JP3851671B2 - Imaging device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an imaging device built in the distal end portion of an endoscope, and more particularly to shortening the rigid length of the imaging unit from the distal end of an objective lens of the imaging device to the bundle end portion of a signal cable bundle.
[0002]
[Prior art]
In recent years, medical endoscopes for observing the inside of body cavities by inserting elongated insertion parts into body cavities, pipes such as machines and chemical plants, or industrial endoscopes used for observation and inspection in machines Mirrors are widely used.
[0003]
Among these endoscopes, there is an electronic endoscope in which an image pickup apparatus including a solid-state image pickup device such as a solid-state image pickup device is disposed at a distal end portion of an insertion portion. In this endoscope, an elongated endoscope insertion portion has to be inserted into a narrow and winding tube or lumen. For this reason, the outer diameter of the distal end portion of the endoscope and the length of the hard portion are reduced so that the endoscope insertion portion can be inserted smoothly and without causing pain to the patient. Shortening was desired.
[0004]
In general, an objective lens and a solid-state imaging device constituting an imaging device are incorporated as an imaging unit at the distal end portion of the endoscope, and a subject image is placed on the imaging surface of the solid-state imaging device via the objective lens. An image is formed. A circuit board constituting one or two signal processing circuits is disposed in the opposite direction of the objective lens of the solid-state image sensor, and external leads extending from the solid-state image sensor are soldered to the circuit board. Is fixed by bonding. The circuit board is connected to a signal line of a signal cable connected to a camera control unit which is an external device. Further, the signal line of the signal cable is also connected to an external lead extending from the solid-state imaging device.
[0005]
Then, a solid-state image sensor drive signal, a solid-state image sensor output signal, a solid-state image sensor drive power source, etc., which are input / output signals of the solid-state image sensor, are transmitted to the solid-state image sensor via a signal cable and a circuit board. Yes.
[0006]
The plurality of signal lines of the signal cable connected to the external leads and the circuit board are cable stoppers positioned on the base end side opposite to the connection portion to which the external leads extending from the solid-state image sensor are attached. As a result, the individual signal lines that were separated are grouped together to form a cable bundle. For this reason, the bundle end portion of the cable bundle is provided so as to be positioned behind the objective lens, the solid-state imaging device, the circuit board, and the cable stopper when viewed from the distal end side of the endoscope.
[0007]
In general, the rigid length of the imaging unit constituting the imaging apparatus was regarded as the length from the front end surface of the objective lens to the bundle end of the cable bundle, so that the bundle end of the cable bundle is connected to the cable as described above. If the image pickup unit is formed on the rear side of the stop, there is a limit to shortening the rigid length of the image pickup unit.
[0008]
[Problems to be solved by the invention]
However, shortening the rigid length of the imaging unit, that is, the length of the rigid portion of the endoscope, is a factor that greatly improves the curvature of the distal end portion of the endoscope, and the length of the rigid portion is shortened. As a result of the improved curvature, the operator can see the inner wall of the body cavity and the stomach wall from the front and improve the observation performance. For the patient, the body cavity is excessively swollen to ensure bending operability. Pain is reduced by the fact that it is no longer necessary. For this reason, shortening the length of the rigid length of the imaging unit has been desired from both the standpoint of the operator and the standpoint of the patient.
[0009]
The present invention has been made in view of these circumstances, it is possible to obtain a reduction in the rigid length of the imaging unit, which is formed with a like objective lens and the solid-state imaging device Fig Ritsutsu, the shielding effect of the imaging unit An object of the present invention is to provide an imaging apparatus.
