JP4118855B2 - Printed solder inspection apparatus and printed solder inspection method - Google Patents

Description

  The present invention irradiates a printed board that has been printed and soldered for surface mounting electronic components and the like while scanning with laser light, receives the reflected light, performs so-called triangulation, and determines the printed solder formation state. The present invention relates to a printed solder inspection apparatus and method for measuring and inspecting.

  Measurement values obtained by triangulation of a substrate (hereinafter, a printed board is simply referred to as “substrate”), for example, displacement (including height) of printed solder on the substrate and brightness (from the substrate) In the inspection device that determines the quality of the printed solder state (printed solder formation state or solder printing state) based on the measured values of the amount of reflected light and the amount of received light (intensity of light)) The inspection result including the determination and the substrate process information for specifying the substrate and the process are stored and managed as a database, and if there is a trouble such as a defect in the substrate later, the actual recognition code of the substrate It is necessary to access the database so that it can be analyzed by referring to the test results. Substrate process information is information that can specify a part of a substrate or process, and includes identification information, lot number, date of manufacture (day), type of substrate, manufacturer (person), history, etc. One included.

  In general, a recognition code (for example, a bar code) is attached to the substrate from the beginning, and the substrate is sent to a printing solder process and an inspection process. Therefore, when the printed solder formation state is inspected, the above-mentioned management is performed by reading the board process information from the recognition code.

  In particular, the present invention provides a simple method by triangulating a printed solder location on a substrate and a recognition code together with a laser beam for inspecting the substrate, and acquiring substrate process information from the measured recognition code. The present invention relates to a printed solder inspection apparatus that can easily acquire board information with a configuration.

  Conventionally, as a method of optically measuring the printed solder formation state on a substrate, a method of performing triangulation by irradiating laser light while scanning (Patent Document 1), or irradiating with irradiation light (photographing). There is a method (Patent Document 2).

  In general, as described in the section “Prior Art” of Patent Document 2, a bar code reader is separately prepared, and (a) a bar code on the board is sensed to obtain board process information. The code sensing reading step and (b) the printed solder formation state sensing inspection step of sensing and inspecting the printed solder formation state are performed separately for the sensing means and the steps.

  Therefore, in the method of photographing in Patent Document 2, sensing is performed by the same photographing means, and the process of detecting the recognition code is divided into the inspection process for inspecting the printed solder formation state, and the recognition code is photographed in each process. And obtaining the printed solder formation state in the inspection process. In either case, the luminance information obtained by photographing from the vertical direction on the top of the substrate is processed to acquire the recognition code and the printed solder formation state, but the process is different on the substrate In addition to the difference between the distribution area of the recognition code and the distribution area of the printed solder, it is recognized that the method of processing the luminance information is different.

  For example, in the embodiment of Patent Document 2, a recognition code (one-dimensional or two-dimensional symbol) is described as being engraved on a substrate with laser light. Then, since the brightness | luminance obtained by image | photographing differs greatly by the case where a stamp is image | photographed and the case where a printing solder state is image | photographed, it is thought that the processing content until it obtains subsequent desired data differs. That is, in this conventional example, the recognition code and the printed solder formation state are sensed by the same photographing means, but it is necessary to prepare a separate process for making the data usable.

JP 2002-22412 A (paragraphs [0030]-[0034], FIG. 4) JP 2003-273507 A (paragraphs [0033]-[0055], FIG. 1, FIG. 3, FIG. 4)

  However, as in the example of Patent Document 2, even if the means for sensing the recognition code and the printed solder formation state is the same means, the data processing until the data that can be used thereafter is a separate process. There are drawbacks. Depending on the difference and size of the data processing process, it could be time consuming and costly.

  In other words, the above time burden has a large effect on the total inspection time when the recognition code acquisition step and the printed solder formation state acquisition step are performed serially and the data processing for acquiring the recognition code becomes complicated. Because. The cost burden is also the program cost for data processing, but if the data processing for obtaining the recognition code is subtle and complicated, troubles for it will occur and it will be cheap, and the total cost will be affected as a countermeasure. Come.

