JP4303482B2 - Device for removing remaining gate and tie bar after resin sealing of semiconductor device, and method for manufacturing semiconductor device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an apparatus and method for removing a gate residue / tie bar performed after resin sealing of a semiconductor chip. The present invention also relates to a semiconductor device manufacturing apparatus and method.
[0002]
[Prior art]
Conventionally, as a semiconductor device, a resin-sealed type device is known in which a semiconductor chip disposed on a lead frame is placed in a mold cavity and resin is injected into the cavity and cured. ing. In addition, a method of forming a tie bar between leads of a lead frame is known in order to prevent the resin from flowing out around the lead frame during resin sealing. The tie bar is removed after resin sealing. However, since there is a gate residue in the lead frame after resin sealing, if the tie bar is removed while the gate residue remains, the gate residue may damage parts such as a die used for tie bar removal. Therefore, it is necessary to perform the gate cut process before the tie bar cut process.
[0003]
In view of this, a conventional removal device (cutting device) for cutting the remaining gate from the resin package is provided with a remaining gate cutting die located at the lower part of the lead frame and a punch die located at the upper part of the lead frame. The cutting die is formed in the lower die, the punch die is formed in the upper die, the lower die further includes a tie bar cutting die for cutting a tie bar (dam bar) of the lead frame, and the upper die corresponds to the tie bar cutting die. One that further includes a punch die has been proposed (see, for example, Patent Document 1).
[0004]
[Patent Document 1]
Japanese Patent Laid-Open No. 11-233541
[Problems to be solved by the invention]
However, in the case where the gate residual removal unit and the tie bar removal unit are provided in the removal device, due to interference between the gate residual and the gate residual removal member at the time of cutting the gate residual by the cutting die and the punch die in the gate residual removal unit. A lateral force is generated in the lead frame, and as a result, the lead frame may be displaced. In this case, the tie bar cutting accuracy at the tie bar removing unit is lowered.
[0006]
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a gate residue / tie bar removal apparatus and method that can prevent lead frame misalignment and thus realize highly reliable tie bar removal.
[0007]
The present invention also aims to provide an apparatus and method for realizing reliable tie bar removal and thus manufacturing high quality semiconductor devices.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, a removal apparatus according to the present invention comprises:
In a removing apparatus for removing a gate residue and a tie bar with respect to a common lead frame in which first and second resin packages in which first and second semiconductor chips are sealed with resin are disposed,
A first removal portion for disposing the first resin package and removing the remaining gate from the first resin package;
The second resin package is disposed, and a second removal unit for removing a tie bar corresponding to the second resin package from the lead frame;
With
The first removal portion is disposed with the lead frame sandwiched therebetween, and two sandwiching members for removing the gate residue of the first resin package by sandwiching the lead frame therebetween, and the first resin package A release member that releases the lead frame from a state in which the two clamping members sandwich the lead frame after removing the gate residue of
The second removing unit removes the tie bar corresponding to the second resin package from the lead frame in a state where the lead frame is released from the holding of the two holding members by the release member.
It is characterized by that.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the accompanying drawings.
[0010]
Embodiment 1 FIG.
1-3 is a block diagram which shows Embodiment 1 of the removal apparatus which concerns on this invention. The apparatus 2 includes a removal portion (first removal portion) 4 for removing a gate residue after sealing a semiconductor chip disposed on the lead frame L with a resin, and a gate residue with respect to a guide direction 8 of the lead frame L. A removal unit (second removal unit) 10 is provided on the downstream side of the removal unit 4 for removing the tie bars. As will be described below, some components of the removal device 2 are used in common for the remaining gate removal unit 4 and the tie bar removal unit 10 and are unique to each removal unit 4.
[0011]
The removing device 2 has a lower die set 12, and a guide post 14 extending in the vertical direction is fixed to the die set 12. An upper die set 15 is supported on the guide post 14 so as to be movable up and down. Lower and upper die sets 12 and 15 are respectively provided with lower and upper stoppers 16 and 17 facing each other. The upper die set 15 moves up and down between a standby position as shown in the figure and a position where the upper surface of the lower stopper 16 and the lower surface of the upper stopper 17 are in contact with each other.