[0010]
[Means for Solving the Problems]
An imaging apparatus according to an aspect of the present invention includes a solid-state imaging device disposed at an imaging position of an objective lens,
A mounting surface that is connected to the solid-state image sensor and is arranged in parallel to the optical axis direction of the objective lens, and has one surface mounted with electronic components for driving the solid-state image sensor or performing signal processing. A peripheral circuit board formed as a non-mounting surface on which the other part is not mounted, and
In order to electrically connect the camera control unit for controlling the solid-state image sensor or the peripheral circuit board and the solid-state image sensor or the peripheral circuit board, they are covered by an external conductor connected to the mounting surface or the electronic component. A signal cable consisting of a plurality of signal lines,
The signal lines arranged on the non-mounting surface side of the peripheral circuit board by being bundled together by a cable stopper that is a conductive binding member so as to electrically conduct the outer conductor covering the plurality of signal lines. A bundle end,
It has.
An imaging device according to another aspect of the present invention includes a fixed imaging element disposed at an imaging position of an objective lens,
Connected to the solid-state image sensor and disposed perpendicular to the solid-state image sensor, one surface is formed as a mounting surface on which electronic components for driving the solid-state image sensor or performing signal processing are mounted. A peripheral circuit board formed on the other surface as a non-mounting surface on which no electronic component is mounted
In order to electrically connect the camera control unit for controlling the solid-state image sensor or the peripheral circuit board and the solid-state image sensor or the peripheral circuit board, they are covered by an external conductor connected to the mounting surface or the electronic component. A signal cable consisting of a plurality of signal lines,
The signal lines arranged on the non-mounting surface side of the peripheral circuit board by being bundled together by a cable stopper that is a conductive binding member so as to electrically conduct the outer conductor covering the plurality of signal lines. A bundle end,
It has.
An imaging device according to still another aspect of the present invention includes a solid-state imaging device disposed at an imaging position of an objective lens,
A mounting surface that is connected to the solid-state image sensor and is arranged in parallel to the optical axis direction of the objective lens, and has one surface mounted with electronic components for driving the solid-state image sensor or performing signal processing. A peripheral circuit board formed as a non-mounting surface on which the other part is not mounted, and
In order to electrically connect the camera control unit for controlling the solid-state image sensor or the peripheral circuit board and the solid-state image sensor or the peripheral circuit board, they are covered by an external conductor connected to the mounting surface or the electronic component. A signal cable consisting of a plurality of signal lines,
The signal lines arranged on the non-mounting surface side of the peripheral circuit board by being bundled together by a cable stopper that is a conductive binding member so as to electrically conduct the outer conductor covering the plurality of signal lines. A bundle end,
Shield that bundles and bundles the solid-state image pickup device, the peripheral circuit board, the signal cable, and the cable line and arranges the signal wire bundle ends arranged on the non-mounting surface side of the peripheral circuit board inside A member, and an insulation coating covering the outer periphery of the shield member;
The outer conductor covering the outer periphery of the plurality of signal lines, the conductive cable stopper, and the shield member are electrically connected.
An imaging device according to another aspect of the present invention includes a fixed imaging element disposed at an imaging position of an objective lens,
Connected to the solid-state image sensor and disposed perpendicular to the solid-state image sensor, one surface is formed as a mounting surface on which electronic components for driving the solid-state image sensor or performing signal processing are mounted. A peripheral circuit board formed as a non-mounting surface on which the other surface is not mounted with an electronic component;
In order to electrically connect the camera control unit for controlling the solid-state image sensor or the peripheral circuit board and the solid-state image sensor or the peripheral circuit board, they are covered by an external conductor connected to the mounting surface or the electronic component. A signal cable consisting of a plurality of signal lines,
The signal lines arranged on the non-mounting surface side of the peripheral circuit board by being bundled together by a cable stopper that is a conductive binding member so as to electrically conduct the outer conductor covering the plurality of signal lines. A bundle end,
Shield that bundles and bundles the solid-state image pickup device, the peripheral circuit board, the signal cable, and the cable line and arranges the signal wire bundle ends arranged on the non-mounting surface side of the peripheral circuit board inside A member, and an insulation coating covering the outer periphery of the shield member;
The outer conductor covering the outer periphery of the plurality of signal lines, the conductive cable stopper, and the shield member are electrically connected.
