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JP4029155B2 - Visible-light-responsive membranous porous semiconductor photoelectrode - Google Patents

Visible-light-responsive membranous porous semiconductor photoelectrode Download PDF

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JP4029155B2
JP4029155B2 JP2003280421A JP2003280421A JP4029155B2 JP 4029155 B2 JP4029155 B2 JP 4029155B2 JP 2003280421 A JP2003280421 A JP 2003280421A JP 2003280421 A JP2003280421 A JP 2003280421A JP 4029155 B2 JP4029155 B2 JP 4029155B2
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和弘 佐山
裕則 荒川
竜 阿部
志剛 鄒
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National Institute of Advanced Industrial Science and Technology AIST
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/542Dye sensitized solar cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30Hydrogen technology
    • Y02E60/36Hydrogen production from non-carbon containing sources, e.g. by water electrolysis
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00Technologies relating to chemical industry
    • Y02P20/10Process efficiency
    • Y02P20/133Renewable energy sources, e.g. sunlight

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Description

本発明は、太陽光などの光エネルギーを水素などの化学エネルギーに変換する光電気化学セル、該セルに用いられる高効率な多孔質構造の膜状半導体光電極及び該光電気化学セルを用いた水の分解方法に関するものである。   The present invention uses a photoelectrochemical cell that converts light energy such as sunlight into chemical energy such as hydrogen, a highly efficient porous-structured semiconductor photoelectrode used in the cell, and the photoelectrochemical cell. It relates to a method for decomposing water.

太陽エネルギーなどの再生可能エネルギーの有効利用は非常に重要であるが、安価でかつ高性能な光エネルギー変換システムの実現は難しい。特に太陽エネルギーを用いて水を分解して水素を製造する技術は、水素燃料電池自動車の早期実用化・普及加速のために是非必要な技術である。太陽光で水を分解する技術としては下記のものが挙げられる。   Although effective use of renewable energy such as solar energy is very important, it is difficult to realize an inexpensive and high-performance optical energy conversion system. In particular, a technique for producing hydrogen by decomposing water using solar energy is a technique that is indispensable for the early commercialization and acceleration of hydrogen fuel cell vehicles. Examples of the technology for decomposing water with sunlight include the following.

まず、太陽電池−電解システムであるが、太陽電池の発電コストは非常に高価であるため、電気分解と組み合わせても安価に水素を製造することは不可能である。
次の水素製造としては、水の熱化学分解法があるが、700−800度以上の高熱を必要とし、サイクル速度も非常に遅い。
光触媒による水の光分解法については、近年広く研究されているが、性能は非常に低い。量子収率の高い光触媒は、300nm以下の太陽光にほとんど含まれない紫外線しか利用できないので太陽エネルギー変換できない。TiOなど400nmまでの紫外線を使う光触媒で水分解する報告はあるが、太陽エネルギー変換効率は最高でも0.03%以下であり、非常に低い。いくつか可視光応答性の半導体光触媒が知られているが、ほとんどが、メタノールや硝酸銀といった還元剤や酸化剤(いわゆる犠牲試薬)の反応であり、太陽エネルギーの変換はできていない。
ごく最近、NiOx−In1−xNixTaOにより可視光下で水を水素と酸素に分解したという報告があったが、その量子収率は400nmで0.66%であり、太陽エネルギー変換効率としては0.01%以下と推察される。また、非酸化物系光触媒でも水の分解は成功していない。
このように光触媒分野では、可視光を利用した効率的な太陽エネルギー変換はほとんど達成されていないと言える。また、水素と酸素が同時に混合して発生するため、分離コストも大きく、また爆発の危険も高い。
First, although it is a solar cell-electrolysis system, since the power generation cost of a solar cell is very expensive, even if it combines with electrolysis, it is impossible to manufacture hydrogen cheaply.
As the next hydrogen production, there is a thermochemical decomposition method of water, but high heat of 700-800 degrees or more is required, and the cycle rate is very slow.
The photodecomposition method of water using a photocatalyst has been widely studied in recent years, but its performance is very low. A photocatalyst with a high quantum yield cannot convert solar energy because it can use only ultraviolet rays hardly contained in sunlight of 300 nm or less. Although there is a report of water splitting with a photocatalyst using ultraviolet rays up to 400 nm such as TiO 2 , the solar energy conversion efficiency is 0.03% or less at the maximum, which is very low. Some visible light-responsive semiconductor photocatalysts are known, but most are reactions of reducing agents and oxidizing agents (so-called sacrificial reagents) such as methanol and silver nitrate, and solar energy conversion is not possible.
More recently, although the water under visible light were reports that decomposed into hydrogen and oxygen by NiOx-In1-xNixTaO 4, the quantum yield was 0.66% for 400 nm, 0 as solar energy conversion efficiency It is estimated that it is less than 0.01%. Moreover, the decomposition of water has not been successful even with non-oxide photocatalysts.
Thus, it can be said that the efficient solar energy conversion using visible light has hardly been achieved in the photocatalyst field. Also, since hydrogen and oxygen are mixed at the same time, the separation cost is high and the risk of explosion is high.

一方、半導体光電極による太陽エネルギー変換についても古くから検討されている(図1)。半導体光電極とPt対極を組み合わせて、バイアスをかけながら光を照射すると、半導体上で価電子帯に生成した正孔が水を酸化して酸素を生成し、伝導帯上に生成した電子は対極のPt上で水を還元して水素を生成できる。水素と酸素は別々に発生できる利点がある。このような半導体において、TiOなど酸化物半導体は安定でかつ安価であるが、紫外線など波長の短い光しか利用できない。シリコンなど非酸化物系半導体を用いた場合は、可視光の大部分を利用できるため性能は比較的高いが、コストが高く、半導体の劣化も起こりやすい。コストと安定性を考慮すると、やはり酸化物系が望ましい。ドープ型酸化物半導体の可視光応答性光電極は以前から研究されているが、性能は非常に低かった。従来型の可視光応答性半導体光電極は、単結晶や粉末高温焼結体など数mm程度の厚さで且つ表面積の低い電極で主に研究がされてきたので、電荷の移動距離が長い(図1)。電荷、特に正孔は表面に移動しにくいため、反応が電極表面で起こる前に電荷再結合が進行し、性能が向上できなかった。
従来型の可視光応答性光電極では、ペレット型(ミリメートル程度の厚さ)の高温焼結した半導体粉末を用い、裏面にインジウムなどのオーミック接触用金属を塗布し、導線を接続し、電解液がその金属や導線と接触しないように接着剤などで固めた構造をしている(J.Solid State Electrochem.2(1998)176、Solar Energy Materials 21(1991)335、Nouv.J.Chimie 4(1980)501、Chem.Phys.Lett.,77(1981)6.)。
On the other hand, solar energy conversion by a semiconductor photoelectrode has also been studied for a long time (FIG. 1). When a semiconductor photoelectrode and a Pt counter electrode are combined and irradiated with light while applying a bias, holes generated in the valence band on the semiconductor oxidize water to generate oxygen, and the electrons generated on the conduction band are counter electrodes. Water can be reduced by reducing water on Pt. There is an advantage that hydrogen and oxygen can be generated separately. In such a semiconductor, an oxide semiconductor such as TiO 2 is stable and inexpensive, but only light having a short wavelength such as ultraviolet light can be used. When a non-oxide semiconductor such as silicon is used, most of the visible light can be used, so the performance is relatively high, but the cost is high and the semiconductor is likely to deteriorate. In view of cost and stability, an oxide system is still desirable. Although a visible light responsive photoelectrode of a doped oxide semiconductor has been studied for a long time, its performance has been very low. Conventional visible light responsive semiconductor photoelectrodes have been studied mainly with electrodes having a thickness of several millimeters and a low surface area, such as single crystals and high-temperature powder sintered bodies. FIG. 1). Since charges, especially holes, are difficult to move to the surface, charge recombination progressed before the reaction occurred on the electrode surface, and the performance could not be improved.
A conventional visible light responsive photoelectrode uses pellet-type (millimeter-thickness) high-temperature-sintered semiconductor powder, the back surface is coated with an ohmic contact metal such as indium, and a conductive wire is connected. Is solidified with an adhesive or the like so that it does not come into contact with the metal or lead (J. Solid State Electrochem. 2 (1998) 176, Solar Energy Materials 21 (1991) 335, Nouv. J. Chimie 4 ( 1980) 501, Chem. Phys. Lett., 77 (1981) 6.).

