JP4115661B2 - Electronic component thermocompression bonding apparatus and thermocompression bonding method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component thermocompression bonding apparatus and a thermocompression bonding method for thermocompression bonding an electronic component to a substrate such as a display panel.
[0002]
[Prior art]
Electronic components such as a driver chip are mounted on a substrate such as a display panel. In this mounting operation, an electronic component is first mounted on a substrate supplied with a resin adhesive at the mounting position. Then, the electronic component is heated and pressed with a pressure bonding tool to maintain a predetermined load and heat condition, so that the electronic component is thermally bonded to the substrate.
[0003]
[Problems to be solved by the invention]
In order to ensure good thermocompression bonding quality in the above mounting operation, it is required to press the electronic component with a uniform load with a crimping tool. For this reason, the lower surface of the crimping tool must be kept in good linearity, but generally the lower surface of the crimping tool tends to warp in the vertical and horizontal directions. If you use a crimping tool with warping deformation, the electronic parts will be pressed differently. Conventionally, a plurality of adjustment bolts are provided on the crimping tool. The degree was corrected. However, since the adjustment work for this correction is a work that is performed while performing precise measurement and confirming the linearity, the work requires time and effort, and a method of performing this work efficiently has been desired.
[0004]
SUMMARY OF THE INVENTION An object of the present invention is to provide a thermocompression bonding apparatus and a thermocompression bonding method for an electronic component that can efficiently and accurately correct warpage deformation of the lower surface of a pressure bonding tool and ensure the pressure bonding quality.
[0005]
[Means for Solving the Problems]
The thermocompression bonding apparatus for an electronic component according to claim 1 is a thermocompression bonding apparatus for an electronic component that presses a contact portion of a heated crimping tool against the electronic component and crimps the electronic component to a substrate. A first heating part for heating the crimping tool from the side surface of the crimping tool near the part, a second heating part for heating the crimping tool from the side surface of the crimping tool above the heating position of the crimping tool by the first heating part, Based on the third heat generating part for heating the pressure bonding tool from the side opposite to the side surface of the pressure bonding tool heated by the second heat generating part, and the set temperature for realizing the pressure bonding temperature determined by the pressure bonding condition. A first heater control unit for controlling the heater of the first heat generating unit, and a second heater control unit for controlling the second heat generating unit based on a set temperature set for the purpose of correcting vertical deformation of the crimping tool. When On the basis of the set temperature set for the purpose of correcting the horizontal deformation of the crimping tool and a third heater control unit for controlling the third heating unit, also the said crimping tool and said first heat generating portion A pressing unit that presses against the second heat generating portion is provided.
[0006]
The electronic component thermocompression bonding method according to claim 2 includes a first heat generating portion that heats the pressure bonding tool from the side surface in the vicinity of the contact portion of the pressure bonding tool, and pressure bonding above the heating position of the pressure bonding tool by the first heat generation portion. A second heat generating part for heating the crimping tool from the side of the tool, and a third heat generating part for heating the crimping tool from the side opposite to the side of the crimping tool heated by the second heating part. An electronic component thermocompression bonding method that presses the contact portion of the crimping tool against the electronic component and crimps the electronic component to the substrate, based on a set temperature for realizing a crimping temperature determined by the crimping conditions. The heater of the first heat generating part is controlled, the second heat generating part is controlled based on a set temperature set for the purpose of correcting the vertical deformation of the crimping tool, and the horizontal deformation of the crimping tool is controlled. to correct So as to control the third heat generating section based on the set temperature setting target, the pressing means and pressing said bonding tool into said second heat generating portion and said first heat generating portion is provided.
