JP4301110B2 - Continuous molding method and apparatus for fiber reinforced resin molded product - Google Patents

Description

  The present invention relates to a molding method and apparatus for a fiber-reinforced resin molded article having a surface layer containing a pattern material and excellent in design.

  Conventionally, resin molded products in which a surface layer includes a pattern material and a base material layer is reinforced with a fiber material have been used for various applications such as bathroom floor materials and wall materials. For the production of this type of resin molded product, a method is used in which a molding sheet having a pattern material and a fiber reinforced resin molding material are overlapped and set in a mold, and are integrally heat-pressure molded in the mold. Yes. For example, Japanese Patent Laid-Open No. 2001-62949 (Patent Document 1) discloses a surface material made of a decorative bulk molding compound (BMC) containing a pattern material, and a sheet molding compound (SMC) or BMC containing no pattern material. A method of manufacturing a decorated FRP molded product by stacking a back side material made of a fiber reinforced resin molding material such as the above and integrally hot pressing in a mold is described. JP-A-9-174792 (Patent Document 2) discloses a decorative molding sheet having a structure in which a printed or patterned base sheet is impregnated with a thermosetting resin composition containing a pattern material. Is prepared, and the decorative molding sheet is set in a mold together with a thermosetting molding material such as SMC or BMC, followed by hot press molding to produce a decorative molded product.

  However, since the conventional manufacturing method is hot press molding using a mold, there is a problem that a long product cannot be produced. Further, since SMC and BMC are used, the finished product has a large rigidity, and there is a problem that a flexible product cannot be manufactured.

  By the way, the continuous forming method of FRP sheet is known conventionally. In this continuous molding method, a first carrier film is caused to travel along a predetermined traveling path, a liquid thermosetting resin is supplied to the carrier film in a predetermined thickness, and a reinforcing fiber material is provided thereon. Then, the fiber material for reinforcement is impregnated with an impregnation roller or the like to form a resin-impregnated fiber layer, and a second carrier film is placed thereon, and if necessary, the first carrier film and the second carrier film are covered. The resin-impregnated fiber layer is sandwiched by a defoaming roller or the like from the outside of the carrier film to perform defoaming and thickness regulation, then the resin is heated and cured by passing through a curing furnace, and then the first and second In this method, the carrier film is peeled off, whereby a long FRP sheet can be produced with high productivity. The carrier film used here is usually a flat film, but it is also known to produce an FRP sheet having an embossed surface by using an embossed film instead of the flat film [for example, a special film. No. 57-144724 (Patent Document 3)].

Accordingly, the present inventors have focused on applying a conventionally known FRP sheet continuous molding method to produce a long fiber-reinforced resin molded product containing a pattern material, and the first carrier Continuous molding was performed using a thermosetting resin in which a pattern material was uniformly mixed as a liquid thermosetting resin to be supplied onto the film. However, even if the pattern material is well mixed and dispersed in the liquid thermosetting resin and supplied onto the carrier film, the dispersion of the pattern material becomes uneven when the resin is impregnated with the reinforcing fiber material. As a result, the dispersion of the pattern material is increased, resulting in a problem that the appearance of the obtained FRP sheet is deteriorated.
JP 2001-62949 A JP-A-9-174792 JP-A-57-144724

  The present invention has been made in view of such a situation, and a long resin molded product in which the surface layer is contained in a form in which the pattern material is well dispersed and the base material layer is reinforced with a fiber material has high productivity. It is an object of the present invention to provide a continuous molding method and apparatus for a fiber-reinforced resin molded product that can be produced and that can also produce a flexible resin molded product.

In the continuous molding method of the invention according to claim 1 of the present invention, it is possible to continuously mold a fiber-reinforced resin molded product containing a pattern material in a form in which a pattern material is well dispersed in a surface layer. Supplying a liquid thermosetting resin and a reinforcing fiber material onto the first carrier film, and impregnating the reinforcing fiber material with the thermosetting resin to form a resin-impregnated fiber layer; Forming a pattern material-containing resin layer by supplying a liquid thermosetting resin in which a pattern material is mixed and dispersed in advance on a second carrier film traveling on a path; and the second carrier film A semi-cured pattern material-containing resin layer formed on the first carrier film and a resin-impregnated fiber layer formed on the first carrier film. Along with the second carrier film, the pattern material-containing tree A step of facing and overlapping the resin-impregnated fiber layer, and a step of curing the resin-impregnated fiber layer and the handle material-containing resin layer that are being overlapped and being sandwiched between the first and second carrier films It is set as the structure which has.