  In the conventional bar code reading, the direction of the bar code reader (scan direction) has to be changed corresponding to the direction of the recognition code on the substrate.

  Although it is rudimentary, an operator in the inspection process identifies a printed solder board, operates the printed solder inspection device, and measures according to the layout of the board to obtain a measured value. Since it is determined, a part of the substrate process information is grasped, and the operator may input and record the substrate process information directly on the determination result without relying on the recognition code. This is where the question of whether it is. However, for example, when inspecting 100 printed boards of the same type, the printed solder inspection device can be inspected automatically if it is initially set and adjusted, but if the operator records directly, Confirming the substrate process information for 100 sheets, there are many problems such as having to input directly, time consuming, mistaken cheapness, etc. is there.

  An object of the present invention is to provide a printed solder inspection apparatus and method that can further improve the above-described drawbacks of the prior art and reduce the time and cost burden associated with acquisition of substrate process information.

  In order to achieve the above object, the present invention focuses on the fact that the method of attaching a recognition code to a substrate is expressed as a height difference (displacement in the height direction) on the substrate, whether it is a stamped format or an ink-printed format. In addition, the method of measuring and inspecting by triangulation using laser light has the feature that it can capture the amount of displacement in the height direction of the substrate surface (and the amount of light may also be measured). Then, until the measured value is obtained by sensing and processing the printed solder formation state and the recognition code of the board, it is performed by the same means and processes (that is, as the measurement means, the printed solder formation state and the recognition code are distinguished and conscious) Measure without having to). And the process which acquires board | substrate process information from the recognition code after acquiring a measured value was set as the structure performed in parallel with the process of the quality determination of a board | substrate.

Specifically, the invention according to claim 1 irradiates the surface of the printed board designated as the inspection target with a recognition code indicating the specific substrate process information while being scanned while irradiating the laser beam, and measuring means (100) for obtaining a measure of the displacement of the height direction at each position of the printed board surface obtained from the reflected light, measured value storing means for storing the measured value (6), the A printed solder inspection apparatus comprising a determination means (8) for determining a printing state of solder based on a measurement value of a measurement value storage means,
In parallel with the operation of determining the printing state by the determination unit, a recognition code is detected based on the measurement value of the partial area of the printed board to be inspected stored by the measurement value storage unit, and the detected recognition code is used. The printed board to be inspected is provided with board information acquisition means (200) for reading the specific board process information.

According to a second aspect of the present invention, in the first aspect of the invention, the substrate information acquisition unit includes:
Corresponding to the type of pre-printed circuit board, design information storing convention to convert the partial region in which the recognition code of a substrate process information of the printed circuit board is attached as a pattern, and the pattern of the identification code in the information storage means (13), the partial area information corresponding to the printed circuit board of the given said object receiving from the design information storing unit, reads the measurement value of the partial area from the measured value storing means, Based on the read measurement value of the partial area, the code detection means (9) for detecting the recognition code pattern of the printed circuit board to be inspected, and the recognition code pattern detected by the code detection means And translation means (10) for reading out the board process information of the printed board to be inspected with reference to the rules stored in the design information storage means.

The invention according to claim 3, in the invention described in claim 2, wherein the measuring means is stored as the measurement value, including the amount of reflected light with the amount of displacement in the height direction at each position of the printed board surface The code detection means is configured to detect the pattern of the recognition code on the printed board to be inspected based on one of the displacement amount and the light amount among the measurement values of the partial area.