[0007]
According to the present invention, the warpage of the crimping tool is controlled by controlling the temperatures of the first to third heat generating portions disposed on the side surface of the crimping tool and heating them at a predetermined set temperature according to the warp deformation of the crimping tool. The deformation can be corrected by the thermal stress due to the temperature difference, the crimping temperature can be properly maintained, and the vertical and horizontal warpage deformation of the lower surface of the crimping tool can be accurately corrected by a simple method.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component thermocompression bonding apparatus according to an embodiment of the present invention, FIG. 2 is a sectional view of a crimping tool of the electronic component thermocompression bonding apparatus according to an embodiment of the present invention, and FIG. The block diagram which shows the structure of the temperature control system of the thermocompression bonding apparatus of the electronic component of one embodiment of FIG. 4, FIG. 4 is explanatory drawing of the curvature deformation correction of the crimping | compression-bonding tool of the thermocompression bonding apparatus of the electronic component of one embodiment of this invention. It is.
[0009]
First, the configuration of a thermocompression bonding apparatus for electronic components will be described with reference to FIG. In FIG. 1, a positioning table 2 is disposed on a base 1. The positioning table 2 is configured by stacking substrate holders 5 each having a θ table for positioning in the θ direction on an X table 3 and a Y table 4. A substrate 6 to which the electronic component 7 is thermocompression bonded is placed and held on the substrate holding unit 5. An anisotropic conductive agent for adhering electronic components is attached to the substrate 6 in the previous step, and an electronic component 7 is mounted thereon. By driving the positioning table 2, the substrate 6 moves in the horizontal direction and the vertical direction, and the position can be adjusted during thermocompression bonding.
[0010]
On the side of the positioning table 2, a crimping part 10 is provided. In the main body frame 11 of the crimping portion 10, a crimping head 13 including a crimping tool 21 is provided so as to be vertically movable by a head vertical movement mechanism 12. The crimping tool 21 has an elongated shape with the X direction as the longitudinal direction, and a contact portion 21a having a shape in which the width in the Y direction is narrowed is protruded from the lower end portion. Below the pressure-bonding head 13, a lower receiving portion 17 is disposed in the X direction. At the time of thermocompression bonding, the positioning table 2 is driven to align the substrate 6, whereby the edge of the substrate 6 is placed on the upper surface of the lower receiving portion 17.
[0011]
By driving the head up-and-down mechanism 12, the crimping head 13 is lowered, and the abutting portion 21 a at the lower end of the crimping tool abuts against the electronic component 7 mounted on the upper surface of the substrate 6 and presses against the substrate 6. At this time, the substrate 6 is supported by the lower receiving portion 17 from below, and the pressing force by the crimping tool 21 is supported by the lower receiving portion 17.
[0012]
A pressing member 16 is disposed at the center of the front side surface (first side surface 21 b) parallel to the longitudinal direction of the crimping tool 21, and one heat block 15 is horizontally disposed on each side of the pressing member 16. Arranged in the direction. A heating block 14 is disposed on the opposite surface (second side surface 21 c) of the crimping tool 21 to the first side surface. The heat block 15 heats the crimping tool 21 from the first side surface 21b side, and the heating block 14 heats the crimping tool 21 from the second side surface 21c side.
[0013]
FIGS. 2A and 2B show vertical cross sections in the Y direction at the center of the crimping head 13 and at both sides of the center, respectively. In FIG. 2A, the crimping head 13 has a configuration in which a crimping tool 21 is held on the lower surface of the elevating unit 20 via a heat insulating member 22. On the left side surface (first side surface 21 b) of the crimping tool 21, the pressing member 16 is disposed in the vertical direction across the elevating part 20 and the crimping tool 21. An upper end portion of the pressing member 16 is fixed to the elevating portion 20 with a bolt 26 via a heat insulating member 24, and a lower end portion 16 a of the pressing member 16 is in contact with the crimping tool 21 via a heat insulating member 27.
[0014]
Further, the heating block 14 is disposed in contact with the right side surface (second side surface 21 c) of the crimping tool 21. The heating block 14 has an upper end fixed to the elevating part 20 with a bolt 25 via a heat insulating member 23, and is divided into two upper and lower stages by a slit directed in the horizontal direction, and two rows of heat blocks 14A and 14B are formed. It is the structure arranged in the horizontal direction. The heat blocks 14A and 14B include heaters 14a and 14b, respectively.