[0011]
According to this configuration, the bundled ends of the signal lines are provided on the peripheral circuit board connected to the solid-state imaging device. As a result, the arrangement position from the objective lens to the signal line bundle end becomes a positional relationship of the objective lens, the solid-state imaging device, the peripheral circuit board, and the signal line bundle end, and the hard length is shortened.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
1 and 2 relate to a first embodiment of the present invention, FIG. 1 is an explanatory diagram showing a schematic configuration of an endoscope apparatus, and FIG. 2 is a cross-sectional view illustrating a schematic configuration of an imaging unit.
[0013]
As shown in FIG. 1, an endoscope apparatus 10 includes an imaging unit 1 that can be inserted into a body cavity, for example, and is formed by disposing a solid-state imaging device such as an objective lens or a CCD at the distal end of the insertion portion. 2 and a light source device 3 that supplies illumination light to the endoscope 2 through a light guide fiber or the like, and a solid-state image sensor of the imaging unit 1 disposed at the distal end of the insertion portion of the endoscope 2 A peripheral device 5 having a camera control unit (hereinafter referred to as CCU) 4 that performs supply and control of signal processing of a subject image formed on an imaging surface of a solid-state imaging device, and an image obtained by converting an electrical signal transmitted to the CCU 4 The monitor 6 is configured to receive the signal and display an endoscopic image on the screen.
[0014]
The endoscope 2 includes an insertion portion 21 to be inserted into a body cavity or the like, an operation portion 22 located on the proximal side of the insertion portion 21, a universal cord 23 extending from a side portion of the operation portion 22, A universal connector 24 is provided at the proximal end of the universal cord 23 and is detachably connected to the peripheral device 5.
[0015]
Supply of driving power for driving the solid-state imaging device of the imaging unit 1 and transmission / reception of an electrical signal of a subject image formed on the imaging surface of the solid-state imaging device and subjected to photoelectric conversion are performed by the insertion unit 21, the operation unit 22 and the universal unit. This is performed by the signal cable 7 having a plurality of signal lines inserted through the cord 23.
[0016]
Note that an imaging device 8 is configured by the imaging unit 1, the CCU 4 and the signal cable 7 that connects the imaging unit 1 and the CCU 4.
[0017]
The imaging unit 1 will be described with reference to FIG.
The imaging unit 1 is provided with an objective lens group 20 that mainly includes a plurality of lenses and serves as an objective lens, and an optical image formed on the imaging surface that is disposed at the imaging position of the objective lens group 20 as an electrical signal. And an imaging unit 30 that performs photoelectric conversion.
[0018]
First, the objective lens group 20 will be described.
The objective lens group 20 includes a first lens group 21 a housed in a first lens frame 21, a second lens group 22 a housed in a second lens frame 22, the first lens frame 21, The insulating frame 24 is fitted on the outer periphery of the second lens frame 22, and the third lens frame 23 is fitted on the outer periphery of the insulating frame 24.
[0019]
The first lens group 21a and the second lens group 22a are bonded and fixed to the first lens frame 21 and the second lens frame 22, respectively, with an adhesive. The first lens frame 21 and the second lens frame 22 are bonded and fixed to the insulating frame 24 and the third lens frame 22 with an adhesive.
[0020]
An imaging unit holder 25 is fitted to the outer periphery of the second lens frame 22 and is fixed integrally to the second lens frame 22 with an adhesive. The second lens frame 22 and the imaging unit holder 25 are integrally bonded and fixed with an adhesive after focus adjustment.
[0021]
Next, the imaging unit 30 will be described.
The imaging unit 30 includes an imaging element chip 31 having an imaging surface and a peripheral circuit board 40 on which a signal processing circuit is formed.
[0022]
A package formed of an optical material on the front surface of the image pickup device chip 31 and provided with a chip protection member 32 to which the image pickup unit holder 25 is fitted, and a kovar plate 33a and a chip substrate 33b provided on the rear surface. A portion 33 is disposed.
