JP4083371B2 - Substrate processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate processing apparatus.
[0002]
[Prior art]
For example, in lithography technology in the manufacture of semiconductor devices, a resist solution is applied to the surface of a substrate such as a semiconductor wafer (hereinafter referred to as “wafer”) to form a resist film, and the pattern is exposed. A developing solution is supplied for development processing. In performing such a series of processing steps, a substrate processing apparatus has been conventionally used.
[0003]
The substrate processing apparatus includes a resist coating processing apparatus that applies a resist solution to a wafer and processes the wafer, a heat processing apparatus that heats the wafer after completion of the resist coating process and a wafer after exposure processing, Are individually provided with a cooling processing apparatus for performing cooling processing, a developing processing apparatus for supplying a developing solution to the wafer and developing the wafer, and transporting wafers between these processing apparatuses, and loading / unloading of wafers, This is done by the transport device.
[0004]
By the way, if the wafer after the heat treatment is not immediately cooled, the wafer may be excessively heat-treated, which may cause a processing failure due to so-called overbaking. Therefore, conventionally, in order to quickly remove the heat stored in the wafer after completion of the heat treatment, for example, by adjusting each tact between the heat treatment device and the transfer device, the transfer device before the heat treatment of the wafer is finished. However, the transfer device can immediately transfer the wafer after the heat processing to the cooling processing unit.
[0005]
[Problems to be solved by the invention]
However, for example, when unloading of the wafer that has been subjected to the cooling process from the cooling processing apparatus is delayed for some reason, the wafer after the heating process can be immediately loaded into the cooling processing apparatus. Disappear. As a result, the wafer after the heat treatment cannot be carried into the cooling processing apparatus but waits in the state as it is, and there is a possibility that a processing failure due to overbaking may occur.
[0006]
Accordingly, an object of the present invention is to provide a substrate processing apparatus capable of preventing a processing failure due to overbaking of a substrate after heat treatment, and to solve the above problems.
[0009]
[Means for Solving the Problems]
  To achieve the above objective,Claim1According to the above, a liquid processing apparatus for supplying a processing liquid to a substrate for processing, a cooling processing apparatus for cooling the substrate to a predetermined temperature, a heating processing apparatus for heating the substrate, and a substrate after the heating processing A pre-cooling device that cools the substrate before performing the cooling process in the cooling processing device, and a first transport device, a second transport device, and a third transport device that transport the substrate. The second transport device is configured to transport the substrate between the liquid processing device and the cooling processing device, and the third transport device is configured to transport the substrate between the apparatus and the pre-cooling device. There is provided a substrate processing apparatus configured to transfer a substrate between a pre-cooling apparatus and a cooling processing apparatus.
[0010]
  Claim1According to the substrate processing apparatus described in 1), the substrate processing apparatus is divided into a first transport apparatus that transports a substrate having a high temperature immediately after the end of the heat treatment and a second transport apparatus that transports the substrate cooled to a predetermined temperature by the cooling processing apparatus. Therefore, heat does not accumulate in the second transport device, and the subsequent predetermined liquid treatment can be suitably performed. This is particularly effective when the substrate is transferred to a temperature-sensitive resist coating apparatus. In addition, since a third transport device dedicated to transporting the substrate between the pre-cooling device and the cooling processing device is used, and these transport devices are properly used depending on the temperature condition of the substrate, the thermal effect on the substrate is further reduced. Can be prevented. And since the board | substrate conveyance is shared and performed by the 1st-3rd conveying apparatus, the burden at the time of a 1st conveying apparatus conveying a board | substrate can be eased.
[0013]
  Claim2According to the present invention, a liquid processing apparatus that supplies a processing liquid to a substrate and processes the substrate, a cooling processing apparatus that cools the substrate, a heating processing apparatus that heats the substrate, and a substrate after the heating processing are added to the cooling processing apparatus. A pre-cooling device that cools the substrate before the cooling process, and a first transport device, a second transport device, and a third transport device that transport the substrate, and sandwiching the first transport device, A pre-cooling device, a liquid processing device and a cooling processing device are arranged across the second transport device, and a pre-cooling device and a cooling processing device are arranged between the heat processing device and the liquid processing device. In addition, the first transfer device is configured to transfer the substrate between the heat treatment device and the pre-cooling device, and the second transfer device transfers the substrate between the liquid processing device and the cooling processing device. The third transport device is configured as a pre-cooling device and Characterized in that it is configured to transfer substrates between the retirement processing apparatus, a substrate processing apparatus is provided.
[0014]
  Claim2Since the pre-cooling device, the cooling processing device, and the first and second transfer devices are respectively arranged between the heat processing device and the liquid processing device, first, the substrate processing device described above is emitted from the heat processing device. It is possible to prevent heat from being transmitted to the liquid processing apparatus. The second transport device transports the substrate after being cooled by the cooling processing device, and does not transport the high-temperature substrate immediately after heating. Therefore, for example, when the processing in the liquid processing apparatus is sensitive to a temperature change such as a resist coating processing, it is possible to perform a suitable processing while suppressing the adverse effect of heat. Furthermore, a first transport device for transporting the substrate immediately after the heat treatment, a second transport device for transporting the substrate after completion of the cooling processing, and a third transport device for transporting the substrate between the pre-cooling device and the cooling processing device. Therefore, the burden on the first transfer device can be reduced.
[0017]
  Claim3The invention described in claim 11 or 2In the substrate processing apparatus described in (1), the pre-cooling device is stacked on top of the cooling processing device.
[0018]
  Claim3Since the pre-cooling device is stacked on top of the cooling processing device, the floor-occupying area of the device can be further reduced. Therefore, the arrangement space in the apparatus can be used more effectively.