ところが近年、半導体光電極に関して、下記のようないくつかの可視光応答性多孔質膜電極の報告がされた。FeやWOからなる多孔質半導体光電極を用いて、非常に高効率で水を分解できることがわかった[J.Phys.Chem.B,103(1999)7184(非特許文献1)、J.Am.Chem.Soc.123,(2001),10639(非特許文献2)、WO0102624A1(特許文献1)]。多孔質半導体光電極は、反応基質である水などが電極の内部まで浸透できる。つまり半導体光電極内部で生成した正孔の拡散距離が従来の電極と比較して小さくてすむので高効率化が期待できる(図2)。しかし、これらの可視光応答性の単純酸化物半導体は伝導帯準位が正に大きいという欠点があった。つまり、伝導帯に生成した電子を使ってプロトンを水素に還元する反応を進行させるためには、外部から大きな電気エネルギーを投入する必要があった。これは正味の太陽エネルギー変換効率が低下することを意味する。このような可視光応答性の膜状多孔質光電極において実用化を目指すためには、太陽エネルギー変換効率を大きく向上させる技術が必要であった。また、WOは酸性でのみ安定、Feはアルカリ性でのみ安定というように、使用条件が限定されるため、新しい安定な材料の開発が要望されている。新しい半導体材料は上記の性質の他に、電荷分離ができ、且つ酸素発生が効率よくできなくてはいけない。 However, in recent years, several visible light-responsive porous membrane electrodes have been reported with respect to semiconductor photoelectrodes. It was found that water can be decomposed with very high efficiency using a porous semiconductor photoelectrode made of Fe 2 O 3 or WO 3 [J. Phys. Chem. B, 103 (1999) 7184 (Non-Patent Document 1), J. Am. Am. Chem. Soc. 123, (2001), 10639 (Non-Patent Document 2), WO01026224A1 (Patent Document 1)]. In the porous semiconductor photoelectrode, water as a reaction substrate can penetrate into the electrode. That is, since the diffusion distance of holes generated inside the semiconductor photoelectrode is smaller than that of the conventional electrode, high efficiency can be expected (FIG. 2). However, these visible light responsive simple oxide semiconductors have a drawback of having a large conduction band level. In other words, in order to advance the reaction of reducing protons to hydrogen using electrons generated in the conduction band, it was necessary to input large electric energy from the outside. This means that the net solar energy conversion efficiency is reduced. In order to aim for practical use in such a visible light-responsive film-like porous photoelectrode, a technique for greatly improving the solar energy conversion efficiency is required. Further, since the use conditions are limited such that WO 3 is stable only when it is acidic and Fe 2 O 3 is stable only when it is alkaline, development of a new stable material is desired. In addition to the above properties, the new semiconductor material must be capable of charge separation and oxygen generation efficiently.

J.Phys.Chem.B,103(1999)7184J. et al. Phys. Chem. B, 103 (1999) 7184 J.Am.Chem.Soc.123,(2001),10639J. et al. Am. Chem. Soc. 123, (2001), 10639 WO0102624A1WO0102624A1

本発明は、前記事情に鑑みてなされたもので、特定の半導体光電極と対極を組み合わせた光電気化学システムにおいて、該半導体の導電性や価電子準位を制御することで可視光応答性を持たせながら、電荷移動度を確保しつつ、伝導帯の準位が正に大きくなることを防ぎ、且つ多孔質構造の膜状半導体光電極を用いることで電荷の拡散距離を小さくし、太陽エネルギー変換効率を大きく向上させる技術を提供することをその課題とする。   The present invention has been made in view of the above circumstances, and in a photoelectrochemical system in which a specific semiconductor photoelectrode and a counter electrode are combined, visible light responsiveness is controlled by controlling the conductivity and valence level of the semiconductor. While maintaining the charge mobility, it prevents the conduction band level from becoming positively large, and by using the porous semiconductor film-like semiconductor photoelectrode, the charge diffusion distance is reduced, and the solar energy It is an object to provide a technique for greatly improving the conversion efficiency.

本発明によれば、以下に示す膜状半導体光電極、光電気化学セル及び水の分解方法が提供される。
(1)水の分解反応又はレドックス反応によるエネルギー蓄積型反応を行う光電気化学セルにおいて用いられる膜状半導体光電極であって、可視光応答性の多孔質構造の複合金属酸化物系半導体からなり、2種類以上の金属元素から構成され、その金属元素の少なくとも1つはビスマス、銀、銅、スズ、鉛、インジウム、プラセオジム及びニッケルの中から選ばれることを特徴とする膜状多孔質半導体光電極。
(2)水の分解反応又はレドックス反応によるエネルギー蓄積型反応を行う光電気化学セルにおいて用いられる膜状半導体光電極であって、窒素及びイオウの中から選ばれる1つ以上の元素を含む可視光応答性の多孔質構造の含酸素化合物半導体からなることを特徴とする膜状多孔質半導体光電極。
(3)クロム、ニッケル、鉄、銀、鉛、銅、バナジウム及びビスマスの中から選ばれる1つ以上の元素を20〜0.5mol%ドープし、且つアンチモン、ビスマス、バナジウム、ニオブ及びタンタルの中から選ばれる1つ以上の元素を共ドープした前記(1)に記載の膜状多孔質半導体光電極。
(4)半導体内部に生成した正孔の50%以上の半導体表面への拡散距離が500nm以内である前記(1)〜(3)のいずれかに記載の膜状多孔質半導体光電極。
(5)ビスマスとバナジウムの両方を含む可視光応答性の多孔質構造の複合金属酸化物系半導体からなる前記(1)に記載の膜状多孔質半導体光電極。
(6)光透過性基板上に形成されている前記(1)〜(5)のいずれかに記載の膜状多孔質半導体光電極。
(7)該半導体の膜厚が50μm以下である前記(1)〜(6)のいずれかに記載の膜状多孔質半導体光電極。
(8)該半導体光電極として、前記(1)〜(7)のいずれかに記載の膜状半導体光電極を用いることを特徴とする光電気化学セル。
(9)該エネルギー蓄積型反応が水の分解反応である前記(8)に記載の光電気化学セル。
(10)前記(8)に記載の光電気化学セルを用いて水を水素と酸素に分解することを特徴とする水の分解方法。
According to the present invention, the following film-like semiconductor photoelectrode, photoelectrochemical cell and water decomposition method are provided.
(1) A film-like semiconductor photoelectrode used in a photoelectrochemical cell that performs an energy storage type reaction by water decomposition reaction or redox reaction, and is composed of a composite metal oxide semiconductor having a porous structure that is responsive to visible light. A film-like porous semiconductor light comprising two or more metal elements, at least one of which is selected from bismuth, silver, copper, tin, lead, indium, praseodymium and nickel electrode.
(2) A film-like semiconductor photoelectrode used in a photoelectrochemical cell that performs an energy storage-type reaction by water decomposition reaction or redox reaction , and includes visible light containing one or more elements selected from nitrogen and sulfur A membranous porous semiconductor photoelectrode comprising an oxygen-containing compound semiconductor having a responsive porous structure.
(3) doped with 20 to 0.5 mol% of one or more elements selected from chromium, nickel, iron, silver, lead, copper, vanadium and bismuth, and in antimony, bismuth, vanadium, niobium and tantalum The membranous porous semiconductor photoelectrode according to the above (1), which is co-doped with one or more elements selected from:
(4) The membranous porous semiconductor photoelectrode according to any one of (1) to (3), wherein a diffusion distance of 50% or more of holes generated in the semiconductor to the semiconductor surface is within 500 nm.
(5) The membranous porous semiconductor photoelectrode according to (1), comprising a composite metal oxide based semiconductor having a visible light responsive porous structure containing both bismuth and vanadium.
(6) The membranous porous semiconductor photoelectrode according to any one of (1) to (5) , which is formed on a light-transmitting substrate.
(7) The film-like porous semiconductor photoelectrode according to any one of (1) to (6), wherein the thickness of the semiconductor is 50 μm or less.
(8) A photoelectrochemical cell using the film-like semiconductor photoelectrode according to any one of (1) to (7) as the semiconductor photoelectrode.
(9) The photoelectrochemical cell according to (8), wherein the energy storage type reaction is a water decomposition reaction.
(10) A method for decomposing water, comprising decomposing water into hydrogen and oxygen using the photoelectrochemical cell according to (8) .