[0023]
The imaging element chip 31 is disposed so as to be orthogonal to the optical axis of the objective lens group 20, and the sealing resin 35 is placed with the CFA 34 placed on the imaging surface side of the imaging element chip 31. Is sealed by.
[0024]
In addition, the external leads 36, 36. . . Protrudes from the external leads 36, 36. . . And the image pickup device chip 31 are electrically connected by a chip substrate 33b, wiring (not shown) on the chip substrate 33b, and bonding wires (not shown).
[0025]
A peripheral circuit board 40 whose longitudinal direction is arranged parallel to the optical axis direction of the objective lens group is electrically connected to the external lead 36 by soldering or the like.
[0026]
One plane (front side surface) of the peripheral circuit board 40 is a mounting surface, and the IC 41 is sealed with the sealing resin 43 in a state where the IC 41 is electrically wired by the bonding wires 42, and the capacitor 44 is electrically connected by the solder 45. Wired to form a signal processing circuit.
[0027]
The signal cable 7 is arranged on the other end surface (back side surface) which is a non-mounting surface where the circuit such as the signal processing circuit of the peripheral circuit board 40 is not formed. The signal cable 7 includes a plurality of signal lines 71, 71. . . This is a composite wire of a shield wire 71a as an outer conductor and a single wire 71b as an inner conductor.
[0028]
The plurality of signal lines 71, 71. . . The outer conductors as the shield wires 71a are bundled together so as to be electrically connected by a cable stopper 72 which is a metal binding member. These signal lines 71, 71. . . The signal line end bundle 73 formed by being bundled together is provided behind the cable stopper 72 so as to be positioned on the back surface of the peripheral circuit board 40. On the other hand, the plurality of signal lines 71, 71. . . The single wires 71b are connected and fixed to the external leads 36 and the peripheral circuit board 40 of the imaging unit 30, respectively.
[0029]
A cable protection member 74 is provided on the outer periphery of the signal cable 7. The cable protection member 74 is for reducing damage from other built-in objects arranged in the endoscope or damaging other built-in objects. The member 75 is fixed in the vicinity of the bundle end 73.
[0030]
The bundle end portion 73 of the signal line is an end portion of the outermost covering portion of the signal cable 7, and the bundle end portion 73 may be retracted from an insulating coating described later by performing a bending operation while using the endoscope. In the unlikely event that the bundle end 73 is retracted from the insulation coating, the bending strength in the vicinity of the bundle end sharply decreases, causing disconnection or defective lead. For this reason, the bundle end portion 73 is integrally fixed to the peripheral circuit board 40 by the second binding member 76 so as not to move closer to the proximal side than the insulating coating so as not to cause these problems.
[0031]
By configuring as described above, the optical image of the observation image formed on the imaging surface of the imaging element chip 31 of the imaging unit 30 is output to the peripheral circuit board 40 via the external lead 36 and subjected to signal processing. It is transmitted to the CCU 4 through the signal line 71 and the signal cable 7 and processed into an image signal, which is output to the monitor 6 and an endoscopic image is displayed on the screen.
[0032]
A plurality of sealing resins are used when forming the imaging unit 30. In order to reinforce the external lead 36, the first sealing resin 81 is used. Further, the IC 41, the capacitor 44, the signal lines 71, 71. . . After the wiring, the second sealing resin 82 is used to cover the electrically conductive portions such as the external lead 36 and the single wire 71b. By sealing the electrically conductive portion with the second sealing resin 82, a short circuit with the shield member 91 to be assembled later is prevented. Then, when the shield member 91 is assembled to the imaging unit 30 sealed with the second sealing resin 82, the third sealing resin 83 is filled between the second sealing resin 82 and the shield member 91. To do. Finally, when the insulating coating 92 is coated on the outer periphery of the shield member 91, the fourth sealing resin 84 is filled to seal the electrical component.
[0033]
Further, in order to enhance the shielding effect of the imaging unit 30, the cable stopper 72 and the external lead 36 are electrically connected by a jumper wire 77, and the cable stopper 72 and the shield member 91 are electrically connected by a conductive member 93. The imaging unit holder 25 and the shield member 92 are electrically connected by the conductive member 93.