The invention according to claim 4 is, in advance, identification information of a plurality of types of printed boards, reference data for determining pass / fail, a partial area to which a pattern of an identification code including printed board board process information is attached, and A preparatory step of storing the design code storage means in association with the rules for converting the pattern of the recognition code into information;
A designation stage in which the identification information of the printed board to be inspected is designated by the operation means;
A measurement step of storing a displacement amount in a height direction obtained by receiving reflected light while scanning the surface of the printed board to be inspected with laser light as a measurement value in a measurement value storage unit;
With reference to the reference data corresponding to the specified identification information, a determination step of determining the quality of the solder printing state based on the measurement value of the measurement value storage means;
Code detection for reading a measurement value in the partial area from the measurement value storage means based on the partial area corresponding to the specified identification information and detecting a pattern of a recognition code based on the read measurement value Stages,
Based on the pattern of the detected recognition code, referring to a rule corresponding to the specified identification information, a translation step of reading substrate process information;
And a synthesis step for associating the substrate process information with the determination result in the determination step.

  According to the first and fourth aspects of the present invention, the recognition code is acquired in parallel with the determination operation based on the measurement value indicating the displacement in the height direction obtained by measurement for determining the printed solder formation state. Since it is possible to acquire substrate process information, measurement (sensing) and processing up to the measurement value representing the displacement can be performed in the same process, and it is not necessary to set up a processing time zone until subsequent substrate information acquisition. In addition, the cost burden can be reduced. In addition, since the recognition code is acquired as the displacement data together with the measurement value, it is not necessary to change the reading direction according to the direction of the recognition code attached to the substrate.

  In addition, since the measurement is configured to perform the same triangulation with respect to the recognition code and the printed solder, the region where the recognition code is attached to the substrate is a region that is specially separated from the printed solder position. There is no need to save space. Moreover, the aspect which attaches a recognition code to a board | substrate can respond | correspond whether it is printing by an inscription or ink. Even if the type of recognition code changes, it can cope. Furthermore, unlike the photographing method, the detection method using scanning laser light is less affected by the color of the printed board.

  According to the invention of claim 3, since either the displacement in the height direction or the reflected light can be used as the measurement value, the mode (engraved, printed, etc.) or pattern to which the pattern of the recognition code is attached or the pattern Even if the measurement sensitivity varies depending on the size and complexity, any one of the measurement values with good sensitivity can be used. Therefore, it is possible to detect the recognition code in a more sensitive state.

  An embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a functional block diagram showing the configuration of the present invention. FIG. 2 is a diagram for explaining the layout of the printed board. 3 and 4 are diagrams illustrating an example of measuring (detecting) a recognition code.

  The measuring means 100 in FIG. 1 is an example of a scanning type laser displacement meter, and the sensor 3 is a laser light source capable of scanning the substrate 1 and irradiating laser in each of the X axis and Y axis directions. And a light receiving means for receiving the reflected light from the substrate 1, wherein the light source and the light receiving means are in a triangulation relationship with respect to the measurement position on the substrate, and particularly in the height direction of the soldered soldered portion. The displacement amount, that is, the height (Z-axis direction) is measured in association with the position. At that time, the received light amount (luminance) corresponding to the position is also obtained from the printed solder surface. Although detailed explanation of the operation as a laser displacement meter is omitted, as a principle, there is one disclosed in Japanese Patent Laid-Open No. 3-291512 filed by the same applicant, and FIG. 4 and FIG. It is the same as that. As the light receiving means, a joint position detection element PSD (Position Sensitive Detector) is used.

  The measurement control means 4 stores in the design information storage means 13 which will be described later the layout of printed solder locations or resist locations (shown schematically in FIG. 2) when the substrate 1 to be inspected is designed. Therefore, in response to the layout, the sensor 3 performs scanning measurement relative to the layout, and the detected displacement amount and / or light reception corresponding to the position of the printed solder location. The quantity is output as a measured value, binarized as described later, and stored in the measured value storage means 6.

  In the relative scanning, for example, the movement control unit 4a performs main scanning by moving the sensor 3 in the X-axis direction of the layout, and performs sub-scanning by moving the movable table 2 along the Y-axis direction. It is done by. Therefore, the measurement value obtains data (displacement amount) in the Z-axis (height) direction at the X and Y positions on the layout.