[0012]
A lower holder 18 is fixed on the lower die set 12. The lower holder 18 is fixed with the remaining gate cut punch unit 20 of the remaining gate removal portion 4 and the tie bar cut die 22 of the tie bar removal portion 10.
[0013]
As shown in FIG. 2, the remaining gate cut punch unit 20 includes a lifter 24 having a protrusion 24a facing the remaining gate G of the lead frame L, and a housing member 25 for housing the lifter 24 so as to be movable up and down. ing. The lifter 24 is connected to one end of a coil spring 26 disposed inside a hole provided in the housing member 25 and is biased upward. Reference numeral 28 denotes a screw for incorporating the coil spring 26 into the hole. The uppermost surface 25a of the housing member 25 is set to a height substantially equal to the tip of the protrusion 24a of the lifter 24 positioned at the uppermost portion by being urged by the spring 26. The lower support member that sandwiches the lead frame L together with the remaining gate cut stripper (described later) is configured.
[0014]
The tie bar cut die 22 constitutes a lower support member that sandwiches the lead frame L together with a tie bar cut stripper (described later) when the tie bar is cut. Specifically, as shown in FIG. 3, the lead frame support surface of the tie bar cut die 22 is uneven according to the lead pitch of the lead frame L, receives the lead frame at the convex portion, and the inner surface of the concave portion 22 a. Forms a blade portion. The recess 22a forms a through hole communicating with a tie bar discharge hole 22b formed on the lower side of the die 22. The lower die set 12 has tie bar discharge holes 12a for removing the cut tie bars corresponding to the tie bar discharge holes 22b.
[0015]
An upper holder 32 is fixed to the upper die set 15. A guide pin 36 extending in the vertical direction for supporting the stripper plate 34 so as to be movable up and down is fixed to the upper holder 32. A stripper 38 for removing the gate residue and a stripper 39 for removing the tie bar 10 are fixed to the stripper plate 34. The remaining gate cut stripper 38 is a member that supports the lead frame L when cutting the remaining gate, and cooperates with the protrusion (cutting member) 24a of the lifter 24 to pinch the remaining gate to remove the remaining gate G. Disconnect. The remaining gate cut stripper 38 also constitutes an upper support member that sandwiches the lead frame L together with the housing member 25 when the cutting of the remaining gate G is completed. The tie bar cut stripper 39 also constitutes an upper support member that holds the lead frame L together with the tie bar cut die 22 when the tie bar is cut. The lower surface 38a of the stripper 38 and the lower surface 39a of the stripper 39 are set to substantially the same height.
[0016]
One end of a push rod 40 extending in the vertical direction is fixed to the upper surface of the stripper plate 34. The push rod 40 penetrates the upper holder 32, and the other end is connected to a coil spring 42 provided in the upper die set 15 to urge the push rod 40 downward. Reference numeral 44 represents a screw for incorporating the coil spring 42 into the upper die set 15.
[0017]
Between the lower holder 18 and the stripper plate 34, there is a guide rail 50 (not shown in FIG. 1) for guiding the lead frame L into the remaining gate removing portion 4 and further transporting it to the tie bar removing portion 10. It is provided. The guide rail 50 is moved to the stripper plate 34 by the standby position shown in the figure arranged between the lower holder 18 and the stripper plate 34 with a predetermined gap therebetween, and the lowering of the stripper plate 34 as will be described later. It is pushed down and can move up and down between the lower holder 18 and the gate remaining / tie bar removal position held between the stripper plate 34. For this reason, although not shown in the drawings, a coil spring is disposed inside the lower holder 18 so as to penetrate vertically, and one end of the spring is connected to the lower surface of the guide rail 50 and biased upward. Yes.