[0019]
  Claim4The invention described in claim 1, 2 or 2Or 3In the substrate processing apparatus according to the item 1, the pre-cooling device is a flat plate having a support member capable of supporting the substrate.
[0020]
  Claim4According to the substrate processing apparatus described in (1), the substrate can be pre-cooled while being supported by the support member. Thus, by simplifying the structure of the pre-cooling device, for example, the number of pre-cooling devices that can be incorporated in a substrate processing device of a predetermined size can be increased, and the size of the entire substrate processing device can be increased. Can also be suppressed.
[0021]
  Such claims4In the invention of claim5As described above, the support member may have a plurality of support pins. As described above, since the support member has a plurality of support pins, the substrate can be supported by the support pins having a small contact area when the substrate is pre-cooled, so that the heat dissipation effect of the substrate is improved.
[0022]
  Such claims.4In the invention of claim6As described above, the support member may include a support having a support surface that supports the central portion of the substrate and the vicinity thereof. As described above, when the support member has a support body having a support surface that supports the central portion of the substrate and the vicinity thereof, the substrate is supported by a support body having a small contact area when the substrate is precooled. Can improve the heat dissipation effect of the board.
[0023]
  Claim7The invention described in claim 1, 2, 3, 4, 45 or 6In the substrate processing apparatus described in the item 1, the pre-cooling device has a heat dissipation mechanism for radiating heat of the substrate.
[0024]
  Claim7According to the substrate processing apparatus described in (1), since the substrate carried into the pre-cooling apparatus can be cooled by the heat dissipation mechanism, no other special cooling mechanism or the like is required. Here, specific examples of the heat dissipation mechanism include, for example, a circulation path through which a temperature adjustment fluid such as a heat dissipation fin, a heat dissipation fan, and temperature adjustment water flows.
[0025]
  In each of the above substrate processing apparatuses, the claim8As described above, the pre-cooling device may have a fan for blowing air toward the substrate.9As described above, a gas ejection portion that ejects a cooling gas toward the substrate may be provided. As described above, since the pre-cooling device has the fan or the gas jetting part, the substrate in the pre-cooling device can be actively cooled. Occurrence of processing defects can be prevented.
[0026]
  In particular, the claims10As described above, the cooling gas may contain an inert gas. Thus, by including an inert gas in the cooling gas, the substrate can be suitably cooled without adversely affecting the substrate by ejecting the cooling gas onto the substrate.
[0027]
  Claims 1 to 1 described above10In the substrate processing apparatus of claim11As described above, the pre-cooling device may have an exhaust mechanism for forcibly exhausting the inside of the pre-cooling device. Thus, by having an exhaust mechanism that exhausts the atmosphere in the pre-cooling device, the heat in the pre-cooling device can be released to the outside together with the atmosphere, so that the substrate can be cooled more efficiently.
[0028]
  Furthermore, the above-mentioned claims 1 to11The substrate processing apparatus of claim12The pre-cooling device can be stacked in multiple stages as inYoYes. As described above, since the pre-cooling apparatuses are stacked in a plurality of stages, a large number of substrates can be pre-cooled at a time. Even in a substrate processing apparatus that processes a large number of substrates in a short time, over-baking is also possible. Occurrence of processing defects can be prevented.
[0029]
  Such claims12In the invention of claim13As described above, a means for controlling the substrate to be carried in from the upper pre-cooling device among the pre-cooling devices stacked in a plurality of stages may be provided. By providing such a control means, for example, by controlling the first transport device and the second transport device and carrying the substrate from the upper pre-cooling device, for example, the pre-cooling device is positioned above the cooling processing device. In this case, the substrate heat can be prevented from adversely affecting the cooling processing apparatus below.
[0030]
  Such claims.12In the invention of claim14As described above, it may have a means for controlling the substrate to be carried in from the lower pre-cooling device among the pre-cooling devices stacked in a plurality of stages. Thus, by providing the control means, for example, by controlling the first transport device and the second transport device and carrying the substrate from the lower pre-cooling device, for example, the pre-cooling device is positioned above the cooling processing device. In this case, the distance for transporting the substrate from the pre-cooling device to the cooling processing device can be shortened.
[0031]
  In addition, such claims12In the invention of claim15As described above, the pre-cooling device stacked in the plurality of stages may be provided with a means for controlling the substrate to be loaded into the pre-cooling device at a position away from the pre-cooling device in which the substrate has already been loaded. . By providing such a control means, for example, by controlling the first transport device and the second transport device, the substrate is loaded into the pre-cooling device at a position away from the pre-cooling device where the substrate has already been loaded. It is possible to prevent the substrates carried into the pre-cooling apparatus from interfering with each other thermally and causing adverse thermal effects.
  Further, according to the present invention, there is provided a liquid processing apparatus that supplies a processing liquid to a substrate for processing, a cooling processing apparatus that cools the substrate to a predetermined temperature, and a heating processing apparatus that heats the substrate. And a pre-cooling device that cools the substrate before the substrate is cooled to a predetermined temperature. The pre-cooling device is stacked in a plurality of stages, and the upper stage of the pre-cooling devices stacked in the plurality of stages. There is provided a substrate processing apparatus having means for controlling the substrate to be carried in from the pre-cooling apparatus.
  In this case, instead of means for controlling the substrate to be loaded from the upper pre-cooling device among the pre-cooling devices stacked in the plurality of stages, the lower pre-cooling device among the pre-cooling devices stacked in the plurality of stages is used. A means for controlling the substrate to be loaded from the apparatus, or the substrate is loaded into the pre-cooling device at a position away from the pre-cooling device in which the substrates are already loaded among the pre-cooling devices stacked in a plurality of stages. You may make it comprise the means to control.