[0034]
In this way, a bundle of signal lines formed when a plurality of signal lines of a signal cable such as a signal line directly connected to an external lead of the imaging unit and a signal line connected to a peripheral circuit board are gathered together by cable fastening By arranging the part on the back surface of the peripheral circuit board, the imaging unit can be configured from the front end side by the positional relationship of the objective lens, solid-state imaging device, peripheral circuit board, and signal line bundle end to reduce the hard length Can do. As a result, the length of the rigid portion of the endoscope is shortened, so that the curvature of the endoscope distal end is improved, the observation performance is improved, and pain to the patient is reduced.
[0035]
Moreover, assembly workability | operativity can be improved by assembling a cable protection member and a cable stopper partially to a signal cable beforehand.
[0036]
FIG. 3 is a view for explaining a wiring state to the peripheral circuit board according to the second embodiment of the present invention.
3 shows the peripheral circuit board 40 of FIG. 2 as viewed from the direction A. On the surface of the peripheral circuit board 40, external leads 36, jumper wires 77, shield wires 71a for signal wires 71, single wires 71b, etc. Lands 46, 46. . . Is formed.
[0037]
These lands 46, 46. . . The IC 41 previously die-bonded on the peripheral circuit substrate 40 is connected via a bonding wire 42 and then sealed with a sealing resin 43. A capacitor 44 is mounted on the peripheral circuit board 40 with solder 45. That is, the peripheral circuit board 40 is a single-sided board in which an IC 41, a capacitor 44, and the like are mounted on the surface side of the board, and the lands 46, 46. . . Is located on the front surface side, and a bundle end portion 73 of signal lines is disposed on the non-mounting surface on the back surface side of the substrate.
[0038]
Therefore, a plurality of signal lines 71, 71... Of the signal cable 7 disposed on the back surface side of the peripheral circuit board 40 are used. . . , The lands 46, 46. . . So that the signal line 71 does not protrude from the outer peripheral surface of the peripheral circuit board 40 to increase the diameter of the imaging unit 1, so that the signal line 71 is connected to the peripheral circuit board 40 from the back side to the front side. At least one notch 47 for guiding is formed. Other configurations are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and the description thereof is omitted.
[0039]
By forming the notch 47 in the peripheral circuit board 40 as described above, the signal lines 71, 71... Of the signal cable 7 arranged on the back surface side of the peripheral circuit board 40 are formed. . . Is guided to the surface side of the peripheral circuit board 40 through the notch 47. Then, the signal line guided to the surface side is connected and fixed to a predetermined position on the mounting surface by soldering or the like. For example, the jumper wire 77 is guided from the non-mounting surface on the rear surface of the peripheral circuit board 40 to the mounting surface on the front surface through the notch 47 and soldered to the external lead 36b described later, and the shield member 79a of the shield wire 79 The single wire 79 b is soldered to the land 46, and the single wire 79 c is soldered directly to the electrode of the capacitor 44.
[0040]
Thus, when connecting the signal line of the signal cable disposed on the back surface, which is the non-mounting surface of the peripheral circuit board, to the mounting surface formed on the surface of the peripheral circuit board, the signal line of the signal cable is connected. By guiding to the surface which is the mounting surface through the notch formed in the peripheral circuit board, the signal line is guided from the non-mounting surface side to the mounting surface side without being projected from the outer peripheral surface of the peripheral circuit substrate. be able to. Thus, the size of the imaging unit is not increased by guiding the signal line on the non-mounting surface side to the mounting surface side.
[0041]
Moreover, since a single-sided board can be used for the peripheral circuit board, the imaging unit can be configured at low cost. Other operations and effects are the same as those in the first embodiment.