[0018]
As shown in FIG. 2, a push-down pin (a separating member in a broad sense) 52 of the remaining gate removal portion 4 is fixed to the upper holder 32. The push-down pin 52 is fitted in a through hole provided in the stripper plate 34 and the remaining gate cut stripper 38 so as to be movable up and down. The upper surface 24b of the lifter 24 faces the lower surface 52a of the push-down pin 52, and can come into contact with the push-down pin 52 when the push-down pin 52 is lowered. The difference in height between the pressing pin lower surface 52a and the stripper lower surface 38a is set smaller than the difference in height between the tip of the lifter projection 24a and the upper surface 24b. In order to prevent the lead frame L from interfering with the lead frame L when the push pin 52 is lowered while the lead frame L is disposed at a predetermined position, the lead frame L has a hole for passing the push pin (not shown). Is formed.
[0019]
As shown in FIG. 3, a tie bar cut punch 54 of the tie bar removing unit 10 is fixed to the upper holder 32 in order to cut and remove the tie bar in cooperation with the recess 22 a constituting the blade part of the die 22. Yes. The tie bar cut punch 54 is fitted into a through hole provided in the stripper plate 34 and the tie bar cut stripper 39 so as to be movable up and down. The tie bar cut punch 54 also has a plurality of cutting blades (protrusions) 54 a facing the die 22, and the size and pitch of these cutting blades 54 a are set so as to be able to be inserted into the concave portions 22 a of the die 22. Yes.
[0020]
Further, a positioning hole (not shown) provided in the lead frame L and a pin 56 for positioning the lead frame L by being inserted into the positioning hole 22 c provided in the die 22 are fixed to the upper holder 32. The positioning pins 56 are inserted into through holes provided in the stripper plate 34 and the tie bar cut stripper 39 so as to be movable up and down. The lower end 56a of the positioning pin 56 is formed in a taper shape so that the positioning pin 56 can be easily inserted into the positioning hole of the lead frame L and the positioning hole 22c of the die 22. The elongated portion 56b other than the lower end 56a of the positioning pin 56 has substantially the same diameter as the two positioning holes. As will be described later, the tie bar cut punch 54 with the elongated portion 56b inserted in the positioning hole. The tie bar is removed by. For this reason, the end (lower end) position of the elongated portion 56 b is set below the lower surface of the cutting blade 54 a of the tie bar cut punch 54. The positioning pin 56 and the push-down pin 50 of the remaining gate removal portion 4 are in a predetermined vertical position relationship, which will be described when the operation of the removal device 2 is described.
[0021]
Next, the operation of the removal apparatus 2 will be described with reference to FIGS. First, the ribbon-like lead frame L is moved along the guide rail 50 in the direction of arrow 8 by a predetermined distance, and the resin package (first resin package) 60 after resin sealing is attached to the gate remaining removal portion 4 with a tie bar. Resin packages (second resin packages) 62 from which the gate residue has already been removed by the gate residue removal unit 4 are respectively disposed in the removal unit 10. Next, by lowering the upper die set 15 along the guide post 14, the stripper plate 34 fixed to the push rod 40 and the strippers 38 and 39 fixed to the plate 34 are lowered. As the upper die set 15 is lowered, the stripper plate 34 contacts and further presses the guide rail 50 to push down the guide rail 50.
[0022]
When the upper die set 15 is further lowered, as shown in FIG. 4, the stripper plate 34 comes into contact with the lower holder 18 with the guide rail 50 interposed therebetween and stops. At this time, as shown in FIG. 5, the remaining gate of the first resin package 60 is clamped and removed by the lower surface 38a of the stripper 38 and the lifter projection 24a (when the cutting is completed, The lead frame L is sandwiched between the uppermost surfaces 25a of the housing members 25 of the remaining gate cut punch unit 20.) On the other hand, in the second resin package 62, the lead frame L is formed by the stripper 39 and the die 22. It is pinched. At this time, the tie bar removing unit 10 does not remove the tie bar of the second resin package 62. A method for discharging the cut gate residue to the outside of the apparatus will be described in the second embodiment.