Further, according to the present invention, a liquid processing apparatus for supplying a processing liquid to a substrate for processing, a cooling processing apparatus for cooling the substrate to a predetermined temperature, a heating processing apparatus for heating the substrate, and a post-heating process A pre-cooling device for cooling the substrate before the substrate is cooled by the cooling processing device, and a first transport device and a second transport device for transporting the substrate. And the pre-cooling device are configured to transport the substrate, and the second transport device is configured to transport the substrate between the liquid processing device and the cooling processing device. At least one of the second transfer devices is configured to transfer the substrate between the pre-cooling device and the cooling processing device, and the pre-cooling devices are stacked in a plurality of stages, and the pre-cooling devices stacked in the plurality of stages are stacked. Upper part of the cooling device It is characterized in that it comprises means for controlling so as to carry the substrate from the pre-cooling deviceA substrate processing apparatus is provided.
  In this case, instead of means for controlling the substrate to be loaded from the upper pre-cooling device among the pre-cooling devices stacked in the plurality of stages, the lower pre-cooling device among the pre-cooling devices stacked in the plurality of stages is used. A means for controlling the substrate to be loaded from the apparatus, or the substrate is loaded into the pre-cooling device at a position away from the pre-cooling device in which the substrates are already loaded among the pre-cooling devices stacked in a plurality of stages. You may make it comprise the means to control.
  Furthermore, according to the present invention, a liquid processing apparatus that supplies a processing liquid to a substrate for processing, a cooling processing apparatus that cools the substrate to a predetermined temperature, a heating processing apparatus that heats the substrate, and a post-heating process A pre-cooling device that cools the substrate before the substrate is cooled by the cooling processing device, a first transport device that transports the substrate, and a second transport device, and is heated with the first transport device sandwiched between them. A processing device and a pre-cooling device are arranged, a liquid processing device and a cooling processing device are arranged across the second transport device, and the pre-cooling device, the cooling processing device, and the like are disposed between the heat processing device and the liquid processing device. The first transport device is configured to transport the substrate between the heat treatment device and the pre-cooling device, and the second transport device transports the substrate between the liquid processing device and the cooling processing device. In addition, the first transfer device or At least one of the second transfer devices is configured to transfer the substrate between the pre-cooling device and the cooling processing device, and the pre-cooling devices are stacked in a plurality of stages, and the pre-cooled devices stacked in the plurality of stages are stacked. It has a means to control so that a board | substrate may be carried in from the pre-cooling device of the upper stage among cooling devices, It is characterized by the above-mentioned., A substrate processing apparatus is provided.
  Also in this case, instead of the means for controlling the substrate to be loaded from the upper pre-cooling device among the pre-cooling devices stacked in the plurality of stages, the lower pre-cooling apparatus among the pre-cooling devices stacked in the plurality of stages is used. Means for controlling the substrate to be carried in from the cooling device, or the plurality of stages It is also possible to provide means for controlling the substrate to be loaded into the pre-cooling device at a position distant from the pre-cooling device in which the substrate has already been loaded among the pre-cooling devices stacked on the substrate.
[0038]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a substrate processing apparatus according to a preferred embodiment of the present invention will be described.
[0039]
As shown in FIG. 1, the substrate processing apparatus 1 includes, for example, a cassette station 2 for loading / unloading 25 wafers W from / to the substrate processing apparatus 1 in the cassette unit and loading / unloading wafers W into / from the cassette C. It has a configuration in which a processing station 3 in which various processing units that perform predetermined processing in a single wafer type are arranged and an interface unit 4 that delivers the wafer W to the exposure apparatus E that exposes the wafer W are integrally connected. Yes.
[0040]
In the cassette station 2, the cassette C can be placed at a predetermined position on the cassette mounting table 5 in a line in the X direction (vertical direction in FIG. 1) with the entrance / exit of the wafer W facing the processing station 3 side. The wafer transfer body 6 that can move in the cassette arrangement direction (X direction) and the wafer arrangement direction (Z direction; vertical direction) of the wafer W accommodated in the cassette C is movable along the transfer path 7. The wafer carrier 6 is also rotatable in the θ direction (rotating direction around the Z axis), and can selectively access the cassette C.
[0041]
As shown in FIGS. 1 and 2, various processing apparatuses that perform predetermined processing on the wafer W are arranged in the processing station 3. That is, on the front side of the processing station 3, there are a resist coating processing device 8 for applying a resist solution to the rotating wafer W and processing, and a developing processing device 9 for supplying the developer to the rotating wafer W for processing. Are arranged in three rows in a stacked state in two stages. On the cassette station 2 side, a chemical box 10 capable of storing a resist solution supply tank and other devices is provided.
[0042]
On the back side of the processing station 3, an adhesion device that improves the adhesion between the wafer W and the resist film, a pre-baking device that heats the wafer W after the resist coating process, and a heat treatment that is performed on the wafer W after the exposure process. Various heat treatment apparatuses 11 for heat-treating the wafer W, such as a post-exposure baking apparatus and a post-baking apparatus for heat-treating the developed wafer W, are arranged in four rows in a stacked state in eight stages.
[0043]
Then, between the resist coating processing device 8 and the development processing device 9 and the heat processing device 11, the first transfer device 12 and the second transfer device 13 for transferring the wafer W, and the wafer W is cooled to a predetermined temperature. The cooling processing device 14, a pre-cooling device 15 that cools the wafer W before the cooling processing in the cooling processing device 14, and a third transfer device 17 that transfers the wafer W between the cooling processing device 14 and the pre-cooling device 15. And mounting tables 33, 34, 35, and 36 on which the wafer W can be mounted.