  The process of obtaining the displacement amount of the recognition code will be described specifically using FIG. The sensor 3 performs main scanning in the X-axis direction and sub-scanning in the Y-axis direction (this is the movement table 2, that is, the substrate 1 moves) on the substrate 1 in the lower stage of FIG. Then, by performing electrical processing based on the amount of light received from the light receiving means of the sensor 3, as shown by the solid line in the middle of FIG. 3, the main scanning line (in the X-axis direction) is used in accordance with the marking depth. Measurement values are obtained as analog height data. Then, by performing sub-scanning and measuring while shifting the main scanning line in the Y-axis direction, a substantially constant measurement value in the depth direction of the marking can be obtained corresponding to the position of the plane composed of the X-axis and the Y-axis. . A measurement value (analog at this point) corresponding to the pattern of the recognition code (one-dimensional information of either one of the X-axis and Y-axis or two-dimensional information of both) is obtained. By comparing this with the threshold value indicated by the one-dot chain line in the middle of FIG. 3, a binary digital measurement value (displacement amount) as shown in the upper part of FIG. 3 is obtained. The binarized measurement value (displacement amount) is stored in the measurement value storage means 6 as position information on the X axis and position information on the Y axis as addresses. Of course, since the measurement is performed while receiving the reflected light, the amount of received light (luminance) at that time can also be stored as a measured value corresponding to the position (X, Y).

  As described above, in the present invention, finally, measurement (sensing) is performed to detect a pattern of the recognition code expressed in one or two dimensions on the X axis and / or the Y axis. It is a technical feature that information in the height direction (Z-axis direction) is involved in the process.

  The threshold value for binarization in FIG. 3 is adjustable. The adjustment can also be performed with reference to the amount of received light. The degree of reflection of the irradiated laser beam differs depending on the method of marking (printing in FIG. 4), the size of the pattern, the type of printed board, and the like. As a result, the amount of received light and the noise when the light receiving means receives light. This is because the ratio with the component changes and affects the light reception sensitivity and measurement sensitivity. This is the same not only when detecting the recognition code but also when detecting other printed solder formation states.

  That is, FIG. 3 shows only the engraved pattern portion in a partial area where the recognition code exists in the layout of FIG. 2, but the scanning by the sensor 3 is performed on the entire substrate 1. Done. At that time, since the influence of noise varies depending on the amount of reflection (resulting in the amount of received light) depending on the shape of the printed solder pattern and the soldering situation of the printed solder location, the printed solder location or each predetermined area The threshold value for binarization can be changed. Therefore, both the adjustment of the threshold value and the detection of the recognition code can be adjusted based on the same idea as the measurement of the printed solder formation state.

  FIG. 4 shows a case where the recognition code attached to the substrate 2 is printed with ink or the like. In this case, the thickness (that is, the height) of the ink or the like on the substrate 1 is measured. Also in this case, as shown in the upper part of FIG. 4, the analog measurement value is binarized with a predetermined threshold value, and the binarized measurement value is stored in correspondence with the position (X, Y). Store in the means 6.

  The board information acquisition unit 200 includes a design information storage unit 13, a code detection unit 9, and a translation unit 10, and the measurement value stored in the measurement value storage unit is stored in parallel with an operation in which the determination unit 8 described later determines the printing state. A recognition code is detected based on the value, and substrate process information specific to the printed circuit board to be inspected is read from the recognition code.

  The design information storage means 13 includes a layout indicating the solder location and resist location of the designed substrate 1, reference data used as a reference when determining the quality of the solder formation state by the determination means 8, and a recognition code on the substrate 1. The marked partial area, the type of recognition code, and the rules for obtaining information from the recognition code are stored in advance for each type of substrate.

  The layout is a layout diagram when the board 1 to be inspected is designed. For example, as schematically shown in FIG. 2, the printed solder locations, the resist locations without printed solder, and the recognition codes, etc. The above arrangement information is stored. The partial area indicates the address of the area where the recognition code of FIG. 2 exists. This layout itself can be displayed as an image (as a layout screen) on the display means 12c via the display control means 12b.