[0023]
Thereafter, when the upper die set 15 is further lowered, the upper pin 32 fixed to the die set 15 is lowered, so that the push-down pin 52 of the gate remaining removal unit 4 and the tie bar cut punch 54 / positioning pin of the tie bar removal unit 10 56 is guided downward in the through holes formed in the stripper plate 34 and the strippers 38 and 39, while the stripper 39 presses the compression coil spring 32 via the push rod 40, and the reaction force causes the lead frame L is further pressed into the die 22. Subsequently, the push-down pin 52 comes into contact with the upper surface 24b of the lifter 24 and pushes the lifter 24 downward against the urging force of the spring 26, so that the protrusion 24a of the lifter 24 is inserted into the lead frame L as shown in FIG. Separate from. When the lead frame L is released from the state of being sandwiched between the lifter protrusion 24a and the stripper 38, the positioning pin 56 has its lower end 56a inserted into the positioning hole of the lead frame L and the positioning hole 22c provided in the die 22. The elongated portion 56b is not inserted into the positioning hole. Accordingly, when the remaining gate G of the first resin package 60 is clamped and cut by the stripper 38 and the lifter 24, a lateral force, that is, a horizontal component force (force along the surface direction of the lead frame L) is applied to the lead frame L. Even if F (FIG. 5) occurs, the tie bar removal accuracy of the second resin package 62 is not affected.
[0024]
Further, when the upper die set 15 is lowered, the elongated portion 56b of the positioning pin 56 is inserted into the positioning hole of the lead frame L and the positioning hole 22c of the die 22 as shown in FIG. Is positioned. In this state, when the upper die set 15 is further lowered, the tie bar cut punch 54 fixed to the upper holder 32 is lowered, and as shown in FIG. 8, the blade 22a (FIG. 3) of the die 22 and the punch 54a Then, the tie bar of the second resin package 62 (FIG. 3) is clamped and cut. Then, the upper die set 15 is stopped by contact of the lower and upper stoppers 16 and 17. The cut tie bar is discharged out of the apparatus through the discharge holes 22b and 12a.
[0025]
Thereafter, the upper die set 15 is raised to cause each member of the removing device 2 to perform an operation reverse to that at the time of lowering, and the guide rail 50 is returned to the standby state. Subsequently, the lead frame L is moved by a predetermined distance, and the first resin package 60 from which the remaining gate is removed is placed in the tie bar removing unit 10 at a resin package (not shown) located on the upstream side of the resin package 60 in the lead frame L guide direction. Is disposed in the remaining gate removal portion 4. Then, the gate remaining removal process and the tie bar removal process as described above are repeated.
[0026]
As described above, according to the removing device 2 according to the present embodiment, even when a lateral force is generated due to interference with the stripper 38 and the lifter 24 when removing the remaining gate of the first resin package 60, Since the tie bar of the second resin package 62 is not removed (that is, the lead frame L is not clamped by the punch 54 and the die 22), the tie bar can be removed with high accuracy. Therefore, a high quality semiconductor device can be manufactured. Further, the positioning pin 56 of the tie bar removing unit 10 is inserted into the positioning hole of the lead frame L in a state where the stripper 38 and the lifter projection 24a of the gate remaining removing unit 4 cut the gate remaining G and then the lead frame L is released. Therefore, the positioning pin 56 can be smoothly inserted into the lead frame positioning hole, and as a result, damage to the lead frame L and the positioning pin 56 can be suppressed.
[0027]
Embodiment 2. FIG.
FIG. 9 is a diagram showing a remaining gate removal section in the second embodiment of the removal apparatus according to the present invention. In the following description, constituent elements that are the same as or similar to those in the first embodiment are represented by the same reference numerals or the same reference numerals with appropriate subscripts added.
[0028]
The gate remaining removal portion is formed on the lower side of the gate residue G (under the lead frame L) of the resin package 60 by the protrusion 24a ′ of the lifter 24 ′ and the stripper 38, similarly to the gate remaining removal portion 4 of the first embodiment. The lead frame L is sandwiched between the stripper lower surface 38a and the uppermost surface 25a ′ of the accommodating member 25 ′ of the remaining gate cut punch unit 20). Thereafter, the lifter 24 ′ is pushed down by the push-down pin 52, and the lead frame L is released from the state of being held between the lifter projection 24 a ′ and the stripper 38. The gate residue removal unit further includes a mechanism for discharging the cut gate residue and the resin powder (cutting waste) generated at the time of cutting out of the apparatus.