[0044]
The first transport device 12 and the second transport device 13 have basically the same configuration, and the configuration of the first transport device 12 will be described. As shown in FIG. Tweezers 19 and 20 capable of holding a wafer W are provided on a table 18 at the top and bottom, and the tweezers 19 and 20 are independently moved back and forth by an appropriate motor (not shown) built in the transfer base 18. It is free. The transport base 18 is provided on a lift shaft 21 that can be raised and lowered, and the lift shaft 21 itself is provided on a movable base 23 that is movable along the transport rail 22. The second transport device 13 also includes tweezers 29 and 30 on the transport base 28 and is movable along a transport rail 32 disposed in parallel with the transport rail 22.
[0045]
In addition, on the end of the transfer rails 22 and 32 on the cassette station 2 side, mounting tables 33 and 34 on which the wafer W can be mounted are respectively provided. The first transfer device 12 transfers the wafers via the mounting table 33. The body 6 can be exchanged with the wafer W, and the second transfer device 13 can exchange the wafer transfer body 6 with the wafer W via the mounting table 34.
[0046]
The cooling processing apparatuses 14 are stacked in four stages. The cooling processing apparatus 14 is configured to perform a process of cooling the wafer W carried into the casing 14a to a predetermined temperature. Therefore, the cooling processing apparatus 14 includes a cooling plate on which a wafer P is placed, in which a Peltier element, a cooling pipe to which cooling water is supplied, and the like are embedded in the casing 14a. It can be distinguished from the pre-cooling device 15 in that it has such a member. The pre-cooling device 15 is stacked on the uppermost cooling processing device 14 in eight stages. As shown in FIG. 2, the pre-cooling device 15 includes a flat plate 15a made of a material having a good thermal conductivity, for example, aluminum, and a support member 3 for indicating a wafer W provided on the flat plate 15a. The support pins 15b of the book and the heat dissipating fins 15c as heat dissipating mechanisms provided on the lower surface of the flat plate 15a. The cooling processing device 14 and the pre-cooling device 15 stacked in a multi-stage form a cooling processing device group 16, and a total of three cooling processing device groups 16 are arranged in the length direction of the transport rails 22 and 32. Are arranged along. The heat treatment device 11 and the cooling processing device group 16 are arranged to face each other with the first transport device 12 interposed therebetween, and the resist coating processing device 8 and the development processing device 9 are cooled with the second transport device 13 in between. The processing device group 16 is disposed to face the processing device group 16.
[0047]
A third transfer device 17 is arranged between the adjacent cooling processing device group 16 and the cooling processing device group 16. The third transfer device 17 is formed so that it can be moved up and down and expanded and contracted while the wafer W is held on the tweezers 17 a, and the wafer W is transferred between the cooling processing device 14 and the pre-cooling device 15. It can be transported.
[0048]
Further, in the vicinity of the cooling processing unit group 16 and the interface unit 4 which are located closest to the interface unit 4, mounting tables 35 and 36 having basically the same configuration as the mounting tables 33 and 34 are provided for the transport rails 22 and 32. They are arranged side by side along the length direction. Further, these mounting tables 35 and 36 may have a stacked structure of upper and lower stages. The first transfer device 12 can transfer the wafer W to the heat treatment device 11, the pre-cooling device 15, and the mounting tables 35 and 36, and the second transfer device 13 is a resist coating apparatus. 8. The wafer W can be transferred to the development processing device 9, the cooling processing device 14, and the mounting tables 35 and 36.
[0049]
The interface unit 4 is provided with a wafer transfer body 41 that can freely move in the X direction, move in the Z direction, and rotate in the θ direction along the transfer rail 40. The wafer transfer body 41 includes an exposure apparatus E, The wafer W can be transferred to the mounting table 36 and the peripheral exposure device 42.
[0050]
The substrate processing apparatus 1 according to the embodiment of the present invention is configured as described above. Next, the function and effect thereof will be described.
[0051]
When a cassette C storing unprocessed wafers W is placed on the cassette mounting table 5, the wafer carrier 6 extracts one wafer W from the cassette C, and the extracted wafer W is first loaded on the mounting table 33. Placed on. Next, the wafer W is sequentially transferred to the alignment device and the adhesion device by the first transfer device 12 and subjected to predetermined processing. In this case, the alignment apparatus may also be used as the mounting table 33. In addition, since the adhesion apparatus usually involves heat treatment, a part of the many heat treatment apparatuses 11 may have an adhesion treatment function.
[0052]
Next, the wafer W is transferred to the pre-cooling device 15 while being held by the tweezers 19 of the first transfer device 12. Thereafter, the wafer W is carried into the pre-cooling device 15 and naturally cooled while being supported by the support pins 15a as shown by the solid line in FIG. By such pre-cooling, the wafer W is cooled to a temperature at which overbaking does not occur. Thereafter, the pre-cooled wafer W is transferred to the cooling processing unit 14 by the third transfer unit 17 and is cooled until reaching a predetermined temperature.
[0053]
The wafer W cooled to a predetermined temperature is transferred to the resist coating processing apparatus 8 by the second transfer device 13, and a predetermined resist coating process is performed. Thereafter, the wafer W coated with the resist is transferred to the mounting table 35 by the second transfer device 13. Then, the first transfer device 12 is transferred from the mounting table 35 to the heat treatment device 11 and prebaked. After that, the wafer W is again subjected to a predetermined cooling process by the pre-cooling device 15 and the cooling processing device 14, and then transferred to the mounting table 36. Next, the wafer W is transferred to the wafer transfer body 41, After passing through the peripheral exposure device 42, it is transported to the exposure device E and subjected to pattern exposure processing.