  The invention according to claim 2 is the invention according to claim 1, wherein the second carrier film is an embossed sheet.

  The invention according to claim 3 is the invention according to claim 1 described above, wherein the pattern material is a resin granule or a cut product of a resin film.

The invention according to claim 4 provides an apparatus used for carrying out the continuous molding method of the invention according to claim 1 described above, and is a first device provided to travel along a predetermined route. A liquid thermosetting resin and a reinforcing fiber material are supplied onto the carrier film and the running first carrier film, and the reinforcing fiber material is impregnated with the thermosetting resin to form a resin-impregnated fiber layer. A resin-impregnated fiber layer forming means to be formed, a second carrier film provided so as to travel in a position that overlaps the first carrier film after traveling along a horizontal path, and the horizontal path A pattern material-containing resin layer forming means for supplying a liquid thermosetting resin in which a pattern material is mixed and dispersed in advance to form a pattern material-containing resin layer on the traveling second carrier film; Second carrier film A semi-curing heating device that heats the handle material-containing resin layer being held and semi-cured and a semi-cured handle material-containing resin layer together with a second carrier film on the first carrier film. Overlaid on the formed resin-impregnated fiber layer with an overlapping means for overlapping the pattern material-containing resin layer so as to face the resin-impregnated fiber layer, it is overlapped and traveled by being sandwiched between the first and second carrier films A continuous molding device for a fiber-reinforced resin molded product, comprising a curing heating device for heating the resin-impregnated fiber layer and the pattern material-containing resin layer therein.

  The invention according to claim 5 is the invention according to claim 4, wherein the second carrier film is an embossed sheet.

In the above-described method and apparatus for molding a fiber-reinforced resin molded article of the present invention, a liquid thermosetting resin in which a pattern material is mixed and dispersed in advance is supplied onto the second carrier film to form a pattern material-containing resin layer. After forming and semi-curing the pattern material-containing resin layer, it is laminated and integrated on the resin-impregnated fiber layer formed on the first carrier film, and is heated and cured. If a pattern material-containing resin layer in which the pattern material is well dispersed is formed on the second carrier film, it can be laminated and integrated with the resin-impregnated fiber layer without disturbing the dispersion state of the pattern material. Also, since the pattern material-containing resin layer formed on the second carrier film is not impregnated into the fiber material, a liquid thermosetting resin in which the pattern material is well dispersed is supplied onto the second carrier film. With the pattern material dispersed well The pattern material containing resin layer state can be easily formed. Thus, it is possible to continuously form a fiber reinforced resin molded article having a structure in which the surface layer contains the pattern material in a well-dispersed form and the base material layer is reinforced with the fiber material. A good fiber-reinforced resin molded product can be manufactured to a desired length with high productivity, and a long fiber-reinforced resin molded product can also be manufactured. In addition, the material, shape, supply amount, mixing ratio, etc. of the thermosetting resin and the reinforcing fiber material supplied onto the first carrier film can be selected as desired during continuous molding. It is also possible to manufacture a fiber reinforced resin molded product having appropriate flexibility, and it is also possible to manufacture a long fiber reinforced resin molded product wound up in a roll shape.

  Here, if the second carrier film is an embossed film, the embossed surface of the carrier film can be transferred to the pattern material-containing resin layer formed on the second carrier film, and the surface layer An effect is obtained that a fiber-reinforced resin molded product containing the pattern material in a well-dispersed form and having an embossed surface on the surface can be continuously molded and manufactured with high productivity.