  In addition, the design information storage unit 13 stores a recognition code pattern and a rule for defining information meaning the pattern in correspondence with the layout type and the partial area. For example, there are various bar code patterns and conventions that are often used as recognition codes, which are defined by public institutions (for example, JIS) or the private sector (for example, JAN (EAN, UPC)). Since the pattern is used, any kind of recognition code can be used. Moreover, it is not limited to them, and numbers, symbols, and combinations thereof may be used. In this way, if the rules and the like are stored in advance and the measurement by the measuring means 100 can detect any recognition code, the barcode reader is replaced when the barcode type is changed as in the conventional barcode reader. There is no need.

  In addition, the design information storage unit 13 stores reference data for inspecting the substrate 1 and determining pass / fail in correspondence with the substrate 1 to be inspected. Specifically, the reference data corresponds to the determination data generated by the data generation means 7 in which values such as the height, area, volume, and solder defect of the printed solder location are prepared for each solder location. Have been prepared. The reference data is information that makes it easy to quantitatively (image-wise) recognize the printed solder at the solder location.

  If there are many types of substrates 1 to be inspected, the substrate process information is stored in the design information storage means 13 with identification information, and a list of identification information and / or a layout screen is displayed on the display means 12c. The identification information is designated by a marker or the like on the screen by the operation means 12a, so that the printed board (to be inspected) of the designated identification information can be selected.

  The data generation means 7 receives the position of the solder location of the substrate 1 stored in the measurement value storage means 6 and the displacement data (displacement amount) or luminance data (light reception amount) at the position, for example, a filter, solder Based on a number of predetermined image parameter values indicating sensitivity for identifying delicate patterns such as bridges and solder pattern edges, the measurement data is processed into determination data representing the amount of printed solder at each solder location. Further, the data generation means 7 has a calculation means for calculating the height, area, and / or volume at the printed solder location using the measured value (binarized data).

  The determination data is data that represents the amount of solder in the printed solder location, and similarly to the reference data, the height, area, volume, and deficiency (solder to be present) of each solder location. Detection of a state with no amount). These data such as height, area, and volume are information that can also serve as three-dimensional image information.

  Note that not all of the above determination data is required to determine the substrate 1, but at least one of height, area, and volume is indispensable. In the determination, what is used as the determination data of the substrate 1 to be inspected or which combination of determination data is determined may differ depending on the type and content of the substrate 1.

  The determination means 8 compares the determination data output from the data generation means 7 with the reference data corresponding to the substrate to be inspected stored in the design information storage means 13, and the determination data becomes the reference data. On the other hand, if it is within the allowable value, it is determined to be good, and otherwise it is determined to be no. At that time, since the determination means 8 determines for each printed solder location, the position information of the location determined as NO can also be detected. The determination means 8 can output various inspection results such as the difference between the determination data and the reference data for each printed solder location, the determination result, and the determination result of the substrate 1 as a whole.

  The code detection means 9 receives from the design information storage means 13 the partial area information in which the recognition code corresponding to the substrate 1 to be inspected exists, and receives the measurement values (areas) in the partial area from the measurement value storage means 6. Data on the X and Y coordinates) is read, and a pattern (one-dimensional and two-dimensional information on the X and Y coordinates) as a recognition code is detected. If the amount of displacement is used as a measurement value, it can be detected by the same method because there is a thickness (height) regardless of whether the pattern of the recognition code is stamped as shown in FIG. 3 or printed as shown in FIG. However, the polarity in which the pattern appears differs between FIG. 3 and FIG. This is reversed to correspond to the substrate 1 to be inspected to form a recognition code pattern.

  In addition, if the light reception sensitivity is taken into account when detecting the pattern of the recognition code, as the measurement value, select one of the above-mentioned displacement amount, light reception amount, or a combination thereof, and a measurement value with higher sensitivity. It is good to use. For example, in the engraving of FIG. 3, a sufficient amount of light cannot be obtained from the pattern portion. However, if there is a high possibility that the reflected light from the printed portion is sufficiently obtained in the printing form of FIG. It may be used. Further, as described above, a displacement adjusted by the amount of received light may be used, or a correlation value between the amount of displacement and the amount of received light may be used.