[0054]
The wafer W subjected to the exposure process in the exposure apparatus E is transferred to the mounting table 36, and then transferred to the heat processing apparatus 11 by the first transfer apparatus 12, and subjected to a post-exposure baking process. Next, the wafer W is transferred to the pre-cooling device 15 by the first transfer device 12 and pre-cooled, and then transferred to the cooling processing device 14 by the third transfer device 17. The wafer W cooled to a predetermined temperature by the cooling processing device 14 is transferred to the development processing device 9 by the second transfer device 13 and developed, and then transferred to the mounting table 35. And it is again conveyed by the 1st conveying apparatus 12 to the heat processing apparatus 11, and is attached | subjected to a post-baking process.
[0055]
The wafer W after the post-baking process is transferred to the pre-cooling device 15 by the first transfer device 12, and then transferred to the cooling processing device 14 by the third transfer device 17 and cooled to a predetermined temperature. The wafer W after being cooled to a predetermined temperature is transferred to the mounting table 34 by the second transfer device 13. Then, after being transferred from the mounting table 34 to the cassette C by the wafer transfer body 6, it is stored in the cassette C. Thus, a series of processing of the wafer W is completed.
[0056]
As described above, in the substrate processing apparatus 1 according to the embodiment of the present invention, processing involving heating, such as adhesion processing, post-exposure baking processing, and post-baking processing, and heat processing are performed in the heat processing apparatus 11. The wafer W just after is first transferred to the pre-cooling device 15 by the first transfer device 12 and pre-cooled. And after that, it is conveyed by the 3rd conveying apparatus 17 to the cooling processing apparatus 14, and is cooled to predetermined temperature. For this reason, the wafer W immediately after the end of the heat treatment can be quickly cooled to at least a temperature at which overbaking does not occur, and processing failure due to overbaking can be prevented. Further, since the pre-cooling device 15 is provided with the radiation fins 15c, the cooling efficiency of the wafer W is improved and the structure is simple.
[0057]
Then, the wafer W after being cooled to a predetermined temperature as described above is transferred to a liquid processing apparatus such as the resist coating processing apparatus 8 and the development processing apparatus 9 by the second transfer apparatus 13. Therefore, the second transfer device 13 transfers only the wafer W after being cooled to a predetermined temperature, and does not transfer the high-temperature wafer W immediately after heating. Therefore, a resist coating process sensitive to temperature can be suitably performed.
[0058]
In addition, since the first transfer device 12, the second transfer device 13, and the third transfer device 17 each share the transfer of the wafer W, the load of the wafer transfer of the first transfer device 12 is reduced. As a result, it becomes possible to prevent a delay in the transfer of the wafer W immediately after the end of the heat treatment by the first transfer device 12, and thus it is possible to more reliably prevent the processing failure of the wafer W due to overbaking. .
[0059]
In addition, since the cooling processing device 14 and the pre-cooling device 15 are arranged between the resist coating processing device 8 and the development processing device 9 and the heat processing device 11, the heat from the heat processing device 11 is applied to the resist coating processing device 8. And transmission to the development processing apparatus 9 can be prevented. As a result, predetermined liquid processing such as resist coating processing sensitive to temperature can be suitably performed.
[0060]
In addition, since the pre-cooling device 15 is stacked in eight stages on the upper part of the cooling processing apparatus 14 stacked in four stages, the occupied floor area is reduced. Further, since the pre-cooling device 15 itself is basically composed of the flat plate 15a, the number of units incorporated in the substrate processing apparatus 1 can be increased.
[0061]
Further, in the above embodiment, the transfer of the wafer W between the pre-cooling device 15 and the cooling processing device 14 is performed by the dedicated third transfer device 17, but this third transfer device 17 is not added. The first transfer device 12 itself may be configured to transfer between the pre-cooling device 15 and the cooling processing device 14. In this way, the overall structure of the substrate processing apparatus 1 can be simplified. In addition, it is possible to effectively use the arrangement space.
[0062]
In the above-described embodiment, an example in which the pre-cooling device 15 is stacked on the upper portion of the cooling processing device 14 has been described. However, in the present invention, the cooling processing device 14 and the pre-cooling device 15 can be arranged side by side. It is.
[0063]
Further, the heat dissipating mechanism provided in the pre-cooling device 15 is not limited to the heat dissipating fins 15b, and may be a cooling fan 45 as shown in FIG. In this way, the wafer W can be cooled by the air blown from the cooling fan 45, and the occurrence of processing defects due to overbaking can be similarly prevented. Further, the cooling effect can be further improved by combining the radiation fins 15b and the cooling fan 45.
[0064]
Further, instead of the cooling fan 45, as shown in FIG. 6, the pre-cooling device 15 may be provided with a gas ejection portion 61 for ejecting an inert gas, for example, nitrogen gas, toward the wafer W. Thereby, similarly, the wafer W can be efficiently cooled.
[0065]
In the above-described embodiment, the pre-cooling device 15 has a flat plate provided with three support pins as support members for supporting the wafer W. However, as shown in FIG. The apparatus 71 may have a support 73 on the flat plate 74 having a support surface 72 that supports the central portion of the wafer W and the vicinity thereof. Thereby, the heat dissipation effect using the support body 73 can be expected.
[0066]
As shown in FIG. 4, the pre-cooling devices 15 are stacked in multiple stages. However, as shown in FIG. 8, the pre-cooling devices 15 are stacked in a plurality of stages under the control of the control unit 81. The first transfer device 12 may be controlled so as to carry in the wafers W in order from the upper pre-cooling device 15. Thereby, the thermal adverse effect with respect to the cooling processing apparatus 14 can be made small.