[0029]
Specifically, the lifter 24 ′ of the remaining gate punch unit 20 ′ and the lower part (lifter support part) of the lifter 24 ′ of the housing member 25 ′ have holes extending vertically through the members 24 ′ and 25 ′. 70 is formed. This through-hole 70 is used as a passage for discharging the cut gate residue G and the resin powder P ₁ scattered to the opposite side of the resin package 60 when cutting. The through-hole 70 is provided with an annular shoulder 70a on the inner surface portion close to the lifter upper surface 24b ′. A screw 28 ′ having a hole 28 a ′ penetrating the center is fitted into the lower end portion of the through hole 70. In the through hole 70, a coil spring 26 'is accommodated in contact with the shoulder 70a and the upper surface of the screw 28', thereby urging the lifter 24 'upward. The upper surface portion and the hollow portion of the spring 26 ′ are covered with a collar 72, thereby preventing foreign matter (for example, resin powder) from being mixed between the springs 26 ′ and inhibiting the expansion and contraction of the spring 26 ′. Good. The collar 72 has a ring-shaped cross section, and a spring 26 'is disposed on the outer side of the ring, and a hollow portion on the inner side of the ring includes an upper surface 24a' of the lifter 24 'and a lower surface 25b of the lifter support portion of the housing member 25'. Form part of the passage connecting '. Although not shown, this passage communicates with a through hole provided in the lower die set, and the through hole is connected to a suction device. The housing member 25 ′ also has a side surface 25c ′ formed so as to surround the space above the lifter upper surface 24b ′. In the figure, reference numeral 25d 'denotes an annular shoulder portion of the housing member 25' for holding the lifter 24 'in the uppermost position by engaging with an annular protrusion 24c' formed on the outer periphery of the lower end of the lifter 24 '. .
[0030]
A part of the housing member 25 ′ located below the resin package 60 arranged at a predetermined position of the remaining gate removal portion extends from the upper surface 25 e ′ facing the resin package 60 to the lower surface 25 f ′ in contact with the lower die set. A hole 74 is formed. The upper end of the through-hole 74 is disposed in the vicinity of the remaining gate cutting position, and is connected to the suction device via the through-hole provided in the lower die set. used for discharging the resin powder P ₂ out of the apparatus. The housing member 25 ′ further surrounds the lower surface of the lead frame of the resin package 60 together with the uppermost surface 25g ′ (approximately the same height as the uppermost surface 25a ′) that supports the lead frame L when the remaining gate is cut. And has a side surface 25h ′.
[0031]
In the remaining gate removal portion, when the remaining gate is clamped and cut by the lifter protrusion 24a ′ and the stripper 38, the lifter 24 ′ and the housing member 25 ′ (side surface 25c ′) are provided on the side opposite to the resin package 60. , and since the substantially closed chamber in the lead frame L is formed, never resin powder P ₁ is scattered to such adjacent tie bar removal unit. Therefore, the tie bar removing portion and the gate remaining portion can be disposed close to each other, and the removal device can be downsized. It was cut gate remaining G and resin powder P ₁ is removed from the removal device by the suction device. As described above, it is possible to prevent the cutting gate residue and the resin powder from remaining in the apparatus, and it is possible to prevent a cutting defect (semiconductor device processing defect) from occurring due to the resin waste. After cutting the remaining gate G, the push-down pin 52 advances into the closed chamber through the hole 78 formed in the lead frame L and pushes down the lifter 24 ′.
[0032]
On the other hand, on the resin package 60 side, a chamber substantially closed by the lifter 24 ′, the housing member 25 ′ (the upper surface 25 e ′ and the side surface 25 h ′), the resin package 60 and the lead frame L is formed. P ₂ is prevented from scattering to such adjacent tie bar removal unit. The resin powder P ₂ generated during cutting are removed from the removal device by the suction device. Therefore, it is possible to prevent the resin powder from remaining in the apparatus, and to prevent the resin powder from being deposited on the resin package 60 due to accumulation of the resin powder or the like.