[0042]
Reference numerals 36a and 36b are external leads of the same electrode, and are ground in this embodiment. In the present embodiment, the two electrodes are electrically connected to each other in the image pickup device chip 31. However, even if the connection is performed on the substrate 33a, the connection is made to the land 46 of the peripheral circuit board 40 so as to be conductive. Also good.
[0043]
Reference numeral 46a denotes a land to which the external lead 36a and the external lead 36b are connected, and a slit 46b is formed in the land 46a. The slit 46b is connected to the external leads 36, 36. . . The land 46, 46. . . In the automatic soldering in which cream solder is applied at the time of soldering and is automatically irradiated by irradiating a laser beam, the amount of cream solder applied is made constant.
[0044]
Further, the lands 46, 46. . . In this case, after the conductor is patterned on the peripheral circuit board 40, gold plating is applied. At this time, the IC 41 and the land 46 are electrically connected in order to perform electrolytic treatment. In order to make this portion non-conductive after gold plating, a land trimming portion 80 is provided in the vicinity of the notch portion 47 of the substrate.
[0045]
By the way, conventionally, a separate cable fixing member is provided on the proximal side of the peripheral circuit board, and this cable is divided into both the front side and the back side of the board on the proximal side of the cable fixing member. The bundle end is located closer to the cable stop member and the cable is divided into the front side and back side of the board, so filling the part with adhesive to reinforce this part only increases the hard length. In addition, the flow of the adhesive became unstable, and as a result, the hard length became unstable. However, by configuring the imaging unit as described above, the bundle end portion 73 is positioned on the back side of the peripheral circuit board 40 and the hard length is shortened, and the cable is divided into a front side and a back side, and an adhesive. It is no longer necessary to pour the cable into the cable bundle, and the rigid length is stabilized.
[0046]
By the way, when soldering the external lead protruding from the imaging unit and the land of the peripheral circuit board, first, the external lead and the land are aligned using a jig (not shown), and cream solder is applied by a dispenser. Then, soldering was performed by applying heat to the cream solder. At this time, the application of the cream solder to the land was automatically performed by a dispenser.
[0047]
However, when cream solder was applied using this dispenser, the amount of solder increased on the soldering amount end portion side, which is the coating start portion and the coating end portion on the substrate, compared with the solder amount of the other soldering portions. For this reason, when soldering, there is a problem that the soldering condition varies greatly depending on whether the soldering conditions are set at both ends or the central part other than both ends, and the fixed state is not stable. . For this reason, it was desired that the soldering conditions be unified.
[0048]
Therefore, as shown in FIG. 4, in the present embodiment, the external leads 36, 36. . . Of the peripheral circuit board 40 to be soldered to the lands 46, 46. . . , The land width m of the land 46b on both ends is set to the land 46, 46. . . It is formed wider than the land width n. The land 46a is a land 46, 46. . . It is formed wider than the land width n.
[0049]
Therefore, the external leads 36, 36. . . And land 46,46. . . When the cream solder 85 is automatically applied by the dispenser, the application amount of the cream solder 85 applied by the dispenser is as shown in the figure at both ends of the application start part and the application end part. Although the land widths of the lands 46a, 46b on both ends are larger than the lands 46, 46. . . Since it is wider than the land width, when soldering is performed by applying heat, the soldering conditions are unified and fixed.
[0050]
As described above, when the soldering operation is performed in an automatic process by appropriately setting the land width of the lands formed on the peripheral circuit board so that the soldering conditions are substantially unified, the edge of the peripheral circuit board is obtained. The soldering conditions are unified between the part side and the center part side, and soldering can be performed under appropriate soldering conditions. As a result, the soldering strength between the external lead and the land increases and stabilizes, so that the reliability of connection fixing by soldering is greatly improved.
[0051]
Note that, when soldering a heat-sensitive material such as a solid-state imaging device, laser soldering capable of heating the solder by locally irradiating laser light is desirable instead of using a thermal probe.