[0067]
Further, as shown in FIG. 9, under the control of the control unit 81, the first transfer is performed so that the wafers W are sequentially loaded from the lower pre-cooling device 15 among the pre-cooling devices 15 stacked in a plurality of stages. The device 12 may be controlled. Thereby, the distance which conveys the wafer W from the pre-cooling apparatus 15 to the cooling processing apparatus 14 can be made smaller.
[0068]
Further, as shown in FIG. 10, under the control of the control unit 81, the pre-cooling at a position away from the pre-cooling device 15 in which the wafer W has already been carried out among the pre-cooling devices 15 stacked in a plurality of stages. The first transfer device 12 may be controlled so as to carry the wafer W into the device 15. Thereby, the thermal adverse effect between the pre-cooling devices 15 can be reduced.
[0069]
As shown in FIG. 11, when the air supply part 112 which supplies the clean air of a downflow is provided on the area | region 111 where the pre-cooling apparatus 15 and the cooling processing apparatus 14 are arrange | positioned, the outer periphery of each pre-cooling apparatus 15 An introduction member 113 for introducing clean air into each pre-cooling device 15 may be provided in the section. In this case, as shown in FIG. 11, it is more preferable that the introduction member 113 of the lower pre-cooling device 15 protrudes from the introduction member 113 of the upper pre-cooling device 15 as viewed from above, that is, from above. . Thereby, in each pre-cooling device 15, it becomes possible to cool the wafer W more efficiently. Further, a temperature sensor 114 for detecting the temperature in the region 111 is provided in the region 111, and the control unit 115 determines the supply amount of clean air supplied from the air supply unit 112 based on the detection result of the temperature sensor 114. You may comprise so that it may control. For example, efficient temperature control can be achieved by controlling the air supply amount to increase as the temperature in the region 111 rises.
[0070]
As shown in FIG. 12, an exhaust port 121 for exhausting the gas in each pre-cooling device 15 is provided behind each pre-cooling device 15, and the inside of each pre-cooling device 15 is exhausted by an exhaust device 124 through an exhaust passage 123. If the pre-cooling device 15 is configured to exhaust the air, it is possible to perform more efficient cooling.
[0071]
In the embodiment shown in FIG. 1, the first transfer device 12 and the second transfer device 13 can move in the Y direction, but as shown in FIG. 13, the vertical transfer type transfer that does not move in the XY direction. The devices 131 and 132 may be used in place of the first transfer device 12, and similar vertical transfer type transfer devices 133 and 134 may be used in place of the second transfer device 13. That is, these vertical transfer type transfer devices 131, 132, 133, and 134 are configured as transfer devices that can be moved up and down in the vertical direction and can be rotated in the θ direction, and the arm can be moved forward and backward with respect to each device. , Such conveying devices 131 to 134 may be used.
[0072]
In the above-described embodiment, the example in which the wafer W is used as the substrate has been described. However, the present invention can also be applied to a case where another substrate such as an LCD substrate or a CD substrate is used.
[0073]
【The invention's effect】
  Claims 1 to24According to the above, since the substrate is pre-cooled by the pre-cooling device before the substrate immediately after the heat treatment is cooled to the predetermined temperature by the cooling processing device, the processing failure of the substrate due to overbaking can be prevented.
[0074]
  Claim1-24Since the burden on the first transfer device can be reduced, it is possible to prevent a delay in the transfer of the substrate immediately after the heat treatment. As a result, it is possible to more reliably prevent substrate processing defects due to overbaking. Further, since the second transport device transports the substrate having a predetermined temperature or lower, the liquid processing can be suitably performed.
[0076]
  Claim2Since the heat treatment device and the liquid treatment device are arranged with the pre-cooling device and the cooling treatment device arranged close to each other, the heat from the heat treatment device is not transmitted to the liquid treatment device, and the liquid treatment Can be more suitably implemented.
[0077]
  Claim3According to this, the floor area occupied by the apparatus can be reduced, and the limited arrangement space in the substrate processing apparatus can be used effectively.
[0078]
  Claim4Therefore, it is possible to simplify the structure of the pre-cooling device and reduce the size of the entire substrate processing apparatus.
[0079]
  Claim7According to this, the cooling efficiency when pre-cooling the substrate is further improved, and processing defects due to overbaking can be prevented more reliably.
[0080]
  Claim12Since a large number of substrates can be pre-cooled at a time, the throughput can be improved accordingly.
[Brief description of the drawings]
FIG. 1 is a schematic plan view of a substrate processing apparatus according to an embodiment of the present invention.
2 is a perspective view showing a processing station of the substrate processing apparatus of FIG. 1. FIG.
FIG. 3 is a perspective view of a first transfer device provided in the processing station of FIG. 2;
FIG. 4 is an explanatory diagram showing pre-cooling devices stacked on the first cooling processing device group.
FIG. 5 is a perspective view showing a pre-cooling device equipped with a cooling fan.
FIG. 6 is a perspective view showing a pre-cooling device equipped with a nitrogen gas blow.
FIG. 7 is a diagram showing another configuration example of the pre-cooling device.
FIG. 8 is a diagram for explaining carry-in control to the pre-cooling device.
FIG. 9 is a view for explaining another carry-in control to the pre-cooling device.
FIG. 10 is a view for explaining still another carry-in control to the pre-cooling device.
FIG. 11 is a diagram showing still another configuration example of the pre-cooling device.
FIG. 12 is a diagram showing another configuration example of the pre-cooling device.
FIG. 13 is a plan view showing another configuration example of the substrate processing apparatus according to the present invention.