  In addition, when the pattern material is a resin granule or a resin film cut, when the pattern material is mixed in a liquid thermosetting resin, the specific gravity difference between the thermosetting resin and the pattern material is small. Therefore, it is easy to obtain a uniform mixed state, and when the pattern material-containing resin layer is formed on the second carrier film, the dispersion state of the pattern material in the pattern material-containing resin layer is made extremely uniform. The fiber reinforced resin molded product in which the surface layer contains the pattern material in a more uniformly dispersed form can be continuously molded and can be manufactured with good productivity.

  FIGS. 1A and 1B are schematic cross-sectional views showing typical examples of fiber-reinforced resin molded products (hereinafter abbreviated as resin molded products) manufactured by the method and apparatus of the present invention, respectively. A resin molded product 1 shown in FIG. 1A is a laminate including a surface layer 2 and a base material layer 3. The surface layer 2 has a structure in which the pattern material 5 is well dispersed in the matrix resin 4, and the base material layer 3 has a structure in which the matrix resin 7 is reinforced with the reinforcing fiber material 8. Both the surface of the surface layer 2 and the surface of the base material layer 3 are flat surfaces. The resin molded product 1A shown in FIG. 1 (b) is also a laminate including the surface layer 2 and the base material layer 3 like the resin molded product 1 shown in FIG. 1 (a). Embossed surface. Other configurations are the same as those of the resin molded product 1. Both of these resin molded products 1 and 1A have an excellent design by having a surface layer 2 in which a pattern material is well dispersed, and also have a base layer 3 reinforced with fibers. It has excellent strength characteristics, durability, water resistance, etc. In addition, the surface layer 2 can not only exhibit a design effect, but can also have characteristics such as waterproofness, hydrophilicity, and weather resistance by selecting the material and filler of the matrix resin 4 as necessary. . The thickness of the resin molded product 1 or 1A is appropriately determined according to the purpose of use of the resin molded product 1 or 1A. In many cases, the overall thickness is selected to be about 0.5 to 3.0 mm. The thickness of the surface layer 2 is selected to be about 0.2 to 1.0 mm. Each composition of the surface layer 2, the base material layer 3, etc. is mentioned later.

  Next, a continuous molding apparatus for a resin molded product and a continuous molding method using the same according to a preferred embodiment of the present invention will be described. FIG. 2 schematically shows a continuous molding apparatus 10 for continuously molding the resin molded product 1 or 1A shown in FIG. In FIG. 2, 11 is a first carrier film (hereinafter referred to as a lower carrier film), which is pulled out from the carrier film roll 11A, travels along a predetermined horizontal path, and is wound around the carrier film roll 11B. It is supposed to be. A flat film is used for the lower carrier film 11.

  15, a liquid thermosetting resin and a reinforcing fiber material are supplied onto the traveling lower carrier film 11, and the reinforcing fiber material is impregnated with the thermosetting resin to form the resin-impregnated fiber layer 16. Resin impregnated fiber layer forming means, a resin tank 18 containing a liquid thermosetting resin 17, and a doctor knife 19 for regulating the resin supplied from the resin tank 18 onto the lower carrier film 11 to a predetermined thickness; The fiber material supply device 22 that continuously supplies the reinforcing fiber material 21 onto the thermosetting resin 17 applied on the lower carrier film 11, and the reinforcing fiber material 21 supplied onto the lower carrier film 11. Are provided with an impregnation roller 23 for impregnating with a thermosetting resin 17.

  The resin-impregnated fiber layer 16 formed on the lower carrier film 11 forms the base material layer 3 of the resin molded product 1 or 1A. Examples of the thermosetting resin 17 include ortho-based polyester and iso-based polyester. Polyester, vinyl ester resin monomer, or a mixture thereof is used. Further, the reinforcing fiber material 21 can be used in various forms and materials. For example, as the form, a nonwoven fabric (short fiber nonwoven fabric, spun bond, etc.), a woven fabric, a knitted fabric, a chopped strand mat, etc. Examples of the material include inorganic fibers (glass fiber, rock wool, ceramic fiber, etc.) and organic fibers (polyester, nylon, acrylic, polypropylene, etc.). The supply amount (basis weight) and blending ratio of the thermosetting resin 17 and the reinforcing fiber material 21 may be appropriately determined according to the specifications required for the resin molded product 1 or 1A to be manufactured. By selecting the material, form, supply amount, blending ratio, etc. of the thermosetting resin 17 and the reinforcing fiber material 21, the resin molded product 1 or 1A having various characteristics can be manufactured. It is also possible to produce products with