本発明により、太陽光の可視光を効率よく水素など化学エネルギーに変換できる、シンプルなシステムが実現できる。本発明の重要な点は、電荷の移動を容易にしたり、または伝導帯準位が比較的高い(負に大きい)可視光応答性の膜状多孔質半導体光電極を提供できることである。実施例において量子収率が未だ低い電極でも、成膜方法をさらに最適化することで、その量子収率は100%に近くなる。それにより、無尽蔵の太陽光と水から効率よく水素を取り出すことが可能になり、水素エネルギー社会実現に一歩近づくことができる。   According to the present invention, a simple system that can efficiently convert visible light of sunlight into chemical energy such as hydrogen can be realized. An important point of the present invention is that it is possible to provide a film-like porous semiconductor photoelectrode having a visible light responsiveness that facilitates charge transfer or has a relatively high conduction band level (negatively large). Even in an electrode with a low quantum yield in the examples, the quantum yield is close to 100% by further optimizing the film forming method. As a result, it becomes possible to efficiently extract hydrogen from inexhaustible sunlight and water, and one step closer to realizing a hydrogen energy society.

以下、本発明を詳しく説明する。
本発明で用いる可視光応答性の半導体としては、安定性や経済性を考えて、酸素原子を含む酸化物系半導体のを使用が好ましい。この場合の可視光応答性とは、可視光線を単に吸収し得るだけでなく、可視光照射によって生成した電荷を反応に利用できる性質を意味する。
TiOやSrTiO、Ta、WOなどの酸化物半導体は、一般的に伝導帯が遷移金属原子のd軌道、価電子帯が酸素の2p軌道で形成されている。これらの遷移金属原子の形式電荷はTi4+やTa5+、W6+であり、d軌道は電子が無い状態である。光が照射されると、酸素の2p軌道の電子が遷移金属の空のd軌道へと励起される。つまり、酸素の2p軌道に電子の抜け殻である正孔ができる。このような半導体は酸素の2p軌道がどれも同じような準位にあるとすれば、バンドギャップの大きさで伝導帯準位が支配されるので、可視光を広く利用するためにバンドギャップを小さくすると伝導帯準位が正に大きくシフトする。伝導帯準位が正に大きくシフトするほど、対極で水素発生を行うためには多くの外部バイアスを必要とするため、正味のエネルギー変換効率は悪くなるというジレンマがある。このジレンマを解消する方法が、価電子帯を酸素以外の原子の軌道で制御して、価電子帯準位を負にシフトさせることである。紫外線応答性の半導体電極に遷移金属などをドープや原子置換することで価電子準位制御を行い、可視光応答性を持たせる試みは、従来型の半導体電極(単結晶や高温焼結体)では行われてきたが、性能は非常に小さかった。理由は、価電子帯の正孔は伝導帯の電子に比べて動きにくく、且つドープ量が少ない場合はドープ準位が空間的に離れて存在するため、半導体バルク内部から正孔が表面に移動することが難しいからである。
The present invention will be described in detail below.
As the visible light responsive semiconductor used in the present invention, an oxide-based semiconductor containing an oxygen atom is preferably used in consideration of stability and economy. The visible light responsiveness in this case means not only the ability to absorb visible light but also the property that charges generated by irradiation with visible light can be used for the reaction.
In general, oxide semiconductors such as TiO 2 , SrTiO 3 , Ta 2 O 5 , and WO 3 are formed with a 2p orbital in which a conduction band is a d-orbital of a transition metal atom and a valence band is oxygen. The formal charges of these transition metal atoms are Ti 4+ , Ta 5+ , W 6+ , and the d orbit is in a state without electrons. When irradiated with light, oxygen 2p orbital electrons are excited into transition metal vacant d orbitals. That is, a hole which is a shell of electrons is formed in the 2p orbit of oxygen. In such a semiconductor, if all the 2p orbitals of oxygen are at the same level, the conduction band level is governed by the size of the band gap. When it is made smaller, the conduction band level shifts significantly larger. There is a dilemma that as the conduction band level shifts to a large positive value, more external bias is required to generate hydrogen at the counter electrode, and the net energy conversion efficiency becomes worse. A method of eliminating this dilemma is to shift the valence band level negatively by controlling the valence band with the orbits of atoms other than oxygen. The conventional semiconductor electrode (single crystal or high-temperature sintered body) has been tried to control the valence levels by doping transition atoms, etc., or substituting atoms into the ultraviolet-responsive semiconductor electrode and to provide visible light response. The performance was very small. The reason is that holes in the valence band are less likely to move than electrons in the conduction band, and when the doping amount is small, the doping level exists spatially away, so holes move from the inside of the semiconductor bulk to the surface. Because it is difficult to do.

我々は、この問題を解決するためには、半導体を微粒子化すれば電荷が表面へ移動する距離が短くなり、酸化反応がスムーズになると考えて本発明に至った。つまり、半導体を多孔質膜にして電解質溶液が膜内部まで浸透した構造の電極が良いことになる。このような電極は、FeとWOのような単純酸化物では報告があるが、価電子制御した複雑な複合酸化物系半導体では検討されていない。本発明では、電荷の移動をスムーズにし、かつ半導体バンド構造を制御する目的で、(i)金属元素を2種類以上含有する可視光応答性の複合酸化物系半導体、(ii)酸素以外のアニオン性元素(SまたはN)を一部含む、可視光応答性の含酸素化合物半導体、又は(iii)ドープ量を比較的多めにして且つ共ドープを行った酸化物系半導体を用いる。
なお、この場合の複合酸化物とは、2種類以上の金属元素を含み、且つ結晶構造が規定できる物質である。ドーピングとは、ホスト化合物の基本結晶構造がほとんど変わらない範囲で異種元素をホスト化合物結晶中に入れることを意味する。
In order to solve this problem, the inventors have arrived at the present invention on the assumption that if the semiconductor is micronized, the distance that the electric charge moves to the surface is shortened and the oxidation reaction becomes smooth. That is, an electrode having a structure in which a semiconductor is used as a porous film and an electrolyte solution penetrates into the film is good. Such electrodes have been reported for simple oxides such as Fe 2 O 3 and WO 3 , but have not been studied for complex complex oxide semiconductors controlled by valence electrons. In the present invention, for the purpose of smoothing the movement of electric charges and controlling the semiconductor band structure, (i) a visible light-responsive complex oxide semiconductor containing two or more metal elements, and (ii) an anion other than oxygen A visible light responsive oxygen-containing compound semiconductor containing a part of the reactive element (S or N), or (iii) a relatively large amount of doped oxide-based semiconductor.
Note that the composite oxide in this case is a substance that includes two or more kinds of metal elements and whose crystal structure can be defined. Doping means putting a different element into the host compound crystal within a range where the basic crystal structure of the host compound hardly changes.

半導体の種類としては、基本的に価電子準位上部が酸化物以外の元素の準位を含む可視光応答性の複合金属酸化物系半導体が好ましい。この複合金属酸化物系半導体は、2種類以上の金属元素で構成することが好ましく、その少なくとも1つの元素Aは、ビスマス(Bi)、銀(Ag)、銅(Cu)、スズ(Sn)、鉛(Pb)、バナジウム(V)、インジウム(In)、プラセオジム(Pr)、クロム(Cr)、及びニッケル(Ni)の中から選ばれる。特に、ビスマス、銀、スズ、ニッケルが好ましい。2種以上の金属元素の組合せは、前記元素A同志の組合せの他、前記元素Aに対する元素Bの組合せを示すことができる。この場合、元素Bは、Ti、Nb、Ta、Zr、Hf、Mo、W、Zn、Ga、In、Ge及びSnの中から選ばれる。   As the type of semiconductor, a visible light responsive complex metal oxide semiconductor in which the upper part of the valence level basically includes the level of an element other than an oxide is preferable. This composite metal oxide semiconductor is preferably composed of two or more kinds of metal elements, and at least one element A thereof is bismuth (Bi), silver (Ag), copper (Cu), tin (Sn), It is selected from lead (Pb), vanadium (V), indium (In), praseodymium (Pr), chromium (Cr), and nickel (Ni). In particular, bismuth, silver, tin, and nickel are preferable. The combination of two or more metal elements can indicate a combination of element B with respect to element A in addition to a combination of elements A. In this case, the element B is selected from Ti, Nb, Ta, Zr, Hf, Mo, W, Zn, Ga, In, Ge, and Sn.