[0052]
[Appendix]
1. A solid-state imaging device disposed at the imaging position of the objective lens;
A peripheral circuit board that is connected to the solid-state image sensor and performs driving or signal processing of the solid-state image sensor; and
A camera control unit for controlling the solid-state imaging device or the peripheral circuit board;
In the imaging apparatus having a signal cable including a plurality of signal lines that electrically connect the camera control unit and the solid-state imaging device or the peripheral circuit board,
While arranging the peripheral circuit board parallel to the optical axis direction of the objective lens, a bundle end of signal lines formed when a plurality of signal lines of the signal cable are grouped on the peripheral circuit board surface An imaging apparatus characterized by disposing a portion.
[0053]
2. A solid-state image sensor disposed at an imaging position of the objective lens orthogonal to the optical axis of the objective lens;
A peripheral circuit board that is connected to the solid-state image sensor and performs driving or signal processing of the solid-state image sensor; and
A camera control unit for controlling the solid-state imaging device or the peripheral circuit board;
In the imaging apparatus having a signal cable including a plurality of signal lines that electrically connect the camera control unit and the solid-state imaging device or the peripheral circuit board,
While arranging the peripheral circuit board parallel to the optical axis direction of the objective lens, a bundle end of signal lines formed when a plurality of signal lines of the signal cable are grouped on the peripheral circuit board surface An imaging device for arranging parts.
[0054]
3. A solid-state imaging device disposed at the imaging position of the objective lens;
A peripheral circuit board that is connected to the solid-state image sensor and performs driving or signal processing of the solid-state image sensor; and
A camera control unit for controlling the solid-state imaging device or the peripheral circuit board;
In the imaging apparatus having a signal cable including a plurality of signal lines that electrically connect the camera control unit and the solid-state imaging device or the peripheral circuit board,
A plurality of signal lines of a signal cable disposed in one plane of the peripheral circuit board formed in the peripheral circuit board by forming a notch portion and parallel to the optical axis direction of the objective lens, An imaging apparatus having an imaging unit for wiring to another plane of a substrate through a notch formed in a circuit board.
[0055]
4). A solid-state imaging device disposed at the imaging position of the objective lens;
In an imaging device having a peripheral circuit board that is connected to the solid-state imaging device and performs driving or signal processing of the solid-state imaging device,
Out of a plurality of lands provided on the peripheral circuit board to which the external leads extending from the solid-state imaging device are soldered, the land widths of the lands located on both ends are set to the lands located on the central part side of the peripheral circuit board. An imaging device formed wider than the land width.
[0056]
【The invention's effect】
According to the present invention described above, it is possible to obtain a reduction in the rigid length of the imaging unit, which is formed with a like objective lens and the solid-state imaging device Fig Ritsutsu, the shielding effect of the imaging unit.
[Brief description of the drawings]
1 and FIG. 2 relate to a first embodiment of the present invention, and FIG. 1 is an explanatory view showing a schematic configuration of an endoscope apparatus. FIG. 2 is a cross-sectional view showing a schematic configuration of an imaging unit. 3 is a diagram illustrating a wiring state to a peripheral circuit board according to a second embodiment of the present invention. FIG. 4 is an explanatory diagram illustrating a land configuration and a solder application state to the land.