  Reference numeral 25 denotes a second carrier film (hereinafter referred to as an upper carrier film), which is pulled out from the carrier film roll 25A, travels along a predetermined route set horizontally, and then reverses and travels at a position overlapping the lower carrier film 11. Then, the film is wound around the carrier film roll 25B. As the upper carrier film 25, a flat film is used when the resin molded product 1 having the surface of the surface layer 2 as shown in FIG. 1 (a) as a flat surface is manufactured, as shown in FIG. 1 (b). In the case of manufacturing a resin molded product 1A in which the surface of the surface layer 2 has an uneven embossed surface, an embossed film is used.

Reference numeral 27 denotes a pattern material-containing resin layer forming means for supplying a liquid thermosetting resin obtained by mixing a pattern material onto the upper carrier film 25 traveling along a horizontal path to form the pattern material-containing resin layer 28. . The pattern material-containing resin layer forming means 27 has a resin tank 30 containing a liquid thermosetting resin 29 mixed with a pattern material, and a resin supplied from the resin tank 30 onto the upper carrier film 25 with a predetermined thickness. A doctor knife 31 or the like is provided. The resin tank 30 is provided with a stirrer (not shown) so that the pattern material is well mixed and dispersed in the thermosetting resin 29. The pattern material in the resin tank 30 is well dispersed. The pattern material-containing resin layer 28 in which the pattern material is well dispersed can be formed by allowing the thermosetting resin 29 to flow down on the upper carrier film 25 and regulating the film thickness with the doctor knife 31.

The handle material-containing resin layer 28 formed on the upper carrier film 25 forms the surface layer 2 containing the handle material of the resin molded product 1 or 1A. As the thermosetting resin 29 used here, for example, ortho polyester, iso polyester, vinyl ester resin monomer, or a mixture thereof is used, and an ultraviolet absorber, a hydrophilic agent, and an antifungal agent are used as necessary. Etc. are added. In addition, the pattern material can be uniformly mixed and dispersed in the liquid thermosetting resin 29. Specifically, the resin material granular material, mineral-based pulverized material, metal-based pulverized material, colored resin Examples of the cut material of the film and the cut material of the metal foil include the resin-based granular material and the colored resin film material having a specific gravity close to that of the thermosetting resin 29. It is preferable because it can be easily dispersed uniformly. If the size of the pattern material is too large, uniform dispersion in the thermosetting resin 29 becomes difficult. On the other hand, if the size of the pattern material is too small, the design effect is reduced. Therefore, the size of the pattern material is preferably selected to be about 0.1 to 1.0 mm. The size of the pattern material indicates an average particle diameter in the case of a granular material, and indicates an average value of vertical and horizontal sizes in the plane of the pattern material in the case of a flat pattern material such as a cut product of film or foil. Shall. The blending amount of the pattern material with respect to the thermosetting resin is preferably about 1 to 5 wt%. The thickness of the pattern material-containing resin layer 28 formed on the carrier film 25 is determined so that the surface layer 2 having a desired thickness can be formed.

  Reference numeral 33 denotes a semi-curing heating device that heats the pattern material-containing resin layer 28 formed on the upper carrier film 25 so as to be semi-cured. The heating device 33 may be of any structure as long as the heating device 33 can be heated so as to semi-cure the handle material-containing resin layer 28 held by the upper carrier film 25 and continuously running.

