JP4020050B2 - ケーブル接続部 - Google Patents
ケーブル接続部 Download PDFInfo
- Publication number
- JP4020050B2 JP4020050B2 JP2003324667A JP2003324667A JP4020050B2 JP 4020050 B2 JP4020050 B2 JP 4020050B2 JP 2003324667 A JP2003324667 A JP 2003324667A JP 2003324667 A JP2003324667 A JP 2003324667A JP 4020050 B2 JP4020050 B2 JP 4020050B2
- Authority
- JP
- Japan
- Prior art keywords
- cable
- electric circuit
- coaxial cable
- conductor
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004020 conductor Substances 0.000 claims description 31
- 238000003780 insertion Methods 0.000 claims description 11
- 230000037431 insertion Effects 0.000 claims description 11
- 239000011810 insulating material Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 description 35
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000002390 adhesive tape Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 238000009864 tensile test Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 3
- 230000002040 relaxant effect Effects 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Landscapes
- Multi-Conductor Connections (AREA)
- Cable Accessories (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Description
2 電気回路
3 同軸ケーブル(ケーブル)
8 導体
9 フィルム
10 緩和部材
Claims (1)
- 平面アンテナを構成する電気回路とケーブルとを接続したケーブル接続部において、前記電気回路は板状の導体とその導体を絶縁性材料で覆ってなるフィルムとで構成され、その電気回路には、前記フィルムの一部を導体の上面に対して垂直に起立して設けた起立部とその起立部に形成され前記ケーブルを挿通するケーブル挿通孔とからなる緩和部材が設けられたことを特徴とするケーブル接続部。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003324667A JP4020050B2 (ja) | 2003-09-17 | 2003-09-17 | ケーブル接続部 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003324667A JP4020050B2 (ja) | 2003-09-17 | 2003-09-17 | ケーブル接続部 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005093226A JP2005093226A (ja) | 2005-04-07 |
| JP4020050B2 true JP4020050B2 (ja) | 2007-12-12 |
Family
ID=34455356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003324667A Expired - Fee Related JP4020050B2 (ja) | 2003-09-17 | 2003-09-17 | ケーブル接続部 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4020050B2 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10608359B2 (en) | 2016-12-16 | 2020-03-31 | Samsung Electronics Co., Ltd. | Connection structure between flat cable and electronic circuit board |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5132505B2 (ja) * | 2008-09-25 | 2013-01-30 | 株式会社東芝 | 同軸ケーブル固定機構 |
| US9967511B2 (en) | 2013-11-12 | 2018-05-08 | Thomson Licensing | Through PCB hole cable lead dress conduit |
| BR112017022649B1 (pt) * | 2015-04-20 | 2022-09-06 | Interdigital Madison Patent Holdings, Sas | Dispositivo eletrônico, método de construção de um decodificador set-top box ou dispositivo de gateway tendo um invólucro e método de construção de uma submontagem para incorporar em uma pluralidade de decodificadores set-top box e dispositivos de gateway diferentes |
| JP2019138255A (ja) * | 2018-02-14 | 2019-08-22 | 日本電産サンキョー株式会社 | ポンプ装置 |
-
2003
- 2003-09-17 JP JP2003324667A patent/JP4020050B2/ja not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10608359B2 (en) | 2016-12-16 | 2020-03-31 | Samsung Electronics Co., Ltd. | Connection structure between flat cable and electronic circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005093226A (ja) | 2005-04-07 |
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