一般的な酸化物系半導体では、価電子帯は酸素2p軌道でできている。この価電子帯の上部の準位がバンドギャップを決めている。バンドギャップを小さくするには、価電子帯上部と同じ準位またはそれより上(電気化学的に負の方向)に別の原子の軌道を存在させればよい。また、価電子帯上部準位よりも下に軌道を持つ原子を存在させても、酸素とその原子の軌道がハイブリッドする場合は新しい準位が上にできる可能性があり、利用できる。このような軌道のハイブリッドは電荷の移動をスムーズにできる。
どのような原子の化合物を使ったりドープしたりすべきかについては、最近では計算機科学(密度汎関数法など)が進展しているため、おおよそ判別できる。本発明で用いる好ましい半導体は、具体的には、クロム、ニッケル、鉄など、d軌道が一部満たされた電子状態を持つ元素を1つ以上含む可視光応答性の複合酸化物系半導体や、ビスマス、銀、スズ(好ましくは形式II価)、鉛(好ましくは形式II価)、バナジウム、インジウム及びプラセオジムの中から選ばれる1つ以上の元素を含む可視光応答性の複合酸化物系半導体である。
In a general oxide semiconductor, the valence band is made of oxygen 2p orbitals. The upper level of this valence band determines the band gap. In order to reduce the band gap, another atomic orbital may be present at the same level as or above the upper part of the valence band (electrochemically negative direction). In addition, even if an atom having an orbit below the upper level of the valence band is present, if oxygen and the orbit of the atom hybridize, there is a possibility that a new level can be raised and used. Such orbital hybrids can move charges smoothly.
What kind of atomic compound should be used or doped can be roughly discriminated because of recent advances in computer science (such as density functional theory). A preferred semiconductor used in the present invention is specifically a visible light-responsive composite oxide semiconductor containing one or more elements having an electronic state partially filled with d orbitals, such as chromium, nickel, iron, A visible light responsive complex oxide semiconductor containing one or more elements selected from bismuth, silver, tin (preferably form II valence), lead (preferably form II valence), vanadium, indium and praseodymium. is there.

本発明で用いる半導体は、窒素及びイオウの中から選ばれる1つ以上の元素を含む可視光応答性の含酸素化合物半導体でも良い。例えばオキシナイトライドやオキシサルファイド類である。また、オキシカーバイド類など炭素を含んでも良い。上述の半導体では、ドーピングや元素置換の結果、酸素欠陥や格子歪みを生じることがあるが、これが価電子準位を変化させることもある。   The semiconductor used in the present invention may be a visible light responsive oxygen-containing compound semiconductor containing one or more elements selected from nitrogen and sulfur. For example, oxynitrides and oxysulfides. Carbons such as oxycarbides may also be included. In the semiconductor described above, oxygen defects and lattice distortion may occur as a result of doping and element substitution, which may change the valence level.

本発明で用いられる複合金属酸化物系半導体において、その金属元素の組合せの具体例を示すと、例えば、Bi/V、Ag/Nb、In/Ni/Ta、Ag/Pr/Ti、Rb/Pb/Nb、In/Zn、Bi/Mo、Bi/W、Ag/V、Pb/Mo/Cr、In/Zn/Cu、Na/Bi、K/Bi等が挙げられる。   Specific examples of combinations of metal elements in the composite metal oxide semiconductor used in the present invention include, for example, Bi / V, Ag / Nb, In / Ni / Ta, Ag / Pr / Ti, and Rb / Pb. / Nb, In / Zn, Bi / Mo, Bi / W, Ag / V, Pb / Mo / Cr, In / Zn / Cu, Na / Bi, K / Bi, and the like.

複合金属酸化物系半導体の具体例としては、例えば、以下のものを挙げることができる。
BiVO、AgNbO、AgPrTi、RbPbNb10、In−(ZnO)、BiMoO、BiWO、AgVO、In−xZnxCu(x=0〜1)、ABiO(AはNa、K、Li、Ag等の1価金属)、ABiO(AはNa、K、Li、Ag等の1価金属)等。
Specific examples of the composite metal oxide semiconductor include the following.
BiVO 4, AgNbO 3, AgPrTi 2 O 6, RbPb 2 Nb 3 O 10, In 2 O 3 - (ZnO) 3, Bi 2 MoO 6, Bi 2 WO 6, Ag 3 VO 4, In 2 -xZnxCu 2 O 5 (X = 0 to 1), ABiO 2 (A is a monovalent metal such as Na, K, Li and Ag), ABiO 3 (A is a monovalent metal such as Na, K, Li and Ag) and the like.

窒素及び/又はイオウを含む含酸素化合物半導体は、(i)金属と(ii)酸素と(iii)N及び/又はSの元素から構成される。この場合の金属元素には、Ta、Sm、Ti、Nb、Zr、Hf、Mo、W、Zn、Ga、In、Ge、Sn、Bi、V及びPb等が包含される。
前記含酸素化合物半導体の具体例としては、TaON、SmTi、BaNbON、SrTaON、LaTaON、ZrON、NaTiOS、ZrOS、Li7.2Ti0.81.62.4、Ta1.814.79、Ta0.48Zr0.52CaO2.520.48等が挙げられる。
The oxygen-containing compound semiconductor containing nitrogen and / or sulfur is composed of (i) a metal, (ii) oxygen, and (iii) N and / or S elements. The metal elements in this case include Ta, Sm, Ti, Nb, Zr, Hf, Mo, W, Zn, Ga, In, Ge, Sn, Bi, V, Pb, and the like.
Specific examples of the oxygen-containing compound semiconductor include TaON, Sm 2 Ti 2 S 2 O 5 , BaNbO 2 N, SrTaO 2 N, LaTaON 2 , Zr 2 ON 2 , Na 2 TiOS 2 , ZrOS, and Li 7.2 Ti. 0.8 O 1.6 N 2.4 , Ta 5 O 1.81 N 4.79 , Ta 0.48 Zr 0.52 CaO 2.52 N 0.48, and the like.

本発明では、金属Xドープし、且つ金属Yを共ドープした構造の酸化物系半導体も好ましく用いることができる。
この場合、金属Xとしては、クロム(Cr)、ニッケル(Ni)、鉄(Fe)、銀(Ag)、鉛(Pb)、銅(Cu)、バナジウム(V)及びビスマス(Bi)の中から選ばれる少なくとも1種が用いられる。
一方、金属Yとしては、アンチモン(Sb)、ビスマス(Bi)、バナジウム(V)、ニオブ(Nb)及びタンタル(Ta)の中から選ばれる少なくとも1種が用いられる。金属Xと金属Yとの比率は、原子比[X]/[Y]で、0.2〜5、好ましくは0.5〜2である。
酸化物系半導体に含まれる金属Zとしては、チタン(Ti)、タンタル(Ta)、ジルコニウム(Zr)、ハフニウム(Hf)、モリブデン(Mo)、タングステン(W)、亜鉛(Zn)、ガリウム(Ga)、イソジウム(In)、ゲルマニウム(Te)、スズ(Sn)、ビスマス(Bi)等が用いられる。
In the present invention, an oxide-based semiconductor having a structure doped with metal X and co-doped with metal Y can also be preferably used.
In this case, the metal X is selected from among chromium (Cr), nickel (Ni), iron (Fe), silver (Ag), lead (Pb), copper (Cu), vanadium (V) and bismuth (Bi). At least one selected is used.
On the other hand, as the metal Y, at least one selected from antimony (Sb), bismuth (Bi), vanadium (V), niobium (Nb), and tantalum (Ta) is used. The ratio of the metal X to the metal Y is an atomic ratio [X] / [Y] and is 0.2 to 5, preferably 0.5 to 2.
Examples of the metal Z contained in the oxide semiconductor include titanium (Ti), tantalum (Ta), zirconium (Zr), hafnium (Hf), molybdenum (Mo), tungsten (W), zinc (Zn), and gallium (Ga ), Isodium (In), germanium (Te), tin (Sn), bismuth (Bi), and the like.