[0015]
Of these heat blocks 14A and 14B, the lower heat block 14A (first heat generating portion) is close to the abutting portion 21a at the lower end of the crimping tool 21, and is related to the crimping temperature by the crimping tool 21 during thermocompression bonding. It is controlled so as to achieve the set temperature. Further, the upper heat block 14B (second heat generating portion) can be controlled in temperature independently of the heat block 14A, and is controlled to maintain a predetermined temperature difference with respect to the set temperature. As will be described later, this temperature difference is artificially set in order to correct the vertical warping deformation of the crimping tool 21 by the thermal stress due to the temperature difference. That is, a set temperature is set for the lower heat block 14 </ b> A for the purpose of realizing the crimping condition, and a set temperature is set for the upper heat block 14 </ b> B for the purpose of correcting variations in the crimping by the crimping tool 21.
[0016]
In FIG. 2A, the lower end 16 a presses the crimping tool 21 against the heating block 14 via the heat insulating member 27 by fastening the bolt 26 that fixes the pressing member 16 to the elevating unit 20. Thereby, the adhesiveness of the crimping | compression-bonding tool 21 and the heating block 14 improves, and the heating characteristic by heater 14a, 14b is improved.
[0017]
As shown in FIG. 2B, the upper portion of the heat block 15 is fixed by a bolt 29 via a heat insulating member 28, and the lower portion is in contact with the first side surface 21 b of the crimping tool 21. By tightening the bolt 29, the heat block 15 is pressed against the first side surface 21b. Similar to the pressing member 16, the heat block 15 also functions as pressing means for pressing and fixing the crimping tool 21 against the heat blocks 14A and 14B contacting the second side surface 21c.
[0018]
The heat block 15 disposed on the left side surface (first side surface 21b) of the crimping tool 21 includes a heater 15a. The heat block 15 is provided to supplement heat that escapes from the pressing member 16 and the first side surface 21b to the atmosphere. When the temperature difference between the first side surface 21b side and the second side surface 21c side of the crimping tool 21 increases, the crimping tool 21 is deformed in the horizontal direction due to this temperature difference. Can be prevented. The set temperature of the heat block 15 is set for the purpose of preventing horizontal deformation of the crimping tool.
[0019]
Next, the configuration of the temperature control system of the crimping head 13 will be described with reference to FIG. In FIG. 3, the heaters 14a, 14b, 15a of the heat blocks 14A, 14B, 15 are connected to a first heater control unit 34, a second heater control unit 35, and a third heater control unit 36, respectively. The heating temperature of each heater is controlled by the control unit. The heaters 14a, 14b, and 15a have temperature detectors 31, 32, and 33, respectively. The temperature of the heat blocks 14A, 14B, and 15 at the time of heating is detected, and the first heater controller 34 and the second heater 14 are detected. The detected temperature is fed back to the heater controller 35 and the third heater controller 36.
[0020]
The first heater control unit 34 is connected to the pressure bonding temperature setting unit 39, the second heater control unit 35 is connected to the vertical warp correction temperature setting unit 38, and the third heater control unit 36 is connected to the horizontal warp correction temperature setting unit 37. The horizontal warp correction temperature setting unit 37, the vertical warp correction temperature setting unit 38, and the pressure bonding temperature setting unit 39 are connected to an operation unit 40 capable of inputting numerical values. Therefore, the set temperature set according to the purpose from the operation unit 40 is input to the horizontal warpage correction temperature setting unit 37, the vertical warp correction temperature setting unit 38, and the pressure bonding temperature setting unit 39 and set.