  The translation means 10 identifies the type of recognition code in the design information storage means 13 based on the pattern detected by the code detection means 9, and based on the rules of the identified type of recognition code, the translation process 10 uses the substrate process information that the pattern means. Convert and output. As described above, the substrate process information includes identification information, a lot number, a manufacturing number, a manufacturing date, and the like of the substrate 1 to be inspected.

  The inspection data management unit 11 stores the inspection result output from the determination unit 8 and the substrate process information output from the translation unit 10 in association with each other. It is desirable that the user interface 12 has a database that can be viewed. Further, it may be transmitted to an external computer via a network. The inspection data management means 11 itself may be performed by an external computer, and the inspection apparatus may be configured to send inspection results and substrate process information.

  The user interface 12 includes an operation unit 12a, a display control unit 12b, and a display unit 12c. Further, the display control means 12b displays an operation guide on the display means 12c. Then, when the operation means 12a is operated by the operator according to the guidance, for example, a layout is displayed, a determination result is displayed, a data generation means is linked with each unit according to the operation content. It is possible to display the height, area, volume, etc. generated by 7 or display a list of databases managed by the inspection data management means 11.

  In the above configuration, each function unit of the measurement control unit 4, the data generation unit 7, the code detection unit 9, the translation unit 10, the inspection data management unit 11 and the display control unit 12b includes a CPU and a function of each functional unit. It is comprised with ROM etc. which memorize | stored the program for exhibiting. The measured value storage means 6 and the design information storage means 13 are mainly composed of a RAM and managed by the CPU.

Next, the flow of operation will be described.
(1) Identification information, layout, reference data for determination, partial area where a printed board recognition code exists, recognition code type, and recognition of a plurality of types of boards 1 to be inspected in advance A rule for reading out substrate process information from the code is stored in the design information storage unit 13 in advance. The display control means 12b prepares an input format in advance, displays it on the display means 12c, guides the input, and stores it as a database in the design information storage means 13 in response to the input by the operation means 12a. Alternatively, the design information storage unit 13 may store the data transferred from an external memory.

(2) The display control means 12b displays a list of at least identification information (information that can be distinguished such as name, ID or layout) stored in the design information storage means 13, and the operator can Identification information of the substrate 1 to be inspected is selected on the display screen by the operation means 12a.
(3) The measuring means 100 receives reflected light while scanning the printed board to be inspected with laser light, and binarizes the obtained displacement amount and received light amount (or only the change amount) and measures it as a measured value. The value is stored in the value storage means 6.

  (4) The code detection means 9 receives the area information of the selected substrate 1 from the design information storage means 13, reads the measurement value of the area indicated by the area information from the measurement value storage means 6, and recognizes the pattern of the recognition code Is detected. When the displacement amount and the received light amount are stored as the types of measurement values, whether the displacement amount, the received light amount, or a combination thereof is used corresponds to the substrate 1 in advance in the design information storage unit 13. It is good also as a structure employ | adopted according to the kind of the memorize | stored measured value. This is because the mode of the pattern of the recognition code given to the substrate 1 is known information, and the type of measurement value according to the mode can be determined.

(5) The translation unit 10 acquires the substrate process information by referring to the rules corresponding to the substrate to be inspected stored in the design information storage unit 13 based on the detected recognition code pattern.
(6) On the other hand, the data generation means 7 generates data on the height, area, and volume at the printed solder location, which is the determination data, based on the measured values. The determination means 8 Corresponding reference data is received from the design information storage means 13, and the determination data and the reference data are compared to determine pass / fail and output the inspection result including the determination result.
(7) The inspection data management means 11 synthesizes the inspection results and the substrate process information in association with each other, and stores and manages them as a database that can be viewed on the display means 12c or the network.