[0033]
Since the cut gate residue and the resin powder are present in a substantially closed space, dust collection by suction is easy, and thus a removal device with easy maintenance can be provided.
[0034]
As shown in the figure, the upper ends of the through holes 70 and 74 are tapered so that the cutting gate residue G and the resin powders P ₁ and P ₂ can be prevented from falling due to their own weight, and a wide area can be sucked by the suction device. It may be.
[0035]
【The invention's effect】
According to the present invention, highly reliable tie bar removal can be realized.
[Brief description of the drawings]
FIG. 1 is a side view showing a first embodiment of a removing apparatus according to the present invention.
2 is a cross-sectional view of a remaining gate removal portion along the line II-II in FIG. 1;
FIG. 3 is a cross-sectional view of a tie bar removing portion taken along line III-III in FIG.
FIG. 4 is a cross-sectional view of a remaining gate removal portion showing that the remaining gate is being cut.
FIG. 5 is an enlarged side view showing a remaining gate cutting position.
FIG. 6 is a diagram for explaining a positional relationship between a lifter / push-down pin of a gate remaining removal portion and a positioning pin of a tie bar removal portion immediately after the gate remaining cutting.
FIG. 7 is a view for explaining the positional relationship between a lifter / push-down pin of a remaining gate removal portion and a positioning pin of a tie bar removal portion in a state where the lifter protrusion is sufficiently separated from the lead frame after the remaining gate is cut.
FIG. 8 is a cross-sectional view showing a state in which the protrusion of the tie bar cut punch is fitted into the concave portion of the die in the tie bar removing portion.
9A is a partial perspective view of a remaining gate removal portion, and FIG. 9B is a partial cross-sectional view of the remaining gate removal portion after cutting the remaining gate in the second embodiment of the removal apparatus according to the present invention;
[Explanation of symbols]
2: removal device (removal unit), 4: gate remaining removal unit, 10: tie bar removal unit, 12: lower die set, 15: upper die set, 20: gate remaining cut punch unit, 22: tie bar cut die, 24 : Lifter, 24a: Projection (cutting member), 25: Housing member (lower support member), 38: Stripper, 39: Stripper, 50: Guide rail, 52: Push-down pin (separating member), 54: Tie bar cut Punch, 56: positioning pin, 60: first resin package, 62: second resin package, L: lead frame, G: remaining gate.

Claims (9)

In a removing apparatus for removing a gate residue and a tie bar with respect to a common lead frame in which first and second resin packages in which first and second semiconductor chips are sealed with resin are disposed,
A first removal portion for disposing the first resin package and removing the remaining gate from the first resin package;
The second resin package is disposed, and a second removal unit for removing a tie bar corresponding to the second resin package from the lead frame;
With
The first removal portion is disposed with the lead frame sandwiched therebetween, and two sandwiching members for removing the gate residue of the first resin package by sandwiching the lead frame therebetween, and the first resin package A release member that releases the lead frame from a state in which the two clamping members sandwich the lead frame after removing the gate residue of
The second removing unit removes the tie bar corresponding to the second resin package from the lead frame in a state where the lead frame is released from the holding of the two holding members by the release member.
