 11 after soldering in a long range. The upper surface of the lead wire 11 is pressed through the long hole 25.
[0026]
A lead wire pressing pin 41 is attached to the lifting rod 40 of the third air cylinder 36. The lead wire pressing pin 41 has a tapered tip and penetrates the small diameter hole 26 of the horizontal guide 21 to press the lead wire 11 before soldering.
[0027]
Then, the second air cylinder 35, the first air cylinder 28, and the third air cylinder 36 are operated in this order to connect the lead wire 11 to the solder bump 10 formed in the lead wire attachment region 8 of the solar cell 1. A long range is pressed by the pressing member 39. Further, the lead wire 11 is pressed against the solder bump 10 by the lead wire soldering iron 31, and then the lead wire 11 is soldered to the solder bump 10 in a state where the lead wire 11 is pressed against the solder bump 10 by the lead wire holding pin 41. It is supposed to be.
[0028]
Next, the operation of the solar cell lead wire soldering apparatus configured as described above will be described.
[0029]
The solar cell 1 carried into the mounting portion 12 of the lead wire soldering device 14 has solder bumps 10 formed in a row in the lead wire attachment regions 8 at both ends, and the movable frame 13 is 1 in the arrow A direction. The lead wire 11 is soldered to the solder bump 10 of the solar cell 1 mounted on the mounting portion 12 by the lead wire soldering device 14 mounted on the movable frame 13 by intermittently moving the pitch.
[0030]
First, the lead wire soldering device 14 faces the lead wire attachment region 8 in which the solder bumps 10 at both ends of the solar cell 1 are formed. At this time, an alignment mark attached to the solar cell 1 is read by a camera (not shown) to perform positioning.
[0031]
When positioning the solar cell by pressing the solar cell against the positioning bar instead of the camera and alignment mark, the camera is not installed, a positioning bar (not shown) is installed, and the fixed positioning bar is used as a reference. The positioning is performed by pressing the reference surface of the solar cell against the fixed positioning bar with a movable positioning bar.
[0032]
Next, when the lead wire soldering device 14 is lowered by the Z-direction drive mechanism, the horizontal guide 21 attached to the attachment plate 15 approaches the lead wire attachment region 8 having the solder bumps 10.
[0033]
Next, the lead wire 11 is fed out from the bobbin 17, guided in the order of the vertical guide 19, the arc guide 20 and the horizontal guide 21, and further guided to the lead wire attachment region 8 having the solder bump 10 of the solar cell 1 by the guide groove 23. It has been. At this time, the inner surfaces of the vertical guide 19, the arc guide 20, and the horizontal guide 21 have a small friction coefficient, for example, Teflon coating or nylon coating, so that the lead wire 11 is smoothly slid and guided and supplied. The solder on the surface of the lead wire 11 is melted by the friction between the wire 11 and the guides 19, 20, 21 and collects in the guides 19, 20, 21, so that the lead wire 11 is not clogged or damaged. Further, by using the arc guide 20 of R40 or more, preferably R60 or more, the force applied to the arc guide 20 due to the tension of the lead wire 11 is dispersed, and the direction changing portion is further improved.
[0034]
Next, the lifting rod 37 of the second air cylinder 35 is lowered, and the lead wire 11 is pressed against the solder bump 10 by the lead wire pressing member 39. Next, the lifting rod 29 of the first air cylinder 28 is lowered and the lead wire 11 is pressed against the solder bump 10 by the lead wire soldering iron 31. Next, the lifting rod 40 of the third air cylinder 36 descends and presses the lead wire 11 against the lead wire attachment region 8.
[0035]
In this state, when the ultrasonic vibrator 32 of the lead wire soldering iron 31 is ultrasonically vibrated, ultrasonic vibration is sometimes applied to the pressure contact portion between the lead wire 11 and the solder bump 10 via the lever 33, and the lead The solder of the lead wire 11 and the solder bump 10 are melted by the heating of the electric heater built in the wire soldering iron 31, and the lead wire 11 is soldered to the solder bump 10.
[0036]
When one end of the lead wire 11 is soldered to the most advanced solder bump 10, the first, second, and third air cylinders 28, 35, and 36 are operated in this order to raise and lower the rods 29, 37, and 40. At the same time, the movable frame 13 moves one pitch in the direction of arrow A, solders the lead wire 11 to the next solder bump 10, and repeats the above operation, whereby one end side of the solar cell 1 is changed to the other end side. The lead wires 11 are connected to the solder bumps 10 in the row.
[0037]
At this time, the portion of the lead wire 11 after soldering can be pressed over a long range by the plate-like lead wire pressing member 39 along the longitudinal direction of the lead wire 11, and the portion before soldering is the lead wire pressing pin. 41, and the lead wire 11 between them is soldered to the solder bump 10. Therefore, no extra tension is applied to the lead wire 11, and the lead wire 11 is caused by thermal contraction of the lead wire 11 after soldering. It does not come off from the solder bump 10.
[0038]
Thus, when the soldering of the lead wire 11 is completed over the entire length of the lead wire attachment region 8, the lead wire 11 is cut at a predetermined length. When the lead wire 11 is cut, the solar cell 1 is carried out, and the next solar cell 1 is carried into the mounting portion 12. Therefore, the attachment of the lead wire 11 to the solder bump 10 of the solar cell 1 can be performed automatically.
[0039]
【The invention's effect】
As described above, according to the first aspect of the present invention, by using a material having a low friction coefficient on the surface of the lead wire guide portion with respect to the lead wire mounting region of the solar cell, the lead is provided inside the guide portion. The lead wire will not stick, the lead wire will not be clogged or damaged, the lead wire can be supplied smoothly, and the lead wire can be automatically connected to the solder bump formed in the lead wire mounting area. The work efficiency can be improved.
[Brief description of the drawings]
FIG. 1 is a side view of a solar cell lead wire soldering apparatus according to a first embodiment of the present invention.
FIG. 2 is an enlarged side view of a part of the lead wire soldering apparatus according to the embodiment.
FIG. 3 is an enlarged side view of the lead wire soldering portion of the embodiment.
FIG. 4 is a cross-sectional view of the solar cell of the same embodiment.
FIG. 5 is a perspective view showing a state in which solder bumps are formed on the solar cell of the embodiment.
FIG. 6 is a perspective view of a state where lead wires are attached to the solar cell of the embodiment.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Solar cell 8 ... Lead wire attachment area | region 10 ... Solder bump 11 ... Lead wire 12 ... Mounting part 14 ... Lead wire soldering apparatus 18 ... Lead wire supply part 31 ... Lead wire soldering iron

Claims (2)

In a solar cell lead wire soldering apparatus for attaching a lead wire to a solar cell lead wire mounting region,
A mounting portion for mounting solar cells in which solder bumps are formed in a row in the lead wire mounting region;
A lead wire having a guide for continuously guiding a lead wire on the solder bump row of the solar cell, and at least a guide surface of the guide is coated with a material having a smaller coefficient of friction than a material forming the guide A supply section;
A lead wire soldering iron that presses the lead wire against the solder bump and connects the lead wire to the solder bump;
A lead wire soldering device for solar cells, comprising: The solar cell lead wire soldering apparatus according to claim 1, wherein the coating is a polytetrafluoroethylene coating or a nylon coating.

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