  35, the semi-cured pattern material-containing resin layer 28 faces the resin-impregnated fiber layer 16 formed on the lower carrier film 11 together with the upper carrier film 25, and the pattern material-containing resin layer 28 faces the resin-impregnated fiber layer 16. In this case, a pair of nip rollers 35a and 35a are used. The pair of nip rollers 35a, 35a form a laminate 36 by bringing the resin-impregnated fiber layer 16 and the handle material-containing resin layer 28 into close contact with each other, and also perform the action of further impregnating and defoaming the resin-impregnated fiber layer 16. In addition, it is good also as a structure which arrange | positions a defoaming roller downstream from a pair of nip rollers 35a and 35a as needed, and defoams further. Reference numeral 37 denotes a curing heating device that heats the laminated body 36 composed of the superimposed resin-impregnated fiber layer 16 and the pattern material-containing resin layer 28. The heating device 37 may have any structure as long as the heating device 37 can be heated to cure the laminated body 36 that is sandwiched between the lower carrier film 11 and the upper carrier film 25 and is continuously running. Reference numeral 38 denotes a cutting device for cutting the formed laminate 36 to a desired length, and reference numeral 40 denotes a roller for guiding the carrier films 11 and 25. In addition, in the case of forming a molded product having flexibility that enables winding into a roll shape, the molded product 36 is wound downstream in the cutting device 38 into a roll shape. A winding device is provided.

  Next, the molding operation by the continuous molding apparatus 10 having the above configuration will be described. In FIG. 2, the lower carrier film 11 is pulled out of the carrier film roll 11A and travels along a predetermined horizontal path. On this lower carrier film 11, a liquid thermosetting resin 17 is supplied from a resin tank 18, regulated to a predetermined thickness by a doctor knife 19, and then a reinforcing fiber material 21 is supplied thereon and impregnated. The resin is impregnated by the roller 23 to form the resin-impregnated fiber layer 16. Here, the thickness of the resin-impregnated fiber layer 16 and the content of the reinforcing fiber material are set so that the base material layer 3 of the resin molded product 1 or 1A (see FIG. 1) to be manufactured can be formed. ing.

In parallel with this process, the upper carrier film 25 is pulled out from the carrier film roll 25A, travels along a predetermined horizontal path, and the pattern material is well mixed and dispersed on the upper carrier film 25 from the resin tank 30. The liquid thermosetting resin 29 is supplied and regulated to a predetermined thickness by the doctor knife 31 to form the pattern material-containing resin layer 28. Here, since the pattern material is well dispersed in the thermosetting resin 29 supplied to the upper carrier film 25, the pattern material-containing resin layer formed by restricting the pattern material to a desired film thickness by the doctor knife 31. 28, the pattern material is well dispersed. Even if the pattern material settles or rises due to the difference in specific gravity in the pattern material-containing resin layer 28, the pattern material is well dispersed in a plane. It is kept in the state. Here, the thickness of the pattern material-containing resin layer 28 is set so that the surface layer 2 of the resin molded product 1 or 1A (see FIG. 1) to be manufactured can be formed. Next, the pattern material-containing resin layer 28 passes through the semi-curing heating device 33 and is heated and semi-cured. Here, as the degree of semi-curing, the pattern material contained in the pattern material-containing resin layer 28 is cured to an extent that does not move, but the pattern material-containing resin layer 28 is inverted to form the resin-impregnated fiber layer 16. The overlapping operation should be selected so that it is flexible enough to be performed without hindrance.

  Next, the upper carrier film 25 is reversed and travels to a position where it overlaps the lower carrier film 11, and the semi-cured pattern material-containing resin layer 28 faces the resin-impregnated fiber layer 16 on the lower carrier film 11. Then, they are brought into close contact with the nip rollers 35a, 35a to form a laminate 36. Next, the laminated body 36 composed of the superimposed resin-impregnated fiber layer 16 and the handle material-containing resin layer 28 is passed through the heating device 37 for curing while being sandwiched between the lower carrier film 11 and the upper carrier film 25, and heated. The resin-impregnated fiber layer 16 and the pattern material-containing resin layer 28 are integrated by being cured. In these overlaying and curing steps, the pattern material-containing resin layer 28 is in a semi-cured state, so that the pattern material that is well dispersed in the pattern material-containing resin layer 28 moves to increase dispersion unevenness. In other words, the pattern material is kept in a well-dispersed state even in the laminated body after curing. Thereafter, the lower carrier film 11 and the upper carrier film 25 are peeled off from the cured laminate 36, and the laminate 36 is cut into a desired size to form the resin molded product 1 or 1A. Here, when a flat film is used as the upper carrier film 25, the resin molded product 1 having the surface layer 2 as a flat surface is formed as shown in FIG. When the attached film is used, as shown in FIG. 1B, a resin molded product 1A having the surface of the surface layer 2 as an embossed surface is formed.