DESCRIPTION OF SYMBOLS 1 ... Imaging unit 7 ... Signal line 20 ... Objective lens group (objective lens)
30 ... Imaging unit (solid-state imaging device)
40 ... peripheral circuit board 71 ... signal line 73 ... bundle end

Claims (6)

A solid-state imaging device disposed at the imaging position of the objective lens;
A mounting surface that is connected to the solid-state image sensor and is arranged in parallel to the optical axis direction of the objective lens, and has one surface mounted with electronic components for driving the solid-state image sensor or performing signal processing. A peripheral circuit board formed as a non-mounting surface on which the other part is not mounted, and
In order to electrically connect the camera control unit for controlling the solid-state image sensor or the peripheral circuit board and the solid-state image sensor or the peripheral circuit board, they are covered by an external conductor connected to the mounting surface or the electronic component. A signal cable consisting of a plurality of signal lines,
The signal lines arranged on the non-mounting surface side of the peripheral circuit board by being bundled together by a cable stopper that is a conductive binding member so as to electrically conduct the outer conductor covering the plurality of signal lines. A bundle end,
An imaging apparatus comprising: A fixed imaging device disposed at the imaging position of the objective lens;
Connected to the solid-state image sensor and disposed perpendicular to the solid-state image sensor, one surface is formed as a mounting surface on which electronic components for driving the solid-state image sensor or performing signal processing are mounted. A peripheral circuit board formed on the other surface as a non-mounting surface on which no electronic component is mounted
In order to electrically connect the camera control unit for controlling the solid-state image sensor or the peripheral circuit board and the solid-state image sensor or the peripheral circuit board, they are covered by an external conductor connected to the mounting surface or the electronic component. A signal cable consisting of a plurality of signal lines,
The signal lines arranged on the non-mounting surface side of the peripheral circuit board by being bundled together by a cable stopper that is a conductive binding member so as to electrically conduct the outer conductor covering the plurality of signal lines. A bundle end,
An imaging apparatus comprising: A solid-state imaging device disposed at the imaging position of the objective lens;
A mounting surface that is connected to the solid-state image sensor and is arranged in parallel to the optical axis direction of the objective lens, and has one surface mounted with electronic components for driving the solid-state image sensor or performing signal processing. A peripheral circuit board formed as a non-mounting surface on which the other part is not mounted, and
In order to electrically connect the camera control unit for controlling the solid-state image sensor or the peripheral circuit board and the solid-state image sensor or the peripheral circuit board, they are covered by an external conductor connected to the mounting surface or the electronic component. A signal cable consisting of a plurality of signal lines,
The signal lines arranged on the non-mounting surface side of the peripheral circuit board by being bundled together by a cable stopper that is a conductive binding member so as to electrically conduct the outer conductor covering the plurality of signal lines. A bundle end,
Shield that bundles and bundles the solid-state image pickup device, the peripheral circuit board, the signal cable, and the cable line and arranges the signal wire bundle ends arranged on the non-mounting surface side of the peripheral circuit board inside A member, and an insulation coating covering the outer periphery of the shield member;
And an external conductor covering the outer periphery of the plurality of signal lines, the conductive cable stopper, and the shield member . A fixed imaging device disposed at the imaging position of the objective lens;
  Connected to the solid-state image sensor and arranged perpendicular to the solid-state image sensor, A peripheral circuit board formed as a mounting surface on which an electronic component for performing driving or signal processing of the solid-state imaging device is mounted, and the other surface as a non-mounting surface on which no electronic component is mounted,
  In order to electrically connect the camera control unit for controlling the solid-state image sensor or the peripheral circuit board and the solid-state image sensor or the peripheral circuit board, they are covered by an external conductor connected to the mounting surface or the electronic component. A signal cable consisting of a plurality of signal lines,
  The signal lines arranged on the non-mounting surface side of the peripheral circuit board by being bundled together by a cable stopper that is a conductive binding member so as to electrically conduct the outer conductor covering the plurality of signal lines. A bundle end,
  Shield that bundles together the solid-state imaging device, the peripheral circuit board, the signal cable, and the cable clamp and arranges the bundle end of the signal line arranged on the non-mounting surface side of the peripheral circuit board for shielding A member, and an insulation coating covering the outer periphery of the shield member;
  And an external conductor covering the outer periphery of the plurality of signal lines, the conductive cable stopper, and the shield member.   The peripheral circuit board forms a connection portion for electrically connecting the signal lines only on a mounting surface on which electronic components are mounted, and collectively by the cable stopper without providing an electrical connection portion on a non-mounting surface. The image pickup apparatus according to claim 1, wherein a bundled signal cable is disposed.   6. The imaging apparatus according to claim 5, wherein the peripheral circuit board is provided with a guide portion that guides signal lines arranged on the non-mounting surface to an electrical connection portion provided on the mounting surface.

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