[0021]
That is, a temperature determined for the purpose of preventing horizontal deformation of the crimping tool 21 is set in the horizontal warpage correction temperature setting section 37, and the vertical warpage of the crimping tool 21 is set in the vertical warpage correction temperature setting section 38. The temperature determined for the purpose of correcting the pressure is set, and the temperature for realizing the pressure bonding temperature determined by the pressure bonding condition is set in the pressure bonding temperature setting unit 39.
[0022]
Thus, the first heater control unit 34 controls the heater 14a of the heat block 14A (first heat generating unit) based on the set temperature set in the pressure bonding temperature setting unit 39, and the second heater control unit 35 controls the heat block 14B ( The heater 14b of the second heat generating part) is controlled based on the set temperature set in the vertical warp correction temperature setting part 38, and the third heater control part 36 controls the heater 15a of the heat block 15 (third heat generating part) horizontally. Control is performed based on the set temperature set in the correction temperature setting unit 37.
[0023]
This electronic component thermocompression bonding apparatus is configured as described above, and the warping deformation correction of the crimping tool during electronic component compression will be described below with reference to FIG. In thermocompression bonding of electronic components, it is necessary to press the electronic components against the substrate with an equal load. For this reason, the straightness of the contact portion 21a at the lower end portion of the crimping tool 21 that contacts and presses the electronic component needs to be maintained with high accuracy.
[0024]
However, when the size of the substrate to be subjected to thermocompression bonding increases, it is not easy to maintain the straightness at the correct level throughout the longitudinal direction of the crimping tool 21. For example, as shown in FIG. 4A, the contact portion 21a of the crimping tool 21 may exhibit so-called vertical warpage deformation in which an arc-shaped deformation (see arrow a) is indicated in the vertical direction (Z direction).
[0025]
In such a case, vertical warp correction is performed based on the straightness measurement result of the contact portion 21a. That is, the temperature difference in the vertical direction (temperature difference between the heat block 14A and the heat block 14B) necessary for realizing thermal deformation corresponding to the amount of warp deformation is obtained in advance by calculation or experiment, and the target electronic component In addition, the temperature considering the temperature difference is input to the vertical warp correction temperature setting unit 38 and set with respect to the crimping temperature (set temperature of the heat block 14A) individually set by the substrate. As a result, the contact portion 21a is heated to an appropriate crimping temperature according to the object, and a temperature difference in the vertical direction necessary for correcting the vertical warp deformation is generated in the crimping tool 21, and the vertical warp deformation is heated. It can be corrected by stress.
[0026]
In addition, as shown in FIG. 4B, the contact portion 21a of the crimping tool 21 may exhibit a so-called horizontal warpage deformation that exhibits an arcuate deformation (see arrow b) in the horizontal direction (Y direction). In such a case, horizontal warp correction is performed based on the straightness measurement result of the contact portion 21a. That is, a temperature difference in the horizontal direction (temperature difference between the heat block 14A or 14B and the heat block 15) necessary for realizing horizontal heat deformation corresponding to the horizontal warp deformation amount is obtained in advance by calculation or experiment. The temperature considering the temperature difference is input to the horizontal warpage correction temperature setting unit 37 and set. Thereby, as in the case of the above-described vertical warpage correction, the contact portion 21a is heated to an appropriate pressure bonding temperature depending on the object, and the pressure direction of the pressure bonding tool 21 is required to correct horizontal warpage deformation. Thus, the horizontal warp deformation can be corrected by thermal stress.
[0027]
As described above, the heat blocks 14A, 14B, 15 for heating the crimping tool 21 and the temperature control system are configured as described above, thereby ensuring an appropriate crimping temperature according to the electronic component to be crimped, and The warp deformation of the shape of the abutting portion 21a at the lower end can be accurately corrected, and proper crimping conditions can be maintained and the crimping quality can be ensured.
[0028]
Further, by correcting the warpage deformation by a thermal stress due to a temperature difference generated in the crimping tool 21 itself, finer correction can be easily performed as compared with a mechanical adjustment method using a conventional adjustment bolt. Therefore, the accuracy and workability of the adjustment work can be improved.