  As described above, in the operation of the embodiment of the present invention, since the operations (4) and (5) and the operation (6) are performed in parallel, the time for acquiring the substrate process information from the recognition code is specially set. The measuring means 100 senses the printed solder formation state and senses the pattern of the recognition code, and therefore does not require a separate means for sensing the recognition code and a data processing step. , Is a feature.

It is a figure for demonstrating the functional block of embodiment of this invention. It is a figure for demonstrating a printed board. It is a figure for demonstrating the measurement when a recognition code is stamped on the printed board. It is a figure for demonstrating the measurement when a recognition code is printed by the ink etc. on the printed board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate (printed board), 2 Moving stand, 3 Sensor, 4 Measurement control means 4a Movement control part, 5 Movement mechanism part, 6 Measurement value memory | storage means, 7 Data generation means 8 Judgment means, 9 Code detection means, 10 Translation means ,
11 inspection data management means, 12 user interface, 12a operation means,
12b display control means, 12c display means, 13 design information storage means,
100 measurement means, 200 substrate information acquisition means.

Claims (4)

It is irradiated while scanning the laser beam on the surface of the specified print board as an inspection target is attached a recognition code indicating a specific substrate process information in a part region, at each position of the printed board surface obtained from the reflected light Measurement means (100) for obtaining a measurement value indicating the amount of displacement in the height direction, measurement value storage means (6) for storing the measurement value, and a solder printing state based on the measurement value of the measurement value storage means A printed solder inspection apparatus comprising a determination means (8) for determining
In parallel with the operation of determining the printing state by the determination unit, a recognition code is detected based on the measurement value of the partial area of the printed board to be inspected stored by the measurement value storage unit, and the detected recognition code is used. A printed solder inspecting apparatus comprising a board information acquisition means (200) for reading the specific board process information on a printed board to be inspected. The board information acquisition means includes
Corresponding to the type of pre-printed circuit board, design information storing convention to convert the partial region in which the recognition code of a substrate process information of the printed circuit board is attached as a pattern, and the pattern of the identification code in the information Storage means (13);
The partial area information corresponding to the printed circuit board of the given said object receiving from the design information storing unit, reads the measurement value of the partial area from the measured value storing means, read the partial area Code detecting means (9) for detecting the pattern of the recognition code of the printed circuit board to be inspected based on the measured value;
Translation means (10) for reading out the board process information of the printed board to be inspected with reference to the rules stored in the design information storage means on the basis of the pattern of the recognition code detected by the code detection means The printed solder inspection apparatus according to claim 1, further comprising: The measuring means may store a measurement value, including the quantity of the reflected light with the amount of displacement in the height direction at each position of the printing plate surface,
The code detecting means detects a pattern of a recognition code on a printed circuit board to be inspected based on one of the displacement amount and the light amount among the measurement values of the partial area. Item 3. A printed solder inspection apparatus according to Item 2. Preliminary identification information of multiple types of printed boards, reference data for judging pass / fail, partial areas to which recognition code patterns including board process information of printed boards are attached, and conversion of the recognition code patterns into information A preparatory stage for preliminarily storing the rules to be stored in the design information storage means (13);
A designation stage in which the identification information of the printed board to be inspected is designated by the operation means;
A measurement step of storing, in the measurement value storage means (6), a displacement amount in the height direction obtained by receiving reflected light while scanning the printed board surface to be inspected with a laser beam;
With reference to the reference data corresponding to the specified identification information, a determination step of determining the quality of the solder printing state based on the measurement value of the measurement value storage means;
Code detection for reading a measurement value in the partial area from the measurement value storage means based on the partial area corresponding to the specified identification information and detecting a pattern of a recognition code based on the read measurement value Stages,
Based on the pattern of the detected recognition code, referring to a rule corresponding to the specified identification information, a translation step of reading substrate process information;
A printed solder inspection method comprising: a synthesis step for associating the substrate process information with the determination result in the determination step.

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