A removal device characterized by that. In a removing apparatus for removing a gate residue and a tie bar with respect to a common lead frame in which first and second resin packages in which first and second semiconductor chips are sealed with resin are disposed,
  A first removal portion for disposing the first resin package and removing the remaining gate from the first resin package;
  The second resin package is disposed, and a second removal unit for removing a tie bar corresponding to the second resin package from the lead frame;
With
The second removal portion includes a positioning pin that is inserted into a hole provided in the lead frame and positions the lead frame, and a tie bar that corresponds to the second resin package in a state where the positioning pin positions the lead frame. With tie bar cut punch to remove,
  The first removal portion is disposed with the lead frame sandwiched therebetween, and two sandwiching members for removing the gate residue of the first resin package by sandwiching the lead frame therebetween, and the first resin package A release member that releases the lead frame from a state in which the two clamping members sandwich the lead frame after removing the gate residue of
The release member removes the gate residue of the first resin package before the positioning pin positions the lead frame, and then the lead frame is in a state in which the two holding members sandwich the lead frame. Release,
The removal apparatus characterized by the above-mentioned. The positioning pin has an elongated portion that matches the shape of the hole provided in the lead frame, and a tapered lower end portion continuous to the elongated portion,
  In a state where the lower end portion of the positioning pin is inserted into the hole, the two members sandwich the lead frame, and the release mechanism is inserted into the lead before the elongated portion of the positioning pin is inserted into the hole. 3. The removing device according to claim 2, wherein the frame is released from the holding of the two members. One of the two clamping members is a support member that supports the lead frame, and the other is a punch unit that cuts the remaining gate together with the support member,
The punch unit is biased in a direction toward the support member,
  The release member includes a separation member that moves the punch unit in a direction opposite to a direction in which the punch unit is biased after cutting the remaining gate, thereby separating the punch unit from the lead frame. 3. The removing apparatus according to item 3. The removal device according to claim 4, wherein the separation member has a push-down pin that pushes down the punch unit, and the push-down pin and the positioning pin are fixed to a common holder and move simultaneously. The gate remainder is formed on the lower surface of the lead frame,
  The punch unit is disposed below the lead frame,
  The punch unit of the first removal unit includes a lower support member that supports a lower surface of the lead frame when cutting the remaining gate and forms a substantially closed chamber together with the lead frame and the cutting member.
  A hole communicating with the outside is formed in the bottom surface of the chamber,
  6. The removing device according to claim 4, wherein the gate residue and gate residue cutting waste are removed by suction from an external suction device through the hole. The lower support member forms a second chamber that is substantially closed together with the lead frame, the cutting member, and the resin package when the remaining gate is cut;
  A hole communicating with the outside is formed in the bottom surface of the second chamber,
  7. The removing device according to claim 6, wherein the remaining gate cutting waste is removed by suction from an external suction device through the hole. A resin sealing step in which the first and second semiconductor chips disposed on the common lead frame are resin-sealed to form first and second resin packages, respectively;
  The lead frame is moved to a removal device having a first removal portion for removing the remaining gate and a second removal portion for removing the tie bar, and the first resin package is moved to the first removal portion. A disposing step in which the second resin package is disposed in the second removal portion, respectively.
  In the first removal section, a gate residue removing step in which two sandwiching members arranged with the lead frame interposed therebetween sandwich the pressure to remove the gate residue of the first resin package;
  A release step of releasing the lead frame from a state in which the two clamping members sandwich the lead frame after removing the gate residue of the first resin package;
  In the second removal section, a tie bar removing step of removing a tie bar corresponding to the second resin package from the lead frame in a state where the lead frame is released from the holding of the two holding members by the releasing step. When,
including,
A method for manufacturing a semiconductor device. A resin sealing step in which the first and second semiconductor chips disposed on the common lead frame are resin-sealed to form first and second resin packages, respectively;
  The lead frame is moved to a removal device having a first removal portion for removing the remaining gate and a second removal portion for removing the tie bar, and the first resin package is moved to the first removal portion. A disposing step in which the second resin package is disposed in the second removal portion, respectively.
  In the first removal section, a gate residue removing step in which two sandwiching members arranged with the lead frame interposed therebetween sandwich the pressure to remove the gate residue of the first resin package;
  A release step of releasing the lead frame from a state in which the two clamping members sandwich the lead frame after removing the gate residue of the first resin package;
  A tie bar that removes a tie bar corresponding to the second resin package from the lead frame in a state where the positioning pin is inserted into a hole provided in the lead frame and the lead frame is positioned in the second removing portion. A removal step;
Including
  In the releasing step, before the positioning pins position the lead frame, the two holding members release the lead frame from a state of sandwiching the lead frame.
A method for manufacturing a semiconductor device.

Images