未ドープの酸化物系半導体の具体例としては、以下のものが挙げられる。
(1)単純酸化物:TiO、Ta、ZrO等。
(2)複合酸化物
(i)Ti系:SrTiO、KLaTi10、RbLaTi10
、CsLaTiNbO10、NaTi13、BaTi等。
(ii)Nb系:KNb17、RbNb17、SrNb、Na
Nb32、KCaNb10等。
(iii)Ta系:KTaO、NaTaO、BaTa、RbTa17
、KTaSi13、NaTa32、KTa11、K
rTa、SrTa、RbNdTa、LaTaO等。
(iv)In系:CaIn、SrIn等。
(v)Sn系:SrSnO、CaSnO等。
(vi)Ga系:CaGa、SrGa、ZnGa等。
(vii)Ge系、ZnGeO等。
(viii)Sb系、NaSbO、KSbO等。
Specific examples of the undoped oxide semiconductor include the following.
(1) Simple oxides: TiO 2, Ta 2 O 5 , ZrO 2 and the like.
(2) Complex oxide (i) Ti-based: SrTiO 3 , K 2 La 2 Ti 3 O 10 , Rb 2 La 2 Ti 3 O 10
CsLa 2 Ti 2 NbO 10 , Na 2 Ti 6 O 13 , BaTi 4 O 9 and the like.
(Ii) Nb series: K 4 Nb 6 O 17 , Rb 4 Nb 6 O 17 , Sr 2 Nb 2 O 7 , Na 4
Nb 8 P 4 O 32 , KCa 2 Nb 3 O 10 and the like.
(iii) Ta series: KTaO 3 , NaTaO 3 , BaTa 2 O 6 , Rb 4 Ta 6 O 17
, K 3 Ta 3 Si 2 O 13, Na 4 Ta 8 P 4 O 32, K 2 Ta 4 O 11, K 2 S
rTa 2 O 7 , Sr 2 Ta 2 O 7 , RbNdTa 2 O 7 , LaTaO 4 and the like.
(Iv) In-based: CaIn 2 O 4 , SrIn 2 O 4 and the like.
(V) Sn series: Sr 2 SnO 4 , Ca 2 SnO 4 and the like.
(Vi) Ga-based: CaGa 2 O 4 , SrGa 2 O 4 , ZnGa 2 O 4 and the like.
(vii) Ge-based, Zn 2 GeO 4 or the like.
(Viii) Sb-based, NaSbO 3 , KSbO 3 and the like.

酸化物系半導体とドープ金属の組合せを示すと、以下の通りである。
(1)半導体:TiO
金属X:Cu
金属Y:Sb
(2)半導体:TiO
金属X:Cr
金属Y:Bi
(3)半導体:TiO
金属X:Ni
金属Y:Sb
(4)TiO/Cr、Sb、
(5)Ta/Cr、Sb、
(6)NaTaO/Cr、Sb
A combination of an oxide semiconductor and a doped metal is as follows.
(1) Semiconductor: TiO 2
Metal X: Cu
Metal Y: Sb
(2) Semiconductor: TiO 2
Metal X: Cr
Metal Y: Bi
(3) Semiconductor: TiO 2
Metal X: Ni
Metal Y: Sb
(4) TiO 2 / Cr, Sb,
(5) Ta 2 O 5 / Cr, Sb,
(6) NaTaO 3 / Cr, Sb

金属X及びYがドープされた酸化物系半導体において、該金属Xのドープ量は、半導体化合物1モルに対して、0.5〜20モル%、好ましくは5〜10モル%である。共ドープする金属Yの共ドープ量は、ドープ種の電荷のバランスが合う量を基体とするが、それからずれてもかまわない。   In the oxide-based semiconductor doped with the metals X and Y, the doping amount of the metal X is 0.5 to 20 mol%, preferably 5 to 10 mol%, relative to 1 mol of the semiconductor compound. The co-doping amount of the metal Y to be co-doped is based on an amount in which the balance of the charge of the doping species matches, but may be deviated from that.

ドーピング化合物でドープ元素が価電子準位を形成し、かつその準位が酸素の形成する価電子帯と0.03eV(室温の励起エネルギー)以上離れている場合は、ドープ量は比較的多くなければ、正孔は移動しにくい。ドーピング化合物としてはクロム、ニッケルなど、d軌道が一部満たされた電子状態を持つ元素やバナジウム、ビスマス、銀、スズが挙げられる。ホストとなる半導体の金属と価数が異なるドーピング種を用いる場合は、電荷を中和するための別の価数の金属を共ドープすることが望ましい。共ドープ種としてはアンチモン、ビスマス、バナジウム、ニオブ、タンタル等がある。   If the doping element in the doping compound forms a valence level and the level is separated from the valence band formed by oxygen by 0.03 eV (excitation energy at room temperature) or more, the doping amount must be relatively large. For example, holes are difficult to move. Examples of the doping compound include elements having an electronic state partially filled with d orbitals such as chromium and nickel, vanadium, bismuth, silver, and tin. When a doping species having a valence different from that of the host semiconductor metal is used, it is desirable to co-dope another valence metal for neutralizing the charge. Examples of co-doped species include antimony, bismuth, vanadium, niobium, and tantalum.

正孔の移動距離を短くするためには、半導体は小さいことが望ましい。形状は球状でも棒状でも良いが、半導体内部に生成した正孔の50%以上、好ましくは80%以上の半導体表面への拡散距離が500nm以下、好ましくは10nm以下である多孔質膜が良い。電荷分離の促進や電荷再結合の抑制のためには結晶性が高い必要があり、アモルファスでは好ましくない。   In order to shorten the movement distance of holes, it is desirable that the semiconductor is small. The shape may be spherical or rod-like, but a porous film having a diffusion distance to the semiconductor surface of 50% or more, preferably 80% or more of the holes generated in the semiconductor is 500 nm or less, preferably 10 nm or less. In order to promote charge separation and suppress charge recombination, crystallinity needs to be high, and amorphous is not preferable.

次に、本発明の膜状多孔質半導体の説明構造図を図3及び図4に示す。   Next, an explanatory structural diagram of the membranous porous semiconductor of the present invention is shown in FIGS.

図3に示すものは、細孔(空孔)が垂直に延びている場合の例を示す。
図3(a)は、図3(b)のa−a’切断線に沿った説明断面図を示し、図3(b)は多孔質半導体膜の平面図を示す。
図3において、1は基板、2は半導体膜、3は正孔、4は空孔、5は空孔、6は粒子状半導体を示す。図3中の矢印は正孔3と半導体表面との間の拡散距離を示す。
FIG. 3 shows an example in which the pores (holes) extend vertically.
FIG. 3A shows an explanatory cross-sectional view taken along the line aa ′ in FIG. 3B, and FIG. 3B shows a plan view of the porous semiconductor film.
In FIG. 3, 1 is a substrate, 2 is a semiconductor film, 3 is a hole, 4 is a hole, 5 is a hole, and 6 is a particulate semiconductor. The arrows in FIG. 3 indicate the diffusion distance between the holes 3 and the semiconductor surface.

図4に示すものは、半導体が微粒子で構成されている場合の例を示す。
図4は、多孔質半導体膜の説明断面図を示す。
図4において、1は基板、2は半導体膜、3は正孔、4は空孔を示す。図4中の矢印は正孔3と半導体表面との間の拡散距離を示す。
FIG. 4 shows an example where the semiconductor is composed of fine particles.
FIG. 4 is an explanatory cross-sectional view of the porous semiconductor film.
In FIG. 4, 1 is a substrate, 2 is a semiconductor film, 3 is a hole, and 4 is a hole. The arrows in FIG. 4 indicate the diffusion distance between the holes 3 and the semiconductor surface.

本発明で用いる半導体は、多孔質構造のものであるため、電解液は半導体細孔を通じて基板と接触することがほとんどである。基板表面が電解液と触れると、漏れ電流を生じる可能性がある場合は、基板表面を細孔のほとんどない緻密膜で覆うと性能が向上する。
電解液の膜内部での移動や酸素などの生成物の拡散を効率よくするためには、半導体膜の孔の大きさは比較的大きい方が望ましいが、大きすぎると膜強度が弱くなったり、電荷の移動がし難くなる。5nm〜500nmのいろいろな大きさの細孔が組み合わさった状態が好ましい。細孔径を制御するには、膜を焼成して作成する時に混ぜる有機物の分子量や混合量で調整できる。
半導体膜を構成する半導体粒子において、大きな粒子は光散乱を起こし、光吸収効率を上げる効果がある。
Since the semiconductor used in the present invention has a porous structure, the electrolytic solution is mostly in contact with the substrate through the semiconductor pores. If there is a possibility that leakage current will occur when the surface of the substrate comes into contact with the electrolytic solution, the performance is improved by covering the substrate surface with a dense film having almost no pores.
In order to efficiently move the electrolyte solution inside the membrane and diffuse the product such as oxygen, it is desirable that the pore size of the semiconductor membrane is relatively large, but if it is too large, the membrane strength will be weakened, It becomes difficult to move charges. A state in which pores of various sizes of 5 nm to 500 nm are combined is preferable. In order to control the pore diameter, it can be adjusted by the molecular weight or mixing amount of the organic substance to be mixed when the film is baked and formed.
In the semiconductor particles constituting the semiconductor film, large particles cause light scattering and have an effect of increasing light absorption efficiency.