[0029]
Although the present embodiment has been described above, various design changes can be made within the scope of the present invention. For example, the positional relationship between the heat block 14B and the heat block 15 can be exchanged. Further, the same set temperature may be set in the vertical warp correction temperature setting unit 38 and the horizontal warp temperature setting unit 37. If it is assumed that both set temperatures are always used at the same set temperature, the vertical warp correction temperature setting unit 38 and the horizontal warp correction temperature setting unit 37 can be integrated into one temperature setting unit. . In this case, one integrated temperature setting unit functions as a vertical warp correction temperature setting unit and a horizontal warp temperature setting unit.
[0030]
【The invention's effect】
According to the present invention, the temperature of the first to third heat generating portions arranged on the side surface of the crimping tool is controlled and heated at a predetermined set temperature according to the warp deformation of the crimping tool. Warpage deformation can be corrected by thermal stress due to temperature difference, and the crimping temperature can be properly maintained, and warpage deformation in the vertical and horizontal directions of the lower surface of the crimping tool can be accurately corrected by a simple method. .
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic component thermocompression bonding apparatus according to an embodiment of the present invention. FIG. 2 is a sectional view of a crimping tool of an electronic component thermocompression bonding apparatus according to an embodiment of the present invention. FIG. 4 is a block diagram showing a configuration of a temperature control system of a thermocompression bonding apparatus for an electronic component according to an embodiment of the present invention. Figure [Explanation of symbols]
2 Positioning table 5 Substrate holding part 6 Substrate 7 Electronic components 14A, 14B, 15 Heat block 16 Pressing member 21 Crimping tool 34 First heater control part 35 Second heater control part 36 Third heater control part 37 Horizontal warpage correction temperature setting part 38 Vertical warp correction temperature setting part 39 Pressure bonding temperature setting part

Claims (2)

An electronic component thermocompression bonding apparatus that presses a contact portion of a heated crimping tool against an electronic component and crimps the electronic component to a substrate, and heats the crimping tool from a side surface of the crimping tool near the contact portion. A first heat generating portion; a second heat generating portion that heats the pressure bonding tool from the side surface of the pressure bonding tool above the heating position of the pressure bonding tool by the first heat generation portion; and a side surface of the pressure bonding tool heated by the second heat generation portion. A first heating unit for controlling the heater of the first heating unit based on a third heating unit for heating the crimping tool from a side surface opposite to the side and a set temperature for realizing a crimping temperature determined by the crimping condition A second heater control unit that controls the second heat generating unit based on a set temperature set for the purpose of correcting vertical deformation of the crimping tool, and correcting horizontal deformation of the crimping tool And a third heater control unit for controlling the third heating unit based on the set the set temperature in order that, also comprising means pressing presses the crimping tool to the second heating portion and the first heat generating unit thermocompression bonding apparatus that electronic components to said ever. A first heat generating unit that heats the crimping tool from the side surface in the vicinity of the contact portion of the crimping tool, and a second heat generating unit that heats the crimping tool from the side surface of the crimping tool above the heating position of the crimping tool by the first heating unit. And a third heat generating part for heating the crimping tool from the side opposite to the side of the crimping tool heated by the second heat generating part, and presses the contact part of the heated crimping tool against the electronic component An electronic component thermocompression bonding method for crimping the electronic component to a substrate, the heater of the first heat generating unit being controlled based on a set temperature for realizing a crimping temperature determined by a crimping condition, and the crimping The second heat generating unit is controlled based on a set temperature set for the purpose of correcting the vertical deformation of the tool, and based on the set temperature set for the purpose of correcting the horizontal deformation of the crimping tool. 3 so as to control the heating unit, and the thermocompression bonding method you wherein electronic components that the bonding tool is pressing means presses the second heat generating portion and said first heat generating portion is provided.

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