  When the flexible molded resin 1 or 1A is manufactured in the continuous molding apparatus described above, the laminate 36 is wound into a roll shape by a winding device (not shown) provided downstream of the cutting device 38. Then, the resin molded product 1 or 1A in roll form is manufactured. On the other hand, when manufacturing the resin molded product 1 or 1A having high rigidity, the laminated body 36 cut by the cutting device 38 is stacked in a predetermined accumulation position while remaining in a plate shape, and the plate-shaped resin molded product 1 or 1A is manufactured. 1A is manufactured.

  The obtained resin molded product 1 or 1A has a structure in which the surface layer 2 in which the pattern material is well dispersed in the resin and the base material layer 3 reinforced with the fiber material are integrated. It exhibits excellent design properties and has various properties such as excellent strength, durability, and water resistance due to being a fiber-reinforced resin molded product. The use of the resin molded product 1 or 1A is not particularly limited, but is suitable for a flooring material, a wall material, an interior material, and the like. Moreover, it can be used also as a sheet | seat for repairs, such as a bathroom floor and a wall, by setting the thickness of the resin molded product 1 or 1A to about 2 mm or less, and giving moderate softness | flexibility.

[Example 1]
Using the continuous molding apparatus 10 shown in FIG. 2, the resin molded product 1 shown in FIG. 1A was molded under the following materials and conditions.
(1) Material used Lower carrier film 11: Flat film (material: polyester, thickness 25 μm)
Upper carrier film 25: flat film (material: polyester, thickness 75 μm)
Thermosetting resin 17 for forming base material layer: Vinyl ester resin (manufactured by Nippon Iupika Co., Ltd., “8932”)
Fiber material 21 for forming the base layer: Glass paper (Olivest Co., Ltd., “FBP-025”) and spunbond (Toyobo Co., Ltd., “3501A”) are used in layers.
Thermosetting resin 29 for surface layer formation: Vinyl ester resin (manufactured by Nippon Iupika Co., Ltd., “8932”)
Pattern material: Cut PET film, size 0.5 mm x 0.5 mm, thickness 20 μm 3 parts by weight per 100 parts by weight of thermosetting resin

(2) Molding conditions The lower carrier film 11 is continuously run at a speed of 1 m / min, the thermosetting resin 17 and the fiber material 21 are supplied thereon, impregnated by the impregnation roller 23, and the thickness is about 1 A resin impregnated fiber layer 16 having a thickness of 0 mm is formed.
The upper carrier film 25 is continuously run at a speed of 1 m / min, a thermosetting resin 29 containing a pattern material is supplied on the upper carrier film 25, and the thickness is regulated to about a constant thickness by a doctor knife 31. A 3 mm pattern material-containing resin layer 28 is formed and passed through a semi-curing heating device 33 to be semi-cured. The temperature in the heating device 33 is 100 ° C., and the passing time of the pattern material-containing resin layer 28 is 3 minutes.
The semi-cured pattern material-containing resin layer 28 is superposed on the resin-impregnated fiber layer 16 and then cured by passing through a curing heating device 37. The inlet temperature of the heating device 37 is 80 ° C., the outlet temperature is 140 ° C., and the transit time of the laminate of the pattern material-containing resin layer 28 and the resin-impregnated fiber layer 16 is 45 minutes.
Thereafter, the upper and lower carrier films were peeled off, and the cured laminate was wound into a roll and cut into a predetermined length to obtain a resin molded product 1.

(3) Result The obtained resin molded product 1 was rolled up, and had a width of 1000 mm, a length of 15 m, a total thickness of about 1.7 mm, and a thickness of the surface layer 2 of about 0.5 mm. As a result of visual inspection of the surface of the resin molded product 1, the pattern material was uniformly dispersed in the surface layer and had excellent design properties.