半導体は、通常、基板上に形成するが、この場合の半導体電極基板としては、導電性ガラスや導電性プラスチックなど透明導電体が最も良い。中でも耐熱性の酸化スズ系導電性ガラスが良い。透明導電体が良い理由は、基板側から光照射できるため、電子の移動距離が短くなり、電荷再結合が抑制できるからである。しかし、半導体膜厚が薄ければ金属や炭素板など非透明基板でも良い。   The semiconductor is usually formed on a substrate. In this case, a transparent conductor such as conductive glass or conductive plastic is the best as the semiconductor electrode substrate. Of these, heat-resistant tin oxide conductive glass is preferable. The reason why the transparent conductor is good is that the light can be irradiated from the substrate side, so that the electron moving distance is shortened and charge recombination can be suppressed. However, if the semiconductor film thickness is thin, a non-transparent substrate such as a metal or carbon plate may be used.

半導体膜厚は、光が充分吸収できる膜厚があれば充分であり、それ以上厚くするとクラックを生じたり、溶液輸送や生成物輸送が妨げられるという問題が起こり、性能低下につながる。半導体膜厚は、50マイクロメートル(μm)以下、好ましくは20μm以下、より好ましくは0.1〜5マイクロメートル(μm)が良い。
また多孔質構造の半導体を構成する半導体粒子において、該粒子が球形状や粉末状の場合、その平均粒子半径は3〜50nm、好ましくは10〜300nmである。一方、該粒子が柱状の場合、該柱の平均半径が3〜500nm、好ましくは10〜300nmであり、縦穴が空いた中空体状の場合、該中空体壁の平均厚さが3〜1000nm、好ましくは10〜600nmである。
The semiconductor film thickness is sufficient if it has a film thickness that can absorb light sufficiently. If it is thicker than that, problems such as cracks occur, and solution transportation and product transportation are hindered, leading to performance degradation. The semiconductor film thickness is 50 micrometers (μm) or less, preferably 20 μm or less, and more preferably 0.1 to 5 micrometers (μm).
Moreover, in the semiconductor particle which comprises the semiconductor of a porous structure, when this particle | grain is spherical shape or powder form, the average particle radius is 3-50 nm, Preferably it is 10-300 nm. On the other hand, when the particles are columnar, the average radius of the columns is 3 to 500 nm, preferably 10 to 300 nm. In the case of a hollow body with a vertical hole, the average thickness of the hollow body wall is 3 to 1000 nm. Preferably it is 10-600 nm.

半導体膜の調製法としては、ゾルゲル法や錯体重合法など金属前駆体を溶媒に分散して、塗布後に熱分解(焼成)する方法や、予め半導体の微粒子を固相法などで調製しておき、ペースト状にして塗布後に熱分解(焼成)する方法などがある。融点が低ければ固相法でも良い。塗布方法は、スクリーン印刷やドクターブレード法、スピンコート法、スプレー法、ディップコート法などが利用できる。
焼成温度は、基本的には上記で混合した有機物が分解する温度でなくてはいけない。しかし基板の耐熱性もあるため、酸化スズ系導電性ガラスでは、耐熱温度(約600度)以下が望ましい。有機物の分解を促進するために酸素中で焼成することも有効である。
As a method for preparing a semiconductor film, a metal precursor such as a sol-gel method or a complex polymerization method is dispersed in a solvent and thermally decomposed (baked) after coating, or semiconductor fine particles are prepared in advance by a solid phase method or the like. There is a method of making a paste and thermally decomposing (baking) after application. If the melting point is low, a solid phase method may be used. As a coating method, screen printing, a doctor blade method, a spin coating method, a spray method, a dip coating method, or the like can be used.
The firing temperature must basically be a temperature at which the organic matter mixed above is decomposed. However, since the substrate has heat resistance, it is desirable that the heat resistance temperature (about 600 ° C.) or less be used for the tin oxide based conductive glass. It is also effective to fire in oxygen in order to accelerate the decomposition of organic matter.

窒素やイオウ、さらには炭素を含む含酸素化合物半導体は、酸化物膜を後からアンモニアや硫化水素などで処理しても合成できる。または前駆体酸化物と含窒素化合物、または含イオウ化合物を混合して焼成しても良い。NやSの量は最低でも酸化物半導体中の酸素1原子に対して、0.5原子%以上、好ましくは10原子%以上が望ましい。その上限値は、通常80原子%である。   An oxygen-containing compound semiconductor containing nitrogen, sulfur, or carbon can be synthesized by treating the oxide film with ammonia or hydrogen sulfide later. Alternatively, the precursor oxide and the nitrogen-containing compound or sulfur-containing compound may be mixed and fired. The amount of N or S is at least 0.5 atomic%, preferably 10 atomic% or more with respect to 1 atom of oxygen in the oxide semiconductor. The upper limit is usually 80 atomic%.

調製した多孔質半導体膜は、後処理により性能を向上させることができる。Ti系半導体の場合は、TiClなどTiを含む溶液に浸したり、NbやTa系では、アルコキシドや塩化物などの溶液、Bi系ではビスマスイオンを含む溶液に浸し、最後に熱処理することで、格子欠陥や粒子間のネッキングが改善される。
当該電極は、上述した各種可視光応答性半導体だけでなく、それ以外の導電性材料と混合しても良い。この場合の導電性材料としては、SnO、TiO、WO、In−SnOなど、伝導帯が電子を流しやすい無機材料や、導電性ポリマーなど有機材料でも良い
The prepared porous semiconductor film can improve performance by post-treatment. In the case of a Ti-based semiconductor, it is immersed in a solution containing Ti such as TiCl 4 , in an Nb or Ta-based solution such as an alkoxide or chloride, in a Bi-based solution in a solution containing bismuth ions, and finally heat treated, Lattice defects and necking between particles are improved.
The electrode may be mixed with not only the various visible light responsive semiconductors described above but also other conductive materials. In this case, the conductive material may be an inorganic material such as SnO 2 , TiO 2 , WO 3 , In 2 O 3 —SnO 2 or the like, and an organic material such as a conductive polymer.

上述した半導体膜は単独の半導体でも異なる半導体層を積層することもできる。積層する場合は、電荷が移動できるようにバンドポテンシャルを考慮する必要がある。   The semiconductor film described above can be a single semiconductor or a stack of different semiconductor layers. In the case of stacking, it is necessary to consider the band potential so that charges can move.

このように調製した半導体電極に導線を取り付ける。抵抗を下げるために櫛形電極など集電電極をつけることが望ましい。接触抵抗を下げるにはインジウムハンダが有効である。   A conducting wire is attached to the semiconductor electrode thus prepared. In order to lower the resistance, it is desirable to attach a current collecting electrode such as a comb electrode. Indium solder is effective for reducing the contact resistance.

本発明の光電気化学セルは、前記した可視光応答性の半導体電極と対極を組合せた構造のものであり、エネルギー蓄積型反応を有利に実施させることができる。
この場合のエネルギー蓄積型化学反応とは、反応の自由エネルギー変化(ΔG)が正である反応を示す。その基本反応は水の分解反応である。本セルはそれ以外にも例えば、HIやHBrの分解反応、ヨウ素レドックス反応にも用いることができる。
本発明の半導体光電極は、ハロゲン等のレドックス反応と組み合わせて太陽電池用電極にも用いることができる。
該光電気化学セルに存在させる電解液組成については、水の分解の場合は、硫酸ナトリウムや硫酸、過塩素酸塩、水酸化ナトリウムなど安定な支持電解質を用いる。基本的には0.1mol/l以上で、飽和溶液に近くても良い。pH条件は半導体電極が安定な領域で使用する。HIやHBrの分解反応ではこれらの支持電解液にHIやHBrを溶解させる。この時、水溶媒ではなく有機溶媒でも良い。
本発明の電極は、有機物、バイオマスなど酸化されやすい物質を含んだ廃液からの水素製造にも用いることができる。この場合、有機物等は半導体上の正孔で酸化され、水素製造の効率の向上ができる。また、本発明の半導体電極がp型特性を示す場合は、半導体電極上で水素発生などの還元反応を行い、対極で酸化反応を行うこともできる。
The photoelectrochemical cell of the present invention has a structure in which the above-mentioned visible light-responsive semiconductor electrode and a counter electrode are combined, and can advantageously carry out an energy storage type reaction.
The energy storage type chemical reaction in this case indicates a reaction in which the free energy change (ΔG) of the reaction is positive. The basic reaction is a water decomposition reaction. In addition to this, this cell can also be used, for example, for the decomposition reaction of HI and HBr and the iodine redox reaction.
The semiconductor photoelectrode of the present invention can also be used for a solar cell electrode in combination with a redox reaction such as halogen.
As for the composition of the electrolytic solution present in the photoelectrochemical cell, a stable supporting electrolyte such as sodium sulfate, sulfuric acid, perchlorate, or sodium hydroxide is used in the case of water decomposition. Basically, it may be close to a saturated solution at 0.1 mol / l or more. The pH condition is used in a region where the semiconductor electrode is stable. In the decomposition reaction of HI and HBr, HI and HBr are dissolved in these supporting electrolytes. At this time, an organic solvent may be used instead of an aqueous solvent.
The electrode of the present invention can also be used for hydrogen production from waste liquid containing substances that are easily oxidized such as organic matter and biomass. In this case, organic substances and the like are oxidized by holes on the semiconductor, and the efficiency of hydrogen production can be improved. In addition, when the semiconductor electrode of the present invention exhibits p-type characteristics, a reduction reaction such as hydrogen generation can be performed on the semiconductor electrode and an oxidation reaction can be performed on the counter electrode.