[Explanation of symbols]
1 Substrate processing equipment
12 First transfer device
13 Second transport device
14 Cooling processing equipment
15 Pre-cooling device
15b Heat radiation fin
16 Cooling treatment device group
17 Third transfer device
45 Cooling fan
C cassette
W wafer

Claims (24)

A liquid processing apparatus that supplies a processing liquid to a substrate and processes the substrate, a cooling processing apparatus that cools the substrate to a predetermined temperature, a heating processing apparatus that heat-processes the substrate, and a substrate that has been subjected to the heat processing to the cooling processing apparatus. A pre-cooling device that cools the substrate before the cooling process, and a first transport device, a second transport device, and a third transport device that transport the substrate,
The first transport device is configured to transport the substrate between the heat treatment device and the pre-cooling device,
The second transport device is configured to transport the substrate between the liquid processing device and the cooling processing device,
3. The substrate processing apparatus, wherein the third transfer device is configured to transfer a substrate between the pre-cooling device and the cooling processing device. A liquid processing apparatus that supplies a processing liquid to a substrate and processes the substrate, a cooling processing apparatus that cools the substrate, a heating processing apparatus that heats the substrate, and a cooling processing apparatus that cools the substrate after the heat processing. A pre-cooling device that cools the substrate before, a first transport device that transports the substrate, a second transport device, and a third transport device;
A heat treatment device and a pre-cooling device are arranged across the first transport device,
A liquid processing device and a cooling processing device are arranged across the second transfer device,
A pre-cooling device and a cooling processing device are arranged between the heat processing device and the liquid processing device,
further,
The first transport device is configured to transport the substrate between the heat treatment device and the pre-cooling device,
The second transport device is configured to transport the substrate between the liquid processing device and the cooling processing device,
3. The substrate processing apparatus, wherein the third transfer device is configured to transfer a substrate between the pre-cooling device and the cooling processing device. The substrate processing apparatus according to claim 1, wherein the pre-cooling apparatus is stacked on an upper part of the cooling processing apparatus. The substrate processing apparatus according to claim 1, wherein the pre-cooling device is a flat plate having a support member capable of supporting a substrate. The substrate processing apparatus according to claim 4, wherein the support member has a plurality of support pins . The substrate processing apparatus according to claim 4 , wherein the support member includes a support having a support surface that supports a central portion of the substrate and the vicinity thereof . The pre-cooling device is characterized by having a heat dissipation mechanism for dissipating heat of the substrate, the substrate processing apparatus according to claim 1. The substrate processing apparatus according to claim 1, wherein the pre-cooling device includes a fan that blows air toward the substrate. The substrate processing apparatus according to claim 1, wherein the pre-cooling device has a gas ejection portion that ejects a cooling gas toward the substrate. The substrate processing apparatus according to claim 9, wherein the cooling gas includes an inert gas . The pre-cooling device is characterized by having an exhaust mechanism for forcibly evacuating the inside of the pre-cooling device, a substrate processing apparatus according to any one of claims 1 to 10. Wherein the pre-cooling device are stacked in a plurality of stages, the substrate processing apparatus according to any one of claims 1 to 11. 13. The substrate processing apparatus according to claim 12, further comprising means for controlling to carry in a substrate from an upper pre-cooling device among the pre-cooling devices stacked in a plurality of stages . 13. The substrate processing apparatus according to claim 12 , further comprising means for controlling the substrate to be carried in from a lower pre-cooling device among the pre-cooling devices stacked in a plurality of stages . 2. The apparatus according to claim 1, further comprising means for controlling the substrate to be loaded into a pre-cooling device at a position distant from the pre-cooling device already loaded with the substrate among the pre-cooling devices stacked in the plurality of stages. 12. The substrate processing apparatus according to 12 . In a substrate processing apparatus comprising: a liquid processing apparatus that supplies a processing liquid to a substrate for processing; a cooling processing apparatus that cools the substrate to a predetermined temperature; and a heating processing apparatus that heats the substrate.
A pre-cooling device for cooling the substrate before cooling the substrate to a predetermined temperature;
The pre-cooling devices are stacked in multiple stages;
A substrate processing apparatus comprising: means for controlling the substrate to be loaded from an upper pre-cooling device among the pre-cooling devices stacked in a plurality of stages . A liquid processing apparatus that supplies a processing liquid to a substrate and processes the substrate, a cooling processing apparatus that cools the substrate to a predetermined temperature, a heating processing apparatus that heat-processes the substrate, and a substrate that has been subjected to the heat processing to the cooling processing apparatus. A pre-cooling device that cools the substrate before the cooling process, and a first transport device and a second transport device that transport the substrate,
The first transport device is configured to transport the substrate between the heat treatment device and the pre-cooling device,
The second transport device is configured to transport the substrate between the liquid processing device and the cooling processing device,
Further, at least one of the first transfer device and the second transfer device is configured to transfer the substrate between the pre-cooling device and the cooling processing device,
The pre-cooling devices are stacked in multiple stages;
A substrate processing apparatus comprising: means for controlling the substrate to be loaded from an upper pre-cooling device among the pre-cooling devices stacked in a plurality of stages . A liquid processing apparatus that supplies a processing liquid to a substrate and processes the substrate, a cooling processing apparatus that cools the substrate to a predetermined temperature, a heating processing apparatus that heat-processes the substrate, and a substrate that has been subjected to the heat processing to the cooling processing apparatus. A pre-cooling device that cools the substrate before the cooling process, and a first transport device and a second transport device that transport the substrate,
A heat treatment device and a pre-cooling device are arranged across the first transport device,
A liquid processing device and a cooling processing device are arranged across the second transfer device,
A pre-cooling device and a cooling processing device are arranged between the heat processing device and the liquid processing device,
The first transport device is configured to transport the substrate between the heat treatment device and the pre-cooling device,
The second transport device is configured to transport the substrate between the liquid processing device and the cooling processing device,
Further, at least one of the first transfer device and the second transfer device is configured to transfer the substrate between the pre-cooling device and the cooling processing device,
The pre-cooling devices are stacked in multiple stages;
A substrate processing apparatus comprising: means for controlling the substrate to be loaded from an upper pre-cooling device among the pre-cooling devices stacked in a plurality of stages . In a substrate processing apparatus comprising: a liquid processing apparatus that supplies a processing liquid to a substrate for processing; a cooling processing apparatus that cools the substrate to a predetermined temperature; and a heating processing apparatus that heats the substrate.