[Example 2]
The upper carrier film 25 was molded under the same conditions as in Example 1 except that an embossed film (material; made of matte polyester, thickness 75 μm, embossed depth 0.9 mm) was used. The resin molded product 1A shown in FIG.
The obtained resin molded product 1A is in the form of a roll, and is formed on the surface of the surface layer with a width of 1000 mm, a length of 15 m, a total thickness of about 1.7 mm, a thickness of the surface layer 2 of about 1.0 mm. The embossing depth is about 0.7 mm. As a result of visual inspection of the surface of the resin molded product 1A, the pattern material was uniformly dispersed in the surface layer, and an emboss was formed on the surface, which provided excellent design properties.

(A), (b) is a schematic sectional drawing which shows the example of the resin molded object shape | molded by this invention method and apparatus, respectively. Schematic configuration diagram of a continuous molding apparatus according to a preferred embodiment of the present invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 1A resin molded product 2 Surface layer 3 Base material layer 4, 7 Matrix resin 5 Pattern material 8 Reinforcing fiber material 10 Continuous molding apparatus 11 First carrier film (lower carrier film)
DESCRIPTION OF SYMBOLS 15 Resin impregnated fiber layer formation means 16 Resin impregnated fiber layer 17 Thermosetting resin 18 Resin tank 19 Doctor knife 21 Reinforcing fiber material 22 Fiber material supply device 23 Defoaming roller 25 Second carrier film (upper carrier film)
27 Pattern material-containing resin layer forming means 28 Pattern material-containing resin layer 29 Thermosetting resin 30 Resin tank 31 Doctor knife 33 Semi-curing heating device 35 Superposition means 35a Nip roller 36 Laminate 37 Curing heating device 38 Cutting device 40 Roller

Claims (5)

A liquid thermosetting resin and a reinforcing fiber material are supplied onto the first carrier film traveling along a predetermined route, and the reinforcing fiber material is impregnated with the thermosetting resin to form a resin-impregnated fiber layer. And a step of forming a pattern material-containing resin layer by supplying a liquid thermosetting resin in which a pattern material is mixed and dispersed in advance on the second carrier film traveling on a predetermined route, Semi-cured pattern on the resin-impregnated fiber layer formed on the first carrier film, and a step of semi-curing the pattern material-containing resin layer being held by the second carrier film and running The material-containing resin layer and the second carrier film are overlapped with the pattern material-containing resin layer facing the resin-impregnated fiber layer, and the material-containing resin layer is overlapped and traveled between the first and second carrier films. Inside the resin impregnated fiber Continuous molding method of a fiber reinforced resin molded product comprising a step of curing the pattern material containing resin layer and.   The continuous molding method for a fiber-reinforced resin molded product according to claim 1, wherein the second carrier film is an embossed film.   The method for continuously forming a fiber-reinforced resin molded product according to claim 1 or 2, wherein the pattern material is a resin granular material or a resin film cut product. A first carrier film provided so as to travel along a predetermined path, and a liquid thermosetting resin and a reinforcing fiber material are supplied onto the first carrier film while traveling and are used for reinforcement. A fiber-impregnated fiber layer forming means for impregnating a fiber material with a thermosetting resin to form a resin-impregnated fiber layer and a horizontal path, and then reversing and traveling on a position overlapping the first carrier film A pattern material is supplied by supplying a liquid thermosetting resin in which a pattern material is mixed and dispersed in advance on the second carrier film provided on the second carrier film traveling on the horizontal path. A pattern material-containing resin layer forming means for forming a resin layer, a semi-curing heating device that heats the pattern material-containing resin layer that is being held by the second carrier film to be semi-cured, and semi-cured The resin layer containing the pattern material Along with the carrier film, the resin impregnated fiber layer formed on the first carrier film is superposed on the resin material-impregnated fiber layer with the pattern material-containing resin layer facing the resin impregnated fiber layer, A continuous fiber-reinforced resin molded product comprising a curing heating device that heats the resin-impregnated fiber layer and the handle material-containing resin layer that are sandwiched between the first and second carrier films and that is cured. Molding equipment.   The continuous molding apparatus for a fiber-reinforced resin molded product according to claim 4, wherein the second carrier film is an embossed film.

Images