対極は反応に合わせた適切な材料を用いる。水素発生であれば水素発生過電圧の低いPtやカーボンなどが有効であるが、安価なCo−Mo電極を利用することもできる。   As the counter electrode, an appropriate material suitable for the reaction is used. For hydrogen generation, Pt or carbon having a low hydrogen generation overvoltage is effective, but an inexpensive Co—Mo electrode can also be used.

バイアス電位はポテンシオスタットやソースメータなどで制御する。光照射は最終的には太陽光であるが、電極の性能チェックや特殊な化学反応を起こしたい場合は、キセノンランプなどの人工光源を用いる。
また、バイアスを電源でかける代わりに、太陽電池を接続したり、対極に別の半導体電極を使うことでバイアスをかけることもできる。
The bias potential is controlled by a potentiostat or a source meter. The light irradiation is finally sunlight, but an artificial light source such as a xenon lamp is used when it is desired to check the performance of the electrode or to perform a special chemical reaction.
Further, instead of applying a bias by a power source, a bias can be applied by connecting a solar cell or using another semiconductor electrode as a counter electrode.

次に本発明を実施例により詳述する。   Next, the present invention will be described in detail by examples.

実施例1
(1)BiVO電極の調製法
ビスマス2エチルヘキサノエート(Bi(hex)))とバナジウムオキシアセチルアセトネート(VO(acac))を化学量論比1:1でアセチルアセトンに溶解混合した。1時間攪拌後、エバポレーターで濃縮し、ポリエチレングリコールを50vol%添加した。得られた溶液を導電性ガラス(F−SnO、10オーム/sq)にドクターブレード法で塗布し、500度で1時間空気焼成した。これを3回繰り返した。膜厚は約0.3マイクロメートルであった。SEM観察により、大きな細孔としては100−200nmの孔を持つ膜であることが分かった。XRDによりmonoclinicのBiVOができていることを確かめた。
Example 1
(1) Preparation method of BiVO 4 electrode Bismuth 2-ethylhexanoate (Bi (hex) 3 )) and vanadium oxyacetylacetonate (VO (acac) 2 ) were dissolved and mixed in acetylacetone at a stoichiometric ratio of 1: 1. . After stirring for 1 hour, the mixture was concentrated with an evaporator, and 50 vol% of polyethylene glycol was added. The obtained solution was applied to conductive glass (F-SnO 2 , 10 ohm / sq) by a doctor blade method, and air baked at 500 degrees for 1 hour. This was repeated three times. The film thickness was about 0.3 micrometers. By SEM observation, it was found that the large pores were films having pores of 100 to 200 nm. XRD confirmed that monoclinic BiVO 4 was made.

(2)電極の評価
この電極をポテンシオスタットに接続した。参照電極はAg/AgCl、対極はPtを用いた。0.1mol/lのNaSO水溶液で水の分解反応を行った。バイアス電圧を変えながら、各種波長の単色光を照射した。バンドギャップは約2.4eVであり、開放電圧は+0.2V(vs.Ag/AgCl)であった。WOのバンドギャップ(約2.7eV)及び開放電圧(+0.25V)と比較すると、伝導帯準位がWOよりもBiVOの方が負であり、BiVOが好ましいことが分かる。Biの6s軌道が価電子帯上部を構成していることがその優位性の理由と思われる。400nmにおいて、開放電圧に対し0.6V時で、量子収率(QE)は33%、0.8V時でQEは64%であり、非常に高い効率であった。太陽エネルギー変換効率は約0.36%であり、水の分解ができない光触媒システムより有効であることが分かる。
(2) Evaluation of electrode This electrode was connected to a potentiostat. Ag / AgCl was used for the reference electrode, and Pt was used for the counter electrode. Water decomposition reaction was carried out with 0.1 mol / l Na 2 SO 4 aqueous solution. Monochromatic light of various wavelengths was irradiated while changing the bias voltage. The band gap was about 2.4 eV, and the open circuit voltage was +0.2 V (vs. Ag / AgCl). Compared to the band gap of the WO 3 (about 2.7 eV) and open circuit voltage (+ 0.25 V), the conduction band level is negative is more of BiVO 4 than WO 3, it can be seen that BiVO 4 is preferred. The reason why the 6s orbital of Bi constitutes the upper part of the valence band seems to be the reason for the superiority. At 400 nm, the quantum yield (QE) was 33% at an open circuit voltage of 0.6 V, and the QE was 64% at 0.8 V, which was very high efficiency. It can be seen that the solar energy conversion efficiency is about 0.36%, which is more effective than a photocatalytic system that cannot decompose water.

実施例2
(1)AgNbO電極の調製
メタノールに溶解したAgNOとエタノールに溶解したNbエトキシドを化学量論比1:1で混合した。攪拌後、ポリエチレングリコールを50vol%添加した。得られた溶液を導電性ガラス(F−SnO、10オーム/sq)にドクターブレード法で塗布し、550度で1時間空気焼成した。これを5回繰り返した。膜厚は約0.2マイクロメートルであった。XRDによりAgNbOができていることを確かめた。
Example 2
(1) Preparation of AgNbO 3 electrode AgNO 3 dissolved in methanol and Nb ethoxide dissolved in ethanol were mixed at a stoichiometric ratio of 1: 1. After stirring, 50 vol% of polyethylene glycol was added. The obtained solution was applied to conductive glass (F-SnO 2 , 10 ohm / sq) by a doctor blade method and air baked at 550 ° C. for 1 hour. This was repeated 5 times. The film thickness was about 0.2 micrometers. It was confirmed by XRD that AgNbO 3 was formed.

(2)電極の評価
電極の評価法は実施例1と同様である。開放電圧は銀の酸化還元ピークに隠れて観測が難しかったが、0.2V以下であった。密度汎関数法(CASTEP)を用いたバンド計算では伝導帯はNbのd軌道を用いているため、伝導帯はWOやFeと比較して負にあると言える。測定の結果、400nmにおいて、開放電圧に対し0.5V時で、量子収率(QE)は1.4%であった。未ドープTiOでは吸収のない420nmにおいて、量子収率(QE)は0.4%であった。
(2) Electrode Evaluation The electrode evaluation method is the same as in Example 1. The open circuit voltage was difficult to observe because it was hidden behind the silver redox peak, but it was 0.2 V or less. In the band calculation using the density functional method (CASTEP), the conduction band uses the d orbit of Nb. Therefore, it can be said that the conduction band is negative compared to WO 3 and Fe 2 O 3 . As a result of the measurement, at 400 nm, the quantum yield (QE) was 1.4% at 0.5 V with respect to the open circuit voltage. At 420 nm with no absorption in undoped TiO 2 , the quantum yield (QE) was 0.4%.

実施例3
(1)CrとSbをドープしたTiO電極の調製
エタノール溶媒にチタンイソプロポキシドと硝酸クロム(Cr:2.3mol%)、塩化アンチモン(Sb:3.5mol%)を混合した。得られた溶液を導電性ガラス(F−SnO、10オーム/sq)にドクターブレード法で塗布し、500度で1時間空気焼成した。その後TiCl水溶液(0.2mol/l)に18時間浸して、500度で1時間空気焼成した。これを3回繰り返した。膜厚は約1マイクロメートルであった。
Example 3
(1) Preparation of TiO 2 electrode doped with Cr and Sb Titanium isopropoxide, chromium nitrate (Cr: 2.3 mol%), and antimony chloride (Sb: 3.5 mol%) were mixed in an ethanol solvent. The obtained solution was applied to conductive glass (F-SnO 2 , 10 ohm / sq) by a doctor blade method, and air baked at 500 degrees for 1 hour. Thereafter, it was immersed in an aqueous TiCl 4 solution (0.2 mol / l) for 18 hours, and air baked at 500 ° C. for 1 hour. This was repeated three times. The film thickness was about 1 micrometer.