A pre-cooling device for cooling the substrate before cooling the substrate to a predetermined temperature;
The pre-cooling devices are stacked in multiple stages;
A substrate processing apparatus, comprising: means for controlling to carry in a substrate from a lower pre-cooling device among the pre-cooling devices stacked in a plurality of stages . A liquid processing apparatus that supplies a processing liquid to a substrate and processes the substrate, a cooling processing apparatus that cools the substrate to a predetermined temperature, a heating processing apparatus that heat-processes the substrate, and a substrate that has been subjected to the heat processing to the cooling processing apparatus. A pre-cooling device that cools the substrate before the cooling process, and a first transport device and a second transport device that transport the substrate,
The first transport device is configured to transport the substrate between the heat treatment device and the pre-cooling device,
The second transport device is configured to transport the substrate between the liquid processing device and the cooling processing device,
Further, at least one of the first transfer device and the second transfer device is configured to transfer the substrate between the pre-cooling device and the cooling processing device,
The pre-cooling devices are stacked in multiple stages;
A substrate processing apparatus, comprising: means for controlling to carry in a substrate from a lower pre-cooling device among the pre-cooling devices stacked in a plurality of stages . A liquid processing apparatus that supplies a processing liquid to a substrate and processes the substrate, a cooling processing apparatus that cools the substrate to a predetermined temperature, a heating processing apparatus that heat-processes the substrate, and a substrate that has been subjected to the heat processing to the cooling processing apparatus. A pre-cooling device that cools the substrate before the cooling process, and a first transport device and a second transport device that transport the substrate,
A heat treatment device and a pre-cooling device are arranged across the first transport device,
A liquid processing device and a cooling processing device are arranged across the second transfer device,
A pre-cooling device and a cooling processing device are arranged between the heat processing device and the liquid processing device,
The first transport device is configured to transport the substrate between the heat treatment device and the pre-cooling device,
The second transport device is configured to transport the substrate between the liquid processing device and the cooling processing device,
Further, at least one of the first transfer device and the second transfer device is configured to transfer the substrate between the pre-cooling device and the cooling processing device,
The pre-cooling devices are stacked in multiple stages;
A substrate processing apparatus, comprising: means for controlling to carry in a substrate from a lower pre-cooling device among the pre-cooling devices stacked in a plurality of stages . In a substrate processing apparatus comprising: a liquid processing apparatus that supplies a processing liquid to a substrate for processing; a cooling processing apparatus that cools the substrate to a predetermined temperature; and a heating processing apparatus that heats the substrate.
A pre-cooling device for cooling the substrate before cooling the substrate to a predetermined temperature;
The pre-cooling devices are stacked in multiple stages;
The substrate processing comprising: a means for controlling the substrate to be loaded into the pre-cooling device at a position away from the pre-cooling device in which the substrate is already loaded among the pre-cooling devices stacked in the plurality of stages. apparatus. A liquid processing apparatus that supplies a processing liquid to a substrate and processes the substrate, a cooling processing apparatus that cools the substrate to a predetermined temperature, a heating processing apparatus that heat-processes the substrate, and a substrate that has been subjected to the heat processing to the cooling processing apparatus. A pre-cooling device that cools the substrate before the cooling process, and a first transport device and a second transport device that transport the substrate,
The first transport device is configured to transport the substrate between the heat treatment device and the pre-cooling device,
The second transport device is configured to transport the substrate between the liquid processing device and the cooling processing device,
Further, at least one of the first transfer device and the second transfer device is configured to transfer the substrate between the pre-cooling device and the cooling processing device,
The pre-cooling devices are stacked in multiple stages;
The substrate processing comprising: a means for controlling the substrate to be loaded into the pre-cooling device at a position away from the pre-cooling device in which the substrate is already loaded among the pre-cooling devices stacked in the plurality of stages. apparatus. A liquid processing apparatus that supplies a processing liquid to a substrate and processes the substrate, a cooling processing apparatus that cools the substrate to a predetermined temperature, a heating processing apparatus that heat-processes the substrate, and a substrate that has been subjected to the heat processing to the cooling processing apparatus. A pre-cooling device that cools the substrate before the cooling process, and a first transport device and a second transport device that transport the substrate,
A heat treatment device and a pre-cooling device are arranged across the first transport device,
A liquid processing device and a cooling processing device are arranged across the second transfer device,
A pre-cooling device and a cooling processing device are arranged between the heat processing device and the liquid processing device,
The first transport device is configured to transport the substrate between the heat treatment device and the pre-cooling device,
The second transport device is configured to transport the substrate between the liquid processing device and the cooling processing device,
Further, at least one of the first transfer device and the second transfer device is configured to transfer the substrate between the pre-cooling device and the cooling processing device,
The pre-cooling devices are stacked in multiple stages;
The substrate processing comprising: a means for controlling the substrate to be loaded into the pre-cooling device at a position away from the pre-cooling device in which the substrate is already loaded among the pre-cooling devices stacked in the plurality of stages. apparatus.

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