(2)電極の評価
電極の評価法は実施例1と同様である。開放電圧は未ドープのTiOとほぼ同じ0V(vs.Ag/AgCl)であった。密度汎関数法(CASTEP)を用いたバンド計算では、価電子準位はCrのd軌道であり、伝導帯はTiのd軌道を用いているため、伝導帯はWOやFeと比較して負にあると言える。
未ドープTiOでは吸収のない420nmにおいて、開放電圧に対し0.6V時で、量子収率(QE)は1%であった。
(2) Electrode Evaluation The electrode evaluation method is the same as in Example 1. The open circuit voltage was 0 V (vs. Ag / AgCl) which was almost the same as that of undoped TiO 2 . In the band calculation using the density functional method (CASTEP), since the valence level is the d orbital of Cr and the conduction band is the d orbital of Ti, the conduction band is WO 3 or Fe 2 O 3 . It can be said that it is negative in comparison.
At 420 nm with no absorption in undoped TiO 2 , the quantum yield (QE) was 1% at 0.6 V with respect to the open circuit voltage.

実施例4
(1)BiWO電極の調製
硝酸水溶液に溶解した硝酸ビスマスとタングステン酸アンモニウムを化学量論比1:1で混合した。攪拌後、5日間静置しゾル化させた。得られたゾル溶液を超音波で分散後、導電性ガラス(F−SnO,10オーム/sq)にドクターブレード法で塗布し、550度で1時間空気焼成した。これを5回繰り返した。XRDにより主にBiWOができていることを確かめた。
Example 4
(1) Preparation of Bi 2 WO 6 electrode Bismuth nitrate dissolved in an aqueous nitric acid solution and ammonium tungstate were mixed at a stoichiometric ratio of 1: 1. After stirring, the mixture was allowed to stand for 5 days to form a sol. The obtained sol solution was dispersed with ultrasonic waves, and then applied to conductive glass (F-SnO 2 , 10 ohm / sq) by a doctor blade method, followed by air baking at 550 ° C. for 1 hour. This was repeated 5 times. It was confirmed that Bi 2 WO 6 was mainly made by XRD.

(2)電極の評価
電極の評価は実施例1と同様である。開放電圧は−0.12Vであり、今回の実施例の中で最も負であった。
400nmにおいて、開放電圧に対し0.9V時で、量子収率(QE)は1.8%であった。
(2) Evaluation of electrode The evaluation of the electrode is the same as in Example 1. The open circuit voltage was -0.12 V, which was the most negative in the present example.
At 400 nm, the quantum yield (QE) was 1.8% at 0.9 V with respect to the open circuit voltage.

(実施例5)
NドープTiO電極の調製法を示す。TiClにアンモニアを添加し、沈殿させ、これを450度で焼成した。色は黄色であり、吸収は470nmまで延びていた。これをアセチルアセトン、トリトンXと混ぜてペーストにし、導電性ガラスにドクターブレード法で塗布した。さらにTiCl処理を行った。440nmにおいては可視光応答性のないTiO(P−25、日本アエロジル)の場合、QE=0.2%以下であったが、同条件で本Nドープ電極では、0.3%以上を示した。400nmを基準とした相対量子収率では、440nmにおいて、本Nドープ電極は未ドープより6倍以上の高い性能を示すことが分かった。
(Example 5)
It shows the preparation of N-doped TiO 2 electrode. Ammonia was added to TiCl 3 to cause precipitation, which was calcined at 450 degrees. The color was yellow and the absorption extended to 470 nm. This was mixed with acetylacetone and Triton X to form a paste, and applied to conductive glass by the doctor blade method. Further, TiCl 4 treatment was performed. In the case of TiO 2 having no visible light response at 440 nm (P-25, Nippon Aerosil), QE was 0.2% or less, but the N-doped electrode showed 0.3% or more under the same conditions. It was. It was found that the relative quantum yield based on 400 nm shows that the N-doped electrode exhibits a performance 6 times or more higher than that of undoped at 440 nm.

従来の半導体光電極の説明図である。It is explanatory drawing of the conventional semiconductor photoelectrode. 多孔質半導体膜を用いた光電極による水素の製造原理説明図である。It is explanatory drawing of the manufacture principle of hydrogen by the photoelectrode using a porous semiconductor film. 多孔質半導体膜の1例についての説明構造図を示す。An explanatory structural view of an example of a porous semiconductor film is shown. 多孔質半導体膜の他の例についての説明断面図を示す。The explanatory sectional view about other examples of a porous semiconductor film is shown.

符号の説明Explanation of symbols

1 基板
2 半導体膜
3 正孔
4 空孔
5 空孔
6 粒子状半導体
DESCRIPTION OF SYMBOLS 1 Substrate 2 Semiconductor film 3 Hole 4 Hole 5 Hole 6 Particle semiconductor

Claims (10)

水の分解反応又はレドックス反応によるエネルギー蓄積型反応を行う光電気化学セルにおいて用いられる膜状半導体光電極であって、可視光応答性の多孔質構造の複合金属酸化物系半導体からなり、2種類以上の金属元素から構成され、その金属元素の少なくとも1つはビスマス、銀、銅、スズ、鉛、インジウム、プラセオジム及びニッケルの中から選ばれることを特徴とする膜状多孔質半導体光電極。 A film-like semiconductor photoelectrode used in a photoelectrochemical cell that performs an energy storage type reaction by water decomposition reaction or redox reaction, and is composed of a composite metal oxide semiconductor having a porous structure with visible light response. A film-like porous semiconductor photoelectrode comprising the above metal elements, wherein at least one of the metal elements is selected from bismuth, silver, copper, tin, lead, indium, praseodymium and nickel. 水の分解反応又はレドックス反応によるエネルギー蓄積型反応を行う光電気化学セルにおいて用いられる膜状半導体光電極であって、窒素及びイオウの中から選ばれる1つ以上の元素を含む可視光応答性の多孔質構造の含酸素化合物半導体からなることを特徴とする膜状多孔質半導体光電極。 A film-like semiconductor photoelectrode used in a photoelectrochemical cell that performs an energy storage type reaction by water decomposition reaction or redox reaction , and having visible light responsiveness containing one or more elements selected from nitrogen and sulfur A film-like porous semiconductor photoelectrode comprising an oxygen-containing compound semiconductor having a porous structure. ニッケル、鉄、銀、鉛、銅及びビスマスの中から選ばれる1つ以上の元素を20〜0.5mol%ドープし、且つアンチモン、ビスマス、ニオブ及びタンタルの中から選ばれる1つ以上の元素を共ドープした請求項1に記載の膜状多孔質半導体光電極。   One or more elements selected from nickel, iron, silver, lead, copper and bismuth are doped with 20 to 0.5 mol%, and one or more elements selected from antimony, bismuth, niobium and tantalum are added. The membranous porous semiconductor photoelectrode of claim 1 co-doped. 半導体内部に生成した正孔の50%以上の半導体表面への拡散距離が500nm以内である請求項1〜3のいずれかに記載の膜状多孔質半導体光電極。   The membranous porous semiconductor photoelectrode according to any one of claims 1 to 3, wherein a diffusion distance of 50% or more of holes generated in the semiconductor to the semiconductor surface is within 500 nm. ビスマスとバナジウムの両方を含む可視光応答性の多孔質構造の複合金属酸化物系半導体からなる請求項1に記載の膜状多孔質半導体光電極。   The film-like porous semiconductor photoelectrode according to claim 1, comprising a composite metal oxide based semiconductor having a porous structure with visible light response and containing both bismuth and vanadium. 光透過性基板上に形成されている請求項1〜5のいずれかに記載の膜状多孔質半導体光電極。 The membranous porous semiconductor photoelectrode according to any one of claims 1 to 5 , which is formed on a light-transmitting substrate. 該半導体の膜厚が50μm以下である請求項1〜6のいずれかに記載の膜状多孔質半導体光電極。   The film-like porous semiconductor photoelectrode according to any one of claims 1 to 6, wherein the thickness of the semiconductor is 50 µm or less. 請求項1〜7のいずれかに記載の膜状半導体光電極を用いることを特徴とする光電気化学セル。   A photoelectrochemical cell using the film-like semiconductor photoelectrode according to claim 1. 該エネルギー蓄積型反応が水の分解反応である請求項8に記載の光電気化学セル。   The photoelectrochemical cell according to claim 8, wherein the energy storage type reaction is a decomposition reaction of water. 請求項8に記載の光電気化学セルを用いて水を水素と酸素に分解することを特徴とする水の分解方法。 A method for decomposing water, comprising decomposing water into hydrogen and oxygen using the photoelectrochemical cell according to claim 8 .
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